JP6540963B2 - Receiving jig and manufacturing method of receiving jig - Google Patents

Description

  The present invention relates to a receiving jig for supporting an object having a convex shape (an electronic board on which a component is mounted, various industrial products, etc.) on the convex surface having the convex shape, a manufacturing method thereof, and It relates to resin.

  In the production of a substrate on which electronic components are mounted (hereinafter also referred to as a substrate), electronic components (hereinafter also referred to as components) are mounted on both sides of the substrate on a substrate generally used for high-performance electronic devices. It is done. In a substrate on which components are mounted on both sides, after the components are mounted on one side of the both sides, the components are mounted on the opposite side. When the component is mounted on the opposite surface, the mounted surface is supported by the receiving jig.

  FIG. 1A is a view showing an example of a substrate 100 on which a component 112 is mounted on one side.

  As shown in FIG. 1A, an object (substrate 100) having a convex shape (convex shape of component 112) is supported by a receiving jig on the convex surface (mounting surface 110 on which component 112 is mounted) having the convex shape. Be done. Thus, the component 112 is mounted on the opposite surface 120 while the opposite surface 120 on which the component 112 is not mounted is kept horizontal.

  At this time, it is necessary to prevent unnecessary stress (such as pressure or damage) from being applied to the mounted components 112 on the substrate 100. For example, as the receiving jig, one obtained by cutting a hard resin containing metal or carbon is used, and the mounted component 112 is prevented from coming into contact with the metal or the like constituting the receiving jig. Also, for example, when a support pin that supports the substrate 100 is used as a receiving jig, the tip end portion of the support pin may be a cushion such as a spring or rubber, or the tip portion disclosed in Patent Document 1 In this way, unnecessary stress is not applied to the mounted components 112.

Patent No. 5746763 gazette

  By the way, many objects such as the substrate 100 or various industrial products are absorbed by electrostatic charge, for example, destruction of the component 112 due to leakage current to the component 112 mounted on the substrate 100 or static electricity It is affected by static electricity such as contamination of the object by broken waste. Therefore, the receiving jig needs to have antistatic performance.

  In addition, when the object is supported by the receiving jig, it is necessary to prevent the object from being broken due to unnecessary contact with the object by the receiving jig. Therefore, the receiving jig needs to be configured to receive the object at a portion other than the fragile portion of the object, or to have flexibility so that the object is not subjected to stress even when hit by the receiving jig. Thus, there is a need for a receiving jig that is less susceptible to stress that may cause pressure or damage to an object. Here, the demerit of the receiving jig generally used is demonstrated.

  For example, a method of supporting an object by a support pin is a method often used as an object in mounting or inspection on a substrate 100 or the like.

  FIG. 1B is a side view showing the receiving jig 200 provided with the support pins 202 supporting the substrate 100. In FIG. 1B, only three of the components 112 mounted on the substrate 100 are shown.

  As shown in FIG. 1B, the substrate 100 is supported by the support pins 202 of the receiving jig 200 in the dead space between the adjacent parts 112. In order to support the substrate 100 by the support pins 202, it is necessary to support the substrate 100 at many points, and it is necessary to provide the substrate 100 with a large amount of dead space. However, for high-performance electronic devices in recent years, for example, in smartphones and the like, support for support pins 202 in the substrate 100 is achieved by increasing the density of mounting of the components 112 on the substrate 100 by reducing weight and size. Dead space tends to disappear. In addition, even for low-performance electronic devices, efforts are being made to reduce the area of the substrate 100 for cost reduction, and there is a tendency for dead space to be eliminated as with high-performance electronic devices.

  In addition, when the support pin 202 supports the object, distortion, inclination or vibration is easily generated in the object to support at the point, and an error is easily generated in the operation (mounting or inspection) performed on the object.

  In addition, when the substrate 100 or the like is supported by the support pins 202, warpage or the like may occur on the substrate 100, and the pressure caused by this may cause the electronic components mounted to malfunction.

  In addition, in the case where the support pin 202 supports the target, the support pin 202 must be set in accordance with the convex shape of the target (for example, the mounting position of the component 112 on the substrate 100). If a mistake occurs, the object becomes defective in the manufacturing process of the object, resulting in a loss. In addition, since the manufacturing process is in operation every day, it is difficult to visually manage the deterioration of the support pins 202. Therefore, the quality such as mounting failure due to deterioration of the components that make up the support pin 202 (for example, components such as spring or rubber at the tip of the support pin 202 for preventing damage to the object due to impact or pressure) It is difficult to suppress the occurrence of loss in advance.

  As described above, since the receiving jig 200 including the support pin 202 has the disadvantages as described above, the method using the receiving jig 200 including the support pin 202 is not used.

  On the other hand, when an object is supported using an NC (Numerical Control) machine tool with a metal (for example, aluminum) or a carbon-kneaded resin (a resin obtained by kneading carbon with ABS or the like), the convex shape of the object is not hit. There is a receiving jig having a machined hole which is cut to a large depth.

  FIG. 1C is a cross-sectional view showing a state in which the receiving jig 300 having the processing hole 302 supports the substrate 100 as an object. FIG. 1C shows a cross section of a portion where the three parts 112 of the substrate 100 are fitted in the processing holes 302.

  The receiving jig 300 is made of metal, carbon-containing hard resin or the like, and has no flexibility and is hard. Therefore, when the target is misaligned when the target is mounted on the receiving jig 300, the target is likely to be damaged or damaged. Therefore, the processing range of the processing hole 302 of the receiving jig 300 is wide. Therefore, the processing time becomes long, which causes an increase in the processing cost and an increase in the cost for quick delivery. At the time of prototyping of an object such as the substrate 100, the receiving jig 300 may be changed due to, for example, an increase in the part 112 or a change in the mounting position of the part 112, but cost and lead time are required for each change.

  In addition, a special processing machine is required for cutting. Since it is difficult in cost and know-how to install a cutting machine in its own factory, it will be outsourced to an outside company for production, and cost and lead time will be required.

  Further, as described above, since the cost for the receiving jig 300 is increased, it is more expensive to create the receiving jig 300 for each production of the target. Therefore, it is necessary to store the created receiving jig 300 for a long period of time, for example, requiring a large storage space in the factory.

  Further, when the receiving jig 300 is made of metal, it is heavy and difficult to handle. On the other hand, when the receiving jig 300 is made of a hard resin containing carbon in order to lighten the receiving jig 300, carbon is easily peeled off, carbon adheres to an object such as the substrate 100, and market defects such as short circuit occur. Sometimes.

  As described above, the receiving jig 300 cut by using metal or carbon-containing hard resin or the like has the disadvantage that it can not be easily created as described above and costs increase.

  Then, an object of this invention is to provide the manufacturing method and resin of the receiving jig which can be easily produced and can suppress the influence and the stress by the static electricity to the target object to support.

A receiving jig according to an aspect of the present invention is a receiving jig for supporting an object having a convex shape on a convex face having the convex shape, and from a resin having a concave portion corresponding to the contour of the convex shape. The concave portion has a concave shape obtained when the convex mold is taken, and the resin has a hardness of 60 degrees to 90 degrees according to an Asker C-type hardness meter, and a volume resistivity is It is resin which is 10 < ² > ohm * cm-10 < ⁷ > ohm * cm.

