JP6551622B1 - Jig for resin molded body plating and plating method for resin molded body using the same - Google Patents
Jig for resin molded body plating and plating method for resin molded body using the same Download PDFInfo
- Publication number
- JP6551622B1 JP6551622B1 JP2019017662A JP2019017662A JP6551622B1 JP 6551622 B1 JP6551622 B1 JP 6551622B1 JP 2019017662 A JP2019017662 A JP 2019017662A JP 2019017662 A JP2019017662 A JP 2019017662A JP 6551622 B1 JP6551622 B1 JP 6551622B1
- Authority
- JP
- Japan
- Prior art keywords
- plating
- jig
- resin molded
- molded body
- plasticizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007747 plating Methods 0.000 title claims abstract description 95
- 229920005989 resin Polymers 0.000 title claims abstract description 44
- 239000011347 resin Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000004014 plasticizer Substances 0.000 claims abstract description 38
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 claims description 9
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 150000001278 adipic acid derivatives Chemical class 0.000 claims description 2
- 150000001535 azelaic acid derivatives Chemical class 0.000 claims description 2
- 150000001558 benzoic acid derivatives Chemical class 0.000 claims description 2
- 150000002688 maleic acid derivatives Chemical class 0.000 claims description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 2
- 150000003021 phthalic acid derivatives Chemical class 0.000 claims description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical class OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 1
- 150000003329 sebacic acid derivatives Chemical class 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 15
- 238000000151 deposition Methods 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000005530 etching Methods 0.000 description 12
- 229910000365 copper sulfate Inorganic materials 0.000 description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 8
- 238000007772 electroless plating Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 5
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 4
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- -1 ester compound Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1621—Protection of inner surfaces of the apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
【課題】樹脂成形体のめっきにおいて、治具自体へのめっき析出がなく、めっき治具の交換も必要のない、めっき治具を提供する。【解決手段】絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したことを特徴とする樹脂成形体めっき用治具およびこれを用いた樹脂成形体のめっき方法。【選択図】なしThere is provided a plating jig in which plating of a resin molded body does not cause plating deposition on the jig itself and does not require replacement of the plating jig. A resin molded body plating jig characterized in that a surface of a plating jig having an insulating coating portion is coated with a plasticizer, and a method of plating a resin molded body using the same. [Selection figure] None
Description
本発明は、樹脂成形体のめっき作業中に、樹脂成形体を保持するための樹脂成形体めっき用治具およびこれを用いた樹脂成形体のめっき方法に関する。 The present invention relates to a resin molded product plating jig for holding a resin molded product during a resin molded product plating operation and a method of plating a resin molded product using the same.
従来、アクリロニトリル・ブタジエン・スチレン（ＡＢＳ）樹脂、ポリカーボネート／アクリロニトリル・ブタジエン・スチレン（ＰＣ／ＡＢＳ）等の樹脂成形体表面にめっきを施す場合は、樹脂成形体とめっき皮膜との密着性を高めるために、めっき処理前に樹脂成形体表面をクロム酸と硫酸の混合液により粗化するエッチング処理を行うことが知られている。 Conventionally, when plating on the surface of a resin molding such as acrylonitrile butadiene styrene (ABS) resin or polycarbonate / acrylonitrile butadiene styrene (PC / ABS), the adhesion between the resin molding and the plating film is enhanced. In addition, it is known that an etching process is performed to roughen the surface of the resin molded body with a mixed solution of chromic acid and sulfuric acid before the plating process.
しかしながら、上記エッチング液には有害な６価クロムが多量に含まれており、作業環境に悪影響を及ぼす。また、その廃水を安全に処理するためには、有害な６価クロムを３価クロムに還元した後、中和沈降させるなど煩雑な処理が必要とされる。この処理では、有害な６価クロムを用いて６０℃以上の高温で作業するために、作業環境が悪くなり、またその廃水処理にも注意が必要であるという問題があった。 However, the etching solution contains a large amount of harmful hexavalent chromium, which adversely affects the working environment. Further, in order to safely treat the wastewater, complicated treatment such as reduction of harmful hexavalent chromium to trivalent chromium and neutralization and precipitation is required. In this treatment, since harmful hexavalent chromium is used for working at a high temperature of 60 ° C. or higher, the working environment is deteriorated, and there is a problem that attention must be paid to the wastewater treatment.
