JP6574513B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention includes a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a plasma display, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a glass substrate for a photomask, a substrate for a solar cell, etc. The present invention relates to a substrate processing technique for performing processing on a substrate simply).

  As a substrate processing apparatus for performing such processing, Patent Document 1 discloses a spin base ("holding member") that rotates while holding a substrate substantially horizontally by chuck pins, and a predetermined interval from the upper surface of the substrate. An apparatus is disclosed that includes a cover member facing in parallel and a nozzle that selectively supplies hydrofluoric acid, pure water, or the like to the upper surface of the substrate through a through-hole provided in the center of the cover member. The apparatus further includes a cylindrical processing cup having a bottom surface. The spin base is rotatably supported above the bottom surface of the processing cup. The apparatus further includes a cylindrical guard. The guard is provided along the inner peripheral surface of the side wall of the processing cup and surrounds the spin base. The guard is raised and lowered between a predetermined lower position and an upper position by the drive mechanism. The liquid supplied from the nozzle to the substrate during the processing of the substrate adheres to the side surface of the spin base when discharged from the substrate. Therefore, the apparatus further includes a cleaning nozzle that cleans the side surface of the spin base. The cleaning nozzle is provided on the bottom surface of the processing cup away from the spin base radially outward. The cleaning nozzle discharges the cleaning liquid obliquely upward toward the side surface of the spin base to clean the side surface of the spin base.

JP-A-11-102882

  The upper end portion of the guard is usually extended obliquely upward toward the rotation axis of the spin base. The substrate processing apparatus of Patent Document 1 supplies a liquid from a nozzle to a substrate in a state where a guard is disposed at an upper position. The supplied liquid scatters when discharged from the substrate and adheres to the inner peripheral surface of the guard. When the treatment is repeated with the adhered liquid remaining, deposits obtained by drying and solidifying the liquid gradually accumulate on the guard. When such a deposit is peeled off, it causes particles. Since the upper end portion of the guard is close to the substrate, the deposit attached to the upper end portion tends to cause particles.

  However, the apparatus of Patent Document 1 has a problem that the inner peripheral surface of the guard cannot be cleaned by the cleaning nozzle that cleans the side surface of the spin base. Further, for example, if a dedicated cleaning nozzle that discharges the cleaning liquid toward the inner peripheral surface of the guard is further provided, there is a problem that the apparatus configuration becomes complicated and the manufacturing cost increases. In order to effectively suppress particles, it is effective to wash the liquid adhering to the inner peripheral surface of the upper end portion of the guard. However, when the cleaning nozzle discharges the cleaning liquid from below toward the inner peripheral surface of the upper end portion while the spin base is holding the substrate, the cleaning liquid scatters from the upper end portion of the guard to the substrate side and adheres to the substrate. There is a problem such as. Further, if it is attempted to avoid the adhesion of the cleaning liquid, there is a problem that the guard needs to be cleaned after the substrate is retracted from the spin base.

  The present invention has been made to solve such problems, and provides a technique capable of cleaning both the guard and the holding member with a common cleaning liquid discharge section in a state where the holding member holds the substrate. Objective.

  In order to solve the above-described problem, a substrate processing apparatus according to a first aspect includes a top surface that holds a substrate substantially horizontally from below and faces the bottom surface of the substrate with a gap therebetween, and has a predetermined rotation axis. A holding member comprising: a disc-shaped base portion that is rotatably provided on the rotation axis; and a flange portion that protrudes radially outward from a peripheral wall portion of the base portion; and A rotation drive unit that rotates about an axis, a guard having a cylindrical shape with an upper end side portion extending obliquely upward toward the rotation axis, surrounding the periphery of the holding member, and capable of moving up and down; and the substrate A treatment liquid discharger capable of discharging a treatment liquid onto the treatment surface, a cleaning liquid discharger capable of discharging a cleaning liquid from below the flange part of the holding member to the flange part, and supplying the substrate from the treatment liquid discharge part to the substrate Is removed from the substrate after An elevating drive unit capable of elevating the guard between an upper position where the treatment liquid can be received and a lower position where an upper end of the guard is located on a side of the flange portion; A controller that controls the drive unit, the processing liquid discharge unit, and the cleaning liquid discharge unit, wherein the control unit is configured to dispose the cleaning liquid discharge unit in a state in which the guard is disposed at the lower position in the elevation drive unit. The cleaning liquid is discharged toward the flange portion of the holding member that rotates while holding the substrate.

A substrate processing method according to a second aspect includes a holding step of holding a substrate by a holding member having a flange portion, a rotating step of rotating the substrate, a supplying step of supplying a processing liquid to the substrate, and a guard A treatment step for receiving a treatment liquid; and a washing step for washing the treatment liquid adhering to the guard by supplying a washing liquid from below the flange part to the flange part, and the guard includes the holding member A cylindrical inner member that can be moved up and down, and a cylindrical outer member that is provided on the outer side of the inner member and that can be moved up and down. The processing step for receiving the processing liquid and the cleaning step for cleaning the inner member while the inner member is lowered are simultaneously performed .

Also according to the first and second aspects of the invention, both the guard to which the processing liquid is attached and the holding member can be cleaned by the common cleaning liquid discharge unit while the substrate is held by the holding member.

It is a schematic diagram for demonstrating the structure of the substrate processing apparatus which concerns on embodiment. It is a perspective view which shows the interruption | blocking board and spin base of FIG. 1 which are arrange | positioned at a process position. It is a perspective view which shows the spin base of FIG. FIG. 3 is a perspective view showing a blocking plate of FIG. 2. It is a perspective view which shows the spin base of FIG. It is a longitudinal cross-sectional view which shows the peripheral part of the interruption | blocking board of FIG. 2, and a spin base. It is another longitudinal cross-sectional view which shows the peripheral part of the interruption | blocking board of FIG. 2, and a spin base. FIG. 7 is a cross-sectional view of the restricting portion in FIG. 6. It is sectional drawing which shows the state by which the control part of FIG. 8 was covered with the elastic member. It is a perspective view which shows the other structural example of the shielding board and spin base which concern on embodiment. It is a perspective view which shows the state by which the interruption | blocking board of FIG. 10 was arrange | positioned in the process position. It is a longitudinal cross-sectional view of the other structural example of the interruption | blocking board which concerns on embodiment, and a spin base. It is a longitudinal cross-sectional view which shows the other cross section of the shielding board of FIG. 12, and a spin base. It is a cross-sectional view which shows the other structural example of the control part which concerns on embodiment. It is a cross-sectional view which shows the other state of the control part of FIG. It is a cross-sectional view which shows the other state of the control part of FIG. It is a cross-sectional view which shows the other state of the control part of FIG. It is sectional drawing which shows the other structural example of the control part which concerns on embodiment. It is sectional drawing which shows the other structural example of the control part which concerns on embodiment. It is a flowchart which shows an example of operation | movement of the substrate processing apparatus which concerns on embodiment. It is a figure for demonstrating the operation | movement shown by the flowchart of FIG. It is a figure for demonstrating the one part operation | movement in the flowchart of FIG.

  Hereinafter, embodiments will be described with reference to the drawings. The following embodiment is an example embodying the present invention, and is not an example of limiting the technical scope of the present invention. In each of the drawings referred to below, the size and number of each part may be exaggerated or simplified for easy understanding. The vertical direction is the vertical direction, and the substrate side is above the spin base.

<About embodiment>
<1. Configuration of Substrate Processing Apparatus 1>
The configuration of the substrate processing apparatus 1 will be described with reference to FIGS. FIG. 1 is a schematic diagram for explaining the configuration of the substrate processing apparatus 1. FIG. 1 shows a state in which the blocking plate 90 is disposed at the retracted position. Further, the shielding plate 90 arranged at the processing position is indicated by a virtual line. FIG. 2 is a schematic perspective view showing the shielding plate 90 and the spin base 21 rotating around the rotation axis a1 in a state where the shielding plate 90 is disposed at the processing position. FIG. 3 is a schematic perspective view of the spin base 21 that holds the substrate 9 and rotates about the rotation axis a1 when viewed obliquely from above. The description of the blocking plate 90 is omitted. The surface shape of the substrate 9 is substantially circular. Loading and unloading of the substrate 9 to and from the substrate processing apparatus 1 is performed by a robot or the like in a state where the blocking plate 90 is disposed at the retracted position. The substrate 9 carried into the substrate processing apparatus 1 is detachably held by the spin base 21. FIG. 4 is a schematic perspective view of the blocking plate 90 as viewed obliquely from below. FIG. 5 is a schematic perspective view of the spin base 21 as viewed obliquely from above.

  In the following description, “processing liquid” includes “chemical liquid” used for chemical liquid processing and “rinsing liquid (also referred to as“ cleaning liquid ”)” used for rinsing for rinsing the chemical liquid. It is.

  The substrate processing apparatus 1 includes a spin chuck 2, a splash prevention unit 3, a surface protection unit 4, a processing unit 5, a cleaning unit 6, and a control unit 130. These units 2 to 6 are electrically connected to the control unit 130 and operate according to instructions from the control unit 130. As the control unit 130, for example, the same one as a general computer can be adopted. That is, the control unit 130 stores, for example, a CPU that performs various arithmetic processes, a ROM that is a read-only memory that stores basic programs, a RAM that is a readable and writable memory that stores various information, control software, data, and the like. It has a magnetic disk to keep. In the control unit 130, the CPU as the main control unit performs arithmetic processing according to the procedure described in the program, thereby controlling each unit of the substrate processing apparatus 1.

<Spin chuck 2>
The spin chuck 2 is a substrate holding unit that holds the substrate 9 in a substantially horizontal posture with one main surface thereof facing upward, and the substrate 9 is vertically rotated through the center c1 of the main surface. Rotate around axis a1.

  The spin chuck 2 includes a spin base (“holding member”) 21 that is a disk-like member that is slightly larger than the substrate 9. The spin base 21 is formed with a cylindrical through-hole 21a that opens at the center of the upper surface and the lower surface thereof so that the central axis thereof coincides with the rotation axis a1. A cylindrical rotary shaft 22 is connected to the lower opening of the through hole 21a. Thereby, the through-hole 21a and the hollow part of the rotating shaft part 22 are connected. The rotating shaft portion 22 is arranged in such a posture that its axis is along the vertical direction. In addition, a rotation drive unit (for example, a motor) 23 is connected to the rotation shaft unit 22. The rotation drive unit 23 drives the rotation shaft unit 22 to rotate about its axis. The axis of the rotary shaft portion 22 coincides with the rotary shaft a1. Accordingly, the spin base 21 can rotate around the rotation axis a <b> 1 together with the rotation shaft portion 22. The rotating shaft portion 22 and the rotation driving portion 23 are accommodated in a cylindrical casing 24.

  In addition, a plurality of (for example, six) chuck pins 25 are provided in the vicinity of the peripheral edge of the upper surface of the spin base 21 with appropriate intervals. Each chuck pin 25 is attached to the spin base 21 through a plurality of openings 21 b provided on the upper surface of the spin base 21. The chuck pins 25 are in contact with the end surface of the substrate 9 to position the substrate 9 in the horizontal direction, and at a position slightly higher than the upper surface of the spin base 21 (that is, at a predetermined interval from the upper surface of the spin base 21). The substrate 9 is held in a substantially horizontal posture. That is, the spin base 21 holds the substrate 9 substantially horizontally from below via the chuck pins 25. The upper surface of the spin base 21 faces, for example, substantially parallel to the lower surface of the substrate 9 with a gap. Two protrusions 26 are provided at equal intervals along the circumferential direction on the cylindrical side surface portion of the spin base 21. It is sufficient that at least one protrusion 26 is provided, and a large number of protrusions 26 may be provided.

