JP6513964B2 - Crystal device - Google Patents

Description

  The present invention relates to a quartz crystal device used, for example, in an electronic device or the like.

  The quartz crystal device generates thickness-slip vibration so that both sides of the quartz plate are mutually offset by using the piezoelectric effect of the quartz crystal element, and generates a specific frequency. A quartz crystal element mounted via a conductive adhesive on an electrode pad provided on the upper surface of a substrate, an integrated circuit element mounted via a conductive bonding material on a connection pad provided on the lower surface of the substrate, and quartz In order to measure the electrical characteristics of the device, one provided with a monitor electrode provided near the center of the lower surface of the substrate has been proposed (for example, see Patent Document 1 below).

JP 2003-163540 A

  Although the above-described quartz crystal device is significantly reduced in size, the area of the monitor electrode provided on the substrate may also be reduced. For this reason, in the case of measuring the electrical characteristics of the quartz crystal element, the conventional quartz device has to contact the measuring probe with the monitor electrode having a small area, which requires labor and time at the time of measurement. There was a risk of lowering the

  The present invention has been made in view of the above problems, and it is an object of the present invention to provide a quartz crystal device that can be miniaturized while securing the area of a monitor electrode, and can improve productivity.

A quartz crystal device according to one aspect of the present invention comprises a rectangular substrate, a first frame provided along the outer peripheral edge of the upper surface of the substrate, and a second frame provided along the outer peripheral edge of the lower surface of the substrate An integrated circuit device mounted on a body, a pair of electrode pads provided on the upper surface of the substrate, a plurality of connection pads provided on the lower surface of the substrate, a crystal element mounted on the pair of electrode pads, and If, to the pair of electrode pads are electrically connected to a pair of first monitor electrode provided on the lower surface of the substrate along the inner peripheral edge of the second frame, respectively a first monitor electrode is electrically connected A pair of second monitor electrodes provided on the lower surface of the substrate so as to be located between the connection pads, and a lid for hermetically sealing the quartz crystal element, which is parallel to the short side direction of the substrate The side length of the first monitor electrode is parallel to the short side direction of the substrate. It is provided to be longer than the side length of the second monitor electrode, and the first monitor electrode is positioned between the outer peripheral edge on the short side of the second frame and the connection pad in plan view. It is provided.

A quartz crystal device according to one aspect of the present invention comprises a rectangular substrate, a first frame provided along the outer peripheral edge of the upper surface of the substrate, and a second frame provided along the outer peripheral edge of the lower surface of the substrate An integrated circuit device mounted on a body, a pair of electrode pads provided on the upper surface of the substrate, a plurality of connection pads provided on the lower surface of the substrate, a crystal element mounted on the pair of electrode pads, and If, to the pair of electrode pads are electrically connected to a pair of first monitor electrode provided on the lower surface of the substrate along the inner peripheral edge of the second frame, respectively a first monitor electrode is electrically connected A pair of second monitor electrodes provided on the lower surface of the substrate so as to be located between the connection pads, and a lid for hermetically sealing the quartz crystal element, which is parallel to the short side direction of the substrate The side length of the first monitor electrode is parallel to the short side direction of the substrate. It is provided to be longer than the side length of the second monitor electrode, and the first monitor electrode is positioned between the outer peripheral edge on the short side of the second frame and the connection pad in plan view. It is provided. By this, it is possible to miniaturize while securing the area combined with the first monitor electrode and the second monitor electrode. In addition, when measuring the electrical characteristics of the crystal element, the crystal device stably measures the electrical characteristics of the crystal element by bringing the measurement probe into contact with the boundary portion between the first monitor electrode and the second monitor electrode. Productivity can be improved.

It is a disassembled perspective view which shows the quartz crystal device in this embodiment. (A) It is sectional drawing in AA of the crystal device shown by FIG. 1, (b) It is sectional drawing in BB of the crystal device shown by FIG. (A) It is the top view which looked at the package which comprises the crystal device in this embodiment from the top, (b) It is the top view which looked at the substrate of the package which constitutes the crystal device in this embodiment from the top. (A) It is the top view which looked at the substrate of the package which constitutes the crystal device in this embodiment from the bottom, (b) It is the top view which looked at the package which constitutes the crystal device in this embodiment from the bottom.

  The crystal device according to the present embodiment includes the package 110, the crystal element 120 bonded to the upper surface of the package 110, and the integrated circuit element 150 bonded to the lower surface of the package 110, as shown in FIGS. And a lid 130 joined to the top surface of the package 110. The package 110 is formed with a first recess K1 surrounded by the upper surface of the substrate 110a and the inner side surface of the first frame 110b. Further, in the package 110, a second recess K2 formed by the lower surface of the substrate 110a and the inner side surface of the second frame 110c is formed. Such a quartz crystal device is used to output a reference signal used in an electronic device or the like.

  The substrate 110a has a rectangular shape, and functions as a mounting member for mounting the crystal element 120 on the upper surface and mounting the integrated circuit element 150 on the lower surface. A pair of electrode pads 111 for bonding the quartz crystal element 120 is provided on the upper surface of the substrate 110 a, and a pair of connection pads 116 for bonding the integrated circuit device 150 are provided on the lower surface. The substrate 110a is made of an insulating layer which is a ceramic material such as alumina ceramics or glass-ceramics. The substrate 110a may be formed by using a single insulating layer or by stacking a plurality of insulating layers. The electrode pad 111 provided on the upper surface, the connection pad 116 provided on the lower surface of the substrate 110a, and the external terminal 112 provided on the lower surface of the second frame 110c described later A wiring pattern 113, a conductor portion 114, and a via conductor 115 for connection are provided.

