JP6520818B2 - Method of manufacturing metallized resin film - Google Patents

Description

  The present invention relates to a method of producing a metallized resin film. More specifically, the present invention relates to a method for producing a metallized resin film, which includes a trimming step of cutting the metallized film perpendicularly to the width direction.

  A metallized resin film in which a conductive metal film is laminated on the entire surface or a part of a resin film is a printed wiring board (PWB), a flexible printed wiring board (FPC), a tape for automatic tape bonding (TAB), a chip on film It is used as a material of a mounting substrate for electronic components such as (COF).

  Among these mounting substrates, COF is particularly noted as a means for mounting a liquid crystal display driver IC chip. The COF is known as a mounting substrate which is capable of fine pitch mounting as compared with the conventional tape carrier package (TCP) and which can easily reduce the size and cost of the driver IC chip. As a method of producing this COF, a metallized resin film in which a metal film such as a metal thin film layer or a copper layer is laminated on the surface of a polyimide film which is a high heat resistance and high insulation resin without an adhesive Wiring processing by the subtractive method is widely performed.

  With the reduction in size, size, and size of electronic components, there is an increasing demand for narrowing the wiring pitch even on a mounting substrate containing COF. In order to meet the demand for higher wiring pitch, it is important to eliminate distortion and wrinkles in the metallized resin film that is the material of the mounting substrate. It is because distortion or wrinkles cause an obstacle such as reduction in processing accuracy at the time of wiring processing.

  The configuration of a metallized resin film such as COF and a method for producing the same are disclosed, for example, in Patent Document 1. In the technique of this document, first, an underlying metal layer of about 7 to 50 nm in thickness made of nickel, chromium, nickel chromium alloy or the like is formed by sputtering on a resin film of about 38 to 50 μm in thickness, In order to impart good conductivity, the copper thin film layer is thickened using electroplating or the like to form a metal conductor composed of a copper layer having a thickness of about 5 to 15 μm. Obtained metallized resin film. In recent years, the thickness of a copper thin film layer formed by sputtering is generally 100 to 500 nm. Further, the thickness of the copper layer is also generally 5 to 12 μm when the circuit is formed by the subtractive method.

  When the copper thin film layer is thickened by electroplating, copper ions are supplied from the various directions to the end of the area to be plated, and the deposition of copper is more advantageous than the central part. In particular, since the current is concentrated at a place where the electrical resistance is low, the deposition of copper is more advantageous for the thick film part and the film thickness is further thickened. Therefore, in the metallized resin film after electroplating, the film thickness of the copper layer of the width direction end part of resin films (base materials), such as a polyimide film, becomes thick locally. When the metallized resin film is wound, the widthwise end of the roll is raised and the flatness of the surface layer of the roll is lost. This phenomenon is called edge thickening, and the raised portion is deformed, and even if it is rolled out, the deformation does not recover but remains as a permanent strain. As a result, there occurs a defect in which the smoothness in the width direction of the metallized resin film is lost, and when wiring is processed using the metallized resin film as a substrate, a failure such as reduction in processing accuracy occurs.

  Therefore, the edge of the metallized resin film after electroplating is not trimmed when rolled in a roll by performing a process called trimming that is performed by a device called a slitter disclosed in Patent Document 2 to remove the widthwise end of the metallized resin film. It is like that.

  Here, in the copper layer of the metallized resin film, in addition to the widthwise end, although the degree is smaller than in the widthwise end, unevenness (film thickness variation) of the film thickness exists in the widthwise direction. is there. This is because the metallized resin film production is continuously processed in a roll-to-roll method, and therefore this film thickness unevenness is thick at the same position and thin at another position when viewed in the width direction. It appears in the form of The film thickness distribution often appears continuously in the longitudinal direction. Therefore, when the metallized resin film is wound into a roll, even if trimming is performed with a slitter, a portion having a thick film thickness other than the widthwise end bulges. This is called a gauge band, and the raised part is deformed in the same manner as the edge fat, and even if unrolled from the roll shape, the deformation is not recovered and remains as a permanent strain. That is, when the width direction end is cut by trimming to solve the problem of edge thickening, a defect called a gauge band becomes apparent in parts other than the end. When the gauge band is included in the substrate, there is a problem that when the wiring processing of the substrate is attempted, a failure such as a decrease in processing accuracy occurs.

