JP6504182B2 - Electronic parts - Google Patents

Description

  The present invention relates to an electronic component, and more particularly to an electronic component provided with a plurality of LC parallel resonators.

  As an invention relating to a conventional electronic component, for example, a multilayer band pass filter described in Patent Document 1 is known. The laminated band pass filter comprises four LC parallel resonators. The LC parallel resonators are aligned in the left-right direction and magnetically coupled to each other. The multilayer band pass filter configured as described above functions as a band pass filter.

  In addition, in the variation of the multilayer band pass filter, a capacitor connected between two LC parallel resonators provided at both ends is added. Thereby, the frequency of the attenuation pole can be adjusted.

  By the way, in the multilayer band pass filter described in Patent Document 1, it is difficult to obtain desired pass characteristics. More specifically, in a laminated band pass filter, the frequency of all attenuation poles changes as capacitors are added. As a result, it is difficult to obtain desired pass characteristics in the laminated band pass filter.

WO 2007/119356 (especially, FIGS. 46 and 47)

  Therefore, an object of the present invention is to provide an electronic component that can easily obtain desired passage characteristics.

The electronic component according to an aspect of the present invention is a stacked body in which a plurality of insulator layers are stacked in a stacking direction, and two first LC parallel resonators aligned in an orthogonal direction orthogonal to the stacking direction. Two first LC parallel resonators each including a first inductor and a first capacitor, and the two first LC parallel resonators disposed on both sides of the orthogonal direction so as to sandwich the two first LC parallel resonators Two second LC parallel resonators, each comprising a second inductor and a second capacitor, and the two second LC parallel resonators A third capacitor connected to one end of the second LC parallel resonator and the two first LC parallel resonators not adjacent in the orthogonal direction, or the first LC parallel not adjacent in the orthogonal direction Resonator and second LC parallel resonator A first connecting conductor that connects the two LC parallel resonators, and wherein the two first LC parallel resonator and the two second LC parallel resonator, next to the perpendicular direction The band pass filter is configured by magnetic field coupling between the matching members, and the first connection conductor is positioned on one side in the orthogonal direction of the two first LC parallel resonators. A first LC parallel resonator and the second LC parallel resonator located on the other side of the orthogonal direction of the two second LC parallel resonators are connected, and the electronic component comprises two The first LC parallel resonator located on the other side of the orthogonal direction in the first LC parallel resonator and the one on the orthogonal direction among the two LC parallel resonators A second connection conductor connecting the second LC parallel resonator The first connection conductor and the second connection conductor are conductor layers provided on the insulator layer, and the first connection conductor and the second connection conductor are When viewed in plan from the stacking direction, they intersect .

  According to the present invention, desired passage characteristics can be easily obtained.

It is an equivalent circuit schematic of the electronic component 10a which concerns on 1st Embodiment. It is an appearance perspective view of electronic parts 10a-10e. It is a disassembled perspective view of the electronic component 10a. It is the figure which saw through the electronic component 10a from the upper side. It is the graph which showed the passage characteristic (S21) of the 1st model. It is the graph which showed the passage characteristic (S21) of the 2nd model. It is the graph which showed the passage characteristic (S21) of the 3rd model. It is an equivalent circuit schematic of the electronic component 10b which concerns on 2nd Embodiment. It is an exploded perspective view of electronic parts 10b. It is a disassembled perspective view of the electronic component 10c. It is an equivalent circuit schematic of the electronic component 10d. It is an equivalent circuit schematic of the electronic component 10e.

First Embodiment
Hereinafter, an electronic component according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an equivalent circuit diagram of the electronic component 10 a according to the first embodiment.

  First, an equivalent circuit of the electronic component 10a will be described with reference to the drawings. As shown in FIG. 1, the electronic component 10a includes inductors L1 to L4, L11 and L12, capacitors C1 to C4 and C11, and external electrodes 14a to 14c as a configuration of an equivalent circuit, and high frequency signals of a predetermined band are It is a band pass filter to pass.

  The external electrodes 14a and 14b are input / output terminals for inputting and outputting high frequency signals. The external electrode 14c is a ground terminal that is grounded.

