JP6544481B2 - Transport apparatus for measuring characteristics of electronic components and method of manufacturing receiving member for characteristics of electronic components - Google Patents

Description

  The present invention relates to a transport apparatus for measuring the characteristics of electronic components, and more particularly, to a transport apparatus for housing electronic components in a cavity of a housing member.

  DESCRIPTION OF RELATED ART For the characteristic measurement of an electronic component, the conveying apparatus which conveys the electronic component in the state accommodated in the cavity of an accommodation member is used.

  For example, in the transport apparatus for measuring the characteristics of the electronic component shown in the schematic configuration diagram of FIG. 16, the disk-shaped housing member 2 rotates in the direction indicated by the arrow X along the transport surface 1 a of the base member 1. The conveyance surface 1 a of the base member 1 and the housing member 2 are arranged vertically or obliquely to the horizontal direction.

  A guide member 5 is provided to face the lower portion of the housing member 2. The guide member 5 holds the electronic component 30. With the rotation of the housing member 2, the electronic component 30 is housed in the cavity 3 formed in the housing member 2, passes through the compressed air blowing mechanism 6, and the characteristics are measured by the measuring unit 7 disposed in the section A. , And is discharged from the cavity 3 in section B.

  As shown in the schematic sectional view of FIG. 17, the electronic component 30 has electrodes 30a at both ends, is attracted to the cavity 3 by negative pressure, and is accommodated in the cavity 3 in a predetermined posture. The compressed air blowing mechanism 6 blows air from the jet outlet 6 a to the housing member 2 and blows off the electronic component 30 attached to the housing member 2 by static electricity (for example, see Patent Document 1).

JP, 2007-153477, A

  If the electronic component is conveyed while being stuck to the housing member, the electronic component may be cracked or chipped due to being caught in the structure, or the electronic component may spill out of a predetermined path. By blowing air, this can be prevented.

  However, when the electronic component becomes smaller, it becomes difficult to separate the electronic component stuck to the housing member from the housing member by air blowing. For example, for a small electronic component, the force of air acting on the electronic component is small, and the electronic component is less likely to be peeled off from the housing member. If the air is blown strongly to increase the force of air acting on the electronic components, the electronic components contained in the cavity are blown away from the cavity, the attitude is disturbed in the cavity, or the electronic components are contained in the housing member. Problems such as being stirred may occur.

  In view of such circumstances, the present invention provides a transport apparatus for measuring the characteristics of an electronic component which can suppress sticking of the electronic component to the housing member, and a method of manufacturing the housing member for measuring the characteristics of the electronic component. It is said that.

  In order to solve the above-mentioned subject, the present invention provides the conveyance device for the characteristic measurement of the electronic part constituted as follows.

A transport apparatus for measuring the characteristics of an electronic component has (a) first and second main surfaces facing each other, a plurality of openings are formed in the first main surface, and the first main surface and A housing member in which a plurality of cavities respectively communicating with the plurality of openings are formed between the second main surface and (b) a plurality of electronic components on the first main surface of the housing member An electronic component supply mechanism for supplying in contact with each other, and (c) a drive mechanism for moving the storage member relative to the electronic component supply mechanism, wherein the relative movement of the storage member relative to the electronic component supply mechanism Accordingly, the electronic component in contact with the first main surface of the housing member is housed in the cavity of the housing member. The housing member, (i) made of insulating material, said opening and said cavity and is formed insulating portion, (ii) a conductive material a ing sheet, conductive bonded to said insulating portion Part. The conductive portion includes: (a) a contact area of the first main surface in contact with the electronic component supplied from the electronic component supply mechanism; and (b) the contact area of the second main surface. (C) providing a space between the cavity formed in the insulating portion in at least one of an opposing area opposed to (c) and an internal area sandwiched between the contact area and the opposing area It is arranged.

  According to the above configuration, even if static electricity is generated in the electronic component or the housing member, the static electricity is reduced by the conductive portion of the housing member, and sticking of the electronic component to the first main surface of the housing member is suppressed .

  In addition, since the housing member is spaced from the cavity formed in the insulating portion and the conductive portion is disposed, the electronic component does not contact the conductive portion when housed in the cavity. As a result, when measuring the characteristics of the electronic component while being accommodated in the cavity, the measurement is not influenced by the conductive part.

  Preferably, the conductive portion is connected to a ground potential.

  In this case, the static electricity generated in the housing member is released from the conductive portion to the ground potential, so the static electricity is more reliably reduced. As a result, sticking of the electronic component to the first main surface of the housing member is further suppressed.

  In addition, the present invention provides various methods for manufacturing the housing member for measuring the characteristics of the electronic component as follows. That is, it has first and second main surfaces facing each other, and a plurality of openings are formed in the first main surface, and between the first main surface and the second main surface, A plurality of cavities respectively communicating with the openings are formed, (a) an insulating portion made of an insulating material, the insulating portion in which the openings and the cavities are formed, and (b) a conductive material, the first main surface At least one of the second main surface and the inner region sandwiched between the first main surface and the second main surface is disposed with an interval provided therebetween The present invention provides various methods of manufacturing a housing member for measuring the characteristics of an electronic component, comprising: a conductive portion in contact with the insulating portion.

