JP6521735B2 - Inspection apparatus, inspection method and program used in inspection apparatus - Google Patents

Description

  The present invention relates to an inspection apparatus, an inspection method, and a program used in the inspection apparatus for inspecting the quality of a substrate manufactured in a production line.

  As an inspection apparatus disposed in a production line, one is known that picks up an image of all substrates for each process of the production line and analyzes the defects (see, for example, Patent Document 1). In the inspection apparatus described in Patent Document 1, the quality of the substrate is inspected from the captured image in each process, and a non-defective product image and a defective product image are selected in each process and used for defect analysis. Moreover, what carries out the statistical analysis of the test result of a board | substrate and carries out defect analysis as an inspection apparatus is known (for example, refer patent document 2). In the inspection apparatus described in Patent Document 2, the inspection result of the substrate and the identification information are associated and stored in the database, and the statistical result of the stored information in the database is used for failure analysis.

JP 2005-142552 A JP, 2002-368411, A

  By the way, although the board | substrate determined as non-defective goods is shipped to a market from a factory, a certain malfunction may be discovered with respect to a board | substrate in a market. The inspection apparatuses described in Patent Documents 1 and 2 can analyze defects using a substrate before shipping, but can not find the cause of defects in a substrate shipped as a non-defective product. In order to verify the failure of the board determined to be non-defective, the manufacturer of the inspection apparatus had to restructure the inspection logic. Although it is conceivable to visually inspect the substrate for defects by an operator at a production site, there was a problem that the load on the operator became heavy.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an inspection apparatus, an inspection method, and a program used in the inspection apparatus capable of verifying defects of non-defective substrates shipped to the market at a production site. I assume.

  The inspection apparatus according to the present invention is an inspection apparatus capable of performing a normal inspection on a substrate while the production line is in operation and verifying a defect of the substrate missed by the normal inspection, in which a list of inspection processes is stored. A storage unit, a specification unit that specifies the inspection position of the substrate, a reception unit that receives an inspection process selection for each inspection position of the substrate from the list of inspection processes, and the inspection process selected by the reception unit And an execution unit that executes an inspection logic at an inspection position of the substrate.

  The inspection method of the present invention is an inspection method using an inspection apparatus capable of performing a normal inspection on a substrate while the production line is in operation and verifying a defect of the substrate missed in the normal inspection, wherein the inspection position of the substrate Executing an inspection logic on the inspection position of the substrate, which comprises the steps of identifying the inspection process, selecting the inspection process for each inspection position of the substrate from the inspection process list stored in the storage unit, and selecting the inspection process And a step.

  According to these configurations, the operator at the production site can freely select the inspection process according to the failure of the substrate, and can newly form an inspection logic. By using the inspection logic that the operator has assembled himself, it is possible to re-inspect a defect of a substrate missed in the ordinary inspection of the inspection device without relying on the manufacturer of the inspection device, and the operator is the cause of the substrate failure. Can be verified. In addition, since the inspection logic can be constructed only by selecting the inspection process, it is possible to flexibly verify according to the contents of the defect without putting a burden on the operator.

  In the above inspection apparatus, the receiving unit receives adjustment of parameters of the inspection process. According to this configuration, the sensitivity of the inspection of the inspection process can be adjusted, and the failure of the substrate can be more flexibly verified.

  In the above-described inspection apparatus, the execution unit can execute the existing inspection logic used for the normal inspection in addition to the inspection logic. According to this configuration, it is possible to re-inspect a defect in a substrate missed in the normal inspection of the inspection apparatus using the existing inspection logic.

  In the inspection apparatus described above, an imaging unit that images the substrate while the production line is in operation is provided, the storage unit stores a list of inspection processes for the captured image of the substrate, and the identification unit is The inspection position in the captured image is specified, and the execution unit executes the inspection logic on the inspection position of the captured image of the substrate. According to this configuration, since the defect of the substrate can be re-inspected using the captured image of the substrate, the defect of the substrate can be verified even without the substrate.

