JP6486296B2 - Manufacturing method of plate material - Google Patents

Manufacturing method of plate material Download PDF

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JP6486296B2
JP6486296B2 JP2016091046A JP2016091046A JP6486296B2 JP 6486296 B2 JP6486296 B2 JP 6486296B2 JP 2016091046 A JP2016091046 A JP 2016091046A JP 2016091046 A JP2016091046 A JP 2016091046A JP 6486296 B2 JP6486296 B2 JP 6486296B2
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圭介 三渡
圭介 三渡
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株式会社しそうの森の木
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本発明は板材の製造方法に関する。   The present invention relates to a method for manufacturing a plate material.

例えば、兵庫県内の民有林のうち、ほぼ40%が広葉樹林であり、その広葉樹林のうちほぼ40%がコナラやクヌギであるとの統計がある。広葉樹のうち、クリ、タモ、ケヤキ、ミズナラ等は木材の原料として広く利用されているが、成長に長い時間を必要とし、樹齢の古い木を使用する必要があることから、わが国では豊富な資源とはいえず、専ら輸入に頼っていた。
他方、広葉樹のうち、コナラやクヌギは成長が早く、資源としても豊富であり、杉や檜と同様に大量に使用が可能である。
For example, there are statistics that about 40% of the private forests in Hyogo Prefecture are broad-leaved forests, and about 40% of the broad-leaved forests are Quercus or Kunugi. Among broad-leaved trees, chestnuts, tammo, zelkova, mizunara, etc. are widely used as raw materials for timber. That said, it relied solely on imports.
On the other hand, among broad-leaved trees, Quercus and Kunugi grow fast and are abundant as resources, and can be used in large quantities, like cedar and bamboo.

ところで、木材を30°C〜50°Cの範囲の温度で、反り、歪み、変色を生じることなく低温乾燥するようにした技術が提案されているが(特許文献1)、この低温乾燥技術によってコナラやクヌギを乾燥させても反りや捩じれが発生して板材の用途には使用し難く、薪炭や椎茸のほだ木として利用されるに止まっていた(特許文献2)。   By the way, although the technique of drying low temperature without producing a curvature, distortion, and discoloration at the temperature of the range of 30 degreeC-50 degreeC is proposed (patent document 1), this low temperature drying technique is proposed. Even when dried konara and kunugi, warping and twisting occur, making it difficult to use for plate materials, and it has only been used as a charcoal or shiitake mushroom (Patent Document 2).

特開平09−318251号公報JP 09-318251 A 特開平07−327486号公報JP 07-327486 A

最近、薪炭やほだ木への需要が減少し、又里山が手入れされずに放置され、ほだ木を生産する場合にも樹齢60〜80年の大木を切ってその枝をほだ木に使用することが行われており、コナラやクヌギの用途の開発が求められていた。   Recently, the demand for wood charcoal and wood has decreased, and satoyama has been left unmaintained, and even when producing wood, it is used to cut large trees of 60 to 80 years old and use their branches for wood. There was a need to develop applications for Quercus and Kunugi.

本発明はかかる点に鑑み、コナラやクヌギから建築材などの板材を製造できるようにした板材の製造方法を提供することを課題とする。   This invention makes it a subject to provide the manufacturing method of the board | plate material which enabled it to manufacture board | plate materials, such as a building material, from a Japanese oak and a kunugi in view of this point.

