JP6486766B2 - Encoder scale and its manufacturing / mounting method - Google Patents

Description

  The present invention relates to an encoder scale and a method for manufacturing and attaching the encoder scale, and more particularly, to an encoder scale and a method for manufacturing and attaching the encoder scale that can stably eliminate the phenomenon that static electricity is charged in the encoder scale.

  Conventionally, for example, an electromagnetic induction (magnetic) linear encoder as shown in Patent Document 1 has been used. In this electromagnetic induction linear encoder, for example, a scale coil (pattern layer having conductivity) is formed in the measurement direction of the encoder scale. A separate grounding pattern is provided outside the scale coil, and the grounding pattern is grounded to the scale base. As a result, static electricity generated in the encoder scale is released to the scale base.

JP 2004-333417 A

  However, the electromagnetic induction linear encoder shown in Patent Document 1 is basically an effective countermeasure against static electricity for the encoder scale portion provided with a grounding pattern (which may be conductive). That is, such a grounding pattern may not be sufficiently effective except for a portion where the grounding pattern is provided. For example, when the scale coil itself is charged with static electricity, when the static electricity accumulated in the scale coil is discharged, there is a risk of causing malfunction or failure of the electromagnetic induction linear encoder.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an encoder scale that can stably eliminate the phenomenon that static electricity is charged in the encoder scale, and a method for manufacturing and attaching the encoder scale.

  The invention according to claim 1 of the present application relates to an encoder scale that is displaced relative to a detection head, an insulating substrate, a conductive adhesion layer formed on the substrate, and the detection on the adhesion layer. A conductive pattern layer formed in a shape that enables position detection with a head, and the adhesion layer makes all of the pattern layer conductive, and further extends outward from a position detection range by the detection head. The above-described problem is solved by providing an out-of-detection-range pattern that is grounded through a conductive member.

  In the invention according to claim 2 of the present application, an insulating protective layer is formed so as to cover all of the adhesion layer and the pattern layer in the position detection range.

  In the invention according to claim 3 of the present application, the conductive member is provided so as to cover all the patterns outside the detection range where the protective layer is not formed.

  In the invention according to claim 4 of the present application, the conductive member includes a conductive thin film and a resin adhesive film including a conductive filler on a lower surface thereof, and the thin film includes the pattern outside the detection range and the conductive filler. It is made to conduct | electrically_connect with this pattern outside a detection range by making it contact | abut.

  In the invention according to claim 5 of the present application, the conductive member further includes a metallic gripping member formed in a shape capable of elastically deforming and sandwiching the substrate, and the conductive member is a conductive thin film. When providing, the thin film and the substrate are held together so that the thin film is pressed against the pattern outside the detection range by the gripping member.

  In the invention according to claim 6 of the present application, when the conductive member further includes an elastic member having conductivity, and the conductive member includes a thin film having conductivity, the elastic member is used to form the thin film. It arrange | positions so that it may press against a pattern outside a detection range.

  The invention according to claim 7 of the present application is such that the encoder scale is grounded at only one place.

  According to an eighth aspect of the present invention, there is provided a method for manufacturing and mounting an encoder scale that is displaced relative to a detection head, the step of forming a conductive adhesion layer on an insulating substrate; And a step of forming a pattern layer having a shape that is all conductive in the adhesion layer and capable of position detection by the detection head, and a detection that extends outward from a position detection range of the adhesion layer by the detection head. A step of grounding the out-of-range pattern through the conductive member is included.

  According to the present invention, it is possible to stably eliminate the phenomenon that static electricity is charged in the encoder scale.

The schematic diagram which shows an example of the linear encoder which concerns on 1st Embodiment of this invention. 1 is a schematic sectional view of an encoder scale of the linear encoder of FIG. Schematic top view of the encoder scale of FIG. Schematic diagram of a ground clip connected to the encoder scale of FIG. 2 (front view (A), side view (B), bottom view (C)) Schematic diagram showing the first half of the manufacturing and mounting procedure for the encoder scale in FIG. Schematic diagram showing the latter half of the manufacturing and installation procedure for the encoder scale in FIG. The schematic diagram which shows an example of the encoder scale which concerns on 2nd Embodiment of this invention. Schematic sectional view showing an example of an encoder scale according to a third embodiment of the present invention

  Hereinafter, an example of the first embodiment of the present invention will be described in detail with reference to the drawings.

