JP6512682B2 - Peeling device and peeling method of bonded product - Google Patents

Description

  The present invention relates to a peeling apparatus and a peeling method of a bonded product in which a product obtained by laminating rigid members such as a single plate of glass, polycarbonate, acrylic or the like, a liquid crystal panel, a touch panel, a cover glass, etc. is peeled.

  BACKGROUND ART In terminals such as smartphones and tablets, a configuration in which a plurality of members such as a display portion, a touch panel portion, and a portion covering them are fixed with an adhesive or an adhesive tape is increasing. In the manufacturing process of these products, a position may shift at the time of bonding, a bubble may enter, etc., and it may become rejection (NG) as a product. In addition, even after the completion of the product, the product may be broken due to a drop in use or the like. In these cases, since each member is expensive, it is required to reuse rejected products to increase the yield, or to replace and repair a damaged member. However, it is very difficult to separate products into which the respective members are in close contact over the entire surface. For this reason, there is a demand for a technique for efficiently peeling each member without damaging the members.

  Patent Document 1 describes a method in which the product is cooled with a low-temperature liquid such as liquid nitrogen and then subjected to impact to peel off. However, the use of a large amount of low-temperature liquid is expensive in the environment as well, and even if the adhesive strength is reduced, considerable force may be required for peeling, and the product is likely to be broken. In addition, by exposing the product to a low temperature, there is a concern that the product after peeling may break down and can not be reused.

  Patent Document 2 describes a method of peeling by heating the product to soften the adhesive. However, there is a concern that the product after peeling may not be able to be reused due to the load applied to the product using a weight for peeling in addition to applying heat so high that the viscoelasticity of the adhesive changes. is there.

  Patent Document 3 describes a method of irradiating a product with a laser beam to burn and melt the adhesive sheet in a groove shape, and immersing and peeling an organic solvent from the groove. However, there is a concern that the product may be damaged by heat or solvent and can not be reused. Furthermore, there is a concern that the equipment investment will increase due to the high cost of the laser light irradiation device.

  Patent Document 4 describes a method in which the bonded members are relatively moved in parallel, and the adhesive layer is broken and peeled off by shear stress. However, in order to facilitate peeling, it is necessary to use a pressure-sensitive adhesive tape having a weak adhesive strength, and there is a concern that the product may be peeled off due to dropping or excessive load during actual use.

  Patent Document 5 describes a method of holding both sides of a product and swinging one member to separate it from the other member. However, in a product in which a large number of members are laminated, it peels off at a relatively weak portion, making it difficult to peel off the product at a necessary portion. In addition, if the condition is set so as not to damage the member, it is not possible to apply a rapid force, and there is a problem that it takes time to start peeling.

Japanese Patent Laid-Open No. 2001-293464 Japanese Patent Application Laid-Open No. 2002- 367516 JP 2007-204706 A JP, 2010-121134, A JP, 2013-023526, A

  This invention is made in view of the said situation, and makes it a subject to provide the peeling apparatus and peeling method of the bonding article which can peel without damaging each member of a to-be-adhered body.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention winds up the wire inserted in the said contact bonding layer of the bonded product which the thick material was bonded through the contact bonding layer, and the said wire is moved and it moves Wire winding unit for driving the wire winding unit, driving unit for winding the wire around the wire winding unit, and controlling the position of the wire winding unit or the bonded product And the control unit is configured to separate the thick material pasted through the adhesive layer, so that the wire is inserted from one end of the adhesive layer or the other. as moving towards the end, which controls the position of the wire winder unit and the bonding article, the diameter of the wire is less than the thickness of the adhesive layer, the wire into the adhesive layer When inserting the planar shape of the adhesive layer has a corner, the wire provides a peeling apparatus lamination products, characterized in that it is inserted from the corner of the at least one location of said adhesive layer.

