JP6528406B2 - Electronic device and method of manufacturing electronic device - Google Patents

Description

  The present invention relates to an electronic device and a method of manufacturing the electronic device.

  There is known a technique in which another electronic component such as a semiconductor element is mounted on an electronic component such as a circuit board via a conductor material such as solder. In addition, in order to enhance the heat dissipation from the electronic component, there is known a technique of mounting a heat dissipation member on the electronic component via a conductor material such as solder or a thermally conductive resin material.

JP 2012-204632 A JP, 2014-138018, A

  In the prior art, there may be cases where sufficient heat transfer can not be performed between the electronic components disposed via the conductor material, and between the electronic component disposed via the conductor material or the resin material and the heat dissipation member. In that case, the heat dissipation from the electronic component may be deteriorated, which may lead to overheating of the electronic component, and to deterioration in performance or failure of the electronic device including the electronic component and the electronic component.

According to one aspect of the present invention, a substrate, a semiconductor element provided above the substrate, and an electronic component provided above the substrate and at a position different from the semiconductor element in plan view, A first heat radiation member provided above the electronic component, and upper and lower surfaces of the electronic component and a first side surface and a second side surface facing each other continuously connected to the substrate and the first heat radiation member; It is seen including a conductor layer, wherein the electronic component to the lower surface, said has electrically independent terminals and conductor layers, the substrate and electrically connected to it are the electronic device is provided by the terminal Ru.

According to an aspect of the present invention, above a substrate, placing an upper surface and a lower surface and the first side surface and continuously child part conductive conductor layer is provided on a second side opposite the front Stories placing an upper heat radiation member of the electronic component is melted by heating the conductive layer, a method of manufacturing an electronic device including the step of connecting said conductive layer and said substrate and said heat radiating member is provided . Furthermore, according to one aspect of the present invention, there is provided a process of preparing a series of conductor sheets corresponding to the upper surface, the first side surface, the lower surface and the second side surface of an electronic component; Forming a conductor layer continuously provided on the upper surface, the first side surface, the lower surface and the second side surface by attaching to one side surface, the lower surface and the second side surface, and forming the conductor layer Including the steps of: disposing the electronic component above the substrate; disposing the heat dissipation member above the electronic component; and connecting the conductor layer to the substrate and the heat dissipation member. A method of manufacturing an electronic device is provided.

  According to the disclosed technology, the conductor layer continuously provided on the upper and lower surfaces and the opposite side surfaces of the electronic component can enhance the heat dissipation of the electronic component and suppress its overheating, thereby achieving performance and reliability. It is possible to realize an excellent electronic device.

It is a figure showing an example of the electronic device concerning a 1st embodiment. It is a figure showing an example of the electronic device concerning a 2nd embodiment. It is a figure (the 1) showing an example of the regulator parts concerning a 2nd embodiment. It is a figure (the 2) showing an example of the regulator parts concerning a 2nd embodiment. It is a figure which shows an example of the assembly process of the electronic device which concerns on 2nd Embodiment. It is a figure (the 1) showing an example of the electronic device concerning another form. It is a figure (the 2) showing an example of the electronic device concerning another form. It is a figure which shows an example of the assembly process of the electronic device which concerns on another form. It is a figure explaining an example of the fault which may arise in the electronic device concerning another form. It is a figure (the 1) explaining the electronic device concerning a 2nd embodiment. It is a figure explaining another example of the fault which may arise in the electronic device concerning another form. It is a figure (the 2) explaining the electronic device concerning a 2nd embodiment. FIG. 21 is a first view showing an example of a method of producing an electronic device according to a second embodiment. FIG. 16 is a second diagram illustrating an example of the method of manufacturing the electronic device according to the second embodiment; FIG. 16 is a third diagram showing an example of the method of manufacturing the electronic device according to the second embodiment. FIG. 16 is a diagram showing an example of the method of manufacturing an electronic device according to the second embodiment (No. 4). FIG. 16 is a fifth diagram showing an example of a method of manufacturing an electronic device according to a second embodiment. FIG. 16 is a diagram showing an example of the method of manufacturing an electronic device according to the second embodiment (No. 6). FIG. 17 is a seventh diagram showing an example of a method of producing an electronic device according to a second embodiment. It is a figure showing an example of the regulator parts concerning a 3rd embodiment. It is a figure showing an example of the regulator parts concerning a 4th embodiment. It is a figure which shows an example of the regulator components which concern on 5th Embodiment. It is a figure which shows an example of the heat sink which concerns on 6th Embodiment.

First, the first embodiment will be described.
FIG. 1 is a view showing an example of the electronic device according to the first embodiment. 1 (A) is a schematic perspective view of an essential part of an example of the electronic device according to the first embodiment, and FIG. 1 (B) is a schematic cross-sectional view taken along the line L1-L1 of FIG. FIG. 1C is a schematic cross-sectional view cut at the position of line L2-L2 in FIG.

  An electronic device 1 shown in FIG. 1A to FIG. 1C includes an electronic component 10, an electronic component 20, and a heat dissipation member 30. The electronic component 20 is mounted on the electronic component 10, and the heat dissipation member 30 is mounted on the electronic component 20.

  For the electronic component 10, a semiconductor element, a semiconductor device (semiconductor package) including the semiconductor element, a circuit board, or the like can be used. For the electronic component 20, a semiconductor element, a semiconductor package, or the like can be used. For example, a circuit board is used for the electronic component 10, and a semiconductor package having terminals on the lower surface 20b, the side surface 20e, and the side surface 20f is used for the electronic component 20.

  For the heat dissipating member 30, a material having good thermal conductivity is used. For example, a metal material such as copper (Cu) or aluminum (Al), a ceramic material, or a carbon material is used for the heat dissipation member 30. The heat dissipation member 30 is, for example, in a plate shape. The heat dissipating member 30 may have a needle-like or plate-like fin.

  The electronic device 1 further includes, as shown in FIGS. 1A to 1C, the upper surface 20a and the lower surface 20b of the electronic component 20 disposed between the electronic component 10 and the heat dissipation member 30, and the opposing side surfaces. 20c and a conductor layer 40 provided continuously to the side surface 20d. The conductor layer 40 is provided to surround the electronic component 20 except for another pair of opposite side surfaces 20 e and 20 f of the electronic component 20. The conductor layer 40 is provided to surround the electronic component 20 in this manner, and is thermally connected to the electronic component 20.

  For the conductor layer 40, a material having good thermal conductivity is used. For the conductor layer 40, for example, solder is used. Besides the solder, the conductor layer 40 can also use a metal material such as Cu or Al, a ceramic material, a carbon material, or the like.

  When the electronic component 20 having terminals on the lower surface 20 b is used, the portion of the conductor layer 40 provided on the lower surface 20 b of the electronic component 20 is provided electrically independent of the terminals of the electronic component 20. The portion of the conductor layer 40 provided on the lower surface 20 b of the electronic component 20 may be electrically connected to the terminal of the electronic component 20 as long as the processing operation of the electronic component 20 is not impaired.

  The electronic component 10 and the heat dissipation member 30 are thermally connected to the conductor layer 40 below and above the electronic component 20, respectively. For example, the electronic component 10 and the heat dissipation member 30 are bonded to the conductor layer 40 in which the solder is used. Alternatively, the electronic component 10 and the heat dissipation member 30 are bonded to the conductor layer 40 using a material other than solder using solder.