  The inductor L1 (an example of the second inductor) and the capacitor C1 (an example of the second capacitor) are connected in parallel to each other, and form an LC parallel resonator LC1 (an example of the second LC parallel resonator) doing. The resonant frequency of the LC parallel resonator LC1 is f1. The inductor L2 (an example of the first inductor) and the capacitor C2 (an example of the first capacitor) are connected in parallel with each other to form an LC parallel resonator LC2 (an example of the first LC parallel resonator) doing. The resonant frequency of the LC parallel resonator LC2 is f2. The inductor L3 (an example of the first inductor) and the capacitor C3 (an example of the first capacitor) are connected in parallel with each other, and form an LC parallel resonator LC3 (an example of the first LC parallel resonator) doing. The resonant frequency of the LC parallel resonator LC3 is f3. The inductor L4 (an example of the second inductor) and the capacitor C4 (an example of the second capacitor) are connected in parallel to each other, and form an LC parallel resonator LC4 (an example of the second LC parallel resonator) doing. The resonant frequency of the LC parallel resonator LC4 is f4.

  One end of the LC parallel resonator LC1 is connected to the external electrode 14a. One end of the LC parallel resonator LC4 is connected to the external electrode 14b. Furthermore, the LC parallel resonators LC1 to LC4 are arranged in this order between the outer electrode 14a and the outer electrode 14b. The LC parallel resonators LC <b> 1 to LC <b> 4 are magnetically coupled to each other, and the LC parallel resonators LC <b> 1 to LC <b> 4 constitute band pass filters. The other ends of the LC parallel resonators LC1 to LC4 are connected to the external electrode 14c.

  The capacitor C11 is connected between the one end of the LC parallel resonator LC1 and one end of the LC parallel resonator LC4 by being connected between the outer electrode 14a and the outer electrode 14b.

  The inductor L11 connects the inductor L1 (LC parallel resonator LC1) and the inductor L3 (LC parallel resonator LC3) which are not adjacent to each other. The inductor L12 connects the inductor L2 (LC parallel resonator LC2) and the inductor L4 (LC parallel resonator LC4) not adjacent to each other.

  The electronic component 10a configured as described above constitutes a band pass filter that passes high frequency signals of frequencies near f1 to f4 from the external electrode 14a to the external electrode 14b. More specifically, the impedance values of the LC parallel resonators LC1 to LC4 become maximum when high frequency signals near f1 to f4 are input from the external electrode 14a. Therefore, high frequency signals of frequencies near f1 to f4 can not pass through the LC parallel resonators LC1 to LC4, and thus are not output from the external electrode 14c. As a result, high frequency signals of frequencies near f1 to f4 are output from the external electrode 14b. In addition, high frequency signals other than frequencies near f1 to f4 pass through the LC parallel resonators LC1 to LC4 and are output from the external electrode 14c.

  Next, the specific configuration of the electronic component 10a will be described with reference to the drawings. FIG. 2 is an external perspective view of the electronic component 10a. FIG. 3A is an exploded perspective view of the electronic component 10a. FIG. 3B is a perspective view of the electronic component 10a from above. In FIG. 3B, only the stacked body 12, the inductor conductive layers 18a to 18d, and the via hole conductors v1 to v8 are shown. Hereinafter, the stacking direction of the electronic component 10a is defined as the vertical direction (the lower side is an example of one side in the stacking direction, and the upper side is an example of the other side in the stacking direction). When the electronic component 10a is viewed in plan from the upper side, the direction in which the long side of the electronic component 10a extends is the left-right direction (an example of the orthogonal direction / right side is an example of one side in the orthogonal direction; And the direction in which the short side of the electronic component 10a extends is defined as the front-rear direction. The up-down direction, the front-rear direction, and the left-right direction are orthogonal to one another.

  The electronic component 10a includes the laminate 12, the external electrodes 14a to 14c, the inductor conductive layers 18a to 18d, the capacitor conductive layers 20a to 20d, 22, the ground conductive layer 21, the connecting conductive layers 30a, 30b, and the via hole conductors v1 to v8, v11. , V12, v21 to v26 (an example of interlayer connection conductors).

  The laminated body 12 has a rectangular parallelepiped shape, and is formed by laminating the insulator layers 16 a to 16 i in this order from the upper side to the lower side. The insulator layers 16a to 16i have a rectangular shape when viewed in plan from the upper side, and are made of, for example, a ceramic or the like. Hereinafter, the upper main surface of the insulator layers 16a to 16i is referred to as a surface, and the lower main surface of the insulator layers 16a to 16i is referred to as a back surface.