In the peeling apparatus of a bonding goods, it is preferable to provide the movable stage for mounting the said bonding goods .
The wire is preferably a fine wire .
It is preferable that the length of the part which the said wire contact | connects the said adhesive layer between materials with the said thickness is shorter than the length of the longest diagonal of the said bonding goods.

Further, according to the present invention, in a bonded product in which a thick material is bonded via an adhesive layer, a wire is inserted into the adhesive layer, and the thick materials are bonded via the adhesive layer. to peel the while moving toward the inside or the other end of the wire from one end of the adhesive layer, the wire comprising the step of winding the wire winder unit, the diameter of the wire Is smaller than the thickness of the adhesive layer, and when inserting the wire into the adhesive layer, the planar shape of the adhesive layer has a corner, and the wire is inserted from at least one corner of the adhesive layer The peeling method of the bonding goods characterized by the above-mentioned is provided.

In the peeling method of a bonding goods, it is preferable to mount the said bonding goods on a movable stage .
The wire is preferably a fine wire .
It is preferable that the length of the part which the said wire contact | connects the said adhesive layer between materials with the said thickness is shorter than the length of the longest diagonal of the said bonding goods.

  According to the present invention, by inserting and moving the wire only in the adhesive layer, it is possible to peel without damaging each member of the adherend without using heat, an organic solvent or the like. As each component of the product is not adversely affected, reuse of each component is possible.

It is sectional drawing explaining the basic concept of the peeling method of a bonded article. It is a top view explaining the 1st embodiment of the exfoliation method of a bonded article. It is a top view explaining the 2nd embodiment of the exfoliation method of a bonded article. It is a top view explaining the 3rd embodiment of the exfoliation method of a bonded article. It is a top view explaining the 4th embodiment of the exfoliation method of a bonded article. It is a top view explaining the 5th embodiment of the exfoliation method of a bonded article.

  Hereinafter, the present invention will be described based on preferred embodiments. Each figure is a schematic view, and the ratio of dimensions is not necessarily to scale.

  First, the basic concept of the present invention will be described with reference to the sectional view shown in FIG. The bonded product 10 is a product in which thick materials (adherends) 11 and 12 are bonded via the adhesive layer 13. The wire 21 is inserted into the adhesive layer 13 bonding the adherends 11 and 12 each other, and the wire 21 is moved to physically scrape the adhesive layer 13, thereby reducing the adhesive force of the adhesive layer 13. The bodies 11, 12 are separated from each other. Although the example of the bonding goods 10 containing two to-be-adhered bodies 11 and 12 is shown in FIG. 1, this invention is not limited to this, It is applicable also to the bonding goods containing three or more members.

  The jig to be in contact with the adhesive layer 13 in order to remove the material (adhesive material) of the adhesive layer 13 may have a plate-like or blade-like structure. In the present invention, by using a linear jig like the wire 21, the jig is continuously moved in a plane perpendicular to the thickness direction of the adhesive layer 13. By increasing the cumulative contact area, the adhesive layer 13 can be efficiently removed. Further, since the wire 21 can be taken up, the installation area of the device can be suppressed even when using the long wire 21. Although the bonded article 10 may be moved along the longitudinal direction of the wire 21, in the present invention, it is preferable to move the wire 21 in the longitudinal direction while in contact with the adhesive layer 13. As a result, the section to which the adhesive material is attached is pulled apart, and the section to which the adhesive layer 13 is not attached is newly fed, so that the adhesive material can be removed one after another.

  In the present specification, the thickness direction of the bonded product 10 or the adhesive layer 13 may be simply referred to as the “thickness direction” or the “vertical direction”. In this case, the “vertical direction” may or may not coincide with the direction (vertical direction) in which gravity acts. In addition, a direction orthogonal to both the thickness direction and the longitudinal direction of the wire 21 may be referred to as “front-rear direction”. In the “front-rear direction”, the side in which the wire 21 contacts the adhesive layer 13 may be referred to as “front”, and the side from which the adhesive layer 13 is removed may be referred to as “rear”.

