TWI815736B - Method for testing instant hardness of thermal type protection film - Google Patents

Method for testing instant hardness of thermal type protection film Download PDF

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TWI815736B
TWI815736B TW111144473A TW111144473A TWI815736B TW I815736 B TWI815736 B TW I815736B TW 111144473 A TW111144473 A TW 111144473A TW 111144473 A TW111144473 A TW 111144473A TW I815736 B TWI815736 B TW I815736B
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test
hardness
printing substrate
instant
heat
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鄭大維
黃朝偉
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友達光電股份有限公司
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Abstract

A method for testing the instant hardness of thermal type protection film, comprising: providing a baked screen printing substrate, the screen printing substrate is provided with a plurality of protection zones and a plurality of test zones, and a thermal type protection film is screen printed on the protection zones and the test zones; conveying the screen printing substrate to a hardness testing machine, and using a test probe of the hardness testing machine to test the hardness of the test zones, after the test probe is tested, the hardness test information is generated and transmitted; and the hardness testing machine judges whether the thermal type protection film on the screen printing substrate is completely solidified, and generates a test result information according to the hardness test information. Based on the hardness testing machine, the solidified situation of the thermal type protection film can be judged immediately according to the hardness test before production.

Description

熱固化保護膠的硬度即時測試方法Instantaneous test method for hardness of thermally cured protective adhesive

本發明涉及測試領域,尤其涉及一種熱固化保護膠的硬度即時測試方法。The invention relates to the field of testing, and in particular to a method for instant testing of the hardness of thermally cured protective glue.

在玻璃基板上形成電路,具有電路的基板會網印熱固化保護膠,又稱為可剝膠,在LED接合製程前,保護在基板上的電路。通常熱固化保護膠會經過烘箱的烘烤來達到固化,但是在玻璃基板的尺寸增加時,烘箱加熱不均勻的程度會更加明顯,因此,通常會於熱固化保護膠進行測試及檢驗,來避免熱固性保護膠因為反應不完全,而導致在後續製程中,有掉膠,或是殘膠產生的情況。A circuit is formed on the glass substrate. The substrate with the circuit is screen-printed with heat-curing protective glue, also known as peelable glue, to protect the circuit on the substrate before the LED bonding process. Usually, thermally cured protective adhesives are cured by baking in an oven. However, as the size of the glass substrate increases, uneven heating in the oven will become more obvious. Therefore, thermally cured protective adhesives are usually tested and inspected to avoid Due to the incomplete reaction of thermosetting protective glue, glue may fall off or residual glue may be produced in subsequent processes.

傳統的檢驗方法,是將熱固性保護膠撕起,以傅立葉轉換紅外光譜(Fourier-transform infrared spectroscopy ,FTIR),利用官能基的振動能量差異鑑別材料特性差異,以確認熱固性保護膠是否固化完全,然而,這樣的檢驗需較為耗時,對生產的稼動性影響甚鉅。The traditional inspection method is to tear off the thermosetting protective glue and use Fourier-transform infrared spectroscopy (FTIR) to identify differences in material properties using the difference in vibration energy of functional groups to confirm whether the thermosetting protective glue is completely cured. However, , such inspection is time-consuming and has a great impact on the productivity of production.

固化後之熱固性保護膠的硬度正相關於熱固性保護膠的熱固反應程度,換言之,硬度越高,代表熱固反應越完全。因此,在實際現場上,通常會以不同硬度鉛筆,對於保護膠測試,若是達到某一硬度以上,例如,鉛筆H的硬度,肉眼看不出壓痕或刮痕,則認定為反應完全。雖然這樣的方式,能夠快速辨別,解決傳統上生產速度受到影響的問題。然而,由於每個操作者,施予的力度不相同,判斷標準難以一致化,過小的施力,可能導致未完全反應的熱固性保護膠被誤判,而過大的施力,甚至可能破壞了熱固性保護膠所欲保護的電路。另外,鉛筆碳粉的產生,會汙染無塵室的潔淨度。The hardness of the cured thermosetting protective glue is directly related to the degree of thermosetting reaction of the thermosetting protective glue. In other words, the higher the hardness, the more complete the thermosetting reaction. Therefore, in the actual field, pencils of different hardnesses are usually tested for protective glue. If the hardness reaches a certain hardness or above, for example, the hardness of pencil H, and no indentation or scratches are visible to the naked eye, the reaction is considered complete. Although this method can quickly identify and solve the traditional problem of affecting production speed. However, since each operator applies different strengths, it is difficult to standardize the judgment criteria. Too small an application of force may lead to misjudgment of incompletely reacted thermosetting protective glue, while an excessive application of force may even destroy the thermosetting protection. Glue the circuit you want to protect. In addition, the production of pencil toner will pollute the cleanliness of the clean room.

