JP6527612B2 - Multilayer ceramic capacitor - Google Patents

Description

  The present invention relates to a multilayer ceramic capacitor.

  A laminated ceramic capacitor generally comprises a substantially rectangular parallelepiped capacitor body defined by a length, a width and a height, and external electrodes provided at both ends in the longitudinal direction of the capacitor body. In the capacitor body, the first protective portion made of ceramic, the capacitance portion in which the plurality of internal electrode layers are stacked via the ceramic layer, and the second protective portion made of ceramic are arranged in layers in the height direction. Have. In addition, an edge of a portion of the plurality of inner electrode layers included in the capacitive portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. (See FIG. 1 of Patent Document 1 below).

  The mounting of the multilayer ceramic capacitor on a circuit board is achieved by bonding the surfaces to be bonded of the external electrodes of the multilayer ceramic capacitor to the surface of a pad provided on the circuit board using solder. Since the surface shape of the pad to which the bonded surface of each external electrode is bonded is generally a rectangle larger than the bonded surface shape of each external electrode, the end face of each external electrode after mounting is wetted by molten solder Solder fillets are formed (see FIGS. 1 and 2 of Patent Document 1 below).

  In this mounting structure, when a voltage, in particular an AC voltage, is applied to both external electrodes through each pad of the circuit board, expansion and contraction based on the electrostriction phenomenon (shrinkage such as contraction of the capacitive portion mainly in the length direction) Stress caused by the expansion and contraction is transmitted to the circuit board through the external electrode, the solder and the pad to cause vibration (warpage and restoration thereof mainly resulting in a depression between the two pads), and this vibration causes audible noise (So-called sounding) may occur.

  Incidentally, in Patent Document 1 described later, in order to suppress the noise, the “height of the solder fillet based on the surface of the pad” is referred to as “the distance between the surface of the pad and the capacitor body” + “under the capacitor body A mounting structure is described which is lower than the thickness of the side protection (see FIG. 2).

  However, since the solder fillet is formed based on the wetting of the molten solder to the end face of each external electrode, a special method is used because the solder wettability of the end face of each external electrode is good. Unless otherwise stated, it is extremely difficult to control the "height of the solder fillet with respect to the surface of the pad".

  To give a specific example, in the case of a laminated ceramic capacitor in which the height of the end face of each external electrode is 500 μm, the lower end of the end face of each external electrode is actually selected, even if the amount of solder is the same. When the height of the solder fillet when used as a reference is well over 200 μm or less than 200 μm, a non-mounting defect occurs.

  That is, since the mounting structure described in Patent Document 1 below does not adopt a special method for controlling "the height of the solder fillet with respect to the surface of the pad", in fact, "the surface of the pad It is extremely difficult to make the standard solder fillet height lower than the distance between the surface of the pad and the capacitor body + the thickness of the protective portion on the lower side of the capacitor body. Sex is very low.

JP, 2013-046069, A

  An object of the present invention is to provide a laminated ceramic capacitor having high practicability for suppressing noise in a mounted state.

  In order to achieve the above object, the present invention is a laminate comprising a substantially rectangular parallelepiped capacitor body defined by a length, a width and a height, and external electrodes provided at both ends in the longitudinal direction of the capacitor body. A ceramic capacitor, wherein the capacitor body comprises (1) a first protective portion made of a ceramic, (2) a capacitive portion in which a plurality of internal electrode layers are stacked via a ceramic layer, and (3) made of a ceramic The electrostriction alleviating part, (4) the characteristic adjusting part in which the plurality of internal electrode layers are stacked via the ceramic layer, and (5) the second protective part made of ceramic are arranged in layers in the height direction. And an edge of a portion of the plurality of inner electrode layers included in the capacitive portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. Connected to and included in the characteristic adjustment unit The edge of a portion of the number of internal electrode layers is electrically connected to one of the outer electrodes, and the edge of the remaining portion is electrically connected to the other of the outer electrodes, and the thickness of the capacitor portion Assuming that the length is T2, the thickness of the electrostrictive relaxation portion is T3, and the thickness of the characteristic adjustment portion is T4, the T2, T3 and T4 satisfy the condition of T2> T3> T4.

  According to the present invention, it is possible to provide a laminated ceramic capacitor having high practicability with respect to the suppression of noise in the mounted state.

FIG. 1 is a top view of a multilayer ceramic capacitor (first embodiment) to which the present invention is applied. FIG. 2 is a longitudinal sectional view taken along the line S-S in FIG. FIG. 3 is a partial longitudinal sectional view showing a structure in which the multilayer ceramic capacitor shown in FIGS. 1 and 2 is mounted on a circuit board. FIG. 4 is a diagram showing the specifications and characteristics of the effect confirmation sample. FIG. 5 is a longitudinal cross-sectional view corresponding to FIG. 2 of the laminated ceramic capacitor (second embodiment) to which the present invention is applied. FIG. 6 is a longitudinal sectional view corresponding to FIG. 2 of the laminated ceramic capacitor (third embodiment) to which the present invention is applied. FIG. 7 is a longitudinal cross-sectional view corresponding to FIG. 2 of a laminated ceramic capacitor (fourth embodiment) to which the present invention is applied. FIG. 8 is a longitudinal sectional view corresponding to FIG. 2 of the laminated ceramic capacitor (fifth embodiment) to which the present invention is applied. FIG. 9 is a longitudinal sectional view corresponding to FIG. 2 of a laminated ceramic capacitor (sixth embodiment) to which the present invention is applied. FIG. 10 is a longitudinal sectional view corresponding to FIG. 2 of the laminated ceramic capacitor (seventh embodiment) to which the present invention is applied.

First Embodiment
1 and 2 show a laminated ceramic capacitor 10-1 (first embodiment) to which the present invention is applied. The multilayer ceramic capacitor 10-1 includes a substantially rectangular parallelepiped capacitor body 11 defined by a length L, a width W, and a height H, and external electrodes 12 provided at both ends in the longitudinal direction of the capacitor body 11. Have.

  The capacitor body 11 includes (1) a first protective portion 11a made of ceramic, (2) a capacitance portion 11b in which a plurality of internal electrode layers 11b1 are stacked via the ceramic layer 11b2, and (3) an electrostriction made of ceramic The relaxation portion 11c, (4) the characteristic adjustment portion 11d in which the plurality of internal electrode layers 11d1 are stacked via the ceramic layer 11d2, and (5) the second protective portion 11e made of ceramic are layered in the height direction. Have to line up.

