JP6519078B2 - Substrate holding member, substrate holding member for conversion, substrate holding apparatus, substrate processing apparatus, resist coating method, and method of manufacturing semiconductor element - Google Patents

Description

  The present invention relates to a substrate holding member, a conversion substrate holding member, a substrate holding apparatus, a substrate processing apparatus, a resist coating method, and a method of manufacturing a semiconductor element.

  Conventionally, in processing steps of various substrates such as semiconductor substrates and liquid crystal substrates, processing such as application of resist, cleaning, and drying is performed while rotating the substrate in a state where the substrate is adsorbed and held on the substrate mounting surface of the spindle. . Further, a circular substrate is generally used as a substrate used in the semiconductor device process and the like. However, in small-scale production and test research, an irregularly shaped substrate cut from a circular substrate, for example, a fan-shaped substrate may be used.

FIGS. 7A and 7B are a cross-sectional view and a plan view schematically showing a portion of a substrate holding member (vacuum chuck) for adsorbing a substrate in a conventional spin coater (rotational coating apparatus).
FIG. 7A shows the substrate W mounted on the substrate mounting surface 103 together.
As shown in FIG. 7A, the substrate holding member 100 is composed of a main body 101 and a rotary shaft 102 integrated with the main body 101. Further, the substrate holding member 100 is provided with an intake passage 106 having an opening in the substrate mounting surface 103 and penetrating the main body 101 and the rotating shaft 102 in the vertical direction.

As shown in FIGS. 7A and 7B, a suction hole 104, which is an opening of the intake passage 106, is formed at the center of the substrate mounting surface 103 and communicates with the intake passage 106 to suck air. It can be configured. Further, as shown in FIG. 7B, on the substrate mounting surface 103, two annular groove portions 105a are concentrically formed around the suction hole 104. As shown in FIG. Further, two linear grooves 105 b are radially formed around the suction hole 5 of the substrate mounting surface 2 and intersect with the grooves 4 a. The grooves 105a and the grooves 105b communicate with each other at the intersections of the grooves 105a and the grooves 105b. Then, air is sucked from the suction holes 104, whereby the entire suction portion including the groove portion 105a and the groove portion 105b sucks and holds the substrate W.
In the spin coater, processes such as resist application and drying are performed while rotating the substrate W in a state where the substrate W is adsorbed and held on the substrate mounting surface 103 as described above.

  As a substrate holding member used for a highly symmetrical substrate such as a circular shape or a square, a substrate mounting surface having a circular shape (for example, see Patent Document 1) or a square (for example, Patent Document 2) is used There is.

  As a substrate holding member, a method is also known in which the back surface of the substrate is partially adsorbed by a suction disk or the like instead of the flat substrate mounting surface as shown in FIG. 7, but as a substrate holding member holding a semiconductor substrate In general, one having a flat substrate mounting surface which can be held in contact with the back surface of the semiconductor substrate on the surface and held stably.

JP, 2011-82457, A Japanese Patent Application Laid-Open No. 7-163933

When the resist is applied to the substrate by such a spin coater, the substrate needs to cover the grooves in order to prevent the resist from entering the grooves (for example, 105a and 105b in FIG. 7). A substrate holding member having a surface is used.
On the other hand, in order to stably hold the substrate, it is preferable to use a substrate holding member having a substrate mounting surface with the largest possible area. In the case of a circular substrate, a substrate holding member having a flat, circular substrate mounting surface is generally used. In this case, the substrate can be stably adsorbed by using a substrate holding member whose diameter is about 80% of the diameter of the substrate mounted on the substrate mounting surface. On the other hand, in the case of using a substrate holding member having a circular substrate mounting surface with respect to the irregular substrate, it is difficult to increase the ratio of the area of the substrate mounting surface to be adsorbed to the irregular substrate. The reason is that under the condition that the substrate covers the groove, when the irregular substrate is held on the circular substrate mounting surface of the substrate holding member, the distance from the center position of the circle to the groove at the farthest position is This is because it is necessary to use a substrate holding member having a circular substrate mounting surface which is smaller than the distance from the central position to any position of the peripheral edge of the irregular substrate in a plan view. In other words, under the condition that the substrate covers the groove, in the case of the irregular substrate, it is necessary to use a substrate holding member having a circular substrate mounting surface with a smaller diameter than in the case of the circular substrate. It is because there is. For example, in the case of a fan-shaped irregular substrate obtained by cutting a circular substrate into a cross, it is difficult to make the diameter of the substrate mounting surface 50% or more of the maximum diameter of the irregular substrate. In the case where the area of the substrate mounting surface is smaller than the area of the irregular substrate, the area of the groove to which the adsorption force acts is also reduced, so that the fixation of the substrate becomes unstable. For example, when the number of rotations is increased (for example, when the number of rotations is changed from 3000 rpm to 6000 rpm), the substrate may be detached from the substrate mounting surface due to the insufficient suction force. As a result, the surface of the substrate may not only be contaminated or destroyed, but the substrate flying at high speed may collide with the inner wall of the device or the like to cause device failure.