そこで、本発明に係る板材の製造方法は、フローリング材を製造するにあたり、コナラ又はクヌギの幹から直材を切り出す工程と、直材から仕上げ幅及び仕上げ厚さよりも大きな粗板を製材する工程と、粗板を35°C以上60°C以下の範囲内の温度で10%を超え20%以下の範囲内の含水率となるまで低温乾燥する工程と、低温乾燥済みの粗板を仕上げ幅及び仕上げ厚さより大きな素板材に粗仕上げする工程と、粗仕上げ済みの素板材を遮光防湿シートで覆って養生する工程と、養生された素板材を35°C以上60°C以下の範囲内の温度で10%以下の含水率になるまで低温再乾燥する工程と、低温再乾燥済みの素板材を仕上げ幅及び仕上げ厚みのフローリング材に仕上げる工程と、を備えたことを特徴とする。   Therefore, in the production method of the plate material according to the present invention, in producing the flooring material, a step of cutting out a direct material from the trunk of konara or kunugi, and a step of producing a rough plate larger than the finishing width and the finishing thickness from the direct material, A step of low-temperature drying the rough plate at a temperature in the range of 35 ° C. to 60 ° C. until the moisture content is in the range of more than 10% and 20% or less; The step of rough finishing to a base material larger than the finished thickness, the step of covering the rough finished base material with a light-proof moisture-proof sheet and curing, and the temperature of the cured base material within a range of 35 ° C to 60 ° C And a step of finishing the low-temperature re-dried base material into a flooring material having a finished width and a finished thickness.

本発明の特徴はコナラ又はクヌギから粗材を製材し、これを35°C〜60°Cの範囲内の温度で15%〜20%の範囲内の含水率となるまで低温乾燥し、遮光防湿シートで覆って養生した後、35°C〜60°Cの範囲内の温度で10%以下の含水率となるまで低温再乾燥し、板材に仕上げるようにした点にある。   A feature of the present invention is that a rough material is sawn from Quercus or Kunugi, and this is dried at a low temperature until the moisture content is within a range of 15% to 20% at a temperature within a range of 35 ° C. to 60 ° C. After covering and curing with a sheet, it is re-dried at a low temperature until a moisture content of 10% or less at a temperature in the range of 35 ° C. to 60 ° C. to finish the plate.

35°C〜60°Cの範囲内の温度で10%〜20%の範囲内の含水率になるまで低温乾燥することによって反りや捩じれが少ない粗板が得られ、これを養生することによって粗板の含有水分が粗板全体で均一となり、その後に10%以下の含水率になるまで低温再乾燥することによって反りや捩じれのない素板材が得られ、これを所定の寸法の板材に仕上げることによって、ブナやチークよりも高密度で高磨耗性の板材が得られ、家具材や床材に最適な板材を製造することができる。   A rough plate with less warping and twisting is obtained by drying at a low temperature until the moisture content is within the range of 10% to 20% at a temperature within the range of 35 ° C to 60 ° C. A base plate material free from warping and twisting is obtained by re-drying at a low temperature until the moisture content of the plate becomes uniform throughout the rough plate and then reaches a moisture content of 10% or less, and this is finished into a plate material of a predetermined size. As a result, a plate material having higher density and higher wear than beech and teak can be obtained, and a plate material optimal for furniture and flooring can be produced.

また、コナラ又はクヌギの特性として虎班などの杢があり、ナラやクリにも相当する高級な質感で意匠性にも優れ、釘の保持力が高く、施工性に優れた板材が得られる。   In addition, the characteristics of the oak or kunugi include tigers and the like, and a high-quality texture equivalent to oak and chestnut, excellent design, high nail holding power, and excellent workability can be obtained.

コナラやクヌギの幹から直材を切り出す場合、末口が25cm以上、好ましくは28cm以上のコナラ又はクヌギの幹から曲がり部分で切断して1〜5mの範囲内の長さ、好ましくは2m〜4mの範囲内の長さの直材を切り出すのがよい。   When cutting straight wood from konara or kunugi trunks, the end is 25 cm or more, preferably 28 cm or more, and the length is in the range of 1 to 5 m, preferably 2 m to 4 m. It is better to cut out straight wood with a length within the range.

直材を製材して得られる粗板は板材の仕上げ幅よりも15mm以上、好ましくは20mm以上大きく、仕上げ厚さよりも5mm以上大きな粗板とするのがよい。直材は帯鋸台車とテーブルソーを用いて粗板に製材する。   The rough plate obtained by producing the direct material is preferably a rough plate that is 15 mm or more, preferably 20 mm or more larger than the finished width of the plate material, and 5 mm or more larger than the finished thickness. The direct material is made into a rough plate using a band saw carriage and a table saw.