  The plurality of (24 layers in the drawing) internal electrode layers 11b1 included in the capacitive portion 11b have rectangular shapes whose outlines are substantially equal, and their thicknesses are also substantially equal. Further, ceramic layers 11b2 (layers including both side portions in the length direction not sandwiched by portions sandwiched between adjacent internal electrode layers 11b1), which are between adjacent internal electrode layers 11b1, and 23 layers in the figure are respectively The outline shape of is substantially equal and is a rectangle larger than the outline shape of the internal electrode layer 11b1, and the thickness of each is also substantially equal. The 24 layers of internal electrode layers 11b1 included in the capacitor portion 11b are alternately shifted in the length direction, and the edge of the 12 layers which is the odd-numbered from the top in FIG. 2 is one of the external electrodes 12 (left side in FIG. 2) The edges of the 12 layers which are electrically connected and which are even-numbered from the top of FIG. 2 are electrically connected to the other of the outer electrodes 12 (right side of FIG. 2).

  The plurality of (two layers in the drawing) internal electrode layers 11d1 included in the characteristic adjustment unit 11d have rectangular shapes whose outlines are substantially equal, and their thicknesses are also substantially equal. Incidentally, the contour shape of each internal electrode layer 11d1 is substantially the same as the internal electrode layer 11b1, and the opposing area is also substantially the same as the internal electrode layer 11b1. Further, the ceramic layer 11d2 (a layer including both side portions in the length direction not sandwiched by the portion sandwiched by the adjacent internal electrode layers 11d1) between the adjacent internal electrode layers 11d1 has a contour The shape is a rectangle larger than the contour shape of the internal electrode layer 11d1. Incidentally, the contour shape of the ceramic layer 11d2 is substantially the same as that of the ceramic layer 11b2, and the thickness is also substantially the same as that of the ceramic layer 11b2. The two layers of internal electrode layers 11d1 included in the characteristic adjustment section 11d are alternately shifted in the length direction, and the edge of one of the layers which is odd from the top in FIG. 2 is one of the external electrodes 12 (left side in FIG. 2) The edge of one of the layers which is electrically connected to and even-numbered from the top of FIG. 2 is electrically connected to the other of the external electrodes 12 (right side of FIG. 2).

  The twenty-four-layer internal electrode layer 11b1 included in the capacitive part 11b and the two-layer internal electrode layer 11d1 included in the characteristic adjustment part 11d are made of conductors having substantially the same composition. As the conductor, preferably, a good conductor based on nickel, copper, palladium, platinum, silver, gold, an alloy thereof or the like can be used. Incidentally, the term "conductors having substantially the same composition" as used herein refers to conductors having the same composition but also conductors having slightly different compositions within the allowable range due to the relationship such as the degree of sintering.

  In addition, the 23 ceramic layers 11b2 included in the capacitive portion 11b and the single ceramic layer 11d2 included in the characteristic adjustment portion 11d include the first protective portion 11a, the electrostriction alleviating portion 11c and the second protective portion 11e. The composition is substantially the same, and the dielectric constant is also substantially the same. Dielectric ceramics mainly composed of barium titanate, strontium titanate, calcium titanate, magnesium titanate, calcium zirconate, calcium zirconate titanate, barium zirconate, titanium oxide, etc. Preferably, dielectric ceramics of ε> 1000 or class 2 (high dielectric constant system) can be used. By the way, “Ceramics with almost the same composition and dielectric constant are almost the same” here is a ceramic with the same composition and dielectric constant but with a slight difference of at least one of the composition and dielectric constant from the relation of sintering degree etc. Point to different ceramics.

  As can be seen from FIGS. 1 and 2, the height L, width W and height H of the capacitor body 11 satisfy the condition of L> H> W. Further, the thickness T2 of the capacitive portion 11b, the thickness T3 of the electrostriction alleviating portion 11c, and the thickness T4 of the characteristic adjustment portion 11d satisfy the conditions of T2> T3> T4. Furthermore, the thickness T2 of the capacitive portion 11b, the thickness T3 of the electrostriction alleviating portion 11c, the thickness T4 of the characteristic adjustment portion 11d, and the thickness T5 of the second protective portion 11e satisfy the conditions of T2> T3> T5> T4. doing. Furthermore, the thickness T3 of the electrostrictive relaxation portion 11c, the thickness T4 of the characteristic adjustment portion 11d, the thickness T5 of the second protective portion 11e, and the height H of the capacitor body 11 are preferably 0.25 ≦ (T3 + T4 + T5) / The condition of H ≦ 0.4 is satisfied. Furthermore, the thickness T2 of the capacitive portion 11b, the thickness T3 of the electrostriction alleviating portion 11c, the thickness T4 of the characteristic adjusting portion 11d, and the width W of the capacitor body 11 preferably satisfy the condition of (T2 + T3 + T4)> W. There is. Furthermore, the thickness T1 of the first protective portion 11e may be the same as the thickness T5 of the second protective portion 11e, or may be thinner than the thickness T5 of the second protective portion 11e. The thickness T1 of the second protective portion 11e and the thickness T5 of the second protective portion 11e satisfy the condition of T1 ≦ T5. The significance of these conditions will be described in detail later.

  On the other hand, each external electrode 12 is provided so as to cover a longitudinal end face of the capacitor body 11 and a part of four side faces adjacent to the end face. Although not shown, each external electrode 12 has a two-layer structure of a base film in close contact with the outer surface of the capacitor body 11 and a surface film in close contact with the outer surface of the base film, or between the base film and the surface film. It has a multilayer structure having at least one intermediate film. The base film is made of, for example, a baked film, and preferably used is a good conductor mainly made of nickel, copper, palladium, platinum, silver, gold, alloys thereof and the like. The surface film is made of, for example, a plating film, and preferably, a good conductor mainly composed of tin, palladium, gold, zinc, an alloy of these, or the like can be used for the plating film. The intermediate film is made of, for example, a plating film, and preferably, a good conductor mainly composed of platinum, palladium, gold, copper, nickel, an alloy thereof or the like can be used for the plating film.