  Also, for example, in the case of test research, substrates having different sizes and shapes may be used. When the same substrate holding member is used for substrates having different sizes and shapes, there is a possibility that the adsorption force of the substrate mounting surface may be insufficient. Therefore, the substrate holding member of a size and shape suitable for the substrate holding and rotating method. Need to be prepared each time.

  In view of such circumstances, the present invention is a substrate holding member capable of stably holding a substrate having an irregular shape other than a circle or a square, a substrate holding member for conversion, a substrate holding apparatus provided with such substrate holding members, and substrate processing An object of the present invention is to provide an apparatus, a resist coating method using the substrate holding members, and a method of manufacturing a semiconductor device.

The present invention adopts the following means in order to solve the above problems.
(1) A substrate holding member for holding a substrate on a substrate mounting surface by vacuum suction force
The substrate mounting surface has a suction hole and a groove pattern communicating with the suction hole,
The substrate holding member is characterized in that the substrate mounting surface is a flat surface having three sides and three crests connecting two adjacent sides of the three sides in plan view.
(2) The groove pattern according to (1), characterized in that the groove pattern has a groove extending from the suction hole toward the top and three grooves parallel to at least a part of each of the three sides. Substrate holding member.
(3) The substrate holding member according to (1) or (2), wherein all the three sides are straight.
(4) The substrate holding member according to (3), wherein the three sides form an equilateral triangle.
(5) The substrate holding member according to any one of (1) and (2), wherein at least one side of the three sides is a straight line.
(6) The substrate holding member according to any one of (1) to (5), wherein at least one of the three apexes is outwardly rounded.
(7) A substrate holding device comprising the substrate holding member according to any one of (1) to (6).
(8) A conversion substrate holding member capable of holding the substrate on the substrate mounting surface (conversion substrate mounting surface) by vacuum suction force by fitting the substrate holding member from the substrate mounting surface side,
The conversion substrate mounting surface has suction holes and a groove pattern communicating with the suction holes,
The conversion substrate mounting surface is a flat surface having three sides and three apexes connecting two adjacent sides of the three sides in plan view,
A conversion substrate holding member characterized in that a concave portion having the same shape as the outer shape of the substrate mounting surface of the substrate holding member is provided on the opposite side of the conversion substrate mounting surface.
(9) The substrate holding member according to any one of (1) to (6), the substrate holding member provided in the substrate holding device according to (7), or the substrate for conversion according to (8) What is claimed is: 1. A substrate processing apparatus comprising: a rotary substrate processing unit that holds a substrate using a member and rotates the substrate while performing predetermined substrate processing.
(10) The substrate holding member according to any one of (1) to (6), the substrate holding member provided in the substrate holding device according to (7), or the substrate for conversion according to (8) A resist coating method comprising: applying a resist to a substrate while holding the substrate using a member and rotating the substrate.
(11) The substrate holding member according to any one of (1) to (6), the substrate holding member provided in the substrate holding device according to (7), or the substrate for conversion according to (8) A method of manufacturing a semiconductor device comprising forming a resist film by applying a resist to a substrate while holding the substrate using a member and rotating it.

  According to the present invention, a substrate holding member capable of stably holding a substrate having an irregular shape other than a circle or a square, a substrate holding member for conversion, a substrate holding apparatus and a substrate processing apparatus provided with such substrate holding members, and It is possible to provide a resist coating method using the substrate holding members and a method of manufacturing a semiconductor device.

  According to the substrate holding member for conversion of the present invention, for substrates having different sizes and / or shapes, it is easy to replace only the substrate holding member for conversion with different substrate mounting surface while keeping the substrate holding member the same. A substrate holding member adapted to the size and shape can be prepared.

It is a schematic diagram of an example of the substrate holding member which concerns on one Embodiment to which this invention is applied, (a) is the top view seen from the board | substrate mounting surface side, (b) is XX 'of (a). It is sectional drawing along a line. It is a schematic diagram which shows the state which hold | maintained the board | substrate W of the fan shape on the board | substrate mounting surface 3 of the board | substrate holding member 10 shown in FIG. It is a schematic diagram which shows the example of the various shapes of the board | substrate mounting surface of a board | substrate holding member. It is a schematic diagram of an example of the board | substrate holding member for conversion which concerns on one Embodiment to which this invention is applied, (a) is the top view seen from the board | substrate mounting surface side, (b) is Y- of (a). It is sectional drawing along a Y 'line. It is a schematic diagram which shows the state which overlap | superposed the board | substrate holding member 20 for conversion on the board | substrate holding member 10, (a) is the top view seen from the board | substrate mounting surface side, (b) is Z- of (a). It is sectional drawing along Z 'line. FIG. 6 is a schematic view showing a state in which a fan-shaped substrate W is held on the substrate mounting surface 23 of the conversion substrate holding member 20 shown in FIG. 5. It is the figure which showed typically the part of the board | substrate holding member (vacuum chuck) which adsorb | sucks the board | substrate in the conventional spin coater (rotational coating device), (a) is sectional drawing, (b) is a top view.