  First, the overall configuration of the encoder 100 will be described.

  The encoder 100 is an assembly-type electromagnetic induction linear encoder, and includes a detection head 110 and an encoder scale 120 that is displaced relative to the detection head 110 in the measurement direction X as shown in FIG. The detection head 110 is supported by an encoder scale 120, and the encoder scale 120 is supported by a support body 118. The encoder scale 120 and the detection head 110 are respectively attached to a fixed part of a device (not shown) (measurement device or processing device) and a movable part that moves relative to the fixed part. The support 118 has conductivity and is connected to a reference potential, that is, grounded through a fixed portion of the apparatus. The encoder 100 may be either an incremental type or an absolute type.

  In FIG. 1, symbol IR indicates a range (position detection range) in which position detection by the detection head 110 in the encoder scale 120 is possible (the position X5 in FIGS. 2 and 3 is the end of the position detection range IR). Showing). Further, the symbol OR indicates a range in which position detection by the detection head 110 in the encoder scale 120 is impossible (range outside the position detection). Symbol MR indicates a contactable range (bearing contact range) of a bearing provided on the detection head 110 in the encoder scale 120 (a position X4 in FIGS. 2 and 3 indicates an end of the bearing contact range MR). Show).

  The detection head 110 is supported to be opposed to the encoder scale 120 via a plurality of bearings (or rollers) (not shown) (the facing distance is 1 mm or less, for example), and is movable in the measurement direction X. The detection head 110 includes an excitation coil and a detection coil (not shown). The detection head 110 induces an induced current in the pattern layer 126 of the encoder scale 120 with an exciting coil, and detects this induced current with the detection coil. With such a configuration, the detection head 110 detects the position of the detection head 110 with respect to the encoder scale 120.

  As shown in FIGS. 2 and 3, the encoder scale 120 includes a glass substrate 122, an adhesion layer 124, a pattern layer 126, and a protective layer 128.

  The glass substrate 122 is an insulating substrate and has a rectangular parallelepiped shape in which the measurement direction X is a long side, as shown in FIGS. The glass substrate 122 is made of ordinary glass, but may be a glass substrate (including a glass ceramic substrate) having a low coefficient of thermal expansion. The glass substrate 122 has a smaller coefficient of thermal expansion than metal. Further, the glass substrate 122 has low hygroscopicity. Therefore, by using the glass substrate 122, it is possible to prevent the detection accuracy from fluctuating greatly with respect to changes in temperature and humidity.

  The adhesion layer 124 is formed on the detection head side surface 122A of the glass substrate 122 as shown in FIGS. As shown in FIG. 3, the adhesion layer 124 is only partially formed in the direction Y, and does not cover the entire detection head side surface 122A (not limited to this, the adhesion layer is the entire detection head side surface). It may be a solid pattern that covers However, in the measurement direction X, the adhesion layer 124 includes a detection-in-range pattern 124B that exists in the position detection range IR, and an out-detection range pattern 124A that extends outward from the position detection range IR and exists in the position detection outside range OR. And covers all of the glass substrate 122 (that is, the adhesion layer 124 includes an out-of-detection range pattern 124A). The adhesion layer 124 has a constant film thickness (for example, 50 nm to 100 nm) and makes all the pattern layers 126 conductive. The adhesion layer 124 is a conductive metal film such as Cr, Ti, Mo, or Ni (not limited to this, the adhesion layer may be a conductive inorganic compound such as ITO). The adhesion layer 124 has good adhesion to the glass substrate 122 and can be formed by a vacuum film formation method such as vapor deposition or sputtering.