JP 2002-252257 A JP, 2010-234522, A

  Therefore, in view of the above circumstances, the present invention has an object to provide a method for producing a metallized resin film including a trimming step of cutting the metallized resin film so that a gauge band does not occur at places other than the widthwise end. Do.

  As a result of intensive investigations by the inventor of the present invention, in the trimming step, the cut portion of the metallized resin film is intentionally in a roll shape by intentionally applying a slight deformation to such an extent that the edge does not become thick even when wound in a roll shape. The gauge band was not generated when wound up.

In the method of producing a metallized resin film according to the first aspect of the present invention, a metallized resin film is fed between a pair of cutting blades comprising a disk-shaped upper cutting blade and a lower cutting blade, and a product film and a waste film A method of manufacturing a metallized resin film including a trimming step of cutting into two, wherein the upper cutting edge is disposed closer to the product film than the lower cutting edge in the width direction of the metallized resin film , The surface angle of the upper cutting edge in the plane including the rotation center of the upper cutting edge is 25 degrees or more and 50 degrees or less, and the metal of the product film in the cut portion of the product film after being cut by the trimming step It is characterized in that the deformation height of the portion is 1 μm or more and 3 μm or less .
The metallized resin film of the second invention is a metallized resin film in which a conductive metal film is laminated on a resin film, and a deformed portion which is bent and deformed at least one widthwise end of the metallized resin film. And the deformation height of the deformation portion is 1 μm or more and 3 μm or less.
In the metallized resin film of the third invention, the conductive metal film is laminated on at least one surface of the resin film, on a base metal layer laminated without an adhesive layer, and on the surface of the base metal layer. And a copper layer,

According to the first aspect of the present invention, the method of manufacturing a metallized resin film includes a trimming step of cutting the metallized resin film into a product film and a waste film by a pair of cutting blades, and an upper cutting blade constituting the pair of cutting blades is By being disposed closer to the product film than the lower cutting edge in the width direction of the metallized resin film, the upper cutting edge can be deformed so as to raise the cut portion when the metallized resin film is cut. As a result, even when the product film is wound up, the film thickness portion appearing outside the widthwise end can be prevented from being crushed, and it is effective to suppress the gauge band which is a defect that tends to occur in this portion. Can be done. Therefore, when the product film manufactured by this manufacturing method is used as a substrate, highly accurate wiring processing becomes possible.
In addition, when the surface angle of the upper cutting blade in the plane including the rotation axis is 25 degrees or more and 50 degrees or less, the film thickness portion where the bulge of the cut portion of the product film occurs other than the end of the product film Therefore, the gauge band can be suppressed more effectively.
Furthermore, in the cut portion of the product film, when the deformation height of the metal portion of the product film is 1 μm or more and 3 μm or less, no edge thickening occurs and the gauge band at other than the width direction end of the product film can be suppressed. . As a result, the metallized resin film is not distorted or wrinkled, and it is possible to suppress the occurrence of a failure such as a decrease in processing accuracy at the time of wiring processing.
According to the second aspect of the present invention, there is a deformed portion which is bent and deformed at at least one width direction end of the metallized resin film, and the deformation height is 1 μm or more and 3 μm or less. Even when wound up, no edge thickening occurs, and the gauge band at other than the width end of the metallized resin film can be suppressed. Thereby, when this metallized resin film is used, distortion and wrinkles are not generated in the metallized resin film, and it is possible to suppress the occurrence of a failure such as a decrease in processing accuracy at the time of wiring processing.
According to the third aspect of the invention, as the COF capable of fine pitch mounting, the conductive metal film is composed of the base metal layer laminated without the adhesive layer interposed and the copper layer laminated on the surface thereof. Even when the metallized resin film is used, it is possible to suppress the occurrence of a failure such as a decrease in processing accuracy in the wiring processing.

It is explanatory drawing of the trimming process which concerns on embodiment of this invention, (A) is explanatory drawing from a front direction, (B) is explanatory drawing from a side direction. It is explanatory drawing from the perspective view of the trimming process which concerns on embodiment of this invention. It is the elements enlargement explanatory view of the trimming process concerning the embodiment of the present invention, and (A) is the front view showing immediately before reaching metalization resin film to cutting blade pair, (B) is metalization resin film cutting blade pair (C) is a front view showing a state immediately after the metallized resin film is cut by a pair of cutting blades. It is front sectional drawing of the cutting blade pair of another form used by the trimming process which concerns on embodiment of this invention.