  The configurations of a substrate holding member, a substrate holding apparatus, a substrate processing apparatus, a resist coating method, and a method of manufacturing a semiconductor element to which the present invention is applied will be described below using the drawings. Note that the drawings used in the following description may show enlarged features for convenience in order to make features easy to understand, and the dimensional ratio of each component is not necessarily the same as the actual one. . In addition, the materials, dimensions, and the like exemplified in the following description are merely examples, and the present invention is not limited to them, and can be appropriately changed and implemented without changing the gist of the invention.

FIG. 1 is a schematic view of an example of a substrate holding member according to an embodiment to which the present invention is applied. Fig.1 (a) is the top view seen from the board | substrate mounting surface side, FIG.1 (b) is sectional drawing along the XX 'line | wire of FIG. 1 (a).
The substrate holding member 10 shown in FIG. 1 is composed of a rotary shaft 2 integrated with the main body 1. The main body and the rotation shaft may be separate. When the substrate holding member is used for a rotary type substrate processing apparatus (for example, spin coating), the main body 1 for holding the substrate on the substrate mounting surface 3 is rotated by the operation of rotation driving means (for example, motor) not shown. As the shaft 2 is rotationally driven, it is configured to rotate integrally with the rotating shaft 2.

The main body 1 has a substrate mounting surface 3 on which a substrate is mounted. An adsorption hole 4 and a groove pattern 5 communicating with the adsorption hole 4 are formed on the substrate mounting surface 3.
The suction holes 4 are connected to a suction mechanism (including a suction pump) (not shown) via the suction passage 6.
The substrate mounting surface 3 has three sides 3a and three apexes 3b connecting the two sides between the two adjacent sides of the three sides in plan view, and the overall shape is It consists of a flat surface of a substantially regular triangle. The outer periphery (outer edge) of the substrate mounting surface 3 consists of three sides 3a and three tops 3b. In the example shown in FIG. 1, assuming that three sides 3a are 3aa, 3ab and 3ac, the top connecting the adjacent sides 3aa and 3ab is 3ba, and the top connecting the adjacent sides 3ab and 3ac is 3bb. The top connecting the adjacent sides 3ac and 3aa is 3bc. In the example shown in FIG. 1, the top 3 b of the substrate mounting surface 3 is rounded.

  When the substrate mounting surface has symmetry, the load applied to the rotation drive unit during rotation is smaller when using the substrate holding member in the rotation type substrate processing apparatus, as compared to the case where the substrate mounting surface does not have symmetry. There is a merit. Examples of the substrate mounting surface having symmetry include the case of an equilateral triangle and the case where the substrate is almost an equilateral triangle but all vertices (tops) have roundness.

Each of the three sides of the substrate mounting surface may be straight or curved. An example of a curve is an arc.
Each of the three tops of the substrate mounting surface is a portion connecting two adjacent sides, and the case of being a point is also included. For example, in the case where all three sides of the substrate mounting surface are straight and generally triangular, all three apexes are points.
The shape of the substrate mounting surface is substantially determined by three sides, and the top is merely a portion which is interposed between two adjacent two sides and connects the two sides. Also, it is not important to clearly separate the three sides and the three tops. For example, if all three sides are straight lines, the end of the straight line is the side, and the portion connecting those straight lines is the top, and it is possible to clearly separate the three sides from the three tops, Also, even if the side is a curve, for example, if it has regularity like a circular arc, the side until the regularity disappears is the side, the portion connecting those circular arcs is the top, and the three sides And the three tops can be clearly separated.

If the side of the substrate mounting surface is straight, it is easier to make the substrate mounting surface, and there is an advantage that it can be made at low cost.
If the top is a point, the top will be pointed. The rounded top portion prevents the concentration of force on the top contact portion even when the substrate vibrates, and allows the substrate to be held stably.

  In order to stably hold one fan-shaped substrate of a circular wafer divided into four, use a substrate holding member in which two sides of the three sides of the substrate mounting surface are straight. Is preferred. It is possible to increase the ratio of the area in which the fan-shaped substrate is adsorbed to the substrate mounting surface, and the adsorption force is large. More preferably, the remaining side is an arc having the same central angle as the arc portion of the outline of the fan-shaped substrate. In this case, the substrate mounting surface has a similar shape to the fan-shaped substrate.