  As shown in FIGS. 2 and 3, the pattern layer 126 is formed on the upper surface 124C of the adhesion layer 124 so as to extend beyond the position X5 at the end of the position detection range IR. The pattern layer 126 is, for example, a plurality of substantially rectangular coils, and has a shape that enables position detection by the detection head 110 (not limited to a rectangle). The pattern layer 126 is a highly conductive metal film (such as Au or Ag) such as Cu or Al, and has a film thickness of, for example, 200 nm to 500 nm. The pattern layer 126 is formed, for example, by forming a thin film (for example, a film thickness of 10 nm to 50 nm) by a vacuum film forming method such as vapor deposition or sputtering, and forming a thick film thereon by a wet film forming method such as electroplating. can do. Further, a barrier metal layer (such as Cr, Ti, Mo, or Ni described above may be used as a material) may be provided between the pattern layer 126 and the adhesion layer 124 so that the respective materials do not diffuse. By providing the barrier metal layer, it is possible to maintain the structure of the layers for a longer period.

  The film thickness of the adhesion layer 124 is, for example, 50 nm to 100 nm. At the same time, the electrical resistivity as a material is also greatly different (for example, the electrical resistivity of Cu used in the pattern layer 126 is close to 1/10 with respect to Cr used in the adhesion layer 124). For this reason, by optimizing the adhesion layer 124 and the pattern layer 126, it is possible to prevent the induced current induced in the pattern layer 126 from being affected by the adhesion layer 124.

  The protective layer 128 is an insulating film made of an organic material such as a resin. As shown in FIGS. 2 and 3, the protective layer 128 is positioned so as to cover at least all of the adhesion layer 124 and the pattern layer 126 within the position detection range IR. It is formed up to X2. Further, the protective layer 128 is not formed on the detection range outside pattern 124A between the position X0 and the position X2 in the one position detection outside range OR (in FIG. 1, the protection layer 128 is All of the adhesion layer 124 and the pattern layer 126 in the other position detection outside range OR are covered). Since the surface of the protective layer 128 is flat, it is possible to stably prevent the pattern layer 126 from dropping off (not limited to this, the surface of the protective layer may be uneven depending on the presence or absence of the pattern layer). The protective layer 128 can be formed by application such as spin coater, roll coater, or printing.

  As shown in FIG. 3, the pattern outside detection range 124 </ b> A and the conductive member 130 are electrically connected to each other in the portion outside the detection range 124 </ b> A where the protective layer 128 is not formed (range from position X <b> 0 to position X <b> 2). Conduction). The conductive member 130 includes an aluminum tape 131 and a ground clip (gripping member) 136.

  As shown in FIG. 2, the aluminum tape 131 includes an aluminum film (conductive thin film) 132 and a resin adhesive film 134 containing a conductive filler on its lower surface. The thickness of the aluminum tape 131 is 50 μm to 100 μm. The aluminum tape 131 is provided from the position X0 to the position X3 in the measurement direction X so as to cover all the out-of-detection range patterns 124A on which the protective layer 128 is not formed. The aluminum film 132 is electrically connected to the out-of-detection range pattern 124 </ b> A when the out-of-detection range pattern 124 </ b> A and the conductive filler of the resin adhesive film 134 abut. The conductive filler includes flake-like, powder-like or fibrous carbon black, carbon fiber, graphite, fine metal powder (Au, Ag, etc.), metal oxide, metal fiber, and synthetic fiber with a metal coating on the surface. And glass beads can be used.

  As shown in FIGS. 4A to 4C, the earth clip 136 is a metallic member formed into a shape capable of elastically deforming and sandwiching the glass substrate 122. For example, a metal having excellent corrosion resistance such as stainless steel. It is integrally formed with a plate. As shown in FIGS. 4A to 4C, the ground clip 136 includes a locking portion 136A, a gripping portion 136B, a leaf spring portion 136C, and a connection portion 136D.

  As shown in FIG. 3, when the glass substrate 122 is gripped by the gripping portion 136 </ b> B, the locking portion 136 </ b> A abuts on the upper side surface of the glass substrate 122 and restricts the upward movement of the glass substrate 122. A gripping portion 136B is provided at the lower end of the locking portion 136A.

