JP6492983B2 - Electronic equipment casing - Google Patents

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JP6492983B2
JP6492983B2 JP2015112755A JP2015112755A JP6492983B2 JP 6492983 B2 JP6492983 B2 JP 6492983B2 JP 2015112755 A JP2015112755 A JP 2015112755A JP 2015112755 A JP2015112755 A JP 2015112755A JP 6492983 B2 JP6492983 B2 JP 6492983B2
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opening
lid body
case body
inner peripheral
wall
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健志 松葉
健志 松葉
雅大 山本
雅大 山本
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Oki Electric Industry Co Ltd
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Description

本発明は、電子機器の筐体に関し、特に、屋外に設置される電子機器の筐体の防水構造に関する。   The present invention relates to a housing of an electronic device, and more particularly to a waterproof structure of a housing of an electronic device installed outdoors.

屋外の雨水に曝される電子機器においては、その電子回路への防水目的で、防水パッキンを介して閉塞される中空筐体を採用するのが一般的である。   In an electronic device that is exposed to outdoor rainwater, it is common to employ a hollow casing that is closed via a waterproof packing for the purpose of waterproofing the electronic circuit.

例えば、従来の屋外設置用電子機器として、2つの防水パッキンを用いた二重防水構造の筐体を有するものがある(特許文献1、参照)。かかる電子機器においては、図10に示すように、上ケース1を下ケース2に被せた筐体を備え、両ケースの間に、収納部4の近くと遠くに第1の防水パッキン7と第2の防水パッキン8を介装させ、両防水パッキンの間に所定の空間Saが設けられている。該空間Saにより、水が外側の第2の防水パッキン8から毛細管現象にて浸入しても、第1のパッキン7までの水の浸入を防いでいる。さらに、該筐体において、ひさし部14と外延部15とが形成され、第2の防水パッキン8の外側にも水分が溜まりにくい程度の空間Sbを設けている。   For example, as a conventional outdoor-installed electronic device, there is one having a double waterproof structure housing using two waterproof packings (see Patent Document 1). As shown in FIG. 10, such an electronic device includes a housing in which an upper case 1 is covered with a lower case 2, and the first waterproof packing 7 and the first waterproof packing 7 are disposed between both cases near and far from the storage unit 4. Two waterproof packings 8 are interposed, and a predetermined space Sa is provided between the two waterproof packings. The space Sa prevents water from entering the first packing 7 even if water enters from the outer second waterproof packing 8 by capillary action. Further, in the housing, the eaves portion 14 and the outer extension portion 15 are formed, and a space Sb is provided on the outside of the second waterproof packing 8 so as to prevent moisture from collecting.

特開2003−101256号公報JP 2003-101256 A

従来の屋外設置用電子機器の筐体では以下の問題があった。まず、上ケース1の直ぐ裏面に第1及び第2の防水パッキン7、8がある故に、屋外設置し日射の影響で両パッキンが温まり易く、両パッキンの経年劣化が早まり防水性能の維持期間が短くなってしまう。次に、空間Sbに強風雨が進入しまう場合に、ひさし部14を有する上ケース1が変形して上ケース1と第2の防水パッキン8との非接触によって空間Saへ水の浸入が起こり、防水性能が低下することがある。さらに、第1及び第2の防水パッキン7、8と接触する上ケース1の部分が平坦である故に、浸水量が多い場合は当該部分での毛細管現象で筐体の収納部4の内部まで水が浸入してしまう可能性が高くなる。また、防水パッキンが2つ必要である故に組立作業工数が多くなってしまう問題があった。   Conventional casings for outdoor electronic devices have the following problems. First, because the first and second waterproof packings 7 and 8 are immediately on the back surface of the upper case 1, both the packings are likely to heat up due to the influence of solar radiation, and the deterioration of both packings is accelerated and the maintenance period of waterproof performance is increased. It will be shorter. Next, when strong wind and rain enters the space Sb, the upper case 1 having the eaves portion 14 is deformed and water enters the space Sa due to non-contact between the upper case 1 and the second waterproof packing 8, Waterproof performance may deteriorate. Further, since the portion of the upper case 1 that is in contact with the first and second waterproof packings 7 and 8 is flat, when the amount of water immersion is large, the capillarity at that portion causes water to reach the inside of the housing storage portion 4. There is a high possibility of intrusion. Further, since two waterproof packings are necessary, there is a problem that the number of assembling steps is increased.

本発明は、以上の従来技術の問題点に鑑みなされたものであり、その目的は、防水性能を維持しつつ、防水パッキン(以下、単にパッキンともいう)への日射による熱の影響を抑制できる電子機器の筐体を提供することを目的とする。   The present invention has been made in view of the above-described problems of the prior art, and an object thereof is to suppress the influence of heat caused by solar radiation on the waterproof packing (hereinafter also simply referred to as packing) while maintaining the waterproof performance. An object is to provide a housing for an electronic device.

本発明の筐体は、一端において開口し他端において閉塞した筒形状を共に呈する蓋体とケース本体とからなり、前記蓋体の開口の側壁内面が前記ケース本体の開口の側壁外面に嵌合し得る、電子回路を収容する電子機器の筐体であって、
前記蓋体は、その閉塞端部からその開口に向かって突出し且つ前記蓋体の側壁から離間している筒状の内側周壁を有し、
前記ケース本体の開口端面と前記内側周壁の開口端面とに挟持される防水パッキンを有し、
前記ケース本体と前記蓋体は、前記内側周壁の開口端部から離れた位置のそれぞれの側壁から外側に突出して互いに面接合する接合部を有することを特徴とする。
The case of the present invention comprises a case body and a lid body that is open at one end and closed at the other end, and the inner wall surface of the opening of the lid body is fitted to the outer wall surface of the opening of the case body. A housing of an electronic device that houses an electronic circuit,
The lid body has a cylindrical inner peripheral wall protruding from the closed end portion toward the opening and spaced from the side wall of the lid body,
A waterproof packing sandwiched between the opening end surface of the case body and the opening end surface of the inner peripheral wall;
The case main body and the lid body have a joint portion that protrudes outward from each side wall at a position away from the opening end portion of the inner peripheral wall and is surface-bonded to each other.

本発明の電子機器の筐体によれば、ケース本体の開口端面と内側周壁の開口端面とに挟持される防水パッキンの構造によって、断熱空間の形成と、パッキンへの熱伝導距離を長くすることが可能となり、日射熱の影響を抑制できる。よって、防水機能を維持しつつ、従来の電子機器筐体におけるパッキンまでの熱伝導距離が短いことによるパッキンの熱劣化の問題点や、筐体に剛性が足りない問題点を簡易な構成で解決できる。   According to the electronic device casing of the present invention, the structure of the waterproof packing sandwiched between the opening end surface of the case body and the opening end surface of the inner peripheral wall can increase the formation of the heat insulating space and the heat conduction distance to the packing. It is possible to suppress the influence of solar heat. Therefore, while maintaining the waterproof function, it solves the problem of the thermal deterioration of the packing due to the short heat conduction distance to the packing in the conventional electronic device casing and the problem of insufficient rigidity in the casing with a simple configuration it can.

図1は、本発明による実施例である電子機器の筺体の外観を示す蓋体側から見た斜視図である。FIG. 1 is a perspective view showing an external appearance of a housing of an electronic device that is an embodiment according to the present invention, as viewed from the lid side. 図2は、図1の電子機器の筺体の外観を示すケース本体側から見た斜視図である。FIG. 2 is a perspective view seen from the case body side showing the appearance of the housing of the electronic device of FIG. 図3は、図1の線xxにおける電子機器の筺体を示す概略断面図である。FIG. 3 is a schematic cross-sectional view showing the housing of the electronic device taken along line xx of FIG. 図4は、図1の電子機器の筺体のケース本体を示す斜視図である。FIG. 4 is a perspective view showing a case main body of the casing of the electronic apparatus of FIG. 図5は、図1の電子機器の筺体の蓋体を示す斜視図である。FIG. 5 is a perspective view showing a lid body of the casing of the electronic apparatus of FIG. 図6は、実施例の電子機器の筺体の側壁の一部を示す拡大断面図である。FIG. 6 is an enlarged cross-sectional view illustrating a part of the side wall of the housing of the electronic device according to the embodiment. 図7は、実施例の変形例の電子機器の筺体の側壁の一部を示す拡大断面図である。FIG. 7 is an enlarged cross-sectional view illustrating a part of the side wall of the housing of the electronic device according to the modified example of the embodiment. 図8は、実施例の変形例の電子機器の筺体の側壁の一部を示す拡大断面図である。FIG. 8: is an expanded sectional view which shows a part of side wall of the housing of the electronic device of the modification of an Example. 図9は、実施例の変形例の電子機器の筺体の側壁の一部を示す拡大断面図である。FIG. 9 is an enlarged cross-sectional view illustrating a part of the side wall of the housing of the electronic device according to the modified example of the embodiment. 図10は、従来の屋外設置機器の筺体を示す概略断面図である。FIG. 10 is a schematic cross-sectional view showing a housing of a conventional outdoor installation device.

以下、図面を参照しつつ本発明による実施例の屋外設置用電子機器の筐体について詳細に説明する。   Hereinafter, a case of an electronic apparatus for outdoor installation according to an embodiment of the present invention will be described in detail with reference to the drawings.

図1及び図2に示すように、実施例の電子機器の筐体10は略長方体形状を有しており、開口部において互いに嵌合された筒状のケース本体11及び筒状の蓋体12から構成されている。ケース本体11及び蓋体12は、それぞれの側壁12PW、11PWから外側に突出して互いに面接合するフランジ12F、11Fを有している。   As shown in FIGS. 1 and 2, the casing 10 of the electronic apparatus of the embodiment has a substantially rectangular shape, and a cylindrical case body 11 and a cylindrical lid that are fitted to each other in the opening. It is composed of a body 12. The case body 11 and the lid body 12 have flanges 12F and 11F that protrude outward from the respective side walls 12PW and 11PW and are surface-bonded to each other.

ケース本体11及び蓋体12は、それぞれのフランジ12F、11Fが面接合した状態で、それぞれのフランジに設けられたネジScにより締結されることで、互いに固着される。   The case main body 11 and the lid body 12 are fixed to each other by being fastened by screws Sc provided on the respective flanges in a state where the respective flanges 12F and 11F are surface-bonded.

図1に示すように、蓋体12の側壁12PWとフランジ12Fとの間に、該側壁から外側に突出する複数の蓋フランジリブ12Rが設けられている。図2に示すように、ケース本体11の側壁11PWとフランジ11Fとの間にも、該側壁から外側に突出する複数のケース本体フランジリブ11Rが設けられている。蓋フランジリブ12R及びケース本体フランジリブ11Rは、フランジ11F、12Fのそれぞれの面接合するフランジ側面の平坦度を確保しつつ、ケース本体11及び蓋体12の剛性を向上させている。   As shown in FIG. 1, a plurality of lid flange ribs 12 </ b> R that protrude outward from the side wall are provided between the side wall 12 </ b> PW and the flange 12 </ b> F of the lid body 12. As shown in FIG. 2, a plurality of case body flange ribs 11 </ b> R protruding outward from the side wall are also provided between the side wall 11 </ b> PW and the flange 11 </ b> F of the case body 11. The lid flange rib 12R and the case main body flange rib 11R improve the rigidity of the case main body 11 and the cover body 12 while ensuring the flatness of the flange side surfaces to which the flanges 11F and 12F are joined.

図3に示すように、ケース本体及び蓋体11,12は、互いに突き合わされたフランジ側面11s,12s(フランジ12F、11F)にて第一接合部Aとして面接合している。第一接合部より蓋体12の内側に位置する第二接合部Bとして、ケース本体11の側壁11PWの端面と内側周壁12PWiの端面とが、パッキン13を介して、互いに突き合わされている。すなわち、パッキン13を収めたケース本体11の開口端面の溝に蓋体12の内側周壁12PWiの開口端部が嵌合されている。ケース本体及び蓋体11,12のフランジ11F、12Fのフランジ側面11s,12sが面接合されることによって、パッキン13の内側に、電子回路を含む電子部品又は電子装置(図示せず)等を収容する密閉された収容空間SPが画定される。   As shown in FIG. 3, the case main body and the lid bodies 11 and 12 are surface-bonded as the first joint portion A at the flange side surfaces 11 s and 12 s (flanges 12 </ b> F and 11 </ b> F) that face each other. The end surface of the side wall 11PW of the case main body 11 and the end surface of the inner peripheral wall 12PWi are abutted against each other via the packing 13 as the second joint portion B located inside the lid 12 from the first joint portion. That is, the opening end portion of the inner peripheral wall 12PWi of the lid body 12 is fitted in the groove of the opening end surface of the case body 11 in which the packing 13 is accommodated. The case main body and the flanges 11F and 12F of the lids 11 and 12 are surface-bonded so that an electronic component or electronic device (not shown) including an electronic circuit is accommodated inside the packing 13. A sealed housing space SP is defined.

図4に示すように、環状のパッキン13は、ケース本体11の側壁11PWの開口端面11oに形成された環状のパッキン収容溝11dに収容されている。ケース本体11は一側面(開口端面)を開放し、開口端面に対向する他端部(底面)において閉塞した略長方体形状の筒状体である。外周側に張り出したフランジ11Fは、フランジ側面11sがケース本体11の開口端面から所定距離Hだけ離れて位置するように、形成されている。これにより、フランジ11Fより上のケース本体11の側壁11PWの外面が蓋体12の側壁12PWの内面と嵌合できるようになる。なお、フランジ11Fより下のケース本体11の側壁11PWの一部に、収容された電子回路を動作させるための外部の給電ケーブルや入出力ケーブル等を通過させるための接続孔17が設けられている。   As shown in FIG. 4, the annular packing 13 is accommodated in an annular packing accommodation groove 11 d formed on the opening end surface 11 o of the side wall 11 </ b> PW of the case body 11. The case main body 11 is a substantially rectangular parallelepiped cylindrical body having one side surface (opening end surface) opened and closed at the other end (bottom surface) facing the opening end surface. The flange 11 </ b> F protruding to the outer peripheral side is formed such that the flange side surface 11 s is located a predetermined distance H away from the opening end surface of the case body 11. Thereby, the outer surface of the side wall 11PW of the case body 11 above the flange 11F can be fitted to the inner surface of the side wall 12PW of the lid body 12. In addition, a connection hole 17 is provided in a part of the side wall 11PW of the case body 11 below the flange 11F to allow an external power supply cable, an input / output cable, and the like to operate the accommodated electronic circuit. .

図5に示すように、蓋体12は、一側面(開口端面12o)を開放し、開口端面に対向する他端部(天井12c)において閉塞した略長方体形状の筒状体である。蓋体12の内側周壁12PWiは、蓋体12の側壁12PWの内側に沿って天井12cから略平行に突出して、側壁12PWとの間に環状の溝Gを形成するように筒状に形成されている。内側周壁12PWiは蓋体12の側壁12PWより低く形成されている。蓋体12の天井は、その中央がフランジ12Fから最も高くなるように湾曲した蓋曲面天井として形成され、該天井12cにはこれを横断するたわみ防止と補強用の蓋天井リブ12R2が内側周壁12PWiより低く形成されている。   As shown in FIG. 5, the lid body 12 is a substantially rectangular parallelepiped cylindrical body having one side surface (opening end surface 12 o) opened and closed at the other end (ceiling 12 c) facing the opening end surface. The inner peripheral wall 12PWi of the lid body 12 is formed in a cylindrical shape so as to project from the ceiling 12c along the inner side of the side wall 12PW of the lid body 12 so as to form an annular groove G between the side wall 12PW and the side wall 12PW. Yes. The inner peripheral wall 12PWi is formed lower than the side wall 12PW of the lid 12. The ceiling of the lid 12 is formed as a curved curved ceiling so that the center thereof is the highest from the flange 12F, and the ceiling 12c is provided with a lid ceiling rib 12R2 for preventing bending and reinforcing the inner circumferential wall 12PWi. It is formed lower.

蓋体12の開口端面(側壁12PWの端面12o)には、これを拡張する外周側に張り出したフランジ12Fが形成され、これがフランジ側面12sを画定している。蓋体12のフランジ12Fの外周縁部には、ケース本体11との嵌合時にそのフランジ11Fの外周縁部の周端面を覆うように、曲がった屈曲部12Bが設けられている。なお、フランジ11F,12Fのフランジ側面11s,12sには、締結ネジScの通過用の貫通孔Shがそれぞれ対応するように形成されている。   A flange 12F is formed on the opening end surface of the lid 12 (the end surface 12o of the side wall 12PW) so as to extend to the outer peripheral side, which defines the flange side surface 12s. A bent portion 12B that is bent so as to cover the peripheral end surface of the outer peripheral edge of the flange 11F when fitted to the case body 11 is provided on the outer peripheral edge of the flange 12F of the lid 12. In addition, the through holes Sh for passing the fastening screws Sc are respectively formed on the flange side surfaces 11s and 12s of the flanges 11F and 12F.

筐体の組み立て時、図6に示すように、蓋体12の側壁12PWの内面をケース本体11の側壁11PWの外面へ間隙嵌合する(隙間SP1)。このとき、ケース本体11のパッキン収容溝11d内のパッキン13上に蓋体12の内側周壁12PWiの端面を載せ、蓋体12で締め付け、パッキン13に圧力を加えて内側周壁12PWiの端面をパッキン13に弾性変形可能な範囲の食い込ませた嵌合状態で蓋体12をネジ(図示せず)でケース本体11に固定する。また、内側周壁12PWiの端面までの蓋体12の天井からの寸法Haとフランジ側面11sから側壁11PWのパッキン収容溝11dの底面までの寸法Hbとは、組立時の面接合においてパッキン13に適切な締め付け圧力が加えられるように設定されている。   At the time of assembling the casing, as shown in FIG. 6, the inner surface of the side wall 12PW of the lid body 12 is gap-fitted to the outer surface of the side wall 11PW of the case body 11 (gap SP1). At this time, the end surface of the inner peripheral wall 12PWi of the lid body 12 is placed on the packing 13 in the packing accommodating groove 11d of the case body 11 and tightened with the lid body 12, and pressure is applied to the packing 13 so that the end surface of the inner peripheral wall 12PWi is sealed with the packing 13. The lid 12 is fixed to the case main body 11 with screws (not shown) in the fitted state where the elastic deformation is possible. The dimension Ha from the ceiling of the lid 12 to the end surface of the inner peripheral wall 12PWi and the dimension Hb from the flange side surface 11s to the bottom surface of the packing receiving groove 11d of the side wall 11PW are suitable for the packing 13 in the surface joining at the time of assembly. The tightening pressure is set to be applied.

本実施例では、パッキン13を介して内側周壁12PWiと側壁11PWを嵌合状態としつつフランジ11F,12FをネジScにより締結する故に、このフランジの面接合と内側周壁12PWi及びパッキン13の接合とによって、防水が完全に行われ、経時変化による圧力の変動を防止することが可能となる。   In the present embodiment, the flanges 11F and 12F are fastened with the screws Sc while the inner peripheral wall 12PWi and the side wall 11PW are in the fitted state via the packing 13, so that the surface joint of the flange and the inner peripheral wall 12PWi and the packing 13 are joined. Waterproofing is performed completely, and it becomes possible to prevent fluctuations in pressure due to changes over time.

組み立て後、フランジ12F、11Fの面接合(第一接合部A)と、側壁11PW及び内側周壁12PWiの嵌合(第二接合部B)とより、蓋体12の剛性が向上する。   After the assembly, the rigidity of the lid 12 is improved by the surface bonding (first bonding portion A) of the flanges 12F and 11F and the fitting (second bonding portion B) of the side wall 11PW and the inner peripheral wall 12PWi.

また、組み立て後、蓋体12の側壁12PW及び内側周壁12PWi並びにケース本体11の側壁11PWの端面は、空気断熱層(空間SP2)を区画して、壁の二重構造を形成する。よって、この空気断熱層により、蓋体12の日射による直接的な熱の伝導をパッキン13は受けないようになる。   In addition, after the assembly, the side wall 12PW and the inner peripheral wall 12PWi of the lid body 12 and the end surfaces of the side wall 11PW of the case main body 11 define an air insulation layer (space SP2) to form a double wall structure. Therefore, the air insulation layer prevents the packing 13 from receiving direct heat conduction due to solar radiation of the lid 12.

また、本実施例では、図6に示すように、ケース本体11のパッキン収容溝11dの直下の側壁11PWには、外周溝Tが形成されている。フランジ11Fの内側の側壁11PWに沿って形成され外周溝Tによって二重壁が形成され、ケース本体11のフランジ11Fから側壁11PW及びパッキン13の近傍までの放熱効果を向上させてある。また、外周溝Tによる側壁11PWのコ字状断面の二重壁によって、ケース本体11の側壁11PWの剛性も高めることができる。   In this embodiment, as shown in FIG. 6, an outer peripheral groove T is formed in the side wall 11 </ b> PW immediately below the packing housing groove 11 d of the case body 11. A double wall is formed by the outer circumferential groove T formed along the side wall 11PW inside the flange 11F, and the heat radiation effect from the flange 11F of the case body 11 to the vicinity of the side wall 11PW and the packing 13 is improved. In addition, the rigidity of the side wall 11PW of the case body 11 can be increased by the double wall having the U-shaped cross section of the side wall 11PW formed by the outer peripheral groove T.

次に、本実施例の動作を説明する。   Next, the operation of this embodiment will be described.

本実施例の防水構造を有する筐体を屋外に設置する。筐体が雨水等に曝された場合、筐体10の上方や側方からの雨水等は、図3に示す屈曲部12Bにて止水される故に、筐体10内への水の浸入はない。さらに、風等の巻き込みにより屈曲部12Bの裏面隙間から水の浸入があった場合は、蓋体12とケース本体11の面接合するフランジ側面11s,12s(フランジ12F、11F)にて止水する。   The casing having the waterproof structure of this embodiment is installed outdoors. When the casing is exposed to rainwater or the like, rainwater or the like from above or from the side of the casing 10 is stopped at the bent portion 12B shown in FIG. Absent. Further, when water has entered from the back surface gap of the bent portion 12B due to wind or the like, water is stopped at the flange side surfaces 11s and 12s (flanges 12F and 11F) where the lid 12 and the case body 11 are surface-joined. .

浸水量が多い場合は面接合するフランジ側面11s,12s(フランジ12F、11F)の間を毛細管現象により水の浸入が進行する場合もある。この場合でも、図6に示す面接合するフランジ11F、12Fの奥のケース本体11及び蓋体12の嵌合部に隙間SP1がある故に、隙間SP1に水が溜まり、防水が可能となる。すなわち、パッキン13は高低差H(フランジ側面11sから側壁11PWの開口端面までの距離)のある位置に取り付けられており、この位置まで浸入水が溜まって、これを超えないとパッキン13に浸入水が接触することはなく、防水状態が保たれる。最後にパッキン13自体が水の浸入を防ぐ。   When the amount of water immersion is large, water may enter between the flange side surfaces 11s and 12s (flanges 12F and 11F) to be joined by capillary action. Even in this case, since there is a gap SP1 in the fitting portion between the case body 11 and the lid body 12 at the back of the flanges 11F and 12F to be surface-bonded as shown in FIG. That is, the packing 13 is attached at a position having a height difference H (distance from the flange side surface 11s to the opening end surface of the side wall 11PW). Infiltration water accumulates up to this position, and if it does not exceed this, the infiltration water enters the packing 13 Will not touch and will remain waterproof. Finally, the packing 13 itself prevents water from entering.

さらに、筐体が日射に曝された場合、パッキン13は、蓋体12表面よりも奥側に図6に示す空間SP2を隔てて位置する故に、日射による影響で容易には温まらない。すなわち、側壁11PWと内側周壁12PWiの距離H,Haによってパッキン13への熱伝導距離を長くすることが可能となり、日射熱の影響を軽くできる。   Furthermore, when the casing is exposed to solar radiation, the packing 13 is not easily heated due to the influence of solar radiation because the packing 13 is located behind the surface of the lid 12 with the space SP2 shown in FIG. That is, the distance H and Ha between the side wall 11PW and the inner peripheral wall 12PWi can increase the heat conduction distance to the packing 13, and the influence of solar heat can be reduced.

筐体10の素材には、汎用プラスチックと呼ばれる熱可塑性の合成樹脂を使用できる。汎用プラスチックとしては、ポリエチレン(PE)、ポリプロピレン(PP)、ポリ塩化ビニル(PVC)、ポリ塩化ビニリデン(PVDC)、ポリスチレン(PS)、ポリウレタン(PUR)、アクリロニトリルブタジエンスチレン樹脂(ABS)、アクリロニトリルスチレン樹脂(AS)、アクリル樹脂(PMMA)、ポリカーボネイト(PC)等が挙げられる。また、筐体10には、エンジニアリングプラスチックも用いることもできる。さらに、筐体10の素材には、金属も好適に用いられ得る。   A thermoplastic synthetic resin called general-purpose plastic can be used as the material of the housing 10. General-purpose plastics include polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), polystyrene (PS), polyurethane (PUR), acrylonitrile butadiene styrene resin (ABS), and acrylonitrile styrene resin. (AS), acrylic resin (PMMA), polycarbonate (PC) and the like. In addition, an engineering plastic can also be used for the housing 10. Furthermore, a metal can also be suitably used for the material of the housing 10.

以上の実施例の変形例としては、図7に示すように、蓋体12のフランジ12Fの外周縁部にて、ケース本体11のフランジ11Fの外周縁部の周端面を覆う屈曲部(図6、12B)を省略してもよい。また、他の変形例としては、図8に示すように、ケース本体11のフランジ11Fの内側の側壁11PWに沿って形成される外周溝(図6、T)を省略してもよい。さらに、他の変形例としては、防水パッキン13は、ケース本体11の開口端面と蓋体12の内側周壁12PWiの開口端面とに挟持されて、防水機能を発揮できればよく、図9に示すように、防水パッキン13は、内側周壁12PWiの開口端部に固定されてもよい。   As a modification of the above embodiment, as shown in FIG. 7, a bent portion (FIG. 6) covers the peripheral end surface of the outer peripheral edge of the flange 11F of the case body 11 at the outer peripheral edge of the flange 12F of the lid body 12. , 12B) may be omitted. As another modified example, as shown in FIG. 8, the outer peripheral groove (FIG. 6, T) formed along the side wall 11PW inside the flange 11F of the case body 11 may be omitted. Furthermore, as another modified example, the waterproof packing 13 only needs to be sandwiched between the opening end surface of the case body 11 and the opening end surface of the inner peripheral wall 12PWi of the lid body 12, and can exhibit a waterproof function, as shown in FIG. The waterproof packing 13 may be fixed to the opening end of the inner peripheral wall 12PWi.

11…ケース本体
11R…ケース本体フランジリブ
11PW…側壁
11F…フランジ
11s…フランジ側面
12…蓋体
12B…屈曲部
12R…蓋フランジリブ
12PW…側壁
12PWi…内側周壁
12C…蓋曲面天井
12R2…蓋天井リブ
12PW…側壁
12F…フランジ
12s…フランジ側面
13…パッキン
SP1…隙間
SP2…空間
DESCRIPTION OF SYMBOLS 11 ... Case main body 11R ... Case main body flange rib 11PW ... Side wall 11F ... Flange 11s ... Flange side surface 12 ... Cover body 12B ... Bending part 12R ... Cover flange rib 12PW ... Side wall 12PWi ... Inner peripheral wall 12C ... Cover curved surface ceiling 12R2 ... Cover ceiling rib 12PW ... side wall 12F ... flange 12s ... flange side surface 13 ... packing SP1 ... gap SP2 ... space

Claims (6)

一端において開口し他端において閉塞した筒形状を共に呈する蓋体とケース本体とからなり、前記蓋体の開口の側壁内面が前記ケース本体の開口の側壁外面に嵌合し得る、電子回路を収容する電子機器の筐体であって、
前記蓋体は、その閉塞端部からその開口に向かって突出し且つ前記蓋体の側壁から離間している筒状の内側周壁を有し、
前記ケース本体の開口端面と前記内側周壁の開口端面とに挟持される防水パッキンを有し、
前記ケース本体と前記蓋体は、前記内側周壁の開口端部から離れた位置のそれぞれの側壁から外側に突出して互いに面接合する接合部を有し、
前記内側周壁の高さは、前記蓋体の閉塞端部からその開口端面までの高さより低いことを特徴とする電子機器の筐体。
An electronic circuit is housed comprising a case body and a lid body that is open at one end and closed at the other end, and the inner wall surface of the opening of the lid body can be fitted to the outer wall surface of the opening of the case body. A housing of an electronic device,
The lid body has a cylindrical inner peripheral wall protruding from the closed end portion toward the opening and spaced from the side wall of the lid body,
A waterproof packing sandwiched between the opening end surface of the case body and the opening end surface of the inner peripheral wall;
The case body and the lid body, have a joint surfaces joined to each other to project outwardly from the respective side wall at a position spaced from the open end portion of said inner peripheral wall,
The height of the said inner peripheral wall is lower than the height from the closed end part of the said cover body to the opening end surface , The housing | casing of the electronic device characterized by the above-mentioned .
前記ケース本体は、その開口端面において前記内側周壁の開口端部が嵌合し得る溝を有し、前記溝の底部に前記防水パッキンが配置されることを特徴とする請求項1に記載の電子機器の筐体。   2. The electron according to claim 1, wherein the case main body has a groove in which an opening end portion of the inner peripheral wall can fit in an opening end surface thereof, and the waterproof packing is disposed at a bottom portion of the groove. Equipment enclosure. 前記蓋体の接合部の外周縁部には、前記ケース本体の接合部の外周縁部の周端面を覆う屈曲部が設けられていることを特徴とする請求項1又は2に記載の電子機器の筐体。 The outer peripheral edge of the joint portion of the cover body, an electronic device according to claim 1 or 2, characterized in that the bent portion to cover the peripheral end face of the outer circumferential edge portion of the joint portion of the case body is provided Housing. 前記ケース本体の接合部の内側の前記ケース本体の側壁に沿って形成された外周溝を有することを特徴とする請求項1乃至のいずれか1つに記載の電子機器の筐体。 Housing of an electronic device according to any one of claims 1 to 3, characterized in that it has an inner circumferential groove formed along the side wall of the case body of the joint portion of the case body. 一端において開口し他端において閉塞した筒形状を共に呈する蓋体とケース本体とからなり、前記蓋体の開口の側壁内面が前記ケース本体の開口の側壁外面に嵌合し得る、電子回路を収容する電子機器の筐体であって、
前記蓋体は、その閉塞端部からその開口に向かって突出し且つ前記蓋体の側壁から離間している筒状の内側周壁を有し、
前記ケース本体の開口端面と前記内側周壁の開口端面とに挟持される防水パッキンを有し、
前記ケース本体と前記蓋体は、前記内側周壁の開口端部から離れた位置のそれぞれの側壁から外側に突出して互いに面接合する接合部を有し、
前記蓋体の接合部の外周縁部には、前記ケース本体の接合部の外周縁部の周端面を覆う屈曲部が設けられていることを特徴とする電子機器の筐体。
An electronic circuit is housed comprising a case body and a lid body that is open at one end and closed at the other end, and the inner wall surface of the opening of the lid body can be fitted to the outer wall surface of the opening of the case body. A housing of an electronic device,
The lid body has a cylindrical inner peripheral wall protruding from the closed end portion toward the opening and spaced from the side wall of the lid body,
A waterproof packing sandwiched between the opening end surface of the case body and the opening end surface of the inner peripheral wall;
The case main body and the lid body have joints that protrude outward from the respective side walls at positions away from the opening end of the inner peripheral wall and are surface-bonded to each other.
A casing for an electronic device , wherein a bent portion that covers a peripheral end surface of an outer peripheral edge portion of the joint portion of the case body is provided on an outer peripheral edge portion of the joint portion of the lid body.
一端において開口し他端において閉塞した筒形状を共に呈する蓋体とケース本体とからなり、前記蓋体の開口の側壁内面が前記ケース本体の開口の側壁外面に嵌合し得る、電子回路を収容する電子機器の筐体であって、An electronic circuit is housed comprising a case body and a lid body that is open at one end and closed at the other end, and the inner wall surface of the opening of the lid body can be fitted to the outer wall surface of the opening of the case body. A housing of an electronic device,
前記蓋体は、その閉塞端部からその開口に向かって突出し且つ前記蓋体の側壁から離間している筒状の内側周壁を有し、The lid body has a cylindrical inner peripheral wall protruding from the closed end portion toward the opening and spaced from the side wall of the lid body,
前記ケース本体の開口端面と前記内側周壁の開口端面とに挟持される防水パッキンを有し、A waterproof packing sandwiched between the opening end surface of the case body and the opening end surface of the inner peripheral wall;
前記ケース本体と前記蓋体は、前記内側周壁の開口端部から離れた位置のそれぞれの側壁から外側に突出して互いに面接合する接合部を有し、The case main body and the lid body have joints that protrude outward from the respective side walls at positions away from the opening end of the inner peripheral wall and are surface-bonded to each other.
前記ケース本体の接合部の内側の前記ケース本体の側壁に沿って形成された外周溝を有することを特徴とする電子機器の筐体。A housing for an electronic device, comprising an outer peripheral groove formed along a side wall of the case body inside a joint portion of the case body.
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