In a first method of manufacturing a housing member for measuring the characteristics of an electronic component, (i) preparing a base on which an insulating layer made of the insulating material and a conductive layer made of the conductive material are laminated Material preparation process, (ii) a plurality of through holes penetrating all of the insulating layer and the conductive layer, or at least one of the conductive layers in the base material; A hole forming step of forming a plurality of bottomed holes to be formed, (iii) simultaneously with the hole forming step, or after the hole forming step, all the holes in which the through holes or the bottomed holes are formed With respect to the conductive layer, the inner peripheral surface of the through hole or the bottomed hole and the portion around the inner peripheral surface of the through hole are removed, and the inner peripheral surface of the through hole formed in the insulating layer At least a portion, or the insulation layer forming the bottom of the blind hole Such that at least a portion of the inner circumferential surface remains, the through-hole or the blind hole is larger than enlarged bore, and a conductive material removal step of forming on said substrate.

  The housing member can be manufactured by the above method. That is, the insulating layer of the base becomes the insulating part of the housing member, and the conductive layer of the base becomes the conductive part of the housing member. A through hole or a bottomed hole becomes a cavity.

  According to the above-described method, by forming the enlarged hole by a method such as countersinking the through hole or the bottomed hole, all the inner peripheral surfaces of the through hole or the bottomed hole and the parts therearound are formed. Since the conductive material can be removed, the structure in which the conductive portion is disposed at an interval from the cavity formed in the insulating portion can be relatively easily formed with high positional accuracy.

  A second method of manufacturing a housing member for measuring the characteristics of an electronic component comprises: (i) preparing a base on which an insulating layer made of the insulating material and a conductive layer made of the conductive material are laminated Material preparation process, (ii) a plurality of through holes penetrating all of the insulating layer and the conductive layer, or at least one of the conductive layers in the base material; The hole forming step of forming a plurality of bottomed holes to be formed, and (iii) after the hole forming step, the through holes or the through holes or all the conductive layers in which the bottomed holes are formed. And a conductive material removing step of removing the conductive material of the inner peripheral surface of the bottomed hole and the portion around it.

  The housing member can be manufactured by the above method. That is, the insulating layer of the base becomes the insulating part of the housing member, and the conductive layer of the base becomes the conductive part of the housing member. A through hole or a bottomed hole becomes a cavity.

  According to the above method, the conductive portion can be formed in the insulating portion because all the conductive material in the inner peripheral surface of the through hole or the bottomed hole and the portion around it can be removed by a method such as metal etching. The structure disposed with a space between them can be relatively easily formed with high positional accuracy.

  A third method of manufacturing a housing member for measuring the characteristics of an electronic component comprises: (i) preparing a base on which an insulating layer made of the insulating material and a conductive layer made of the conductive material are laminated Material preparation process, (ii) a plurality of through holes penetrating all of the insulating layer and the conductive layer, or at least one of the conductive layers in the base material; Forming a plurality of bottomed holes in which the bottom is formed by the conductive layer; and (iii) covering the inner circumferential surface of the through hole after the hole forming step; To cover the inner circumferential surface of the bottomed hole formed by one of the insulating layers, or to cover the inner circumferential surface and the bottom of the bottomed hole formed by the one conductive layer Forming a separation layer made of the same or different insulating material as the insulating layer. Comprising a layer formation step, a.

  The housing member can be manufactured by the above method. That is, the insulating layer of the base becomes the insulating part of the housing member, and the conductive layer of the base becomes the conductive part of the housing member. A space surrounded by the inner circumferential surface of the separation layer becomes a cavity.

  According to the above method, by forming the separation layer by a method of coating the insulating material or the like, the conductive portion is disposed at a distance from the cavity formed in the insulating portion. The position accuracy can be relatively easily formed.

  According to the present invention, it is possible to suppress that the electronic component is stuck to the housing member.

FIG. 1 is a block diagram of the transfer apparatus. Example 1 FIG. 2 is a schematic plan view of the housing member. Example 1 FIG. 3 is a cross-sectional view of the main part of the transfer device. Example 1 FIG. 4 is an explanatory view of the housing member. (Modification 1 of Embodiment 1) FIG. 5 is an explanatory view of the housing member. (Modified Example 2 of Example 1) FIG. 6 is an explanatory view of the housing member. (Modification 3 of Embodiment 1) FIG. 7 is a cross-sectional view of the main parts of the conveyance device (Modification 4 of Embodiment 1). FIG. 8 is a perspective view of the housing member. Example 1 and Modified Example 4 of Example 1 FIG. 9 is an exploded perspective view of a substrate. (Example 2) FIG. 10 is a cross-sectional view showing the manufacturing process of the housing member. (Example 2) FIG. 11 is a cross-sectional view showing the manufacturing process of the housing member. (Example 3) FIG. 12 is a cross-sectional view showing the manufacturing process of the housing member. (Example 4) FIG. 13 is a plan view of the housing member. (Example 5) FIG. 14 is an enlarged sectional view of an essential part of the housing member. (Example 5) FIG. 15 is a plan view of the housing member. (Modification 1 of Embodiment 5) FIG. 16 is a schematic configuration diagram of the transfer device. (Conventional example) FIG. 17 is a schematic cross-sectional view of the transfer device. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  <Example 1> The conveying apparatus 10 (henceforth "the conveying apparatus 10") for the characteristic measurement of the electronic component of Example 1 is demonstrated, referring FIGS. 1-8.