  Here, a preferred manufacturing example of the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2 will be introduced. The first protective portion 11a, the ceramic layer 11b2 of the capacitor portion 11b, the electrostriction reducing portion 11c, the ceramic layer 11d2 of the characteristic adjusting portion 11d and the second protective portion 11e are mainly composed of barium titanate, and the internal electrode layer of the capacitor portion 11b First, when the internal electrode layer 11d1 of 11b1 and the characteristic adjustment unit 11d contains nickel as a main component, first, a ceramic slurry containing barium titanate powder, ethanol (solvent), polyvinyl butyral (binder), and additives such as a dispersing agent And prepare an electrode paste containing nickel powder, terpineol (solvent), ethyl cellulose (binder), and additives such as a dispersant.

  Then, using a coating apparatus such as a die coater or the like and a drying apparatus, the ceramic slurry is coated on the carrier film and dried to prepare a first green sheet. In addition, using a printing apparatus such as a screen printing machine and a drying apparatus, the electrode paste is printed in a zigzag or matrix on the first green sheet and dried to form a second internal electrode layer pattern group Make a green sheet.

  Then, using a stacking device such as a suction head having a punching blade and a heater, unit sheets punched from the first green sheet are stacked to a predetermined number and thermocompression-bonded, and a portion corresponding to the second protective portion 11e Make. Subsequently, unit sheets (including the internal electrode layer pattern group) punched out of the second green sheet are stacked up to a predetermined number and thermocompression-bonded to produce a portion corresponding to the characteristic adjustment portion 11 d. Subsequently, unit sheets punched from the first green sheet are stacked up to a predetermined number and thermocompression-bonded to produce a portion corresponding to the electrostriction alleviating portion 11c. Subsequently, unit sheets (including the pattern group for internal electrode layer) punched out of the second green sheet are stacked up to a predetermined number and thermocompression-bonded to produce a portion corresponding to the capacity portion 11b. Subsequently, unit sheets punched from the first green sheet are stacked up to a predetermined number and thermocompression-bonded to produce a portion corresponding to the first protective portion 11a. Then, using an actual pressure bonding apparatus such as a hot isostatic press, the ones that have been stacked and thermocompression-bonded are finally finally pressure-bonded to produce an unfired laminated sheet.

  Then, using a cutting device such as a dicing machine, the unfired laminated sheet is cut into a grid shape to produce unfired chips corresponding to the capacitor body 11. Then, using a firing apparatus such as a tunnel-type firing furnace, firing a large number of unfired chips in a reducing atmosphere or under a low oxygen partial pressure atmosphere with a temperature profile according to barium titanate and nickel The treatment and the firing treatment are carried out) to produce a fired chip corresponding to the capacitor body 11.

  Then, using a coating apparatus such as a roller coating machine, apply electrode paste (for electrode paste for internal electrode layer) to both ends in the lengthwise direction of the fired chip, and perform baking processing in the same atmosphere as described above. A base film is formed, and a surface film, or an intermediate film and a surface film are formed thereon by plating such as electrolytic plating to produce an external electrode. Incidentally, the base film may be prepared by applying and drying the electrode paste on both end portions in the lengthwise direction of the unfired chip and then co-firing the unfired chip with the electrode paste.

  FIG. 3 shows a structure in which the multilayer ceramic capacitor 10-1 shown in FIGS. 1 and 2 is mounted on the circuit board 21. As shown in FIG. The circuit board 21 is provided with conductive pads 21 a corresponding to the respective external electrodes 12 of the multilayer ceramic capacitor 10-1, and the bonding surfaces of the respective external electrodes 12 (a part of the portion covering the four side surfaces of the capacitor main body 11) The lower surface is bonded to the surface of each pad 21 a using a solder 22. The surface shape of the pad 21a to which the bonding surface of each external electrode 12 is bonded is a rectangle larger than the bonding surface shape of each external electrode 12, so molten solder is applied to the end surface 12a of each external electrode 12 after mounting. The solder fillet 22a is formed based on the wetting of the solder. Incidentally, Hf shown in FIG. 3 indicates the height of the uppermost point of the solder fillet 22 a with reference to the lower surface in the height direction of the capacitor body 11.

  Here, a preferred mounting example of the multilayer ceramic capacitor 10-1 shown in FIGS. 1 and 2 will be introduced. First, an appropriate amount of cream solder is applied on each pad 21 a of the circuit board 21. Then, the laminated ceramic capacitor 10-1 is mounted such that the bonding surfaces of the external electrodes 12 are in contact with the applied cream solder. Then, the cream solder is melted at one end and then hardened by heat treatment such as reflow soldering, and the bonding surfaces of the external electrodes 12 are bonded to the surfaces of the pads 21 a via the solder 22.

  FIG. 4 shows the specifications of Samples 1 to 6 (multilayer ceramic capacitors) prepared for confirming the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2 and Sample R prepared for comparison. The specifications of the multilayer ceramic capacitor and the characteristics (noise and ESL) measured in a state where each of the samples 1 to 6 and R is mounted on the circuit board 21 are shown. Incidentally, Samples 1 to 6 and R are produced according to the above-mentioned production example, and the characteristics are measured by the mounting structure (see FIG. 3) produced according to the above-mentioned mounting example.

<Specification details of sample 1>
The capacitor body 11 has a length L of 1000 μm, a width W of 500 μm, and a height H of 702 μm. The thickness T1 of the first protective portion 11a is 25 μm, the thickness T2 of the capacitive portion 11b is 450 μm, the thickness T3 of the electrostrictive relaxation portion 11c is 200 μm, the thickness T4 of the characteristic adjustment portion 11d is 2 μm, and the second protective portion 11e Thickness T5 is 25 μm. The first protective portion 11a, the ceramic layer 11b2 of the capacitor portion 11b, the electrostrictive relaxation portion 11c, the ceramic layer 11d2 of the characteristic adjusting portion 11d and the second protective portion 11e are barium titanate, and the internal electrode layer 11b1 of the capacitor portion 11b The main component of the internal electrode layer 11d1 of the characteristic adjustment section 11d is nickel. The internal electrode layer 11b1 included in the capacitor portion 11b has 350 layers, the thickness of the internal electrode layer 11b1 is 0.7 μm, and the thickness of the ceramic layer 11b2 is 0.6 μm. The two internal electrode layers 11d1 included in the characteristic adjustment portion 11d, 0.7 μm of the internal electrode layer 11d1, and 0.6 μm of the ceramic layer 11d2. The thickness of each external electrode 12 is 10 μm, and the length covering a part of the four side surfaces of the capacitor body 11 is 230 μm. Each external electrode 12 has a three-layer structure of a base film mainly composed of nickel, an intermediate film mainly composed of copper, and a surface film mainly composed of tin.