粗板や素板材は低温乾燥機を用い、35°C〜60°Cの範囲内の温度にて低温乾燥する。35°C以上としたのは35°C未満の温度では粗板を10%〜20%の範囲内の含水率又は素板材を10%以下の含水率まで乾燥するのに長い時間を必要とし、60°Cを超えると、乾燥によって反りや捩じれが大きくなるおそれがあるからである。   The rough plate and the base plate material are dried at a low temperature at a temperature in the range of 35 ° C. to 60 ° C. using a low temperature dryer. The reason why the temperature is set to 35 ° C. or more is that it takes a long time to dry the rough plate to a moisture content in the range of 10% to 20% or a base plate material to a moisture content of 10% or less at a temperature below 35 ° C. This is because if it exceeds 60 ° C, warping and twisting may increase due to drying.

粗板はフィンガーシェーバーによってフィンガージョイントを加工し、接着して必要な長さにする。   The rough plate is processed by finger joint with a finger shaver and bonded to the required length.

板材は例えば木実はぎによって幅方向に接合してフローリング板に使用することができ、又板材を厚み方向に接着して集成材の用途にも利用できる。   The plate material can be used in a flooring plate by joining it in the width direction with, for example, tree nuts, and can also be used for laminated wood applications by bonding the plate material in the thickness direction.

そこで、本発明に係る板材の製造方法は、集成材又は幅はぎ材を製造するにあたり、コナラ又はクヌギの幹から直材を切り出す工程と、直材から仕上げ幅及び仕上げ厚さよりも大きな粗板を製材する工程と、粗板を35°C以上60°C以下の範囲内の温度で12%を超え20%以下の範囲内の含水率となるまで低温乾燥する工程と、低温乾燥済みの粗板を仕上げ幅及び仕上げ厚さより大きな素板材に粗仕上げする工程と、粗仕上げ済みの素板材を遮光防湿シートで覆って養生する工程と、養生された素板材を35°C以上60°C以下の範囲内の温度で12%以下の含水率になるまで低温再乾燥する工程と、低温再乾燥済みの素板材を仕上げ幅及び仕上げ厚みの集成材又は幅はぎ材に仕上げる工程と、を備えたことを特徴とする。   Therefore, in the production method of the plate material according to the present invention, in producing the laminated material or the width strip material, a step of cutting out the direct material from the trunk of the oak or kunugi, and a rough plate larger than the finishing width and the finishing thickness from the direct material. A step of lumbering, a step of low-temperature drying the rough plate at a temperature in the range of 35 ° C. to 60 ° C. until the moisture content is in the range of more than 12% and 20% or less; Rough finishing to a base material larger than the finishing width and finish thickness, covering the rough finished base material with a light-proof moisture-proof sheet, curing, and curing the base material from 35 ° C to 60 ° C A step of low-temperature re-drying until a moisture content of 12% or less at a temperature within the range, and a step of finishing the low-temperature re-dried base plate material into a finished width and finished thickness of laminated material or width strip material It is characterized by.

本発明に係る板材の製造方法の好ましい実施形態を示す図である。It is a figure which shows preferable embodiment of the manufacturing method of the board | plate material which concerns on this invention. 上記実施形態の板材をフローリング板に適用した1例を示す図である。It is a figure which shows one example which applied the board | plate material of the said embodiment to the flooring board. 上記実施形態の板材を集積材に適用した1例を示す図である。It is a figure which shows one example which applied the board | plate material of the said embodiment to the accumulation | aggregation material.

以下、本発明を図面に示す具体例に基づいて詳細に説明する。図1は本発明に係る板材の製造方法の好ましい実施形態を示す。本例の方法によって板材を製造する場合、図1の工程1に示されるように、まずコナラ又はクヌギを伐採する。末口28cm以上の幹を曲がり部で切って直材とする。2m〜4mで造材とする。   Hereinafter, the present invention will be described in detail based on specific examples shown in the drawings. FIG. 1 shows a preferred embodiment of a method for producing a plate material according to the present invention. When manufacturing a board | plate material with the method of this example, as shown in the process 1 of FIG. Cut the trunk at the end of 28cm or more at the bend to make a direct material. The lumber is made from 2 m to 4 m.