A method of manufacturing a receiving jig according to an aspect of the present invention is a method of manufacturing a receiving jig for supporting an object having a convex shape on a convex surface having the convex shape, and the convex surface is upward on a base. Placing the object so as to face the surface, covering at least one of a release film and a cloth from the convex side of the object placed on the base, the release film and the cloth A frame-shaped outer mold having a height higher than the height of the convex portion of the convex surface on the base so as to surround the target covered with at least one of the above in the top view of the target; In the step of installing and in the frame of the outer mold installed on the base, the hardness by Asker C-type hardness meter after curing becomes 60 degrees to 90 degrees, and the volume resistivity is 10 ² Ω · cm to 10 ^{7 Ω} The step of inserting a resin of cm, the step of pressing an inner mold having an outer diameter corresponding to the inner diameter of the outer mold in the frame of the outer mold containing the resin, the inner mold Heating the resin in a state of being pressed against the resin.

A manufacturing method of a receiving jig concerning one mode of the present invention is a manufacturing method of a receiving jig for supporting a target object which has convex shape in a convex surface which has the convex shape, and it is the above-mentioned target object on the base Installing a frame-like outer mold having an inner diameter surrounding the object in a top view, and within the frame of the outer mold installed on the base, the hardness by Asker C-type hardness meter after curing is from 60 degrees Inserting a resin having a degree of 90 ° and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm, and at least one of a release film and a cloth on the resin put in the frame of the outer mold. Placing the object such that the convex surface faces downward on at least one of the release film and the cloth, the release film being covered with the resin, and the object is the release film and the release film. Said cloth Pressing the inner mold having an outer diameter corresponding to the inner diameter of the outer mold against the object in the frame of the outer mold placed on at least one of the steps of heating the resin; Including.

  The resin according to one aspect of the present invention is a resin in which a conductive material is blended with one of a thermosetting resin and a thermoplastic resin, and the resin is used for one of the thermosetting resin and the thermoplastic resin. The weight part of the conductive material is 0.3 to 20 parts by weight.

  ADVANTAGE OF THE INVENTION According to this invention, the receiving jig which can be easily produced and can suppress the influence and stress by static electricity to the to-be-supported object can be provided, its manufacturing method, and resin used for these.

FIG. 1A is a view showing an example of a substrate on which components are mounted on one side. FIG. 1B is a side view showing a receiving jig provided with a support pin supporting a substrate. FIG. 1C is a cross-sectional view showing a state in which a receiving jig having a processing hole supports a substrate. FIG. 2 is a view showing an example of a receiving jig according to the embodiment. FIG. 3 is a view showing a state in which the receiving jig according to the embodiment supports the substrate. FIG. 4 is a cross-sectional view showing a state in which the receiving jig according to the embodiment supports the substrate. FIG. 5 is a flowchart showing an example of a method of manufacturing a receiving jig according to the embodiment. FIG. 6A is a diagram for explaining a placing step according to the embodiment. FIG. 6B is a view for explaining the covering step according to the embodiment. FIG. 6C is a diagram for explaining an installation step according to the embodiment. FIG. 6D is a diagram for explaining an inserting step according to the embodiment. FIG. 6E is a view for explaining a pressing step according to the embodiment. FIG. 7: is sectional drawing which shows the state which covered the release film on the board | substrate in the covering step which concerns on embodiment. FIG. 8 is a cross-sectional view showing the substrate in the covering step according to the embodiment with the release film and the cloth covered. FIG. 9 is a cross-sectional view showing a state in which the resin in the pressing step according to the embodiment is pressed against the release film and the cloth. FIG. 10A is a view showing an example of the compounding amount of the compounding material of the resin according to the embodiment. FIG. 10B is a view showing another example of the compounding amount of the compounding material of the resin according to the embodiment. FIG. 11A is a diagram showing the amount of the compounding material of the resin according to the example. FIG. 11B is a view showing conditions for curing the resin according to the example. FIG. 11C is a diagram showing the physical properties of the resin that constitutes the receiving jig according to the example.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a preferable specific example of the present invention. Accordingly, the numerical values, shapes, materials, components, arrangement and connection of components, and the order of steps (steps) and steps etc. shown in the following embodiments are merely examples, and the present invention is limited. is not. Therefore, among the components in the following embodiments, components that are not described in the independent claims indicating the highest concept of the present invention are described as optional components.

  Further, each drawing is a schematic view, and is not necessarily illustrated exactly. Moreover, in each figure, the same code | symbol is attached | subjected about the same component.

Embodiment
Hereinafter, embodiments will be described with reference to FIGS. 2 to 10B. In the following description, the object supported by the receiving jig is often described as the substrate 100, but the object is not limited to the substrate 100, and may be a workpiece or the like used in general manufacturing processes such as various industrial products. It may be.

[Receiving jig]
First, the configuration of the receiving jig will be described using FIGS. 2 to 4.

  FIG. 2 is a view showing an example of the receiving jig 10 according to the embodiment. In addition to the receiving jig 10, a substrate 100 supported by the receiving jig 10 is also shown in FIG. Although six components 112 are mounted on the substrate 100 shown in FIG. 2, one to five components 112 may be mounted, or seven or more components 112 may be mounted.

  The receiving jig 10 is a receiving jig for supporting an object having a convex shape on the convex surface having the convex shape. In the present embodiment, the object is a substrate on which at least one component 112 is mounted, and the convex shape is a shape of the component 112 mounted on the substrate 100. Therefore, the receiving jig 10 supports the substrate 100 on the mounting surface 110 on which the component 112 is mounted. The target is not limited to the substrate 100, but may be a workpiece used in a general manufacturing process such as various industrial products.

The receiving jig 10 is made of resin having a recess 12 corresponding to the contour of the convex shape (convex shape of the part 112). That is, the receiving jig 10 itself is a resin. This resin will be described in detail with reference to FIGS. 10A and 10B described later, but the hardness by the Asker C-type hardness tester is 60 degrees to 90 degrees, and the volume resistivity is 10 ² Ω · cm to 10 ⁷ Ω · It is a resin that is cm. In other words, this resin is a resin having high conductivity and flexibility. The concave portion 12 has a concave shape obtained when a mold having a convex shape (convex shape of the part 112) is taken. The recess 12 is not formed by cutting, but is formed by taking a mold of the component 112 in a state of being mounted on the mounting surface 110. Thus, as shown in FIG. 2, the recess 12 has a concave shape corresponding to the contour of the part 112. Thus, when the substrate 100 is set to the receiving jig 10 with the mounting surface 110 facing the receiving jig 10, the receiving jig 10 has the part 112 on the mounting surface 110 fitted in the recess 12. In the state, the substrate 100 is supported.

  FIG. 3 is a view showing a state in which the receiving jig 10 according to the embodiment supports the substrate 100. As shown in FIG.

  As shown in FIG. 3, the receiving jig 10 supports the substrate 100 on the mounting surface 110 to mount the component 112 on the opposite surface 120 of the mounting surface 110 or inspect the substrate 100 on the opposite surface 120. And so on. In addition, since the receiving jig 10 supports the multiple chamfered substrate, the multiple chamfered substrate can be divided.

  FIG. 4 is a cross-sectional view showing a state in which the receiving jig 10 according to the embodiment supports the substrate 100. As shown in FIG. FIG. 4 shows a cross section in the IV-IV plane shown in FIG.