<Specification details of samples 2 to 6>
The specifications of the sample 2 are the same as the sample 1 except that the thickness T3 of the electrostriction alleviating portion 11c is increased to 290 μm and the height H of the capacitor body 11 is set to 792 μm. The specifications of the sample 3 are the same as the sample 1 except that the thickness T3 of the electrostriction alleviating portion 11c is increased to 380 μm and the height H of the capacitor main body 11 is set to 882 μm. The specifications of the sample 4 are the same as the sample 1 except that the thickness T3 of the electrostriction alleviating portion 11c is reduced to 130 μm and the height H of the capacitor main body 11 is set to 632 μm. The specifications of the sample 5 are the same as the sample 1 except that the thickness T3 of the electrostriction alleviating portion 11c is reduced to 60 μm and the height H of the capacitor main body 11 is set to 562 μm. The specifications of the sample 6 are the same as the sample 1 except that the thickness T5 of the second protective portion 11 e is increased to 45 μm and the height H of the capacitor body 11 is set to 722 μm.

<Specification details of sample R>
The same as the sample 1 except that the electrostriction alleviating portion 11 c and the characteristic adjusting portion 11 d are eliminated from the capacitor main body 11 and the height H of the capacitor main body 11 is 500 μm. Since this sample R does not have the electrostriction relaxation part 11c and the characteristic adjustment part 11d like the samples 1-6, it is produced excluding the process of producing these from the said manufacture example.

<Specification details of mounting structure>
The thickness of the circuit board 21 is 150 μm, and the thickness of each pad 21 a is 15 μm. Each pad 21a has a length of 400 μm, a width of 600 μm, and a distance in the lengthwise direction of 400 μm. The main component of the circuit board 21 is epoxy resin, and the main component of each pad 22 is copper. The solder 22 is a tin-antimony solder, and the amount of cream solder applied is 50 μm in terms of thickness. The height Hf of the uppermost point of the solder fillet 22a is 100 to 300 μm. As described above, since the solder fillet 22a is based on wetting of the molten solder at the end face 12a of the external electrode 12, the above-described range occurs in the height Hf of the uppermost point, but within this range If it does, it will not become a mounting defect.

<Measurement method of sound noise>
Ten mounting structures (see FIG. 3) using each of the samples 1 to 6 and R are fabricated and applied while raising the frequency to 5 to 1 MHz to both external electrodes 12 through each pad 21a of the circuit board 21 And the intensity of the sound in the audible range generated at this time using the TYPe-3560-B130 (made by BRUEEL CARE JAPAN) individually in the soundproof and anechoic room (made by Yokohama Sound Environment Systems). It was measured. By the way, "sounding (db)" in FIG. 4 is an average value of the sounding strength in each of ten mounting structures.

<Method of measuring ESL (equivalent series inductance)>
Ten mounting structures (see FIG. 3) using each of the samples 1 to 6 and R are manufactured, and an oscillation level of 0 dbm is applied to both external electrodes 12 through each pad 21a of the circuit board 21 in a frequency range of 1 MHz to 3 GHz. The ESL (ESL characteristic) generated at this time was individually measured using 4991A (manufactured by Agilent Technologies). Incidentally, “ESL (nH)” in FIG. 4 is an average value of 1000 MHz ESL in each of 10 mounting structures.

  In the mounting structure using each of the samples 1 to 6 and R, when a voltage, in particular an AC voltage, is applied to the two external electrodes 12 through the pads 21 a of the circuit board 21, the capacitor body 11 is based on electrostriction. Expansion and contraction (contraction and restoration such that the capacity portion 11b contracts in the longitudinal direction) occur. However, since each of the capacitor bodies 11 of Samples 1 to 6 has the electrostriction alleviation portion 11c, the characteristic adjustment portion 11d and the second protection portion 11e on the lower side of the capacitance portion 11b, the capacitance portion 11b The downward transmission of the stress caused by the expansion and contraction can be gradually attenuated by the electrostrictive relaxation portion 11c, the characteristic adjustment portion 11d, and the second protective portion 11e. Therefore, regardless of the height Hf of the uppermost point of the solder fillet 22a, it is possible to reduce the transfer of the stress accompanying the expansion and contraction to the circuit board 21 in the mounted state, and to suppress the noise.

  Further, in the mounting structure using each of the samples 1 to 6 and R, since the electrostriction alleviating portion 11c is interposed between the capacitance portion 11b of the capacitor main body 11 and the second protective portion 11e, the capacitance portion 11b The ESL increases because the height interval between and the pad 21a becomes larger than the sample R. However, in each of the capacitor bodies 11 of Samples 1 to 6, since the characteristic adjustment portion 11d including the two-layer internal electrode layer 11d1 is interposed between the electrostriction alleviation portion 11c and the second protection portion 11e, The impedance can be reduced by utilizing the two internal electrode layers 11d1 as a current route. Thus, regardless of the height Hf of the uppermost point of the solder fillet 22a, it is possible to realize low ESL in the mounted state.

  Hereinafter, in consideration of the specifications and characteristics (sound noise and ESL) of each of the samples 1 to 6 and R shown in FIG. 4, the effect obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2 will be described. Do.

  First, the value of "sounds (db)" of samples 1 to 6 is lower than the value of "sounds (db)" of sample R, and the value of "ESL (nH)" of samples 1 to 6 There is almost no difference from the value of “ESL (nH)” of sample R. All of the samples 1 to 6 satisfy the condition of “the thickness T2 of the capacitive portion 11 b> the thickness T3 of the electrostriction alleviating portion 11c> the thickness T4 of the characteristic adjusting portion 11d”. If it is done, it is effective for sound noise suppression and it can be said that it is suitable for low ESL. In each of the samples 1 to 6, “the thickness T2 of the capacitive portion 11 b> the thickness T3 of the electrostrictive relaxation portion 11c> the thickness T5 of the second protective portion 11e> the thickness T4 of the characteristic adjustment portion 11d”. Since the condition is also satisfied, the same can be said even if this condition is satisfied.