  The planar shape of the bonded product 10 is not particularly limited, and specific examples thereof include a quadrangle such as a rectangle, a polygon, a polygon having roundness at corners, a circle, and the like. The planar shape of the bonded article 10 may include a hole, a window, a notch and the like. The planar shapes of the adherends 11 and 12 constituting the bonded article 10 may be the same as or different from each other. The adhesive layer 13 may be provided on the entire surface of the bonded product 10 or may be a part. The adhesive layer 13 may be formed as a solid over the entire predetermined range, or may be mixed with the non-adhered portion by a pattern such as stripes, grids, frames, dots and the like. The adhesive layer 13 may reach the outer periphery of the bonded product 10, may further protrude from the outer periphery, or may not reach the outer periphery. In a region where the adherends 11 and 12 do not overlap in the thickness direction, the presence or absence of the adhesive layer 13 is optional.

  The adherends 11 and 12 constituting the bonded article 10 are adherends bonded by the adhesive layer 13. Each of the adherends 11 and 12 may be a rigid plate, or may be flexible like a film. If at least one adherend can be bent within a range that does not affect the performance, as described later, the work can be performed while curving the adherend. Both of the adherends 11 and 12 may be rigid, or both may be flexible, or one may be rigid and the other flexible. The adherends 11 and 12 may be a single plate of glass, polycarbonate, acrylic, various resins, ceramics, metals, etc., and may be a composite composed of plural materials such as a liquid crystal panel, touch panel, cover glass, wiring board, etc. . When referred to as "members", it includes veneers, composites, and the like.

  In the present invention, by continuing moving the wire 21 in the longitudinal direction at least while the wire 21 is in contact with the adhesive layer 13, it is possible to prevent the material of the adhesive layer 13 from adhering to the wire 21 and becoming difficult to peel off. In addition, if the portion where the wire 21 contacts the adhesive layer 13 is small, the peeling speed can be increased with less pressure. For this reason, it is preferable to provide the mechanism which can move the positional relationship of the bonding article 10 and the wire 21 freely.

  For example, when it is preferable that the wire 21 contacts only the adhesive layer 13, it is preferable to provide a mechanism for adjusting the relative height of the wire 21 with respect to the adhesive layer 13 in the thickness direction. Thereby, the wire 21 can always be in contact with the adhesive layer 13 so as not to damage the adherends 11 and 12. During relative height adjustment, either one of the wire 21 and the bonded product 10 may be moved, or both may be moved. When the bonded product includes two or more adhesive layers, any adhesive layer can be selectively peeled off depending on the position of the adherend to be peeled off.

  The wire 21 is inserted into the adhesive layer 13 while moving the wire 21 in one direction, and the wire 21 is brought into contact with the adhesive layer 13 between the adherends 11 and 12. Thereby, the wire 21 scrapes off the adhesive layer 13 and the material of the adhesive layer 13 can be attached to the wire 21 little by little and taken out. The material of the adhesive layer 13 is not particularly limited, and is, for example, an adhesive material such as an adhesive or a pressure-sensitive adhesive. If a step of removing the adhesive material attached to the wire 21 is provided during the operation, it is also possible to move the wire 21 in the reverse direction. When the wire 21 is in contact with the adhesive layer 13 and during the contact, the operation of the wire 21 is not limited to parallel movement along the longitudinal direction, the front-rear direction, the thickness direction or the diagonal direction combining two or more of them. It is also possible to twist or turn the wire 21 further. The position of the central axis of rotation is not particularly limited, but may be rotation around an axis where the relative angle between the end face of the adhesive layer 13 and the longitudinal direction of the wire 21 does not change, in-plane rotation of the adhesive layer 13 where the relative angle changes, .