為了解決上述的問題,在一些實施例中,提供一種熱固化保護膠的硬度即時測試方法包含:準備經烘烤過的網印基板,網印基板上具有複數個保護區及複數個測試區,保護區及測試區上,網印有熱固化保護膠;輸送網印基板到硬度測試機台,以硬度測試機台上的至少一測試探頭,對測試區進行硬度測試,至少一測試探頭在測試後,產生一硬度測試資訊,並加以輸出;以及硬度測試機台根據硬度測試資訊,判斷網印基板上的熱固化保護膠是否完全固化,而產生測試結果資訊。In order to solve the above problems, in some embodiments, a method for instant testing of the hardness of thermally cured protective glue is provided including: preparing a baked screen printing substrate, with a plurality of protection zones and a plurality of test areas on the screen printing substrate, The protective area and the test area are screen-printed with heat-curing protective glue; the screen-printed substrate is transported to the hardness testing machine, and at least one test probe on the hardness testing machine is used to test the hardness of the test area. At least one test probe is testing Finally, a hardness test information is generated and output; and the hardness test machine determines whether the heat-curing protective glue on the screen printing substrate is completely cured based on the hardness test information, and generates test result information.

在一些實施例中,硬度測試機台在測試探頭進行測試時,提供不同的測試荷重。更詳細地,在一些實施例中,對測試探頭施加的荷重為20g及100g。In some embodiments, the hardness testing machine provides different test loads when the test probe is tested. In more detail, in some embodiments, the load applied to the test probe is 20g and 100g.

在一些實施例中,硬度測試機台包含複數個測試探頭,測試探頭分別對應不同的硬度。例如,在一些實施例中,測試探頭的硬度,分別對應6B、4B、3B、HB、H、2H、4H、6H、7H鉛筆的硬度,且測試探頭以高分子、陶瓷或金屬製成。In some embodiments, the hardness testing machine includes a plurality of test probes, and the test probes respectively correspond to different hardnesses. For example, in some embodiments, the hardness of the test probe corresponds to the hardness of 6B, 4B, 3B, HB, H, 2H, 4H, 6H, and 7H pencils, and the test probe is made of polymer, ceramic, or metal.

在一些實施例中,測試區位於網印基板兩側。In some embodiments, the test areas are located on both sides of the screen printing substrate.

在一些實施例中,測試區位於網印基板的周邊,並圍繞保護區。In some embodiments, the test area is located at the perimeter of the screen-printed substrate and surrounds the protected area.

在一些實施例中,測試區位於網印基板的四個角落。In some embodiments, the test areas are located at four corners of the screen-printed substrate.

在一些實施例中,硬度測試機台更包含光學鏡頭,以產生測試後表面影像,硬度測試機台根據測試後表面影像及硬度測試資訊,產生測試結果資訊。In some embodiments, the hardness testing machine further includes an optical lens to generate a post-test surface image, and the hardness testing machine generates test result information based on the post-test surface image and the hardness test information.

在一些實施例中,硬度測試機台包含螢幕,以呈現測試結果資訊。In some embodiments, the hardness testing machine includes a screen to present test result information.

如同前述實施例所述,在完成網印基板烘烤後,直接以硬度測試機台來進行硬度測試,能夠即時地判斷熱固化保護膠是否固化完全,而避免在後續的製程中,掉膠或是產生殘膠。同時,更避免顆粒、粉塵的問題,能維持後續製程機台及製程環境的潔淨度。As mentioned in the previous embodiment, after the screen printing substrate is baked, the hardness test is directly performed with a hardness testing machine, which can instantly determine whether the heat-curing protective glue is completely cured, thereby avoiding glue loss or damage in the subsequent process. Residual glue is produced. At the same time, it also avoids the problems of particles and dust, and can maintain the cleanliness of subsequent process machines and process environments.