次に、図1の工程2に示されるように、粗板の製材を行う。帯鋸台車とテーブルソーによって仕上がり幅よりも+20mm、仕上がり厚みよりも+5mm以上に製材する。辺材、かびやシミや虫食いがあるものはチップにする。製材した後は速やかに「べた積」をし、かびの侵入を防ぐ。また、反りや捩じれがでないように、直射日光を避け、風雨にあてないようにする。   Next, as shown in step 2 of FIG. With a band saw carriage and a table saw, the lumber is sawed to + 20mm from the finished width and + 5mm from the finished thickness. Chips with sapwood, mold, stains, and worms. Immediately after lumbering, “solid” is applied to prevent mold from entering. Also, avoid direct sunlight and avoid being exposed to wind and rain to avoid warping or twisting.

次の図1の工程3では人工乾燥を行う。低温乾燥機内にて24mm以上の厚みの桟木を60cmピッチ以下で入れ、幅方向には1cm以上の隙間をあけて粗板を桟積みにし、35°C〜60°Cの範囲内の温度で10%を超え20%以下の範囲内の含水率になるまで低温乾燥する。乾燥時間は粗板の含水率によって変動する。粗板の含水率が多ければ長い時間を必要とする。   In the next step 3 of FIG. 1, artificial drying is performed. In a low-temperature dryer, a slab with a thickness of 24 mm or more is put at a pitch of 60 cm or less, and a rough board is stacked with a gap of 1 cm or more in the width direction, and the temperature is within a range of 35 ° C. to 60 ° C. Dry at low temperature until the water content is in the range of more than 20% and not more than 20%. The drying time varies depending on the moisture content of the rough plate. If the moisture content of the rough plate is high, a long time is required.

次に、図1の工程4に示されるように、低温乾燥済みの粗板の欠点除去を行う。まず、仕上がり幅よりも+10mm、仕上がり厚みよりも+4mmとなるように、荒かんなをかける。その後、虫食い、割れ、かび、曲がり、折れ節などの欠点をカットソーにて取り除き、素板材とする。その際、1ユニットが40cm以上になるようにする。   Next, as shown in Step 4 of FIG. 1, the defect removal of the low-temperature dried rough plate is performed. First, roughing is applied so that the finished width is +10 mm and the finished thickness is +4 mm. Thereafter, defects such as worm-eaten, cracks, mold, bends, and bent nodes are removed with a cut-and-sew, and a base plate material is obtained. At that time, 1 unit should be 40 cm or more.

得られた素板材は図1の工程5に示されるフィンガー加工を行う。フィンガー加工はフィンガーシェーバーを使用し、素板材10A、10Bの対向する端面に図2の(b)に示されるようにフィンガー10Cを形成する。フィンガー加工が済むと、接着剤、例えば水性塩化ビニル系接着剤にて素板材10A、10Bを長手方向に接着した後、必要な長さに切り揃える。接着の際、ピンホールができないように調整した圧力でプレスする。   The obtained base material is subjected to finger processing shown in step 5 of FIG. For finger processing, a finger shaver is used, and the fingers 10C are formed on the opposing end surfaces of the base plate materials 10A and 10B as shown in FIG. When the finger processing is completed, the base plate materials 10A and 10B are bonded in the longitudinal direction with an adhesive, for example, an aqueous vinyl chloride-based adhesive, and then trimmed to a required length. When bonding, press with pressure adjusted so that pinholes are not formed.

次に、図1の工程6に示されるように、保管・養生を行う。24mm以上の厚みの桟木を60cmピッチ以下で入れて桟積みし、湿気を吸わないように遮光防湿シート、例えばポリシートをかぶせて保管養生する。この養生によって素板材の含有水分が素板材の全体に均一となる。保管・養生の時間は製品の受注があるまでであるが、品質の安定性のためには長期間の保管・養生が好ましい。   Next, as shown in step 6 of FIG. 1, storage and curing are performed. A pedestal having a thickness of 24 mm or more is put at a pitch of 60 cm or less and stacked and covered with a light-proof moisture-proof sheet such as a poly sheet so as not to absorb moisture. By this curing, the moisture content of the base material becomes uniform throughout the base material. The storage / curing time is until a product is ordered, but long-term storage / curing is preferred for quality stability.