  The diameter (wire diameter) of the wire 21 is preferably smaller than the thickness of the adhesive layer 13, but the wire diameter may be greater than or equal to the thickness of the adhesive layer 13. The material of the wire 21 is not particularly limited, and examples thereof include metal, carbon, resin, glass and the like. The wire 21 may be a single wire, a composite wire such as a stranded wire or a coated wire, or a linear body such as a fiber. In particular, fine wires are preferred. The form of the wire 21 is not limited to a straight wire which is circular in cross section and uniform in the longitudinal direction, but may be a corrugated wire wound loosely in a spiral shape or an irregular wire whose cross section is not circular (e. (A trapezoidal wire, a pentagonal wire, a hexagonal wire, an elliptical wire, a rhombus wire, a convex wire, a grooved wire, etc.), and a wire having a surface provided with irregularities by adhering fine particles and the like. In the case of the corrugated wire, the peeling speed can be increased by depositing the material of the adhesive layer 13 and moving the wire 21.

  The wire 21 preferably has durability (in particular, strength in the tensile direction) which does not break during the peeling operation, and the material of the wire 21 is preferably harder than the material of the adhesive layer 13. The peeling operation can be performed even with a fiber material having flexibility in the direction orthogonal to the longitudinal direction. A wire for metal working is preferable because it has a small diameter and high tensile strength, so that the wire can be strongly tensioned and it can be easily inserted into the required position.

  The range in which the wire 21 contacts the bonding product 10 is preferably less than 100% (shorter than the outer circumference) with respect to the length of the portion (periphery) where the adhesive layer 13 is exposed outside the bonding product 10 . The length of the portion of the wire 21 in contact with the adhesive layer 13 is preferably as small as possible, more preferably 50% or less of the outer circumference, and preferably shorter than the (longest) diagonal length of the bonded article 10. By reducing the contact area (length) of the wire 21 and the adhesive layer 13 as much as possible, the friction is reduced and the processing speed can be increased with a smaller force.

  Specifically, when starting the peeling operation (processing) at least, it is preferable to insert the wire 21 from at least one corner of the adhesive layer 13. Thereby, compared with the case where the wire 21 is inserted in parallel with the side of the bonded article 10, the contact area (length) of the wire 21 and the adhesive layer 13 can be reduced as much as possible. When the adhesive layer 13 is formed on the entire surface of the adherends 11 and 12, the corner of the adhesive layer 13 is the same as the corner of the adherends 11 and 12. Also in the case of changing the insertion position of the wire 21, it is preferable to insert the wire 21 from at least one corner of the adhesive layer 13. The corner of the adhesive layer 13 during processing may be the corner between two sides generated by the adhesive layer 13 by processing, or may be the corner between the side generated by the adhesive layer 13 by processing and a side existing before processing .

  It is also possible to release the wire 21 from the adhesive layer 13 when the tension exceeds a predetermined value while detecting the tension applied to the wire 21, and proceed with the work while changing the insertion position. If the processing proceeds and the length of one side of the adhesive layer 13 becomes short, the wire 21 may be inserted along the side of the adhesive layer 13 and the insertion direction is parallel to the sides of the adherends 11 and 12 May be. When the material of the adhesive layer 13 is an adhesive, or when the adhesive strength of the adhesive increases due to frictional heat during processing, the material of the adhesive layer 13 easily adheres to the wire 21, so the resistance to move the wire 21 is resistance The power is increased. In this case, it is preferable to detect tension and control the device so that excessive tension is not applied to the wire 21. The tension applied to the wire 21 during processing may be lower than the breaking strength of the wire 21, but preferably 50% or less, more preferably 20% or less. Thus, breakage of the wire 21 can be suppressed, and the device can be used stably for a long time.

  The relative speed at which the wire 21 is moved with respect to the bonded product 10 is preferable, as the higher the speed, the better the workability, as long as there is no deformation, damage or the like of the adherends 11 and 12 as adherends. When the relative speed is slow, it is easy to peel off cleanly, but there is a risk that the workability may be reduced. Here, the relative speed is the moving speed of the wire 21 when moving the wire 21 without moving the bonded product 10, and when moving the bonded product 10 without moving the wire 21, the relative speed of the bonded product 10 It is the moving speed, and in the case of moving both, it is the speed of relative displacement between the two.