  As shown in FIGS. 4A to 4C, the gripper 136B has a substantially U-shaped cross section in which the glass substrate 122 can be gripped from the detection head side surface 122A and the back surface thereof. The shape of the substantially U-shape is that the two ends are slightly opened, and the portions immediately inside the ends are close to each other). A leaf spring portion 136C is provided to extend obliquely at the lower end of the gripping portion 136B.

  As shown in FIGS. 4A to 4C, the leaf spring portion 136C is a portion that presses the connection portion 136D provided at the lower end of the leaf spring portion 136C against the support 118. The connecting portion 136D is a leaf spring structure having a substantially U-shaped cross section and is electrically connected to the support 118.

  As shown in FIG. 2, the ground clip 136 holds the aluminum tape 131 and the glass substrate 122 together so as to press the aluminum tape 131 (the aluminum film 132 thereof) against the out-of-detection range pattern 124A. The ground clip 136 is grounded via the support body 118. Note that the ground clip 136 is disposed only in the position detection outside range OR at the right end of the encoder scale 120 in FIG. 1, for example. That is, the encoder scale 120 is grounded only at one place by the ground clip 136.

  Next, a procedure for manufacturing and attaching the encoder scale 120 will be described mainly with reference to FIGS. 5 (A) to (D) and FIGS. 6 (A) to (D).

  First, a uniform adhesion layer 124 is formed on the glass substrate 122 by a vacuum film formation method such as vapor deposition or sputtering. For example, Cr is used as the material.

  Next, a uniform functional layer 125 to be the pattern layer 126 is formed on the adhesion layer 124. At this time, the functional layer 125 is formed by forming a thin film by a vacuum film formation method such as vapor deposition or sputtering, and forming a thick film thereon by a wet film formation method such as electroplating. For example, Cu is used as the material.

  Here, since the Cr metal film as the adhesion layer 124 is first formed on the glass substrate 122, the adhesion strength between the glass substrate 122 and the adhesion layer 124 can be increased. And although it is a different metal, since the Cu metal thin film is formed on the Cr metal film by using the same vacuum film forming method, the adhesion strength between the adhesion layer 124 and the Cu metal thin film can be kept high. And although it is a different film-forming method on Cu metal thin film, since Cu of the same material is plated, the adhesive strength of Cu metal thin film and its Cu plating film can be kept high. That is, the adhesion strength between the glass substrate 122, the functional layer 125 made of the Cu metal thin film, and the Cu plating film can be increased. The formation of the functional layer is not limited to this, and may be performed using thermal spraying or printing.

  Next, as shown in FIG. 5A, a uniform resist layer RL is formed on the functional layer 125 using a spin coater, a roll coater, or the like.

  Next, as shown in FIG. 5B, a resist layer RL is formed in a mask shape for forming the pattern layer 126 by lithography or the like.

  Next, as shown in FIG. 5C, the functional layer 125 in an unmasked region is removed by a resist layer RL having a mask shape by a dry etching method or a wet etching method to form a pattern layer 126. The pattern layer 126 has a shape that enables position detection with the detection head 110. At this time, the adhesion layer 124 is left with a uniform film thickness without being etched. For this reason, all the pattern layers 126 are brought into conduction by the adhesion layer 124.

  Next, as shown in FIG. 5D, the resist layer RL having the mask shape is removed.

  Next, as shown in FIG. 6A, the insulating protective layer 128 is formed widely beyond the position detection range IR by the detection head 110. As a method for forming the protective layer 128, the portion outside the detection range pattern 124 </ b> A may be removed in advance and may be formed by application such as printing. Alternatively, the protective layer 128 including the portion outside the detection range pattern 124A may be formed on the entire surface of the glass substrate 122, and the protection layer 128 corresponding to the portion outside the detection range 124A may be removed later.

  Next, as shown in FIG. 6B, an aluminum tape 131 is attached so as to cover all the out-of-detection range patterns 124A exposed without being covered with the protective layer 128.

  Next, as shown in FIG. 6C, the portion of the glass substrate 122 to which the aluminum tape 131 is attached is held by the ground clip 136.