  FIG. 1 is a block diagram conceptually showing the entire structure of the transfer apparatus 10. As shown in FIG. As shown in FIG. 1, the transfer device 10 is a disk-shaped housing member 12 having a first main surface 12 s and a second main surface 12 r facing each other on the flat transfer surface 11 a of the transfer table 11. Is arranged. The housing member 12 is rotationally driven by the rotation member 16 a of the drive mechanism 16 and rotates along the transport surface 11 a in the direction indicated by the arrow 11 x. Although FIG. 1 illustrates the case where the transport surface 11 a of the transport table 11 and the housing member 12 are horizontal, the transport surface 11 a may be vertical or oblique to the horizontal direction.

  Electronic components 18 are supplied from the electronic component supply mechanism 14 onto the housing member 12. The electronic component 18 supplied from the electronic component supply mechanism 14 is in contact with an annular contact area 12t indicated by a chain line 12i, 12j on the first main surface 12s of the housing member 12. A cavity (not shown in FIG. 1), which will be described later, is formed in the contact area 12t of the housing member 12, and the electronic component 18 is housed in the cavity. The electronic component 18 accommodated in the cavity is transported while being accommodated in the cavity as the accommodating member 12 rotates. The housing member 12 is a rotor that conveys in a circumferential direction on a plane.

  FIG. 2 is a schematic plan view of the housing member 12. As shown in FIG. 2, the housing member 12 has a plurality of cavities 12 p formed between a circular inner peripheral edge 12 g and an outer peripheral edge 12 h. The housing member 12 is positioned with the inner peripheral edge 12g engaged with the rotation member 16a (see FIG. 1) of the drive mechanism 16. Although not shown, a plurality of cavities 12 p are formed not only in the radial direction of the housing member 12 but also in the circumferential direction.

  FIG. 3 is an enlarged cross-sectional view of the main part of the conveyance device 10. As shown in FIG. As shown in FIG. 3, in the housing member 12, a plurality of openings 12 q (only one is shown in FIG. 3) are formed in the first main surface 12 s, and the first main surface 12 s and the second main surface 12 r And a plurality of cavities 12p (only one is shown in FIG. 3) respectively communicating with the plurality of openings 12q.

  The housing member 12 includes an insulating portion 12k made of an insulating material and a conductive portion 12u made of a conductive material, and the conductive portion 12u is disposed on the upper surface 12m of the insulating portion 12k. The lower surface 12 n of the insulating portion 12 k is the second main surface 12 r of the housing member 12 and is in contact with the transport surface 11 a of the transport table 11 or faces the transport surface 11 a of the transport table 11 with an interval. The first main surface 12s of the housing member 12 includes a portion of the top surface 12m of the insulating portion 12k where the conductive portion 12u is not disposed, and the top surface 12x of the conductive portion 12u.

  The opening 12 q and the cavity 12 p are formed in the insulating portion 12 k. The conductive portion 12 u is disposed at a distance from the cavity 12 p formed in the insulating portion 12 k, and is joined to the insulating portion 12 k. The conductive portion 12 u is disposed in the contact area 12 t (see FIG. 1) of the first major surface 12 s of the housing member 12.

  Although FIG. 3 illustrates the case where the cavity 12 p is a through hole penetrating between the main surfaces 12 r and 12 s of the housing member 12, the cavity reaches the second main surface 12 r of the housing member 12. It does not matter if it is not a bottomed hole.

  FIG. 7 is a cross-sectional view of an essential part of a conveyance device using accommodating members 12a to 12d of a modification in which a conductive portion is disposed in addition to the contact region 12t.

  In the housing member 12a illustrated in FIG. 7A, the conductive portion 12v is disposed on the neutral plane in the insulating portion 12k. In the housing member 12b shown in FIG. 7B, the conductive portion 12v is disposed on the upper surface 12m side of the neutral surface in the insulating portion 12k. In the housing member 12c shown in FIG. 7C, a plurality of conductive portions 12v are disposed in the insulating portion 12k. Conductive portion 12v faces contact region 12t (see FIG. 1) of first main surface 12s of housing member 12 and contact region 12t (see FIG. 1) of second main surface 12r of housing member 12. In the internal region 13s sandwiched between the opposing region 13t (see FIG. 1), a space is provided between the cavity 12p formed in the insulating portion 12k and the inner portion 13s is joined to the insulating portion 12k.

  In the housing member 12d illustrated in FIG. 7D, the conductive portion 12w is disposed on the lower surface 12n of the insulating portion 12k. The conductive portion 12 w is provided with a space between the second main surface 12 r of the housing member 12 and the cavity 12 p formed in the insulating portion 12 k in an opposing region facing the contact region 12 t (see FIG. 1). It is arrange | positioned and joined to the insulation part 12k.

  FIG. 8 is a perspective view of the housing members 12, 12a to 12d seen from a direction perpendicular to the main surface. As shown in FIG. 8, the hatched conductive portions 12 u to 12 w are disposed at a distance from the cavity 12 p formed in the insulating portion 12 k and formed to surround the cavity 12 p. ing.

  The conductive portions 12u to 12w are preferably disposed in the most part of the contact area 12t and formed in a continuous single shape when viewed through the housing members 12, 12a to 12d in a direction perpendicular to the main surface, It may be formed into a plurality of divided shapes. For example, 50% or more and 99% or less of the area of the portion excluding the cavity 12p in the contact region 12t is formed and formed in one continuous shape.

  The conductive portion includes a contact region 12t of the first main surface 12s of the housing member 12, a facing region of the second main surface 12r of the housing member 12 facing the contact region 12t, a contact region 12t, and a facing region. It may be disposed in two or more of the inner regions sandwiched between.