  Since the recess 12 is formed by taking a mold of the part 112, the receiving jig 10 supports the substrate 100 while wrapping the part 112 in the recess 12, as shown in FIG. Further, as shown in FIGS. 2 and 4, the recess 12 has a bottom surface smaller than the opening of the recess 12 and has a wall surface inclined from the opening to the bottom surface. That is, the recess 12 has an inverted frustum shape. The recess 12 may have an inverted truncated pyramid shape or an inverted truncated cone shape depending on the shape of the component 112. For example, the bottom surface of the recess 12 is the same size as the top surface of the component 112 fitted in the recess 12 (the lower surface of the component 112 in FIGS. 2 and 4), and the recess 12 extends from the bottom to the opening It has an expanding shape.

Thus, the receiving jig 10 is made of a resin having a hardness of 60 degrees to 90 degrees by an Asker C hardness tester and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm. It is not a tool which is obtained by cutting but has a concave portion 12 which is obtained by taking a mold of a convex shape of an object.

[Method of manufacturing receiving jig]
Next, a method of manufacturing the receiving jig 10 having the concave portion 12 in which the convex shape of the object is taken will be described with reference to FIGS. 5 to 9, in particular, a method of taking the convex shape of the object.

  FIG. 5 is a flowchart showing an example of a method of manufacturing the receiving jig 10 according to the embodiment. In addition, although a person performs the manufacturing method of receiving jig 10 below, for example, the machine for manufacturing receiving jig 10 may carry out. Further, details of steps S11 to S15 will be described with reference to FIGS. 6A to 6E, but in FIGS. 6A to 6E, the object, the convex surface and the convex portion are the substrate 100 shown in FIG. The surface 110 and the part 112 are used.

  First, the object is placed on the base so that the convex surface of the object faces upward (step S11). Step S11 will be described using FIG. 6A.

  FIG. 6A is a diagram for explaining a placing step according to the embodiment.

  As shown in FIG. 6A, the base 50 has, for example, a substantially rectangular parallelepiped shape, and the substrate 100 is mounted on the surface of the base 50. At this time, the substrate 100 is mounted on the base 50 such that the mounting surface 110 which is a surface supported by the receiving jig 10 faces upward.

  Next, at least one of the release film and the cloth is covered from the convex side of the object placed on the base 50 (step S12). Step S12 will be described using FIG. 6B.

  FIG. 6B is a view for explaining the covering step according to the embodiment. In FIG. 6B, the state where the release film 20 is covered on the substrate 100 is shown.

  The release film 20 used in step S12 needs to be a film satisfying a plurality of conditions shown below. Although details will be described later, since the receiving jig 10 is formed by taking a mold through the release film 20, the surface of the receiving jig 10 is the release film 20 when the release film 20 stretches or contracts. It has a wavy shape due to the expansion and contraction of the Therefore, the release film 20 needs to be a film with a small amount of expansion and contraction due to heat and pressure. Further, when the resin put in step S14 described later adheres to the mold release film 20, the shape of the receiving jig 10 such as the concave portion 12 may be broken when the mold release film 20 and the resin are peeled off. The mold film 20 needs to be a film that is difficult to stick. In addition, when the resin penetrates the release film 20, it contaminates the object, and therefore, the release film 20 needs to be a film to which the resin does not easily penetrate. In addition, the release film 20 needs to be a film that can withstand the heating of the resin in step S16 described later. The heat resistance temperature of the release film 20 is preferably about 100 degrees to about 400 degrees, and more preferably 200 degrees or more. In addition, the release film 20 needs to be a film that can clearly take the mold of the component 112 on the mounting surface 110 via the release film 20. In addition, the cloth which satisfy | fills the conditions mentioned above instead of the mold release film 20 by step S12 may be used.

  As the release film 20 which satisfy | fills these conditions, the film etc. which coated the release agent on a fluororesin film, a silicone resin film, or a heat-resistant film are used. When the mold release film 20 is not covered with the substrate 100 and a resin is introduced, the substrate 100 is contaminated by the resin, and adheres to the substrate 100 when the resin is cured. In order to prevent these, the release film 20 is placed on the substrate 100. Step S12 will be described in more detail in FIG. 7 described later.

  Next, a frame-shaped outer portion whose height with respect to the base 50 is higher than the height of the convex portion of the convex surface so as to surround the object covered with at least one of the release film 20 and the cloth in a top view of the object The mold is placed on the base 50 (step S13). Step S13 will be described using FIG. 6C.

  FIG. 6C is a diagram for explaining an installation step according to the embodiment.

  In step S13, in order to copy the shape of the component 112 mounted on the mounting surface 110 of the substrate 100 with the resin inserted in step S14, the outer mold 60 which is a frame-like mold is used. The outer mold 60 has, for example, a rectangular cylindrical shape, and the size in the frame of the outer mold 60 in top view is approximately the same as or slightly larger than the size of the substrate 100, so the substrate 100 can be surrounded by the outer mold 60 . As shown in FIG. 6C, the outer mold 60 is placed on the base 50 while surrounding the substrate 100. The height from the base 50 of the outer mold 60 when the outer mold 60 is installed on the base 50 is higher than the height from the base 50 of the component 112 when the substrate 100 is mounted on the base 50. Thereby, when the resin is put in the frame of the outer mold 60, the top surface of the component 112 can be dipped in the resin.

  Next, the resin is put in the frame of the outer mold 60 installed on the base 50 (step S14). Step S14 will be described using FIG. 6D.

  FIG. 6D is a diagram for explaining an inserting step according to the embodiment.

As shown in FIG. 6D, the resin 40 is placed on the release film 20 in the frame of the outer mold 60. The resin 40 is a resin having a hardness of 60 degrees to 90 degrees according to an Asker C-type hardness meter and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm after hardening. The resin 40 is, for example, a liquid resin. The amount in which the resin 40 is contained is an amount corresponding to a volume of 20% to 95% of the volume in the frame of the outer mold 60. The resin 40 may be plate-like, particulate (particle size is not particularly limited), pellet-like or gel-like resin. When the resin 40 is in the form of particles, more resin 40 is added than when the resin 40 is in the form of gel. The resin 40, which will be described in detail later, is cured in a state in which the recess 12 corresponding to the contour of the convex shape of the object is formed when the receiving jig 10 is formed.

  Next, in the frame of the outer mold 60 containing the resin 40, the inner mold having an outer diameter corresponding to the inner diameter of the outer mold 60 is pressed against the resin 40 (step S15). Step S15 will be described using FIG. 6E.

  FIG. 6E is a view for explaining a pressing step according to the embodiment.

  As shown in FIG. 6E, an inner mold 70 having an outer diameter matched to the inner diameter of the outer mold 60 is used, and the outer shape is used to define the convex shape of the part 112 of the substrate 100 when the resin 40 is cured. Pressure is applied to the resin 40 from the upper side by the inner mold 70 in the frame of the mold 60. For example, a lid 80 is provided on the upper portion of the inner mold 70. The size of the lid 80 in top view is, for example, a size corresponding to the outer diameter of the outer mold 60. Step S15 will be described in more detail in FIG. 9 described later.