  The inductor conductive layers 18a to 18d are strip-shaped conductive layers provided on the surface of the insulator layer 16b, and extend in the front-rear direction of the insulator layer 16b.

  The via hole conductor v1 (an example of a third interlayer connection conductor) penetrates the insulator layers 16b to 16g in the top-bottom direction. The upper end of the via hole conductor v1 is connected to the front end of the inductor conductive layer 18a. Thus, the via hole conductor v1 extends downward from the inductor conductive layer 18a.

  The via hole conductor v2 (an example of a fourth interlayer connecting conductor) penetrates the insulator layers 16b to 16f in the top-bottom direction. The upper end of the via hole conductor v2 is connected to the rear end of the inductor conductive layer 18a.

  The inductor conductor layer 18a (an example of the second inductor conductor layer) and the via hole conductors v1 and v2 configured as described above are included in the inductor L1. Thus, the inductor L1 has an angular U-shape opening downward when viewed in plan from the left side.

  Capacitor conductor layers 20a and 20d (an example of a second capacitor conductor layer) are strip-shaped conductor layers provided on the surface of insulator layer 16h. Capacitor conductor layers 20a and 20d extend in the front-rear direction in the vicinity of the left and right short sides of insulator layer 16h.

  The ground conductor layer 21 (an example of a first ground conductor layer and a second ground conductor layer) is a rectangular conductor layer provided on the surface of the insulator layer 16g. The ground conductor layer 21 covers substantially the entire surface of the insulator layer 16g. Thereby, the capacitor | condenser conductor layer 20a is facing the grand conductor layer 21 via the insulator layer 16g. However, the front right corner and the front left corner of the ground conductor layer 21 are cut away for the via hole conductors v1 and v7 to pass through.

  The capacitor conductor layer 20a and the ground conductor layer 21 configured as described above are included in the capacitor C1. The lower end of the via hole conductor v1 is connected to the capacitor conductor layer 20a. The lower end of the via hole conductor v2 is connected to the ground conductor layer 21. Thus, the inductor L1 and the capacitor C1 are connected in parallel with each other to constitute an LC parallel resonator LC1.

  The via hole conductors v <b> 3 and v <b> 5 (an example of a second interlayer connection conductor) pass through the insulator layers 16 b to 16 i in the top-bottom direction. The upper end of the via hole conductor v3 is connected to the front end of the inductor conductive layer 18b. The upper end of the via hole conductor v5 is connected to the front end of the inductor conductive layer 18c.

  The via hole conductors v4 and v6 (an example of the first interlayer connection conductor) penetrate the insulator layers 16b to 16e in the top-bottom direction. The upper end of the via hole conductor v4 is connected to the rear end of the inductor conductive layer 18b. The upper end of the via hole conductor v6 is connected to the rear end of the inductor conductive layer 18c.

  The inductor conductive layer 18b (an example of the first inductor conductive layer) and the via hole conductors v3 and v4 configured as described above are included in the inductor L2. Thus, the inductor L2 has an angular U-shape opening downward when viewed in plan from the left side. Similarly, the inductor conductive layer 18c (an example of a first inductor conductive layer) and the via hole conductors v5 and v6 are included in the inductor L3. Thus, the inductor L3 has an angular U-shape that opens downward when viewed in plan from the left side.

  Capacitor conductor layers 20b and 20c (an example of a first capacitor conductor layer) are rectangular conductor layers provided on the surface of insulator layer 16f. The capacitor conductor layers 20b and 20c are provided adjacent to the center of the rear long side of the insulator layer 16f and are opposed to the ground conductor layer 21 via the insulator layer 16f.

  The capacitor conductive layer 20b and the ground conductive layer 21 configured as described above are included in the capacitor C2. The lower end of the via hole conductor v3 is connected to the ground conductor layer 21. The lower end of the via hole conductor v4 is connected to the capacitor conductor layer 20b. Thus, the inductor L2 and the capacitor C2 are connected in parallel with each other to constitute an LC parallel resonator LC2. The LC parallel resonator LC2 is located on the right side of the LC parallel resonator LC1. The capacitor conductor layer 20 and the ground conductor layer 21 are included in the capacitor C3. The lower end of the via hole conductor v5 is connected to the ground conductor layer 21. The lower end of the via hole conductor v6 is connected to the capacitor conductor layer 20c. Thus, the inductor L3 and the capacitor C3 are connected in parallel with each other to constitute an LC parallel resonator LC3. The LC parallel resonator LC3 is located on the left side with respect to the LC parallel resonator LC4.