  In the electronic device 1 having the above-described configuration, a device that generates heat during operation may be used as at least one of the electronic component 10 and the electronic component 20. For example, a heat generating component is adopted for an electronic component 20 in which a semiconductor element, a semiconductor package or the like is used. The heat in the electronic device 1 is transferred between the electronic component 10 and the electronic component 20 and thermally between the electronic component 20 and the heat dissipation member 30 thermally connected via the conductor layer 40, and the electronic The heat is dissipated from the component 10 and the electronic component 20 and from the heat dissipation member 30 to the outside of the electronic device 1.

  In the electronic device 1, by using a material with good thermal conductivity for the conductor layer 40, between the lower surface 20 b of the electronic component 20 and the electronic component 10 and between the upper surface 20 a of the electronic component 20 and the heat dissipation member 30, Efficient heat transfer is possible.

  In the electronic device 1, the conductor layer 40 continuous from the upper surface 20 a and the lower surface 20 b is provided on the facing side surface 20 c and the side surface 20 d of the electronic component 20. Thus, the conductor layer 40 is provided also on the side surface 20c and the side surface 20d, and this becomes a heat conduction path of the side surface 20c and the side surface 20d of the electronic component 20, and the electronic component 10 arranged with the electronic component 20 interposed therebetween. Efficient heat transfer with the heat dissipation member 30 is enabled.

  Furthermore, in the electronic device 1, the conductor layer 40 is provided on the side surface 20 c and the side surface 20 d of the electronic component 20 so that the heat of the electronic component 20 can be transmitted from the conductor layer 40 of the side surface 20 c and the side surface 20 d. The heat can be dissipated efficiently to the outside of the That is, the conductor layer 40 of the side surface 20c and the side surface 20d of the electronic component 20 not only serves as a heat conduction path between the electronic component 10 and the heat dissipation member 30, but also functions as a heat dissipation member for radiating heat to the outside.

  In the electronic device 1, the efficient heat transfer between the electronic component 10, the electronic component 20, and the heat dissipation member 30 by the conductor layer 40 and the heat dissipation from the conductor layer 40 cause heat dissipation from the electronic component 10 and the electronic component 20 and Heat can be efficiently dissipated to the outside of the electronic device 1 from the member 30.

  Thus, by providing the electronic component 20 disposed between the electronic component 10 and the heat dissipation member 30 with the conductor layer 40 surrounding the upper surface 20 a and the lower surface 20 b and the opposing side surface 20 c and the opposing side surface 20 d It is possible to improve the heat dissipation of the This makes it possible to suppress the overheating of the electronic component 20 and the overheating of the electronic component 10, and the performance deterioration or failure of the electronic component 20, the electronic component 10, and the electronic device 1 provided with these, due to heat. It is possible to suppress the occurrence and realize an electronic device 1 with high performance and reliability.

Next, a second embodiment will be described.
FIG. 2 is a view showing an example of the electronic device according to the second embodiment. FIG. 2A is a schematic cross-sectional view of an example of the electronic device according to the second embodiment, FIG. 2B is a schematic plan view of an example of the electronic device according to the second embodiment, and FIG. ) Is a schematic plan view of an essential part of an example of an electronic device according to a second embodiment. FIG. 2A is a schematic cross-sectional view taken along line L3-L3 of FIG. FIG. 2 (C) is an enlarged view of a portion X in FIG. 2 (B).

  In FIG. 2A to FIG. 2C, as the electronic device 100, a regulator component 120 including terminals (terminals 121 and the like described later) is mounted on the lower surface on a circuit board 110, and a heat dissipation plate is further mounted thereon. 14 illustrates an FCBGA (Flip Chip Ball Grid Array) package including a structure having 130 mounted thereon.

  On the lower surface 120b of the regulator component 120, as shown in FIG. 2C, along the opposing side surface 120e and the side surface 120f, a plurality of terminals (terminals 121 described later) at positions corresponding to the terminals 111 of the circuit board 110. Is provided. The regulator component 120 is electrically connected to the circuit board 110 at a terminal of the lower surface 120 b.

  The regulator component 120 is provided with the conductor layer 140 continuously to the upper surface 120 a and the lower surface 120 b and the opposite side surface 120 c and the side surface 120 d. The conductor layer 140 on the lower surface 120 b of the regulator component 120 is provided so as not to be electrically connected to a terminal (a terminal 121 described later) provided on the lower surface 120 b of the regulator component 120. Solder is used for the conductor layer 140. The conductor layer 140 is joined to the circuit board 110 below the regulator component 120 and the heat sink 130 above the regulator component 120.

Details of such a regulator component 120 will be described later.
The electronic device 100 includes a semiconductor element 150 which is an active element mounted on the circuit board 110 together with the regulator component 120, and a passive element 160.

  The semiconductor element 150 is a semiconductor chip such as a large scale integration (LSI) or a semiconductor package including such a semiconductor chip. The semiconductor element 150 is mounted on the circuit board 110 using bumps 151 such as solder. An underfill resin 152 is filled between the semiconductor element 150 and the circuit board 110 in order to increase their connection strength. A heat sink 131 is provided on the semiconductor element 150 via a heat conductive material 153 such as solder.

The passive element 160 is a component such as a capacitor or a resistor, and is mounted on the circuit board 110 using a bonding material 161 such as solder.
On the surface and inside of the circuit board 110, predetermined conductor patterns (circuit patterns) such as the terminals 111 and the wirings and vias connected thereto are provided. The regulator component 120, the semiconductor element 150, and the passive element 160 are electrically connected to predetermined conductor patterns of the circuit board 110 through the terminals on the lower surface (terminals 121 described later), the bumps 151, and the bonding material 161, respectively. .

  A bump 113 electrically connected to a predetermined conductor pattern of the circuit board 110 is provided on the side of the circuit board 110 opposite to the mounting surface side of the regulator component 120, the semiconductor element 150, and the like. For example, solder is used for the bumps 113.

  The regulator component 120, the semiconductor element 150, and the passive element 160 on the circuit board 110 are mounted on an inner area of a frame 180 provided on the circuit board 110 using an adhesive 170. The frame 180 functions as a stiffener that suppresses deformation such as warpage of the circuit board 110. The frame 180 is formed integrally with or separately from the heat sink 131. The heat sink 130 is provided on the frame 180 using an adhesive 190.

The electronic device 100 can be mounted on another electronic component or electronic device by using the bumps 113 provided on the circuit board 110.
Here, the regulator component 120 used for the electronic device 100 as described above will be further described.

  FIG.3 and FIG.4 is a figure which shows an example of the regulator components which concern on 2nd Embodiment. FIGS. 3A and 3B are external views of an example of a regulator component according to the second embodiment, and FIG. 3A is an external perspective schematic view of the regulator component as viewed from the top side. FIG. 3B is an external perspective schematic view of the regulator component as viewed from the lower surface side. FIGS. 4 (A) and 4 (B) are schematic cross-sectional views of regulator components according to the second embodiment, and FIG. 4 (A) is a schematic cross-sectional view of L4-L4 in FIG. 2 (C), FIG. 4 (B) is a schematic cross-sectional view taken along line L5-L5 of FIG. 2 (C).