  The shape of the housing member may be a shape other than a circle, as in the case of the housing members 13a to 13c illustrated in the explanatory views of FIGS. Although not illustrated in FIGS. 4 to 6, a plurality of cavities 12 p are formed not only in the radial direction of the housing member 12 but also in the circumferential direction.

  The housing member 13a illustrated in FIG. 4 is a cylindrical member that rotates in the direction indicated by the arrow. The housing member 13a has first and second main surfaces 13u and 13i facing each other, and a plurality of openings 13x are formed in the outer first main surface 13u, and the first main surface 13u and the second main surface 13u are formed. A plurality of cavities 13p respectively communicating with the openings 13x are formed between the main surface 13i and the main surface 13i. The electronic component is accommodated in the cavity 13p and conveyed in the rotational direction (circumferential direction) of the cylindrical surface.

  The housing member 13 b shown in FIG. 5 is an endless belt-like member that circulates in the direction indicated by the arrow. The housing member 13 b has first and second main surfaces 13 v and 13 j facing each other, and a plurality of openings 13 y are formed in the outer first main surface 13 v, and the first main surface 13 v and the second main surface 13 v A plurality of cavities 13 q respectively communicating with the openings 13 y are formed between the main surface 13 j and the main surface 13 j. The electronic component is accommodated, for example, in the cavity 13q in the flat plate portion of the accommodating member 13b, transported straight, and then discharged while the cavity 13q is in the flat plate portion.

  The housing member 13c shown in FIG. 6 is a flat member and moves in the surface direction as indicated by the arrow. The housing member 13c has first and second main surfaces 13w and 13k facing each other, and a plurality of openings 13z are formed in the first main surface 13w, and the first main surface 13w and the second main surface are formed. Between 13k, a plurality of cavities 13r respectively communicating with the openings 13z are formed. The electronic components are accommodated in the cavity 13r and transported on a plane.

  Next, specific examples of the application and configuration of the transport device 10 will be described in more detail.

  The transport device 10 is electrically connected to the external electrodes of the electronic components even if it is a characteristic sorter, a processing device such as an appearance sorter, formation of external electrodes and leads, a packing device such as taping, and an assembly mounter. It is possible to use any device having a function of measuring the target characteristics. For example, a measuring device for measuring the electrical characteristics of the electronic component 18 by conducting to the external electrode of the electronic component 18 housed in the cavity and a pickup mechanism for picking up the electronic component 18 are attached to the transport device 10.

  The workpiece (electronic component) targeted by the transport device 10 is, for example, a rectangular parallelepiped multilayer ceramic capacitor, a coil, a multilayer substrate, or the like. In the case where the workpiece has a rectangular parallelepiped shape, assuming that the dimension in the longitudinal direction of the workpiece is L, the width is W, and the thickness is t, for example, 7 mm> L> 0.1 mm, 5 mm> W> 0.1 mm, 4 mm> t> 0. A work of 01 mm is a target of the transport apparatus 10. The shape of the work may be, for example, a cylindrical shape other than the rectangular parallelepiped shape.

  The electronic component supply mechanism 14 supplies the electronic component 18 by using a vibration feeder, a person's transfer, and other transfer devices.

  As described above, the housing member is a rotor, a roll, a belt, or a flat plate, and the thickness, that is, the dimension between the main surfaces facing each other is about 0.1 mm or more and 10 mm or less.

  The material of the insulating portion of the housing member is glass, ceramics such as zirconia, resin, or the like.

  The material of the conductive portion of the housing member is a metal conductor such as copper, aluminum, silver, gold or the like, a conductive polymer material, or the like. The conductive layer forming the conductive portion may be a single layer or a plurality of layers. The thickness of the conductive layer is about 0.00001 mm or more and about 1 mm or less. The sheet resistance of the conductive layer is about 0.01 Ω / □ or more and 0.1 Ω / □ or less. When the conductive layer is disposed inside the housing member, the conductive layer is disposed parallel to the main surface of the housing member.

  The positional relationship between the conductive portion and the cavity is such that the conductive portion does not contact the electrode of the work (the electronic component), particularly when the transport apparatus 10 is used for a characteristic sorter, the conductive portion has an inner circumferential surface or an opening of the cavity. It forms in the position which separated about 0.01 mm or more and about 1 mm or less from the edge of.

  The housing member can be manufactured by a method such as fixing by fixing or the like sandwiching the conductive layer between the insulating layers, or applying and drying a paste-like conductive material on the insulating layer.

  When the conductive member is provided in the housing member, the electrostatic force acting between the workpiece (electronic component) and the housing member is reduced, and the workpiece is less likely to be attached. For example, in the case of a storage member without a conductive part, the work adheres to the storage member in a continuous operation for 30 minutes, but by providing the conductive part, the work does not adhere even after continuous operation for 3 hours.

  Even when the conductive portion is not connected to the ground potential, it has an effect of suppressing the sticking of the electronic component to the housing member. When the conductive portion is connected to the ground potential, the effect can be made more reliable.

  The conductive portion may be connected to the ground potential in an appropriate manner. For example, an annular continuous groove is formed on the second main surface of the housing member on the side of the transport table so that the conductive layer is exposed at a location away from the cavity, and connected to the ground potential on the side of the transport table. A conductive roller or sphere is provided to contact with the conductive layer. Alternatively, an annular continuous groove is formed on the first main surface of the housing member opposite to the transport table so that the conductive layer is exposed at a location away from the cavity, and the first main surface side of the housing member A conductive roller or sphere connected to the ground potential is provided to make contact with the conductive layer.