  The first frame 110 b is disposed on the upper surface of the substrate 110 a and is for forming the first recess K 1 on the upper surface of the substrate 110 a. The second frame 110c is disposed on the lower surface of the substrate 110a, and is for forming the second recess K2 on the upper surface of the substrate 110a. The first frame 110b and the second frame 110c are made of, for example, a ceramic material such as alumina ceramic or glass-ceramics, and are integrally formed with the substrate 110a.

  Here, the dimension of one side when the package 110 is viewed in plan is 1.0 to 3.0 mm, and the dimension of the package 110 in the vertical direction is 0.2 to 1.5 mm as an example. The sizes of the first recess K1 and the second recess K2 will be described. The lengths of the long sides of the first recess K1 and the second recess K2 are 0.7 to 2.0. The length of the short side is 0.5 to 1.5 mm. Moreover, the length of the up-down direction of the 1st recessed part K1 and the 2nd recessed part K2 is 0.1-0.5 mm.

  In addition, external terminals 112 are provided at the four corners of the lower surface of the second frame 110c. The external terminals 112 are electrically connected to connection pads 116 provided on the lower surface of the substrate 110a.

  The electrode pad 111 is for mounting the crystal element 120. The electrode pads 111 are provided in a pair on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. The electrode pad 111 is configured of a first electrode pad 111a and a second electrode pad 111b. The electrode pad 111 is electrically connected to the external terminal 112 provided on the lower surface of the substrate 110 a through the wiring pattern 113 and the conductor portion 114 provided on the substrate 110 a.

  On the pair of electrode pads 111, a pair of convex portions B1 having a rectangular shape in plan view is provided. Further, the pair of convex portions B1 is provided along the outer peripheral edge of the electrode pad 111 whose one side faces the center side of the substrate 110a in plan view, and the other side connected to the one side Are provided along the outer peripheral edge on the electrode pad 111 facing the outer peripheral edge side of the substrate 110a.

  The external terminals 112 are used to bond to mounting pads (not shown) on an external mounting substrate of an electric device or the like. The external terminals 112 are provided at the four corners of the lower surface of the substrate 110a. The third external terminal 112c is electrically connected to the sealing conductor pattern H via the third via conductor 115c. The third external terminal 112c is connected to a mounting pad connected to a ground potential which is a reference potential on a mounting substrate of an electronic device or the like. Thereby, the lid 130 joined to the sealing conductor pattern H is connected to the third external terminal 112 c which is at the ground potential. Therefore, the shielding property in the recessed part K by the cover body 130 will be improved.

  The wiring pattern 113 is for electrically connecting the electrode pad 111 and the via conductor 115 and for electrically connecting the via conductor 115 and the conductor portion 114. The wiring pattern 113 is composed of a first wiring pattern 113a and a second wiring pattern 113b. The wiring pattern 113 is provided so as to overlap with the first frame 110 b in plan view. By doing this, since the crystal device suppresses generation of stray capacitance between the wiring pattern 113 and the quartz crystal element 120, this stray capacitance is not applied to the quartz crystal element 120. Can be suppressed.

  The first wiring pattern 113a is electrically connected to the second electrode pad 111b and the second via conductor 115b. The first wiring pattern 113a is extended in the direction of the long side of the first frame 110b close to the second electrode pad 111b, and a part of the first wiring pattern 113a is exposed. The second wiring pattern 113 b is electrically connected to the third conductor portion 114 c and the third via conductor 115 c. The second wiring pattern 113b is extended toward the third conductor portion 114c provided at the corner of the substrate 110a which is close to the third via conductor 115c.

  Thus, when the crystal element 120 is mounted by being provided so that a part of the wiring pattern 113 extends from the electrode pad 111 in the long side direction of the first frame 110 b and is exposed. In addition, since the conductive adhesive 140 which is about to spill out flows out along the wiring pattern 113, the conductive adhesive 140 does not flow out toward the center of the package 110 and adheres to the excitation electrode 122. Can be suppressed.

  The conductor portion 114 is for electrically connecting the wiring pattern 113 or the connection pattern 117 and the external terminal 112. The conductor portion 114 is provided inside the notch provided at the corner of the substrate 110a. Both ends of the conductor portion 114 are connected to the wiring pattern 113 or the connection pattern 117 and the external terminal 112. By doing this, the connection pad 116 is electrically connected to the external terminal 112 through the connection pattern 117 and the conductor portion 114. The conductor part 114 is comprised by the 1st conductor part 114a, the 2nd conductor part 114b, the 3rd conductor part 114c, and the 4th conductor part 114d.

  The via conductor 115 is provided inside the substrate 110 a, and both ends thereof are electrically connected to the electrode pad 111 and one of the first monitor electrodes 118 a and electrically connected to the sealing conductor pattern H and the external terminal 112 described later. In order to connect. The via conductor 115 is configured of a first via conductor 115 a, a second via conductor 115 b, and a third via conductor 115 c. The via conductor 115 is provided by filling the inside of the through hole provided in the substrate 110 a with the conductor.