これらの問題から、クロム酸と硫酸の混合液に代わるエッチング剤の提供が望まれており、例えば、これらエッチング剤に代えて過マンガン酸塩を用いたエッチング液で処理し、めっきを施すクロム酸エッチングフリーのめっきプロセスが報告されている（特許文献１、２参照）。 From these problems, it is desirable to provide an etchant that replaces the mixed solution of chromic acid and sulfuric acid. For example, chromic acid which is treated with an etchant using permanganate instead of these etchants and then plated An etching free plating process has been reported (see Patent Documents 1 and 2).
しかし、上記プロセスにおいてはプラスチック表面へめっきは可能なものの、治具のコーティング表面にも触媒金属が吸着してしまうため、その後のめっき工程によりプラスチック表面と共に治具の表面にもめっきが析出しやすいという問題点がある。 However, although it is possible to plate on the plastic surface in the above process, the catalyst metal is adsorbed on the coating surface of the jig, so plating tends to deposit on the surface of the jig as well as the plastic surface in the subsequent plating process There is a problem.
従来用いられるクロム酸と硫酸の混合液によるエッチングでは、エッチング処理工程においてめっき用治具の絶縁コーティング部分に６価クロムが少量残存し、これが触媒毒となって無電解めっき用触媒が治具の絶縁コーティング部分に残存した場合でも、治具の表面に無電解めっきが析出するのを防止する。このため、引き続いて電気めっきを行った場合にも、めっき用治具に対して電気めっきが析出することがなく、無電解めっきと電気めっきを連続して行うことが可能である。 In etching using a mixed solution of chromic acid and sulfuric acid which are conventionally used, a small amount of hexavalent chromium remains in the insulating coating portion of the plating jig in the etching process, which becomes catalyst poison and the electroless plating catalyst becomes the jig. Even when it remains on the insulating coating, it prevents the electroless plating from depositing on the surface of the jig. For this reason, even when electroplating is subsequently performed, it is possible to perform electroless plating and electroplating continuously without electroplating being deposited on the plating jig.
一方、過マンガン酸塩を主成分とするエッチング処理液を用いる場合には、エッチング処理液中に触媒毒となる成分が含まれていないために、めっき用治具の絶縁コーティング部に無電解めっき用触媒が付着すると、この部分に無電解めっきが析出する。そのため、無電解めっきから電気めっきへ移る際に治具を交換することが必要となり、作業性が非常に悪いという問題があった。 On the other hand, when using an etching solution containing a permanganate as the main component, the etching solution does not contain a component that becomes a catalyst poison, so electroless plating is performed on the insulating coating of the plating jig. When the catalyst for deposition adheres, electroless plating is deposited on this portion. Therefore, it is necessary to replace the jig when moving from electroless plating to electroplating, and there is a problem that the workability is very bad.
このため、治具へのめっき析出抑制方法がいくつか報告されているが（特許文献３）、いずれも治具コーティング部にフッ素樹脂等を使用するなど高価で特殊な材質が必要となりコストが高いため実用的ではない。 For this reason, several methods for suppressing plating deposition on jigs have been reported (Patent Document 3), but all require expensive and special materials such as using a fluorocarbon resin in the jig coating portion, resulting in high cost. Therefore it is not practical.
従って、本発明の課題は、樹脂成形体のめっきにおいて、これまで使用されてきた汎用治具を使用しつつ治具自体へのめっき析出がなく、めっき治具の交換も必要のない、めっき治具を提供することである。 Therefore, it is an object of the present invention to use a general-purpose jig that has been used so far without plating deposition on the jig itself and not requiring replacement of the plating jig. Is to provide the ingredients.