  In addition, as the base 50, the outer mold 60, and the inner mold 70 (these are also collectively referred to as a mold), deformation such as metal or wood is small even in a temperature environment of 80 degrees or more, and no burning, burning or contamination occurs. The material is used. In addition, the mold is subjected to non-adhesive surface treatment so as not to stick to the mold when the resin 40 put in step S14 is cured. The non-adhesive surface treatment is, for example, a fluorine resin coating treatment, a silicone resin coating treatment, a non-adhesive composite coating treatment, or the like. The thickness of the non-adhesive surface treatment is, for example, a thickness of 200 μm or less.

  Next, in a state where the inner mold 70 is pressed against the resin 40, the resin 40 is heated (step S16). When the resin 40 is a thermosetting resin, for example, a liquid resin, it is cured by being heated. The resin 40 is heated, for example, at a temperature of 70 degrees to 360 degrees in accordance with the heat resistance temperature of the substrate 100 and the like. Moreover, according to heating temperature, it heats, for example for 10 to 70 minutes. The relationship between the heating time and the heating temperature is, for example, about 60 minutes at 100 to 120 degrees and about 30 minutes at 200 to 260 degrees, but there is fluctuation in the environment around the furnace body. The heating temperature and the heating time are controlled by the type of the curing agent and the like contained in the resin 40.

  In the case where the resin 40 is a resin having thermoplasticity and is, for example, a plate-like, particulate or pellet-like resin, the resin 40 is heated and semi-melted (including softening) in a state where the inner mold 70 is pressed against the resin 40 ) And then cooled, for example, at room temperature.

  The heating furnace for heating the resin 40 may be a reflow furnace for mounting electronic components. The heating furnace is not particularly limited as long as it is an apparatus capable of heating the resin 40.

  In the case where the resin 40 is a resin having thermoplasticity and is, for example, a plate-like, particulate or pellet-like resin, the resin 40 is heated and semi-melted before being inserted into the frame of the outer mold 60 before the putting step. It may be inserted. In this case, the resin 40 is cooled and cured, for example, at normal temperature in a state where the inner mold 70 is pressed against the resin 40 instead of step S16.

  Then, the cured resin 40 is taken out of the mold, and the cured resin 40 becomes the receiving jig 10.

  Here, the details of step S12 will be described with reference to FIG.

  FIG. 7 is a cross-sectional view showing a state in which the release film 20 is covered on the substrate 100 in the covering step according to the embodiment. FIG. 7 shows a cross section where three parts 112 on the front side of FIG. 6B are arranged. 7 and the following figures will be described using the substrate 100, the mounting surface 110, and the component 112 shown in FIG.

  In order to make the mold of the part 112 on the mounting surface 110 clear also through the mold release film 20, the mold release film 20 placed on the substrate 100 is inserted between the parts 112 as shown in FIG. There is a need. In order for the release film 20 to enter between the parts 112, the release film 20 should be thin and easily bent, and the thickness of the release film 20 is, for example, 25 μm to 500 μm. A cloth may be used instead of the release film 20. The thickness of the cloth is, for example, 500 μm to 1000 μm.

  Further, as shown in FIG. 7, the release film 20 is placed on the substrate 100 while the space 22 is provided on the outside of the side surface of the component 112. That is, the release film 20 is put on the substrate 100 so that the side surface of the component 112 and the release film 20 do not contact each other. Thereby, the part which encloses the components 112 of the release film 20 becomes frustum shape. Therefore, as described in FIG. 4, the recess 12 has an inverted frustum shape formed by taking a frustum shape.

  The release film 20 to be placed on the substrate 100 may be one or more. In order to reduce the expansion and contraction of the release film 20 due to the heating in step S16, a plurality of types of films having different properties may be laminated on the substrate 100. Alternatively, the release film 20 of the same property may be laminated on the substrate 100. Even when a cloth is used instead of the release film 20, the cloth covered on the substrate 100 may be one or plural. In order to reduce the expansion and contraction of the cloth due to the heating in step S16, plural types of cloth having different properties may be laminated on the substrate 100. Also, a cloth of the same nature may be laminated to the substrate 100.

  Alternatively, both the release film 20 and the cloth may be covered on the substrate 100.

  FIG. 8 is a cross-sectional view showing a state in which the release film 20 and the cloth 30 are covered on the substrate 100 in the covering step according to the embodiment. FIG. 8 shows a cross section at a position where three parts 112 on the near side of FIG. 6B are lined up when both the release film 20 and the cloth 30 are covered on the substrate 100.

  The resin 40 may shrink after being cured. That is, the size of the recess 12 of the receiving jig 10 may be reduced. Then, the cloth 30 having a thickness matched to the amount of contraction of the resin 40 is put on the substrate 100. When both the release film 20 and the cloth 30 are covered on the substrate 100, the release film 20 may be covered after the cloth 30 is covered on the substrate 100. As a result, it is not necessary to use a cloth having the property that the resin 40 does not easily stick as the cloth 30.

  The details of step S15 will be described with reference to FIG.

  FIG. 9 is a cross-sectional view showing a state in which the resin 40 is pressed against the release film 20 and the cloth 30 in the pressing step according to the embodiment. In FIG. 9, the screw 90 and the spring 92 which are not shown in FIG. 6E are shown. The screws 90 are provided, for example, through the lid 80 at four corners in a top view of the lid 80, and the spring 92 is provided between the lid 80 and the screw head of the screw 90. In FIG. 9, for the purpose of explanation, the cross section of the place where three parts 112 are lined up and the place where the screw 90 and the spring 92 are provided is shown on one drawing.

  When the inner mold 70 is pressed against the resin 40 in the frame of the outer mold 60, the gas in the frame of the outer mold 60 needs to be released, and as shown in FIG. A clearance a is provided between the mold 70 and the outer peripheral surface thereof. However, in order to prevent the resin 40 from entering the clearance a, the resin 40 is pressed against the inner mold 70 in a state where the clearance a is 50 μm to 300 μm. The size of the clearance a is selected from the above range depending on the viscosity of the resin 40 and the like.

  Also, for example, since mounting or inspection is performed on the substrate 100 while the substrate 100 is supported by the receiving jig 10, the surface supporting the mounting surface 110 of the receiving jig 10 and the opposite surface are horizontal. It needs to be. Therefore, when the receiving jig 10 is formed, the resin 40 needs to be pressed against the inner mold 70 in a state in which the bottom surface of the inner mold 70 is horizontal to the surface of the base 50 on which the substrate 100 is mounted. In addition, when the resin 40 is heated while being pressed against the inner die 70, it is necessary to maintain the level of each surface.

  Although the method of keeping each surface horizontal is not particularly limited, for example, a screw, a ball screw, a belt, a weight, a spring or the like is used. In FIG. 9, screws 90 and springs 92 are used to keep the faces horizontal. By screwing into the outer mold 60 while adjusting the screwing amount of the plurality of screws 90 (for example, screws 90 provided at the four corners of the lid 80) passing through the lid 80, the respective surfaces are kept horizontal. The resin 40 is pressed against the inner die 70. At this time, a helical spring 92 is used as a buffer between the screw head of the screw 90 and the lid 80. This further improves the horizontal accuracy.

As described above, the target is made of a resin that has a hardness of 60 to 90 degrees according to Asker C hardness tester and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm. A receiving jig 10 having a concave portion 12 obtained by taking a mold of a convex shape of the object as the object is produced. The receiving jig 10 can be cut by a router or the like, and the shape of the recess 12 can be easily corrected after the receiving jig 10 is formed.