  The regulator component 120 is mounted on the circuit substrate 110 together with the semiconductor element 150, and performs control to keep the voltage and current supplied to the semiconductor element 150 constant. FIGS. 3A, 3 B, 4 A, and 4 B illustrate a dual flat pack no-leaded (DFN) package as an example of the regulator component 120.

  As shown in FIGS. 3A and 3B, the regulator component 120 includes a plurality of terminals 121 provided on the lower surface 120b along the side surface 120e and the side surface 120f. The regulator component 120 is electrically connected to the circuit board 110 using the terminals 121 of the lower surface 120 b.

  Furthermore, as shown in FIG. 3B, the regulator component 120 is provided on the lower surface 120b thereof with a terminal 122 which is electrically independent of the group of terminals 121. The terminal 122 of the lower surface 120 b functions as a heat sink for dissipating heat from the regulator component 120 that generates heat during operation. The terminal 122 may function as an electrical terminal for electrically connecting the regulator component 120 to the circuit board 110.

  The regulator component 120 includes a terminal 121, a terminal 122, a semiconductor element 123, a wire 124, and a sealing resin 125, as shown in FIGS. 4 (A) and 4 (B). The semiconductor element 123 is mounted on the terminal 122 which functions as a heat sink. The semiconductor element 123 is connected by a wire 124 to a terminal 121 used for electrical connection with the circuit board 110. The terminal 121, the terminal 122, the semiconductor element 123, and the wire 124 are sealed with a sealing resin 125 so that the surface of part of the terminal 121 and part of the surface of the terminal 122 are exposed.

The regulator component 120 of the external appearance shown to FIG. 3 (A) and FIG. 3 (B) has an internal structure as shown, for example to this FIG. 4 (A) and FIG. 4 (B).
The terminal 121 of the regulator component 120 is bonded to the terminal 111 of the circuit board 110 provided at the corresponding position using a bonding material 126 such as solder. Thereby, the regulator component 120 and the circuit board 110 are electrically connected.

  As shown in FIGS. 4A and 4B, the regulator component 120 is surrounded by a conductor layer 140 provided continuously to the upper surface 120a and the lower surface 120b and the side surface 120c and the side surface 120d. For example, solder is used for the conductor layer 140.

  The conductor layer 140 of the lower surface 120 b of the regulator component 120 is bonded to the terminal 112 of the circuit board 110 provided at a position corresponding to the terminal 122 (heat dissipation plate) of the regulator component 120. The regulator component 120 is thermally connected to the circuit board 110 by the terminal 122, the conductor layer 140 and the terminal 112. The regulator component 120 is also thermally connected to the circuit board 110 by the terminal 121, the bonding material 126, and the terminal 111, which electrically connect the regulator component 120 to the circuit board 110.

The conductor layer 140 on the top surface 120 a of the regulator component 120 is bonded to the heat sink 130. Thereby, the regulator component 120 and the circuit board 110 are thermally connected.
FIG. 5 is a view showing an example of an assembly process of the electronic device according to the second embodiment. FIG. 5A is a schematic sectional view of an essential part of an example of a regulator component arranging step according to the second embodiment, and FIG. 5B is an essential part of an example of a heat sink arranging step according to the second embodiment. It is a cross-sectional schematic diagram.

  At the time of assembly, first, as shown in FIG. 5A, regulator component 120 provided with continuous conductor layer 140 surrounding upper surface 120a and lower surface 120b and side surface 120c and side surface 120d is disposed on circuit board 110. . Next, as shown in FIG. 5B, the heat sink 130 is disposed on the conductor layer 140 surrounding the regulator component 120. Then, the conductor layer 140 is bonded to the circuit board 110 (the terminal 112 thereof) and the heat sink 130. For example, the conductor layer 140 is bonded to the circuit board 110 and the heat sink 130 by heating and melting the conductor layer 140 using solder.

By such a method, the circuit board 110, the regulator component 120, and the heat sink 130 can be bonded to each other using the conductor layer 140.
By the way, the regulator component 120 can generate heat during operation. When the temperature of the regulator component 120 becomes higher than the guaranteed temperature due to heat, the operating speed may be reduced due to the increase in the resistance of the wiring therein. In addition, if the regulator component 120 continues to be used in an environment that includes high temperature, the regulator component 120 may be affected by long-term effects such as stress load damage that occurs due to deterioration of the material being used and repeated heating and cooling. The life span of the Overheating of the regulator component 120 may degrade the performance and reliability of devices including the regulator component 120 and other electronic components connected thereto.

  On the other hand, in the electronic device 100, overheating of the regulator component 120 is effectively suppressed by the continuous conductor layer 140 surrounding the upper surface 120a and the lower surface 120b and the side surface 120c and the side surface 120d of the regulator component 120.

  That is, in the electronic device 100, the conductor layer 140 is provided, so that the space between the lower surface 120b of the regulator component 120 and the circuit board 110, and between the upper surface 120a of the regulator component 120 and the heat dissipation plate 130, is efficient. Heat transfer is possible. In the electronic device 100, the conductor layer 40 is also provided on the side surface 20c and the side surface 20d of the regulator component 120, so that the heat between the circuit board 110 and the heat sink 130 arranged with the regulator component 120 interposed therebetween. It becomes a conduction path. This enables efficient heat transfer between the circuit board 110 and the heat sink 130. Furthermore, in the electronic device 100, the conductor layer 40 of the side surface 120c and the side surface 120d of the regulator component 120 functions as a heat dissipation member, and the heat of the regulator component 120 can be dissipated efficiently to the outside.

  As described above, in the electronic device 100, the conductor layer 140 enables efficient heat transfer between the circuit board 110, the regulator component 120 and the heat sink 130, and the conductor layer 140 of the side surface 120c and the side surface 120d of the regulator component 120. Efficient heat dissipation is realized. As a result, the heat generated by the regulator component 120 is efficiently transferred to the circuit board 110 and the heat sink 130 and dissipated therefrom, and is also dissipated efficiently from the exposed conductor layer 140. Overheating can be effectively suppressed.

  It is possible to realize the electronic device 100 with high performance and reliability by suppressing the performance deterioration and the failure due to the heat of the regulator component 120 and further the electronic device 100 including the same.

Here, an example of the electronic device in which the conductor layer 140 as described above is not provided on the regulator component 120 will be described.
6 and 7 show an example of an electronic device according to another embodiment. 6A is a schematic cross-sectional view of an example of an electronic device according to another embodiment, FIG. 6B is a plan view of an example of an electronic device according to another embodiment, and FIG. 6C is an electronic device according to another embodiment. It is a principal part plane schematic diagram of an example. FIG. 6A is a schematic sectional view taken along line L6-L6 of FIG. FIG. 6 (C) is an enlarged view of a Y portion in FIG. 6 (B). 7 (A) is a schematic cross-sectional view taken along line L7-L7 in FIG. 6 (C), and FIG. 7 (B) is a schematic cross-sectional view taken along line L8-L8 in FIG. 6 (C).

  Moreover, FIG. 8 is a figure which shows an example of the assembly process of the electronic device which concerns on another form. FIG. 8 (A) is a schematic cross-sectional view of an essential part of an example of a regulator component placement process according to another embodiment, FIG. 8 (B) is a schematic cross-sectional view of an essential part of an adhesive material placement process according to another embodiment, FIG. 2.) is a cross-sectional schematic view of an example of a heat sink disposing step according to another embodiment.