  The connection pad 116 is used to mount the integrated circuit element 150 on the connection pad. The connection pad 116 is provided on the lower surface of the substrate 110 a and is provided along the inside of the second frame 110 c in plan view. Three connection pads 116 are provided along one side of the long side of the substrate 110 a, and three are provided along opposite sides. Also, as shown in FIG. 4A, the connection pads 116 are a first connection pad 116a, a second connection pad 116b, a third connection pad 116c, a fourth connection pad 116d, a fifth connection pad 116e and a sixth connection. The pad 116f is configured. The first connection pad 116a and the first external terminal 112a are connected by the first connection pattern 117a provided on the lower surface of the substrate 110a and the first conductor portion 114a provided at the corner of the substrate 110a and the second frame 110c. It is done. The second connection pad 116 b and the other second monitor electrode 119 b are electrically connected. The third connection pad 116c and the third external terminal 112c are connected by the third connection pattern 117c provided on the lower surface of the substrate 110a and the third conductor portion 114c provided at the corner of the second frame 110c. . The fourth connection pad 116d and the second external terminal 112b are connected by a second connection pattern 117b provided on the lower surface of the substrate 110a and a second conductor portion 114b provided at the corner of the second frame 110c. . The fifth connection pad 116 e and one second monitor electrode 119 a are electrically connected. The sixth connection pad 116f and the fourth external terminal 112d are connected by the fourth connection pattern 117d provided on the lower surface of the substrate 110a and the fourth conductor portion 114d provided at the corner of the second frame 110c. .

  The connection pattern 117 is for electrically connecting the connection pad 115 and the conductor portion 114. The connection pattern 117 is provided on the lower surface of the substrate 110 a, and is drawn from the connection pad 115 toward the nearby conductor portion 114.

  The first monitor electrode 118 and the second monitor electrode 119 are for measuring the characteristics of the quartz crystal element 120 by bringing the measurement probe into contact. The first monitor electrodes 118 are provided in a pair along the short side of the substrate 110 a. The first monitor electrode 118 is constituted by one first monitor electrode 118a and the other first monitor electrode 118b. One first monitor electrode 118a is electrically connected to the first electrode pad 111a provided on the upper surface of the substrate 110a via the first via conductor 115a provided on the substrate 110a. The other first monitor electrode 118b is a second electrode pad provided on the upper surface of the substrate 110a via the first wiring pattern 113a provided on the upper surface of the substrate 110a and the second via conductor 115b provided on the substrate 110a. It is electrically connected to 111b.

  Further, one first monitor electrode 118 a which is one of the first monitor electrodes 118 is provided at a position overlapping with the pair of electrode pads 111 in plan view. Also, by doing this, the heat transmitted from the quartz crystal element 120 is transmitted to one first monitor electrode 118a via the substrate 110a immediately below the electrode pad 111, and the heat is transmitted from one first monitor electrode 118a. Released. Therefore, since such a crystal device can shorten the heat conduction path, it is possible to further reduce the difference from the actual temperature around the crystal element 120, and the temperature correction by the integrated circuit element 150 described later It is easy to do.

  The second monitor electrode 119 is composed of one second monitor electrode 119 a and the other second monitor electrode 1119. As shown in FIG. 4A, the second monitor electrode 119 is provided so as to be located between connection pads 116 provided to face the long side of the substrate 110a. One second monitor electrode 119a is electrically connected to the fifth connection pad 116e. The other second monitor electrode 119b is electrically connected to the second connection pad 116b. The second monitor electrode 119 is provided at a position overlapping with the integrated circuit element 150 in plan view. In this way, the floating capacitance generated between the mounting pattern on the mounting substrate of the electronic device or the like and the second monitor electrode 119 is reduced, so that the floating capacitance is not added to the quartz crystal element 120. Fluctuation of the oscillation frequency of 120 can be reduced.

  Further, one second monitor electrode 119 a of the second monitor electrode 119 is provided so as to be located between the pair of electrode pads 111 in plan view. Also, by doing this, the heat transmitted from the quartz crystal element 120 is transmitted to the one second monitor electrode 119a via the substrate 110a immediately below the electrode pad 111, and the heat is transmitted from the one second monitor electrode 119a. Released. Therefore, since such a crystal device can shorten the heat conduction path, it is possible to further reduce the difference from the actual temperature around the crystal element 120, and the temperature correction by the integrated circuit element 150 described later Can be made easier.

  Such a quartz crystal device can be miniaturized while securing the area combined with the first monitor electrode 118 and the second monitor electrode 119, as compared with the monitor electrode of the conventional piezoelectric device. In addition, when measuring the electrical characteristics of the quartz crystal element 120, the quartz crystal device brings the measurement probe into contact with the boundary portion between the first monitor electrode 118 and the second monitor electrode 119, thereby making the first monitor electrode 118 or the second monitor It becomes possible to reliably contact either one of the electrodes 119. Such a quartz crystal device can stably measure the electrical characteristics of the quartz crystal element 120, thereby improving productivity.

  The convex portion B1 is intended to suppress the inclination of the short side of the quartz crystal element 120 in the vertical direction and to prevent the long side end of the quartz crystal element 120 from coming into contact with the substrate 110a or the lid 130. The convex portion B1 is for suppressing the free end of the quartz crystal element 120 from coming into contact with the substrate 110a. The pair of convex portions B1 is configured of a first convex portion B1a and a second convex portion B1b. The first convex portion B1a is provided on the upper surface of the first electrode pad 111a, and the second convex portion B1b is provided on the upper surface of the second electrode pad 111b. Similarly to the electrode pad 111, the convex portion B1 is provided by performing gold plating or nickel plating on the upper surface of a sintered body of metal powder such as tungsten, molybdenum, copper, silver or silver palladium.