  Then, as shown in FIG. 6D, the ground clip 136 is connected to the support 118 and grounded. That is, the out-of-detection range pattern 124 </ b> A is grounded via the aluminum tape 131 that is the conductive member 130 and the ground clip 136.

  Thus, in this embodiment, since the adhesion layer 124 is simply a uniform layer, an etching process for making the adhesion layer 124 the same shape as the pattern layer 126 is not required. At the same time, it is not necessary to newly provide a grounding pattern for grounding on the encoder scale 120. For this reason, it is possible to prevent an increase in the number of steps for manufacturing and mounting the encoder scale 120.

  In addition, in this embodiment, the adhesion layer 124 and the pattern layer 126 are provided on the glass substrate 122. For this reason, the adhesion layer 124 can be made of an optimal material and film thickness for maintaining the adhesion strength between the glass substrate 122 and the pattern layer 126. At the same time, the pattern layer 126 can be made of an optimal material and film thickness for position detection by the detection head 110. That is, by providing the adhesion layer 124 and the pattern layer 126, the function necessary for the encoder scale 120 can be optimized freely. Therefore, in the present embodiment, the optimum pattern layer 126 necessary for detection can be realized while the adhesion of the pattern layer 126 to the glass substrate 122 can be improved. In the present embodiment, since all the pattern layers 126 are supported by the uniform adhesion layer 124, it is possible to reduce a part of the pattern layer 126 from dropping off.

  Furthermore, in the present embodiment, the adhesive layer 124 makes all the pattern layers 126 conductive and grounds regardless of the pattern shape of the pattern layer 126. For this reason, for example, even if static electricity is generated by contact of the bearings of the detection head 110, static electricity of the pattern layer 126 can be surely released, and occurrence of discharge or the like with the detection head 110 can be prevented.

  In the present embodiment, the protective layer 128 is formed so as to cover all of the adhesion layer 124 and the pattern layer 126 within the position detection range IR. For this reason, corrosion such as rust of the adhesion layer 124 and the pattern layer 126 can be prevented. That is, the deterioration of the encoder scale 120 over time can be reduced, and high durability and environmental resistance can be ensured. However, the present invention is not limited to this, and the protective layer may be formed so as to cover only a part of the adhesion layer or the pattern layer in the position detection range IR, or the protective layer may not be formed at all.

  Further, in the present embodiment, the aluminum tape 131 is provided so as to cover all the out-of-detection range patterns 124A in which the protective layer 128 is not formed. For this reason, the corrosion of the pattern 124A outside the detection range can be further reduced, and higher environmental resistance can be realized. However, the present invention is not limited to this, and the aluminum tape may be provided so as to cover only a part of the pattern outside the detection range where the protective layer is not formed, or covers the pattern outside the detection range where the protective layer is not formed. It does not have to be. Further, the covering member may be a conductive adhesive such as conductive silicone or another conductive member instead of the aluminum tape.

  In the present embodiment, the conductive member 130 includes an aluminum tape 131 including an aluminum film 132 and a resin adhesive film 134 including a conductive filler on the lower surface thereof. The aluminum tape 131 has a passive film on its surface. For this reason, corrosion of the aluminum film 132 itself can be prevented. The aluminum film 132 is electrically connected to the detection outside pattern 124 </ b> A through the conductive filler of the resin adhesive film 134. Here, the aluminum film 132 itself has a high spreadability, and a resin adhesive film 134 is interposed between the aluminum film 132 and the outside detection range pattern 124A. For this reason, it can prevent that a clearance gap arises between the aluminum film 132 and the pattern 124A outside a detection range, and a water | moisture content enters there. In addition, the aluminum film 132 and the adhesion layer 124 are not in direct electrical contact. For this reason, generation | occurrence | production of the electric corrosion based on an ionization tendency etc. can be avoided. For this reason, it is possible to prevent an error in position detection due to dropping of the pattern 124A outside the detection range and the pattern layer 126 caused by electric corrosion or the like.