本発明者らは、上記課題を解決するために鋭意研究した結果、樹脂成形体のめっきに通常用いられる絶縁被覆部を有するめっき用治具の表面に、可塑剤を被覆することにより、上記課題を解決できることを見出し、本発明を完成させた。 As a result of intensive studies to solve the above problems, the present inventors have covered the above-mentioned problems by coating a plasticizer on the surface of a plating jig having an insulating coating portion that is usually used for plating of resin molded articles. The present invention has been completed.
すなわち、本発明は、絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したことを特徴とする樹脂成形体めっき用治具である。 That is, the present invention is a jig for resin molded product, characterized in that a plasticizer is coated on the surface of a plating jig having an insulating covering portion.
また、本発明は、絶縁被覆部を有するめっき用治具の表面を、可塑剤で処理し、絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆することを特徴とする樹脂成形体めっき用治具の製造方法である。 Further, the present invention is a resin molded product characterized in that the surface of a plating jig having an insulating coating portion is treated with a plasticizer, and the surface of the plating jig having an insulating coating portion is coated with the plasticizer. It is a manufacturing method of the jig for plating.
更に、本発明は樹脂成形体のめっきにおいて、上記樹脂成形体めっき用治具を用いることを特徴とする樹脂成形体のめっき方法である。 Further, the present invention is a plating method of a resin molded body characterized by using the above-mentioned jig for resin molded body plating in plating of a resin molded body.
本発明の樹脂成形体めっき用治具は、樹脂成形体のめっきにおいて、治具自体へのめっき析出がなく、めっき治具の交換も必要ない。 The resin molded body plating jig of the present invention does not have plating deposition on the jig itself in plating of a resin molded body, and replacement of the plating jig is not necessary.
そのため、本発明の樹脂成形体めっき用治具は、樹脂成形体のめっきに好適に用いることができる。 Therefore, the jig for resin molded body plating of the present invention can be suitably used for plating of a resin molded body.
本発明の樹脂成形体めっき用治具（以下、「本発明治具」という）は、樹脂成形体のめっきに通常用いられる絶縁被覆部を有するめっき用治具の表面に可塑剤を被覆したものである。 The jig for plating a resin molded body of the present invention (hereinafter referred to as “the jig of the present invention”) is obtained by coating a plasticizer on the surface of a plating jig having an insulating coating portion that is usually used for plating of a resin molded body. It is.
樹脂成形体のめっきに通常用いられる絶縁被覆部を有するめっき用治具（以下、これを「通常治具」という）は、樹脂成形体を掛けられ、かつ、樹脂成形体に通電するため通電部と、通電部のうち、めっきを析出させたくない場所を絶縁体で被覆した絶縁被覆部を有するものである。なお、治具の形状は特に限定されない。 A plating jig (hereinafter referred to as a "normal jig") having an insulating covering portion usually used for plating of a resin molded body is a conductive portion for allowing the resin molded body to be hung and energizing the resin molded body. In addition, among the current-carrying portions, the portion having an insulating covering portion in which the place where the plating is not desired to be deposited is covered with an insulator. The shape of the jig is not particularly limited.
通常治具の通電部は、例えば、通電可能な金属、例えば、ＳＵＳ、銅等で形成される。また、絶縁被覆部は絶縁体、例えば、フッ素樹脂、シリコ−ン樹脂、熱可塑性樹脂等で形成される。これらの絶縁体の中でも熱可塑性樹脂が好ましく、これらの中でも塩化ビニルがより好ましい。これら絶縁体による通電部への被覆は常法により行うことができる。また、これら絶縁体には可塑剤が含まれていてもよい。 The conducting part of the normal jig is made of, for example, a metal that can conduct electricity, such as SUS, copper or the like. Further, the insulating covering portion is formed of an insulator, for example, a fluorine resin, a silicone resin, a thermoplastic resin or the like. Among these insulators, thermoplastic resins are preferable, and among these, vinyl chloride is more preferable. Coating of the current-carrying portion with these insulators can be performed by a conventional method. These insulators may contain a plasticizer.