  The via hole conductor v7 (an example of a third interlayer connection conductor) penetrates the insulator layers 16b to 16g in the top-bottom direction. The upper end of the via hole conductor v7 is connected to the front end of the inductor conductive layer 18d.

  The via hole conductor v <b> 8 (an example of a fourth interlayer connection conductor) penetrates the insulator layers 16 b to 16 f in the top-bottom direction. The upper end of the via hole conductor v8 is connected to the rear end of the inductor conductive layer 18d. Thus, the via hole conductor v8 extends downward from the inductor conductive layer 18d.

  The inductor conductor layer 18d (an example of the second inductor conductor layer) and the via hole conductors v7 and v8 configured as described above are included in the inductor L4. Thus, the inductor L4 has an angular U-shape opening downward when viewed in plan from the left side.

  The capacitor conductor layer 20d and the ground conductor layer 21 configured as described above are included in the capacitor C4. The lower end of the via hole conductor v7 is connected to the capacitor conductor layer 20d. The lower end of the via hole conductor v <b> 8 is connected to the ground conductor layer 21. Thus, the inductor L4 and the capacitor C4 are connected in parallel with each other to constitute an LC parallel resonator LC4.

  The LC parallel resonators LC1 to LC4 configured as described above are loop surfaces S1 to S4 surrounded by the inductors L1 to L4 and the capacitors C1 to C4 as shown in FIG. The loop surfaces S1 to S4 parallel to each other are formed. Each loop surface is a plane passing through the lateral direction of each inductor conductive layer.

  The via hole conductors v21 to v26 pass through the insulator layers 16g to 16i in the top-bottom direction. The upper ends of the via hole conductors v21 to v26 are connected to the ground conductor layer 21. The lower ends of the via hole conductors v21 to v26 are connected to the external electrode 14c. Thus, the LC parallel resonators LC1 to LC4 are connected to the external electrode 14c.

  The LC parallel resonators LC1 to LC4 configured as described above are arranged in this order from left to right.

  Therefore, the loop surfaces S1 to S4 of the LC parallel resonators LC1 to LC4 are opposed to each other in the left-right direction. Specifically, the loop surface S1 (an example of a second loop surface) and the loop surface S2 (an example of a first loop surface) are opposed to each other. The loop surface S2 and the loop surface S3 (an example of a first loop surface) face each other. The loop surface S3 and the loop surface S4 (an example of a fourth loop surface) face each other. Thus, the LC parallel resonators LC1 to LC4 form a band pass filter by performing magnetic field coupling between adjacent ones in the left-right direction.

  The capacitor conductor layer 22 is a strip-shaped conductor layer provided on the surface of the insulator layer 16 e. The capacitor conductor layer 22 extends in the left-right direction near the front long side of the insulator layer 16e. Thus, the capacitor conductor layer 22 overlaps the front ends of the capacitor conductor layers 20a and 20d when viewed from above. Thus, the capacitor C11 is formed between the capacitor conductor layer 20a and the capacitor conductor layer 20d via the capacitor conductor layer 22. The capacitor conductor layer 22 does not overlap with the inductor conductor layers 18 a to 18 d or the ground conductor layer 21 in a plan view.

  The connection conductor layer 30a (an example of a first connection conductor) is a linear conductor layer provided on the surface of the insulator layer 16c. The connecting conductor layer 30a connects two inductors (LC parallel resonators) of an inductor L1 (LC parallel resonator LC1) and an inductor L3 (LC parallel resonator LC3) not adjacent to each other in the left-right direction. That is, the connecting conductor layer 30a includes the inductor L1 (LC parallel resonator LC1) located on the left side among the inductors L1 and L4 (LC parallel resonators LC1 and LC4), and the inductors L2 and L3 (LC parallel resonator LC2, The inductor L3 (LC parallel resonator LC3) located on the right side in LC3) is connected. The front end of the connection conductor layer 30a is connected to the via hole conductor v5. The rear end of the connection conductor layer 30a is connected to the via hole conductor v2. The connection conductor layer 30a is included in the inductor L11.

  The connection conductor layer 30 b (an example of a second connection conductor) is a linear conductor layer provided on the surface of the insulator layer 16 d. The connecting conductor layer 30 b connects two inductors (LC parallel resonators) of the inductor L 2 (LC parallel resonator LC 2) and the inductor L 4 (LC parallel resonator LC 4) not adjacent to each other in the left-right direction. That is, the connecting conductor layer 30b includes the inductor L4 (LC parallel resonator LC4) located on the right side among the inductors L1 and L4 (LC parallel resonators LC1 and LC4), and the inductors L2 and L3 (LC parallel resonator LC2, The inductor L2 (LC parallel resonator LC2) located on the left side in LC3) is connected. The front end of the connection conductor layer 30b is connected to the via hole conductor v3. The rear end of the connection conductor layer 30b is connected to the via hole conductor v8. The connection conductor layer 30b is included in the inductor L12.

  The connection conductor layer 30a and the connection conductor layer 30b intersect when viewed in plan from the upper side. Thus, the connection conductor layer 30a and the connection conductor layer 30b are magnetically coupled.

(effect)
According to the electronic component 10 a according to the present embodiment, desired pass characteristics can be easily obtained. The following description will be made with reference to the drawings. FIG. 4 is a graph showing the pass characteristic (S21) of the first model. FIG. 5 is a graph showing the pass characteristic (S21) of the second model. FIG. 6 is a graph showing the pass characteristic (S21) of the third model. The vertical axes of FIGS. 4 to 6 indicate | S 21 |, and the horizontal axes of FIGS. 4 to 6 indicate frequencies. S21 is the value of the ratio of the intensity of the high frequency signal output from the external electrode 14b to the intensity of the high frequency signal input from the external electrode 14a.

  The inventor of the present application created the first to third models described below, and calculated the pass characteristics of each model by computer simulation. The first model is a model in which the connecting conductor layers 30a and 30b are removed in the electronic component 10a and the line width of the capacitor conductive layer 22 is increased or the capacitor conductive layer 22 is positioned below the electronic component 10a. is there. The second model is a model obtained by removing the connecting conductor layers 30a and 30b in the electronic component 10a. The third model is a model of the electronic component 10a. The line width of the capacitor conductor layer 22 of the second model and the line width of the capacitor conductor layer 22 of the third model are equal. The first model and the second model are models according to the comparative example.

  The pass characteristic of the first model is the characteristic shown in FIG. In the pass characteristic of the first model, attenuation poles P1 and P2 are formed at frequencies lower than the pass band, and attenuation poles P3 and P4 are formed at frequencies higher than the pass band. In such a first model, there is a demand to increase the amount of attenuation at the attenuation poles P1 to P4 to obtain a passing characteristic that rises sharply and falls sharply at both ends of the pass band.

  Therefore, it is conceivable to make the line width of the capacitor conductor layer 22 of the second model smaller than the line width of the capacitor conductor layer 22 of the first model, or to position the capacitor conductor layer 22 on the lower side. Thereby, the capacitance value of the capacitor C11 is reduced. As a result, as shown in FIG. 5, the attenuation pole at the attenuation pole P3 becomes large, and the pass characteristic falls sharply on the high frequency side of the pass band.

  However, when the capacitance value of the capacitor C11 decreases, as shown in FIG. 5, the attenuation pole P1 and the attenuation pole P2 approach each other. As a result, the attenuation poles P1 and P2 disappear and the waveform becomes dull. Therefore, the pass characteristic does not rise sharply on the low frequency side of the pass band.

  Therefore, in the third model, connection conductor layers 30a and 30b are provided. Thereby, the LC parallel resonator LC1 and the LC parallel resonator LC3 are magnetically coupled, and the LC parallel resonator LC2 and the LC parallel resonator LC4 are magnetically coupled. As a result, the attenuation pole P1 and the attenuation pole P2 are separated, and the attenuation poles P1 and P2 appear, without changing the positional relationship between the attenuation pole P3 and the attenuation pole P4. Furthermore, the amount of attenuation at the attenuation pole P1 of the third model is larger than the amount of attenuation at the attenuation poles P1 and P2 of the first model. That is, in the third model, the pass characteristics that rise sharply and fall sharply at both ends of the pass band are obtained.