  In order to hold the bonded product 10 with respect to the wire 21, it is preferable to use holding means such as a movable stage. The holding means is not limited to the configuration in which the bonded product 10 is placed on the stage, and various configurations may be employed such as sandwiching in the thickness direction or the like, providing a stopper on the end surface of the bonded product 10.

  Next, an operation in a plane perpendicular to the thickness direction of the bonded article 10 will be described. The example of the mechanism to which the wire 21 is moved with respect to the bonding goods 10 is shown to FIGS. The front adhesive layer 13 is gradually removed by inserting the wire 21 into the adhesive layer 13 from the end of the bonded product 10 and moving the wire 21 to the front (the back side of the adhesive layer 13). A region (peeling portion) 14 from which the adhesive layer 13 is removed is formed rearward.

  In the first embodiment shown in FIG. 2, the position of the peeling device 20 is fixed, and the position of the bonded product 10 moves. The peeling device 20 includes a wire 21, a wire feeding portion 22, and a wire winding portion 23. In order to drive the wire winding unit 23, a drive unit (not shown) may be provided. The wire feeding portion 22 may be pulled passively by being pulled by the wire 21 wound around the wire winding portion 23, and driven by providing a driving portion (not shown) separately from the wire winding portion 23. May be

  In the present embodiment, the wire 21 is held linearly between the wire feeding portion 22 and the wire winding portion 23. An operation of inserting the wire 21 from the corner of the bonded article 10 and removing the adhesive layer 13 is performed one by one, and when the removal of the adhesive layer 13 proceeds to a certain extent, the insertion position of the wire 21 is changed. The peeling apparatus 20 can hold the bonded product 10 by a movable stage (not shown) or the like and change the distance and angle (direction) of the bonded product 10 with respect to the wire 21. At the time of changing the insertion position, the bonded product 10 is rotated at a desired angle at a position away from the wire 21 and then brought close to the wire 21.

  In the second embodiment shown in FIG. 3, the position of the bonded product 10 is fixed, and the position of the wire 21 moves. One or more idlers 24, 25, 26 are provided along the path of the wire 21 between the wire feeding portion 22 and the wire winding portion 23. By changing the positions of the idlers 24, 25, 26, the wire 21 is approached after being rotated at a desired angle away from the wire 21. In the example of FIG. 3, the wire 21 is simultaneously in contact with the two corners of the rectangular bonded product 10. The number of places where the wire 21 contacts the corners of the adhesive layer 13 is arbitrary, and the wire 21 may be brought into contact with all the corners simultaneously.

  In 3rd Embodiment shown in FIG. 4, the peeling apparatus 20 can move with the wire delivery part 22 and the wire winding-up part 23, and can change the position of the wire 21 with respect to the bonding goods 10. FIG. The length for stretching the wire 21 between the wire feeding portion 22 and the wire winding portion 23 is arbitrary and may be constant or variable.

  As shown in FIG. 3, when using the idlers 24, 25, 26, the angle (direction) of the bonded product 10 with respect to the wire 21 is changed while fixing the height of the bonded product 10. Moreover, when fixing the position of the bonding article 10, the position of the wire 21 is changed. Furthermore, in order to reduce the area in which the wire 21 contacts the adhesive layer 13, the position of the wire 21 or the bonded product 10 is constantly changed, or the wire 21 or the bonded product 10 is continuously moved in one direction. Instead, the adhesive layer 13 can be efficiently removed by small movements or the like.

  Next, the operation in the thickness direction of the bonded product 10 will be described. In order to insert the wire 21 into the adhesive layer 13, the wire 21 is brought into contact from the end face of the adhesive layer 13 while adjusting the height of the wire 21 or the bonded product 10. The range from which the adhesive layer 13 is removed may be the entire thickness or a part of the thickness of the adhesive layer 13. When a part of the adhesive layer 13 remains on the surface of one or both adherends 11 and 12, the adherends 11 and 12 are held parallel to prevent reattachment of the adherends 11 and 12 Preferably, the distance between the adherends 11 and 12 is maintained by curving outward or the like.