[resin]
Next, the resin constituting the receiving jig 10 and the resin 40 used in the method of manufacturing the same will be described with reference to FIG. 10A.

  FIG. 10A is a diagram showing an example of the compounding amount of the compounding material of the resin 40 according to the embodiment.

The resin 40 is a resin in which at least a conductive material is blended in one of a thermosetting resin and a thermoplastic resin (uniform dispersion blending: hereinafter, also referred to as uniform blending). As shown in FIG. 10A, the weight part of the conductive material is 0.3 to 20 parts by weight with respect to one of the thermosetting resin and the thermoplastic resin. Thus, the resin 40 becomes a resin having a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm after curing.

  The thermosetting resin is, for example, an epoxy resin, a urethane resin, a silicone resin, a fluorine resin, a polyimide resin, an acrylic resin or a phenol resin.

  The thermoplastic resin is, for example, low molecular weight polyethylene resin, thermoplastic urethane resin, vinyl chloride resin, polypropylene resin, acrylonitrile styrene resin, styrene resin, acrylic resin, methacrylic resin, polyethylene terephthalate resin, polyvinylidene chloride resin, polyvinylidene fluoride, It is a polyamide resin, an acetal resin, a polycarbonate resin or a polybutylene terephthalate resin.

  In addition, the conductive material is a carbon allotrope including carbon nanotubes, graphene or graphite.

  Next, a more specific compounding material of the resin 40 will be described using FIG. 10B.

  FIG. 10B is a view showing another example of the blending amount of the blending material of the resin 40 according to the embodiment.

As shown in FIG. 10B, when an epoxy resin is included as a compounding material of the resin 40, the resin 40 is formed by blending a carbon allotrope, which is a conductive material, a curing agent and a curing accelerator in the epoxy resin. The weight part of the curing agent is 100 parts by weight to 800 parts by weight, and the weight part of the curing accelerator is 1 part by weight to 20 parts by weight with respect to the thermosetting resin (epoxy resin). Thus, the resin 40 becomes a resin having a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm after heat curing and a hardness of 60 ° to 90 ° according to an Asker C-type hardness meter.

  The curing agent is an acid anhydride compound, a diamine compound, or a dialcohol compound.

  The curing accelerator is an amine compound.

  The resin 40 thus blended becomes the receiving jig 10 by being heated and cured by the above-described method of manufacturing the receiving jig 10.

(Example)
Next, Examples 1 to 3 of manufacturing the receiving jig 10 will be described with reference to FIGS. 11A to 11C.

  FIG. 11A is a view showing the compounding amount of the compounding material of the resin 40 according to the example. The epoxy resin (flexible epoxy resin) shown in FIG. 11A is an epoxy resin in the case of Example 1, and shows that it is a flexible epoxy resin in the case of Examples 2 and 3.

  In Example 1, the thermosetting resin (epoxy resin) is a bisphenol F-type epoxy resin. The curing agent is a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethyl phthalic anhydride. The curing accelerator is 1.8 azabicycloundecene. The conductive material is a multi-walled carbon nanotube.

  In Example 2, the thermosetting resin (flexible epoxy resin) is a mixture in which a bisphenol F-type epoxy resin and a modified epoxy resin are mixed. The curing agent is a polyacid polyanhydride having long chain alkyl groups. The curing accelerator is 1.8 azabicycloundecene. The conductive material is a multi-walled carbon nanotube.

  In Example 3, the thermosetting resin (flexible epoxy resin) is a mixture in which a bisphenol F-type epoxy resin and a modified epoxy resin are mixed. The curing agent is a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethyl phthalic anhydride. The curing accelerator is 1.8 azabicycloundecene. The conductive material is a multi-walled carbon nanotube.

  The resin 40 is a resin that contains the compounding materials described above in Examples 1 to 3 and is compounded in the compounding amounts shown in FIG. 11A.

  Next, hardening conditions of resin 40 in Examples 1-3 are shown in Drawing 11B.

  FIG. 11B is a view showing conditions when the resin 40 according to the example is cured.

  As shown in FIG. 11B, in the heating steps (step S16) in Examples 1 to 3, all curing was performed under the same conditions. In Examples 1 to 3, the resin 40 was cured by heating for 60 minutes at a temperature of 120 ° C. in a thermostat.

  In Examples 1 to 3, aluminum was used as the material of the mold (the base 50, the outer mold 60, and the inner mold 70) because of its light weight, low cost, and good processability. In addition, as a non-adhesive surface treatment to the mold, a fluorine resin coating treatment was performed with a thickness of 100 μm or less.

  Further, in the covering step (Step S12) in Examples 1 to 3, the fluororesin film (heat resistance temperature 220 degrees) and the cloth 30 were covered as the release film 20.

  Next, FIG. 11C shows the physical properties of the resin constituting the receiving jig 10 manufactured under the conditions of Examples 1 to 3 described with reference to FIGS. 11A and 11B.

  FIG. 11C is a diagram showing the physical properties of the resin that constitutes the receiving jig 10 according to the example.

As shown in FIG. 11C, in Examples 1 to 3, as the physical properties of the resin constituting the receiving jig 10, the volume resistivity is 10 ² Ω · cm to 10 ⁷ Ω · cm, and the Asker C type The hardness measured by the hardness tester is 60 degrees to 90 degrees.

[Effects, etc.]
The receiving jig 10 according to the present embodiment is a receiving jig for supporting an object having a convex shape on the convex surface having the convex shape, and a resin having a concave portion 12 corresponding to the contour of the convex shape. It consists of The recess 12 has a concave shape obtained when the convex mold is taken. The resin is a resin having a hardness of 60 degrees to 90 degrees and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm, as measured by an Asker C-type hardness meter.

Thereby, receiving jig 10 is easily created only by taking a mold compared with a support pin or a receiving jig by cutting. Further, since the receiving jig 10 is made of a flexible resin having a hardness of 60 degrees to 90 degrees according to an Asker C-type hardness meter, the target jig supported by the receiving jig 10 may be damaged or stressed. Absent. Furthermore, since the receiving jig 10 has the recessed part 12 which took the shape of an object, it supports an object so that it may wrap including the convex shape of an object. Therefore, for example, in component mounting when the object is the substrate 100 or the like, the printing accuracy and component mounting accuracy of solder or the like can be enhanced, and the substrate 100 can be made high in quality. Furthermore, since the receiving jig 10 is made of a resin having a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm, even when the object is the substrate 100 or the like on which the component 112 is mounted, the leakage current due to static electricity Can be suppressed, and the contamination of objects with dust can be suppressed. As described above, it is possible to provide the receiving jig 10 which can be easily manufactured and can suppress the influence and the stress due to the static electricity to the object to be supported.

  Also, the object is a substrate 100 or a workpiece on which at least one component 112 is mounted.

  Thereby, the influence and stress by static electricity to the workpiece used by general manufacturing processes, such as substrate 100 or various industrial production goods, as a subject can be controlled. In the case where the object is the substrate 100, the substrate 100 is supported on the mounting surface 110 on which the component 112 is mounted, and the influence and stress due to static electricity on the object are suppressed and the opposite surface 120 of the mounting surface 110 is easily Parts can be mounted. In addition, inspection of the substrate 100 can be easily performed on the opposite surface 120 of the substrate 100. In the case where the substrate 100 is a multiple substrate, the substrate 100 can be easily divided.