  Further, as shown in FIG. 3, one side of the pair of convex portions B <b> 1 facing the center side of the substrate 110 a is provided to be aligned on the same straight line. In this way, when the lead-out electrode 123 of the quartz crystal element 120 is mounted on the electrode pad 111 while being in contact with the pair of convex portions B1, the quartz crystal element 120 can be mounted in a stable state without tilting.

  Further, the convex portion B1 is provided at a position facing the lead-out electrode 123 on the outer peripheral edge of the crystal element 120. By doing this, when the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive 140, even if the crystal element 120 is inclined, the lead electrode 123 contacts the convex portion B1. Thus, the crystal element 120 can be mounted in a stable state without being inclined in the lower direction than the convex portion B1. Further, the convex portion B1 is provided at a position overlapping the lead-out electrode 123 on the outer peripheral edge on the fixed end side of the quartz crystal base plate 121 in plan view. By doing so, the contact of the fixed end of the quartz crystal element 120 with the upper surface of the substrate 110a can be reduced.

  The protrusion B2 has a rectangular shape in plan view, and is provided at a position facing the free end of the quartz crystal element 120, for preventing the free end of the quartz crystal element 120 from contacting the substrate 110a. It is. The protrusion B2 is provided on the substrate 110a in the first recess K1 such that the long side of the protrusion B2 and the long side of the substrate 110a are substantially parallel. In this way, it is possible to suppress chipping or the like due to the free end side of the crystal element 120 coming into contact with the substrate 110 a when an impact such as a drop is applied to the crystal device.

  Here, the dimension of one side when the package 110 is viewed in plan is 1.0 to 3.0 mm, and the dimension of the package 110 in the vertical direction is 0.7 to 1.5 mm as an example. The sizes of the pad 111 and the convex portion B1 will be described. The side length of the electrode pad 111 is 250 to 400 μm. The length of the thickness in the vertical direction of the electrode pad 111 is 10 to 50 μm. The length of the side of the triangular convex portion B1 formed along the outer peripheral edge of the electrode pad 111 is 200 to 400 μm. The length of the thickness in the vertical direction of the convex portion B1 is 7 to 30 μm. The length of the protrusion B2 parallel to the long side direction of the substrate 110a is 500 to 800 μm, and the length of the protrusion B2 parallel to the short side direction of the substrate 110a is 150 to 300 μm. Moreover, the length of the up-down direction of protrusion part B2 is about 30-100 micrometers.

  The arithmetic mean surface roughness of the electrode pad 111 is 0.02 to 0.10 μm, and the arithmetic mean surface roughness of the surface of the substrate 110 a is 0.5 to 1.5 μm. Therefore, in the conductive adhesive 140, the conductive adhesive 140 spreads in the direction of the wiring pattern 113 where the convex portion B1 is not provided on the electrode pad 111. It becomes difficult to spread toward above 110a.

  The sealing conductor pattern H plays a role of improving the wettability of the sealing member 131 when bonding the lid 130 and the sealing member 131 via the sealing member 131. The sealing conductor pattern H is electrically connected to the external terminal 112c through the third via conductor 115c, as shown in FIGS. 3 and 4. The conductor pattern H for sealing has a thickness of, for example, 10 to 25 μm by applying nickel plating and gold plating sequentially on the surface of the conductor pattern made of, for example, tungsten or molybdenum in a form of annularly surrounding the upper surface of the first frame 110b. Is formed.

  The conductive adhesive 140 contains a conductive powder as a conductive filler in a binder such as silicone resin, and as the conductive powder, aluminum, molybdenum, tungsten, platinum, palladium, silver, titanium, Those containing either nickel or nickel-iron or combinations thereof are used. Moreover, as a binder, a silicone resin, an epoxy resin, a polyimide resin, or bis maleimide resin is used, for example.

  The conductive adhesive 140 is disposed between the excitation electrode 122 of the quartz crystal element 120 and the conductive adhesive 140. In the quartz crystal device, the conductive adhesive 140 and the excitation electrode 122 are spaced apart, so that the short circuit caused by the conductive adhesive 140 adhering to the excitation electrode 122 can be reduced. .

  In addition, when the conductive adhesive 140 is applied by using the adhesive having a viscosity of 35 to 45 Pa · s, the conductive adhesive 140 does not flow out onto the upper surface of the substrate 110 a from above the electrode pad 111. Since it remains on the pad 111, the thickness in the vertical direction of the conductive adhesive 140 can also be secured. The length of the thickness in the vertical direction of the conductive adhesive 140 is 10 to 25 μm. Since the thickness of the conductive adhesive 140 can be secured as described above, even if an impact applied by dropping or the like is applied to the quartz crystal element 120 in the vertical direction centering on the conductive adhesive 140, the impact is conductive. The adhesive 140 can be sufficiently absorbed and relaxed.

  Here, a method of manufacturing the package 110 will be described. When the substrate 110a and the frame 110b are made of alumina ceramic, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder are prepared. Further, a predetermined conductive paste is applied by screen printing or the like known in the prior art in the surface of the ceramic green sheet or in the through holes which are punched in advance by punching or the like. Furthermore, these green sheets are stacked and press-formed, and fired at a high temperature. Finally, nickel plating or gold plating is applied to a predetermined portion of the conductor pattern, specifically, a portion to be the pair of electrode pads 111 or the external terminal 112, the first convex portion B1a, the second convex portion B1b, and the protruding portion B2. Manufactured by The conductor paste is made of, for example, a sintered body of metal powder such as tungsten, molybdenum, copper, silver or silver palladium.