  In this configuration, when the rotation drive unit 23 rotates the rotation shaft portion 22 with the spin base 21 holding the substrate 9 by the chuck pin 25 above the spin base 21, the spin base 21 rotates about the axis along the vertical direction. Thus, the substrate 9 held on the spin base 21 is rotated around a vertical rotation axis a1 passing through the center c1 in the plane. The surface protection unit 4 described later is provided with a blocking plate 90 so as to be rotatable in the circumferential direction about the rotation axis a1. The relative position of the spin base 21 and the blocking plate 90 in the circumferential direction can be regulated. When the rotation drive unit 23 rotates the rotation shaft unit 22 in a state where the relative position is regulated, the spin base 21, the substrate 9, and the shielding plate 90 rotate in the same rotation direction at the same rotation speed. The rotation drive unit 23, the protrusion 26, and the restriction structure 94 are a rotation mechanism 231 that rotates the spin base 21 and the blocking plate 90 in the same direction around the rotation axis a1.

  Note that another rotation drive unit that rotates the blocking plate 90 about the rotation axis a <b> 1 in a state where the relative position is regulated may be provided instead of the rotation drive unit 23. In this case, the other rotation drive unit is one of the components of the rotation mechanism 231 instead of the rotation drive unit 23. Moreover, both the rotational drive part 23 and the said other rotational drive part may be provided. That is, the rotation mechanism 231 rotates at least one of the spin base 21 and the blocking plate 90 about the rotation axis a1 in a state where the relative position between the spin base 21 and the blocking plate 90 in the circumferential direction is restricted. If the rotation mechanism 231 rotates the spin base 21 and the shielding plate 90 in the same direction at the same speed, an air flow toward the center c1 side of the substrate 9 is generated between the upper surface of the substrate 9 and the lower surface of the shielding plate 90. Can be suppressed. Thereby, it can suppress that the liquid suitability of the processing liquid is sucked into the upper surface of the substrate.

  When both the rotation drive unit 23 and the other rotation drive unit are provided, the restricting structure 94 and the protruding portion 26 may not be provided. In this case, the speed at which the rotation driving unit 23 rotates the spin base 21 may be different from the speed at which the other rotation driving unit rotates the blocking plate 90 in the same direction as the spin base 21. Further, when both the rotation drive unit 23 and the other rotation mechanism are provided, the tip of the extension unit 92 may be positioned slightly above the upper surface of the spin base 21.

  The chuck pin 25 and the rotation driving unit 23 are electrically connected to the control unit 130 and operate under the control of the control unit 130. That is, the timing of holding the substrate 9 on the spin base 21, the timing of releasing the held substrate 9, and the rotation mode of the spin base 21 (specifically, the rotation start timing, the rotation end timing, the rotation speed (that is, , Rotation speed), etc. are controlled by the control unit 130.

<Spattering prevention part 3>
The scattering prevention unit 3 receives a processing liquid or the like scattered from the substrate 9 rotated together with the spin base 21.

  The scattering prevention unit 3 includes a splash guard 31. The splash guard 31 is a cylindrical member having an open upper end and is provided so as to surround the spin chuck 2. In this embodiment, the splash guard 31 includes, for example, a bottom member 311, an inner member (also referred to as “inner guard” or simply “guard”) 312, and an outer member (also referred to as “outer guard”) 313. It is configured to include individual members. The external member 313 may not be provided, and conversely, a guard may be further provided outside the outer member 313 so as to surround the spin chuck 2.

  The bottom member 311 is a cylindrical member having an open upper end, and has an annular bottom, a cylindrical inner wall extending upward from the inner edge of the bottom, and a cylinder extending upward from the outer edge of the bottom. A shaped outer wall. At least the vicinity of the tip of the inner wall portion is accommodated in an inner space of a bowl-shaped member 241 provided in the casing 24 of the spin chuck 2.

  A drainage groove (not shown) that communicates with the space between the inner wall portion and the outer wall portion is formed in the bottom portion. The drainage groove is connected to a factory drainage line. The drainage groove is connected to an exhaust fluid mechanism that forcibly exhausts the groove and places the space between the inner wall portion and the outer wall portion in a negative pressure state. The space between the inner wall portion and the outer wall portion is a space for collecting and draining the processing liquid used for processing the substrate 9, and the processing liquid collected in this space is discharged from the drain groove. Drained.

  The inner member 312 is a cylindrical member having an open upper end, and the upper portion (“upper end portion”, “upper end portion”) of the inner member 312 extends inward and upward. That is, the upper part extends obliquely upward toward the rotation axis a1. A cylindrical inner peripheral wall portion extending downward along the upper inner peripheral surface and a cylindrical outer peripheral wall portion extending downward along the upper outer peripheral surface are formed at the lower portion of the inner member 312. In a state where the bottom member 311 and the inner member 312 are close to each other (the state shown in FIG. 1), the outer wall portion of the bottom member 311 is accommodated between the inner peripheral wall portion and the outer peripheral wall portion of the inner member 312. The processing liquid received by the upper part of the inner member 312 is discharged through the bottom member 311.

  The outer member 313 is a cylindrical member having an open upper end and is provided outside the inner member 312. The upper part (“upper end portion”, “upper end portion”) of the external member 313 extends inward and upward. That is, the upper part extends obliquely upward toward the rotation axis a1. The lower portion extends downward along the outer peripheral wall portion of the inner member 312. The processing liquid received by the upper part of the outer member 313 is discharged from the gap between the outer peripheral wall part of the inner member 312 and the lower part of the outer member 313.

  The splash guard 31 is provided with a guard driving mechanism (“elevating drive unit”) 32 that moves the splash guard 31 up and down. The guard drive mechanism 32 is configured by, for example, a stepping motor. In this embodiment, the guard drive mechanism 32 raises and lowers the three members 311, 312, and 313 included in the splash guard 31 independently.

  Each of the inner member 312 and the outer member 313 receives the drive of the guard drive mechanism 32 and is moved between the upper position and the lower position. Here, the upper positions of the members 312 and 313 are positions at which the upper edge portions of the members 312 and 313 are arranged on the side and above the substrate 9 held on the spin base 21. On the other hand, the lower positions of the members 312 and 313 are positions where the upper edge portions of the members 312 and 313 are disposed below the upper surface of the spin base 21. The upper position (lower position) of the external member 313 is located slightly above the upper position (lower position) of the inner member 312. The inner member 312 and the outer member 313 are raised or lowered simultaneously or sequentially so as not to collide with each other. The bottom member 311 is driven by the guard drive mechanism 32 between a position where the inner wall portion is accommodated in the inner space of the flange-shaped member 241 provided in the casing 24 and a position below the bottom member 311. However, the guard driving mechanism 32 is electrically connected to the control unit 130 and operates under the control of the control unit 130. That is, the position of the splash guard 31 (specifically, the position of each of the bottom member 311, the inner member 312, and the outer member 313) is controlled by the control unit 130.

<Surface protector 4>
The surface protection unit 4 supplies gas (cover gas) to the vicinity of the center of the upper surface of the substrate 9 held on the spin base 21, and the atmosphere of the processing liquid supplied to the lower surface of the upper surface of the substrate 9. Protect from etc.

  The surface protection unit 4 includes a cylindrical cover gas nozzle 41 that discharges a gas toward the vicinity of the center of the upper surface of the substrate 9 held on the spin base 21. The cover gas nozzle 41 is attached to a portion near the tip of the arm 42 extending horizontally, and penetrates the arm 42 in the vertical direction. The center axis of the cover gas nozzle 41 coincides with the rotation axis a1. The lower end portion of the cover gas nozzle 41 extends further downward from the lower end surface of the arm 42. A disc-shaped rotating portion 93 is attached to the lower end portion of the cover gas nozzle 41 via a bearing. The central axis of the rotation part 93 coincides with the rotation axis a1. Thereby, the rotation part 93 can rotate in the circumferential direction around the cover gas nozzle 41 around the rotation axis a1.

  A disc-shaped blocking plate (“opposing member”) 90 is attached to the lower portion of the rotating portion 93 so as to be rotatable together with the rotating portion 93. The upper surface of the blocking plate 90 is provided so as to be substantially horizontal, and the shape thereof is a circle slightly larger than that of the spin base 21, and the rotation axis a1 passes through the center thereof. Thereby, the interruption | blocking board 90 can rotate to the circumferential direction centering on the rotating shaft a1. The blocking plate 90 includes a disc-shaped main body portion 91 having the rotation axis a <b> 1 as a central axis, and an extending portion 92 provided at the peripheral edge of the main body portion 91. A through hole 91 a that communicates with the cover gas nozzle 41 is provided at the center of the main body 91. The extending portion 92 is a cylindrical wall portion (annular wall portion) that extends downward from the peripheral edge portion of the main body portion 91, and is provided along the circumferential direction of the peripheral edge portion. The extending portion 92 is a cylindrical member that surrounds the end surface of the substrate 9 from the peripheral edge of the main body 91 and extends toward the spin base 21. The extending portion 92 protrudes toward the spin base 21 from the substrate 9 across the plane including the substrate 9 outside the end surface of the substrate 9.

  The base end portion of the arm 42 is connected to the nozzle base 43. The nozzle base 43 is arranged in such a posture that its axis is along the vertical direction, and is configured to be able to expand and contract along the vertical direction. The base end portion of the arm 42 is connected to the upper end of the nozzle base 43. The nozzle base 43 is provided with a drive unit (“moving unit”) 44 that expands and contracts the nozzle base 43 along its axis. The drive unit 44 includes, for example, a stepping motor.

  The drive unit 44 expands and contracts the nozzle base 43 to rotate the blocking plate 90 between the processing position (“first position”) and the retracted position (“second position”) above the processing position. Move relative to the spin base 21 along the a1 direction. The processing position of the shielding plate 90 is a position above the substrate 9 held on the spin base 21, and the lower surface of the shielding plate 90 faces the upper surface of the substrate 9 and is close to the upper surface in a non-contact state. Position. The retracting position of the blocking plate 90 is a position where the blocking plate 90 does not interfere with the transport path of the substrate 9, and is, for example, a position above the upper edge of the splash guard 31. When the blocking plate 90 is disposed at the processing position, the main body 91 faces the upper surface of the substrate 9 held by the spin base 21 with a gap therebetween, for example, substantially in parallel. The drive unit 44 is electrically connected to the control unit 130 and operates under the control of the control unit 130. That is, the position of the blocking plate 90 is controlled by the control unit 130.

  Two restriction structures 94 are provided at the distal end side portion of the extending portion 92. As the restriction structure 94, for example, as shown in FIG. 4, a recess that opens from the distal end surface of the extending portion 92 to the inner peripheral surface of the extending portion 92 is employed. At least a part of the protruding portion 26 is accommodated in the recess.

  An initial position (initial rotation angle) in each circumferential direction is set in advance on the spin base 21 and the blocking plate 90. When the blocking plate 90 is disposed at the retracted position above the processing position, the spin base 21 and the blocking plate 90 are respectively disposed at the initial positions in the circumferential direction. In this state, the two restricting structures 94, when seen through from above the blocking plate 90, overlap the two projecting portions 26 provided on the side surface portion of the spin base 21, respectively, on the distal end side of the extending portion 92 Each part is provided.