應當理解的是,元件被稱為「設置」於另一元件時,可以表示元件是直接位另一元件上,或者也可以存在中間元件,透過中間元件連接元件與另一元件。相反地,當元件被稱為「直接設置在另一元件上」或「直接設置到另一元件」時,可以理解的是,此時明確定義了不存在中間元件。It should be understood that, when an element is referred to as being "disposed on" another element, it can mean that the element is directly located on the other element, or that intervening elements may be present to connect the element to the other element through the intervening elements. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, it will be understood that there are no intervening elements present.

另外,術語「第一」、「第二」、「第三」這些術語僅用於將一個元件、部件、區域、或部分與另一個元件、部件、區域、層或部分區分開,而非表示其必然的先後順序。此外,諸如「下」和「上」的相對術語可在本文中用於描述一個元件與另一元件的關係,應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其他元件的「下」側的元件將被定向在其他元件的「上」 側。此僅表示相對的方位關係,而非絕對的方位關係。In addition, the terms “first”, “second” and “third” are only used to distinguish one element, component, region or section from another element, component, region, layer or section and do not indicate Its inevitable sequence. In addition, relative terms, such as "lower" and "upper," may be used herein to describe one element's relationship to another element, and it will be understood that these relative terms are intended to encompass differences in the orientation of the device in addition to the orientation illustrated in the figures. position. For example, if the device in one of the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. This only represents a relative orientation relationship, not an absolute orientation relationship.

圖1係熱固化保護膠的硬度即時測試方法的流程圖。圖2是網印基板第一實施例的俯視圖。圖3是硬度測試機台第一實施例的局部側視圖。如圖1所示,熱固化保護膠的硬度即時測試方法S1包含:準備步驟S10、測試步驟S20、以及結果產生步驟S30。同時參照圖2,準備步驟S10是準備經烘烤過的網印基板1,網印基板1上具有複數個保護區10及複數個測試區20,保護區10及測試區20上,網印有熱固化保護膠30。在此,測試區20的位置依照網印基板1的電路設計而調整,但都是設置於無效區(dummy area),在此實施例中,測試區20位網印基板1兩側,而保護區10位於網印基板1的中央位置。Figure 1 is a flow chart of the instant test method for hardness of thermally cured protective adhesive. Figure 2 is a top view of the first embodiment of the screen printing substrate. Figure 3 is a partial side view of the first embodiment of the hardness testing machine. As shown in FIG. 1 , the instant hardness testing method S1 of the thermally cured protective glue includes: a preparation step S10 , a testing step S20 , and a result generating step S30 . Referring to Figure 2 at the same time, the preparation step S10 is to prepare the baked screen printing substrate 1. The screen printing substrate 1 has a plurality of protection zones 10 and a plurality of test zones 20. On the protection zones 10 and the test zone 20, the screen printing substrate 1 has Heat curing protective glue 30. Here, the position of the test area 20 is adjusted according to the circuit design of the screen printing substrate 1, but it is all set in the dummy area. In this embodiment, the test area 20 is located on both sides of the screen printing substrate 1 to protect Area 10 is located in the center of the screen printing substrate 1 .