  Second, the values of "Sound (db)" of Samples 1 to 4 and 6 are less than the ideal value of 25 db. In each of the samples 1 to 4 and 6, “0.25 ≦ (thickness T3 of the electrostriction alleviating portion 11c + thickness T4 of the characteristic adjusting portion 11d + thickness T5 of the second protective portion 11e) / height of the capacitor main body 11” Since the condition of “H ≦ 0.4” is satisfied, in the case where importance is attached to the suppression of noise, “the thickness T2 of the capacitive portion 11b> the thickness T3 of the electrostriction alleviating portion 11c> the characteristic adjusting portion In addition to the condition of thickness T4 of 11 d, “0.25 ≦ (thickness T3 of electrostrictive relaxation portion 11 c + thickness T4 of characteristic adjustment portion 11 d + thickness T5 of second protective portion 11 e) / height of capacitor main body 11 It can be said that it is preferable to satisfy the condition of “H ≦ 0.4”.

  Thirdly, in all of the samples 1 to 6, "(thickness T2 of the capacitive portion 11b + thickness T3 of the electrostriction relaxation portion 11c + thickness T5 of the second protective portion 11e)> width W of the capacitor main body 11" Since the condition is also satisfied, in addition to the condition “the thickness T2 of the capacitive portion 11 b> the thickness T3 of the electrostriction alleviating portion 11> the thickness T4 of the characteristic adjustment portion 11d”, “the thickness of the capacitive portion 11b is If the condition of T2 + thickness T3 of the second protective portion 11 e> width W of the second protection portion 11> width W of the capacitor body 11 is satisfied, it is effective for suppressing noise, and moreover, ESL reduction It is suitable for

  Fourth, although the thickness T5 of the second protective portion 11 e is twice as thick as that of the samples 1 to 5 in the sample 6, the value of the “sound crunching (db)” and the value of the “ESL (nH)” Is almost the same as the mounting structure using sample 1. That is, in addition to the condition of "the thickness T2 of the capacitive portion 11b> the thickness T3 of the electrostriction alleviating portion 11> the thickness T4 of the characteristic adjusting portion 11d", the "thickness T1 of the first protective portion 11a ≦ the second protection" If the condition of the thickness T5 of the portion 11e is satisfied, it can be said that it is effective for suppressing noise and that it is suitable for lowering ESL. Incidentally, as an advantage in the case where the thickness T5 of the second protective portion 11e is larger than the thickness T1 of the first protective portion 11a, the two-layer internal electrodes included in the characteristic adjustment portion 11d in the firing step at the time of manufacture It is possible to prevent the conductivity of the outermost internal electrode layer 11d1 of the layer 11d1 from being oxidized and lose its conductivity, and to secure the current route by the two internal electrode layers 11d1.

  Fifth, all of the samples 1 to 6 satisfy the condition of "length L of capacitor body 11> height H of capacitor body 11> width W of capacitor body 11". In addition to the condition “the thickness T2 of the capacitive portion 11b> the thickness T3 of the electrostriction alleviating portion 11> the thickness T4 of the characteristic adjusting portion 11d”, the length L of the capacitor main body 11 of the capacitor main body 11 is changed. If the condition of the height H> the width W of the capacitor body 11 is satisfied, it is effective for suppressing the noise generation and it can be said that it is suitable for reducing the ESL.

  Thus, in addition to the fact that the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2 has extremely high practicability with respect to the suppression of noise in the mounted state, it is useful for reducing the impedance of high frequency circuits and removing noise. The ESL can be realized reliably.

Second Embodiment
FIG. 5 shows a multilayer ceramic capacitor 10-2 (second embodiment) to which the present invention is applied. In this multilayer ceramic capacitor 10-2, the number of layers of the multilayer ceramic capacitor 10-1 (first embodiment) shown in FIGS. 1 and 2 and the internal electrode layer 11d1 included in the characteristic adjustment portion 11d-2 is increased to four. 5, the edges of the two layers which are odd from the top of FIG. 5 are electrically connected to one of the external electrodes 12 (the left side of FIG. 5), and the edges of the two layers which are even from the top of FIG. It differs in that it is electrically connected to the other side (right side of FIG. 5) of the electrode 12.

  This multilayer ceramic capacitor 10-2 is a unit sheet punched out of the second green sheet when producing a portion corresponding to the characteristic adjustment portion 11d-2 in the laminating step in the preferred manufacturing example described in the section of the first embodiment. Can be manufactured by increasing the number of stacks of 2 to 4. Incidentally, the preferred mounting example and mounting structure of the multilayer ceramic capacitor 10-2 are the same as the mounting example and mounting structure (see FIG. 3) described in the section of the first embodiment.

  In the laminated ceramic capacitor 10-2 shown in FIG. 5, the outermost internal electrode layer 11d1 of the four internal electrode layers 11d1 included in the characteristic adjustment portion 11d-2 is oxidized in the firing step during manufacturing. Even when the conductivity is lost, the remaining internal electrode layer 11d1 can ensure the current route to reliably reduce the desired impedance. This effect can be obtained similarly even when the number of internal electrode layers 11d1 included in the characteristic adjustment unit 11d-2 is three or five or more, but the characteristic adjustment unit 11d-2 is intended to secure a capacity. In the internal electrode layer 11d1, three or four layers are preferable. The other effects are the same as the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2, and thus the description thereof is omitted.

Third Embodiment
FIG. 6 shows a laminated ceramic capacitor 10-3 (third embodiment) to which the present invention is applied. The multilayer ceramic capacitor 10-3 includes the multilayer ceramic capacitor 10-1 (first embodiment) shown in FIG. 1 and FIG. 2 and the two internal electrode layers 11d1 included in the characteristic adjustment section 11d-3. The edge of one layer which is odd from the top of FIG. 6 is electrically connected to the other of the external electrode 12 (right side of FIG. 6), and the edge of one layer which is even from the top of FIG. It differs in that one of the twelve (the left side in FIG. 6) is electrically connected. That is, the edge of the internal electrode layer 11b1 of the capacitor portion 11b facing through the electrostriction alleviating portion 11c and the edge of the internal electrode layer 11d1 of the characteristic adjustment portion 11d-3 are the same among one and the other of the external electrode 12 It is electrically connected to the external electrode 12 on the side.