  In addition, not only this but a conductive member may be provided with the aluminum film which does not have a resin adhesive film in an aluminum tape (Cu film may be sufficient). Alternatively, instead of an aluminum film, a conductive inorganic compound film such as ITO may be used. In this case, conduction between the film and the pattern outside the detection range may be established by the pressing force of the ground clip. Alternatively, the earth clip may be directly connected to the pattern outside the detection range. Alternatively, there may be no ground clip, and the conductive member may be only a covered wire or a mesh wire. Alternatively, the conductive member may be composed of only a conductive adhesive such as conductive silicone or another conductive member.

  In the present embodiment, the conductive member 130 includes a ground clip 136. The ground clip 136 holds the aluminum film 132 and the glass substrate 122 together so as to press the aluminum film 132 against the detection range outside pattern 124A. For this reason, the conduction to the aluminum tape 131 of the pattern 124A outside the detection range can be further stabilized. At the same time, the encoder scale 120 can be easily attached to and detached from the support 118 while the encoder scale 120 is securely grounded. Of course, the earth clip 136 itself can be easily replaced. However, the present invention is not limited to this, and the ground clip may not have the shape shown in FIGS.

  In the present embodiment, the encoder scale 120 is grounded at only one place. For this reason, it is avoided that the encoder scale 120 forms an electrical loop, which is a so-called “antenna” configuration. That is, it is possible to prevent the encoder scale 120 from picking up electrical noise. However, the present invention is not limited to this, and the encoder scale may be grounded at a plurality of locations. In that case, noise can be reduced by using a filter or the like together.

  That is, in this embodiment, the phenomenon that static electricity is charged in the encoder scale 120 can be stably eliminated.

  Although the present invention has been described with reference to the first embodiment, the present invention is not limited to the above-described embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in the first embodiment, the encoder 100 is an electromagnetic induction linear encoder, but the present invention is not limited to this. For example, the encoder may be composed of only a photoelectric encoder, or may include both a photoelectric encoder and an electromagnetic induction encoder. When the encoder includes a photoelectric encoder, for example, a material and a film forming method having different reflectivities between the adhesion layer and the pattern layer can be used (for example, use of high reflectivity for Al Cu, Ti, Cr) For example, a transparent material such as ITO is used for the adhesion layer). Alternatively, as shown in the second embodiment in FIG. 7, a removal pattern 224 </ b> A from which the adhesion layer 224 is removed may be formed between the pattern layers 226 to increase the reflectance. When the encoder includes a photoelectric encoder, it is desirable that the protective layer be a transparent body. As described above, when the encoder includes the photoelectric encoder, it is possible not only to prevent discharge of static electricity but also to prevent malfunction of the encoder due to dust or dust adhesion due to static electricity. Of course, the encoder may be a rotary type and the encoder scale may be a disk shape, or a cylindrical type and the encoder scale may be a cylindrical shape.

  In the first embodiment, the insulating substrate is the glass substrate 122. However, the present invention is not limited to this, and for example, a substrate on which circuit components such as a glass epoxy substrate and a ceramic substrate are mounted. Alternatively, a substrate obtained by subjecting only the surface to an Si substrate as a base may be used. Alternatively, a sapphire substrate or a quartz substrate may be used.

  In the first embodiment, the encoder 100 is an assembly type and the detection head 110 is provided with a bearing, and the bearing contacts the encoder scale 120. However, the present invention is not limited to this. For example, a separate type in which the encoder is separated into a detection head and an encoder scale may be used. In this case, the detection head has no bearing. For example, the detection head is supported by the movable part of the apparatus and the encoder scale is supported by the fixed part of the apparatus. Then, the detection head and the encoder scale are configured to be in a non-contact state with a slight gap (for example, 100 μm or less). Static electricity countermeasures may occur not only when the bearings come into contact with each other, but also due to the distance between the detection head and the encoder scale and the environment in which the encoder is used (temperature / humidity level, excessive dust / dust). Yes, correspondingly effective.

  In the first embodiment, the support body 118 directly supports the encoder scale 120, but the present invention is not limited to this. For example, the encoder scale may be directly attached to the fixed portion of the apparatus with an attachment member or the like (including an adhesive), and the encoder scale may be connected to the reference potential of the apparatus, that is, grounded.

