JP6552523B2 - 受光素子 - Google Patents
受光素子 Download PDFInfo
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- JP6552523B2 JP6552523B2 JP2016564876A JP2016564876A JP6552523B2 JP 6552523 B2 JP6552523 B2 JP 6552523B2 JP 2016564876 A JP2016564876 A JP 2016564876A JP 2016564876 A JP2016564876 A JP 2016564876A JP 6552523 B2 JP6552523 B2 JP 6552523B2
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- 230000031700 light absorption Effects 0.000 claims description 105
- 230000010287 polarization Effects 0.000 claims description 73
- 239000013598 vector Substances 0.000 claims description 32
- 230000003287 optical effect Effects 0.000 claims description 29
- 230000001902 propagating effect Effects 0.000 claims description 12
- NCGICGYLBXGBGN-UHFFFAOYSA-N 3-morpholin-4-yl-1-oxa-3-azonia-2-azanidacyclopent-3-en-5-imine;hydrochloride Chemical compound Cl.[N-]1OC(=N)C=[N+]1N1CCOCC1 NCGICGYLBXGBGN-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000969 carrier Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000000644 propagated effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 222
- 239000004065 semiconductor Substances 0.000 description 48
- 229910004298 SiO 2 Inorganic materials 0.000 description 47
- 239000000758 substrate Substances 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 230000035945 sensitivity Effects 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- 239000012792 core layer Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 229910052681 coesite Inorganic materials 0.000 description 4
- 229910052906 cristobalite Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052682 stishovite Inorganic materials 0.000 description 4
- 229910052905 tridymite Inorganic materials 0.000 description 4
- 230000003993 interaction Effects 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
- H01L31/1075—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes in which the active layers, e.g. absorption or multiplication layers, form an heterostructure, e.g. SAM structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12126—Light absorber
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/124—Geodesic lenses or integrated gratings
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
Description
<第1実施形態>
図1は、本発明の第1実施形態に係る受光素子100の構成を示す断面図である。受光素子100は、基板101と、下部SiO2層102と、P型半導体層103と、光吸収層104と、N型半導体層105と、上部SiO2層106とを備える。各層は、基板101側から、下部SiO2層102、P型半導体層103、光吸収層104、N型半導体層105、上部SiO2層106の順に積層されている。図1において、基板101の表面に垂直な方向にX軸、基板101の表面に平行な方向(図の横方向)にZ軸をとる。
但し、kZは入射光の波数ベクトルのZ成分、βはグレーティングによる回折光の伝搬定数、Kはグレーティングの逆格子ベクトルの大きさ、Nは正の整数である。図2はグレーティング108による1次回折(即ちN=1)を示しているが、この場合は、式(1)から、TE偏波とTM偏波についてそれぞれ次式(2a)及び(2b)が満たされることが、1次回折が生じる条件となる。
kTM,Z=−K+βTM (<0) ………(2b)