  This multilayer ceramic capacitor 10-3 is a unit sheet punched out of the second green sheet when producing a portion corresponding to the characteristic adjusting portion 11d-3 in the laminating step in the preferred manufacturing example described in the section of the first embodiment. It can be manufactured by changing the stacking direction of. Incidentally, the preferred mounting example and mounting structure of the multilayer ceramic capacitor 10-3 are the same as the mounting example and mounting structure (see FIG. 3) described in the section of the first embodiment.

  In the multilayer ceramic capacitor 10-3 shown in FIG. 6, when a voltage is applied in the mounted state, the internal electrode layer 11b1 of the capacitive portion 11b and the internal electrode layer 11d1 of the characteristic adjustment portion 11d-3 face each other via the electrostriction alleviating portion 11c. Therefore, in particular when the thickness T3 of the electrostriction alleviating layer 11c is small, the internal electrode layers 11b1 and 11d1 avoid that an electric field is formed in the electrostriction alleviating layer 11c to cause electrostriction. The desired noise suppression can be reliably performed. The other effects are the same as the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2, and thus the description thereof is omitted.

  Even if the idea described in the section of the second embodiment (the idea that the internal electrode layers included in the characteristic adjusting portion are made three or four layers) is adopted for the laminated ceramic capacitor 10-3 shown in FIG. good.

Fourth Embodiment
FIG. 7 shows a laminated ceramic capacitor 10-4 (fourth embodiment) to which the present invention is applied. In the multilayer ceramic capacitor 10-4, the multilayer ceramic capacitor 10-1 (first embodiment) shown in FIGS. 1 and 2 and the two internal electrode layers 11d1 'included in the characteristic adjustment section 11d-4 are opposed to each other. The difference is that the area is made smaller than the facing area of the 24 layers of internal electrode layers 11b1 included in the capacitive portion 11b.

  This multilayer ceramic capacitor 10-4 is for the internal electrode layer of the second green sheet when producing a portion corresponding to the characteristic adjustment portion 11d-4 in the laminating step in the preferred manufacturing example described in the section of the first embodiment. It can manufacture by using the 3rd green sheet in which the pattern group whose length is shorter than a pattern group was formed. Incidentally, the preferred mounting example and mounting structure of the multilayer ceramic capacitor 10-4 are the same as the mounting example and mounting structure (see FIG. 3) described in the section of the first embodiment.

  In the multilayer ceramic capacitor 10-4 shown in FIG. 7, the opposing area of the two layers of internal electrode layers 11d1 'included in the characteristic adjustment part 11d-4 is the opposing area of the 24 layers of internal electrode layers 11b1 included in the capacitive part 11b. Since the capacitance is smaller than the above, it is possible to reduce the capacitance formed in the characteristic adjustment unit 11d-4 as much as possible and place emphasis on securing the current route. The other effects are the same as the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2, and thus the description thereof is omitted.

  Even if the idea described in the section of the second embodiment (the idea that the internal electrode layers included in the characteristic adjusting portion are made to be three or four layers) is adopted for the laminated ceramic capacitor 10-4 shown in FIG. good.

Fifth Embodiment
FIG. 8 shows a laminated ceramic capacitor 10-5 (fifth embodiment) to which the present invention is applied. In this multilayer ceramic capacitor 10-5, the multilayer ceramic capacitor 10-1 (first embodiment) shown in FIG. 1 and FIG. 2 and the electrostriction alleviating portion 11c-5 are the first protective portion 11a and the capacitive portion 11b. The present embodiment is different in that it is composed of a low dielectric constant ceramic whose composition is different from that of the 23 layers of the ceramic layer 11b2 contained and the one layer of the ceramic layer 11d2 and the second protective portion 11e contained in the characteristic adjustment portion 11d.

  In this laminated ceramic capacitor 10-5, a low dielectric constant fourth green sheet having a composition different from that of the first green sheet is produced in the sheet producing step in the preferred production example described in the section of the first embodiment. When producing a portion corresponding to the electrostriction alleviating portion 11c-5, it can be manufactured by stacking unit sheets punched out of the fourth green sheet up to a predetermined number and thermocompression bonding. The fourth green sheet is a ceramic slurry obtained by changing the type of ceramics used in the ceramic slurry for the first green sheet to one having a low dielectric constant, and a subcomponent suitable for lowering the dielectric constant without changing the type of ceramics. (For example, a compound of an alkaline earth metal element such as Mg or a compound of a transition metal element such as Mn) can be added or manufactured using a ceramic slurry or the like in which the content of the subcomponents is increased. Incidentally, the preferred mounting example and mounting structure of the multilayer ceramic capacitor 10-5 are the same as the mounting example and mounting structure (see FIG. 3) described in the section of the first embodiment.

  In the multilayer ceramic capacitor 10-5 shown in FIG. 8, the dielectric constant of the electrostriction alleviating portion 11c-5 is included in the first protective portion 11a, the 23 layers of the ceramic layer 11b2 included in the capacitive portion 11b, and the characteristic adjustment portion 11d. Is lower than the dielectric constant of the first ceramic layer 11d2 and the second protective portion 11e, electrostriction that may occur in the Can be done reliably. The other effects are the same as the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2, and thus the description thereof is omitted.

  In the multilayer ceramic capacitor 10-5 shown in FIG. 8, the idea described in the section of the second to fourth embodiments (the idea that the internal electrode layer included in the characteristic adjusting portion is three or four layers, or the characteristic) The idea of changing the orientation of the internal electrode layer included in the adjustment unit, or the idea of reducing the facing area of the internal electrode layer included in the characteristic adjustment portion may be adopted as appropriate.

Sixth Embodiment
FIG. 9 shows a laminated ceramic capacitor 10-6 (sixth embodiment) to which the present invention is applied. In this multilayer ceramic capacitor 10-6, the multilayer ceramic capacitor 10-1 (first embodiment) shown in FIG. 1 and FIG. 2 and one ceramic layer 11d2 'included in the characteristic adjustment section The first embodiment differs from the first embodiment in that it is made of low dielectric constant ceramics having a composition different from that of the 23 protective layer 11b2 included in the protective portion 11a and the capacitive portion 11b, the electrostrictive portion 11c and the second protective portion 11e.