  The inspection apparatus described above includes an extraction unit that extracts a captured image of the substrate from the traceability information of the substrate, and the captured images of all the substrates captured by the imaging unit during operation of the production line are the substrates. The traceability information is stored in association with each other. According to this configuration, it is possible to leave captured images of all the substrates as objective evidence for later verifying the defects of the substrates generated during the operation of the production line. In addition, it is possible to extract a captured image of a substrate that needs to be re-inspected from traceability information.

  In the above inspection apparatus, the traceability information of the substrate includes the type of the substrate and the inspection date and time of the normal inspection of the substrate. According to this configuration, it is possible to easily extract a captured image of a substrate requiring reinspection from the type of the substrate and the inspection date and time of the normal inspection.

  A program according to the present invention is characterized in that the inspection method or the inspection program creation personal computer executes the above-described inspection method. According to this configuration, by installing the program in the inspection apparatus or the inspection program creation personal computer, it is possible to add a highly flexible verification function to the inspection apparatus.

  According to the present invention, by freely selecting the inspection process according to the defect of the substrate at the production site and newly constructing the inspection logic, the inspection was overlooked in the normal inspection of the inspection device without relying on the manufacturer of the inspection device. The operator can verify the cause of the substrate failure.

It is a schematic diagram of the production system concerning this embodiment. It is a block diagram of an inspection device concerning this embodiment. It is a figure which shows an example of the extraction process of the captured image which concerns on this Embodiment. It is a figure which shows an example of the reexamination processing with respect to the captured image which concerns on this Embodiment.

  Hereinafter, a production system according to the present embodiment will be described with reference to the attached drawings. FIG. 1 is a schematic view of a production system according to the present embodiment. The production system according to the present embodiment is merely an example, and can be changed as appropriate.

  As shown in FIG. 1, the production line of the production system 1 according to the present embodiment includes a printing process, an inspection process after printing, a mounting process, an inspection process after mounting, a reflow process, and an inspection process after reflow. Then, the substrate W is produced. In the printing process, paste-like solder is printed at a predetermined position on the substrate W by the printing apparatus 11. In the inspection process after printing, the printing state of the solder on the substrate W is inspected by image processing or the like by the inspection apparatus 14a. . In the mounting process, the component is mounted at a predetermined position of the substrate W by the mounting apparatus 12, and in the inspection process after mounting, the mounting state of the component on the substrate W is inspected by image processing or the like by the inspection apparatus 14b.

  In the reflow process, the solder at a predetermined position is melted by the reflow device 13 and the component is soldered to the substrate W. In the inspection process after the reflow, the soldering state of the component on the substrate W is inspected by image processing or the like by the inspection device 14c. Be done. In addition, in the production system 1, an image storage server 15 and an inspection information storage server 16 are provided. The image storage server 15 stores the captured image of the substrate W captured in each inspection process, and the inspection information storage server 16 stores inspection information such as an inspection result of the substrate W in each inspection process. The substrate W may be a collective substrate composed of a plurality of unit substrates or a single substrate.

  By the way, the substrate W shipped to the market determined to be non-defective through the production line may have a defect found in the market. In this case, the substrate W to be inspected is often not at hand, and the substrate W can not be re-inspected. In addition, even if the substrate W to be inspected is at hand, it takes time to perform the inspection again. Therefore, in the production system 1 according to the present embodiment, an image of the substrate W in each inspection step is imaged as an objective evidence for later verifying the defect of the substrate W generated during the operation of the production line. The traceability information of each substrate W is stored in association with it.

  However, even if a captured image of the substrate W is stored, it is difficult to verify defects of the substrate W found in the market at the production line site. Generally, the manufacturer of the inspection apparatus often does not disclose the inspection logic, and the operator at the production site can not grasp the cause of the failure of the substrate W in the general inspection of the production line. For this reason, it is necessary to request the manufacturer of the inspection apparatus to verify the defect and to have new inspection logic reassembled. It is possible for the operator to visually confirm the defect of the substrate W from the captured image of the substrate W, but a large amount of time has to be spent on the confirmation operation.