  As shown in FIG. 6, at least a part of the protruding portion 26 is accommodated in the restriction structure 94 in a state where the blocking plate 90 is disposed at the processing position. In this case, the restricting structure 94 is disposed so as to face the protruding portion 26 from the front and rear in the circumferential direction around the rotation axis a <b> 1, and restricts relative movement of the protruding portion 26 in the circumferential direction. In addition, in a state where the blocking plate 90 is disposed at the processing position, the extending portion 92 extends from the peripheral portion of the main body portion 91 to the side of the spin base 21. The restricting structure 94 is disposed below the upper surface of the spin base 21. That is, both the protruding portion 26 and the restricting structure 94 are disposed below the upper surface of the spin base 21. The spin base 21 and the blocking plate 90 are mutually restricted in relative movement in the circumferential direction around the rotation axis a <b> 1 through the protruding portion 26 and the restriction structure 94. That is, the restricting structure 94 and the protruding portion 26 are restricting portions 201 that restrict relative movement of the spin base 21 and the blocking plate 90 in the circumferential direction. In other words, the restricting portion 201 restricts the relative position of the blocking plate 90 with respect to the spin base 21 in the circumferential direction around the rotation axis a1.

  When the blocking plate 90 is disposed at the retracted position, the circumferential rotational positions of the restricting structure 94 and the protrusion 26 around the rotational axis a1 are aligned with each other. The restricting structure 94 is disposed so as to avoid a relative movement path of the protruding portion 26 with respect to the restricting structure 94 in the process of moving the blocking plate 90 from the retracted position to the processing position. Thereby, the collision with the control structure 94 and the protrusion part 26 in the said movement process can be avoided. When the blocking plate 90 is disposed at the processing position, the restricting structure 94 is disposed to face the protruding portion 26 from the front and rear in the circumferential direction around the rotation axis a1. More specifically, when the spin base 21 is stopped immediately after the restricting structure 94 is disposed at the processing position, the restricting structure 94 projects without contacting the projecting portion 26 from the front and rear in the circumferential direction. It is arranged to face the part 26. Thereby, the relative position of the blocking plate 90 with respect to the spin base 21 in the circumferential direction is restricted. Further, when the blocking plate 90 is disposed at the retracted position, the restricting structure 94 is disposed relatively away from the protruding portion 26 along the direction of the rotation axis a1.

  When the blocking plate 90 is arranged at the processing position and the rotation driving unit 23 rotates the rotating shaft unit 22 in a state where the relative position in the circumferential direction of the blocking plate 90 with respect to the spin base 21 is regulated by the regulating unit 201, The spin base 21 rotates with the substrate 9. As a result, the protrusion 26 abuts against the protrusion 26 in the restricting structure 94 on the downstream side in the rotation direction. Thereafter, the blocking plate 90 is driven to rotate in the same rotational direction as the spin base 21 at the same rotational speed.

  Here, for example, consider a case where an emergency stop operation is performed while the substrate processing apparatus 1 is processing while rotating the substrate. For example, in this case, it is assumed that the substrate processing apparatus 1 moves the blocking plate 90 to the retracted position. Thus, even when the blocking plate 90 and the spin base 21 are not at the initial position (initial rotation angle), it is necessary to automatically restart the processing.

  The spin base 21 can be rotated by being driven by the rotation driving unit 23, while the blocking plate 90 is rotated by the rotation of the spin base 21. Therefore, the following operation is required. For example, the control unit 130 controls the driving unit 44 to move the blocking plate 90 in the vertical direction so that the blocking plate 90 slightly contacts the spin base 21. Thereafter, the control unit 130 controls the rotation driving unit 23 to rotate the spin base 21 at a low speed, thereby rotating the shielding plate 90 in the circumferential direction around the rotation axis a1.

  The blocking plate 90 includes a sensor that can detect the initial position of the blocking plate 90 in the circumferential direction. Based on the output of the sensor, the control unit 130 controls the rotation driving unit 23 to stop the rotation of the blocking plate 90 when the blocking plate 90 reaches the initial position.

  Thereafter, the control unit 130 controls the drive unit 44 to move the blocking plate 90 to the upper retracted position, and controls the rotation drive unit 23 to rotate the spin base 21 to the initial position in the circumferential direction. Thereby, the shielding plate 90 and the spin base 21 are disposed at the initial position in the circumferential direction in a state where the shielding plate 90 is disposed at the retracted position. When the shielding plate 90 moves relative to the spin base 21 between the retracted position and the processing position, it is preferable that the shielding plate 90 does not deviate from the initial position in the circumferential direction. For this reason, the surface protection unit 4 is preferably provided with a lock mechanism that fixes the circumferential position of the rotation unit 93 and the shielding plate 90 with respect to the arm 42 in a state where the shielding plate 90 is disposed at the initial position in the circumferential direction. . When the blocking plate 90 is disposed at the processing position, the lock mechanism is released.

  4 and 5, the restricting structure 94 is provided at the front end side portion (lower end side portion) of the extending portion 92 and the protruding portion 26 is provided at the side surface portion of the spin base 21. 94 may be provided on the side surface portion of the spin base 21, and the projecting portion 26 may be provided on the distal end side portion of the extending portion 92. In other words, the protruding portion 26 is provided in one of the distal end side portion of the extending portion 92 of the blocking plate 90 and the side surface portion of the spin base 21, and the restriction structure 94 is provided in the other portion.

  For example, a pair of projecting portions disposed opposite to the projecting portions 26 from the front and rear in the circumferential direction around the rotation axis a <b> 1 may be employed as the restricting structure 94. Also in this case, since the relative movement of the protruding portion 26 in the circumferential direction can be restricted by the restriction structure, the usefulness of the present invention is not impaired. As shown in FIG. 4, when a recess that can accommodate at least a part of the protruding portion 26 is employed as the restricting structure, the distance between the spin base 21 and the extending portion 92 of the blocking plate 90 is made narrower. Therefore, the blocking plate 90 can be made smaller in diameter.

  Moreover, although the extending part 92 shown by FIG. 4 is a cylindrical member, it is distributed in the circumferential direction in the peripheral part of the main-body part 91 as an extending part, and several wall part extended below from a peripheral part. Or a pillar part may be used. The extending portion extends from at least a part of the peripheral edge of the main body 91 to the side of the spin base 21. If the extending portion is a cylindrical member, the flow of the processing liquid supplied to the substrate 9 and discharged from the substrate 9 to the outside is not traversed, so that the processing liquid that rebounds from the extending portion to the substrate 9 side can be reduced. it can.

  The cover gas nozzle 41 is connected to a cover gas supply unit 45 that is a piping system for supplying gas (here, for example, nitrogen (N 2) gas). Specifically, for example, the cover gas supply unit 45 is connected to the cover gas nozzle 41 through a pipe 452 in which an on-off valve 453 is inserted, for example, a nitrogen gas supply source 451 that is a supply source for supplying nitrogen gas. It has a configuration. In this configuration, when the on-off valve 453 is opened, the nitrogen gas supplied from the nitrogen gas supply source 451 is discharged from the through hole 91 a provided in the central portion of the blocking plate 90 through the cover gas nozzle 41. The gas supplied to the cover gas nozzle 41 may be a gas other than nitrogen gas (for example, various inert gases other than nitrogen gas, dry air, etc.).

  When gas is supplied from the cover gas supply unit 45 to the cover gas nozzle 41 in a state where the blocking plate 90 is disposed at the processing position, the center of the upper surface of the substrate 9 held on the spin base 21 from the cover gas nozzle 41. A gas (cover gas) is discharged toward the upper surface of the substrate 9 toward the vicinity. However, the on-off valve 453 of the cover gas supply unit 45 is electrically connected to the control unit 130 and is opened and closed under the control of the control unit 130. That is, the discharge mode (specifically, discharge start timing, discharge end timing, discharge flow rate, etc.) of the gas from the cover gas nozzle 41 is controlled by the control unit 130.

<Processing unit 5>
The processing unit 5 performs processing on the processing surface (the lower surface in the example of FIG. 1) of the substrate 9 held on the spin base 21. Specifically, the processing unit 5 supplies the processing liquid to the processing surface of the substrate 9 held on the spin base 21.

  As shown in FIG. 1, the processing unit 5 includes, for example, a supply pipe 81 that is disposed so as to penetrate through the hollow portion of the rotation shaft portion 22 of the spin chuck 2. The tip of the supply pipe 81 is connected to the opening below the through hole 21a so that the supply pipe 81 and the through hole 21a of the spin base 21 communicate with each other. A nozzle 50 is connected to the opening on the upper side (substrate 9 side) of the through hole 21a. The nozzle 50 includes a discharge port on the processing surface of the substrate 9 that is held by the spin base 21 and is rotating. The nozzle 50 discharges the processing liquid supplied through the supply pipe 81 from the discharge port to the lower surface of the substrate. In addition, a nozzle capable of supplying a processing liquid to the upper surface (the whole or a peripheral portion) of the substrate 9 as a processing surface may be employed. Such a nozzle is provided on the blocking plate 90, for example. As the nozzle 50, various nozzles capable of discharging the processing liquid onto the processing surface of the substrate 9 can be employed.

  The supply pipe 81 is connected to a treatment liquid supply unit 83 which is a piping system for supplying a treatment liquid thereto. Specifically, the processing liquid supply unit 83 includes an SC-1 supply source 831a, a DHF supply source 831b, an SC-2 supply source 831c, a rinse liquid supply source 831d, a plurality of pipes 832a, 832b, 832c, 832d, and A plurality of on-off valves 833a, 833b, 833c, and 833d are combined.

  The SC-1 supply source 831a is a supply source that supplies SC-1. The SC-1 supply source 831a is connected to the supply pipe 81 via a pipe 832a in which an on-off valve 833a is inserted. Therefore, when the on-off valve 833a is opened, SC-1 supplied from the SC-1 supply source 831a is discharged from the nozzle 50.

  The DHF supply source 831b is a supply source that supplies DHF. The DHF supply source 831b is connected to the supply pipe 81 via a pipe 832b in which an on-off valve 833b is inserted. Therefore, when the on-off valve 833b is opened, DHF supplied from the DHF supply source 831b is discharged from the nozzle 50.

  The SC-2 supply source 831c is a supply source that supplies SC-2. The SC-2 supply source 831c is connected to the supply pipe 81 via a pipe 832c in which an on-off valve 833c is inserted. Therefore, when the on-off valve 833c is opened, SC-2 supplied from the SC-2 supply source 831c is discharged from the nozzle 50.

  The rinse liquid supply source 831d is a supply source that supplies a rinse liquid. Here, the rinse liquid supply source 831d supplies, for example, pure water as the rinse liquid. The rinse liquid supply source 831d is connected to the supply pipe 81 via a pipe 832d in which an on-off valve 833d is inserted. Therefore, when the on-off valve 833d is opened, the rinse liquid supplied from the rinse liquid supply source 831d is discharged from the nozzle 50. As the rinsing liquid, pure water, warm water, ozone water, magnetic water, reducing water (hydrogen water), various organic solvents (ion water, IPA (isopropyl alcohol), functional water (CO2 water, etc.)), etc. are used. May be.