  The recess 12 has a bottom surface smaller than the opening of the recess 12 and has a wall surface inclined from the opening to the bottom surface.

  As a result, the convex shape of the object is fitted in the recess 12 so that the inclined wall surface of the recess 12 slides from the opening side to the bottom side, so the object can be easily set in the receiving jig 10.

  Further, the resin constituting the receiving jig 10 is a resin in which a conductive material is blended in one of a thermosetting resin and a thermoplastic resin, and the resin is made to one of the thermosetting resin and the thermoplastic resin. The weight part of the conductive material is 0.3 to 20 parts by weight.

Thereby, the volume resistivity of resin which comprises receiving jig 10 can be 10 < ² > ohm * cm-10 < ⁷ > ohm * cm.

  The thermosetting resin is an epoxy resin, a urethane resin, a silicone resin, a fluorine resin, a polyimide resin, an acrylic resin or a phenol resin. As the thermoplastic resin, low molecular weight polyethylene resin, thermoplastic urethane resin, vinyl chloride resin, polypropylene resin, acrylonitrile styrene resin, styrene resin, acrylic resin, methacrylic resin, polyethylene terephthalate resin, polyvinylidene chloride resin, polyvinylidene fluoride, polyamide resin Acetal resin, polycarbonate resin or polybutylene terephthalate resin. The conductive material is a carbon allotrope including carbon nanotubes, graphene or graphite.

  Thereby, resin which comprises receiving jig 10 can be chosen from the above-mentioned material, and can be blended. Further, since the conductive material is a carbon allotrope such as carbon nanotubes, graphene or graphite, the strength against peeling is higher than in the case where the resin constituting the receiving jig 10 is a carbon-containing resin. Therefore, it is difficult to generate dust due to peeling of carbon, and when the object is the substrate 100 or the like, it is possible to suppress the occurrence of market defects such as an unnecessary short circuit on the substrate 100 due to the dust.

  Moreover, resin which comprises the receiving jig 10 is resin which mix | blended the electrically conductive material, the hardening | curing agent, and the hardening accelerator with the epoxy resin as a thermosetting resin. The curing agent is an acid anhydride compound, a diamine compound or a dialcohol compound, and the curing accelerator is an amine compound. The weight part of the curing agent is 100 parts by weight to 800 parts by weight, and the weight part of the curing accelerator is 1 part by weight to 20 parts by weight with respect to the thermosetting resin.

  Thus, when one of the thermosetting resin and the thermoplastic resin is an epoxy resin, the above-described curing agent and curing accelerator are blended to make the resin constituting the receiving jig 10 flexible. It can be made into resin which has the property. In addition, by blending 100 parts by weight to 800 parts by weight of the curing agent and 1 part by weight to 20 parts by weight of the curing accelerator, Asker C-type hardness of the resin constituting the receiving jig 10 The hardness by measurement can be made 60 degrees to 90 degrees.

  The epoxy resin is a bisphenol F-type epoxy resin. The epoxy resin is a flexible epoxy resin in which a bisphenol F-type epoxy resin and one of an aliphatic epoxy resin and a modified epoxy resin are mixed. The curing agent is a polyacid polyanhydride having a long chain alkyl group, or a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethyl phthalic anhydride. In addition, the curing accelerator is 1.8 azabicycloundecene. In addition, the conductive material is a multi-walled carbon nanotube.

  As a result, the characteristics of the resin constituting the receiving jig 10 can be made as shown in FIG. 11C.

The manufacturing method of the receiving jig 10 which concerns on this Embodiment is a manufacturing method of the receiving jig for supporting the target object which has convex shape in the convex surface which has convex shape. In the manufacturing method, the object is placed on the base 50 with the convex surface facing upward, and at least one of the release film 20 and the cloth 30 from the convex side of the object placed on the base 50 And c. Further, in the manufacturing method, the height with respect to the base 50 is higher than the height of the convex shaped portion of the convex surface so as to surround the object covered with at least one of the release film 20 and the cloth 30 in top view of the object. Installing the tall frame-shaped outer mold 60 on the base 50; In the manufacturing method, the hardness by the Asker C-type hardness meter after curing becomes 60 degrees to 90 degrees and the volume resistivity is 10 ² Ω · cm in the frame of the outer mold 60 installed on the base 50 Including the step of putting in the resin 40 to be 10 ⁷ Ω · cm. Further, the manufacturing method includes the steps of: pressing the inner mold 70 having an outer diameter corresponding to the inner diameter of the outer mold 60 against the resin 40 within the frame of the outer mold 60 containing the resin 40; and heating the resin 40 And.

Thereby, the receiving jig 10 can be easily produced only by taking the mold compared with the support pin or the receiving jig by cutting. Further, since the receiving jig 10 is made of a flexible resin having a hardness of 60 degrees to 90 degrees according to an Asker C-type hardness meter, the target jig supported by the receiving jig 10 may be damaged or stressed. Absent. Furthermore, since the receiving jig 10 has the recessed part 12 which took the shape of an object, it supports an object so that it may wrap including the convex shape of an object. Therefore, for example, in component mounting when the object is the substrate 100 or the like, the printing accuracy and component mounting accuracy of solder or the like can be enhanced, and the substrate 100 can be made high in quality. Furthermore, since the receiving jig 10 is made of a resin having a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm, even when the object is the substrate 100 on which the component 112 is mounted, the leakage current due to static electricity is It can control and can control the pollution by the rubbish to the object. As described above, it is possible to provide the receiving jig 10 which can be easily manufactured and can suppress the influence and the stress due to the static electricity to the object to be supported. Moreover, since the convex-shaped type | mold of a target object is taken via the mold release film 20 or the cloth 30, it can suppress that a target object is contaminated by resin 40. FIG.

  Further, in the heating step, the resin 40 is heated in a state in which the inner mold 70 is pressed against the resin 40 after the pressing step. In the heating step, the resin 40 may be heated before the putting step, and in the putting step, the heated resin 40 may be put in the frame of the outer mold 60.

  Thereby, in the process of manufacturing receiving jig 10, receiving jig 10 can be created even if the order of heating resin 40 is changed.

  Also, the object is a substrate 100 or a workpiece on which at least one component 112 is mounted.

  Thereby, the receiving jig 10 which can suppress the influence and the stress by the static electricity to the workpiece used by general manufacturing processes, such as the board | substrate 100 or various industrial products etc., as a target object can be created.

  In addition, the release film 20 is a film in which a release agent is coated on a fluorine resin film, a silicon resin film, or a heat resistant film.

  As a result, the amount of expansion and contraction due to heat and pressure of the release film 20 is reduced, so that the surface of the receiving jig 10 is prevented from being corrugated due to the expansion and contraction of the release film 20. Further, since the cured resin 40 does not easily adhere to the release film 20, the shape of the receiving jig 10 such as the recess 12 is prevented from being broken when the release film 20 and the cured resin are peeled off. Moreover, since it becomes difficult for the resin 40 to penetrate the release film 20, contamination of the object is further suppressed. In addition, the release film 20 can withstand the heating temperature when heating the resin 40. In addition, the mold of convex shape on the convex surface of the object can be clearly taken even through the release film 20.