  Therefore, in each of the inspection devices 14a to 14c according to the present embodiment, the inspection logic can be easily assembled on the operator side of the production site according to the defect of the substrate W. By using the inspection logic self-assembled by the operator for the picked-up image of the substrate W, the operator can self-verify the defects of the substrate W missed in the normal inspection of each inspection device 14a-14c. . In the present embodiment, although the defect of the substrate W is verified using a captured image of the substrate W for which a defect is found in the market, the actual substrate W is obtained and the inspection device 14a-14c is used. It is also possible to verify a defect by retesting.

  The detailed configuration of the inspection apparatus will be described below with reference to FIG. FIG. 2 is a block diagram of an inspection apparatus according to the present embodiment. In the following description, the inspection device in the inspection step after mounting is described as an example, but the inspection device in the inspection step after printing and the inspection device in the inspection step after reflow are configured in the same manner. Further, the block diagram of the inspection apparatus shown in FIG. 2 is simplified to explain the present invention, and it is assumed that the configuration usually provided in the inspection apparatus is provided.

  As shown in FIG. 2, the inspection apparatus 14 performs an ordinary inspection for performing a normal inspection on all the substrates W while the production line is in operation, and an imaging unit 21 that images all the substrates W while the production line is in operation. It comprises a part 22 and a re-inspection part 23 for performing re-inspection on a substrate W for which a defect is overlooked in the normal inspection. The imaging unit 21 images a plurality of locations on each substrate W from directly above, and outputs a captured image of each substrate W to the normal inspection unit 22. The normal inspection unit 22 performs image processing on the captured image of each substrate W using the existing inspection logic, and inspects whether or not a component is appropriately mounted on each substrate W. A substrate W having a bad mounting state of components is not determined to be defective and is not shipped.

  The captured image of each substrate W at the time of the normal inspection is stored in the image storage server 15, and the inspection information of each substrate W is stored in the inspection information storage server 16. In the image storage server 15, the captured image of each substrate W is stored at a predetermined address of the storage medium. Traceability information of each substrate W is stored in the inspection information storage server 16 as inspection information in association with the address of the storage destination of the captured image of each substrate W in the image storage server 15. The traceability information includes, for example, the type of the substrate W, the inspection date and time of the normal inspection, the determination result of the normal inspection, and the determination result of the visual inspection of the operator. The normal inspection unit 22 may create a compressed image and transmit it to the image storage server 15. In this case, the server capacity for storing the image can be reduced.

  The re-examination unit 23 re-inspects using a captured image of the substrate W for which a defect is found in the market, and includes an extraction unit 24, a specification unit 25, a storage unit 26, a reception unit 27, and an execution unit ing. The extraction unit 24 accesses the inspection information storage server 16 and the image storage server 15 by extracting traceability information such as inspection date and time as extraction conditions in the operator, and extracts a captured image that satisfies the extraction condition. In this case, the inspection information storage server 16 identifies the address of the captured image associated with the traceability information that satisfies the extraction condition, and the image storage server 15 extracts the captured image stored at this address.

  As described above, the traceability information of the inspection information storage server 16 is associated with the captured image of the image storage server 15, and the extraction unit 24 extracts the captured image based on the traceability information specified by the operator. As a result, even when there is no substrate W to be inspected at the hand of the operator, it is possible to extract a captured image of the substrate W to be inspected from the traceability information and re-examine it. The traceability information and the captured image may be stored on the same external server, or may be stored on separate external servers.

  The identifying unit 25 identifies the inspection position in the captured image of the substrate W extracted by the extracting unit 24. In this case, position information and coordinate axes of parts on the substrate W are set in the inspection apparatus 14, and an inspection position in the captured image is specified by inputting position information such as part names and specific coordinates. The storage unit 26 stores a list of inspection processes as processing units for constructing inspection logic. The list of inspection processes includes plural types of inspection processes such as length measurement, area measurement, volume measurement, luminance measurement, color recognition, character recognition, weighting filter setting, binarization processing, determination processing, and the like.