  The electronic device 100A shown in FIGS. 6A to 6C and FIGS. 7A and 7B does not include the conductor layer 140 surrounding the regulator component 120 as described above. This differs from the electronic device 100 according to the second embodiment. In the electronic device 100A, the regulator component 120 (the terminal 122 thereof) is bonded to the circuit board 110 (the terminal 112 thereof) via the bonding material 127A, and to the heat sink 130 via the bonding material 128A. For example, solder is used for the bonding material 127A for bonding the regulator component 120 and the circuit board 110, and resin is used for the bonding material 128A for bonding the regulator component 120 and the heat sink 130.

  At the time of assembly, as shown in FIG. 8A, a bonding material 127A such as solder is supplied on the terminals 112 of the circuit board 110, the regulator component 120 is disposed thereon, and the regulator component 120 and the circuit substrate 110 are provided. Are bonded by the bonding material 127A. For example, the regulator component 120 and the circuit board 110 are bonded to each other through the bonding material 127A by heating and melting the bonding material 127A using solder. As shown in FIG. 8B, a bonding material 128A such as a resin is supplied onto the joined regulator component 120. Then, as shown in FIG. 8C, the heat dissipation plate 130 is disposed on the bonding material 128A, and the regulator component 120 and the heat dissipation plate 130 are bonded by the bonding material 128A.

  In the electronic device 100A (FIGS. 6 and 7) including the structural portion assembled in this manner, the heat transfer between the regulator component 120 and the circuit board 110 is performed via the bonding material 127A, and the regulator component 120 and the heat dissipation plate Heat transfer between 130 and 130 is performed via the bonding material 128A.

  In the electronic device 100A, when the thermal conductivity of the bonding material 128A is low, the heat transfer efficiency from the regulator component 120 to the heat sink 130 is low. Further, in the electronic device 100A, since the sealing resin 125 is exposed on the side surface of the regulator component 120, the heat dissipation from the regulator component 120 itself is not high. Even if the heat of the regulator component 120 is transferred to the circuit board 110 via the bonding material 127A, the heat dissipation from the circuit board 110 is limited. In the electronic device 100A, for example, such a factor may cause the regulator component 120 to overheat.

  On the other hand, the electronic device 100 (FIGS. 2 to 5) according to the second embodiment includes the upper surface 120a and the lower surface 120b of the regulator component 120 and the continuous conductor layer 140 surrounding the side surface 120c and the side surface 120d. . The conductor layer 140 enables efficient heat transfer between the circuit board 110, the regulator component 120 and the heat sink 130, and efficient heat dissipation from the conductor layer 140 of the side surface 120 c and the side surface 120 d of the regulator component 120. ing. Thereby, in the electronic device 100, it is possible to effectively suppress the overheating of the regulator component 120.

Further, in the electronic device 100A as shown in FIG. 6 and FIG. 7, there is a possibility that the following trouble as shown in FIG. 9 will occur.
FIG. 9 is a diagram for explaining an example of a defect that may occur in the electronic device according to another embodiment. FIG. 9A is a diagram showing an example of a state when the electronic device according to another embodiment is heated, and FIG. 9B is a diagram showing an example of a state when the electronic device according to another embodiment is cooled after being heated is there.

  For example, after the electronic device 100A is assembled, the electronic device 100A is mounted on another electronic device or the like using the bumps 113 provided on the circuit board 110 (secondary mounting). The secondary mounting includes the step of melting the bumps 113 using solder by reflow heating. If the melting point of the solder used for the bonding material 127A of the regulator part 120 is equal to or lower than the melting point of the solder used for the bumps 113 of the circuit board 110, the regulator part is produced by reflow heating during secondary mounting The bonding material 127A of 120 may also melt.

  In the reflow heating at the time of secondary mounting, deformation such as waviness may occur in the circuit board 110. When such a deformation occurs in the circuit board 110, as shown in FIG. 9A, the distance between the circuit board 110 and the heat sink 130 may be narrowed. When the bonding material 127A between the circuit board 110 and the regulator component 120 is melted together with the bumps 113 by the reflow heating at the time of secondary mounting, if the distance between the circuit board 110 and the heat sink 130 becomes narrow in this way, The melted bonding material 127A is crushed. Then, when the bonding material 127A is crushed, a phenomenon in which a part thereof (shown as the bonding material 127Aa in FIG. 9A) pops out from between the circuit board 110 and the regulator component 120 occurs.

  When reflow heating is ended from the state as shown in FIG. 9A and cooling is started, a force acts on the circuit board 110 so that deformation such as waviness that has occurred tends to be restored. As a result of such a force acting, as shown in FIG. 9B, the space between the circuit board 110 and the heat sink 130 may increase. As described above, while the distance between the circuit board 110 and the heat sink 130 widens, the bonding material 127A melted at the time of reflow heating and the bonding material 127Aa that pops out are solidified by cooling. Since a part of the bonding material 127Aa protrudes between the circuit board 110 and the regulator component 120, it is in a state of being bonded with a smaller amount of bonding material 127A than the initial one before the reflow heating.

  If the bonding material 127Aa protruding from between the circuit board 110 and the regulator component 120 is scattered on a conductor pattern such as a terminal or wiring on the circuit board 110, a short circuit may occur. In addition, a part of the bonding material 127Aa pops out, so that the amount of bonding material 127A bonding between the circuit board 110 and the regulator component 120 is reduced, and the thermal resistance between the circuit substrate 110 and the regulator component 120 is reduced. And heat dissipation may deteriorate. Furthermore, since the bonding material 127A between the circuit board 110 and the regulator component 120 is reduced, the stress applied to the bonding material 127A due to the temperature change during use of the electronic device 100A tends to cause a crack, and the heat dissipation property is deteriorated. there is a possibility.

  On the other hand, in the electronic device 100 (FIGS. 2 to 5) according to the second embodiment, the short circuit and the deterioration of the heat dissipation can be suppressed even by the reflow heating at the secondary mounting. This point will be described with reference to the following FIG.

  FIG. 10 is a view for explaining an electronic device according to the second embodiment. FIG. 10 (A) shows an example of the state when the electronic device according to the second embodiment is heated, and FIG. 10 (B) shows when the electronic device according to the second embodiment is cooled after heating It is a figure which shows an example of the state of.

  When the melting point of the solder used for the conductor layer 140 is equal to or lower than the melting point of the solder used for the bumps 113 of the circuit board 110, the conductor layer 140 can be melted by reflow heating during secondary mounting .

  In the reflow heating at the time of this secondary mounting, if deformation such as waviness occurs in the circuit board 110, as shown in FIG. 10A, a force to try to narrow the distance between the circuit board 110 and the heat sink 130. Thereby, a force acts to crush the molten conductor layer 140. However, in the electronic device 100, since the conductor layer 140 surrounding the regulator component 120 is entirely melted, the force to crush the conductor layer 140 is between the regulator component 120 and the circuit board 110, and the regulator component It disperses in the upper and lower parts between 120 and the heat sink 130. As a result, in the electronic device 100, the amount (displacement amount) by which the conductor layer 140 is crushed can be reduced, and the conductor layer 140 can be suppressed from being separated from the periphery of the regulator component 120 and jumping out.