同時參照圖3,測試步驟S20是將網印基板1輸送到硬度測試機台100,例如置於載台105上,以硬度測試機台100上的測試探頭110,對測試區20進行硬度測試,例如,測試探頭110的硬度可以是對應H鉛筆的硬度,施加100g的荷重對測試區20的熱固化保護膠30,進行加壓並移動,測試探頭110在測試後,同時根據所測試熱固化保護膠30的位置產生反饋,而產生硬度測試資訊,並加以輸出。在此,硬度測試機台100實質上除了載台105、測試探頭110等部件,更包含用於計算及紀錄的紀錄媒介、計算程式等(圖中未繪出),這些部件或程式可以以工業電腦、桌上型電腦、筆記型電腦來實現。Referring to Figure 3 at the same time, the test step S20 is to transport the screen printing substrate 1 to the hardness testing machine 100, for example, place it on the carrier 105, and perform a hardness test on the test area 20 with the test probe 110 on the hardness testing machine 100. For example, the hardness of the test probe 110 can be corresponding to the hardness of an H pencil, and a load of 100g is applied to pressurize and move the heat-curing protective glue 30 in the test area 20. After the test, the test probe 110 is simultaneously protected according to the tested heat-curing protection glue 30. The position of the glue 30 generates feedback, thereby generating hardness test information and outputting it. Here, the hardness testing machine 100 actually includes not only the carrier 105, the test probe 110 and other components, but also recording media and calculation programs for calculation and recording (not shown in the figure). These components or programs can be used in industrial applications. Computer, desktop computer, notebook computer to achieve.

更詳細地,測試探頭110以高分子、陶瓷或金屬製成,如此避免粉塵、顆粒的產生,維持機台及整體製程環境的潔淨度。In more detail, the test probe 110 is made of polymer, ceramic or metal, thereby avoiding the generation of dust and particles and maintaining the cleanliness of the machine and the overall process environment.

結果產生步驟S30是硬度測試機台100根據硬度測試資訊,並根據多個測試區20的硬度測試資訊,綜合判斷整個網印基板1上的熱固化保護膠30是否完全固化,而產生測試結果資訊,例如OK/NG。進一步地,硬度測試機台100包含螢幕120,熱固化保護膠的硬度即時測試方法更包含結果顯示步驟S40,呈現測試結果資訊於螢幕120上,供現場人員決定是否將網印基板1傳輸到後續的製程階段。The result generating step S30 is for the hardness testing machine 100 to comprehensively determine whether the heat-curing protective glue 30 on the entire screen printing substrate 1 is completely cured based on the hardness test information and the hardness test information of multiple test areas 20, and generate test result information. , such as OK/NG. Further, the hardness testing machine 100 includes a screen 120, and the real-time hardness testing method of the thermal curing protective adhesive further includes a result display step S40, which presents the test result information on the screen 120 for on-site personnel to decide whether to transmit the screen printing substrate 1 to subsequent processes. process stage.

進一步地,在測試步驟S20中,還可以提供不同的荷重,例如對測試探頭110施加20g、100g的荷重,來進行硬度測試,以確認熱固化保護膠30的硬度,提供硬度測試機台100計算測試結果資訊有更多參數來進行判斷。Further, in the test step S20, different loads can also be provided, for example, a load of 20g and 100g can be applied to the test probe 110 to perform a hardness test to confirm the hardness of the thermally cured protective glue 30 and provide the hardness testing machine 100 to calculate Test result information has more parameters for judgment.

圖4是網印基板第二實施例的俯視圖。圖5是網印基板第三實施例的俯視圖。如圖4及圖5所示,同時參考圖2,網印基板1的測試區20可以配合整體保護區的位置、電路的布局,來做適當的調配,例如,如圖4所示,測試區20位於網印基板1的周邊,並圍繞保護區10;而如圖5所示,測試區20位於網印基板1的四個角落。通常網印基板1會掃描網印基板1的條碼,存取網印基板1的保護區10及測試區20的相對位置,經過測試步驟S20後,根據多個測試區20上熱固化保護膠30的硬度,計算保護區10上的熱固化保護膠30是否固化完全,而產生測試結果資訊。在此僅為示例,而非用以限制。實際上,僅限定測試區20的在無效區,而其排列位置,可以依據實際的電路布局調配。Figure 4 is a top view of the second embodiment of the screen printing substrate. Figure 5 is a top view of the third embodiment of the screen printing substrate. As shown in Figures 4 and 5, and with reference to Figure 2, the test area 20 of the screen printing substrate 1 can be appropriately configured according to the position of the overall protection zone and the layout of the circuit. For example, as shown in Figure 4, the test area 20 is located at the periphery of the screen printing substrate 1 and surrounds the protection zone 10; and as shown in Figure 5, the test areas 20 are located at the four corners of the screen printing substrate 1. Usually, the screen printing substrate 1 scans the barcode of the screen printing substrate 1 to access the relative positions of the protection zone 10 and the test area 20 of the screen printing substrate 1. After the test step S20, the screen printing substrate 1 scans the barcode of the screen printing substrate 1 according to the thermal curing protective glue 30 on the multiple test areas 20. The hardness is calculated to determine whether the heat-curing protective glue 30 on the protective zone 10 is completely cured, and test result information is generated. This is only an example and not a limitation. In fact, the test area 20 is limited to the invalid area, and its arrangement position can be adjusted according to the actual circuit layout.