但し、上式においてβTE及びβTMは、それぞれ光吸収層104におけるTE偏波伝搬モード光及びTM偏波伝搬モード光の伝搬定数を表す。
また、このとき入射光ILの入射角θ1 TE(=θ1 TM)は、
θ1 TE=sin−1(kTE,Z/k)
=sin−1[(βTM−βTE)/(2・k)]
=sin−1[(neff TM−neff TE)/(2・nSiO2)] …(3)’
となる。
kTE,Z=−βTE+m・K (<0) ………(4a)
kTM,Z=−n・K+βTM (<0) ………(4b)
である。よって、同一方向からのTE偏波及びTM偏波の入射光が、それぞれm次回折、n次回折を受けて−Z方向と+Z方向に回折される条件は、kTE,Z=kTM,Zとして、
K=(βTE+βTM)/(m+n) ………(5)
となる。このとき入射光ILの入射角θ1 TE(=θ1 TM)は次式で与えられる。
また、式(5)は、等価屈折率を用いて次のように表すこともできる。
このように、受光素子100は、回折条件の式(5)、(6)を満足するような構造に形成されてもよい。なお、回折次数が小さいほど回折効率は高いので、m=n=1の場合、即ち上記の式(3)が成り立つ場合に、受光素子100の受光感度を最大にすることができる。
<第2実施形態>
図6は、本発明の第2実施形態に係る受光素子200の構成を示す断面図である。受光素子200は、基板201と、下部SiO2層202と、P型半導体層203と、光吸収層204と、N型半導体層205と、上部SiO2層206とを備える。各層は、基板201側から、下部SiO2層202、P型半導体層203、光吸収層204、N型半導体層205、上部SiO2層206の順に積層されている。基板201、下部SiO2層202、及び上部SiO2層206は、それぞれ、第1実施形態の受光素子100の対応する構成要素と同じものである。図6において、図1と同様に、基板201の表面に垂直な方向にX軸、基板201の表面に平行な方向(図の横方向)にZ軸をとる。
<第3実施形態>
図9は、本発明の第3実施形態に係る受光素子300の構成を示す断面図である。受光素子300は、第1実施形態に係る受光素子100の各構成要素に加えて、更に光導波路112を備える。光導波路112は、上部SiO2層106の上に、その光軸が光吸収層104の成す面に対して傾いた状態に形成される。例えば、光導波路112は、高屈折率の樹脂からなるコア(112)と、その周囲に充填された低屈折率の樹脂113からなるクラッドとを含む導波路構造とすることができる。グレーティング108への入射角θ1 TE(=θ1 TM)が前述の式(3)’又は(5)’で与えられる角度であるとき、光導波路112の等価屈折率をnwとすると、光導波路112の傾き角θwは、スネルの法則nw・sin(θw)=nSiO2・sin(θ1 TE)を満足する角度に設定される。このような構成によれば、入射光ILの入射角を、グレーティング108の回折条件を満たす角度に固定することができる。
nw=Σ(Pi・nwi)/ΣPi
と定義してもよい。但し、Σは全てのモードiに関する和を表す。光導波路112がマルチモード導波路である場合の等価屈折率nwの定義は、上記式に限定されない。例えば、光強度Piが最大となるnwiを光導波路112の等価屈折率nwとしてもよい。
101 基板
102 下部SiO2層
103 P型半導体層
104 光吸収層
105 N型半導体層
106 上部SiO2層
107 PIN構造
108 グレーティング
109 空気層
110 P電極
111 N電極
112 光導波路
Claims (7)
- 光を吸収してキャリアを発生させる光吸収層と、
前記光吸収層へ前記光を導入するための光導入層と、
前記光導入層から前記光吸収層が成す面に対して入射角θで斜めに入射した第1偏波の光を前記光吸収層に沿って第1方向に伝搬するように光路変換し、前記光導入層から前記入射角θで入射した前記第1偏波と直交する第2偏波の光を前記光吸収層に沿って前記第1方向と反対の第2方向に伝搬するように光路変換する回折素子と、
を備え、前記入射角θは、次式
θ=sin −1 [(m・n eff2 −n・n eff1 )/((m+n)・n A )]
但し、n eff1 は前記第1偏波に対する前記光吸収層の等価屈折率、n eff2 は前記第2偏波に対する前記光吸収層の等価屈折率、n A は前記光導入層の等価屈折率、mは前記回折素子による前記第1偏波の回折次数(正の整数)、nは前記回折素子による前記第2偏波の回折次数(正の整数)、
を満たす角度である、受光素子。 - 前記回折素子の逆格子ベクトルの大きさをK、前記光吸収層における前記第1偏波の伝搬定数をβ1、前記光吸収層における前記第2偏波の伝搬定数をβ 2 としたとき、次式
K=(β1+β2)/(m+n)
を満足する、請求項1に記載の受光素子。 - 前記回折素子の逆格子ベクトルの大きさが、前記光吸収層における前記第1偏波の伝搬定数と前記光吸収層における前記第2偏波の伝搬定数との平均値に等しい、請求項1に記載の受光素子。
- 前記回折素子は前記光吸収層に形成されている、請求項1から3のいずれか1項に記載の受光素子。
- 前記回折素子は前記光吸収層と同一面上であって前記光吸収層と異なる領域に形成されている、請求項1から3のいずれか1項に記載の受光素子。
- 前記光吸収層は、前記第1方向に伝搬した前記第1偏波の光を吸収する第1光吸収層と、前記第2方向に伝搬した前記第2偏波の光を吸収する第2光吸収層とを備える、請求項5に記載の受光素子。
- 前記第1偏波の光と前記第2偏波の光を前記回折素子に導入するための、前記光吸収層が成す面に対して斜めに立設した光導波路を更に備える、請求項1から6のいずれか1項に記載の受光素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014253810 | 2014-12-16 | ||
JP2014253810 | 2014-12-16 | ||
PCT/JP2015/085186 WO2016098803A1 (ja) | 2014-12-16 | 2015-12-16 | 受光素子 |
Publications (2)
Publication Number | Publication Date |