  The housing member may be driven continuously or intermittently by the drive mechanism. For example, the rotational speed of the housing member is about 1 rp or more and about 100 rpm or less, and the moving speed is 1 m / s or more and 10 m / s or less.

  The cavities may be formed in one row in the housing member or in multiple rows. The inside of the cavity may be configured to be suctioned.

  As described above, when the conductive parts 12 u to 12 w are provided in the housing member 12, sticking of the electronic component 18 to the first main surface 12 s of the housing member 12 is suppressed. That is, one of the causes of the electronic component 18 sticking to the first major surface 12s of the housing member 12 is static electricity. When the conductive parts 12u to 12w are provided in the housing member 12, static electricity is dispersed in the conductive parts 12u to 12w, diffused from the conductive parts 12u to 12w to the atmosphere or to the ground potential, or distributed in the insulating part 12k. Are relieved by the conductive portions 12 u to 12 w. Thereby, even if static electricity is generated in the electronic component 18 and the housing member 12, the static electricity is reduced by the conductive portions 12u to 12w, and sticking of the electronic component 18 to the first main surface 12s of the housing member 12 is suppressed. Ru.

  In addition, since the conductive portions 12u to 12w are disposed at an interval from the cavity 12p formed in the insulating portion 12k, the electronic component 18 housed in the cavity 12p of the housing member 12 is a conductive portion. Do not touch 12u. Thereby, when measuring the characteristic of the electronic component 18 in the state accommodated in the cavity 12p, a measurement is not received to the influence of the electroconductive part 12u.

  Next, a method of manufacturing the housing member used in the conveyance device 10 will be described.

  In the case of manufacturing the housing member in which the conductive portion is disposed only on the main surface, the conductive material is formed in a wider shape than the cavity in the insulating material in which the cavity is formed in advance. Alternatively, after the conductive material is formed in the insulating material in a shape which is cut out wider than the cavity, the cavity is formed in the insulating material.

  The conductive material is formed by printing, forming a film by sputtering using a mask, or by lift-off in which the conductive material is deposited and removed after the resist is formed into a shape desired to be hollowed. It is formed in a wider hollow shape.

  The housing member in which the conductive portion is disposed can be manufactured by the method of the following second to fourth embodiments.

  Example 2 A method of manufacturing a housing member for measuring the characteristics of the electronic component of Example 2 in which the conductive portion is formed to be separated from the cavity by a method such as counterbore processing, referring to FIGS. 9 and 10. explain. FIG. 9 is an exploded perspective view of a substrate. FIG. 10 is a cross-sectional view showing the manufacturing process of the housing member for measuring the characteristics of the electronic component.

(1) Base Material Preparation Step First, as shown in FIG. 10A, a base material 20 in which two insulating layers 22 and 24 made of an insulating material and a conductive layer 32 made of a conductive material are laminated. Prepare. In the base material 20, the conductive layer 32 is disposed in an inner region between the first major surface 20a and the second major surface 20b. Note that the number of insulating layers may be three or more. The conductive layer may have two or more layers.

  For example, in the case of manufacturing the circular housing member 12 (see FIG. 1), as shown in FIG. 9, a conductive sheet 32s made of a conductive material is sandwiched between the insulating sheets 22s and 24s made of an insulating material. Paste together so that The insulating sheets 22s and 24s become the insulating layers 22 and 24 (see FIG. 10) of the base 20, and the conductive sheet 32s becomes the conductive layer 32 (see FIG. 10) of the base 20. FIG. 9 illustrates the case where the insulating sheets 22s and 24s and the conductive sheet 32s are processed in advance into a circular shape having a central hole, but after forming the cavity, the circular shape having the central hole It may be processed into

(2) Hole Forming Step Next, as shown in FIG. 10 (b), a plurality of through holes 20p (only one is shown in FIG. 10) which penetrates all of the insulating layers 22, 24 and the conductive layer 32 in the base material 20. (Shown).

  Alternatively, a plurality of bottomed holes may be formed through the at least one conductive layer 32 instead of the through holes 20p and the bottom may be formed by one insulating layer (for example, the insulating layer 24). Alternatively, both the through hole 20p and the bottomed hole may be formed.

(3) Conductive Material Removal Step Next, as shown in FIG. 10C, the enlarged hole 20 q larger than the through hole 20 p is attached to the base 20 from one side or both sides of the main surfaces 20 and 20 b of the base 20. Form. At this time, for all the conductive layers 32 in which the through holes 20p are formed, the conductive material in the portions around the inner peripheral surface of the through holes 20p and the periphery thereof is removed and formed in the insulating layers 22 and 24. The enlarged hole 20 q is formed such that at least a part of the inner peripheral surface of the through hole 20 p remains. When forming the expanded hole 20q, the inner peripheral surface of the through hole 20p formed in the insulating layer 22 and the portion around it are also removed.

  For example, the counterbore from the side of the first main surface 20a of the base 20 is such that at least a part of the inner peripheral surface of the through hole 20p formed in the insulating layer 24 on the side of the second main surface 20b of the base 20 remains. By processing, the enlarged hole 20 q having an inner diameter larger than the through hole 20 p is processed at least into the insulating layer 22 and the conductive layer 32 on the first main surface 20 a side of the base 20.