圖6是硬度測試機台第二實施例的局部側視圖。進一步地,還可以如圖6所示,硬度測試機台100包含複數個測試探頭110,例如,110A、110B….至110I,為了清楚起見,圖中未全數示出。多個測試探頭110可以裝設於轉盤107上,可旋轉輪替地進行硬度測試。測試探頭110的硬度,可以分別對應6B、4B、3B、HB、H、2H、4H、6H、7H鉛筆的硬度。在此,是以軟至應作為排列順序,以上僅用以示例,而非用以限制,實際的硬度、數量、排列方式、組裝方式,可以依據所需的規格來進行調配。Figure 6 is a partial side view of the second embodiment of the hardness testing machine. Further, as shown in FIG. 6 , the hardness testing machine 100 may include a plurality of test probes 110 , for example, 110A, 110B... to 110I. For the sake of clarity, not all of them are shown in the figure. Multiple test probes 110 can be installed on the turntable 107 and can rotate and perform hardness testing alternately. The hardness of the test probe 110 can respectively correspond to the hardness of 6B, 4B, 3B, HB, H, 2H, 4H, 6H, and 7H pencils. Here, "softest" is used as the order of arrangement. The above is only an example, not a limitation. The actual hardness, quantity, arrangement, and assembly method can be adjusted according to the required specifications.

另外,測試探頭110以高分子、陶瓷或金屬製成,以避免粉末的產生。當測試探頭110由軟至硬加壓並移動若未產生壓痕時,則更換較硬的測試探頭110直到最高的硬度,若是產生痕跡或破壞缺陷時,則紀錄對應硬度為測試區20的硬度。如此,可以確認整體硬度的分布,從而反饋相關的資料,以調整烘烤製程的相關參數。In addition, the test probe 110 is made of polymer, ceramic or metal to avoid the generation of powder. When the test probe 110 is pressurized and moved from soft to hard and if no indentation is produced, the harder test probe 110 is replaced until the highest hardness is reached. If traces or damage defects are produced, the corresponding hardness is recorded as the hardness of the test area 20 . In this way, the overall hardness distribution can be confirmed and relevant data can be fed back to adjust the relevant parameters of the baking process.

圖7是硬度測試機台第三實施例的局部側視圖。如圖7所示,硬度測試機台100更包含光學鏡頭130,在測試步驟S20後,進一步拍攝並產生測試後受測之測試區20的表面影像。由於熱固化保護膠30若是熱固化反應,使得內部交聯性低於60%時,會發現白色霧狀的現象,此外,透過光學鏡頭130還可以發現是否有明顯微氣孔、裂痕等,進一步確認熱固化保護膠30熱固化的程度。硬度測試機台100並根據表面影像及硬度測試資訊,產生測試結果資訊。Figure 7 is a partial side view of the third embodiment of the hardness testing machine. As shown in FIG. 7 , the hardness testing machine 100 further includes an optical lens 130 , which, after the testing step S20 , further captures and generates a surface image of the tested test area 20 after the test. If the thermal curing protective glue 30 undergoes a thermal curing reaction and the internal cross-linking property is lower than 60%, a white mist-like phenomenon will be found. In addition, through the optical lens 130, it can also be found whether there are obvious micropores, cracks, etc. for further confirmation. Thermal curing protective glue has 30 degrees of thermal curing. The hardness testing machine 100 generates test result information based on the surface image and hardness testing information.