  The outer mold 60 and the inner mold 70 are molds coated with fluorine resin, silicon resin or non-adhesive composite.

  This makes it difficult for the cured resin 40 to adhere to the outer mold 60 and the inner mold 70, so that the shape of the receiving jig 10 may be broken when the outer mold 60 and the inner mold 70 and the cured resin 40 are peeled off. Be suppressed.

  In the pressing step, the inner die 70 is pressed in a state where the clearance a between the inner peripheral surface of the outer die 60 and the outer peripheral surface of the inner die 70 is 50 μm to 300 μm.

  Thereby, it is possible to suppress the resin 40 from entering the clearance a while removing the gas when the inner die 70 is pressed.

  In the heating step, the resin 40 is heated at a temperature of 70 degrees to 360 degrees.

Thus, the resin 40 is heated at a temperature of 70 to 360 degrees, so that the resin 40 is cured if it is a thermosetting resin, and it is partially melted if the resin 40 is a thermoplastic resin. Then it is cooled and cured. After curing, the resin 40 becomes a resin having a hardness of 60 to 90 degrees and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm, as measured by an Asker C hardness meter.

  Further, the resin 40 is a resin in which a conductive material is blended in one of a thermosetting resin and a thermoplastic resin, and the weight part of the conductive material with respect to one of the thermosetting resin and the thermoplastic resin. Is 0.3 to 20 parts by weight.

Thereby, the volume resistivity of the resin 40 can be 10 ² Ω · cm to 10 ⁷ Ω · cm.

  The thermosetting resin is an epoxy resin, a urethane resin, a silicone resin, a fluorine resin, a polyimide resin, an acrylic resin or a phenol resin. As the thermoplastic resin, low molecular weight polyethylene resin, thermoplastic urethane resin, vinyl chloride resin, polypropylene resin, acrylonitrile styrene resin, styrene resin, acrylic resin, methacrylic resin, polyethylene terephthalate resin, polyvinylidene chloride resin, polyvinylidene fluoride, polyamide resin Acetal resin, polycarbonate resin or polybutylene terephthalate resin. The conductive material is a carbon allotrope including carbon nanotubes, graphene or graphite.

  Thereby, the resin 40 can be selected from the above materials and blended. Further, since the conductive material is a carbon allotrope such as carbon nanotubes, graphene or graphite, the strength against peeling is higher than in the case where the resin constituting the receiving jig 10 is a carbon-containing resin. Therefore, it is difficult to generate dust due to peeling of carbon, and when the object is the substrate 100 or the like, it is possible to suppress the occurrence of market defects such as an unnecessary short circuit on the substrate 100 due to the dust.

  Further, the resin 40 is a resin obtained by blending a conductive material, a curing agent and a curing accelerator into an epoxy resin as a thermosetting resin. The curing agent is an acid anhydride compound, a diamine compound or a dialcohol compound, and the curing accelerator is an amine compound. The weight part of the curing agent is 100 parts by weight to 800 parts by weight, and the weight part of the curing accelerator is 1 part by weight to 20 parts by weight with respect to the thermosetting resin.

  Thus, when one of the thermosetting resin and the thermoplastic resin is an epoxy resin, the above-described curing agent and curing accelerator are blended to make the resin constituting the receiving jig 10 flexible. It can be made into resin which has the property. In addition, by blending 100 parts by weight to 800 parts by weight of the curing agent and 1 part by weight to 20 parts by weight of the curing accelerator, Asker C-type hardness of the resin constituting the receiving jig 10 The hardness by measurement can be made 60 degrees to 90 degrees.

  The epoxy resin is a bisphenol F-type epoxy resin.

  The epoxy resin is a flexible epoxy resin in which a bisphenol F-type epoxy resin and one of an aliphatic epoxy resin and a modified epoxy resin are mixed.

  The curing agent is a polyacid polyanhydride having a long chain alkyl group, or a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethyl phthalic anhydride.

  In addition, the curing accelerator is 1.8 azabicycloundecene.

  In addition, the conductive material is a multi-walled carbon nanotube.

  By these, the characteristic of resin which constitutes receiving jig 10 can be made into a characteristic as shown in Drawing 11C.

(Other embodiments)
As mentioned above, although receiving jig 10 concerning an embodiment and an example, a manufacturing method of receiving jig 10, and resin 40 were explained, the present invention is not limited to the above-mentioned embodiment etc.

  For example, although receiving jig 10 was created by the method shown in steps S11 to S16 described above in which resin 40 is pressed against the object placed on base 50, the invention is not limited thereto. For example, the receiving jig 10 may be created by the method described below.

First, a frame-like outer mold 60 having an inner diameter that surrounds the target in top view of the target is placed on the base 50. Next, in the frame of the outer mold 60 installed on the base 50, the hardness by the Asker C-type hardness meter after hardening becomes 60 degrees to 90 degrees, and the volume resistivity is 10 ² Ω · cm to 10 ⁷ Ω -Put resin 40 which will be cm. Next, at least one of the mold release film 20 and the cloth 30 is covered on the resin 40 placed in the frame of the outer mold 60. Next, the object is placed on at least one of the release film 20 and the cloth 30 which is covered with the resin 40 so that the convex surface is directed downward. Then, in the frame of the outer mold 60 on which the object is placed on at least one of the release film 20 and the cloth 30, the inner mold 70 having an outer diameter corresponding to the inner diameter of the outer mold 60 is pressed against the object . Next, the resin 40 placed in the frame of the outer mold 60 is heated while the inner mold 70 is pressed against the object. The temperature at which the resin 40 is heated is a temperature of 70 degrees to 360 degrees. Further, the inner die 70 is pressed in a state where the clearance a between the inner peripheral surface of the outer die 60 and the outer peripheral surface of the inner die 70 is 50 μm to 300 μm.

  Even in the method in which the target is pressed against such a resin 40, the receiving jig 10 can be easily created.

  The resin 40 may be preheated before being put in the frame of the outer mold 60. In addition, after the resin 40 is put in the frame of the outer mold 60, heating may be performed before at least one of the release film 20 and the cloth 30 is covered. Specifically, in the case where the resin 40 is a thermoplastic resin, for example, a plate-like, particulate or pellet-like resin, the resin 40 is heated in advance before the resin 40 is put into the frame of the outer mold 60. It may be put into the frame of the outer mold 60 after being semi-melted. In this case, instead of heating the resin 40 placed in the frame of the outer mold 60 with the inner mold 70 pressed against the object, the resin 40 holds the inner mold 70 pressed against the object. For example, it is cooled and hardened at normal temperature. Alternatively, the resin 40 may be heated after being placed in the frame of the outer mold 60, and at least one of the release film 20 and the cloth 30 may be covered on the heated resin 40. Thus, the receiving jig 10 can be created even if the order of heating the resin 40 is changed.

  In addition, an embodiment obtained by applying various modifications to those skilled in the art to the embodiment, and an embodiment realized by arbitrarily combining components and functions in each embodiment without departing from the scope of the present invention. Also included in the present invention.

  The present invention can be applied to, for example, a jig for mounting or inspecting a substrate or the like as an object, or a supporting jig for stably supporting an intermediate workpiece having various complicated structures.