Next, an embodiment of the present invention will be described based on the drawings.
<Manufacturing process of metallized resin film>
Although the following description exemplifies the metallized resin film processed using the dry plating method and the electroplating method, it is limited to the metallized resin film which takes this manufacturing method so that it may mention later. The present invention is widely applied to other metallized resin films which are wound into a roll and processed while being conveyed by a roll-to-roll method.

  The metallized resin film of the present invention is conveyed by a roll-to-roll method on at least one surface of a long strip-shaped resin film while using a dry plating method without using an adhesive layer. A copper thin film layer is formed on the surface of the base metal layer and the surface of the base metal layer to obtain a resin film with a copper thin film. Furthermore, a metallized resin film is manufactured by thickening this copper thin film layer using electroplating with this copper thin film provided resin film.

  In the production of a resin film with a copper thin film, as a resin film which is a long strip, a polyimide film, a polyamide film, a polyester film, a polytetrafluoroethylene film, a polyphenylene sulfide film, a polyethylene naphthalate film, polyethylene terephthalate (PET) A film, a liquid crystal polymer film or the like may be used, and in particular, a polyimide film is preferable from the viewpoint of heat resistance.

  These resin films are metallized resins used for manufacturing a mounting substrate for electronic parts by wiring processing from the point of having flexibility, strength necessary for practical use, and electrical insulating properties suitable as wiring materials. It is suitable as a film material. Moreover, the thickness is also suitably selected according to a use, but a thing of 10-50 micrometers is mainly used.

  The dry plating method is used to secure sufficient adhesion between a resin film and a metal layer such as a base metal layer without using an adhesive, and vacuum deposition, sputtering, ion plating, ion beam sputtering It is preferable to use a sputtering method, in particular.

  The base metal layer is made of nickel, chromium or a nickel-based alloy in order to enhance the corrosion resistance and electrical reliability of the metallized resin film as a wiring material. Examples of nickel-based alloys include nickel-chromium alloys, nickel-chromium-molybdenum alloys, and nickel-vanadium-molybdenum alloys. The thickness of the base metal layer is not particularly limited, but generally 5 to 50 nm.

  The copper thin film layer is formed and laminated on the surface of the base metal layer in order to impart good conductivity for power supply by the electroplating method described later. Although the thickness of the copper thin film layer is not particularly limited, it is generally 100 to 1,000 nm, and preferably 100 to 500 nm from the viewpoint of productivity.

  Next, a metallized resin film is manufactured by thickening a copper thin film layer into a copper layer by electroplating using a copper thin film-attached resin film. In electroplating, it is preferable to perform pre-treatment before electroplating treatment and post-treatment after electroplating.

  In the pretreatment before electroplating, foreign substances such as oxides and organic substances may be present on the surface of the copper thin film layer, and they are applied to form a copper layer with few surface defects. The pretreatment is preferably performed in the order of chemical treatment, water washing, dehydration and drying.

  In the electroplating process, the resin film on which the base metal layer and the copper thin film layer are laminated is immersed in the plating solution while being transported by a roll-to-roll method, and the copper thin film layer is fed as a cathode. Copper ions are deposited to form a copper thin film layer to form a copper layer.

  The range of the thickness of the copper layer differs depending on the method of wiring the metallized resin film to the mounting substrate for electronic components, but the range differs depending on, for example, 5 to 5 when wiring is performed using the subtractive method. It is preferable to set it as 12 micrometers.

  The plating solution is not particularly limited, and any known plating solution may be used. However, the plating solution is mainly composed of sulfuric acid and copper sulfate, and is acidic to which various additives are added in order to obtain desired copper layer characteristics. It is preferable to use a plating solution. Here, as the additives, known ones may be used according to the desired effects. A soluble anode may be used as a copper ion source in the plating solution to use a copper plate or the like as the copper ion source, or an insoluble anode may be used to provide a copper ion source outside the plating tank.

  The current density in electroplating is not particularly limited, but while the copper layer in the initial stage of electroplating is thin, the current density is lowered, and as the electroplating progresses and the copper layer becomes thicker, the current The density may be increased to finally achieve the desired copper layer thickness.

  Since the copper plating solution adheres to the surface of the copper layer after the electroplating process, it is subjected to a post-treatment of washing it with water and drying it. Moreover, in this post-treatment, in order to prevent the copper layer from being oxidized, it is preferable to carry out an anticorrosion treatment after the water washing.