  The receiving unit 27 receives the selection of the inspection process for each inspection position of the captured image from the list of inspection processes. In this case, the operator selects a desired inspection process from the list of inspection processes for each inspection position, and the selected inspection processes are arranged in the execution field 31 (see FIG. 4C) in the order of execution to assemble the inspection logic. That is, the reception unit 27 forms an assembly screen of the inspection logic (see FIG. 4C). In addition, the receiving unit 27 receives adjustment of parameters of each inspection process. As parameters, for example, coefficients of weighting filters, thresholds of binarization processing and determination processing, and the like are set. Thus, selection of the inspection process makes it possible to easily form inspection logic.

  The execution unit 28 executes inspection logic including the inspection process selected by the reception unit 27 on the inspection position of the captured image. In this case, the inspection process is executed in order of being arranged in the execution field 31 of the reception unit 27, and the inspection position of the captured image extracted by the extraction unit 24 is re-inspected. In this manner, the inspection process can be re-inspected by the operator with the inspection logic freely selected according to the defect of the substrate W, and the operator can usually identify the cause of the defect of the substrate W missed in the inspection. The executing unit 28 can also execute the existing inspection logic used at the time of the normal inspection.

  The respective units of the normal inspection unit 22 and the reinspection unit 23 of the printing apparatus 11 are configured by a processor, a memory, and the like that execute various processes of the respective units. The memory is configured of one or more storage media such as ROM (Read Only Memory) and RAM (Random Access Memory) according to the application, and the memory is for normal inspection of the printing apparatus according to the present embodiment. In addition to the programs described above, a program for extraction processing of a captured image, a program for reinspection processing, an assembly screen of inspection logic to be described later, and the like are stored.

  With reference to FIG.3 and FIG.4, the extraction process of a captured image and the reexamination process with respect to a captured image are demonstrated. FIG. 3 is a diagram showing an example of a process of extracting a captured image according to the present embodiment. FIG. 4 is a diagram showing an example of re-examination processing on a captured image according to the present embodiment.

  As shown in FIG. 3A, in the inspection apparatus 14 (see FIG. 3B), normal inspection is performed on two types of substrates Wa-Wf of MODEL: A and B between 0: 00-0: 50 of 1/1. Has been implemented. In the normal inspection, the existing inspection logic is executed on all these substrates Wa-Wf, and the captured images of the substrates Wa-Wf are stored in the image storage server 15 (see FIG. 3B), and the traceability information of the substrates Wa-Wf Are stored in the examination information storage server 16 (see FIG. 3B). In this normal inspection, although all the substrates Wa-Wf were shipped as non-defective products, a defect was found in the substrate of MODEL: B which was inspected at 1/130: 1:30, and the extraction unit 24 (figure An extraction process of the substrate W to be inspected according to 2) is performed.

  In this case, as shown in FIG. 3B, 0:30 to 1:00 of the classification MODEL: B of the substrate W and inspection date and time 1/1 is transmitted from the inspection apparatus 14 to the inspection information storage server 16 as an extraction condition (step S01). The inspection information storage server 16 searches for traceability information that satisfies the extraction condition, and specifies the substrate Wd of MODEL: B inspected at 0:30 of 1/1 as an inspection target (step S 02). The address to which the substrate Wd is to be stored is transmitted from the inspection information storage server 16 to the inspection device 14 (step S03). Then, the captured image stored at the address of the substrate Wd of the image storage server 15 is read by the inspection device 14 (step S04).

  Next, a reinspection process is performed on the substrate Wd. As shown to FIG. 4A, the several location of each board | substrate W is imaged by the imaging part 21 (refer FIG. 2) in a normal test | inspection. Therefore, from among the plurality of captured images of the substrate Wd, the identifying unit 25 (see FIG. 2) identifies the captured image I including the defective portion as the inspection target. Furthermore, as shown in FIG. 4B, a plurality of parts are included in the captured image I, and the part P to be a defective part is specified as an inspection target from among the plurality of parts by the specifying unit 25. As described above, since position information is associated with each part, the inspection position can be specified by inputting the part name. Moreover, it is also possible to specify an inspection position directly not only by parts but also by coordinate input of the inspection position.