  When the processing liquid (SC-1, DHF, SC-2, or rinsing liquid) is supplied from the processing liquid supply unit 83 to the supply pipe 81, the processing of the substrate 9 held on the spin base 21 from the nozzle 50 is performed. The treatment liquid is discharged toward the vicinity of the center of the surface. However, each of the on-off valves 833a, 833b, 833c, and 833d provided in the processing liquid supply unit 83 is electrically connected to the control unit 130 and is opened and closed under the control of the control unit 130. That is, the control unit 130 controls the discharge mode of the processing liquid from the nozzle 50 (specifically, the type of processing liquid to be discharged, the discharge start timing, the discharge end timing, the discharge flow rate, etc.). The nozzle 50, the supply pipe 81, and the processing liquid supply unit 83 are a processing liquid discharge unit 83 </ b> A that discharges the processing liquid onto the processing surface of the substrate 9 under the control of the control unit 130.

<Washing part 6>
The cleaning unit 6 performs a cleaning process on both the side surface of the spin base 21 and the inner member 312 of the splash guard 31. Specifically, the cleaning unit 6 supplies the processing liquid to the lower surface of the flange portion 29 from below the flange portion 29 (FIG. 6) of the spin base 21. As shown in FIG. 1, the cleaning unit 6 includes, for example, a plurality (for example, four) of rinsing liquid discharge ports 86 provided on the side surface of the casing 24 of the spin chuck 2 and a plurality (for example, two) of rinses. And a liquid discharge port 87.

  The plurality of rinse liquid discharge ports 86 are opposed to the lower surface of the flange portion 29 of the spin base 21 (more preferably, the curved surface 211 (FIG. 6) that is the lower surface of the proximal end portion of the flange portion 29) and below the lower surface. Are distributed in the circumferential direction of the spin base 21. Each rinse liquid discharge port 86 is configured to be capable of discharging the rinse liquid upward along the vertical direction toward the lower surface (more preferably, the curved surface 211) of the flange portion 29.

  The plurality of rinse liquid discharge ports 87 are provided in a distributed manner in the circumferential direction of the spin base 21 so as to face the peripheral portion of the lower surface of the disk-shaped base portion 28 (FIG. 6) of the spin base 21 and below the peripheral portion. It has been. Each rinse liquid discharge port 87 is configured to discharge the rinse liquid upward along the vertical direction toward the peripheral edge of the lower surface of the base portion 28.

  Note that the axis of the casing 24 described above coincides with the rotation axis a1. The upper end portion of the casing 24 is formed in a cylindrical shape whose axis is the rotation axis a <b> 1, and the diameter thereof is slightly smaller than the diameter of the disk-shaped base portion 28 of the spin base 21. Therefore, when viewed from below, the peripheral edge of the lower surface of the base portion 28 protrudes outward from the outer peripheral surface of the upper end portion of the casing 24 and surrounds the outer peripheral surface. Thereby, the rinse liquid can be discharged from below toward the peripheral edge of the lower surface of the base portion 28. Further, the casing 24 includes a slope that obliquely faces the lower surface of the flange portion 29 of the spin base 21. The slope has a shape like a side surface of a truncated cone, and the diameter decreases as it approaches the upper end (on the spin base 21 side). The rinse liquid discharge ports 86 and 87 are provided, for example, so as to open on the slope.

  A rinsing liquid supply unit 85 that is a piping system for supplying a rinsing liquid to each of the rinsing liquid discharge ports 86 and 87 is connected thereto. The rinsing liquid supply unit 85 supplies the rinsing liquid when the spin base 21 is rotating. Specifically, the rinsing liquid supply unit 85 is configured by combining a rinsing liquid supply source 851d, a pipe 852d, and an on-off valve 853d.

  The rinse liquid supply source 851d is a supply source that supplies a rinse liquid. Here, the rinse liquid supply source 851d supplies, for example, pure water as a rinse liquid. The rinsing liquid supply source 851d is connected to the rinsing liquid discharge ports 86 and 87 via a pipe 852d in which an on-off valve 853d is inserted. The pipe 852 d branches into a plurality of branch pipes inside the casing 24, and the upper ends of the branch pipes are connected to the rinse liquid discharge ports 86 and 87. Therefore, when the on-off valve 853d is opened, the rinse liquid supplied from the rinse liquid supply source 851d is discharged from the rinse liquid discharge ports 86 and 87. As the rinsing liquid, pure water, warm water, ozone water, magnetic water, reducing water (hydrogen water), various organic solvents (ion water, IPA (isopropyl alcohol), functional water (CO2 water, etc.)), etc. are used. May be.

  The inner member 312 (outer member 313) can receive the processing liquid discharged from the substrate 9 after being supplied from the nozzle 50 to the substrate 9 in a state of being disposed above the inner member 312. When the inner member 312 is disposed at the lower position, the upper end of the inner member 312 is located on the side of the flange portion 29 of the spin base 21.

  When the rinsing liquid is supplied from the rinsing liquid supply unit 85 to the rinsing liquid discharge ports 86 and 87, the lower surface of the flange portion 29 of the spin base 21 and the peripheral portion of the lower surface of the base portion 28 from the rinsing liquid discharge ports 86 and 87. The rinsing liquid is discharged toward the head. The lower surface of the base portion 28 is cleaned by the rinsing liquid discharged toward the peripheral portion of the lower surface of the base portion 28. The rinse liquid discharged toward the lower surface of the flange portion 29 proceeds along the side surface while washing the side surface of the base portion 28 and hits the lower surface of the flange portion 29. The processing liquid moves to the outside in the radial direction of the spin base 21 along the lower surface of the flange portion 29 by the centrifugal force generated by the rotation of the spin base 21, and is discharged from the tip portion of the flange portion 29 to the outside of the spin base 21. The inner member 312 disposed at the lower position receives the rinse liquid discharged to the outside of the spin base 21 by the inner peripheral surface of the upper end side portion thereof. Thereby, the inner peripheral surface of the inner member 312 is cleaned. However, the on-off valve 853d provided in the rinse liquid supply unit 85 is electrically connected to the control unit 130 and is opened and closed under the control of the control unit 130. That is, the discharge mode of the rinse liquid from the rinse liquid discharge ports 86 and 87 (specifically, the discharge start timing, the discharge end timing, the discharge flow rate, etc.) is controlled by the control unit 130. The rinse liquid discharge ports 86 and 87 and the processing liquid supply unit 83 are a rinse liquid discharge unit (“cleaning liquid discharge unit”) 85 </ b> A that discharges the rinse liquid under the control of the control unit 130.

<2. Structure of shielding plate and spin base>
FIGS. 6 and 7 are longitudinal sectional views showing the configuration of the peripheral portion of the shielding plate 90 and the spin base 21 when the shielding plate 90 is disposed at the processing position. FIG. 6 shows a cross section of the restricting portion 201, and FIG. 7 shows a cross section of a portion other than the restricting portion 201. 6 and 7, the outer member 313 of the splash guard 31 is disposed at the upper position, and the inner member 312 is disposed at the lower position. FIG. 8 is a cross-sectional view showing the restricting portion 201. FIG. 9 is a cross-sectional view showing another restricting portion 201F according to the embodiment.

  The spin base 21 includes a disk-shaped base portion 28 having a circular upper surface shape, and an annular flange portion projecting radially outward from a position slightly below the upper surface of the base portion 28 at the periphery (side surface) of the base portion 28. 29. The base portion 28 and the flange portion 29 are integrally formed of, for example, vinyl chloride. The upper surface and the lower surface of the flange portion 29 (more specifically, the lower surface of the flange portion 29 other than the base end portion, that is, the lower surface of the distal end side portion of the flange portion 29) are formed along the horizontal plane, and the base portion 28 The side surface is a vertical surface. An annular curved surface (“curved surface portion”) 211 along the circumferential direction of the spin base 21 is formed at the proximal end portion of the flange portion 29. The curved surface 211 has, for example, a ¼ arc-shaped cross-section that protrudes obliquely upward toward the rotation axis a1. The radius of the arc is set to 5 mm to 10 mm, for example. The lower surface of the front end side portion of the flange portion 29 and the portion of the side surface of the base portion 28 below the flange portion 29 are gently connected by a curved surface 211.

  An annular recess is formed by the upper surface of the flange portion 29 and the upper portion of the flange portion 29 among the side surfaces of the base portion 28. A draining portion 27, which is an annular plate member, is fixed to the recess by a bolt. The draining portion 27 is preferably formed of, for example, a fluororesin having higher heat resistance than the base portion 28. The outer peripheral edge portion of the draining portion 27 extends outward from the outer peripheral edge of the flange portion 29 in the radial direction of the base portion 28. The diameter of the outer peripheral edge of the draining portion 27, that is, the diameter of the outer peripheral edge of the spin base 21 is larger than the diameter of the substrate 9. The upper surface of the draining portion 27 other than the outer peripheral edge portion (“tip portion”) is the same horizontal plane as the upper surface of the base portion 28. The upper surface of the outer peripheral edge portion of the draining portion 27 is a curved surface that protrudes obliquely upward and outward and is curved. The outer peripheral edge portion gradually decreases in thickness as it approaches the outer peripheral edge. The two protrusions 26 described above are provided so as to protrude from the tip (outer edge) of the outer peripheral edge of the draining portion 27 toward the radially outer side of the blocking plate 90. For example, the protrusion 26 is formed in a quadrangular prism shape as shown in FIGS. 5, 6, and 8. The upper surface 261 of the protruding portion 26 is a rectangular horizontal plane. The front end surface 262 of the protruding portion 26 is a rectangular vertical surface in which a normal line passing through the center of the front end surface 262 intersects with the rotation axis a1. The side surfaces 263 and 264 of the protruding portion 26 are rectangular vertical surfaces that are orthogonal to both the upper surface 261 and the tip surface 262. The upper surface 261 is located below the upper surface of the base portion 28. As a result, the entire protrusion 26 is positioned below the upper surface of the base 28.

  The main body 91 of the blocking plate 90 is a disk-shaped member made of, for example, vinyl chloride. The lower surface 911 other than the peripheral portion of the lower surface of the main body 91 faces the upper surface of the substrate 9 held by the chuck pins 25 of the spin base 21 with a gap. A distance D2 between the lower surface 911 and the upper surface of the substrate 9 is, for example, about 1 mm. An annular recess along the periphery is formed on the periphery of the lower surface of the main body 91. Thereby, the thickness of the peripheral part of the main-body part 91 is about half of the other part. The extending portion 92 has an annular shape that can be fitted into the recess. The extending portion 92 is fitted in the recess and is fixed to the main body portion 91 with a bolt. The extending portion 92 is preferably formed of a material having better heat resistance than the main body portion 91, for example, a fluororesin. The annular inner peripheral surface 921 of the extending portion 92 is erected upward from the lower end thereof, and then extends to the upper side of the peripheral portion of the substrate 9 toward the rotating shaft a1 side. An annular peripheral portion on the rotation axis a1 side of the inner peripheral surface 921 is gently connected to the lower surface 911 of the main body 91, and forms an opposing surface that faces the upper surface of the substrate 9 together with the lower surface 911. The extending portion 92 is a cylindrical wall portion extending downward from the peripheral edge portion of the main body portion 91, and the tip side portion extends to a side portion of the spin base 21. Of the inner peripheral surface 921 of the extended portion 92, the tip side (lower end side) portion of the extended portion 92 is a curved surface that curves so as to protrude obliquely upward and outward with respect to the upper surface of the spin base 21. Thereby, the width of the distal end side portion of the extending portion 92 in the radial direction of the blocking plate 90 is gradually reduced toward the lower side, that is, the side portion of the spin base 21. As described above, the inner peripheral surface 921 is continuous with the lower surface of the blocking plate 90 and bulges and curves so as to protrude obliquely upward and outward with respect to the upper surface of the spin base 21.