  This multilayer ceramic capacitor 10-6 is manufactured by forming a fourth green sheet with a low dielectric constant which differs in composition from the first green sheet in the sheet manufacturing process in the preferred manufacturing example described in the section of the first embodiment. A fifth green sheet in which a pattern group for internal electrode layer is formed on a green sheet is produced, and a unit sheet (pattern for internal electrode layer) punched out from the second green sheet when producing the characteristic adjustment section 11d-6 in the laminating step It can manufacture by laminating | stacking and thermocompression-bonding the group, and laminating | stacking and thermocompression-bonding the unit sheet (inclusive of the pattern group for internal electrode layers) which followed and was pierced from the 5th green sheet. The production example of the fourth green sheet is as described in the section of the fifth embodiment, and thus the description thereof is omitted. Incidentally, the preferred mounting example and mounting structure of the multilayer ceramic capacitor 10-5 are the same as the mounting example and mounting structure (see FIG. 3) described in the section of the first embodiment.

  In the multilayer ceramic capacitor 10-6 shown in FIG. 9, the dielectric constant of one layer of the ceramic layer 11d2 'included in the characteristic adjustment portion 11d-6 is a 23-layer ceramic included in the first protective portion 11a and the capacitive portion 11b. Since the dielectric constant of the layer 11b2, the electrostriction alleviating portion 11c, and the second protective portion 11e is lower than that of the layer 11b 2, the electrostriction that may occur in the characteristic adjustment portion 11d-6 during voltage application in the mounted state is reduced as much Squeak suppression can be performed reliably. The other effects are the same as the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2, and thus the description thereof is omitted.

  In the laminated ceramic capacitor 10-6 shown in FIG. 9, the idea described in the section of the second to fourth embodiments (the idea that the internal electrode layer included in the characteristic adjusting portion is three or four layers, or the characteristic) The idea of changing the orientation of the internal electrode layer included in the adjustment unit, or the idea of reducing the facing area of the internal electrode layer included in the characteristic adjustment portion may be adopted as appropriate. Further, the concept described in the section of the fifth embodiment (thought to reduce the dielectric constant of the electrostriction alleviating portion 11c) may be adopted for the laminated ceramic capacitor 10-6 shown in FIG.

Seventh Embodiment
FIG. 10 shows a laminated ceramic capacitor 10-7 (seventh embodiment) to which the present invention is applied. In this laminated ceramic capacitor 10-7, the laminated ceramic capacitor 10-1 (first embodiment) shown in FIG. 1 and FIG. 2 and the first protective portion 11a-7 and the second protective portion 11e-7 It differs from the ceramic layer 11b of 23 layers included in 11b, the ceramic layer 11d of one layer included in the electrostriction alleviation portion 11c, and the characteristic adjustment portion 11d and in the point of being composed of low dielectric constant ceramics different in composition.

  This multilayer ceramic capacitor 10-7 produces a low dielectric constant fourth green sheet having a composition different from that of the first green sheet in the sheet producing step in the preferred production example described in the section of the first embodiment, and When producing 1st protection part 11a-7 and 2nd protection part 11e-7, it can manufacture by laminating | stacking and thermocompression-bonding the unit sheet punched out from the 4th green sheet. The production example of the fourth green sheet is as described in the section of the fifth embodiment, and thus the description thereof is omitted. Incidentally, the preferred mounting example and mounting structure of the multilayer ceramic capacitor 10-7 are the same as the mounting example and mounting structure (see FIG. 3) described in the section of the first embodiment.

  In the multilayer ceramic capacitor 10-7 shown in FIG. 10, the dielectric constant of the first protective portion 11a-7 and the second protective portion 11e-7 is the ceramic layer 11b2 of 23 layers included in the capacitor portion 11b, and the electrostrictive relaxation portion Electrostriction that may occur in the first protective portion 11a-7 and the second protective portion 11e-7 at the time of voltage application in the mounted state, since the dielectric constant of the ceramic layer 11d2 included in the layer 11c and the characteristic adjusting portion 11d is lower Can be reduced as much as possible, and the desired noise suppression can be reliably performed. The other effects are the same as the effects obtained by the laminated ceramic capacitor 10-1 shown in FIGS. 1 and 2, and thus the description thereof is omitted.

  In the laminated ceramic capacitor 10-7 shown in FIG. 10, the idea described in the section of the second to fourth embodiments (the idea that the internal electrode layer included in the characteristic adjusting portion is three or four layers, or the characteristic) The idea of changing the orientation of the internal electrode layer included in the adjustment unit, or the idea of reducing the facing area of the internal electrode layer included in the characteristic adjustment portion may be adopted as appropriate. Further, the idea described in the fifth and sixth embodiments (into the idea of reducing the dielectric constant of the electrostriction alleviating portion 11c, and the characteristic adjusting portion 11d) of the multilayer ceramic capacitor 10-7 shown in FIG. The idea of lowering the dielectric constant of the ceramic layer 11d2 may be adopted as appropriate.

Other Embodiments
(1) In the columns and drawings of the first to seventh embodiments, the capacitor portion 11b of the capacitor main body 11 is shown to have the 24 or 350-layer internal electrode layer 11b1, but the inside included in the capacitor portion 11b There is no particular limitation on the number of electrode layers 11b1.

  (2) In the columns and drawings of the first to seventh embodiments, the capacitor body 11 of length L> height> width W is exemplified, but the number of internal electrode layers 11b1 included in the capacitor portion 11b If the thickness T2 of the capacitor portion 11b can be reduced from the relationship with the etc., the condition of length L> height = width W or the condition of length L> width W> height is satisfied. It can also be satisfactory.

  10-1, 10-2, 10-3, 10-4, 10-5, 10-6, 10-7 ... laminated ceramic capacitors, 11 ... capacitor body, 11a, 11a-7 ... first protective portion, 11b ... Capacitance part, 11b1 ... internal electrode layer, 11b2 ... ceramic layer, 11c, 11c-5 ... electrostrictive relaxation part, 11d, 11d-2, 11d-3, 11d-4, 11d-6 ... characteristic adjustment part, 11d1, 11d1 Internal electrode layer 11d2, 11d2 'Ceramic layer 11e, 11e-7 Second protective portion L Length of capacitor body W Width of capacitor body H Height of capacitor body T1 T1 Thickness of first protective portion, T2: Thickness of capacitive portion, T3: Thickness of electrostrictive relaxation portion, T4: Thickness of characteristic adjustment portion, T5: Thickness of second protective portion.