  As shown in FIG. 4C, in the inspection logic assembly screen, an arbitrary inspection process is selected from the inspection process list 33 of the storage unit 26 (see FIG. 2), and each inspection process is set in the execution field 31 in order of execution. . In the example shown in the figure, luminance measurement, binarization processing, length measurement, and determination processing are selected for the part P of the captured image I, and these inspection processes are set in the execution field 31 in the order of execution and one inspection logic Will be assembled. Thereby, an outline is extracted from the luminance of the part P of the captured image I, and a determination logic as to whether the part P has an appropriate length is generated. In addition, since nothing is set in the parameter field 32, a specified value is set as a threshold value of the binarization process or the determination process.

  Then, inspection logic composed of a plurality of inspection processes set in the execution field 31 is executed by the execution unit 28 (see FIG. 2), and luminance measurement, binarization processing, and length measurement on the component P of the captured image I The determination process is performed in order. Thereby, even if there is no substrate W to be inspected, re-inspection is performed on the component P of the substrate W from the captured image stored at the time of the normal inspection. In addition, since the operator can freely set the inspection process in the execution field, the inspection logic can be flexibly constructed according to the defect of the substrate W, and the operator can verify the defect. .

  In addition, at the production site of the substrate W, it is possible to incorporate the inspection logic assembled at the time of reinspection as necessary into the normal inspection at the time of operation of the production line. Thereby, defects in the substrate W can be found out at the time of normal inspection, and it is possible to prevent in advance the substrate W that may have defects from being shipped to the market. In this case, different programs are set according to the type of the substrate W. However, even if the type of the substrate W changes, the program is automatically changed so that the same inspection logic is applied to the same parts. It may be done. As a captured image at the time of reexamination, a raw image usually used in an examination may be used, or a compressed image may be used.

  In addition, the inspection device 14 can be used other than reinspection of the substrate W. For example, when the inspection logic for a new part is formed, the inspection logic can be tried on a captured image of a past part similar to the new part. If there is a problem with a part in the past, it is possible to avoid the trouble of a new part in advance by conducting an inspection in advance. In this case, the inspection logic is managed for each type or system of parts so that the operator can easily use the inspection logic. Furthermore, by using past captured images and inspection logic, it can also be used for education to make an operator with less experience experience identify defects in specific parts.

  As described above, the inspection apparatus 14 according to the present embodiment can freely select the inspection process by the operator at the production site according to the defect of the substrate W, and can newly form an inspection logic. By using the inspection logic self-assembled by the operator, it is possible to re-inspect a defect of a substrate missed in the ordinary inspection of the inspection device 14 without relying on the manufacturer of the inspection device 14. The operator can verify the cause. In addition, since the inspection logic can be constructed only by selecting the inspection process, it is possible to flexibly verify according to the contents of the defect without putting a burden on the operator.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications. In the above embodiment, the size, shape, and the like illustrated in the attached drawings are not limited thereto, and can be appropriately changed within the range in which the effects of the present invention are exhibited. In addition, without departing from the scope of the object of the present invention, it is possible to appropriately change and implement.

  For example, in the present embodiment, the storage unit 26 of the inspection apparatus 14 is configured to store the inspection process for the captured image, that is, the image processing in the list of inspection processes, but is not limited to this configuration. The storage unit 26 may store an inspection process other than image processing such as laser measurement as an inspection process. Thus, when the substrate W to be inspected is at hand, inspection logic including an inspection process such as laser measurement can be performed on the substrate W.

  Moreover, in this Embodiment, although it was set as the structure which specifies the test | inspection position in the captured image of the board | substrate W in the identification part 25, it is not limited to this structure. The specifying unit 25 may be configured to be able to specify the inspection position of the substrate W, and may be configured to specify the actual inspection position of the substrate W when the substrate W to be inspected is at hand.