  In the fourth embodiment shown in FIG. 5, the peeling device 20 can move together with the wire feeding portion 22 and the wire winding portion 23 to adjust the height of the wire 21 with respect to the adhesive layer 13. Conversely, the peeling device 20 may be fixed to both the wire feeding portion 22 and the wire winding portion 23, and may move the bonded product 10 up and down. In order to proceed with the removal of the adhesive layer 13, it is necessary to move the wire 21 in the front-rear direction from one end of the adhesive layer 13 toward the inside (or the other end) of the adhesive layer 13. In this movement in the longitudinal direction, the bonded product 10 may be fixed and the wire 21 may be moved, or the wire 21 may be fixed and the bonded product 10 may be moved, and both the wire 21 and the bonded product 10 are moved May be

  In the fifth embodiment shown in FIG. 6, the idlers 24, 25 can be moved to adjust the height of the wire 21 relative to the adhesive layer 13. At this time, the wire feeding portion 22 and the wire winding portion 23 may or may not move in conjunction with each other. When the idlers 24 and 25 are provided, the idlers 24 and 25 can have a function of pressing the wire 21 against the adhesive layer 13 in the front-rear direction. Regardless of the presence or absence of the idlers 24 and 25, it is optional to move either the wire 21 or the bonded product 10 in the thickness direction.

  In the peeling portion 14 from which the adhesive layer 13 is removed, the distance between the adherends 11 and 12 is increased so as not to affect the performance of the adherends 11 and 12. One or both may be curved. The method of curving the adherend is not particularly limited, and a jig may be coupled to the surface or the end face of the adherend by attraction, hooking, or the like and pulled. When the adherend has flexibility like a film, the film can be curved also by a method of pushing the end face of the film or inserting a wire having a larger diameter than the thickness of the adhesive layer 13. In the peeling portion 14, the adherends 11 and 12 are curved such that the distance between the adherends 11 and 12 is larger than the thickness of the adhesive layer 13, thereby preventing reattachment of the adhesive layer 13 in the peeling portion 14 it can. Further, even a wire 21 whose diameter is slightly larger than the thickness of the adhesive layer 13 can be used. As a result, the amount of adhesion of the adhesive layer 13 per unit length of the wire 21 increases, and the peeling speed can be increased.

  When both adherends 11 and 12 on both sides of the adhesive layer 13 can be fixed, a force in a twisting direction may be applied to the adherends 11 and 12 to apply stress to the adhesive layer 13. Thereby, since the breaking strength of the adhesive layer 13 can be reduced, peeling can be performed even with the wire 21 having a shorter length.

  Although the application range of this invention is not specifically limited, For example, in the product by which the cover glass is bonded by the surface like a smart phone, it can utilize also for replacement | exchange of the cover glass damaged by the fall etc. FIG. In this case, a scattering prevention film is provided on the surface of the cover glass to prevent scattering of broken glass, and then the adhesive layer can be removed to peel off the cover glass. When the shatterproof film is provided on the product in advance, the work can be performed without separately providing the shatterproof film. Even if the anti-scattering film is not firmly attached to the cover glass, it is not necessary to forcibly bend the cover glass, so the cover glass is peeled off in a state where scattering of the broken glass is reduced, and the adhesive surface is cleaned after breakage. Parts can be replaced with new ones.

  The hardness of the material of the adhesive layer 13 is not particularly limited as long as it can be physically scraped by the wire 21. The material of the adhesive layer 13 may, for example, be a thermosetting resin, a moisture curing resin, or an ultraviolet curing resin. An adhesive which cures and hardens after bonding may be used, and a pressure-sensitive adhesive, a pressure-sensitive adhesive tape, or the like, which retains adhesiveness, can also be used. As a pressure-sensitive adhesive tape, a cored pressure-sensitive adhesive tape in which a pressure-sensitive adhesive layer is formed on both sides of a film substrate, or an optical pressure-sensitive adhesive tape having no core and only a pressure-sensitive adhesive layer can be used.