Claims (12)

A multilayer ceramic capacitor comprising a substantially rectangular parallelepiped capacitor body defined by a length, a width, and a height, and external electrodes provided at both ends in the lengthwise direction of the capacitor body,
The capacitor main body includes (1) a first protective portion made of ceramic, (2) a capacitance portion in which a plurality of internal electrode layers are stacked via the ceramic layer, and (3) an electrostrictive relaxation portion made of ceramic. (4) A characteristic adjustment section in which a plurality of internal electrode layers are stacked via a ceramic layer, and (5) a second protective section made of ceramic are arranged in layers in the height direction,
An edge of a portion of the plurality of inner electrode layers included in the capacitance portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. ,
An edge of a part of the plurality of inner electrode layers included in the characteristic adjustment portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. Yes,
Assuming that the thickness of the capacitance portion is T2, the thickness of the electrostriction alleviating portion is T3, and the thickness of the characteristic adjustment portion is T4, the conditions of T2, T3 and T4 satisfy T2>T3> T4. I am satisfied
Among the ceramic layer included in the first protective portion, the capacitor portion, the electrostrictive alleviating portion, the ceramic layer included in the characteristic adjusting portion, and the second protective portion, the electrostrictive alleviating portion is the first protective portion. Part, a ceramic layer included in the capacity part, a ceramic layer included in the characteristic adjustment part, and a low dielectric ceramic having a composition different from that of the second protective part
Multilayer ceramic capacitor. A multilayer ceramic capacitor comprising a substantially rectangular parallelepiped capacitor body defined by a length, a width, and a height, and external electrodes provided at both ends in the lengthwise direction of the capacitor body,
The capacitor main body includes (1) a first protective portion made of ceramic, (2) a capacitance portion in which a plurality of internal electrode layers are stacked via the ceramic layer, and (3) an electrostrictive relaxation portion made of ceramic. (4) A characteristic adjustment section in which a plurality of internal electrode layers are stacked via a ceramic layer, and (5) a second protective section made of ceramic are arranged in layers in the height direction,
An edge of a portion of the plurality of inner electrode layers included in the capacitance portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. ,
An edge of a part of the plurality of inner electrode layers included in the characteristic adjustment portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. Yes,
Assuming that the thickness of the capacitance portion is T2, the thickness of the electrostriction alleviating portion is T3, and the thickness of the characteristic adjustment portion is T4, the conditions of T2, T3 and T4 satisfy T2>T3> T4. I am satisfied
Among the ceramic layer contained in the first protective portion, the capacitive portion, the ceramic layer contained in the electrostriction alleviating portion, the ceramic layer contained in the characteristic adjusting portion, and the ceramic layer contained in the characteristic adjusting portion of the second protective portion, The first protective portion, the ceramic layer included in the capacitive portion, and the low dielectric constant ceramic whose composition is different from that of the electrostriction alleviating portion and the second protective portion.
Multilayer ceramic capacitor. A multilayer ceramic capacitor comprising a substantially rectangular parallelepiped capacitor body defined by a length, a width, and a height, and external electrodes provided at both ends in the lengthwise direction of the capacitor body,
The capacitor main body includes (1) a first protective portion made of ceramic, (2) a capacitance portion in which a plurality of internal electrode layers are stacked via the ceramic layer, and (3) an electrostrictive relaxation portion made of ceramic. (4) A characteristic adjustment section in which a plurality of internal electrode layers are stacked via a ceramic layer, and (5) a second protective section made of ceramic are arranged in layers in the height direction,
An edge of a portion of the plurality of inner electrode layers included in the capacitance portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. ,
An edge of a part of the plurality of inner electrode layers included in the characteristic adjustment portion is electrically connected to one of the outer electrodes, and an edge of the remaining portion is electrically connected to the other of the outer electrodes. Yes,
Assuming that the thickness of the capacitance portion is T2, the thickness of the electrostriction alleviating portion is T3, and the thickness of the characteristic adjustment portion is T4, the conditions of T2, T3 and T4 satisfy T2>T3> T4. I am satisfied
Of the ceramic layer included in the first protective portion, the capacitive portion, the electrostrictive alleviating portion, the ceramic layer included in the characteristic adjusting portion, and the second protective portion, the electrostrictive alleviating portion and the characteristic adjusting portion The ceramic layer contained is made of a ceramic having a low dielectric constant different in composition from the first protective portion, the ceramic layer contained in the capacitive portion, and the second protective portion.
Multilayer ceramic capacitor. When the thickness of the second protective portion is T5, the T2, T3 and T4 and the T5 satisfy the condition of T2>T3>T5> T4.
The multilayer ceramic capacitor according to any one of claims 1 to 3. Assuming that the height of the capacitor body is H and the thickness of the second protective portion is T5, the T3 and T4 and the H and T5 satisfy the condition of 0.25 ≦ (T3 + T4 + T5) /H≦0.4. Is pleased,
The multilayer ceramic capacitor according to any one of claims 1 to 4. When the width of the capacitor body is W, the T2, T3 and T4 and the W satisfy the condition of (T2 + T3 + T4)> W,
The multilayer ceramic capacitor according to any one of claims 1 to 5. When the thickness of the first protective portion is T1 and the thickness of the second protective portion is T5, the T1 and T5 satisfy the condition of T1 ≦ T5.
The multilayer ceramic capacitor according to any one of claims 1 to 6. The number of the plurality of internal electrode layers included in the characteristic adjustment unit is at least two.
The multilayer ceramic capacitor according to any one of claims 1 to 7. When the length of the capacitor body is L, the width is W, and the height is H, the L, W and H satisfy the condition of L>H> W,
The multilayer ceramic capacitor according to any one of claims 1 to 8. The edge of the internal electrode layer of the capacitor and the edge of the internal electrode layer of the characteristic adjustment portion facing each other through the electrostriction alleviating portion are respectively connected to the external electrodes on one side and the other side of the external electrode. It is connected,
The multilayer ceramic capacitor according to any one of claims 1 to 9. The edge of the internal electrode layer of the capacitor and the edge of the internal electrode of the characteristic adjustment portion facing each other through the electrostriction alleviating portion are connected to the external electrode on one and the other of the external electrodes. Being
The multilayer ceramic capacitor according to any one of claims 1 to 10. The facing area of the plurality of internal electrode layers included in the characteristic adjusting unit is smaller than the facing area of the plurality of internal electrode layers included in the capacitor unit.
A multilayer ceramic capacitor according to any one of claims 1 to 11.

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