  As an example of the shape of the substrate mounting surface consisting of three sides and three apexes connecting two adjacent sides among the three sides, when all three sides are straight and all three apexes are points If one side is a straight line, the other two sides are arcs and all three vertices are points, then the two sides are straight and the other side is an arc and all three vertices are points In the case where all three sides are straight and at least one of the three apexes is rounded outward, one side is a straight line and the other two sides are arcs and at least one of the three apexes outward In the case of being rounded, there are cases in which two sides are straight, the other side is an arc, and at least one of the three apexes is rounded outward.

  The substrate holding member 10 is provided with an air intake passage 6 communicating with an opening (suction hole 4) formed in the substrate mounting surface 3 and penetrating the main body 1 and the rotary shaft 2 in the vertical direction.

  A groove pattern having three grooves 5a parallel to at least a part of each of three sides and grooves 5b extending from the suction holes 4 toward the top 3b on the substrate mounting surface 3 shown in FIG. 1 (a) 5 is formed. More specifically, as the groove portion 5a, two substantially triangular annular groove portions 5aa, 5ab similar to each other are formed so as to surround the suction hole 4 around it. Further, as the groove 5b, three linear grooves 5ba, 5bb, 5bc extend from the suction holes 4 of the substrate mounting surface 2 toward the tops 3ba, 3bb, 3bc, and intersect the inner annular groove 5aa. , And so as to reach the outer annular groove 5ab. The linear grooves 5ba, 5bb, 5bc and the annular grooves 5aa, 5ab communicate with each other at the intersections of the linear grooves 5ba, 5bb, 5bc and the annular grooves 5aa, 5ab. Then, air is sucked from the suction holes 4, whereby the substrate is sucked by the entire groove pattern 5 consisting of the annular groove portions 5 aa and 5 ab and the linear groove portions 5 ba, 5 bb and 5 bc and the suction holes 4. It is configured to be held on the surface of

  In the substrate holding member, air is sucked from the intake passage 6 by a suction mechanism (not shown), and the suction force in the suction holes 4 and the groove pattern 5 is controlled.

The groove pattern preferably has a groove extending from the suction hole toward the top and three grooves parallel to at least a part of each of the three sides of the outer periphery (outer edge) of the substrate mounting surface. In this case, at least one of the three groove portions may be parallel to at least a portion of each of the three sides of the outer periphery of the substrate mounting surface.
Here, the groove extending from the suction hole toward the top is a groove communicating with the suction hole. Also, three grooves parallel to at least a part of each of the three sides may or may not be in communication with each other, but in order to communicate with the suction holes, all three grooves from the suction holes It is necessary to be in communication with the groove extending toward the top (in the case of more than one, one of the grooves).
The groove portion pattern 5 shown in FIG. 1 is an example of three groove portions parallel to three sides of the annular groove portions 5aa and 5ab that the outer periphery of the substrate mounting surface has, and the annular groove portions 5aa and 5ab are all three. It is an example in which the groove part is in communication. Further, each of the linear groove portions 5ba, 5bb, 5bc is an example of a groove portion extending from the suction hole toward the top.

  From the viewpoint of stably holding the substrate, it is preferable that at least a part of the groove portions of the groove portion pattern be formed along the outer periphery in the vicinity of the outer periphery of the substrate mounting surface.

The depth of the grooves forming the groove pattern is about 0.2 to 1 mm, and can be 0.5 mm, for example.
Further, the diameter of the adsorption holes is about 1 to 5 mm, and can be 3 mm, for example.

  The material of the substrate holding member is not particularly limited, but may be made of a material having a hardness lower than that of the substrate in order to improve the adhesion to the substrate. One example is Teflon (registered trademark). In addition, when the material of the substrate holding member is not Teflon, and the surface of the substrate mounting surface is usually coated with Teflon, damage in processing such as resist application to the substrate, cleaning, and drying, or chemical solution The influence by dripping can be prevented.

FIG. 2 is a schematic view showing a state where a fan-shaped substrate W is held on the substrate mounting surface 3 of the substrate holding member 10 shown in FIG.
When the substrate holding member is used in a spin coating apparatus, a fan-shaped substrate W is disposed on the substrate mounting surface 3 of the substrate holding member 10 as shown in FIG. Then, the substrate W can be rotated in a state of being held on the substrate mounting surface 3 of the substrate holding member 10 to perform resist application and the like.