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JPWO2016098803A1 JPWO2016098803A1 (ja) | 2017-09-21 |
JP6552523B2 true JP6552523B2 (ja) | 2019-07-31 |
Family
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JP2016564876A Expired - Fee Related JP6552523B2 (ja) | 2014-12-16 | 2015-12-16 | 受光素子 |
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US (1) | US10535786B2 (ja) |
JP (1) | JP6552523B2 (ja) |
WO (1) | WO2016098803A1 (ja) |
Families Citing this family (4)
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JP7061572B2 (ja) * | 2016-12-02 | 2022-04-28 | 日本碍子株式会社 | 光学素子及びその製造方法 |
CN109683230B (zh) * | 2019-02-18 | 2020-06-26 | 京东方科技集团股份有限公司 | 导光结构、透明显示装置、导光结构的制造方法 |
US11340403B2 (en) * | 2020-03-03 | 2022-05-24 | Globalfoundries U.S. Inc. | Photonic component with distributed Bragg reflectors |
US20220344523A1 (en) * | 2021-04-27 | 2022-10-27 | Globalfoundries U.S. Inc. | Photodetectors and absorbers with slanted light incidence |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01136380A (ja) | 1987-11-24 | 1989-05-29 | Oki Electric Ind Co Ltd | 半導体受光素子 |
SE468188B (sv) | 1991-04-08 | 1992-11-16 | Stiftelsen Inst Foer Mikroelek | Metod foer inkoppling av straalning i en infraroeddetektor, jaemte anordning |
JPH06237006A (ja) * | 1993-02-12 | 1994-08-23 | Olympus Optical Co Ltd | 半導体光集積素子 |
US6858462B2 (en) * | 2000-04-11 | 2005-02-22 | Gratings, Inc. | Enhanced light absorption of solar cells and photodetectors by diffraction |
JP4835837B2 (ja) * | 2006-03-31 | 2011-12-14 | 日本電気株式会社 | フォトダイオードとその製造方法 |
US20100322555A1 (en) * | 2009-06-22 | 2010-12-23 | Imec | Grating Structures for Simultaneous Coupling to TE and TM Waveguide Modes |
ITTO20120657A1 (it) * | 2011-07-27 | 2013-01-28 | Selex Sistemi Integrati Spa | Piastra plasmonica per la generazione di vortici ottici |
US9244227B2 (en) * | 2013-11-11 | 2016-01-26 | Futurewei Technologies, Inc. | Polarization splitter/combiner based on a one-dimensional grating coupler |
TWI518925B (zh) * | 2013-11-11 | 2016-01-21 | Kingwave Corp | A photovoltaic element device having a surface periodic grating structure and a method of manufacturing the same |
-
2015
- 2015-12-16 WO PCT/JP2015/085186 patent/WO2016098803A1/ja active Application Filing
- 2015-12-16 JP JP2016564876A patent/JP6552523B2/ja not_active Expired - Fee Related
- 2015-12-16 US US15/536,533 patent/US10535786B2/en not_active Expired - Fee Related
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Publication number | Publication date |
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US10535786B2 (en) | 2020-01-14 |
JPWO2016098803A1 (ja) | 2017-09-21 |
US20170345952A1 (en) | 2017-11-30 |
WO2016098803A1 (ja) | 2016-06-23 |
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