進一步地,硬度測試機台100更可以透過光學、硬度的相關資料,進行人工智慧的訓練,配合人工智慧更加迅速地判斷,提高檢驗的準確度。Furthermore, the hardness testing machine 100 can conduct artificial intelligence training through optical and hardness related data, and cooperate with artificial intelligence to make more rapid judgments and improve the accuracy of inspection.

綜上所述,在網印基板1經過烘烤後,直接以硬度測試機台100來進行硬度測試,能夠即時地判斷熱固化保護膠30是否固化完全,而避免在後續的製程中,發生掉膠或是產生殘膠,同時更避免顆粒、粉塵的問題,能維持後續製程機台及製程環境的潔淨度。In summary, after the screen printing substrate 1 is baked, the hardness test is directly performed with the hardness testing machine 100, which can instantly determine whether the heat-curing protective glue 30 is completely cured, thereby avoiding the occurrence of dropout in the subsequent process. Glue may produce residual glue, while also avoiding problems with particles and dust, and maintaining the cleanliness of subsequent processing machines and the process environment.

雖然本發明的技術內容已經以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神所作些許之更動與潤飾,皆應涵蓋於本發明的範疇內,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed above in the form of preferred embodiments, it is not intended to limit the present invention. Any slight changes and modifications made by anyone skilled in the art without departing from the spirit of the present invention should be covered by the present invention. Within the scope of the present invention, the protection scope of the present invention shall be subject to the scope of the appended patent application.

1:網印基板 10:保護區 20:測試區 30:熱固化保護膠 100:硬度測試機台 105:載台 107:轉盤 110:測試探頭 110A~110I:測試探頭 120:螢幕 130:光學鏡頭 S1:熱固化保護膠的硬度即時測試方法 S10:準備步驟 S20:測試步驟 S30:結果產生步驟 S40:結果顯示步驟1: Screen printing substrate 10:Protected area 20:Test area 30: Heat curing protective glue 100: Hardness testing machine 105: Carrier platform 107:Turntable 110:Test probe 110A~110I: test probe 120:Screen 130: Optical lens S1: Instant test method for hardness of thermally cured protective adhesive S10: Preparatory steps S20: Test steps S30: Result generation steps S40: Result display steps

圖1是熱固化保護膠的硬度即時測試方法的流程圖。 圖2是網印基板第一實施例的俯視圖。 圖3是硬度測試機台第一實施例的局部側視圖。 圖4是網印基板第二實施例的俯視圖。 圖5是網印基板第三實施例的俯視圖。 圖6是硬度測試機台第二實施例的局部側視圖。 圖7是硬度測試機台第三實施例的局部側視圖。 Figure 1 is a flow chart of the instant test method for hardness of thermally cured protective adhesive. Figure 2 is a top view of the first embodiment of the screen printing substrate. Figure 3 is a partial side view of the first embodiment of the hardness testing machine. Figure 4 is a top view of the second embodiment of the screen printing substrate. Figure 5 is a top view of the third embodiment of the screen printing substrate. Figure 6 is a partial side view of the second embodiment of the hardness testing machine. Figure 7 is a partial side view of the third embodiment of the hardness testing machine.

1:網印基板 1: Screen printing substrate

10:保護區 10:Protected area

20:測試區 20:Test area

30:熱固化保護膠 30: Heat curing protective glue

100:硬度測試機台 100: Hardness testing machine

105:載台 105: Carrier platform

110:測試探頭 110:Test probe

120:螢幕 120:Screen

Claims (10)