  In the electronic device 100, the conductor layer 140 is also provided on the side surface 120c and the side surface 120d of the regulator component 120. Therefore, even if the distance between the circuit board 110 and the heat sink 130 narrows and the conductor layer 140 is squeezed, the conductor layer 140 which tends to fly out between the regulator component 120 and the circuit board 110 or the heat sink 130 is shown in FIG. It is guided to the side surface 120c or the side surface 120d as shown in 10 (A) (shown by dotted arrow in the figure). As described above, a part of the conductor layer 140 a that is going to jump out from between the regulator component 120 and the circuit board 110 or the heat sink 130 is a side surface 120 c or a side surface 120 d of the regulator component 120 (here, the side surface 120 c is illustrated) Induced and trapped. As a result, the crushed conductor layer 140 can be more effectively suppressed from being separated from the periphery of the regulator component 120 and jumping out.

  When reflow heating is ended from the state as shown in FIG. 10A and cooling is started, deformation such as waviness that has occurred in the circuit board 110 tends to be restored, and the electronic device 100 becomes as shown in FIG. As shown in FIG. 5, a force acts to widen the distance between the circuit board 110 and the heat sink 130. In this case, a regulator including a portion between the circuit board 110 and a portion between the circuit board 110 and a portion between the circuit board 110 and a portion of the conductor layer 140a induced and trapped in the side surface 120c and the side surface 120d of the regulator component 120 Return to the periphery of the part 120 (shown by dotted arrows in the figure). Thereby, a state in which a certain amount of conductor layer 140 exists between the regulator component 120 and the circuit board 110 and the heat sink 130 can be obtained.

  As described above, in the electronic device 100, the scattering of the melted conductor layer 140 can be suppressed, and a short circuit due to the scattering of the conductor layer 140 can be effectively suppressed. Furthermore, in the electronic device 100, it is possible to effectively suppress the deterioration of the heat dissipation due to the shortage of the conductor layer 140 between the regulator component 120 and the circuit board 110 and the heat sink 130.

Further, in the electronic device 100A as shown in FIGS. 6 and 7, there may be a problem as shown in the following FIG.
FIG. 11 is a diagram for explaining another example of a defect that may occur in the electronic device according to another embodiment. FIG. 11 is a schematic sectional view of an essential part of an example of the electronic device according to another embodiment.

  In the electronic device 100A, when bonding between the regulator component 120 and the circuit board 110 with the bonding material 127A using solder (FIG. 8A), air is mixed in the bonding material 127A, as shown in FIG. Such void 129 may occur. In that case, the heat dissipation plate 130 is bonded on the regulator component 120 which is bonded to the circuit board 110 with the bonding material 127A including such voids 129 using the bonding material 128A such as resin. The void 129 may reduce the heat transfer efficiency between the regulator component 120 and the circuit board 110, thereby preventing the heat dissipation from the regulator component 120 and contributing to the overheating of the regulator component 120.

  If the product is inspected before shipment, such as X-ray inspection, which specifies the size of void 129 to improve the quality, and a product containing void 129 of a certain size or more is rejected, the reject component is lost and the product cost Could contribute to an increase in There is also a technology to suppress the occurrence of the void 129, such as vacuum heating for bonding by the bonding material 127A between the regulator component 120 and the circuit board 110, but equipment cost for realizing it is required and the manufacturing process is complicated. And may increase production costs.

  On the other hand, in the electronic device 100 according to the second embodiment (FIGS. 2 to 5), even if the conductor layer 140 includes the void 129, it is possible to suppress the deterioration of the heat dissipation and the increase of the cost. it can. This point will be described with reference to the following FIG.

FIG. 12 is a diagram for explaining an electronic device according to the second embodiment. FIG. 12 is a schematic sectional view of an essential part of an example of the electronic device according to the second embodiment.
In the electronic device 100, a conductor layer 140 using solder is provided so as to surround the upper surface 120a and the lower surface 120b, and the side surface 120c and the side surface 120d of the regulator component 120. Therefore, the heat transfer efficiency between the regulator component 120 and the heat sink 130 is relatively high, the heat of the regulator component 120 is efficiently transferred to the heat sink 130, and the heat is dissipated from the heat sink 130 to the outside of the electronic device 100. can do. Furthermore, in the electronic device 100, the heat of the regulator component 120 can be dissipated to the outside from the conductor layer 140 provided on the side surface 120c and the side surface 120d.

  In the electronic device 100, even if the void 129 is contained in the conductor layer 140 as shown in FIG. 12, the heat of the regulator component 120 is transferred at the portion of the conductor layer 140 of the upper surface 120a, the side surface 120c and the side surface 120d. , Can dissipate heat. As a result, it is possible to suppress a decrease in heat transfer efficiency and a decrease in heat dissipation efficiency due to the void 129. As a result, it is possible to avoid equipment costs for realizing the technology of suppressing the generation of the void 129 and complication of the manufacturing process and increase of the manufacturing cost by adopting such a technology. Cost reduction can be achieved.

Subsequently, an example of a method of manufacturing the electronic device 100 as described above will be described.
13 to 19 are views showing an example of the method of manufacturing an electronic device according to the second embodiment. Hereinafter, each manufacturing process will be described in order with reference to FIGS. 13 to 19.

The preparation process of the regulator component 120 provided with the conductor layer 140 will be described.
FIG. 13 is a view showing an example of a regulator component preparation step according to the second embodiment, and FIG. 13 (A) is a schematic plan view of a conductor sheet, and FIG. 13 (B) is a regulator component after conductor sheet arrangement. FIG. 13C is an external perspective schematic view of the regulator component after the conductor sheet is disposed, as viewed from the lower surface side.

  Here, a conductor sheet 141 as shown in FIG. 13 (A) is prepared. The conductor sheet 141 is wound around the regulator component 120 as shown in FIG. 3A and FIG. 3B to form the conductor layer 140, and is formed using, for example, solder. The conductor sheet 141 has a first portion 141a corresponding to the upper surface 120a of the regulator component 120 on which it is wound, a second portion 141b corresponding to the lower surface 120b, a third portion 141c corresponding to the side surface 120c, and a fourth corresponding to the side surface 120d. It includes a portion 141d.

  Such a conductive sheet 141 is sequentially wound around the upper surface 120a, the side surface 120c, the lower surface 120b, and the side surface 120d of the regulator component 120, and the fourth portion 141d at both ends and the first portion 141a are connected. As a result, as shown in FIGS. 13B and 13C, the conductor sheet 141 is wound, and the regulator component 120 provided with the continuous conductor sheet 141, that is, the conductor layer 140 is obtained.

  The first portion 141 a of the conductor sheet 141 is formed to have a planar size so as to cover the top surface 120 a of the regulator component 120. The second portion 141b of the conductor sheet 141 is formed on the lower surface 120b of the regulator component 120 so as not to be in contact with the terminals 121 provided along the side surface 120e and the side surface 120f, and is wider than the first portion 141a. Is formed in a narrow plane size. The third portion 141 c and the fourth portion 141 d of the conductor sheet 141 are each formed in a planar shape whose width is narrowed from the portion connected with the first portion 141 a to the portion connected with the second portion 141 b.