FIG. 3 is a schematic view showing an example of various shapes of the substrate mounting surface of the substrate holding member.
By changing the design of the shape of the substrate mounting surface according to the shape of the irregular substrate used, the substrate can be held more stably. When the substrate holding member whose design of the shape of the substrate mounting surface is changed in this way is used in the rotary processing apparatus, the substrate can be more stably rotated.
In any of the examples shown in FIG. 3, the top is entirely rounded, and the groove pattern has a groove extending from the suction hole toward the top and three grooves parallel to at least a part of each of the three sides. It is an example.

In the substrate mounting surface of the substrate holding member shown in FIG. 3A, all three sides of the substrate mounting surface are straight lines, and the entire shape is substantially triangular with different lengths, and the top is The groove pattern is rounded all around outwards, and the groove pattern has two similar, substantially triangular inner and outer annular grooves and a ring from the adsorption holes toward the top so as to surround it around the adsorption holes. And three straight grooves formed to intersect the inner annular groove and reach the outer annular groove. Both the inner and outer annular grooves consist of three grooves parallel to at least a portion of each of the three sides.
In the substrate mounting surface of the substrate holding member shown in FIG. 3B, all three sides of the substrate mounting surface are straight lines, and the entire length is the same overall shape is substantially an equilateral triangle; Are all rounded outward, and the groove pattern surrounds the adsorption hole so that it has two similar, substantially triangular inner and outer annular grooves and from the adsorption hole towards the top It consists of three straight grooves extending towards and intersecting the inner annular groove and reaching the outer annular groove. Both the inner and outer annular grooves consist of three grooves parallel to at least a portion of each of the three sides.
The substrate mounting surface of the substrate holding member shown in FIG. 3C has an overall shape in which two of the three sides of the substrate mounting surface are straight and the lengths are the same and the remaining sides are arcs. A generally sectoral shape of a central acute angle, with all the peaks rounded outward, and the groove pattern surrounding it with the suction holes, inside of two similar triangles of similar similarity and It comprises an outer annular groove, and three straight grooves extending from the suction hole toward the top, intersecting the inner annular groove, and reaching the outer annular groove. Both the inner and outer annular grooves consist of three grooves parallel to at least a portion of each of the three sides.
In the substrate mounting surface of the substrate holding member shown in FIG. 3D, all three sides of the substrate mounting surface are straight lines, and the entire shape of the two sides is the same. And two mutually similar substantially triangular inner and outer annular grooves, such that the tops are all rounded outward and the groove pattern surrounds it around the suction holes, It consists of three straight grooves extending from the suction holes toward the top, intersecting the inner annular groove and reaching the outer annular groove. Both the inner and outer annular grooves consist of three grooves parallel to at least a portion of each of the three sides.
In the substrate mounting surface of the substrate holding member shown in FIG. 3 (e), all three sides of the substrate mounting surface are straight lines, and the entire shape of the two sides is the same. Two triangular, substantially triangular, inner and outer annular grooves, similar to one another, such that the tops are all rounded outwards and the groove pattern encloses it around the suction holes It consists of three linear grooves extending from the suction holes toward the top, intersecting the inner annular groove, and reaching the outer annular groove. Both the inner and outer annular grooves consist of three grooves parallel to at least a portion of each of the three sides.
The substrate mounting surface of the substrate holding member shown in FIG. 3 (f) has an overall shape in which two of the three sides of the substrate mounting surface are straight and the lengths are the same and the remaining sides are arcs. A generally sector-shaped (1⁄4 circular shape) perpendicular to the central angle, with the peaks all rounded outwards, and the groove pattern surrounding the suction hole so that the two are mutually centered Similar substantially triangular inner and outer annular grooves, and three straight grooves extending from the suction holes toward the top, intersecting the inner annular grooves, and reaching the outer annular grooves It consists of Both the inner and outer annular grooves consist of three grooves parallel to at least a portion of each of the three sides.

  Since the substrate holding member of the present invention can design a large area of the substrate mounting surface to be adsorbed to the substrate when holding and rotating an irregular substrate, particularly an irregular semiconductor substrate, the substrate can be stably held. can do. The irregular substrate is a substrate other than a circle and a square, and includes those having a fan shape, an axis of symmetry and a center of symmetry. Further, as a result that the area of the substrate mounting surface can be designed large, the area of the groove formed on the substrate mounting surface can also be increased, so that the suction force is improved, and the substrate is stably held and rotated. be able to. As a result, the substrate does not come off the substrate mounting surface during rotation by a rotary substrate processing apparatus or the like, and substrate surface contamination and breakage of the substrate can be prevented.

  The substrate holding device of the present invention has a known configuration except that the substrate holding member of the present invention as described above is provided. For example, a suction mechanism is provided, and the suction mechanism is provided with a vacuum pump as a suction source connected to a suction hole via an air intake passage.