<Trimming process>
The method for producing a metallized resin film according to the present invention includes a trimming step of cutting and removing widthwise end portions of the metallized resin film after performing electroplating and post-treatment.

  In the metallized resin film in which the copper layer is thickened by electroplating, as described above, copper ions are supplied from the various directions at the end of the area to be electroplated, and copper deposition is greater than in the central part. From the advantage, the widthwise end tends to have a thicker copper layer than the central portion. When this is wound into a roll, an edge thickening occurs in which the widthwise end of the roll bulges, and even if it is unwound from the roll, deformation remains as a permanent strain in the metallized resin film. In order to prevent this edge thickening, trimming is performed by cutting and removing the thickened copper layer at the widthwise end of the metallized resin film.

  FIG. 1 is an explanatory view of a trimming process according to an embodiment of the present invention, and FIG. 1 (A) is an explanatory view of a partial configuration of the slitter 1 performing the trimming process as viewed from the front direction; These are explanatory figures which looked at the slitter 1 from the side direction. FIGS. 1A and 1B show a configuration in which trimming is actually performed in the slitter device. FIG. 2 is an explanatory view from the perspective of the trimming process according to the embodiment of the present invention. FIG. 3 is a partially enlarged explanatory view of the trimming process according to the embodiment of the present invention, which is an enlarged view of a portion S of FIG. 1 (A). FIG. 3A is a front view showing a state immediately before the metallized resin film 20 reaches the cutting blade pair 10, and FIG. 3B is a cutting of the metallized resin film 20 by the cutting blade pair 10 3C is a front view showing a state immediately after the metallized film 20 is cut by the cutting blade pair 10. FIG.

  As shown in FIG. 2, the slitter 10 used in the trimming step constituting the present invention is a metallized resin film 20 which is conveyed in the direction of the arrow in FIG. 2 and held in a substantially horizontal posture. By the pair 10, the product film 21 at the center in the width direction and the waste film 22 at the end in the width direction are cut. The product film 21 and the waste film 22 constitute the metallized resin film 20, and for convenience, the name of the metallized resin film 20 after cutting is changed.

  As shown in FIG. 1, the cutting blade pair 10 is configured to include a disk-shaped upper cutting blade 10 and a flat bottomed cylindrical lower cutting blade 12. When the metallized resin film 20 passes between the upper cutting edge 11 and the lower cutting edge 12, the metallized resin film 20 is cut and divided into a product film 21 and a waste film 22. The divided product film 21 and the waste film 22 are respectively wound on rolls in a post process.

  In order to stabilize the posture of the metallized resin film 20, a spacer 13 is provided in parallel with the lower cutting edge 12. The spacer 13 is provided at a position horizontally opposed to the lower cutting edge 12 so that the upper end thereof is at the same height as the upper end of the lower cutting edge 12, and the upper cutting edge 11 is provided so as to sandwich the lower cutting edge 12. It is done.

  The disk-shaped upper cutting blade 11 will be described in detail with reference to FIG. In the trimming process, as shown in FIG. 3A, the upper cutting edge 11 having a sharp blade angle B in cross section is used. Of the two surfaces forming the acute cutting edge B, the cutting edge of the upper cutting edge 11 is composed of a front surface 11a on one side and a back surface 11b on the other side.

  The lower cutting blade 12 serving as the receiving member preferably has a shape such that the upper end thereof is horizontal in order to facilitate the alignment of the cut portion of the metallized resin film 20 and to make it difficult to cause positional deviation even at the time of cutting.

  The trimming process will be described in detail with reference to FIG. FIG. 3A shows the state in the a cross section of FIG. 1B, and in the state before cutting the metallized resin film 20 using the upper cutting edge 11 and the lower cutting edge 12, the metallized resin The film 20 is cut at a cutting position 40 which is vertically below the cutting edge of the upper cutting edge 11. The metallized resin film 20 is held by the spacer 30 and a pressing member (not shown) in the state where the end in the width direction including the cutting position 40 extends from the spacer 30 into space. On the paper surface of FIG. 3, the left side of the cutting position 40 is a product film 21 which is rolled up as a product after trimming, and the right side is a waste film 22 which becomes unnecessary due to trimming. The metallized resin film 20 has the resin film 20b on the upper side, and the copper layer 20a is laminated on the lower side. The upper end of the lower cutting edge 12 is disposed such that the lower surface of the metallized resin film 20 abuts.