通常治具の表面に可塑剤を被覆するには、通常治具の表面を、可塑剤で処理すればよい。処理の方法は、特に限定されないが、可塑剤を含有する溶液に、通常治具を浸漬する方法、可塑剤を含有する溶液を通常治具に塗布する方法等を行った後、乾燥、焼成等で通常治具の表面に可塑剤を被覆する方法が挙げられる。なお、可塑剤は、通電部には何も影響を与えないが、被覆後に脱脂処理をすれば、通電部の可塑剤は除去できる。 In order to coat the surface of the jig with a plasticizer, the surface of the jig may be treated with a plasticizer. The method of treatment is not particularly limited, but after performing a method of immersing a normal jig in a solution containing a plasticizer, a method of applying a solution containing a plasticizer to a normal jig, drying, firing, etc. And a method of coating the surface of the jig with a plasticizer. The plasticizer has no effect on the conducting part, but if degreasing treatment is performed after coating, the plasticizer in the conducting part can be removed.
ここで用いられる可塑剤は、特に限定されないが、酸とアルコールから合成されたエステル化合物が好ましく、フタル酸エステル類、アジピン酸エステル類、トリメリット酸エステル類、リン酸エステル類、クエン酸エステル類、セバシン酸エステル類、アゼライン酸エステル類、マレイン酸エステル類、安息香酸エステル類がより好ましい。これら可塑剤は少なくとも１つを含めばよい。 The plasticizer used herein is not particularly limited, but is preferably an ester compound synthesized from an acid and an alcohol, and phthalic acid esters, adipic acid esters, trimellitic acid esters, phosphoric acid esters, and citric acid esters Sebacic acid esters, azelaic acid esters, maleic acid esters and benzoic acid esters are more preferable. These plasticizers may contain at least one.
これら可塑剤の濃度は特に限定されず、例えば、市販されている原液のまま使用することができる。また、この可塑剤の温度も特に限定されず、例えば、常温である。 The concentration of these plasticizers is not particularly limited, and, for example, a commercially available stock solution can be used as it is. Further, the temperature of the plasticizer is also not particularly limited, and is, for example, normal temperature.
乾燥、焼成の条件は、可塑剤の種類や濃度によって異なるため特に限定されず、例えば、可塑剤が揮散してしまい、被覆できないような条件でなければよい。このような条件としては、概ね、乾燥であれば常温で、１日程度であり、焼成であれば１６０℃、２０分程度である。また、乾燥、焼成は、風乾の他に、通常の乾燥機、電気炉等を用いて行えばよい。 The conditions for drying and firing are not particularly limited because they differ depending on the type and concentration of the plasticizer, and for example, the conditions may be such that the plasticizer is volatilized and can not be coated. Such conditions are generally about 1 day at ambient temperature if drying, and about 160 ° C. for about 20 minutes if firing. In addition to air drying, drying and baking may be performed using a common drier, an electric furnace or the like.
上記処理後には、通常治具の表面に可塑剤が被覆される。治具の表面に可塑剤が被覆されているかどうかは、目視による外観の比較、種々の測定等で確認することができるが、例えば、後記する実施例２の方法で硫酸銅めっきまで行った後に、析出面積が５％以下、好ましくは０％である時に、被覆されていると判断することが好ましい。もし、治具の表面に可塑剤が被覆されていない場合には硫酸銅めっき後の析出面積は上記範囲にならない。 After the treatment, the surface of the jig is usually coated with a plasticizer. Whether or not the surface of the jig is coated with a plasticizer can be confirmed by visual comparison of appearance, various measurements, etc. For example, after performing copper sulfate plating by the method of Example 2 described later When the deposition area is 5% or less, preferably 0%, it is preferable to judge that the coating is performed. If the surface of the jig is not coated with a plasticizer, the deposition area after copper sulfate plating does not fall in the above range.
本発明治具の好ましい一態様としては、例えば、以下のものが挙げられる。
＜通常治具＞
通電部：ＳＵＳ、銅
絶縁部：軟塩化ビニルゾルコーティング（可塑剤としてフタル酸ジオクチルを含有）
＜本発明治具＞
通常治具を、塩化ビニルに含まれるのと同種の可塑剤であるフタル酸ジオクチル（原液）に１０〜３０秒間浸漬する。次に、１４０〜２００℃で５〜３０分乾燥させ、通常治具の表面に塩化ビニルゾル上に可塑剤の被膜を形成させ、次いで脱脂処理により不要な通電部の可塑剤を除去して本発明治具が得られる。
As a preferable one aspect | mode of this invention jig | tool, the following are mentioned, for example.