  The conductive material removing step may be performed simultaneously with the hole forming step. For example, a stepped drill having a small diameter at the tip end and a large diameter at the base end is used to process from the side of the first main surface 20a of the base material 20 to form the through hole 20p at the small diameter portion of the drill, and the large diameter portion The enlarged hole 20q is formed.

  In the case of forming a bottomed hole in the hole forming step, the inner circumferential surface of the bottomed hole and the periphery thereof for all the conductive layers in which the bottomed hole is formed simultaneously with or after the hole forming step. An enlarged hole larger than the bottomed hole is formed in the substrate so that the conductive material in the portion of the bottom is removed and at least a part of the inner circumferential surface of the insulating layer forming the bottom of the bottomed hole remains. Form.

  By the steps (1) to (3) above, the housing member for measuring the characteristics of the electronic component can be manufactured. The through holes 20p formed in the insulating layer 24 become cavities of the housing member. The insulating layers 22 and 24 become the insulating portions of the housing member, and the conductive layer 32 becomes the conductive portion of the housing member.

  As shown in FIG. 10C, the opening 12 q of the housing member is formed in the insulating layer 24. Further, the first main surface of the housing member includes the surface 22 a of the insulating layer 22 and the exposed surface 24 a of the insulating layer 24 inside the enlarged hole 20 q.

  Since the conductive material forming the inner peripheral surface of the through hole can be removed by forming the enlarged hole in the through hole by a counterbore process or the like, the conductive portion is separated from the cavity formed in the insulating portion Can be formed relatively easily with high positional accuracy.

  Example 3 A method of manufacturing the housing member for measuring the characteristics of the electronic component of Example 3 in which the conductive portion is formed to be separated from the cavity by a method such as etching will be described with reference to FIG. FIG. 11 is a cross-sectional view showing the manufacturing process of the housing member for measuring the characteristics of the electronic component.

(1) Base Material Preparation Step First, as in the second embodiment, a base material 20 on which insulating layers 22 and 24 made of an insulating material and a conductive layer 32 made of a conductive material are laminated is prepared. Note that the number of insulating layers may be three or more. The conductive layer may have two or more layers.

(2) Hole Forming Step Next, as in Example 2, as shown in FIG. 11A, the substrate 20 is provided with a plurality of through holes 20p penetrating all of the insulating layers 22 and 24 and the conductive layer 32 (see FIG. In 11, only one is shown).

  Alternatively, a plurality of bottomed holes may be formed through the at least one conductive layer 32 instead of the through holes 20p and the bottom may be formed by one insulating layer (for example, the insulating layer 24). Alternatively, both the through hole 20p and the bottomed hole may be formed.

(3) Conductive Material Removal Step Next, as shown in FIG. 11B, the inner circumferential surface of the through hole 20p is formed by etching using a solvent that selectively dissolves only the conductive material of the conductive layer 32. The conductive material of the portion 20r around the inner circumferential surface of the through hole 20p is removed for all the conductive layers 32 that are to be formed.

  When forming a bottomed hole in the hole forming step, the conductive material of the inner peripheral surface and the surrounding portion is removed for all the conductive layers forming the inner peripheral surface of the bottomed hole by a method such as etching Do.

  By the steps (1) to (3) above, the housing member for measuring the characteristics of the electronic component can be manufactured. The through hole 20p formed in the insulating layer becomes a cavity of the housing member. The insulating layers 22 and 24 become the insulating portions of the housing member, and the conductive layer 32 becomes the conductive portion of the housing member.

  Since the conductive material around the inner peripheral surface of the bottomed hole can be removed by a method such as metal etching, a structure in which the conductive portion is separated from the cavity can be relatively easily formed with high positional accuracy.

  Example 4 A method of manufacturing the housing member for measuring the characteristics of the electronic component of Example 4 in which the conductive portion is formed to be separated from the cavity by a method such as coating will be described with reference to FIG. FIG. 12 is a cross-sectional view showing the manufacturing process of the housing member for measuring the characteristics of the electronic component.

(1) Base Material Preparation Step First, as in the second embodiment, a base material 20 on which insulating layers 22 and 24 made of an insulating material and a conductive layer 32 made of a conductive material are laminated is prepared. Note that the number of insulating layers may be three or more. The conductive layer may have two or more layers.

(2) Hole Forming Step Next, as in Example 2, as shown in FIG. 12A, the base 20 is provided with a plurality of through holes 20p penetrating all of the insulating layers 22 and 24 and the conductive layer 32 (see FIG. At 12, only one is shown).

  Alternatively, a plurality of bottomed holes may be formed through the at least one conductive layer 32 instead of the through holes 20p and the bottom may be formed by one insulating layer (for example, the insulating layer 24). Alternatively, both the through hole 20p and the bottomed hole may be formed.

(3) Separation Layer Forming Step Subsequently, the separation layer 26 made of an insulating material that is the same as or different from the insulating layers 22 and 24 is formed so as to cover the inner peripheral surface of the through hole 20p. The separation layer 26 is formed by a method such as coating.

  In the hole forming step, in the case of forming the bottomed hole, the separation layer made of the same or different insulating material as the insulating layer is formed to cover the inner peripheral surface of the bottomed hole. The separation layer is formed by a method such as coating.