  In the present embodiment, the metallized resin film 20 is described in which the copper layer 20a is laminated only on one side of the resin film 20b. However, for example, the metallized resin film 20 is also laminated on both sides. The same effect is achieved on one side. In the case where the copper layer 20a is laminated only on one side, as shown in FIG. 3, the copper layer 20a is preferably disposed on the lower side so as to be in contact with the spacer 30.

  The upper cutting edge 11 is disposed closer to the product film than the lower cutting edge 12 in the width direction of the metallized resin film 20. That is, the front blade surface 11 a faces the product film 21, and the back blade surface 11 b faces the waste film 22. The upper cutting edge 11 has a surface angle A with respect to an axis (vertical axis T) perpendicular to the metallized resin film 20 in a plane including the rotation center of the upper cutting edge 11 as a surface angle A. The angle on the blade surface 11b side is represented by B-A, and the angle is A> B-A. The surface angle A of the upper cutting edge 11 shown in FIG. 3A represents an angle in a plane including the rotation center of the upper cutting edge 11.

  FIG. 3 (B) shows the state in the b cross section of FIG. 1 (B), that is, the state where the upper cutting edge 11 is cutting into the metallized resin film 20. As described above, since the waste film 22 has a small blade angle B-A on the back blade surface side, the end in the width direction after cutting is pushed by the upper cutting blade 11 and slightly right on the sheet of FIG. It only moves in the direction. On the other hand, the product film 21 has a large surface angle A of the upper cutting edge, and the product film 21 side is fixed to the spacer 30 with a holding jig not shown, so during cutting it is horizontal on the paper of FIG. It does not move in the direction and is compressed between the upper cutting edge 11 and the spacer 30.

  FIG. 3C shows a state in the c cross section of FIG. 1B, that is, a state in which the metallized resin film 20 is cut past the cutting edge pair 10. In FIG. 3 (B), the portion compressed at the width direction end of the product film 21 by the upper cutting blade 11 is moved from the compression by the upper cutting blade 11 moving relatively upward from the metallized resin film 20 Although it is released, the end portion jumps upward due to the reaction, and finally, as shown in FIG. 3 (C), it becomes a permanent strain that bends upward and remains bending deformation to form a deformed portion 20c. The height of the deformation portion 20c is hereinafter referred to as a deformation height H. It is important that the deformation height H be in a range in which neither edge weight nor gauge band occurs.

  The method of manufacturing the metallized resin film 20 includes a trimming step of cutting the metallized resin film 20 into the product film 21 and the waste film 22 by the cutting blade pair 10, and the upper cutting blade 11 constituting the cutting blade pair 10 is By being disposed closer to the product film 21 than the lower cutting edge 12 in the width direction of the metallized resin film 20, the upper cutting edge 11 can be deformed so as to raise the cut portion when the product film 21 is cut. . As a result, even when the product film 21 is wound up, the film thickness portion appearing outside the widthwise end can be prevented from being crushed, and it is effective to suppress the gauge band which is a defect that tends to occur in this portion. Can be done. Therefore, when the product film 21 manufactured by this manufacturing method is used as a substrate, highly accurate wiring processing becomes possible.

  The surface angle A of the upper cutting edge 11 in the plane including the rotation center of the upper cutting edge 11 is larger than the angle (B-A) obtained by removing the surface angle A from the cutting edge B of the upper cutting edge 11 The cut portion on the product film 21 side can be deformed to be raised as compared to the film 22 side.

  The deformation height H of the widthwise end of the product film 21 is preferably 1 μm or more and 3 μm or less. When the deformation height H is less than 1 μm, no edge thickening occurs when the product film 21 is wound in a roll, but a region with a thick copper layer is continuous in the longitudinal direction at locations other than the widthwise end. When it is present, winding stress can not be relieved at the widthwise end of the roll, and a gauge band may occur. On the other hand, when the deformation height H exceeds 3 μm, edge thickening may occur. In the product film 21, there are deformed portions 20c in which both of the widthwise end portions are bent and deformed, and it is preferable to set the deformation height H of the deformed portions 20c to 1 μm or more and 3 μm or less. Both the edge thickening and the gauge band occur even if the deformation portion 20c bent and deformed by the trimming process of the present invention described above is formed in the portion and the deformation height H of the deformation portion 20c is 1 μm to 3 μm. It is possible to reduce the