<Normal jig>
Current-carrying part: SUS, copper Insulation part: Soft vinyl chloride sol coating (contains dioctyl phthalate as plasticizer)
<Invention jig>
Usually, the jig is immersed in dioctyl phthalate (stock solution), which is a plasticizer of the same kind as that contained in vinyl chloride, for 10 to 30 seconds. Next, it is dried at 140 to 200 ° C. for 5 to 30 minutes, and a plasticizer film is formed on the surface of the normal jig on the vinyl chloride sol. A bright jig is obtained.
斯くして得られる本発明治具は、エッチング、触媒付与、めっき等の処理を行っても、治具自体へのめっき析出がないため、樹脂成形体めっきに用いることができる。樹脂成形体めっきは、電気めっきまたは無電解めっきおよびこれらの組合せの何れでもよい。また、めっき液の種類も特に限定されないが、例えば、無電解めっきであれば、無電解ニッケルめっき、無電解銅めっき等が挙げられ、電気めっきであれば、硫酸銅めっき、電気ニッケルめっき、電気クロムめっき等が挙げられる。また、樹脂成形体としては、特に限定されないが、例えば、ＡＢＳ、ＰＣ／ＡＢＳ等の成型体が挙げられる。更に、樹脂成形体めっきの条件は、治具として本発明治具を用いる以外は、従来のめっき条件を用いることができる。 The jig of the present invention thus obtained can be used for plating a resin molded article because there is no plating deposition on the jig itself even when etching, catalyst application, plating, or the like is performed. Resin molded body plating may be either electroplating or electroless plating and a combination thereof. Further, the kind of the plating solution is not particularly limited, but, for example, in the case of electroless plating, electroless nickel plating, electroless copper plating, etc. may be mentioned, and in the case of electroplating, copper sulfate plating, electric nickel plating, electricity Chrome plating etc. are mentioned. The resin molded product is not particularly limited, and examples thereof include molded products of ABS, PC / ABS, and the like. Furthermore, the conditions for resin molded body plating can be conventional plating conditions except that the jig of the present invention is used as a jig.
特に本発明治具は樹脂成形体のエッチングに、クロム酸を含有するエッチング液を用いる代わりに、過マンガン酸塩を主成分とするエッチング液、あるいは、オゾン等を用いる、いわゆる、クロム酸エッチングフリーのめっきに用いることが好ましい。このようなクロム酸エッチングフリーめっきに用いる治具として通常治具を用いた場合、治具へのめっき析出が多く、治具の架け替えが必要であるが、本発明治具を用いた場合、治具へのめっき析出がない。 In particular, the jig according to the present invention uses so-called chromic acid etching free, using an etching solution containing permanganate as a main component or ozone, etc. instead of using an etching solution containing chromic acid for etching a resin molded product. It is preferable to use for plating. When a normal jig is used as a jig used for such chromic acid etching-free plating, plating deposition on the jig is large and it is necessary to replace the jig, but when using the jig of the present invention, There is no plating deposition on the jig.
以下、本発明を実施例を挙げて詳細に説明するが、本発明はこれら実施例に何ら限定されるものではない。 EXAMPLES Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited to these examples.
実 施 例 １
治具の製造：
汎用の軟塩化ビニルゾルコーティング（丸石化成品株式会社社製／品番Ｇ−２３３０ブラック：フタル酸ジオクチルを可塑剤として含む）を施した治具（通電部：銅（基本骨格）、ＳＵＳ（枝骨））を表１に記載の可塑剤に２０秒間浸漬した後、表１に記載の温度で２０分間焼成させ、次いで脱脂処理により不要な通電部の可塑剤を除去して本発明治具を製造した。
Example 1
Jig manufacture:
General-purpose soft vinyl chloride sol coating (manufactured by Cobblestone Chemicals Co., Ltd./Part No. G-2330 black: containing dioctyl phthalate as a plasticizer) (conducting part: copper (basic skeleton), SUS (branches) )) Is immersed in the plasticizer listed in Table 1 for 20 seconds, then fired at the temperature listed in Table 1 for 20 minutes, and then the plasticizer in the unnecessary current-carrying part is removed by degreasing to produce the jig of the present invention. did.
