JP6562567B2 - アルミニウムパターン及びその製造方法 - Google Patents
アルミニウムパターン及びその製造方法 Download PDFInfo
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- JP6562567B2 JP6562567B2 JP2017504137A JP2017504137A JP6562567B2 JP 6562567 B2 JP6562567 B2 JP 6562567B2 JP 2017504137 A JP2017504137 A JP 2017504137A JP 2017504137 A JP2017504137 A JP 2017504137A JP 6562567 B2 JP6562567 B2 JP 6562567B2
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- aluminum
- aluminum pattern
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- 229910052782 aluminium Inorganic materials 0.000 title claims description 125
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims description 125
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 29
- 239000010408 film Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 18
- 238000002834 transmittance Methods 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 3
- 239000012789 electroconductive film Substances 0.000 claims description 3
- 230000035699 permeability Effects 0.000 claims 2
- 239000000463 material Substances 0.000 description 5
- 229910001111 Fine metal Inorganic materials 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000003666 anti-fingerprint Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- -1 Al (OH) 3 Inorganic materials 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- General Engineering & Computer Science (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Human Computer Interaction (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electric Cables (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
102・・・アルミニウムパターン
103・・・レジスト層
104・・・酸化アルミニウム
a・・・アルミニウムパターンの線幅
b・・・パターンの厚さ
リバースオフセット(Reverse offset)印刷によってパターンを形成し、エッチング(etching)する過程を通じて、線幅3.2μm、ピッチ300μmのアルミニウムパターンを形成した。前記形成されたアルミニウムパターンを100℃の蒸留水(DI water)に浸漬した。
Claims (9)
- 基板上にアルミニウムパターンを形成するステップ、
前記アルミニウムパターンの全面上にレジスト層を形成するステップ、及び
前記アルミニウムパターンを水に浸漬してアルミニウムパターンの側面のうち少なくとも一部に酸化アルミニウムを形成するステップを含むアルミニウムパターンの製造方法。 - 前記水の温度は40℃〜100℃である、請求項1に記載のアルミニウムパターンの製造方法。
- 前記水に浸漬した後のアルミニウムパターンの透過率は、水に浸漬する前のアルミニウムパターンの透過率に比べて10%〜50%増加する、請求項1又は2に記載のアルミニウムパターンの製造方法。
- 前記水の温度は40℃〜100℃であり、
前記酸化アルミニウムを形成するステップ後、
アルミニウムパターンの線幅が5分以内に10%〜30%減少する、請求項1から3のいずれか1項に記載のアルミニウムパターンの製造方法。 - 前記アルミニウムパターンはメッシュパターンである、請求項1から4のいずれか1項に記載のアルミニウムパターンの製造方法。
- 基板、
前記基板に接するように前記基板上に備えられたアルミニウムパターン、
前記アルミニウムパターンの全面上のレジスト層、及び、
前記アルミニウムパターンの側面のうち少なくとも一部に備えられた酸化アルミニウムを含むものである、請求項1から5のいずれか1項に記載の方法により製造された導電性フィルム。 - 基板、
前記基板に接するように前記基板上に備えられたアルミニウムパターン、
前記アルミニウムパターンの全面上のレジスト層、及び、
前記アルミニウムパターンの側面のうち少なくとも一部に備えられた酸化アルミニウムを含む導電性フィルム。 - 前記酸化アルミニウムが備えられたアルミニウムパターンの透過率は80%〜100%である、請求項7に記載の導電性フィルム。
- 請求項6から8のいずれか1項に記載の導電性フィルムを含むディスプレイ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140103910A KR101828646B1 (ko) | 2014-08-11 | 2014-08-11 | 알루미늄 패턴 및 이의 제조 방법 |
KR10-2014-0103910 | 2014-08-11 | ||
PCT/KR2015/008390 WO2016024787A1 (ko) | 2014-08-11 | 2015-08-11 | 알루미늄 패턴 및 이의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017527959A JP2017527959A (ja) | 2017-09-21 |