  By the steps (1) to (3) above, the housing member for measuring the characteristics of the electronic component can be manufactured. A space surrounded by the inner circumferential surface 26 a of the separation layer 26 is a cavity of the housing member. The insulating layers 22 and 24 and the separation layer 26 become an insulating part of the housing member, and the conductive layer 32 becomes a conductive part of the housing member.

  The separation layer 26 can be formed by coating an insulating material or the like, and a structure in which the conductive part is separated from the cavity can be relatively easily formed with high positional accuracy.

  In the hole forming step, the bottom of the bottomed hole may be formed by one conductive layer. In this case, in the conductive material removing step, the separation layer is formed of the same or different insulating material as the insulating layer by a method such as coating so as to cover the inner peripheral surface of the bottomed hole and the bottom of the bottomed hole.

  Example 5 Example 5 in which other measures against static electricity are used in combination with Example 1 will be described with reference to FIGS. 13 to 15.

  (1) A groove is formed on the first main surface of the housing member to reduce the contact area with the electronic component. For example, radial grooves 12y shown in FIG. 13 and an annular groove 12z shown in FIG. 15 are formed.

  FIG. 13 is a plan view of the housing member 12e. FIG. 14 is an enlarged cross-sectional view of main parts of the accommodation member 12e cut in the circumferential direction. As shown in FIGS. 13 and 14, a groove 12y is formed in the contact area 12t of the first main surface 12s of the housing member 12e in contact with the electronic component 18 so as not to overlap with the cavity 12p. The grooves 12y radially extend in the radial direction, and the number (two in FIG. 13) is appropriately formed between two cavities 12p adjacent to each other in the circumferential direction.

  Although the groove 12y illustrates the bottomed groove formed to the front of the second main surface 12r of the housing member 12e, it may be a through groove reaching the second main surface 12r of the housing member 12e. Moreover, although the groove | channel 12y which has continued in radial direction is shown in figure, you may form a groove | channel intermittently in radial direction. Preferably, the groove 12y and the cavity 12p do not overlap.

  When the electronic component 18 has a rectangular parallelepiped shape, the dimension in the longitudinal direction of the electronic component 18 is L, the width is W, the thickness is t, and L> W ≧ t, as shown in FIG. Assuming that the width is S1, the dimension of the gap between the adjacent grooves 12y without the cavity 12p is S2, the dimension of the gap between the adjacent cavity 12p and the groove 12y is S3, and the depth of the groove 12y is S4. It is preferable to constitute so that S1 <L, S2 <L, S3 <L, and S4 <t / 2 may be satisfied.

  As indicated by a chain line in FIG. 14, the electronic component 18 adheres to the housing member 12e in a state where the moving direction (that is, the circumferential direction) of the housing member 12e and the longitudinal direction of the electronic component 18 are substantially parallel. There are many.

  By setting S1 <L, entry of the electronic component 18 into the groove 12y can be suppressed. In addition, by setting S2 <L and S3 <L, the electronic component 18 and the first main surface 12s of the housing member 12e are provided between the adjacent grooves 12y or between the adjacent cavities 12p and the grooves 12y. The contact area can be reduced.

  By setting S4 <t / 2, even if the electronic component 18 enters the groove 12y, the center G of the electronic component 18 is positioned outside the groove 12y, and the electronic component 18 remains in the groove 12y. Can be suppressed.

  FIG. 15 is a plan view of the housing member 12 f. As shown in FIG. 15, an annular groove 12z is concentrically formed in the first major surface 12s of the housing member 12f so as not to overlap with the cavity 12p. The number of grooves 12z is appropriately formed (one each in FIG. 15) between the cavities 12p adjacent in the radial direction.

  A groove may be formed on the first main surface of the housing member so as to extend continuously or intermittently in an oblique direction intersecting both the radial direction and the circumferential direction. In addition, radial grooves, concentric grooves, or grooves in an oblique direction may be appropriately combined and formed on the first main surface of the housing member.

  By forming a groove in the contact area of the first main surface of the housing member in contact with the electronic component, the contact area of the electronic component in contact with the first main surface of the housing member is reduced to suppress generation of static electricity. Can.

  (2) A static eliminator or static electricity removing device may be provided, for example, above the electronic component supply mechanism or the housing member to suppress the generation of static electricity.

  (3) The contact area between the housing member and the transport table can be reduced to suppress the generation of static electricity. For example, in the configuration of the first embodiment shown in FIG. 1, a groove or unevenness is provided on the second main surface 12 r of the accommodation member 12 on the conveyance table 11 side, or a groove or unevenness is provided on the conveyance surface 11 a of the conveyance table 11 To As a result, the contact area between the second main surface 12r of the housing member 12 and the transport surface 11a of the transport table 11 is reduced, and the generation of static electricity is suppressed.

  When forming a conductive portion in the housing member and using one or more of the other measures against static electricity in the above (1) to (3) in combination, the measures against sticking of the work due to static electricity are more reliable Can be

  <Summary> As described above, by forming the conductive portion in the housing member used in the transport apparatus for measuring the characteristics of the electronic component, it is possible to suppress the electronic component from being stuck to the housing member.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the housing members for measuring the characteristics of the electronic component may be manufactured by appropriately combining the methods of the second to fourth embodiments.