治具Ｂは、可塑剤が焼成により揮散してしまい、可塑剤で処理していない治具Ａと同じ外観であった。治具Ｃ〜Ｊは可塑剤で処理していない治具Ａとは違う外観であった。 The jig B had the plasticizer volatilized by firing and had the same appearance as the jig A not treated with the plasticizer. The jigs C to J had an appearance different from that of the jig A which was not treated with a plasticizer.
実 施 例 ２
めっき試験：
実施例１で製造した治具Ａ〜Ｊに被めっき物となるＡＢＳ樹脂（株式会社ＵＭＧ社製：サイコラック３００１Ｍ）の平板（１００ｍｍ×５０ｍｍ×３ｍｍ）を取り付け、表２の条件でめっきを行った。無電解ニッケルめっき後および硫酸銅めっき後の治具への析出を以下の方法で評価した。その結果を表３に示した。
Example 2
Plating test:
A flat plate (100 mm × 50 mm × 3 mm) of ABS resin (manufactured by UMG Co., Ltd .: Psycolac 3001M) to be plated is attached to the jigs A to J manufactured in Example 1, and plating is performed under the conditions of Table 2. It was. Precipitation on the jig after electroless nickel plating and copper sulfate plating was evaluated by the following method. The results are shown in Table 3.
＊：株式会社ＪＣＵの商品名
*: Product name of JCU Corporation
＜治具への析出評価方法＞
治具絶縁被覆部の面積を１００％とし、めっき析出した面積を目視にて以下の５段階で評価した。
（評価） （析出面積）
◎ ： ０％
○ ： ０％より多く５％以下
△ ： ５％より多く１０％以下
× ： １０％より多く５０％以下
×× ： ５０％より多い
<Deposition evaluation method on jig>
The area of the jig insulation coating portion was set to 100%, and the plating deposited area was visually evaluated in the following five stages.
(Evaluation) (Deposition area)
◎: 0%
○: More than 0% and 5% or less △: More than 5% and 10% or less ×: More than 10% and 50% or less XX: More than 50%
無電解ニッケルめっき後および硫酸銅めっき後の被めっき物のめっき析出状態は何れの治具を用いた場合でも良好であった。しかし、治具については、可塑剤が被覆されていない治具ＡおよびＢでは、無電解ニッケルめっき後および硫酸銅めっき後の両方で治具へのめっきの析出が多かった。一方、可塑剤が被覆されている治具Ｃ〜Ｊは無電解ニッケルめっき後および硫酸銅めっき後の両方で治具へのめっきの析出が少なかった。また、無電解ニッケルめっき後に治具にめっきが析出したとしても硫酸銅めっき後にはめっきが伸びず少なくなることが分かった。 The deposition condition of the object to be plated after electroless nickel plating and copper sulfate plating was good regardless of which jig was used. However, with regard to the jigs, in jigs A and B not coated with a plasticizer, plating deposition on the jigs was frequent both after electroless nickel plating and after copper sulfate plating. On the other hand, jigs C to J coated with a plasticizer had less plating deposition on the jig both after electroless nickel plating and after copper sulfate plating. It was also found that even if plating was deposited on the jig after electroless nickel plating, the plating did not extend after copper sulfate plating.