一種熱固化保護膠的硬度即時測試方法,包含: 準備經烘烤過的一網印基板,該網印基板上具有複數個保護區及複數個測試區,該等保護區及該等測試區上,網印有一熱固化保護膠; 輸送該網印基板到一硬度測試機台,以該硬度測試機台上的至少一測試探頭,對該等測試區進行硬度測試,該至少一測試探頭在測試後,產生一硬度測試資訊,並加以輸出;以及 該硬度測試機台根據該硬度測試資訊,判斷該網印基板上的該熱固化保護膠是否完全固化,而產生一測試結果資訊。 An instant hardness testing method for thermally cured protective adhesive, including: Prepare a baked screen-printing substrate, which has a plurality of protection zones and a plurality of test areas, and a heat-curing protective glue is screen-printed on the protection zones and the test areas; Transport the screen printing substrate to a hardness testing machine, use at least one test probe on the hardness testing machine to perform a hardness test on the test areas. After testing, the at least one test probe generates a hardness test information, and to output; and The hardness testing machine determines whether the heat-curing protective glue on the screen printing substrate is completely cured based on the hardness testing information, and generates test result information. 如請求項1所述之熱固化保護膠的硬度即時測試方法,其中該硬度測試機台,在該測試探頭至少一測試時,提供不同的測試荷重。The instant hardness testing method of heat-cured protective adhesive as described in claim 1, wherein the hardness testing machine provides different testing loads during at least one test of the testing probe. 如請求項2所述之熱固化保護膠的硬度即時測試方法,其中對該測試探頭施加的荷重為20g及100g。The method for instant testing of the hardness of thermally cured protective glue as described in claim 2, wherein the loads applied to the test probe are 20g and 100g. 如請求項1或2所述之熱固化保護膠的硬度即時測試方法,其中該硬度測試機台包含複數個測試探頭,該等測試探頭分別對應不同的硬度。The instant hardness testing method of heat-cured protective adhesive as described in claim 1 or 2, wherein the hardness testing machine includes a plurality of test probes, and the test probes respectively correspond to different hardnesses. 如請求項4所述之熱固化保護膠的硬度即時測試方法,其中該等測試探頭的硬度,分別對應6B、4B、3B、HB、H、2H、4H、6H、7H鉛筆的硬度,且該些測試探頭以高分子、陶瓷或金屬製成。The instant test method for the hardness of heat-cured protective glue as described in request item 4, wherein the hardness of the test probes corresponds to the hardness of 6B, 4B, 3B, HB, H, 2H, 4H, 6H, and 7H pencils respectively, and the Some test probes are made of polymers, ceramics or metals. 如請求項1所述之熱固化保護膠的硬度即時測試方法,其中該等測試區位於該網印基板兩側。The instant hardness testing method of heat-cured protective adhesive as described in claim 1, wherein the test areas are located on both sides of the screen printing substrate. 如請求項1所述之熱固化保護膠的硬度即時測試方法,其中該等測試區位於該網印基板的周邊,並圍繞該等保護區。The method for instant testing of the hardness of heat-cured protective glue as described in claim 1, wherein the test areas are located at the periphery of the screen printing substrate and surround the protective areas. 如請求項1所述之熱固化保護膠的硬度即時測試方法,其中該等測試區位於該網印基板的四個角落。The instant hardness testing method of heat-cured protective adhesive as described in claim 1, wherein the test areas are located at four corners of the screen printing substrate. 如請求項1所述之熱固化保護膠的硬度即時測試方法,其中該硬度測試機台更包含一光學鏡頭,以產生一測試後表面影像,該硬度測試機台根據該測試後表面影像及該硬度測試資訊,產生該測試結果資訊。The instant hardness testing method of heat-cured protective adhesive as described in claim 1, wherein the hardness testing machine further includes an optical lens to generate a post-test surface image, and the hardness testing machine is based on the post-test surface image and the Hardness test information generates the test result information. 如請求項1或9所述之熱固化保護膠的硬度即時測試方法,其中該硬度測試機台包含一螢幕,以呈現該測試結果資訊。The real-time hardness testing method of heat-cured protective adhesive as described in claim 1 or 9, wherein the hardness testing machine includes a screen to present the test result information.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI476253B (en) * 2011-01-12 2015-03-11 Prior Company Ltd Dual curable coating material, hard coating layer, and method of forming a hard coating layer
US20220018748A1 (en) * 2020-07-14 2022-01-20 Jilin University Traceable In-Situ Micro- and Nano-Indentation Testing Instrument and Method under Variable Temperature Conditions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI476253B (en) * 2011-01-12 2015-03-11 Prior Company Ltd Dual curable coating material, hard coating layer, and method of forming a hard coating layer
US20220018748A1 (en) * 2020-07-14 2022-01-20 Jilin University Traceable In-Situ Micro- and Nano-Indentation Testing Instrument and Method under Variable Temperature Conditions

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