DESCRIPTION OF SYMBOLS 10 conveyance apparatus 11 conveyance table 11a conveyance surface 12, 12a-12f accommodation member 12k insulating part 12p cavity 12q opening 12r 2nd main surface 12s 1st main surface 12t contact area 12u-12w electroconductive part 13a-13c accommodation member 13i- 13k 1st main surface 13p to 13r cavity 13u to 13w 2nd main surface 13x to 13z Opening 14 electronic component supply mechanism 18 drive mechanism 18 electronic component 20 base 20p through hole 20q enlarged hole 22, 24 insulating layer 26 separation layer 32 Conductive layer

Claims (5)

It has a first and a second main surface facing each other, and a plurality of openings are formed in the first main surface, and the plurality of openings are formed between the first main surface and the second main surface. A housing member in which a plurality of cavities respectively communicating with the openings are formed;
An electronic component supply mechanism that supplies a plurality of electronic components in contact with the first main surface of the housing member;
A drive mechanism for moving the housing member relative to the electronic component supply mechanism;
Equipped with
A characteristic of an electronic component in which the electronic component in contact with the first main surface of the housing member is accommodated in the cavity of the housing member in accordance with relative movement of the housing member with respect to the electronic component supply mechanism. In the measuring device,
The housing member is
An insulating portion made of an insulating material and having the opening and the cavity formed therein;
A conductive material a ing sheet is bonded to said insulating portion,
A contact area of the first main surface in contact with the electronic component supplied from the electronic component supply mechanism;
In the second main surface, a facing region facing the contact region,
An internal region sandwiched between the contact region and the opposing region;
And at least one of the conductive parts disposed at a distance from the cavity formed in the insulating part.
What is claimed is: 1. A transport apparatus for measuring the characteristics of electronic components, comprising:   The transport apparatus for measuring the characteristics of the electronic component according to claim 1, wherein the conductive portion is connected to a ground potential. A plurality of openings are formed in the first main surface, and the opening is provided between the first main surface and the second main surface. A plurality of cavities communicating with each other are formed,
An insulating portion made of an insulating material and having the opening and the cavity formed therein;
And at least one of the first main surface, the second main surface, and the inner region sandwiched between the first main surface and the second main surface. A conductive portion disposed at a distance from the cavity and in contact with the insulating portion;
A method of manufacturing a housing member for measuring the characteristics of an electronic component, comprising:
A substrate preparation step of preparing a substrate on which the insulating layer made of the insulating material and the conductive layer made of the conductive material are laminated;
In the base material, a plurality of through holes penetrating all of the insulating layer and the conductive layer, or a plurality of bottomed holes penetrating the at least one conductive layer and having a bottom formed by the one insulating layer Forming a hole, and
At the same time as the hole forming process or after the hole forming process,
For all the conductive layers in which the through hole or the bottomed hole is formed, the conductive material of the inner peripheral surface of the through hole or the bottomed hole and the surrounding portion is removed.
And, wherein at least a portion of the inner peripheral surface of the through hole formed in the insulating layer, or the like at least a portion of the inner peripheral surface of the insulation layer forming the bottom of the blind hole remains,
A conductive material removing step of forming an enlarged hole larger than the through hole or the bottomed hole in the substrate;
A method for manufacturing a housing member for measuring the characteristics of an electronic component, comprising: A plurality of openings are formed in the first main surface, and the opening is provided between the first main surface and the second main surface. A plurality of cavities communicating with each other are formed,
An insulating portion made of an insulating material and having the opening and the cavity formed therein;
And at least one of the first main surface, the second main surface, and the inner region sandwiched between the first main surface and the second main surface. A conductive portion disposed at a distance from the cavity and in contact with the insulating portion;
A method of manufacturing a housing member for measuring the characteristics of an electronic component, comprising:
A substrate preparation step of preparing a substrate on which the insulating layer made of the insulating material and the conductive layer made of the conductive material are laminated;
In the base material, a plurality of through holes penetrating all of the insulating layer and the conductive layer, or a plurality of bottomed holes penetrating the at least one conductive layer and having a bottom formed by the one insulating layer Forming a hole, and
After the hole forming step, for all the conductive layers in which the through hole or the bottomed hole is formed, the conductive material of the inner peripheral surface of the through hole or the bottomed hole and the surrounding portion is removed Conductive material removal process,
A method for manufacturing a housing member for measuring the characteristics of an electronic component, comprising: A plurality of openings are formed in the first main surface, and the opening is provided between the first main surface and the second main surface. A plurality of cavities communicating with each other are formed,
An insulating portion made of an insulating material and having the opening and the cavity formed therein;
And at least one of the first main surface, the second main surface, and the inner region sandwiched between the first main surface and the second main surface. A conductive portion disposed at a distance from the cavity and in contact with the insulating portion;
A method of manufacturing a housing member for measuring the characteristics of an electronic component, comprising:
A substrate preparation step of preparing a substrate on which the insulating layer made of the insulating material and the conductive layer made of the conductive material are laminated;
The base is formed with a plurality of through holes penetrating all of the insulating layer and the conductive layer, or at least one of the conductive layers, and a bottom is formed by the one insulating layer or the one conductive layer. Forming a plurality of bottomed holes,
After the hole forming process,
To cover the inner circumferential surface of the through hole, or
As the bottom covers the inner circumferential surface of the bottomed hole formed by one of the insulating layers, or
As the bottom covers the inner circumferential surface and the bottom of the bottomed hole formed by the one conductive layer,
A separation layer forming step of forming a separation layer made of the same or different insulating material as the insulating layer;
A method for manufacturing a housing member for measuring the characteristics of an electronic component, comprising:

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