本発明治具は、樹脂成形体のめっきに好適に用いることができる。
以 上
The jig of the present invention can be suitably used for plating a resin molded body.
that's all
Claims (7)
The plating method for a resin molding according to claim 6, wherein the plating of the resin molding is chromic acid etching-free plating.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/945,808 | 2018-04-05 | ||
| US15/945,808 US20190309432A1 (en) | 2018-04-05 | 2018-04-05 | Tool for plating resin molded body and method for plating resin molded body using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6551622B1 true JP6551622B1 (en) | 2019-07-31 |
| JP2019183260A JP2019183260A (en) | 2019-10-24 |
Family
ID=67473350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019017662A Expired - Fee Related JP6551622B1 (en) | 2018-04-05 | 2019-02-04 | Jig for resin molded body plating and plating method for resin molded body using the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20190309432A1 (en) |
| JP (1) | JP6551622B1 (en) |
| WO (1) | WO2019193835A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4297197A (en) * | 1980-11-13 | 1981-10-27 | International Telephone And Telegraph Corp. | Electroplating rack |
| JPS6337166A (en) * | 1986-08-01 | 1988-02-17 | Asahi Chem Ind Co Ltd | Resin composition for coating metal-plating jig |
| JP5131683B2 (en) * | 2007-07-04 | 2013-01-30 | 奥野製薬工業株式会社 | Plating jig used for plating of resin moldings |
| DE102011082260A1 (en) * | 2011-09-07 | 2013-05-08 | Robert Bosch Gmbh | Sensor for determining at least one property of a sample gas in a sample gas chamber |
| JP6648885B2 (en) * | 2015-09-08 | 2020-02-14 | 奥野製薬工業株式会社 | Composition for forming film of plating jig, plating jig, and plating method |
-
2018
- 2018-04-05 US US15/945,808 patent/US20190309432A1/en not_active Abandoned
-
2019
- 2019-02-04 JP JP2019017662A patent/JP6551622B1/en not_active Expired - Fee Related
- 2019-02-08 WO PCT/JP2019/004566 patent/WO2019193835A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019183260A (en) | 2019-10-24 |
| US20190309432A1 (en) | 2019-10-10 |
| WO2019193835A1 (en) | 2019-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI586772B (en) | Treatment for electroplating racks to avoid rack metallization | |
| US11047052B2 (en) | Resin plating method | |
| JP5269306B2 (en) | Dielectric metallization | |
| CA2939316A1 (en) | Treatment for electroplating racks to avoid rack metallization | |
| JP7078232B2 (en) | Electroplating process on the surface of refractory metal or stainless steel with an electroplating layer on the surface, and refractory metal or stainless steel | |
| US2923608A (en) | Method of improving the bonding properties of steel surfaces | |
| KR20060073941A (en) | Magnesium or magnesium alloy product and method for producing same | |
| US20080156652A1 (en) | Cyanide-free pre-treating solution for electroplating copper coating layer on zinc alloy surface and a pre-treating method thereof | |
| JP6551622B1 (en) | Jig for resin molded body plating and plating method for resin molded body using the same | |
| KR20120034067A (en) | Method of reactivating electrode for electrolysis | |
| US2465443A (en) | Treatment of magnesium and magnesium alloy articles to increase their resistance to corrosion | |
| JP2007254866A (en) | Plating pretreatment method for aluminum or aluminum alloy raw material | |
| US20080156653A1 (en) | Cyanide-free pre-treating solution for electroplating copper coating layer on magnesium alloy surface and a pre-treating method thereof | |
| JPS5911678B2 (en) | Manufacturing method of porous copper thin film | |
| US20210372000A1 (en) | Metallization inhibitor for racks employed in galvanic treatments | |
| JP6648885B2 (en) | Composition for forming film of plating jig, plating jig, and plating method | |
| JP2005336507A (en) | Plating method | |
| KR20190034910A (en) | Surface treating method of magnesium metal | |
| JPS6318099A (en) | Production of titanium material coated with colored film having superior adhesion | |
| JPH0339498A (en) | High corrosion resistant chromium plating stainless steel product and production thereof | |
| US2886498A (en) | Process of preparing steel for enameling | |
| JPH03100197A (en) | Method for plating molded product of polymer blend | |
| JPS61201794A (en) | Partial plating method | |
| JPS63105975A (en) | Surface-treated aluminum material | |
| JPH04110479A (en) | Surface-treated al or al alloy material having superior corrosion resistance after coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190205 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20190205 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190225 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190318 |
|
| A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20190326 |
|
| RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7426 Effective date: 20190403 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190409 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190516 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190604 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190617 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6551622 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
| R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
| R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |