JP6502319B2 - 高密度分子アレイ、特にペプチドアレイを作製する組み合わせ粒子操作の方法、及びそれを用いて得ることができる分子アレイ - Google Patents
高密度分子アレイ、特にペプチドアレイを作製する組み合わせ粒子操作の方法、及びそれを用いて得ることができる分子アレイ Download PDFInfo
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- LYGJENNIWJXYER-UHFFFAOYSA-N nitromethane Chemical compound C[N+]([O-])=O LYGJENNIWJXYER-UHFFFAOYSA-N 0.000 description 1
- 239000002773 nucleotide Substances 0.000 description 1
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- 238000002515 oligonucleotide synthesis Methods 0.000 description 1
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- 150000002482 oligosaccharides Chemical class 0.000 description 1
- 230000003204 osmotic effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000008300 phosphoramidites Chemical class 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000005373 porous glass Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000000015 trinitrotoluene Substances 0.000 description 1
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Description
(i)複数の個別のスポットを有する標的基板を準備する工程、
(ii)選択されたスポットを電磁放射の選択的かつ直接的な作用によって調整する工程、及び
(iii)少なくとも1つのモノマーと固定化形態で存在する反応物とを前記標的基板の選択されたスポットにおいて反応させる工程、
を含む、方法が提供される。
粒子を規定の部位に固定すること及び/又は電磁放射により粒子を規定の部位に転写すること、又は、
これらの部位へのアクセスを可能にするために電磁放射により規定の部位の粒子を除去すること、
によって粒子に直接影響を与え、それによりパターニングすることで達成される。
直径4.2±0.11μmの市販のポリスチレン粒子(図3A参照)を、水性懸濁液中で、パターニングした基板にアプライした(図3B参照)。基板はフォトレジストSU−8をリソグラフィー方法によってパターニングしたガラスウエハーである。円筒形ウェルの規則的パターンを作製した。ウェルの直径は6μmであり、中点間距離(ピッチとも呼ばれる)は10μmである。ウェルは、ガラスウエハー上のSU−8層の厚さに相当する深さが約17μmである。図3Dに見られるように、基板のウェルを確実にポリスチレン粒子で満たす。この場合、パルスレーザーを用いて構造を選択的に空にすることが可能である(セクション2参照)。
直径10μmの市販の赤色着色ポリスチレン粒子を、水性懸濁液中で、パターニングした基板にアプライした(図4A参照)。基板はフォトレジストSU−8をリソグラフィー方法によってパターニングしたガラスウエハーである。直径20μm、ピッチ50μm及び深さ約40μmの円筒形ウェルの規則的パターンを作製した。ウェルの直径及び深さが粒子の直径よりも顕著に大きいため、幾つかの粒子が各々のウェルに存在する。図4Bに見られるように、文字「KIT」が現れるようにパルスレーザーを用いて一部のウェルを選択的に空にした。次の工程では、青色着色ポリスチレン粒子(直径10μm)を水性懸濁液からアプライした。赤色のポリスチレン粒子は遮断粒子として作用し、青色の粒子が堆積するのを防ぐため、青色の粒子を開放ウェルにのみ堆積させることができた(図4C及び図4D参照)。
スチレン−アクリレートコポリマー及びグラファイトナノ粒子からなるモノマー粒子(平均径約8.8μm)を、ポリジメチルシロキサン(PDMS)基板上にエアロゾルから堆積させた。この基板は出発基板となり、僅かな機械的圧力でガラス標的基板と接触させた。レーザー(波長810nm、出力最大100mW、焦点径7.5μm)を使用して、いずれの場合にも10msにわたって特定の領域を選択的に加熱した(図5A参照)。図5Bに見られるように、融解領域は2つの基板の分離後も標的担体上に残る。第2の出発基板を用いてこれらの工程を首尾よく繰り返した(図5C及び図5D)。合計で約85%の照射スポットがこれにより転写された。
スチレン−アクリレートコポリマー及びグラファイトナノ粒子のモノマー粒子(平均径約8.8μm)を、エアロゾルからガラス出発基板にアプライした。エアロゾル発生装置において生じる摩擦のために粒子が荷電した。次いで、ガラス標的基板を出発基板に対して約160μmの距離で並行に位置付けた。電場を印加することにより、一部の粒子が標的基板へと転写され、それにより密閉粒子層がその上に形成された。レーザーを用いて、粒子層の特定の領域を選択的に照射した(図7A参照)。次いで、圧縮空気を使用して標的基板上の粒子層を除去した。粒子層の加熱領域が標的基板上に残った(図7B参照)。この原理を、標的基板の異なる領域を照射して2回繰り返すことができた。
レーザーを用いて基板上にパターニングしたアミノ酸粒子を用いてペプチドを合成することができることを実験によって示すことが可能であった。
材料をモノマーフィルムから転写するために図12の図解に示される手順に従った。図12とは対照的に、この実験におけるレーザーは標的基板の後ろに位置付けたため、レーザービームは標的基板を介して出発基板に作用した。さらに、中間層はこの実験に使用しなかった。
この実験において、レーザーを用いて粒子をパターニングした出発基板からパターニングした標的基板へと目的に適って転写することが可能であることが示された。基板は、フォトレジスト(フォトレジストSU−8)をリソグラフィー方法によってパターニングしたガラスウエハーである。円筒形ウェルの規則的パターンを作製した(図11A参照)。ウェルの直径は70μmであり、中点間距離(ピッチ)は100μmである。ウェルは、ガラスウエハー上のフォトレジスト層の厚さに相当する深さが約40μmである。出発基板のウェルを、ドクターブレードを用いてスチレン−アクリレートコポリマー及び2%グラファイト(平均径2.5μm、噴霧乾燥によって作製)で満たし、基板表面から過剰な粒子を除いた(図11B参照)。出発基板を標的基板上に位置付け、2つのホールマトリクスを整列させた。次いで、5×5ウェルをパルスレーザー(波長532nm、パルスエネルギー約50μJ、パルス幅約10ns)で上から処理した。出発基板のウェルをそれにより部分的に空にし(図11C参照)、標的基板のウェルを満たした(図11D参照)。
アミノ酸配列Tyr−Pro−Tyr−Asp−Val−Pro−Asp−Tyr−Ala(血球凝集素又はHA)及びAsp−Tyr−Lys−Asp−Asp−Asp−Asp−Lys(FLAG)を有し、ピッチが150μmのペプチドアレイを合成するために図12に示される図解に従う手順に従った。
モノマー粒子層で覆われたガラス出発基板をレーザーパルス(波長532nm、パルスエネルギー約50μJ、パルス幅約10ns)に供した。層のモノマー粒子をこれにより除去することができた(図10A参照)。約170μmの距離で配置した第2のガラス標本スライドを、粒子を再度堆積する標的基板とした(図10B参照)。
Claims (10)
- ピッチが300μm以下の高密度分子アレイを作製する方法であって、
(i)複数の個別のスポットを有する標的基板を準備する工程、
(ii)前記標的基板の選択されたスポットを電磁放射によって調整する工程、及び
(iii)少なくとも1つのモノマーと固定化形態で存在する反応物とを前記標的基板の選択されたスポットにおいて反応させる工程、
を含み、
前記少なくとも1つのモノマーが存在するフィルム層を有する少なくとも1つの出発基板を準備し、
選択されたスポットを調整する工程(ii)が、該出発基板から前記標的基板への該少なくとも1つのモノマーの材料の選択的転写及び該標的基板への該材料の部位特異的固定を含み、
該選択的転写及び/又は部位特異的固定が、レーザー光を含む電磁放射により行われ、
前記出発基板と前記フィルム層との間に、前記材料の前記選択的転写を助ける1つ又は複数の中間層が配置され、
前記出発基板から前記標的基板への前記材料の前記選択的転写及び前記部位特異的固定が、基板間の直接的な接触なしに行われ、
前記材料の前記選択的転写が、液体又は気体形態で行われる、方法。 - ピッチが300μm以下の高密度分子アレイを作製する方法であって、
(i)複数の個別のスポットを有する標的基板を準備する工程、
(ii)前記標的基板の選択されたスポットを電磁放射によって調整する工程、及び
(iii)少なくとも1つのモノマーと固定化形態で存在する反応物とを前記標的基板の選択されたスポットにおいて反応させる工程、
を含み、
前記少なくとも1つのモノマーが存在するフィルム層を有する少なくとも1つの出発基板を準備し、
選択されたスポットを調整する工程(ii)が、該出発基板から前記標的基板への該少なくとも1つのモノマーの材料の選択的転写及び該標的基板への該材料の部位特異的固定を含み、
該選択的転写及び/又は部位特異的固定が、レーザー光を含む電磁放射により行われ、
前記出発基板と前記フィルム層との間に、前記材料の前記選択的転写を助ける1つ又は複数の中間層が配置され、
前記出発基板から前記標的基板への前記材料の前記選択的転写及び前記部位特異的固定が、前記出発基板と前記標的基板とを接触させ、前記フィルム層を前記電磁放射によって直接的又は間接的に加熱することで行われ、前記フィルム層が前記基板間に位置し、
前記材料の前記選択的転写が、液体又は気体形態で行われる、方法。 - 前記出発基板及び/又は前記標的基板が前記接触時に振動に曝される又は機械的発振に供される、請求項2に記載の方法。
- 前記出発基板及び/又は前記標的基板が可撓性材料からなる、請求項1〜3のいずれか一項に記載の方法。
- 前記材料の前記選択的転写が、アブレーション、光子により伝送されるパルスによる該材料の脱離、光ピンセット原理、前記基板間での電場及び/又は磁場の生成を含む機構の1つ又は複数によって行われる、請求項1に記載の方法。
- 前記転写された材料の標的基板への前記部位特異的固定が、該材料の直接的若しくは間接的な加熱又は該材料及び/又は標的基板材料の好適な選択によって行われる、請求項5に記載の方法。
- 前記材料の前記選択的転写が、前記フィルム層又は前記少なくとも1つの中間層の容量の拡大によって行われる、請求項5又は6に記載の方法。
- 前記材料の前記選択的転写が前記フィルム層又は前記少なくとも1つの中間層における気泡の形成によって行われる、請求項7に記載の方法。
- 工程(ii)及び(iii)を同一又は異なる出発基板を用いて繰り返し行う、請求項1〜8のいずれか一項に記載の方法。
- 前記基板間の間隙が液体で満たされる、請求項1〜9のいずれか一項に記載の方法。
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