  The timing at which the adhesive layer 13 breaks varies depending on the material. Therefore, while adjusting the wire diameter of the wire 21, the speed and tension to move the wire 21, the area in which the wire 21 contacts the adhesive layer 13, etc., the friction between the wire 21 and the adhesive layer 13 is reduced to efficiently adhere. The bodies 11 and 12 can be peeled off.

  Although the present invention has been described above based on the preferred embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  Although the wire 21 may be disposable, it is preferable to reuse it by removing the adhering adhesive material. For example, the wire 21 may be wound around the wire winding portion 23 with the adhesive material attached, and then the wire 21 may be washed. Alternatively, a mechanism for cleaning the wire 21 may be provided between the bonded product 10 and the wire winding portion 23. Alternatively, the wire 21 after being in contact with the adhesive layer 13 may be cleaned, and the wire 21 may be circulated so as to be in contact with the adhesive layer 13 again. The cleaning of the wire 21 may use physical means such as heating, cooling, ultrasonic waves or the like, or chemical means such as an organic solvent or medicine.

Example 1
Two glass plates (100 mm in width × 150 mm in length) with a thickness of 2 mm were bonded without bubbles using an adhesive tape with a thickness of 100 μm. A straight wire with a diameter of 100 μm was tensioned, and the wire was brought into contact with the end face of the adhesive layer from a surface with a width of 100 mm. The adsorption jig was adsorbed to the glass surface from the front and back of the bonded product, and while the force was applied in the direction to separate the two glass plates, the wire was inserted in the adhesive layer while being moved in the longitudinal direction. Gradually adhered to the wire and was removed from the glass. When the wire or bonded product is operated so that the wire moves in the length direction of the bonded product (direction of 150 mm in length), the peeling speed gradually increases from about half the length of the glass plate, Before the wire reached the opposite surface on the insertion side, the adhesion between the glasses was lower than the adsorption force of the adsorption jig, and the two sheets of glass could be separated. The adhesive adhering to the surface of the glass could be removed cleanly by an organic solvent such as alcohol.

(Example 2)
When implemented in the same manner as in Example 1 except that the thickness of the adhesive tape was 150 μm, two sheets of glass were able to be separated.

(Example 3)
When it implemented similarly to Example 1 except the thickness of the adhesive tape having been 200 micrometers, two sheets of glass were able to be isolate | separated.

(Example 4)
When it implemented similarly to Example 1 except the thickness of the adhesive tape having been 250 micrometers, two sheets of glass were able to be isolate | separated.

(Example 5)
When it implemented similarly to Example 1 except the thickness of the adhesive tape having been 500 micrometers, two sheets of glass were able to be isolate | separated.

(Example 6)
When implemented in the same manner as in Example 1 except that the thickness of the adhesive tape was changed to 150 μm and the type of wire was changed from a straight wire to a corrugated wire, two sheets of glass were able to be separated. From the feeling that the wire was touched by hand, I felt that the stickiness was more than that of the straight wire used in Example 2. Moreover, compared with Example 2, the direction of glass of the corrugate wire in which the shape of the wire is helical was able to be separated early. These situations are considered to be due to the increase in the amount of adhesive adhering to the wire by using a helical wire, and the wire shape also affects the peeling rate.