  The conductor sheet 141 having such a planar size and planar shape is wound so as to surround the regulator component 120, and the terminal 121 (FIG. 3A) for electrical connection with the circuit board 110 is exposed from the conductor layer 140, The terminal 122 for heat radiation (FIG. 3B) is covered with the conductor layer 140. Thereby, the regulator component 120 provided with the conductor layer 140 as shown in FIG. 13 (B) and FIG. 13 (C) is obtained.

  A conductor sheet 141 having a planar size and a planar shape in accordance with the form of the regulator component 120 to be used is prepared, and the conductor sheet 140 is wound to prepare the regulator component 120 provided with the conductor layer 140.

The regulator component 120 provided with such a conductor layer 140 may be performed by the regulator component disposing step (FIG. 17) described later.
FIG. 14 is a view showing an example of the passive element disposing step according to the second embodiment, and FIG. 14 (A) is a schematic cross-sectional view of the passive element disposing step, and FIG. 14 (B) is a passive element disposing step It is a plane schematic diagram. FIG. 14A is a schematic cross-sectional view taken along line L9-L9 in FIG.

First, a circuit board 110 as shown in FIGS. 14 (A) and 14 (B) is prepared. A printed circuit board can be used for the circuit board 110.
As shown in FIG. 14B, the circuit board 110 has the terminals 111 and 112 provided in the mounting area of the regulator component 120, the terminal 115 provided in the mounting area of the semiconductor element 150, and the passive element 160. And a terminal 116 provided in the mounting area of The terminals 111 and 112 and the terminals 115 and 116 are electrically connected to conductor patterns (not shown) provided on the circuit board 110.

  Solder paste is supplied onto the terminal 116 of the prepared circuit board 110 using a printing method, a dispensing method, or the like, and a passive element 160 such as a capacitor is disposed. Then, reflow heating is performed at or above the melting point of the solder contained in the solder paste. Thus, as shown in FIGS. 14A and 14B, the passive element 160 is bonded to the circuit board 110 (the terminal 116 thereof) via the bonding material 161.

  FIG. 15 is a view showing an example of the semiconductor element disposing step according to the second embodiment, and FIG. 15 (A) is a schematic cross-sectional view of the semiconductor element disposing step, and FIG. It is a plane schematic diagram. FIG. 15A is a schematic cross-sectional view taken along line L10-L10 in FIG.

  After bonding the passive element 160, the semiconductor element 150 provided with the bumps 151 using solder is disposed on the terminals 115 of the circuit board 110, and reflow heating is performed at a temperature higher than the melting point of the solder contained in the bumps 151. As a result, as shown in FIGS. 15A and 15B, the semiconductor element 150 is bonded to the circuit board 110 (the terminal 115 thereof) via the bumps 151.

  Note that solder paste may be supplied on the terminals 115 of the circuit board 110 in advance before bonding the bumps 151 of the semiconductor element 150. In this case, the solder and bumps 151 in the solder paste are melted and integrated by reflow heating, whereby the circuit board 110 and the semiconductor element 150 are bonded.

  After the circuit board 110 and the semiconductor element 150 are joined, an underfill resin 152 is supplied between them as shown in FIGS. Thereby, the connection strength between the circuit board 110 and the semiconductor element 150 can be improved.

  FIG. 16 is a view showing an example of the first heat sink arranging step according to the second embodiment, and FIG. 16 (A) is a schematic sectional view of the first heat sink arranging step, and FIG. 1 is a schematic plan view of a heat sink disposing step. FIG. 16A is a schematic cross-sectional view taken along line L11-L11 in FIG.

After bonding of the passive element 160 and the semiconductor element 150, as shown in FIGS. 16A and 16B, the heat sink 131 is disposed on the circuit board 110.
The heat sink 131 is prepared, for example, as an integral part of the frame 180. A heat conductive material 153 using solder is supplied on the semiconductor element 150 bonded to the circuit board 110, the heat dissipation plate 131 (and the frame 180) is disposed thereon, and the heat conductive material 153 is interposed by heating. Then, the heat sink 131 is bonded to the semiconductor element 150. When the heat sink 131 and the frame 180 are integrated, the frame 180 is bonded onto the circuit board 110 with the adhesive 170 together with the bonding of the heat sink 131.

  When the heat dissipation plate 131 and the frame 180 are separate parts, the frame 180 is bonded onto the circuit board 110 with the adhesive 170, and then the heat dissipation plate 131 is bonded over the frame 180 with an adhesive or the like. At the same time, the heat radiation plate 131 is bonded onto the semiconductor element 150 by the heat conduction material 153.

  As shown in FIG. 16A, a protrusion 131 a is provided on the heat sink 131 so as to surround the semiconductor element 150. When bonding the heat sink 131 and the semiconductor element 150 by providing the protrusion 131 a, even if the heat conductive material 153 using solder is melted by reflow heating, the heat conductive material 153 is a circuit around the semiconductor element 150. It is suppressed that it flows out or scatters on the substrate 110 to cause a short circuit.

  After bonding the heat sink 131, as shown in FIGS. 16A and 16B, the circuit board 110 is provided on a terminal (not shown) provided on the side opposite to the mounting surface side of the semiconductor element 150 and the like. , And a bump 113 using solder is provided. For example, solder balls are mounted on the terminals of the circuit board 110 and reflow heating is performed to form the bumps 113.

  Prior to the arrangement of the regulator component 120 to be performed later, solder paste 142 is supplied to the circuit board 110 on the terminals 111 and 112 of the mounting region of the regulator component 120 as shown in FIG. 16B, for example. Be done.

  FIG. 17 is a view showing an example of a regulator component arranging step according to the second embodiment, and FIG. 17 (A) is a schematic cross-sectional view of the regulator component arranging step, and FIG. 17 (B) is a regulator component arranging step It is a plane schematic diagram. FIG. 17A is a schematic cross-sectional view taken along line L12-L12 in FIG.

  A regulator component 120 (FIGS. 13B and 13C) in which a conductor layer 140 is provided by winding the conductor sheet 141 (FIG. 13A) is shown in FIGS. 17A and 17B. As shown, it is disposed on the circuit board 110 (its terminals 111 and 112).

  The solder paste 142 (FIG. 16B) is supplied onto the terminals 111 and the terminals 112 of the circuit board 110 prior to the arrangement of the regulator parts 120 provided with the conductor layer 140, whereby the regulator It can be temporarily fixed on 110.

  When arranging the regulator component 120 provided with the conductor layer 140, the terminal 121 for electrical connection exposed from the conductor layer 140 is arranged on the solder paste 142 supplied on the terminal 111 of the circuit board 110. At the same time, the conductor layer 140 covering the terminal 122 for heat dissipation of the regulator component 120 is disposed on the solder paste 142 supplied on the terminal 112 of the circuit board 110.

  FIG. 18 is a view showing an example of the adhesive arranging step according to the second embodiment, and FIG. 18 (A) is a schematic sectional view of the adhesive arranging step, and FIG. 18 (B) is an adhesive arranging step It is a plane schematic diagram. FIG. 18A is a schematic cross-sectional view taken along line L13-L13 in FIG.

  After disposition of the regulator component 120 provided with the conductor layer 140, as shown in FIGS. 18A and 18B, an adhesive 190 for bonding the heat dissipation plate 130 disposed later is disposed on the frame 180. Deploy.