  The surface angle A of the upper cutting edge 11 is preferably an acute angle of 25 degrees or more and 50 degrees or less, and more preferably 40 degrees or more and 50 degrees or less. As the surface angle A of the upper cutting edge 11 becomes wider, the area to be compressed at the end in the width direction of the product film 21 shown in FIG. 3B is broadened, and the deformation height H after cutting is increased. As this is the case, the deformation height H is controlled by the surface angle A of the upper cutting edge 11. However, as the surface angle A of the upper cutting edge 11 is wider, it is more likely that a crushed deformation occurs in the cut surface or a burr is generated in the cut surface. On the other hand, as the surface angle A of the upper cutting edge 11 narrows, the cutting edge of the upper cutting edge 11 is chipped, and the life of the upper cutting edge 11 tends to be shortened. If the surface angle A of the upper cutting edge 11 is less than 25 degrees, the cutting edge of the upper cutting edge 11 may be chipped and it may not be possible to cut immediately. Further, in consideration of the life of the cutting edge, the surface angle A of the upper cutting edge is preferably 40 degrees or more. When the surface angle A of the upper cutting edge 11 exceeds 60 degrees, the deformation height H may exceed the above-mentioned appropriate range, and edge thickening may occur.

  The material of the upper cutting blade 11 and the lower cutting blade 12 is not particularly limited and may be a material used for a known cutting material, such as cemented carbide such as tungsten carbide (WC) or tool steel. it can. In addition, the edge portions of the upper cutting edge 11 and the lower cutting edge 12 may be subjected to surface treatment such as diamond coating or DLC coating to enhance the abrasion resistance.

  The method for producing the metallized resin film of the present invention has been described above by exemplifying the metallized resin film processed using the dry plating method and the electroplating method while conveying by the roll-to-roll method. The metal resin film is not limited to the illustrated metallized resin film. For example, a metallized resin film may be produced by bonding or laminating a resin film and a metal foil with an adhesive, a metal foil coated with a resin solution, dried and polymerized, or the like Also included are resin films and metal foils that are partially metallized. These metallized resin films should all be in the form of a band, be processed while being transported by a roll-to-roll method, and be wound into a roll when processing is completed, and cut the end in the width direction Common to all three points. In addition, the gauge band produced by edge thickening etc. becomes remarkable, when the thickness of a metallized resin film is thin. Therefore, when the thickness of a metallized resin film is 100 micrometers or less, the manufacturing method of this invention is used suitably. Further, the lower limit of the thickness of the metallized resin film is not particularly limited, but as it becomes thinner, it becomes more difficult to wind in a roll shape and to process in a roll-to-roll system, The present invention is suitably used for metallized resin films having a thickness of 5 μm or more.

  Further, FIG. 4 shows a front sectional view of another form of cutting blade pair 10 used in the trimming process. The upper cutting blade 11 of this embodiment differs from the above-mentioned upper cutting blade 11 in that the back blade surface 11 b is closer to the front blade surface 11 a than the vertical axis T.

<Example>
The present invention will be further described with reference to the following examples. The evaluation method is as follows.

(Gauge band)
The metallized resin film after trimming is wound into a roll, and the flatness of the wound roll is visually observed, and it is determined as a gauge band when irregularities are confirmed in locations other than the widthwise end. X.

(End face quality)
The metallized resin film after trimming is wound into a roll, and the flatness of the wound roll is visually observed, and when the convex shape is confirmed at the end in the width direction, it is determined that the edge is thick and "X" And

(Edge life)
When the cutting edge of the upper cutting edge used for trimming is chipped at the time of cutting, the amount of wear when used for a long time is large and the life is short, and evaluation is made. Although the cutting edge was not chipped, it was evaluated as “Δ” when the amount of wear was large and the life was short.