  The quartz crystal element 120 is bonded onto the electrode pad 111 via the conductive adhesive 140 as shown in FIG. The quartz crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by the stable mechanical vibration and the piezoelectric effect.

  In the quartz crystal element 120, as shown in FIG. 2, as shown in FIGS. 1 and 2, the excitation electrode 122 and the lead-out electrode 123 are attached to the upper surface and the lower surface of the quartz substrate 121 respectively. It has a structure that The excitation electrode 122 is formed by depositing and forming a metal on each of the upper surface and the lower surface of the quartz crystal substrate 121 in a predetermined pattern. The excitation electrode 122 includes a first excitation electrode 122 a on the upper surface and a second excitation electrode 122 b on the lower surface. The lead-out electrodes 123 extend from the excitation electrode 122 toward one side of the quartz substrate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first lead-out electrode 123 a is drawn out from the first excitation electrode 122 a and provided so as to extend toward one side of the quartz crystal base plate 121. The second lead-out electrode 123 b is drawn out from the second excitation electrode 122 b and provided so as to extend toward one side of the quartz crystal base plate 121. That is, the extraction electrode 123 is provided in a shape along the long side or the short side of the quartz substrate 121. Further, in the present embodiment, one end of the quartz crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110, and the other end is between the upper surface of the substrate 110 The quartz crystal element 120 is fixed on the substrate 110 by a cantilevered support structure with free ends.

  The first lead-out electrode 123a of the crystal element 120 is in contact with the first convex portion B1a, and the second lead-out electrode 123b of the crystal element 120 is in contact with the second convex portion B1b. By bringing the lead-out electrode 123 of the crystal element 120 into contact with the convex portion B 1 in this way, even in the process of mounting the crystal element 120 on the electrode pad 111, the mounting position of the crystal element 120 is shifted and the mounting angle is inclined. The long-side end of the quartz crystal element 120 is supported in contact with the convex portion B1, the inclination of the short side of the quartz-crystal element 120 is suppressed, and the long-side end of the quartz crystal element 120 corresponds to the substrate 110a or the lid 130. It can prevent contact. Therefore, the fluctuation of the oscillation frequency of the crystal element 120 can be prevented, and the productivity can be improved.

  In addition, the crystal device adjusts the oscillation frequency of the crystal element 120 by scraping the surface of the excitation electrode 122 of the crystal element 120 with, for example, an ion gun. Further, in the conventional quartz crystal device, since the wiring pattern provided on the upper surface of the substrate is exposed also in the vicinity of the excitation electrode of the quartz crystal element, the wiring pattern is scraped off when the excitation electrode is scraped by the ion gun. There is. In addition, in the conventional quartz crystal device, shavings of the wiring pattern may be attached to the excitation electrode of the quartz crystal element, and the oscillation frequency may be fluctuated. However, in the quartz crystal device according to the present embodiment, as shown in FIG. 3A, the wiring pattern 113 is not exposed in the vicinity of the excitation electrode 122 of the quartz crystal element 120, and viewed in plan, Since they are provided at overlapping positions, it is possible to prevent the wiring pattern 113 from being scraped off when the excitation electrode 122 is scraped by the ion gun. In addition, since such a crystal device does not generate shavings of the wiring pattern 113, it is possible to stably output the oscillation frequency without attaching shavings to the excitation electrode 122 of the crystal element 120. Become.

  Further, the extraction electrode 123 of the quartz crystal element 120 contacts the convex part B1 even if the convex part B1 lead electrode 123 is inclined at the time of mounting, so that the fixed end side of the quartz crystal element 120 is the convex part B1. Since the distance for the thickness in the vertical direction can be secured, the free end of the quartz crystal element 120 does not float too much, and the free end of the quartz crystal element 120 can be prevented from contacting the lid 130.

  Here, the operation of the crystal element 120 will be described. In the quartz crystal element 120, when an alternating voltage from the outside is applied from the extraction electrode 123 to the quartz crystal base plate 121 via the excitation electrode 122, the quartz crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

  Here, a method for manufacturing the crystal element 120 will be described. First, the quartz crystal element 120 is cut at a predetermined cut angle from the artificial crystalline lens to reduce the thickness of the outer periphery of the quartz crystal base plate 121, and the central portion of the quartz crystal base plate 121 becomes thicker than the outer periphery of the quartz crystal base plate 121. Perform bevel processing to be provided. The quartz crystal element 120 is manufactured by forming the excitation electrode 122 and the lead-out electrode 123 by depositing a metal film on both principal surfaces of the quartz crystal base plate 121 by photolithography, vapor deposition technology or sputtering technology. Be done.

  A method of bonding the crystal element 120 to the substrate 110 a will be described. First, the conductive adhesive 140 is applied by spreading, for example, on the electrode pad 111 by a dispenser. The quartz crystal element 120 is transported onto the conductive adhesive 140. Furthermore, the quartz crystal element 120 is placed on the conductive adhesive 140 so that the lead electrode 123 on the outer peripheral edge on the fixed end side of the quartz crystal element 120 overlaps the convex portion B1 in plan view. At this time, the overflowing conductive adhesive 140 flows out on the exposed first wiring pattern 113a. The conductive adhesive 140 is cured and shrunk by heat curing. In the quartz crystal element 120, when the conductive adhesive 140 cures and contracts, the fixed end side of the quartz crystal element 120 is pulled downward, and the principle of the ladder with the second convex portion B1b as a fulcrum works. It is joined to a pair of electrode pads 111 so that the free end side of 120 may float upward. Further, when the fixed end side of the quartz crystal element 120 is pulled downward at the time of curing and shrinkage of the conductive adhesive 140, the electrode pad 111 is in a state where the convex portion B1 and the lead electrode 123 on the outer peripheral edge of the quartz crystal element 120 are in contact. Bonded to