  Further, in the present embodiment, the receiving unit 27 is configured to receive the selection of the inspection process for each inspection position in the captured image of the substrate W, but is not limited to this configuration. The receiving unit 27 may be configured to receive the inspection process for each inspection position of the substrate W, and when the substrate W to be inspected is at hand, the selection of the inspection process for each inspection position of the actual substrate W is received It may be a configuration. Further, the receiving unit 27 may be configured not to receive the adjustment of the parameter of the inspection process. Furthermore, the parameters are not limited to those for setting the threshold of each inspection process, and may be those for adjusting the inspection sensitivity.

  Further, in the present embodiment, the execution unit 28 executes the inspection logic at the inspection position in the captured image of the substrate W. However, the present invention is not limited to this configuration. The execution unit 28 only needs to be configured to execute the inspection logic for each inspection position of the substrate W, and when the substrate W to be inspected is at hand, the inspection logic is performed for each inspection position of the actual substrate W The configuration may be

  Further, in the present embodiment, the substrate W is not limited to a printed circuit board, and may be a flexible substrate mounted on a jig substrate.

  Further, in the present embodiment, the inspection apparatus 14 for performing the normal inspection is configured to verify the defect of the substrate W missed in the normal inspection, but the present invention is not limited to this configuration. The inspection apparatus 14 may be an apparatus for reinspection which is different from the apparatus usually used in the inspection.

  Moreover, although it was set as the structure which the imaging part 21 images all the board | substrates W in this Embodiment, it is not limited to this structure. The imaging unit 21 may be configured to image only a part of the substrate W.

  In the present embodiment, the inspection apparatus is configured to store the program for executing the inspection method of the present invention. However, even if the inspection program is created in the personal computer different from the inspection apparatus, the program for executing the inspection method is stored. Good.

  As described above, the present invention has the effect of being able to verify the defects of the non-defective substrates shipped to the market by an operator at the production site, and in particular, inspects the quality of the substrates manufactured in the production line. The present invention is useful for an inspection apparatus, an inspection method, and a program used in the inspection apparatus.

DESCRIPTION OF SYMBOLS 1 Production system 14 inspection apparatus 15 image storage server 16 inspection information storage server 21 imaging unit 22 regular inspection unit 23 reinspection unit 24 extraction unit 25 identification unit 26 storage unit 27 reception unit 28 execution unit 31 execution field 32 parameter field

Claims (8)

An inspection apparatus capable of performing normal inspection on a substrate while the production line is in operation, and verifying defects of the substrate that are missed in the normal inspection,
A storage unit in which a list of inspection processes is stored;
An identifying unit that identifies an inspection position of the substrate;
A receiving unit that receives a selection of an inspection process for each inspection position of the substrate from the list of the inspection processes;
An inspection unit that executes inspection logic including an inspection process selected by the reception unit at an inspection position of the substrate.   The inspection apparatus according to claim 1, wherein the reception unit receives adjustment of a parameter of an inspection process.   The inspection apparatus according to claim 1, wherein the execution unit can execute the existing inspection logic used in the normal inspection in addition to the inspection logic. An imaging unit for imaging the substrate while the production line is in operation;
The storage unit stores a list of inspection processes for the captured image of the substrate,
The specifying unit specifies an inspection position in a captured image of the substrate,
The said execution part performs the said test | inspection logic with respect to the test | inspection position of the captured image of the said board | substrate, The inspection apparatus in any one of the Claims 1-3 characterized by the above-mentioned. An extraction unit that extracts a captured image of the substrate from the traceability information of the substrate;
5. The inspection apparatus according to claim 4, wherein captured images of all the substrates captured by the imaging unit during operation of the production line are stored in association with traceability information of the substrates.   The inspection apparatus according to claim 5, wherein the traceability information of the substrate includes a type of the substrate and an inspection date and time of a normal inspection of the substrate. An inspection method using an inspection apparatus capable of performing normal inspection on a substrate while the production line is in operation, and verifying a defect of the substrate missed in the normal inspection,
Identifying an inspection position of the substrate;
Selecting an inspection process for each inspection position of the substrate from a list of inspection processes stored in a storage unit;
Performing an inspection logic consisting of the selected inspection process at the inspection position of the substrate.   A program causing an inspection apparatus or an inspection program creation personal computer to execute the inspection method according to claim 7.

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