  The adhesive 190 may be, for example, a thermosetting resin that cures at a temperature equal to or lower than the bonding temperature of the conductor layer 140 described later, or a thermoplastic resin that softens at a temperature higher than the bonding temperature of the conductor layer 140 described later. An ultraviolet curable resin or the like which is cured by ultraviolet irradiation is used.

  FIG. 19 is a view showing an example of the second heat dissipating plate disposing step according to the second embodiment, and FIG. 19 (A) is a schematic cross-sectional view of the second heat dissipating plate disposing step; FIG. 2 is a schematic plan view of a heat sink disposing step. FIG. 19A is a schematic cross-sectional view taken along line L14-L14 in FIG.

  As shown in FIGS. 19A and 19B, the heat sink 130 is disposed on the frame 180 provided with the adhesive 190. Then, heating is performed at a temperature (joining temperature) at which the solder of the conductor layer 140 and the solder paste 142 is melted.

  By this heating, the conductor layer 140 is bonded to the circuit board 110 (the terminal 112 thereof) and to the heat dissipation plate 130 provided on the frame 180 via the adhesive 190. Thus, the circuit board 110, the regulator component 120, and the heat sink 130 can be thermally connected to each other through the conductor layer 140.

  Further, by this heating, the terminals 121 (FIGS. 13A and 13B) of the regulator component 120 are made of the circuit board 110 using the solder paste 142 (the bonding material 126 shown in FIG. 4B). It joins to the terminal 111 (FIG. 16 (B)). Thereby, the state where the regulator component 120 is electrically connected to the circuit board 110 is obtained.

  For example, the electronic device 100 can be obtained by the method as described above. The obtained electronic device 100 can be mounted (secondary mounting) on another electronic component or electronic device using the bumps 113 of the circuit board 110.

  Depending on the type, the regulator component 120 may be degraded in performance and reliability by being exposed to high temperature. As a result, the number of times that the regulator component 120 can be exposed to relatively high temperature heating, such as that involving melting of the solder, may be limited. In the above method, such heating can be performed on the regulator component 120 only once at the time of bonding the conductor layer 140 to the circuit board 110 and the heat sink 130 as shown in FIG. . Even when heating is performed when the electronic device 100 is secondarily mounted, the number of times of heating can be suppressed to two. Therefore, it is possible to realize the electronic device 100 provided with the regulator component 120 with high performance and high reliability.

  Further, in the method of manufacturing the electronic device 100 described above, the regulator component 120 is applied to both the circuit board 110 and the heat dissipation plate 130 by melting the conductor layer 140 provided so as to surround the regulator component 120 at a predetermined bonding temperature. It can be joined at one time.

  On the other hand, in the electronic device 100A as shown in FIG. 6 and FIG. 7, the procedure shown in FIG. 8 (A) to FIG. 8 (C) is performed. That is, first, a bonding material 127A using, for example, solder is supplied on the circuit board 110, the regulator component 120 is disposed thereon, and the regulator component 120 and the circuit board 110 are bonded with the bonding material 127A by heating. (FIG. 8 (A)). Next, a bonding material 128A of resin, for example, is supplied on the joined regulator component 120 (FIG. 8B), the heat sink 130 is disposed thereon, and the regulator component 120 and the heat sink 130 are heated by heating. Bonding is performed with the bonding material 128A (FIG. 8C).

  In the method of manufacturing the electronic device 100 described above, the step of bonding the regulator component 120 on the circuit board 110 with the bonding material 127A by heating as shown in FIG. 8A, and the regulator as shown in FIG. 8B. The process of supplying the bonding material 128A onto the component 120 can be reduced. According to the method of manufacturing the electronic device 100 using the conductor layer 140 as described above, the number of manufacturing steps can be reduced, and the efficiency of the manufacturing and the cost reduction can be achieved.

  In the step of bonding the conductor layer 140 provided so as to surround the regulator component 120, and the circuit board 110 and the heat sink 130 (FIG. 19), a force acts such that the melted conductor layer 140 is crushed. Things can happen. Even in such a case, the scattering of the crushed conductor layer 140 can be suppressed, and the short circuit and the deterioration of the heat dissipation due to the scattering can be suppressed, as described in FIG. Further, even when the void 129 is generated in the conductor layer 140 as shown in FIG. 12, the conductor layer 140 surrounding the regulator component 120 can suppress the deterioration of the heat dissipation from the regulator component 120.

During the secondary mounting of the electronic device 100, as described with reference to FIG. 10, the scattering of the conductor layer 140, the short circuit and the deterioration of the heat dissipation due to it are effectively suppressed.
According to the method of manufacturing the electronic device 100 using the conductor layer 140 as described above, the electronic device 100 having high performance and reliability can be efficiently manufactured.

Next, a third embodiment will be described.
FIG. 20 is a view showing an example of a regulator component according to the third embodiment. 20 (A) and 20 (B) are external views of an example of a regulator part according to the third embodiment, and FIG. 20 (A) is a schematic external perspective view of the regulator part as viewed from the top side. FIG. 20B is an external perspective schematic view of the regulator component as viewed from the lower surface side.

  The regulator component 120A shown in FIG. 20A and FIG. 20B uses a material that allows molten solder to wet the surface of the sealing resin 125 provided so that the surfaces of the terminals 121 and 122 are exposed. It has the film | membrane 210 (base layer) formed. The regulator component 120A according to the third embodiment is different from the regulator component 120 according to the second embodiment in such a point.

  The film 210 is provided on the surface on which the conductor layer 140 is provided, that is, on the sealing resin 125 on the upper surface 120 a and the lower surface 120 b and the side surface 120 c and the side surface 120 d. For the film 210, various materials, such as Cu, nickel (Ni), gold (Au), etc., which are wettable when the solder used for the conductor layer 140 is melted can be used. On the film 210 provided on the surface of the sealing resin 125 as shown in FIGS. 20A and 20B, a conductor sheet 141 using solder as shown in FIG. 13A is used. The conductor layer 140 is formed by winding.

  When heating is performed at a temperature at which the solder of the conductor layer 140 is melted, such as the step of bonding the conductor layer 140 to the circuit board 110 and the heat sink 130 (FIG. 19), the melted conductor layer 140 Wet on the membrane 210 to effectively surround the regulator component 120. Furthermore, the outflow of the melted conductor layer 140 from above the underlying film 210 is suppressed, and the contact between the solder flowing by the melting and the terminal 121 of the lower surface 120 b is effectively suppressed.

Next, a fourth embodiment will be described.
FIG. 21 is a view showing an example of a regulator component according to the fourth embodiment. 21 (A) and 21 (B) are external views of an example of the regulator component according to the fourth embodiment, and FIG. 21 (A) is an external perspective schematic view of the regulator component as viewed from the top side; FIG. 21B is an external perspective schematic view of the regulator component as viewed from the lower surface side. 21 (C) and 21 (D) are cross-sectional schematic views of an example of the regulator component according to the fourth embodiment, and FIG. 21 (C) is a position of line L15-L15 of FIG. 21 (A). FIG. 21D is a schematic cross-sectional view taken along line L16-L16 in FIG. 21A.