10, 200, 300 Receiving jig 12 Recess 20 Release film 22 Space 30 Cloth 40 Resin 50 Base 60 Outer mold 70 Inner mold 80 Lid 90 Screw 92 Spring 100 Substrate 110 Mounting surface 112 Parts 120 Opposite surface 202 Support pin 302 Machining hole

Claims (23)

A receiving jig for supporting an object having a convex shape on the convex surface having the convex shape, wherein
It consists of resin which has a crevice corresponding to the outline of the above-mentioned convex shape,
The recess has a concave shape obtained when the convex mold is taken,
The resin is a resin having a hardness of 60 degrees to 90 degrees according to an Asker C-type hardness meter, and a volume resistivity of 10 ² Ω · cm to 10 ⁷ Ω · cm,
The resin is a resin obtained by blending a conductive material, a curing agent, and a curing accelerator into an epoxy resin as a thermosetting resin,
The conductive material is a carbon allotrope including carbon nanotubes or graphene,
The curing agent is an acid anhydride compound, a diamine compound or a dialcohol compound,
The curing accelerator is an amine compound,
With respect to the thermosetting resin,
The weight part of the conductive material is 0.3 to 20 parts by weight,
The weight part of the curing agent is 100 parts by weight to 800 parts by weight,
The weight part of the said hardening accelerator is 1 part weight part-20 weight parts receiving jig. The receiving jig according to claim 1, wherein the object is a substrate or a workpiece on which at least one component is mounted. The receiving jig according to claim 1, wherein the recess has a bottom surface smaller than an opening of the recess, and has a wall surface inclined from the opening toward the bottom. The receiving jig according to any one of claims 1 to 3, wherein the epoxy resin is a bisphenol F-type epoxy resin. The receiving and curing method according to any one of claims 1 to 3, wherein the epoxy resin is a flexible epoxy resin in which a bisphenol F-type epoxy resin and one of an aliphatic epoxy resin and a modified epoxy resin are mixed. Equipment. The curing agent is a polyacid polyanhydride having a long chain alkyl group, or a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethyl phthalic anhydride. The receiving jig according to any one of the above. The receiving jig according to any one of claims 1 to 6, wherein the curing accelerator is 1.8 azabicycloundecene. The receiving jig according to any one of claims 1 to 7, wherein the conductive material is a multilayer carbon nanotube. A manufacturing method of a receiving jig for supporting an object having a convex shape on a convex surface having the convex shape,
Placing the object on a base with the convex surface facing upward;
Covering at least one of a release film and a cloth from the convex side of the object placed on the base;
A frame shape whose height with respect to the base is higher than the height of the convex portion of the convex surface so as to surround the object covered with at least one of the release film and the cloth in a top view of the object Placing an outer mold on the base;
In the frame of the outer mold placed on the base, the hardness by the Asker C-type hardness meter after curing becomes 60 degrees to 90 degrees, and the volume resistivity is 10 ² Ω · cm to 10 ⁷ Ω · cm And the step of
In the frame of the outer mold containing the resin, pressing an inner mold having an outer diameter corresponding to the inner diameter of the outer mold against the resin;
Heating the resin.
The resin is a resin obtained by blending a conductive material, a curing agent, and a curing accelerator into an epoxy resin as a thermosetting resin,
The conductive material is a carbon allotrope including carbon nanotubes or graphene,
The curing agent is an acid anhydride compound, a diamine compound or a dialcohol compound,
The curing accelerator is an amine compound,
With respect to the thermosetting resin,
The weight part of the conductive material is 0.3 to 20 parts by weight,
The weight part of the curing agent is 100 parts by weight to 800 parts by weight,
The method for producing a receiving jig, wherein a weight part of the curing accelerator is 1 part by weight to 20 parts by weight. A manufacturing method of a receiving jig for supporting an object having a convex shape on a convex surface having the convex shape,
Installing on the base a frame-like outer mold having an inner diameter surrounding the target in top view of the target;
In the frame of the outer mold placed on the base, the hardness by the Asker C-type hardness meter after curing becomes 60 degrees to 90 degrees, and the volume resistivity is 10 ² Ω · cm to 10 ⁷ Ω · cm And the step of
Covering at least one of a release film and a cloth on the resin placed in the frame of the outer mold;
Placing the object on at least one of the release film coated on the resin and the cloth so that the convex surface faces downward;
In the frame of the outer mold on which the object is placed on at least one of the release film and the cloth, pressing an inner mold having an outer diameter corresponding to the inner diameter of the outer mold against the object When,
Heating the resin.
The resin is a resin obtained by blending a conductive material, a curing agent, and a curing accelerator into an epoxy resin as a thermosetting resin,
The conductive material is a carbon allotrope including carbon nanotubes or graphene,
The curing agent is an acid anhydride compound, a diamine compound or a dialcohol compound,
The curing accelerator is an amine compound,
With respect to the thermosetting resin,
The weight part of the conductive material is 0.3 to 20 parts by weight,
The weight part of the curing agent is 100 parts by weight to 800 parts by weight,
The method for producing a receiving jig, wherein a weight part of the curing accelerator is 1 part by weight to 20 parts by weight. The manufacturing method of the receiving jig according to claim 9 or 10, wherein in the heating step, the resin is heated in a state where the inner mold is pressed against the resin after the pressing step. In the heating step, the resin is heated before the inserting step;
The method for manufacturing a receiving jig according to claim 9 or 10, wherein the resin heated in the heating step is put into the frame of the outer mold in the putting step. In the heating step, the resin placed in the frame of the outer mold in the putting step is heated,
The method for manufacturing a receiving jig according to claim 10, wherein in the covering step, at least one of the release film and the cloth is covered on the heated resin. The method for manufacturing a receiving jig according to any one of claims 9 to 13, wherein the object is a substrate or a workpiece on which at least one component is mounted. The method for manufacturing a receiving jig according to any one of claims 9 to 14, wherein the release film is a fluororesin film, a silicone resin film, or a heat resistant film coated with a release agent. The receiving die according to any one of claims 9 to 15, wherein the outer mold and the inner mold are a mold coated with a fluorine resin, a silicon resin, or a non-adhesive composite. Production method. In the pressing step, the inner mold is pressed in a state where the clearance between the inner peripheral surface of the outer mold and the outer peripheral surface of the inner mold is 50 μm to 300 μm. Method of manufacturing receiving jig. The method for manufacturing a receiving jig according to any one of claims 9 to 17, wherein in the heating step, the resin is heated at a temperature of 70 degrees to 360 degrees. The method for manufacturing a receiving jig according to any one of claims 9 to 18, wherein the epoxy resin is a bisphenol F-type epoxy resin. The receiving system according to any one of claims 9 to 18, wherein the epoxy resin is a flexible epoxy resin in which a bisphenol F-type epoxy resin and one of an aliphatic epoxy resin and a modified epoxy resin are mixed. Method of manufacturing tools. The curing agent is a polyacid polyanhydride having a long chain alkyl group, or a mixture of a polyacid polyanhydride having a long chain alkyl group and tetrahydromethyl phthalic anhydride. The manufacturing method of the receiving jig of any one term. The method for producing a receiving jig according to any one of claims 9 to 21, wherein the curing accelerator is 1.8 azabicycloundecene. The method of manufacturing a receiving jig according to any one of claims 9 to 22, wherein the conductive material is a multilayer carbon nanotube.

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