(Example 7)
Two polycarbonate (PC) plates (width 100 mm × length 150 mm) having a thickness of 2 mm were bonded without bubbles with a pressure-sensitive adhesive tape having a thickness of 150 μm. A straight wire with a diameter of 100 μm was tensioned, and the wire was brought into contact with the end face of the adhesive layer from a surface with a width of 100 mm. The adsorption jig was adsorbed to the PC board from the front and back of the bonded product, and while applying force in the direction to separate the two PC boards, the wire was inserted into the adhesive layer while being moved in the longitudinal direction. Gradually adhered to the wire and was removed from between the PC boards. When the wire or bonded product is operated so that the wire moves in the length direction of the bonded product (direction of 150 mm in length), the peeling speed gradually increases from about half the length of the PC plate, Before the wire reached the opposite surface on the insertion side, the adhesive force between the PC plates was lower than the adsorption force of the adsorption jig, and the two PC plates could be separated. The adhesive adhering to the surface of the PC board could be removed cleanly by an organic solvent such as alcohol which does not affect the PC.

(Example 8)
When it carried out like Example 7 except having changed the kind of wire into a corrugated wire (wire diameter 100 micrometers), two PC boards were able to be isolate | separated.

(Example 9)
When carried out in the same manner as in Example 7 except that the thickness of the adhesive tape is 75 μm and the type of wire is changed from straight wire to corrugated wire (wire diameter 100 μm), two PC boards can be separated. The

(Comparative example 1)
When implemented in the same manner as in Example 1 except that the thickness of the adhesive tape was 50 μm, the wire did not enter the end face of the adhesive layer and the glass end face was damaged.

  The conditions of Examples 1 to 9 and Comparative Example 1 are summarized in Table 1.

DESCRIPTION OF SYMBOLS 10 ... Bonding product, 11, 12 ... material (adhesion body, member) with a thickness, 13 ... adhesion layer, 14 ... area | region (peeling part) where adhesion layer was removed, 20 ... peeling apparatus, 21 ... wire, 22: Wire feeding part, 23: Wire winding part, 24, 25, 26: Idler.

Claims (8)

A wire inserted into the adhesive layer of a bonded product in which a thick material is bonded via an adhesive layer;
A wire winding unit for winding the wire and moving the wire;
A driving unit for driving the wire winding unit to wind the wire around the wire winding unit;
And a control unit for controlling the position of the wire winding unit or the bonded product,
The control unit moves the wire from one end of the adhesive layer toward the inside or the other in order to separate the thick materials pasted through the adhesive layer. As such, the position of the wire winding unit or the bonded product is controlled ,
The diameter of the wire is smaller than the thickness of the adhesive layer,
When inserting the wire into the adhesive layer, peeling of a bonded product is characterized in that the planar shape of the adhesive layer has a corner, and the wire is inserted from at least one corner of the adhesive layer. apparatus.   The peeling apparatus of the bonding goods of Claim 1 provided with the movable stage for mounting the said bonding goods. The said wire is a thin wire, The peeling apparatus of the bonding goods of Claim 1 or 2 characterized by the above-mentioned. The length of the part in which the said wire contacts the said contact bonding layer between materials with the said thickness is shorter than the length of the longest diagonal of the said bonding goods, The any one of the Claims 1-3 characterized by the above-mentioned. The peeling apparatus of the bonding goods as described in. Insert a wire into the adhesive layer of the bonded product in which a thick material is bonded via the adhesive layer,
In order to separate the thick materials pasted together via the adhesive layer, the wire is moved from one end of the adhesive layer toward the inside or the other, Having a step of winding on the wire winding section ;
The diameter of the wire is smaller than the thickness of the adhesive layer,
When inserting the wire into the adhesive layer, peeling of a bonded product is characterized in that the planar shape of the adhesive layer has a corner, and the wire is inserted from at least one corner of the adhesive layer. Method. The method for peeling a bonded product according to claim 5 , wherein the bonded product is placed on a movable stage. The method for peeling a bonded product according to claim 5 or 6 , wherein the wire is a fine wire. The length of the portion where the wire is in contact with the adhesive layer between the materials each other with the thick, any one of claims 5-7, characterized in that less than the length of the longest diagonal of the bonding products The peeling method of the bonding goods as described in.

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