  A restricting structure 94 is formed at the distal end portion of the extending portion 92. For example, as shown in FIGS. 4, 6, and 8, the restriction structure 94 is a dent that opens from the distal end surface of the extending portion 92 to the inner peripheral surface of the extending portion 92. The restriction structure 94 is formed so as to be able to accommodate at least a part of the protruding portion 26 when the blocking plate 90 is disposed at the processing position. The upper surface 941 of the restriction structure 94 is a rectangular horizontal plane. The bottom surface 942 of the restriction structure 94 is a rectangular vertical surface that is orthogonal to the top surface 941 and whose normal passing through the center intersects the rotation axis a1. The side surfaces 943 and 944 of the restriction structure 94 are rectangular vertical surfaces that are orthogonal to both the upper surface 941 and the bottom surface 942. The upper surface 941 is located below the upper surface of the base portion 28 and above the upper surface 261 of the protruding portion 26. As a result, the entire restriction structure 94 is positioned below the upper surface of the base portion 28.

  When the blocking plate 90 is disposed at the processing position, one of the two restricting structures 94 accommodates at least a part of one of the two projecting portions 26, and the other restricting structure 94 is disposed on the other projecting portion 26. Accommodates at least a portion.

  When the spin base 21 is stopped immediately after the protruding portion 26 is accommodated in the restricting structure 94, the upper surface 941 of the restricting structure 94 and the upper surface 261 of the protruding portion 26 face each other with a gap. At the same time, the bottom surface 942 of the restricting structure 94 and the front end surface 262 of the protruding portion 26 face each other with a gap. The side surface 943 of the restricting structure 94 faces the side surface 263 of the protruding portion 26, and the side surface 944 of the restricting structure 94 faces the side surface 264 of the protruding portion 26. Thereby, the restricting structure 94 is disposed so as to face the protruding portion 26 from the front and rear in the circumferential direction around the rotation axis a <b> 1, and can restrict relative movement of the protruding portion 26 in the circumferential direction. The restricting structure 94 and the protruding portion 26 are restricting portions 201 that restrict the relative movement of the spin base 21 and the blocking plate 90 along the circumferential direction around the rotation axis a1.

  As shown in FIG. 7, in the state where the blocking plate 90 is disposed at the processing position, the distal end side portion of the extending portion 92, the side portion of the spin base 21, more specifically, the distal end portion of the draining portion 27. A gap G1 is formed in a portion other than the restricting portion 201. The width D1 of the gap G1 is, for example, about 1 mm to 5 mm. The processing liquid discharged by the nozzle 50 of the processing unit 5 onto the processing surface of the substrate 9 is discharged to the outside of the substrate 9 along the processing surface, and further discharged to the outside from the peripheral portion of the spin base 21 through the gap G1. The If the tip portion of the extension portion 92 and the top surface of the tip portion of the draining portion 27 of the inner peripheral surface 921 of the extension portion 92 are curved with each other as described above, the processing liquid will be in the gap G1. Is smoothly discharged to the outside.

  The upper end portion of the inner peripheral surface 921 of the extending portion 92 is located above the opposing surface (more specifically, the peripheral edge portion of the opposing surface) of the lower surface of the shielding plate 90, that is, the spin base 21. It exists in the position higher than the said opposing surface with respect to an upper surface. Thereby, an annular recess 922 is formed at the upper end portion of the inner peripheral surface 921. The recess 922 is formed along the circumferential direction with the rotation axis a1 as the center. The recessed portion 922 is formed between the distal end portion of the extending portion 92 and the portion of the blocking plate 90 that faces the substrate 9. That is, the recessed portion 922 is formed in a portion of the inner side surface 901 of the blocking plate 90 between the tip side portion of the extending portion 92 and the facing portion facing the substrate 9. The inner side surface 901 is a surface surrounding the upper surface and the end surface of the substrate 9. The inner side surface 901 includes a lower surface 911 of the main body portion 91 and an inner peripheral surface 921 of the extending portion 92. The recess 922 is recessed above the peripheral edge of the opposing portion of the blocking plate 90 that faces the upper surface of the substrate 9. An annular bulged space (“bulged space”) 923 is formed between the recessed portion 922 and the upper surface of the spin base 21. The space 923 swells above the opposing surface of the blocking plate 90 that faces the substrate 9. A distance D3 between the most recessed portion of the recess 922 and the upper surface of the substrate 9 is longer than the distance D2. The width D4 of the recess 922 in the radial direction of the blocking plate 90 is preferably set to 20 mm or more, for example.

  Of the inner side surface 901 of the blocking plate 90 (more specifically, the inner peripheral surface 921 of the extending portion 92), the portion outside the recessed portion 922 (the radially outer side of the blocking plate 90) with respect to the lower surface 911 As described above, a curved surface that bulges and curves obliquely upward and outward with respect to the upper surface of the spin base 21 is formed. In the illustrated example, the lower surface 911 is parallel to the upper surface of the substrate 9. However, the entire lower surface 911 may not be parallel to the upper surface of the substrate 9, for example, a portion of the lower surface 911 excluding the peripheral edge portion becomes higher from the upper surface of the substrate 9 toward the center of the lower surface 911.

  The processing liquid discharged from the gap G1 may stay in the space between the extending portion 92 and the draining portion 27 depending on the amount of the processing liquid and the width of the gap G1, but is formed by the recess 922. The space 923 becomes a buffer. Thereby, it can suppress that a process liquid rebounds and adheres to the non-processing surface of the board | substrate 9 resulting from the staying process liquid.

  Further, a part of the processing liquid discharged from the tip portion of the draining portion 27 hits the regulation structure 94 and the protruding portion 26 and rebounds. However, in a state where the blocking plate 90 is disposed at the processing position, both the restriction structure 94 of the blocking plate 90 and the protruding portion 26 of the spin base 21 are below the upper surface of the spin base 21, so that they are rebounded. The treatment liquid is prevented from adhering to the main surface (“non-treatment surface”) other than the treatment surface of the substrate 9.

  If the extending portion 92 and the draining portion 27 are formed of a fluororesin or the like having excellent heat resistance, it is possible to suppress damage to the shielding plate 90 and the spin base 21 due to the high temperature even when the treatment liquid is at a high temperature. it can. However, for example, a fluororesin is superior in heat resistance to vinyl chloride but has a low hardness. When the rotation driving unit 23 rotates the spin base 21 via the rotating shaft portion 22 with the blocking plate 90 disposed at the processing position, the projecting portion 26 and the regulating structure 94 contact each other during acceleration and deceleration. Touch. Thereby, the restricting structure 94 and the protrusions 26, that is, the members made of fluororesin may collide, and dust may be generated. When this dust adheres to the substrate 9, it becomes a defect. Note that the extending portion 92 and the spin base 21 may be integrally formed of the same material.

  In the configuration example of FIG. 9, the protruding portion 26 of the spin base 21 is covered with an O-ring formed of an elastic member such as EPDM on the outer peripheral surface other than the tip surface 262. Even when the restricting structure 94 and the protruding portion 26 come into contact with each other when the spin base 21 is accelerated, generation of dust can be suppressed. Note that dust generation can be suppressed if at least one of the protruding portion 26 and the restricting structure 94 is covered with an elastic member at a portion facing the other. Even if neither the protrusion 26 nor the restriction structure 94 is covered with the elastic member, the usefulness of the present invention is not impaired.

  12 and 13 are longitudinal sectional views showing a blocking plate 90B and a spin base 21B as another configuration example of the blocking plate and the spin base of the substrate processing apparatus according to the embodiment. 12 and 13 show the peripheral portions of the blocking plate 90B and the spin base 21B. In FIG. 12, the cross section in the control part 201 is shown, and in FIG. 13, the cross section in parts other than the control part 201 is shown. The blocking plate 90B has the same configuration as the blocking plate 90 except that the extending portion 92B is provided instead of the extending portion 92 of the blocking plate 90. The spin base 21 </ b> B has the same configuration as the spin base 21 except that a draining portion 27 </ b> B is provided instead of the draining portion 27 of the spin base 21.

  The inner peripheral surface (lower surface) 921B of the extending portion 92B is smoothly connected to the lower surface of the main body portion 91 other than the thin peripheral edge portion. The inner peripheral surface 921B is not formed with the recessed portion 922 of the extending portion 92. Moreover, the curved surface provided in the upper surface of the front-end | tip part of the draining part 27 is not formed in the draining part 27B, and the front end surface of the draining part 27B is a vertical surface. The processing liquid is discharged to the outside through the gap G2 between the extending portion 92B and the draining portion 27B through the processing surface of the substrate 9 and the peripheral edge of the upper surface of the spin base 21B. In the portion where the restricting portion 201 is provided, the processing liquid is rebounded by the restricting portion 201 (the restricting structure 94, the protruding portion 26).

  However, the protruding portion 26 provided at the tip portion of the draining portion 27B, that is, the side surface portion of the spin base 21B, and the regulation structure 94 provided at the tip side portion of the extending portion 92B are more than the upper surface of the spin base 21B. It is arranged below. Thereby, the penetration | invasion and adhesion to the non-processing surface of the board | substrate 9 of the processing liquid bounced back are suppressed. Therefore, the blocking plate 90B is used instead of the blocking plate 90, and even if the spin base 21B is used instead of the spin base 21, the usefulness of the present invention is not impaired. Further, the blocking plate 90B may be combined with the spin base 21, and the blocking plate 90 may be combined with the spin base 21B.

<3. Operation and configuration of substrate processing apparatus>
FIG. 20 is a flowchart showing an operation of the substrate processing apparatus 1 performing the processing of the lower surface of the substrate 9 and the cleaning processing of the side surface of the spin base 21 and the inner member 312 by the nozzle 50 and the cleaning unit 6. FIG. 21 is a schematic diagram for explaining the operation shown in the flowchart of FIG. FIG. 21 shows a longitudinal section of the substrate processing apparatus 1 according to the processing order of FIG. FIG. 22 is a schematic diagram for explaining in more detail the operation of step S150 in the flowchart of FIG. Step S <b> 150 is a step in which the substrate processing apparatus 1 performs a cleaning process by the cleaning unit 6. FIG. 22 shows a longitudinal section of a portion of the substrate processing apparatus 1 that includes the peripheral portions of the blocking plate 90 and the spin base 21 and the upper portions of the inner member 312 and the outer member 313. The outer member 313 of the splash guard 31 is disposed at the upper position, and the inner member 312 is disposed at the lower position.

  Hereinafter, an example of an operation in which the substrate processing apparatus 1 performs a process on the lower surface of the substrate 9 and a cleaning process on the side surface of the spin base 21 and the inner member 312 will be described with reference to FIGS. Further, the positional relationship of the blocking plate 90, the spin base 21, the inner member 312, and the outer member 313 will be described as appropriate. If necessary, other drawings are also referred to as appropriate. Here, the case where the nozzle 50 discharges the processing liquid to the lower surface of the substrate 9 will be described. For example, the processing liquid is supplied to the upper surface of the substrate 9 from the nozzle provided in the central portion of the blocking plate 90 and the substrate 9 The top surface may be treated.