FIG. 4 is a schematic view of an example of a conversion substrate holding member according to an embodiment to which the present invention is applied. 4 (a) is a plan view seen from the substrate mounting surface side, and FIG. 4 (b) is a cross-sectional view taken along the line YY 'of FIG. 4 (a). Note that FIG. 4B shows the substrate holding member 10 shown in FIG. 1B for reference.
This conversion substrate holding member can be fitted from the substrate mounting surface side of the substrate holding member of the present invention or the above-described known substrate holding member from the substrate mounting surface side, and, like the substrate holding members, vacuum. The substrate can be held on the substrate mounting surface (conversion substrate mounting surface) by the suction force.
The substrate holding member for conversion is a substrate holding member known in the prior art or the substrate holding member of the present invention as described above and used in a two-tiered manner, and is different from the substrate mounting surface of the substrate holding member. By having a substrate mounting surface (conversion substrate mounting surface) of a shape and / or size, it is suitable for stably holding a substrate of a shape and / or size different from those of the substrate holding members. It becomes.

The conversion substrate holding member 20 is composed of a main body 21 and has the same shape as the outer shape of the substrate mounting surface 3 of the substrate holding member 10 to be fitted on the opposite side (back side) of the substrate mounting surface (conversion substrate mounting surface) 23. The concave portion 22 of Therefore, when stacking the conversion substrate holding member on the substrate holding member, it is possible to stack without any gap (see FIG. 5B). Therefore, when the conversion substrate holding member 20 is applied to a rotary substrate processing apparatus, the conversion substrate holding member 20 can be rotated integrally with the substrate holding member 10.
The conversion substrate holding member 20 shown in FIG. 4 is an example that is fitted to the substrate holding member 10 shown in FIG.

The main body 21 has a substrate mounting surface (conversion substrate mounting surface) 23 on which a substrate is mounted.
The substrate mounting surface (conversion substrate mounting surface) 23 is a plan view, and includes three sides 23 a and three apexes 23 b which are interposed between two adjacent sides of the three sides and connect the two sides. It has a flat surface. The outer periphery (outer edge) of the substrate mounting surface 23 is composed of three sides 23 a and three crests 23 b. More specifically, of the three sides 23aa, 23ab, 23ac constituting the outer periphery of the substrate mounting surface 23, two of the sides 23ab, 23ac are straight lines, the lengths thereof are the same, and the remaining side 23aa is an arc. The overall shape is a fan-like shape (1⁄4 circular shape) perpendicular to the central angle. The top connecting the adjacent sides 23aa and 23ab is 23ba, the top connecting the adjacent sides 23ab and 23ac is 23bb, the top connecting the adjacent sides 23ac and 23aa is 23bc, and the top 23b is all outside It is rounded.

  In the substrate holding member 10 shown in FIG. 1, the entire shape having the rounded top portion is a substantially equilateral triangle substrate mounting surface, but the conversion substrate holding member 20 shown in FIG. As a result, the substrate mounting surface (conversion substrate mounting surface) 23 for holding the substrate has an almost fan-like shape (1⁄4 circular shape) whose entire shape is perpendicular to the central angle.

  The substrate holding member 20 for conversion is the same as the substrate holding member 10 in that it holds the substrate, and therefore, as a variation of the shape of the substrate mounting surface (conversion substrate mounting surface) 23, the substrate mounting of the substrate holding member 10 is performed. There is the same variation as the shape of the mounting surface 3 and the contents described for the shape of the substrate mounting surface 3 of the substrate holding member 10 are the same as the shape of the substrate mounting surface (conversion substrate mounting surface) 23 Is also applicable.

  The conversion substrate holding member 20 is provided with an intake passage 26 which vertically penetrates the main body 21 in communication with the opening (suction hole 24) formed in the substrate mounting surface (conversion substrate mounting surface) 23. ing. The intake passage 26 is in communication with the intake passage 6 of the substrate holding member 10 by being fitted to the substrate holding member 10.

  A groove pattern having three grooves 25a parallel to at least a part of each of the three sides and grooves 25b extending from the suction holes 24 toward the top 23b on the substrate mounting surface 23 shown in FIG. 4A. 25 are formed. More specifically, the groove portion 25a includes two annular grooves 25aa and 25ab each having a substantially fan-shaped (1/4 circular shape) having a general angle perpendicular to the central angle so as to surround the suction hole 24 at the center. It is formed. In addition, three linear grooves 25ba, 25bb, 25bc extend from the suction holes 24 of the substrate mounting surface 2 toward the tops 23ba, 23bb, 23bc, intersect the inner annular groove 5aa, and form an outer annular groove It is formed to reach 5ab. The linear grooves 25ba, 25bb, 25bc and the annular grooves 25aa, 25ab communicate with each other at the intersections of the linear grooves 25ba, 25bb, 25bc and the annular grooves 25aa, 25ab. Then, air is suctioned from the suction holes 24, and the substrate is suctioned by the entire groove pattern 25 consisting of the annular groove portions 25aa, 25ab and the linear groove portions 25ba, 25bb, 25bc and the suction holes 24. It is configured to be held on the surface of the conversion substrate mounting surface 23).