Example 1
A polyimide film roll (Kapton (registered trademark) EN, manufactured by Toray DuPont Co., Ltd.) having a width of 50 cm, a thickness of 38 μm, and a length of 1000 m was prepared as a resin film. After laminating a nickel-chromium alloy thin film with a film thickness of 25 nm on one side of this polyimide film using a roll-to-roll sputtering device, a copper thin film with a film thickness of 100 nm is laminated on the surface The polyimide film with a copper thin film was obtained. Next, using a roll-to-roll type electroplating apparatus, the copper thin film layer of this copper thin film-attached polyimide film was thickened to a thickness of 8 μm to form a copper layer, to obtain a metallized resin film. The widthwise end of this metallized resin film was trimmed while being conveyed by the roll-to-roll method using the slitter shown in FIG. 1 according to the procedure shown in FIG. 3, and after trimming, it was wound into a roll. The surface angle of the upper cutting edge was 45 degrees.

  The condition of the wound roll was observed to determine the gauge band and end face quality. Moreover, the cutting edge of the upper cutting blade after trimming was confirmed, and the cutting edge life was determined. The results are shown in Table 1.

(Example 2)
Trimming was performed under the same conditions as in Example 1 except that the surface angle of the upper cutting edge of Example 1 was set to 30 degrees, and the metallized resin film was wound into a roll. The condition of the wound roll was observed to determine the gauge band and end face quality. Moreover, the cutting edge of the upper cutting blade after trimming was confirmed, and the cutting edge life was determined. The results are shown in Table 1.

(Comparative example 1)
Trimming was performed under the same conditions as in Example 1 except that the surface angle of the upper cutting edge of Example 1 was changed to 20 degrees, and the metallized resin film was wound into a roll. The condition of the wound roll was observed to determine the gauge band and end face quality. Moreover, the cutting edge of the upper cutting blade after trimming was confirmed, and the cutting edge life was determined. The results are shown in Table 1.

(Comparative example 2)
Trimming was performed under the same conditions as in Example except that the blade angle of the upper cutting edge of Example 1 was set to 60 degrees, and the metallized resin film was wound into a roll. The condition of the wound roll was observed to determine the gauge band and end face quality. Moreover, the cutting edge of the upper cutting blade after trimming was confirmed, and the cutting edge life was determined. The results are shown in Table 1.

(Comparative example 3)
Trimming was carried out under the same conditions as in Example except that the blade angle of the upper cutting edge of Example 1 was 85 degrees, and the metallized resin film was wound into a roll. The condition of the wound roll was observed to determine the gauge band and end face quality. In addition, the cutting edge of the upper cutting edge after trimming was confirmed to determine the cutting edge life. The results are shown in Table 1.

  From Table 1, when the surface angle of the upper cutting edge is 20 degrees or less, the result that the gauge band appears and the edge life becomes short is obtained. In addition, when the surface angle of the upper cutting edge is 60 degrees or more, the end surface quality of the metallized resin film after cutting is deteriorated. When the end face quality of Example 2 (having a surface angle of 45 degrees) and Comparative Example 2 (having a surface angle of 60 degrees) is visually compared, the surface angle of the upper cutting edge is limited to 50 degrees. In addition, when the wear amount of the cutting edge is measured at the surface angle of 30 degrees and 45 degrees that satisfy the gauge band and the end face quality, when the surface angle is 30 degrees, the wear amount of the cutting edge is relatively large and the blade life is about Was able to get the result of becoming shorter.

DESCRIPTION OF SYMBOLS 10 cutting blade pair 11 upper cutting blade 12 lower cutting blade 20 metallized resin film 21 product film 22 waste film A surface angle H deformation height

Claims (3)

A metallized resin film comprising a trimming step in which a metallized resin film is fed between a pair of cutting blades consisting of a disk-shaped upper cutting blade and a lower cutting blade, and cut into a product film and a waste film. A manufacturing method,
The upper cutting edge is disposed closer to the product film than the lower cutting edge in the width direction of the metallized resin film ,
The surface angle of the upper cutting edge in a plane including the rotation center of the upper cutting edge is 25 degrees or more and 50 degrees or less,
In the cut portion of the product film after being cut by the trimming step,
The deformation height of the metal part of the product film is 1 μm or more and 3 μm or less,
A method of producing a metallized resin film characterized by A metallized resin film in which a conductive metal film is laminated on a resin film,
A deformed portion which is bent and deformed exists at at least one width direction end of the metallized resin film,
The deformation height of the deformation portion is 1 μm to 3 μm,
Metallized resin film characterized by The conductive metal film is
An underlying metal layer laminated without an adhesive layer on at least one surface of the resin film;
And a copper layer laminated on the surface of the base metal layer,
The metallized resin film according to claim 2 , characterized in that.

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