  Prior to the start of the operation shown in FIG. 20, the substrate 9 is transferred onto the spin base 21 and held by the chuck pins 25. Further, the blocking plate 90 is disposed at the processing position, and the inner member 312 and the outer member 313 are disposed at respective lower positions. The rotation of the spin base 21 is stopped, and the nozzle 50 and the rinse liquid discharge ports 86 and 87 do not discharge the processing liquid and the rinse liquid.

  The substrate processing apparatus 1 moves the inner member 312 and the outer member 313 to their upper positions from the state in which the inner member 312 and the outer member 313 are disposed at their lower positions (step S110). Specifically, the control unit 130 controls the guard driving mechanism 32 to move the inner member 312 and the outer member 313 to their upper positions and arrange them at the upper positions. Thereafter, preferably, the cover gas nozzle 41 (FIG. 1) of the surface protection unit 4 starts to discharge gas (cover gas) toward the vicinity of the center of the upper surface of the substrate 9 held on the spin base 21.

  When the process of step S110 is completed, the substrate processing apparatus 1 starts rotating the spin base 21 (step S120). Specifically, the control unit 130 controls the rotation driving unit 23 to start the rotation of the rotation shaft unit 22. As a result, the spin base 21 starts rotating together with the rotating shaft portion 22. The rotation speed of the spin base 21, that is, the substrate 9, is set to 1000 to 1500 rpm, for example.

  Next, the substrate processing apparatus 1 processes the lower surface of the substrate 9 with the processing liquid (step S130). Specifically, for example, the control unit 130 selectively opens the on-off valves 833a to 833d to cause the processing liquid supply unit 83 to process the processing liquids (SC-1, DHF, SC-2, Alternatively, the supply of the rinse liquid) is started. The processing liquid is supplied to the nozzle 50 through the pipe 832a and the like, and the nozzle 50 starts to discharge the processing liquid toward the processing surface (the lower surface in the illustrated example) of the substrate 9. For example, the processing liquid is supplied at a flow rate of 600 ml / min for 7 to 10 seconds. Thereafter, the control unit 130 causes the processing liquid supply unit 83 to stop supplying the processing liquid by closing the on-off valves 833a to 833d. Thereby, the nozzle 50 stops the discharge of the processing liquid toward the lower surface of the substrate 9.

  When the supply of the processing liquid to the processing liquid supply unit 83 is stopped, the substrate processing apparatus 1 moves the inner member 312 to the lower position and arranges it at the lower position (step S140). Specifically, the control unit 130 causes the guard driving mechanism 32 to move the inner member 312 from the upper position to the lower position, and stops the inner member 312 at the lower position.

  When the inner member 312 is disposed at the lower position, the upper end of the inner member 312 is located on the side of the lower surface of the flange portion 29. More specifically, the lower surface of the upper end of the inner member 312 is disposed in a range of, for example, 25 mm below to 25 mm above the lower surface of the distal end portion of the flange portion 29. Preferably, as shown in FIG. 22, the lower surface of the upper end of the inner member 312 and the lower surface of the distal end side portion of the flange portion 29 are disposed at the same height. When the upper end of the inner member 312 is positioned on the side of the lower surface of the flange portion 29 due to the inner member 312 being disposed at the lower position, the inner member 312 is placed on the lower surface of the flange portion 29 by the inner peripheral surface of the upper end portion. A rinse liquid discharged to the outside of the spin base 21 can be received.

  The horizontal distance D5 between the upper end portions of the inner member 312 and the outer member 313 and the outer peripheral surface of the blocking plate 90 is set to 1 mm to 5 mm, for example. The interval D5 is constant regardless of the elevation of the inner member 312 and the outer member 313. Further, a horizontal distance D6 between the upper end portions of the inner member 312 and the outer member 313 and the tip of the draining portion 27 is set to 5 mm to 10 mm, for example. The horizontal distance D7 between the upper end portions of the inner member 312 and the outer member 313 and the front end surface of the flange portion 29 is set to 15 mm to 25 mm, for example. Further, a horizontal distance D8 between the upper end portions of the inner member 312 and the outer member 313 and the side surface of the base portion 28 is set to 40 mm, for example. The thicknesses of the upper ends of the inner member 312 and the outer member 313 are, for example, about 5 mm. The lower surface of the draining portion 27 and the lower end surface of the extending portion 92 of the blocking plate 90 are set at substantially the same height, and the vertical distance D9 between these surfaces and the lower surface of the upper end portion of the inner member 312 is: For example, it is set to 10 mm.

  The substrate processing apparatus 1 cleans the side surface of the spin base 21 and the inner peripheral surface of the inner member 312 while processing the lower surface of the substrate 9 with the processing liquid in a state where the inner member 312 is disposed at the lower position. (Step S150). That is, the controller 130 rinses the rinsing liquid toward the lower surface of the flange portion 29 of the spin base 21 that rotates while holding the substrate 9 in a state where the inner member 312 is disposed at the lower position in the guard driving mechanism 32. A rinse liquid is discharged to the discharge ports 86 and 87. Specifically, the control unit 130 opens the on-off valve 353d and supplies the rinsing liquid from the rinsing liquid supply source 851d to each of the rinsing liquid discharge ports 86 and 87 at a flow rate of, for example, 600 ml / min for 7 to 10 seconds. Supply. The rinse liquid is supplied to the rinse liquid discharge ports 86 and 87 through the pipe 852d, and the rinse liquid discharge ports 86 and 87 discharge the rinse liquid upward in the vertical direction.

  Prior to the start of supplying the rinse liquid to the rinse liquid discharge ports 86 and 87, the control unit 130 preferably controls the rotation drive unit 23 to increase the rotation speed of the spin base 21. Specifically, the rotation speed is set to, for example, about 2000 rpm to 2500 rpm. Thereby, the rinse liquid discharged to the lower surface of the flange portion 29 can easily reach the inner member 312.

  Further, in step S150, the control unit 130 controls the processing liquid supply unit 83 in the same manner as the processing in step S130 while discharging the rinsing liquid upward from each of the rinsing liquid discharge ports 86 and 87 in the same manner as in step S130. The processing liquid is discharged from the nozzle 50 toward the lower surface. The processing liquid discharged in step S150 may be the same as or different from the processing liquid discharged in step S130.

  As shown in FIG. 22, the rinse liquid discharged toward the curved surface 211 of the flange portion 29 flows along the side surface of the base portion 28 and cleans the side surface. The traveling direction of the rinsing liquid that has reached the curved surface 211 is changed outward in the radial direction of the spin base 21 by the curved surface 211. The rinse liquid is blown from the tip of the flange portion 29 toward the upper end side of the inner member 312 by the centrifugal force generated by the rotation of the spin base 21. When the inner member 312 is disposed at the lower position and the upper end thereof is disposed on the side of the lower surface of the distal end side portion of the flange portion 29, the rinse liquid blown off from the distal end of the flange portion 29 is shown in FIG. As shown, the inner member 312 is scattered on the inner peripheral surface including the lower surface of the upper end side portion, and the inner peripheral surface is cleaned.

  Further, the processing liquid supplied to the lower surface of the substrate 9 by the nozzle 50 is a gap G <b> 1 between the distal end portion (lower end portion) of the extending portion 92 of the blocking plate 90 and the distal end portion of the draining portion 27 of the spin base 21 (FIG. 7) and discharged to the outside of the spin base 21. The draining portion 27 is located above the flange portion 29 and protrudes outward in the radial direction of the spin base 21 from the flange portion 29. Accordingly, the treatment liquid discharged from the upper surface of the draining portion 27 and the rinse liquid discharged from the lower surface of the flange portion 29 are discharged from the spin base 21 in a state of being separated from each other. The discharged processing liquid and rinsing liquid are separated from each other by the upper end side portion of the inner member 312, and spread to the outside in the radial direction of the spin base 21 while spreading in the vertical direction. The processing liquid is received by the outer member 313 disposed at a position above the upper surface of the upper end portion of the outer member 313. The rinse liquid is received by the inner peripheral surface of the outer member 313 including the inner peripheral surface of the upper end side portion of the inner member 312 and cleans the inner peripheral surface.

  When the process of step S150 is completed, the control unit 130 causes the processing liquid supply unit 83 and the rinsing liquid supply unit 85 to stop supplying the processing liquid and the rinsing liquid, and the inner member 312 and the outer member 313 are moved to lower positions. Alternatively, the rotation of the spin base 21 is stopped.

  As described above, the upper surface of the outer peripheral edge portion of the draining portion 27 is a curved surface that protrudes obliquely upward and outward, and is gradually curved toward the outer peripheral edge (tip portion) of the draining portion 27 and the outer peripheral edge. The thickness is thin. Accordingly, the treatment liquid discharged from the gap G <b> 1 is suppressed from flowing around the flange portion 29 side along the lower surface of the draining portion 27. Accordingly, the processing liquid is prevented from being scattered toward the inner peripheral surface of the inner member 312 by being mixed with the rinse liquid discharged from the flange portion 29.

  For example, although the front end surface of a draining portion 27B (FIG. 13) to be described later is a vertical surface, the draining portion 27B is also located above the flange portion 29 and protrudes radially outward of the spin base 21 from the flange portion 29. Yes. Therefore, the treatment liquid discharged from the upper surface of the draining portion 27B and the rinse liquid discharged from the lower surface of the flange portion 29 are discharged from the spin base 21 in a state of being separated from each other. Thus, even if the draining part 27B is employed, the usefulness of the present invention is not impaired.

  For example, when the draining portion 27 (27B) is not provided, a part of the processing liquid discharged to the substrate 9 and discharged from the spin base 21 through the substrate wraps around the lower surface side of the flange portion 29. In this case, the wrapping processing liquid is discharged from the spin base 21 together with the rinsing liquid discharged from below toward the lower surface of the flange portion and discharged along the lower surface. However, if the same rinsing liquid as the rinsing liquid supplied by the rinsing liquid supply unit 85 is adopted as the processing liquid supplied to the substrate 9, the substrate 9 is cleaned with the rinsing liquid without causing problems due to the mixing. Cleaning of the inner peripheral surface of the inner member 312 can be performed in parallel. Therefore, even if the draining portion 27 (27B) is not provided, the usefulness of the present invention is not impaired.

  Further, for example, if the rinsing liquid is discharged from the rinsing liquid discharge ports 86 and 87 without discharging the processing liquid from the nozzle 50 in step S150, the remaining processing liquid attached to the substrate 9 in step 130 is The substrate 9 can be dried by being shaken off by the high-speed rotation of the substrate 9. In this case, a large amount of processing liquid is not discharged from the spin base 21 through the substrate 9 in step S150. Therefore, even if the outer member 313 is not provided, the cleaning of the side surface of the spin base 21 and the cleaning of the inner peripheral surface of the inner member 312 can be performed by the rinse liquid discharge ports 86 and 87 in step S150. Therefore, even if the outer member 313 is not provided, the usefulness of the present invention is not impaired.

  Further, the curved surface 211 is not formed on the lower surface of the base end portion of the flange portion 29, and for example, the lower surface of the flange portion 29 and the side surface of the base portion 28 may be substantially orthogonal. Even in this case, the rinse liquid discharged to the lower surface of the flange portion 29 is discharged from the tip of the flange portion 29 toward the inner peripheral surface of the inner member 312 by the centrifugal force generated by the rotation of the spin base 21.