JP6562567B2 true JP6562567B2 (ja) | 2019-08-21 |
Family
ID=55304356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017504137A Active JP6562567B2 (ja) | 2014-08-11 | 2015-08-11 | アルミニウムパターン及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10796817B2 (ja) |
JP (1) | JP6562567B2 (ja) |
KR (1) | KR101828646B1 (ja) |
CN (1) | CN106575546B (ja) |
WO (1) | WO2016024787A1 (ja) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3846540A (en) * | 1972-06-15 | 1974-11-05 | Continental Oil Co | Method for converting high-density low-porosity alumina into low-density high porosity alumina |
JPH04103132A (ja) * | 1990-08-22 | 1992-04-06 | Ricoh Co Ltd | 半導体集積回路装置の製造方法 |
JPH05152444A (ja) * | 1991-11-28 | 1993-06-18 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
JPH05232734A (ja) * | 1992-02-21 | 1993-09-10 | Fuji Electric Co Ltd | 電子写真感光体およびその製造方法 |
JPH065859A (ja) * | 1992-06-22 | 1994-01-14 | Fujitsu Ltd | アルミニウムゲートtftの製造方法 |
JPH07201821A (ja) | 1993-12-28 | 1995-08-04 | Matsushita Electric Ind Co Ltd | アルミ合金配線の形成方法 |
JPH07295241A (ja) * | 1994-04-22 | 1995-11-10 | Fuji Electric Co Ltd | 電子写真用有機感光体の製造方法 |
JP2000314897A (ja) | 1999-05-06 | 2000-11-14 | Hitachi Ltd | 液晶表示装置 |
TW200628939A (en) * | 2004-12-27 | 2006-08-16 | Sekisui Chemical Co Ltd | Process for producing liquid crystal display device, spacer particle dispersion liquid, and liquid crystal display device |
JP5046495B2 (ja) * | 2005-04-18 | 2012-10-10 | セーレン株式会社 | 透明導電性フィルムとその製造方法 |
JP2006310482A (ja) * | 2005-04-27 | 2006-11-09 | Aqua Science Kk | アルミニウム表面腐食防止方法 |
KR100829746B1 (ko) * | 2006-11-01 | 2008-05-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 및 그 제조방법 |
JP2009118369A (ja) | 2007-11-09 | 2009-05-28 | Epson Toyocom Corp | 弾性表面波デバイス、弾性表面波デバイスの製造方法 |
KR100998010B1 (ko) * | 2008-04-28 | 2010-12-03 | 삼성엘이디 주식회사 | 발광소자 패키지 및 그 제조방법 |
JP5365903B2 (ja) | 2008-10-07 | 2013-12-11 | 富士電機株式会社 | アルミニウム合金形成基板及びその製造方法 |
KR101156275B1 (ko) * | 2009-02-06 | 2012-06-13 | 주식회사 엘지화학 | 터치스크린 및 이의 제조방법 |
JP5865996B2 (ja) * | 2012-03-30 | 2016-02-17 | アルプス電気株式会社 | 導電パターン形成基板の製造方法 |
CN103309510B (zh) * | 2013-06-08 | 2016-06-08 | 南昌欧菲光科技有限公司 | 触摸屏电极制造方法 |
-
2014
- 2014-08-11 KR KR1020140103910A patent/KR101828646B1/ko active IP Right Grant
-
2015
- 2015-08-11 WO PCT/KR2015/008390 patent/WO2016024787A1/ko active Application Filing
- 2015-08-11 CN CN201580042921.7A patent/CN106575546B/zh active Active
- 2015-08-11 JP JP2017504137A patent/JP6562567B2/ja active Active
- 2015-08-11 US US15/502,326 patent/US10796817B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10796817B2 (en) | 2020-10-06 |
KR20160019303A (ko) | 2016-02-19 |
WO2016024787A1 (ko) | 2016-02-18 |
JP2017527959A (ja) | 2017-09-21 |
US20170229209A1 (en) | 2017-08-10 |
KR101828646B1 (ko) | 2018-02-13 |
CN106575546B (zh) | 2018-09-14 |
CN106575546A (zh) | 2017-04-19 |
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