  In the conversion substrate holding member 20, air is sucked from the suction passage 26 through the suction passage 6 of the substrate holding member 10 by a suction mechanism (not shown), and the suction force in the suction holes 24 and the groove pattern 25 is controlled.

The conversion substrate holding member 20 is the same as the substrate holding member 10 in that it holds the substrate, and therefore the groove pattern of the conversion substrate holding member should be the same as the groove pattern of the substrate holding member described above. Can.
Further, the preferable configuration of the groove pattern of the conversion substrate holding member is the same as the groove pattern of the substrate holding member. For example, like the groove pattern of the substrate holding member described above, the groove pattern of the substrate holding member for conversion is a groove extending from the suction hole toward the top and the outer periphery (outer edge) of the substrate mounting surface (conversion substrate mounting surface) It is preferable to have three grooves parallel to at least a part of each of the three sides of.

The depth of the groove portion constituting the groove portion pattern is the same as that of the groove portion of the substrate holding member 10, is about 0.2 to 1 mm, and can be 0.5 mm as an example.
Further, the diameter of the suction hole is also the same as that of the suction hole of the substrate holding member 10 and is about 1 to 5 mm, and can be 3 mm, for example.

  The suction holes 24 are connected to a suction mechanism (not shown) (including a suction pump) via the intake passage 26 and the intake passage 6.

  As a material of the conversion substrate holding member, the same material as the above-mentioned substrate holding member can be used.

  The substrate holding member for conversion is a substrate mounting member having a shape and / or size different from the substrate mounting surface of the substrate holding member by being fitted to a conventionally known substrate holding member or the substrate holding member of the present invention as described above. Since the mounting surface (conversion substrate mounting surface) can be provided, variations of the substrate that can be stably held can be expanded. When the conventionally known substrate holding member or the substrate holding member of the present invention as described above can not be used under any circumstances, the conversion substrate holding member can be used instead of them. For substrates with different sizes and / or shapes, the substrate holding members remain the same, and by replacing only the conversion substrate holding members with different substrate mounting surfaces, a substrate holding member easily adapted to the size and shape is prepared. it can. In addition, since the shape of the substrate holding member has a shape having three sides, even if the conversion substrate holding member is stacked and rotated, it can be stably rotated without slipping as in the case of the circular substrate holding member. Can. In addition, when the substrate mounting surface of the substrate holding member is a regular triangle, the symmetry is high and stable rotation is possible, so that even if the conversion substrate holding members are stacked and used, the substrate is held and rotated with high stability. Can.

  FIG. 5 is a schematic view showing a state in which the conversion substrate holding member 20 is superimposed on the substrate holding member 10. 5 (a) is a plan view seen from the substrate mounting surface side, and FIG. 5 (b) is a cross-sectional view taken along the line Z-Z 'of FIG. 5 (a). The alternate long and short dash line in FIG. 5A indicates the outer diameter of the substrate mounting surface 3 of the substrate holding member 10 for reference.

As shown in FIG. 5 (b), the conversion substrate holding member 20 has a recess 22 having the same shape as the outer shape of the substrate mounting surface 3 of the substrate holding member 10, so the conversion substrate holding member 20 is used as the substrate holding member 10. It can be stacked without gaps. As shown by the alternate long and short dash line in FIG. 5A, the substrate holding member 10 stacked on the conversion substrate holding member 20 is a substrate mounting surface of which the top part has a rounded top and a substantially triangular shape. However, by fitting the conversion substrate holding member 20, the entire substrate mounting surface for holding the substrate is converted into a substantially sector shape (1/4 circular shape) having a central angle of 90 degrees.
By selecting the shape of the conversion substrate holding member in accordance with the shape of the irregular substrate, it becomes possible to stably hold the irregular substrate different in size and shape.

FIG. 6 is a schematic view showing a state in which the sector-shaped substrate W is held on the substrate mounting surface 23 of the conversion substrate holding member 20 shown in FIG.
When this conversion substrate holding member is used in a spin coating apparatus, a fan-shaped substrate W is disposed on the substrate mounting surface 23 of the conversion substrate holding member 20 as shown in FIG. It is possible to perform resist coating or the like by rotating in a state where the substrate W is stably held on the substrate mounting surface 23 of the conversion substrate holding member 20 by suction from the groove portion pattern 25.