  In the regulator component 120B shown in FIGS. 21A to 21D, the terminal 122 for heat radiation on which the semiconductor element 123 in the sealing resin 125 is mounted is from the lower surface 120b to the side 120c and the side 120d opposed to each other. It is provided to extend and further to the upper surface 120a. The regulator component 120B according to the fourth embodiment is different from the regulator component 120 according to the second embodiment in such a point.

  The terminal 122, the terminal 121, the semiconductor element 123, and the wire 124 are sealed with a sealing resin 125 so that the surfaces of the terminal 122 having such a shape and the terminal 121 for electrical connection are exposed, as illustrated in FIG. A regulator component 120B as shown in FIG. 21D is obtained. The conductor sheet 141 using solder as shown in FIG. 13A is wound around the surface of the exposed terminal 122 of the regulator component 120B, and the conductor layer 140 is formed. The terminal 122 may be made of a material which has high thermal conductivity and is wetted by molten solder, such as Cu, Ni, Au or the like.

  According to this regulator component 120B, the volume occupied by the sealing resin 125 having a relatively low thermal conductivity in the entire package can be reduced, and the heat dissipation can be enhanced by the terminal 122 provided so as to surround the semiconductor element 123. . By using a material that allows molten solder to be wetted for the terminal 122, this becomes a base (layer), and as in the third embodiment, the melted conductor layer 140 effectively surrounds the regulator component 120 and melts. The contact between the layer 140 and the terminal 121 for electrical connection is effectively suppressed.

The fifth embodiment will now be described.
FIG. 22 is a view showing an example of a regulator component according to the fifth embodiment. 22 (A) and 22 (B) are external views of an example of a regulator part according to the fifth embodiment, and FIG. 22 (A) is a schematic external perspective view of the regulator part as viewed from the top side. FIG. 22B is an external perspective schematic view of the regulator component as viewed from the lower surface side.

  The regulator component 120C shown in FIGS. 22A and 22B has a plurality of recesses or projections 220 on the surface of the sealing resin 125 provided so that the surfaces of the terminals 121 and 122 are exposed. doing. The regulator component 120C according to the fifth embodiment is different from the regulator component 120 according to the second embodiment in such a point.

  A conductive sheet 141 using solder as shown in FIG. 13 (A) on the surface of the sealing resin 125 provided with the concave or convex portions 220 as shown in FIGS. 22 (A) and 22 (B). To form a conductor layer 140. On the surface of the sealing resin 125 provided with the concave or convex portion 220, a film (film 210 in FIG. 20) to which molten solder gets wet as described in the third embodiment may be provided. As described above, by providing the concave portion or the convex portion 220 on the surface of the sealing resin 125, the surface area of the sealing resin 125 is increased, and the bonding effect between the conductor layer 140 and the regulator component 120C is enhanced by the anchor effect.

Next, a sixth embodiment will be described.
FIG. 23 is a view showing an example of the heat sink according to the sixth embodiment. FIG. 23A is a schematic cross-sectional view of main parts of a first modification of the heat sink according to the sixth embodiment, and FIG. 23B is a second modification of the heat sink according to the sixth embodiment. FIG. 23C is a schematic cross-sectional view of main parts of a third modification of the heat sink according to the sixth embodiment.

  As shown in FIG. 23A, the heat sink 130 has a material which gets wet when the solder used for the conductor layer 140 melts, as shown in FIG. 23A, in the bonding region with the conductor layer 140 provided so as to surround the regulator components 120 and the like. The membrane 230 used can be provided. For such a film 230, a material such as Cu, Ni, Au or the like can be used, for example. The film 230 can be provided in the bonding region of the heat sink 130 with the conductor layer 140 using a plating method. By providing the film 230, the bonding strength between the heat sink 130 and the conductor layer 140 can be improved.

  Also, as shown in FIG. 23B, the heat sink plate 130 has a recess 240 as shown in FIG. 23B or a joint region with a conductor layer 140 provided so as to surround the regulator component 120 and the like. Can also be provided. Such concave portions 240 and convex portions 250 can be formed by pressing, blasting, or the like of the heat sink 130. Alternatively, a member having such a recess 240 and a protrusion 250 may be separately prepared, and the member may be provided in a region of the heat dissipation plate 130 to be bonded to the conductor layer 140. A film on which the molten solder gets wet may be provided on the surface of the recess 240 and the protrusion 250. By providing the concave portion 240 and the convex portion 250, the anchor effect by the increase in the contact area with the conductor layer 140 can improve the bonding strength between the heat sink 130 and the conductor layer 140.

1, 100, 100A Electronic device 10, 20 Electronic component 20a, 120a Upper surface 20b, 120b Lower surface 20c, 20d, 20e, 20f, 120c, 120d, 120e Side surface 30 Heat dissipation member 40, 140, 140a Conductor layer 110 Circuit board 111 , 112, 115, 116, 121, 122 terminals 113, 151 bumps 120, 120A, 120B, 120C regulator parts 123, 150 semiconductor elements 124 wires 125 sealing resin 126, 127A, 127Aa, 128A, 161 bonding material 129 void 130, DESCRIPTION OF SYMBOLS 131 Heat sink 131a Protrusion 141 Conductor sheet 141a, 141b, 141c, 141d Portion 142 Solder paste 152 Underfill resin 153 Thermal conductive material 160 Passive element 170, 190 Adhesive 1 0 frame 210 230 film 220 concave or convex portion 240 concave 250 protrusions

Claims (6)

A substrate,
A semiconductor element provided above the substrate;
An electronic component provided above the substrate and at a position different from the semiconductor element in plan view;
A first heat dissipation member provided above the electronic component;
Wherein the first and second side surfaces to the upper and lower surfaces and opposing electronic components provided continuously, it viewed including the said substrate and the conductor layer connected to the first heat radiating member,
2. The electronic device according to claim 1, wherein the electronic component has a terminal on the lower surface that is electrically independent of the conductor layer, and is electrically connected to the substrate by the terminal .   The conductor layer is joined to the substrate at a portion provided on the lower surface of the electronic component, and is joined to the first heat dissipation member at a portion provided on the upper surface of the electronic component. An electronic device according to claim 1.   The electronic device according to claim 1, wherein portions of the conductor layer provided on the first side surface and the second side surface of the electronic component are exposed to the outside. A plurality of bumps provided on the surface of the substrate opposite to the surface on which the semiconductor element and the electronic component are provided;
The electronic device according to any one of claims 1 to 3 , further comprising: a second heat dissipation member provided on the semiconductor element and different from the first heat dissipation member. Arranging an electronic component having a conductor layer continuously provided on the upper surface and the lower surface and the opposing first and second side surfaces above the substrate;
Disposing a heat dissipating member above the electronic component;
And heating the conductor layer to melt it, and connecting the conductor layer to the substrate and the heat dissipation member. Preparing a series of conductor sheets corresponding to the upper surface, the first side surface, the lower surface and the second side surface of the electronic component;
By adhering the conductive sheet to the upper surface, the first side surface, the lower surface and the second side surface, a conductive layer provided continuously to the upper surface, the first side surface, the lower surface and the second side surface is provided. Forming step;
After the step of forming the conductor layer, disposing the electronic component above the substrate;
Disposing a heat dissipating member above the electronic component;
And a step of connecting the conductor layer to the substrate and the heat dissipation member.

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