  The integrated circuit element 150 is, for example, a rectangular flip chip type integrated circuit element having a plurality of connection pads, and a circuit forming surface (upper surface) thereof is a temperature sensor for detecting an ambient temperature condition, quartz Storage element unit for storing temperature compensation data for compensating temperature characteristic of element 120, temperature compensation circuit unit for correcting vibration characteristic of crystal element 120 according to temperature change based on temperature compensation data, temperature compensation circuit unit And an oscillation circuit unit that generates a predetermined oscillation output. The output signal generated by the oscillation circuit unit is output to the outside of the temperature compensated crystal oscillator through one of the external terminals 112, and is used as a reference signal such as a clock signal, for example.

  The memory element unit is configured of PROM or EEPROM. The temperature compensation control data of the external terminal 112 is a parameter serving as the basis of a cubic function shown below which is a temperature compensation function, for example, third order component adjustment value α, first order component adjustment value β, and zero order component adjustment value γ. It is input and stored from the write / read terminal which is one of them. A register map is stored in the storage element unit. The register map indicates that when control data is input to each address data, the control unit reads the data, outputs a signal, and what operation is to be performed.

  The temperature compensation circuit unit is configured of a cubic function generation circuit, a quintic function generation circuit, and the like. For example, in the case of a cubic function generation circuit, temperature compensation control data input to the storage element portion is read out, and a voltage derived as a cubic function is generated for each temperature from the temperature compensation control data. The external ambient temperature at this time is obtained from the temperature sensor in the integrated circuit element 150. The temperature compensation circuit unit is connected to the cathode of the variable capacitance diode, and a voltage from the temperature compensation circuit unit is applied. As described above, the frequency temperature characteristic is flattened by correcting the frequency temperature characteristic of the crystal element 120 by applying the voltage from the temperature compensation circuit unit to the variable capacitance diode.

  As shown in FIG. 2, the integrated circuit element 150 is mounted on a connection pad 116 provided on the lower surface of the substrate 110 a via a conductive bonding material 160 such as solder. The connection terminal 151 of the integrated circuit element 150 is connected to the connection pad 116. The connection pad 116 is electrically connected to the external terminal 112 through the connection pattern 117 and the conductor portion 115. One of the external terminals 112 serves as a ground terminal by being connected to a mounting pad connected to the ground which is a reference potential on a mounting substrate of an electronic device or the like. Therefore, one of the connection terminals 151 of the integrated circuit element 150 is connected to the ground which is the reference potential.

  Further, the temperature sensor provided in the integrated circuit element 150 is provided so as to be positioned in the monitor electrode 119 in plan view. By doing this, the heat transmitted from the crystal element 120 is transferred from the electrode pad 111 to the first monitor electrode 118 or the second monitor electrode 119 via the wiring pattern 113 and the via conductor 114 as a first monitor. The heat is dissipated from the electrode 118 or the second monitor electrode 119 and is transmitted to the temperature sensor provided in the integrated circuit element 150. Therefore, since the temperature compensation type crystal oscillator can shorten the heat conduction path, the temperature of the crystal element 120 and the temperature of the integrated circuit element 150 approximate each other, and the temperature sensor of the integrated circuit element 150 is obtained. It is possible to further reduce the difference between the temperature and the actual temperature around the crystal element 120.

  A method of bonding the integrated circuit element 150 to the substrate 110a will be described. First, the conductive bonding material 160 is applied to the connection pad 116 by, for example, a dispenser. The integrated circuit element 150 is placed on the conductive bonding material 160. The conductive bonding material 160 is melted and bonded by heating. Thus, the integrated circuit element 150 is bonded to the connection pad 116.

  Further, as shown in FIGS. 1 and 2, the integrated circuit element 150 has a rectangular shape, and six connection terminals 151 are provided on the lower surface thereof. Three connection terminals 151 are provided along one side, and three are provided along one side facing the one side. The length of the long side of the integrated circuit element 150 is 0.5 to 1.2 mm, and the length of the short side is 0.3 to 1.0 mm. The length of the integrated circuit element 150 in the thickness direction is 0.1 to 0.3 mm.

  The conductive bonding material 160 is made of, for example, silver paste or lead-free solder. Further, the conductive bonding material 160 contains an added solvent for adjusting the viscosity to be easy to apply. The component ratio of lead-free solder is 95 to 97.5% of tin, 2 to 4% of silver, and 0.5 to 1.0% of copper.

  The insulating resin 170 is provided between the surface of the integrated circuit element 150 on which the connection terminal 151 is provided and the connection pad 116, as shown in FIG. 2B. By doing this, the insulating resin 170 can enhance the adhesive strength between the integrated circuit element 150 and the lower surface of the substrate 110a. In addition, if the temperature compensated crystal oscillator is mounted on the mounting pad of the mounting substrate of the electronic device or the like, even if foreign substances such as solder enter into the second recess K2, the insulating resin 170 makes it possible to Since adhesion of foreign matter between the connection terminals 151 of the integrated circuit element 150 is suppressed, a short circuit between the connection terminals 151 of the integrated circuit element 150 can be reduced. In addition, the insulating resin 170 is made of a resin material such as an epoxy resin or a composite resin containing an epoxy resin as a main component.