  Further, even when each rinse liquid discharge port 87 does not discharge the rinse liquid toward the lower surface peripheral portion of the spin base 21, if each rinse liquid discharge port 86 discharges the rinse liquid toward the lower surface of the flange portion 29, Cleaning of the side surface of the spin base 21 and cleaning of the inner peripheral surface of the inner member 312 can be performed. Therefore, even if each rinse liquid discharge port 87 is not provided, the usefulness of the present invention is not impaired.

  Further, only the spin base 21 of the spin base 21, the rinse liquid discharge ports 86 and 87, and the inner member 312 rotates around the rotation axis a1. For this reason, it is preferable that a large number of rinse liquid discharge ports 86 are arranged along the circumferential direction of the spin base 21 because the inner peripheral surface of the inner member 312 can be more uniformly cleaned. Even if only the outlet 86 is provided, the side surface of the spin base 21 and the inner peripheral surface of the inner member 312 can be cleaned in parallel, so that the usefulness of the present invention is not impaired.

<4. About other embodiments>
10 and 11 are perspective views showing a blocking plate 90A and a spin base 21A as another configuration example of the blocking plate and the spin base of the substrate processing apparatus according to the embodiment. FIG. 11 is a perspective view showing the shielding plate 90A and the spin base 21A when the shielding plate 90A is disposed at the processing position.

  The blocking plate 90 </ b> A is configured in the same manner as the blocking plate 90 except that the extending portion 92 </ b> A is provided instead of the extending portion 92 of the blocking plate 90. Similarly to the extending portion 92, the extending portion 92 </ b> A extends from the peripheral portion of the disk-shaped main body portion 91 to the side of the spin base 21 </ b> A, and extends along the circumferential direction about the rotation axis a <b> 1. It is the cylindrical wall part extended cyclically | annularly. The difference between the extending portion 92A and the extending portion 92 is that the blocking plate 90 has two restriction structures 94 at the distal end side portion thereof, whereas the extending portion 92A has a plurality of distal end side portions. The restriction structure 94A is provided.

  The spin base 21A is configured in the same manner as the spin base 21 except that a protrusion 26A is provided in place of the protrusion 26 at the tip of the draining portion 27 of the spin base 21. The restricting structure 94A and the protruding portion 26A are restricting portions 201A that restrict the relative movement of the spin base 21A and the blocking plate 90A in the circumferential direction about the rotation axis a1.

  The plurality of restriction structures 94A are continuously provided over the entire circumference in the circumferential direction of the distal end side portion of the extending portion 92A. Each restricting structure 94A is a recess formed in a shape capable of accommodating at least a part of the protruding portion 26A. Each restricting structure 94A penetrates the distal end portion of the extending portion 92A along the radial direction of the blocking plate 90A, and also opens below the distal end portion. That is, the restricting structure 94A opens in a direction along the direction of the rotation axis a1 to the protruding portion 26A protruding from the side surface portion of the spin base 21A. Note that, even if the restriction structure 94A does not penetrate through the distal end portion of the extending portion 92A along the radial direction of the blocking plate 90A as in the restriction structure 94 shown in FIG. 6, the usefulness of the present invention is impaired. It is not a thing. In this case, the sealing property of the substrate 9 by the blocking plate 90A can be improved.

  The width W1 along the circumferential direction of at least the lower opening portion of the restricting structure 94A becomes wider as the opening approaches. Specifically, the restriction structure 94A includes side surfaces (slopes) 943A and 944A that are diagonally opposed to each other along the circumferential direction around the rotation axis a1. The width W1 along the circumferential direction of the side surface 943A and the side surface 944A becomes wider as approaching downward.

  The protruding portion 26A is formed in a pentagonal column shape, for example, and its axial direction is along the radial direction of the spin base 21A. The protruding portion 26A includes a rectangular horizontal bottom surface 267A, and rectangular side surfaces 265A and 266A provided upright from both ends of the bottom surface 267A in the circumferential direction of the spin base 21A, that is, on the opening side of the restricting structure 94A. Is provided. The side surfaces 265A and 266A are vertical surfaces. Slopes 263A, 264A are connected to the upper ends of the side surfaces 265A, 266A. The slope 263A and the slope 264A form a tip portion (upper end portion) of the protruding portion 26A. The slope 263A and the side surface 943A of the restriction structure 94A are substantially parallel to each other, and the slope 264A and the side surface 944A are also substantially parallel to each other. The width W2 in the circumferential direction centering on the rotation axis a1 between the slope 263A and the slope 264A becomes narrower as approaching upward. That is, at least the tip portion of the protruding portion 26A faces the restriction structure 94A on the tip side portion of the extending portion 92A, and the width W2 along the circumferential direction around the rotation axis a1 of the tip portion has a restriction structure. As it approaches 94, it becomes narrower. Further, the restricting structure 94A and the protruding portion 26A are preferably formed so that at least the tip side portion of the protruding portion 26A can be fitted to at least the opening portion on the protruding portion 26A side of the restricting structure 94A. .

  Here, at least one of the spin base 21A and the blocking plate 90A is not disposed at the initial position in the circumferential direction, and either one is not locked for rotation in the circumferential direction, and the other is Consider the case where the blocking plate 90A is moved from the retracted position to the processing position in the locked state.

  The plurality of restriction structures 94A are continuously provided over the entire circumference in the circumferential direction of the distal end side portion of the extending portion 92A. Accordingly, during the movement of the blocking plate 90A to the processing position, the tip of the protrusion 26A comes into contact with any one of the plurality of restriction structures 94A. In most cases, as shown in FIG. 10, the side surface 944A of the restricting structure 94 and the inclined surface 264A of the protruding portion 26A come into contact with each other, or the side surface 943A of the restricting structure 94 and the inclined surface 263A of the protruding portion 26A Will come into contact. That is, the inclined surfaces having substantially the same inclination contact each other.

  From this state, when the blocking plate 90A is further moved to the processing position, in the process, the extending portion 92A is moved so that the top of the restricting structure 94A and the tip of the protruding portion 26A approach each other in the circumferential direction. Then, it is moved to the processing position while rotating relative to the spin base 21A in the circumferential direction. Then, as shown in FIG. 11, when the blocking plate 90A is disposed at the processing position, the tip end portion of the protruding portion 26A is accommodated in the restricting structure 94A. Thereby, the blocking plate 90A is restricted from moving in the circumferential direction with respect to the spin base 21A.

  When the blocking plate 90A is disposed at the processing position, the upper ends of the restricting structures 94A and the upper ends of the protruding portions 26A are provided below the upper surface of the spin base 21A. Therefore, even when the processing liquid discharged from the processing surface of the substrate 9 hits the regulating portion 201A and rebounds, the rebounding of the processing liquid on the non-processing surface of the substrate 9 can be suppressed.

  A plurality of restricting structures 94A may be provided along the circumferential direction at the side surface portion of the spin base 21A, and the protruding portion 26A may be provided at the tip side portion of the extending portion 92A.

  14 to 17 are cross-sectional views showing a restricting portion 201C of the shield plate 90C and the spin base 21C as another configuration example of the shield plate and the spin base restricting portion of the substrate processing apparatus according to the embodiment. The shielding plate 90C is disposed at the processing position. FIG. 14 shows the restricting portion 201 in a state where the spin base 21 is stationary, and FIG. 15 shows the restricting portion 201C when the spin base 21C is rotating while accelerating. FIG. 16 shows the restricting portion 201C when the spin base 21C rotates at a constant speed, and FIG. 17 shows the restricting portion 201C when the spin base 21C rotates while decelerating.

  The spin base 21 </ b> C is configured in the same manner as the spin base 21 except that the protrusion 26 </ b> C is provided instead of the protrusion 26 of the spin base 21. The protruding portion 26C is configured in the same manner as the protruding portion 26 except that the protruding portion 26C includes a magnet 101a therein. The N pole of the magnet 101a is disposed on the side surface 263 side, and the S pole is disposed on the side surface 264 side. The magnet 101a is provided on the protruding portion 26C so that the N pole and the S pole are sequentially arranged substantially along the circumferential direction around the rotation axis a1.

  The shielding plate 90 </ b> C is configured in the same manner as the shielding plate 90 except that the extending portion 92 </ b> C is provided instead of the extending portion 92 of the shielding plate 90. The extending portion 92C is configured in the same manner as the extending portion 92, except that the magnets 101b and 101c are provided inside. The magnet 101b is configured such that the N pole and the S pole are sequentially arranged substantially along the circumferential direction around the rotation axis a1, and the N pole is closer to the side surface 943 of the restriction structure 94 than the S pole. The structure 94 is provided on the upstream side in the rotation direction of the spin base 21C. The magnet 101c is configured such that the N pole and the S pole are sequentially arranged substantially along the circumferential direction around the rotation axis a1, and the S pole is closer to the side surface 944 of the restriction structure 94 than the N pole. The structure 94 is provided on the downstream side in the rotation direction of the spin base 21C.

  Thus, the magnets 101a to 101c are arranged so that the N pole of the magnet 101b and the N pole of the magnet 101a face each other, and the S pole of the magnet 101a and the S pole of the magnet 101c face each other. And a magnetic repulsion works between N poles and between S poles. Moreover, it is preferable that the magnets 101a to 101c generate magnetic fields having substantially the same strength.

  That is, the magnets 101a to 101c widen the gaps between the protrusions 26C and the side surfaces 943 and 944 disposed on the front and rear in the circumferential direction around the rotation axis a1 with respect to the protrusions 26C of the restricting structure 94. Magnetic repulsive force is applied to By the magnetic repulsive force, the relative movement in the circumferential direction of the protruding portion 26 </ b> C with respect to the restricting structure 94 is restricted. Further, the magnets 101a to 101c may be provided so that the N pole and the S pole of the magnets 101a to 101c are inverted from each other.

  As shown in FIG. 14, when the spin base 21 is at rest, a force that acts to widen the distance between the side surface 943 and the side surface 263 and a force that acts to widen the distance between the side surface 944 and the side surface 264. And are substantially equal to each other, and their intervals are substantially equal. As shown in FIG. 16, even when the spin base 21 is rotating at a constant speed, these intervals are substantially equal.

  As shown in FIG. 15, when the spin base 21 is accelerating, the distance between the side surface 944 and the side surface 264 is reduced by the acceleration of the spin base 21 in addition to the magnetic repulsive force between the magnets. A force that widens the distance between 943 and the side surface 263 further acts. For this reason, the interval between the side surface 944 and the side surface 264 is wider than the interval between the side surface 943 and the side surface 263.

  As shown in FIG. 17, when the spin base 21 is decelerating, in addition to the magnetic repulsive force between the magnets, the spin base 21 is decelerated to widen the distance between the side surface 944 and the side surface 264, and the side surface 943. The force which narrows the space | interval with the side surface 263 acts further. For this reason, the distance between the side surface 944 and the side surface 264 is narrower than the distance between the side surface 943 and the side surface 263.

  Each of the magnets 101a to 101c, the restricting structure 94, and the protruding portion 26C are restricting portions 201C that restrict the relative movement (position) of the blocking plate 90C with respect to the spin base 21C in the circumferential direction around the rotation axis a1. It is.