  The substrate processing apparatus of the present invention holds a substrate using the substrate holding member of the present invention, the substrate holding member provided in the substrate holding apparatus of the present invention, or the conversion substrate holding member of the present invention, and rotates the substrate while rotating. A rotary substrate processing unit that performs predetermined substrate processing is provided.

  The resist coating method of the present invention holds a substrate using the substrate holding member of the present invention, the substrate holding member provided with the substrate holding device of the present invention, or the conversion substrate holding member of the present invention and rotating it while rotating. A resist is applied to the substrate.

  In the method of manufacturing a semiconductor device of the present invention, the substrate is held using the substrate holding member of the present invention, the substrate holding member provided in the substrate holding device of the present invention, or the conversion substrate holding member of the present invention Meanwhile, a resist film is formed by applying a resist to the substrate.

  Hereinafter, the effects of the present invention will be made more apparent by examples. The present invention is not limited to the following examples, and can be appropriately modified and implemented without changing the gist of the invention.

Example 1
The substrate holding member having a substrate mounting surface having a substantially equilateral triangular shape as shown in FIG. 1 was applied to a spin coater. As a substrate to be adsorbed, a sector-shaped (1⁄4 circular shape) irregular substrate having a whole shape with a central angle of right angle obtained by quartering a circular SiC epitaxial wafer having a diameter of 4 inches was used.

The substrate holding member held the irregular substrate such that the substrate mounting surface was completely covered by the irregular substrate in plan view when holding the irregular substrate.
Thereafter, the substrate was rotated at 3000 to 6000 rpm to apply a resist, but the irregular substrate did not come off the substrate mounting surface during the rotation.

(Example 2)
Next, resist coating was performed under the same conditions as in Example 1 except that the conversion substrate holding member shown in FIG. 4 was stacked on the substrate holding member used in Example 1. Also in this case, the irregular substrate did not come off the substrate mounting surface during rotation.

Reference Signs List 3 substrate mounting surface 3a side 3b top 4 suction hole 5 groove pattern 10 substrate holding member 20 conversion substrate holding member 23 substrate mounting surface (conversion substrate mounting surface)
24 suction holes 25 groove pattern W substrate

Claims (11)

A substrate holding member for holding a substrate on a substrate mounting surface by a vacuum suction force.
The substrate mounting surface has a suction hole and a groove pattern communicating with the suction hole,
The substrate mounting surface in a plan view, and three sides, Ri Do from the flat surface and a three top connecting two sides adjacent one of the three sides, of the three top, at least one of the top is a one having a rounded outwardly, the substrate holding member, characterized that you have installed in the rotation shaft end.   The substrate holding device according to claim 1, wherein the groove pattern includes a groove extending from the suction hole toward the top and three grooves parallel to at least a part of each of the three sides. Element.   The substrate holding member according to claim 1, wherein all the three sides are straight.   The substrate holding member according to claim 3, wherein the three sides form an equilateral triangle.   The substrate holding member according to claim 1, wherein at least one side of the three sides is a straight line. A substrate holding device comprising the substrate holding member according to any one of claims 1 to 5 . The conversion substrate capable of holding the substrate on the substrate mounting surface (conversion substrate mounting surface) by vacuum suction force by fitting to the end of the substrate holding member according to any one of claims 1 to 5. A holding member,
The conversion substrate mounting surface has suction holes and a groove pattern communicating with the suction holes,
The conversion substrate mounting surface is a flat surface having three sides and three apexes connecting two adjacent sides of the three sides in plan view,
A conversion substrate holding member characterized in that a concave portion having the same shape as the outer shape of the substrate mounting surface of the substrate holding member is provided on the opposite side of the conversion substrate mounting surface. A substrate holding member according to any one of claims 1 to 5 , a substrate holding member provided with the substrate holding device according to claim 6 , or a substrate using the conversion substrate holding member according to claim 7. What is claimed is: 1. A substrate processing apparatus comprising: a rotatable substrate processing unit that performs predetermined substrate processing while holding and rotating the substrate processing unit. A substrate holding member according to any one of claims 1 to 5 , a substrate holding member provided with the substrate holding device according to claim 6 , or a substrate using the conversion substrate holding member according to claim 7. A resist coating method comprising: applying a resist to a substrate while holding and rotating the substrate. A substrate holding member according to any one of claims 1 to 5 , a substrate holding member provided with the substrate holding device according to claim 6 , or a substrate using the conversion substrate holding member according to claim 7. A resist film is formed by applying a resist to a substrate while holding and rotating the resist film; The method of manufacturing a semiconductor device according to claim 10, wherein when the resist is applied to the substrate, the held substrate is rotated in a range of 3000 to 6000 rpm.

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