  As described above, by adjusting the capacitance value of the capacitor C11 and providing the connecting conductor layers 30a and 30b, the attenuation amount and the frequency of each of the attenuation poles P1 to P4 formed at both ends of the passband are adjusted. Is possible. As a result, according to the electronic component 10a, it becomes easy to obtain desired passage characteristics.

  Further, in the electronic component 10a, the connection conductor layers 30a and 30b overlap each other when viewed from above. As a result, magnetic field coupling and electric field coupling easily occur between the connecting conductor layers 30a and 30b. Therefore, magnetic field coupling and electric field coupling can be adjusted by adjusting the area where the connecting conductor layer 30a and the connecting conductor layer 30b overlap. As a result, the pass characteristic of the electronic component 10a can be adjusted.

Second Embodiment
An electronic component according to the second embodiment will be described below with reference to the drawings. FIG. 7 is an equivalent circuit diagram of the electronic component 10b according to the second embodiment. FIG. 8 is an exploded perspective view of the electronic component 10b.

  The electronic component 10b is different from the electronic component 10a in that the inductor L12 (connection conductor layer 30b) is not provided as shown in FIGS. 7 and 8. Thus, any one of the inductor L11 (connection conductor layer 30a) and the inductor L12 (connection conductor layer 30b) may be provided.

  Also in the electronic component 10 b configured as described above, the same function and effect as the electronic component 10 a can be obtained.

Third Embodiment
An electronic component according to the third embodiment will be described below with reference to the drawings. FIG. 9 is an exploded perspective view of the electronic component 10c.

  As shown in FIG. 9, the electronic component 10c does not intersect the connecting conductor layer 30a and the connecting conductor layer 30b in plan view from the upper side, and the electronic component 10a in the direction of the LC parallel resonator LC3. It is different from. As described above, in the case where the connection conductor layer 30a and the connection conductor layer 30b do not want to strongly couple magnetic field and electric field, it is not necessary to cross the connection conductor layers 30a and 30b.

  Also in the electronic component 10c configured as described above, the same function and effect as the electronic component 10a can be obtained.

Fourth Embodiment
An electronic component according to the fourth embodiment will be described below with reference to the drawings. FIG. 10 is an equivalent circuit diagram of the electronic component 10d.

  The electronic component 10d is different from the electronic component 10a in that a capacitor C12 is provided instead of the inductor L12 as shown in FIG.

  Also in the electronic component 10d configured as described above, the same function and effect as the electronic component 10a can be obtained.

Fifth Embodiment
An electronic component according to the fifth embodiment will be described below with reference to the drawings. FIG. 11 is an equivalent circuit diagram of the electronic component 10e.

  The electronic component 10e is different from the electronic component 10a in that the electronic component 10e includes LC parallel resonators LC1 to LC5 as shown in FIG. Thus, the electronic component 10e may include five or more LC parallel resonators.

  In the electronic component 10e, the inductor L13 connects two LC parallel resonators LC2 and LC parallel resonators LC4 which are not adjacent to each other in the left-right direction.

  Also in the electronic component 10 e configured as described above, the same function and effect as the electronic component 10 a can be obtained.

  In the electronic component 10e, for example, the inductor L13 may be connected to two LC parallel resonators not adjacent to each other in the left-right direction. Therefore, the inductor L13 may connect the LC parallel resonator LC1 and the LC parallel resonator LC3, or may connect the LC parallel resonator LC1 and the LC parallel resonator LC4. The inductor L13 may connect the LC parallel resonator LC2 and the LC parallel resonator LC5, or may connect the LC parallel resonator LC3 and the LC parallel resonator LC5.

  Therefore, inductor L13 connects two LC parallel resonators LC2 to LC4 not adjacent to each other in the left and right direction among LC parallel resonators LC2 to LC4, or in the left and right direction among LC parallel resonators LC1 to LC5. Two LC parallel resonators may be connected: one of the LC parallel resonators LC1 and LC5 not adjacent to one another and one of the LC parallel resonators LC2 to LC4. However, the inductor L13 should not connect the LC parallel resonator LC1 and the LC parallel resonator LC5 located at both ends.