  Further, the insulating resin 170 is provided to cover the first monitor electrode 118 or the second monitor electrode 119. By doing so, the adhesion of foreign matter to the first monitor electrode 118 or the second monitor electrode 119 is suppressed, so that the addition resistance of the foreign matter to the quartz crystal element 120 can be suppressed. Therefore, it is possible to reduce the fluctuation of the oscillation frequency of the crystal element 120.

  A method of forming the insulating resin 170 on the substrate 110a will be described. The tip of the resin dispenser is inserted into the gap of the second recess K2, and the insulating resin 170 is injected. Next, the insulating resin 180 is heated and cured. Therefore, the insulating resin 170 is provided so as to cover the lower surface of the substrate 110 a and between the integrated circuit element 150 and the connection pad 116 and the first monitor electrode 118 or the second monitor electrode 119.

  The lid 130 has a rectangular shape, and seals the first recess K1 in a vacuum state or the first recess K1 filled with nitrogen gas in an airtight manner. Specifically, the lid 130 is placed on the top surface of the bonding member 131 provided on the frame 110 b in a predetermined atmosphere. The heat is applied to the bonding member 131 provided on the upper surface of the frame 110b, whereby fusion bonding is performed. Also, the lid 130 is made of, for example, an alloy containing at least one of iron, nickel or cobalt.

  The bonding member 131 is provided at a position of the lid 130 which is opposed to the sealing conductor pattern H provided on the upper surface of the first frame 110 b of the package 110. The sealing member 131 is provided by, for example, silver solder or gold-tin. In the case of silver wax, the thickness is 10 to 20 μm. For example, the component ratio of silver of 72 to 85% and copper of 15 to 28% is used. In the case of gold-tin, its thickness is 10 to 40 μm. For example, a component ratio of 78 to 82% of gold and 18 to 22% of tin is used.

  The bonding member 131 is, for example, in the case of gold-tin, the thickness of the layer of the bonding member 131 is 10 to 40 μm, for example, 70 to 80% of gold and 20 to 30% of tin. You may use In the case of silver solder, for example, the thickness of the layer of the bonding member 131 is 10 to 40 μm. For example, the component ratio is 70 to 80% of silver and 20 to 30% of copper. You may use the one of

  The quartz crystal device according to the present embodiment includes a rectangular substrate 110a, a first frame 110b provided along the outer periphery of the upper surface of the substrate 110a, and a second frame provided along the outer periphery of the lower surface of the substrate 110a. The frame 110c, the pair of electrode pads 111 provided on the upper surface of the substrate 110a, the connection pads provided on the lower surface of the substrate 110a, the quartz crystal element 120 mounted on the pair of electrode pads, and the connection pad 116 Integrated circuit element 150, a first monitor electrode 118 electrically connected to the pair of electrode pads 111, and provided on the lower surface of the substrate 110a along the inner peripheral edge of the second frame 110c; A second monitor electrode 119 electrically connected to 118 and provided on the lower surface of the substrate 110 a so as to be located between the connection pads 115 and the crystal element 120 are hermetically sealed. It includes a lid 130 for a. In this way, the size can be reduced while securing the combined area of the first monitor electrode 118 and the second monitor electrode 119, as compared with the monitor electrode of the conventional piezoelectric device. In addition, when measuring the electrical characteristics of the quartz crystal element 120, the quartz crystal device brings the measurement probe into contact with the boundary portion between the first monitor electrode 118 and the second monitor electrode 119, thereby making the first monitor electrode 118 or the second monitor It becomes possible to reliably contact either one of the electrodes 119. Such a quartz crystal device can stably measure the electrical characteristics of the quartz crystal element 120, thereby improving productivity.

  In the crystal device in the present embodiment, one first monitor electrode 118 a of the first monitor electrode 118 is provided at a position overlapping with the pair of electrode pads 111 in plan view. Also, by doing this, the heat transmitted from the quartz crystal element 120 is transmitted to one first monitor electrode 118a via the substrate 110a immediately below the electrode pad 111, and the heat is transmitted from one first monitor electrode 118a. Released. Therefore, since such a crystal device can shorten the heat conduction path, it is possible to further reduce the difference from the actual temperature around the crystal element 120, and the temperature correction by the integrated circuit element 150 described later It is easy to do.

  Further, the quartz crystal device in the present embodiment is provided such that one second monitor electrode 119 a of the second monitor electrode 119 is located between the pair of electrode pads 111 in plan view. Also, by doing this, the heat transmitted from the quartz crystal element 120 is transmitted to the one second monitor electrode 119a via the substrate 110a immediately below the electrode pad 111, and the heat is transmitted from the one second monitor electrode 119a. Released. Therefore, since such a crystal device can shorten the heat conduction path, it is possible to further reduce the difference from the actual temperature around the crystal element 120, and the temperature correction by the integrated circuit element 150 described later Can be made easier.

  In the quartz crystal device in the present embodiment, the insulating resin 170 is provided to cover the first monitor electrode 118 or the second monitor electrode 119. By doing so, the adhesion of foreign matter to the first monitor electrode 118 or the second monitor electrode 119 is suppressed, so that the addition resistance of the foreign matter to the quartz crystal element 120 can be suppressed. Therefore, it is possible to reduce the fluctuation of the oscillation frequency of the crystal element 120.