  As shown in FIGS. 14 to 17, when the blocking plate 90C is disposed at the processing position, the projecting portion 26C and the regulating structure 94 of the extending portion 92C, including during the acceleration and deceleration of the spin base 21, It is preferable to always regulate the circumferential movement around the rotation axis a1 in a non-contact state. In this case, dust generation due to contact between the protruding portion 26C and the restriction structure 94 of the extending portion 92C can be completely prevented. Temporarily, due to the magnitude of repulsive force applied by each magnet and the magnitude of the acceleration of the spin base 21C, the protruding portion 26C and the restricting structure 94 of the extending portion 92C are during the acceleration and deceleration of the spin base 21. Even if it contacts, compared with the case where each magnet 101a-101c is not provided, the impact at the time of a contact can be reduced significantly. Therefore, even if the projecting portion 26C comes into contact with the regulating structure 94 of the extending portion 92C during acceleration or deceleration of the spin base 21, the usefulness of the present invention is not impaired.

  FIG. 18 is a cross-sectional view showing a restricting portion 201D of the extending portion 92D and the spin base 21C as another configuration example of the blocking plate and the spin base restricting portion of the substrate processing apparatus according to the embodiment. FIG. 19 is a cross-sectional view showing a restricting portion 201E of the extending portion 92E and the spin base 21C as another configuration example of the blocking plate and the spin base restricting portion of the substrate processing apparatus according to the embodiment. 18 and 19 are cross-sectional views in which the restricting portions 201D and 201E are cut by a cylinder having the rotation axis a1 as the center.

  The spin base 21C shown in FIGS. 18 and 19 has the same configuration as the spin base 21C shown in FIG. A blocking plate 90D in FIG. 18 is configured in the same manner as the blocking plate 90C except that an extending portion 92D is provided instead of the extending portion 92C of the blocking plate 90C in FIG. The extending portion 92D is configured in the same manner as the extending portion 92C except that the extending portion 92D further includes a magnet 101d. Each of the magnets 101a to 101e preferably generates a magnetic field having substantially the same strength. The magnet 101d is provided such that the N pole and the S pole are sequentially arranged along the upper surface 941 of the restricting structure 94 substantially along the circumferential direction around the rotation axis a1. The north pole of the magnet 101d faces the north pole of the magnet 101a, and the south pole of the magnet 101d faces the south pole of the magnet 101a. As a result, a magnetic repulsive force acts between the magnets 101a and 101d. As a result, a force acts to increase the distance between the upper surface 941 and the upper surface 261.

  The magnets 101a to 101c act on a magnetic repulsive force that widens the intervals between the side surfaces 943 and 944 of the restricting structure 94 and the protruding portion 26C in the circumferential direction around the rotation axis a1. Further, the magnets 101a and 101d apply a magnetic repulsive force so as to widen the distance between the upper surface 941 of the restricting structure 94 and the upper surface 261 of the protruding portion 26C in the direction of the rotation axis a1 (vertical direction). Thereby, the movement of the upper surface 941 and the upper surface 261 approaching each other is restricted, and the mutual contact is also suppressed, so that the generation of dust due to the contact between the restriction structure 94 and the protruding portion 26C can be further suppressed.

  Each of the magnets 101a to 101d, the restricting structure 94, and the protruding portion 26C has a relative movement (position) of the blocking plate 90C with respect to the spin base 21C in both the circumferential direction around the rotation axis a1 and the vertical direction. ) Is a restriction unit 201D.

  A blocking plate 90E in FIG. 19 is configured in the same manner as the blocking plate 90C except that an extending portion 92E is provided instead of the extending portion 92C of the blocking plate 90C in FIG. The extending portion 92E is configured in the same manner as the extending portion 92C, except that magnets 101e and 101f are further provided inside. Each of the magnets 101a to 101c, 101e, and 101f preferably generates a magnetic field having substantially the same strength. The magnet 101e is provided above the upper surface 941 of the restricting structure 94 such that the N pole is close to the upper surface 941 and the S pole is positioned above the upper surface 941. Further, the N pole of the magnet 101d and the N pole of the magnet 101a face each other. The magnet 101f is provided above the upper surface 941 of the restricting structure 94 such that the south pole is close to the upper surface 941 and the north pole is positioned above the upper surface 941. Further, the south pole of the magnet 101d and the south pole of the magnet 101a face each other.

  Thereby, a magnetic repulsive force acts between the magnets 101a and 101e, and a magnetic repulsive force also acts between the magnets 101a and 101f. As a result, a force acts to increase the distance between the upper surface 941 and the upper surface 261.

  The magnets 101a to 101e act on a magnetic repulsive force that widens the intervals between the side surfaces 943 and 944 of the restricting structure 94 and the protruding portion 26C in the circumferential direction around the rotation axis a1. Furthermore, the magnets 101a, 101e, and 101f apply a magnetic repulsive force so as to widen the distance between the upper surface 941 of the restricting structure 94 and the upper surface 261 of the protruding portion 26C in the direction of the rotation axis a1 (vertical direction). Thereby, the movement of the upper surface 941 and the upper surface 261 approaching each other is restricted, and the mutual contact is also suppressed, so that the generation of dust due to the contact between the restriction structure 94 and the protruding portion 26C can be further suppressed.

  The magnets 101a to 101c, 101e, and 101f, the restricting structure 94, and the projecting portion 26C are relative to the spin base 21C relative to the spin base 21C in both the circumferential direction around the rotation axis a1 and the vertical direction. It is the regulation part 201E which regulates a gentle movement (position).

  In addition, even if the substrate processing apparatus 1 does not include the shielding plates 90 and 90A to 90E, the usefulness of the present invention is not impaired. In this case, the processing positions of the inner member 312 and the outer member 313 are set to an upper position, for example, a position higher than the upper surface of the substrate 9 as compared with the case where the blocking plate 90 or the like is provided. Further, in the case where the blocking plates 90 and 90A to 90E are provided, the present invention even if the restricting portions 201 and 201C to 201E are provided at the same height as the upper surface of the spin base 21 or above the upper surface. It does not impair the usefulness.

  In any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above, the upper position can receive the processing liquid discharged from the substrate 9. In a state where the inner member 312 is disposed, the processing liquid discharge unit 83 </ b> A discharges the processing liquid toward the processing surface of the substrate 9. After that, the rinse base 85A is rotated while holding the substrate while the inner member 312 is disposed at a lower position where the upper end of the inner member 312 is located on the side of the flange portion 29 of the spin base 21. The rinse liquid is discharged toward the flange portion 29 of 21. The discharged rinse liquid is discharged from the lower surface of the flange portion 29 toward the radially outer side of the spin base 21. Since the upper end of the inner member 312 disposed at the lower position is located on the side of the flange portion 29, the discharged processing liquid hits the inner peripheral surface of the upper end portion of the inner member 312. Accordingly, both the inner member 312 and the spin base 21 to which the processing liquid is attached can be cleaned by the common rinse liquid discharger 85A while the substrate 9 is held on the spin base 21.

  Further, according to any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above, the draining portion 27 is located above the flange portion 29, and It protrudes radially outward of the spin base 21 from the flange portion 29. The rinse liquid discharged from below to the flange portion 29 moves along the lower surface of the flange portion 29 to the tip of the flange portion 29 and is discharged from the tip toward the radially outer side of the spin base 21. The processing liquid discharged to the processing surface of the substrate 9 and discharged from the substrate 9 is discharged from the outer side in the radial direction than the rinsing liquid and from the upper side to the outer side in the radial direction of the spin base 21 through the upper surface of the draining portion 27. . Accordingly, since the processing liquid and the rinsing liquid are discharged from the spin base 21 in a state of being separated from each other, mixing of the discharged processing liquid and the rinsing liquid can be suppressed.

  Also, the rinse liquid discharge portion 85A is directed toward the curved surface 211 of the flange portion 29 by any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above. Then, rinse out from below. The curved surface 211 is gently connected to each of the outer peripheral surface of the base portion 28 of the spin base 21 and the lower surface of the flange portion 29. Accordingly, the rinse liquid that is sprinkled downward after being discharged onto the curved surface 211 can be reduced, and more rinse liquid can be discharged along the lower surface of the flange portion 29. Thereby, the inner peripheral surface of the inner member 312 can be more efficiently cleaned.

  Further, both of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above, the inner member 312 is disposed at the lower position and the processing liquid is discharged. The outer member 313 is disposed at a position where it can receive the processing liquid discharged from the substrate 9 after being supplied to the substrate 9 from the portion 83A. In this state, the processing liquid is discharged toward the processing surface of the substrate 9 and the rinsing liquid is discharged toward the lower surface of the flange portion 29. Therefore, the processing of the substrate 9 and the cleaning processing of the spin base 21 and the inner member 312 can be performed in parallel.

  Further, in any of the substrate processing method according to the present embodiment as described above and the substrate processing apparatus according to the present embodiment configured as described above, in a state where the sealing performance of the substrate 9 is enhanced by the blocking plate 90, Since the spin base 21 and the inner member 312 can be cleaned, the upper surface of the substrate 9 can be further protected.

  Although the invention has been shown and described in detail, the above description is illustrative in all aspects and not restrictive. Therefore, embodiments of the present invention can be modified or omitted as appropriate within the scope of the invention.

1 Substrate processing equipment 21 Spin base (holding member)
DESCRIPTION OF SYMBOLS 23 Rotation drive part 231 Rotation mechanism 26 Protrusion part 44 Drive part 50 Nozzle 83 Treatment liquid supply part 83A Treatment liquid discharge part 85 Rinse liquid supply part 85A Rinse liquid discharge part 86, 87 Rinse liquid discharge port 90 Blocking plate (opposing member)
91 Body portion 92 Extension portion 94 Restriction structure 312 Inner member (guard)
313 External material (outer guard)

Claims (2)

A disk-shaped base portion that holds a substrate substantially horizontally from below and has an upper surface that faces the lower surface of the substrate with a gap therebetween and is rotatable about a predetermined rotation axis, with the rotation axis as a central axis And a holding member comprising a flange portion protruding radially outward from the peripheral wall portion of the base portion,
A rotation drive unit that rotates the holding member around the rotation axis;
A guard having a cylindrical shape with an upper end side portion extending obliquely upward toward the rotation axis, surrounding the holding member, and being provided so as to be movable up and down;
A processing liquid discharger capable of discharging a processing liquid onto the processing surface of the substrate;
A cleaning liquid discharger capable of discharging a cleaning liquid from below the flange part of the holding member;
An upper position where the processing liquid discharged from the substrate after being supplied to the substrate from the processing liquid discharge portion can be received, and a lower position where the upper end of the guard is located on the side of the flange portion An elevating drive unit capable of elevating the guard between,
A control unit that controls the elevating drive unit, the processing liquid discharge unit, and the cleaning liquid discharge unit;
With
The controller is
A substrate processing apparatus that causes the cleaning liquid to be discharged toward the flange portion of the holding member that rotates while holding the substrate in the cleaning liquid discharge section in a state where the guard is disposed at the lower position in the elevating drive unit. A holding step of holding the substrate by a holding member having a flange portion;
A rotating step of rotating the substrate;
Supplying a treatment liquid to the substrate;
A treatment step for receiving the treatment liquid by a guard;
A cleaning step of cleaning the treatment liquid adhering to the guard by supplying a cleaning liquid from under the flange to the flange;
Equipped with a,
The guard includes a cylindrical inner member that can be raised and lowered to surround the holding member, and a cylindrical outer member that is provided outside the inner member and can be raised and lowered.
Simultaneously executing the processing step in which the outer member receives the processing liquid while the outer member is raised, and the cleaning step of washing the inner member in a state where the inner member is lowered ; Substrate processing method.

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