(Other embodiments)
The electronic component according to the present invention is not limited to the electronic components 10a to 10e, but can be changed within the scope of the invention.

  The configurations of the electronic components 10a to 10e may be arbitrarily combined.

  The loop surfaces S1 to S4 may not be parallel to one another.

  As described above, the present invention is useful for electronic components, and is particularly excellent in that desired passing characteristics can be easily obtained.

10a to 10e: electronic components 12: laminates 14a to 14c: external electrodes 16a to 16i: insulator layers 18a to 18d: inductor conductor layers 20a to 20d, 22: capacitor conductor layers 21: ground conductor layers 30a, 30b: connection conductors Layers C1 to C5, C11 and C12: capacitors L1 to L5, L11 to L13: inductors LC1 to LC5: LC parallel resonators S1 to S4: loop surfaces v1 to v8, v11, v12, v21 to v26: via hole conductors

Claims (5)

A laminate in which a plurality of insulator layers are stacked in the stacking direction;
A two first LC parallel resonator arranged in an orthogonal direction orthogonal to the stacking direction, and the each of the two containing the first inductor and the first capacitor 1 of the LC parallel resonator,
Two second LC parallel resonators arranged to sandwich the two first LC parallel resonators from both sides in the orthogonal direction, each including a second inductor and a second capacitor Two second LC parallel resonators,
A third capacitor connected to one end of the two second LC parallel resonators;
2 of the first LC parallel resonator and the second LC parallel resonator which connect the two first LC parallel resonators which are not adjacent to each other in the orthogonal direction or which are not adjacent to each other in the orthogonal direction A first connection conductor connecting two LC parallel resonators,
Equipped with
The two first LC parallel resonator and the two second LC parallel resonator by magnetic field coupling adjacent groups in the orthogonal direction constitutes a band-pass filter,
The first connection conductor includes one of the first LC parallel resonators and one of the second LC parallel resonators located on one side in the orthogonal direction of the two first LC parallel resonators. Connecting the second LC parallel resonator located on the other side of the orthogonal direction in the
The electronic component is
One side of the first LC parallel resonator located on the other side of the orthogonal direction of the two first LC parallel resonators and one side of the orthogonal direction of the second LC parallel resonators A second connection conductor connecting the second LC parallel resonator located at
Further equipped,
The first connection conductor and the second connection conductor are conductor layers provided on the insulator layer,
The first connection conductor and the second connection conductor intersect when viewed in plan from the stacking direction,
Electronic parts characterized by Each of the first LC parallel resonators is a loop surface surrounded by the first inductor and the first capacitor, and forms a first loop surface substantially parallel to the stacking direction. Yes,
Each of the second LC parallel resonators is a loop surface surrounded by the second inductor and the second capacitor, and forms a second loop surface substantially parallel to the stacking direction. To be
Electronic component according to claim 1, wherein the. The first inductor includes a first interlayer connecting conductor and a second interlayer connecting conductor penetrating the insulator layer in the stacking direction, and a first inductor conductor layer provided on the insulator layer. And contains
The first interlayer connection conductor and the second interlayer connection conductor extend from the first inductor conductor layer toward one side in the stacking direction,
The second inductor includes a third interlayer connecting conductor and a fourth interlayer connecting conductor which penetrate the insulator layer in the stacking direction, and a second inductor conductor layer provided on the insulator layer. And contains
The third interlayer connection conductor and the fourth interlayer connection conductor extend from the second inductor conductor layer toward one side in the stacking direction.
The electronic component according to claim 2 , characterized in that The first capacitor is composed of a first capacitor conductor layer and a first ground conductor layer facing each other through the insulator layer,
The second capacitor is constituted of a second capacitor conductor layer and a second ground conductor layer opposed to each other through the insulator layer,
The first interlayer connection conductor is connected to the first capacitor conductor layer,
The second interlayer connection conductor is connected to the first ground conductor layer,
The third interlayer connection conductor is connected to the second capacitor conductor layer,
The fourth interlayer connection conductor is connected to the second ground conductor layer.
The electronic component according to claim 3 , characterized in that Two or more of the first loop surface and two of the second loop surfaces are opposed to each other in the orthogonal direction,
The electronic component according to any one of claims 2 to 4 , characterized by

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