  Further, in the quartz crystal device in the present embodiment, the electrode pad 111 is provided along one side of the substrate 110 a, and includes the convex portion B 1 provided on the upper surface of the electrode pad 111. When the crystal element 120 is mounted on the electrode pad 111 via the conductive adhesive 140, even if the crystal element 120 is inclined, the lead-out electrode 123 is in contact with the convex portion B1, and the convex electrode B1 is The crystal element 120 can be mounted in a stable state without being inclined downward. Further, the convex portion B1 is provided at a position overlapping the lead-out electrode 123 on the outer peripheral edge on the fixed end side of the quartz crystal base plate 121 in plan view. By doing so, the contact of the fixed end of the quartz crystal element 120 with the upper surface of the substrate 110a can be reduced.

  In addition, the crystal device in the present embodiment includes the protrusion B2 provided along the side facing the one side of the substrate 110a. By doing this, when an impact such as a drop is applied to the quartz crystal device, the free end side of the quartz crystal element 120 contacts the projection B2, so that chipping due to direct contact with the substrate 110a can be suppressed. .

  The present invention is not limited to the present embodiment, and various changes, improvements, and the like can be made without departing from the scope of the present invention. In the above embodiment, the case where the frame 110b is provided on the upper surface of the substrate 110a has been described, but after mounting the crystal element on the substrate, the lid having the sealing frame portion provided on the lower surface of the sealing base is used. The structure may be such that the crystal element is hermetically sealed by using it. The lid includes a rectangular sealing base and a sealing frame provided along the outer periphery of the lower surface of the sealing base, and the lower surface of the sealing base and the inner side of the sealing frame A housing space is formed by the side surface. The sealing frame portion is for forming an accommodation space on the lower surface of the sealing base. The sealing frame is provided along the outer edge of the lower surface of the sealing base.

  Although the case where the frame 110b is provided on the upper surface of the substrate 110a has been described in the above embodiment, after the quartz crystal element is mounted on the substrate, the crystal device is mounted using a lid having a wall provided on the lower surface. It may be a hermetically sealed structure.

  In the above embodiment, the quartz crystal element has been described for the case where the quartz crystal element for AT is used, but a tuning fork type curved quartz crystal having a base and two flat vibrating arms extending in the same direction from the side surface of the base An element may be used. The quartz crystal element is constituted of a quartz crystal piece, an excitation electrode provided on the surface of the quartz crystal piece, an extraction electrode, and a metal film for frequency adjustment. The quartz crystal piece comprises a quartz crystal base and a quartz crystal vibrating portion, and the quartz crystal vibrating portion comprises a first quartz crystal vibrating portion and a second quartz crystal vibrating portion. The quartz crystal base is an orthogonal coordinate system in which the electrical axis is X axis, the mechanical axis is Y axis, and the optical axis is Z axis as the crystal axis direction, within the range of -5 ° to + 5 ° around the X axis It is a flat plate having a substantially rectangular shape in plan view, in which the direction of the rotated Z 'axis is the thickness direction. The first quartz-crystal vibrating portion and the second quartz-crystal vibrating portion extend from one side of the quartz crystal base in parallel to the direction of the Y ′ axis. Such a quartz crystal piece has a crystal base and crystal vibrating portions integrally formed in a tuning fork shape, and is manufactured by photolithography technology and chemical etching technology.

DESCRIPTION OF SYMBOLS 110 ... Package 110a ... Substrate 110b ... 1st frame 110c ... 2nd frame 111 ... Electrode pad 112 ... External terminal 113 ... Wiring pattern 114 ... Conductor part 115: via conductor 116: connection pad 117: connection pattern 118: first monitor electrode 119: second monitor electrode B1: convex portion B2: projection H Conducting pattern for sealing 120 ... Crystal element 121 ... Crystal base plate 122 ... Excitation electrode 123 ... Extraction electrode 130 ... Lid body 131 ... Bonding member 140 ... Conductive bonding Agent 150 ··· Integrated circuit element 160 · · · Conductive bonding material 170 ··· Insulating resin K1 ··· First recess K2 ··· Second recess

Claims (6)

A rectangular substrate,
A first frame provided along the outer peripheral edge of the upper surface of the substrate;
A second frame provided along the outer peripheral edge of the lower surface of the substrate;
A pair of electrode pads provided on the upper surface of the substrate;
A plurality of connection pads provided on the lower surface of the substrate;
A quartz crystal element mounted on the pair of electrode pads;
An integrated circuit element mounted on the connection pad;
A pair of first monitor electrodes which are respectively electrically connected to the pair of electrode pads and provided on the lower surface of the substrate along the inner peripheral edge of the second frame;
The first monitor electrode and are electrically connected, and a pair of second monitor electrode provided on the lower surface of the substrate so as to be located between the connection pads,
And a lid for hermetically sealing the crystal element,
The side length of the first monitor electrode parallel to the short side direction of the substrate is longer than the side length of the second monitor electrode parallel to the short side direction of the substrate,
The quartz crystal device, wherein the first monitor electrode is provided so as to be located between the outer peripheral edge on the short side of the second frame and the connection pad in plan view . The crystal device according to claim 1, wherein
One of the first monitor electrodes is provided at a position overlapping with the pair of electrode pads in plan view. The crystal device according to claim 1 or 2, wherein
One of the second monitor electrodes is provided so as to be located between the pair of electrode pads in plan view. The crystal device according to any one of claims 1 to 3, wherein
A quartz crystal device comprising an insulating resin provided to cover the first monitor electrode and the second monitor electrode. The crystal device according to any one of claims 1 to 4, wherein
The electrode pad is provided along one side of the substrate,
A crystal device comprising a convex portion provided on the upper surface of the electrode pad. The crystal device according to any one of claims 1 to 5, wherein
A quartz crystal device comprising a protrusion provided along a side facing one side of the substrate.

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