  In the first embodiment, the adhesion layer 124 and the pattern layer 126 are formed on the detection head side surface 122A of the glass substrate 122, but the present invention is not limited to this. For example, the adhesion layer and the pattern layer may be formed on the anti-detection head side surface (back surface) of the glass substrate. If the glass substrate is correspondingly thin, the same effect as the first embodiment can be obtained.

  In the first embodiment, the conductive member 130 includes the ground clip 136, but the present invention is not limited to this. For example, it may be as in the third embodiment shown in FIG. In the third embodiment, instead of the ground clip, a conductive elastic member 338 is disposed between a metal member such as an aluminum frame constituting the support. As the elastic member 338, for example, conductive resin, elastomer, interconnector, or the like can be used. In this case, the elastic member 338 is disposed between the glass substrate 322 and the support so as to press the aluminum film 332 against the outside detection range pattern 324A. For this reason, the elastic member 338 can apply a uniform pressing force to the aluminum film 332 on the surface facing the glass substrate 322. That is, in this embodiment, not only can the same effect as the first embodiment be obtained, but also the conduction of the pattern 324A outside the detection range to the aluminum tape 331 can be further stabilized. The ground clip may be combined, and the ground clip may sandwich the elastic member alone or from the glass substrate to the elastic member together.

  The present invention can be widely applied to an insulating encoder scale that is displaced relative to the detection head.

DESCRIPTION OF SYMBOLS 100 ... Encoder 110 ... Detection head 118 ... Support body 120, 220, 320 ... Encoder scale 122, 222, 322 ... Glass substrate 122A ... Detection head side surface 124, 224, 324 ... Adhesion layer 124A, 324A ... Pattern outside detection range 124B ... Detection range pattern 124C ... Upper surface 125 ... Functional layer 126, 226, 326 ... Pattern layer 128, 328 ... Protective layer 130, 330 ... Conductive member 131, 331 ... Aluminum tape 132, 332 ... Aluminum film 134, 334 ... Resin adhesion Membrane 136... Earth clip 136 A. Locking portion 136 B. Grip portion 136 C. Leaf spring portion 136 D. layer

Claims (8)

In the encoder scale that is displaced relative to the detection head,
An insulating substrate;
A conductive adhesion layer formed on the substrate;
A conductive pattern layer formed in a shape enabling position detection by the detection head on the adhesion layer;
The adhesion layer includes all of the pattern layers in a conductive state, and further includes a pattern outside the detection range that extends outward from the position detection range by the detection head,
The encoder scale, wherein the pattern outside the detection range is grounded via a conductive member.   The encoder scale according to claim 1, wherein an insulating protective layer is formed so as to cover all of the adhesion layer and the pattern layer within the position detection range.   The encoder scale according to claim 2, wherein the conductive member is provided so as to cover all the patterns outside the detection range in which the protective layer is not formed. The conductive member includes a conductive thin film and a resin adhesive film including a conductive filler on a lower surface thereof,
The encoder scale according to any one of claims 1 to 3, wherein the thin film is electrically connected to the pattern outside the detection range by contacting the pattern outside the detection range and the conductive filler. The conductive member further includes a metallic gripping member formed into a shape that can be elastically deformed and sandwich the substrate,
When the conductive member includes a conductive thin film, the gripping member holds the thin film and the substrate together so as to press the thin film against the pattern outside the detection range. The encoder scale according to any one of claims 1 to 4. The conductive member further includes an elastic member having conductivity,
When the conductive member includes a conductive thin film, the elastic member is disposed so as to press the thin film against the pattern outside the detection range. Encoder scale as described.   The encoder scale according to claim 1, wherein the encoder scale is grounded only at one place. In the manufacturing and mounting method of the encoder scale that is displaced relative to the detection head,
Forming a conductive adhesion layer on an insulating substrate;
Forming a pattern layer on the adhesion layer in a shape that is all conductive in the adhesion layer and allows position detection with the detection head;
A step of grounding the pattern outside the detection range extending outward from the position detection range by the detection head of the adhesion layer via a conductive member;
A method for manufacturing and mounting an encoder scale, comprising:

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