JP6572996B1 - Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ - Google Patents
Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ Download PDFInfo
- Publication number
- JP6572996B1 JP6572996B1 JP2018111876A JP2018111876A JP6572996B1 JP 6572996 B1 JP6572996 B1 JP 6572996B1 JP 2018111876 A JP2018111876 A JP 2018111876A JP 2018111876 A JP2018111876 A JP 2018111876A JP 6572996 B1 JP6572996 B1 JP 6572996B1
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- ball
- mass
- solder
- layer
- core
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 274
- 239000006260 foam Substances 0.000 title claims description 8
- 239000002184 metal Substances 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 62
- 239000000956 alloy Substances 0.000 claims abstract description 62
- 229910052742 iron Inorganic materials 0.000 claims abstract description 42
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 38
- 239000012535 impurity Substances 0.000 claims abstract description 37
- 229910052709 silver Inorganic materials 0.000 claims abstract description 36
- 229910052718 tin Inorganic materials 0.000 claims abstract description 18
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 17
- 229910020935 Sn-Sb Inorganic materials 0.000 claims abstract 3
- 229910008757 Sn—Sb Inorganic materials 0.000 claims abstract 3
- 238000002845 discoloration Methods 0.000 abstract description 32
- 239000010410 layer Substances 0.000 description 293
- 239000011162 core material Substances 0.000 description 186
- 238000007747 plating Methods 0.000 description 62
- 230000000052 comparative effect Effects 0.000 description 47
- 239000000203 mixture Substances 0.000 description 43
- 238000000034 method Methods 0.000 description 42
- 238000011156 evaluation Methods 0.000 description 35
- 230000002093 peripheral effect Effects 0.000 description 29
- 239000004065 semiconductor Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 22
- 238000009713 electroplating Methods 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 17
- 238000009826 distribution Methods 0.000 description 16
- 238000005259 measurement Methods 0.000 description 16
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 14
- 239000013078 crystal Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 230000006866 deterioration Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- 229910052797 bismuth Inorganic materials 0.000 description 8
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 7
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 150000004763 sulfides Chemical class 0.000 description 7
- 229910052815 sulfur oxide Inorganic materials 0.000 description 7
- 229910052776 Thorium Inorganic materials 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 229910052745 lead Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910052770 Uranium Inorganic materials 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 230000006355 external stress Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000005260 alpha ray Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000001036 glow-discharge mass spectrometry Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000010718 Oxidation Activity Effects 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011824 nuclear material Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Powder Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018111876A JP6572996B1 (ja) | 2018-06-12 | 2018-06-12 | Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ |
| TW108117472A TWI783150B (zh) | 2018-06-12 | 2019-05-21 | Cu核球、焊接頭、焊膏及泡沫焊料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018111876A JP6572996B1 (ja) | 2018-06-12 | 2018-06-12 | Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6572996B1 true JP6572996B1 (ja) | 2019-09-11 |
| JP2019214759A JP2019214759A (ja) | 2019-12-19 |
Family
ID=67909499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018111876A Active JP6572996B1 (ja) | 2018-06-12 | 2018-06-12 | Ｃｕ核ボール、はんだ継手、はんだペースト及びフォームはんだ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6572996B1 (zh) |
| TW (1) | TWI783150B (zh) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5590259B1 (ja) * | 2014-01-28 | 2014-09-17 | 千住金属工業株式会社 | Ｃｕ核ボール、はんだペーストおよびはんだ継手 |
-
2018
- 2018-06-12 JP JP2018111876A patent/JP6572996B1/ja active Active
-
2019
- 2019-05-21 TW TW108117472A patent/TWI783150B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202006147A (zh) | 2020-02-01 |
| TWI783150B (zh) | 2022-11-11 |
| JP2019214759A (ja) | 2019-12-19 |
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