受注があると、図1の工程7に示される再乾燥を行う。低温乾燥機内にて24mm以上の厚みの桟木を60cmピッチ以下で入れ、幅方向には1cm以上の隙間をあけて粗板を桟積みにし、35°C〜60°Cの範囲内の温度で10%以下の含水率になるまで低温再乾燥する。これによって反りや捩じれの少ない安定した品質の素板材が得られる。   When an order is received, the re-drying shown in step 7 of FIG. 1 is performed. In a low-temperature dryer, a slab with a thickness of 24 mm or more is put at a pitch of 60 cm or less, and a rough board is stacked with a gap of 1 cm or more in the width direction, and the temperature is within a range of 35 ° C. to 60 ° C. Re-dry at low temperature until water content is less than 10%. As a result, a stable quality base material with less warping and twisting can be obtained.

こうして素板材の低温再乾燥が済むと、図1の工程8に示されるように、仕上げ加工を行って板材を製造する。すなわち、モルダーを用いて木実加工を行い、素板材10の一方の側面にさね10D、他方の側面に溝10Eを形成するとともに、ダブルエンドテノーナーにてエンドマッチ加工を施し、節や割れなどをパテと接着剤で補修し、ワイドサンダーにて♯240の粗さに仕上げる。   When the low-temperature re-drying of the base plate material is completed in this way, as shown in Step 8 of FIG. 1, finishing is performed to manufacture the plate material. In other words, the wood is machined using a molder, and a groove 10E is formed on one side of the base material 10 and a groove 10E is formed on the other side. Are repaired with putty and adhesive, and finished with # 240 roughness with a wide sander.

この板材にロールコーターで均等に天然系塗料を塗布し、十分に乾燥させると、製品のフローリング材が得られる。塗布回数は塗料の仕様書による。最後に、空気を吸わないように、フローリング材を遮光不通気性の袋、例えばポリエチレン袋に入れて密封して輸送する。   When a natural coating material is evenly applied to the plate material with a roll coater and sufficiently dried, a product flooring material is obtained. The number of applications depends on the paint specifications. Finally, the flooring material is sealed and transported in a light-shielding and impermeable bag, for example, a polyethylene bag, so as not to inhale air.

以上はフローリング材の製造方法であったが、集成材や幅はぎ材を製造する場合、低温再乾燥(工程7)まではフローリング材の場合と同様である。ただし、低温再乾燥は含水率12%以下までとする。低温再乾燥が済むと、事前加工を行う。つまり、モルダーを用い、幅はぎ材は直材加工を行い、積層材は引き割り加工を行う。   The above is the manufacturing method of a flooring material, but when manufacturing a laminated material and a width | variety strip material, it is the same as that of the case of a flooring material until low temperature re-drying (process 7). However, low-temperature re-drying is limited to a moisture content of 12% or less. After low temperature re-drying, pre-processing is performed. That is, using a molder, the width strip material is processed directly, and the laminated material is split.

その後、プレス機にかけ、接着剤、例えば水性塩化ビニル系接着剤にて接着し、必要寸法に成型し、プレナーで仕上げ寸法よりも0.5mm大きくかんながけをし、ワイドサンダーで♯240の粗さに仕上げ、幅はぎ材や図3に示される集成材20を製造し、遮光不通気性の袋、例えばポリエチレン袋に入れて密封して輸送する。   After that, it is put on a press machine, glued with an adhesive such as an aqueous vinyl chloride adhesive, molded to the required size, and finished with a planer that is 0.5 mm larger than the finished dimension, and a # 240 roughness with a wide sander. After finishing, the stripping material and the laminated material 20 shown in FIG. 3 are manufactured, and sealed and transported in a light-shielding and air-impermeable bag such as a polyethylene bag.

10 素板材
20 集成材
10 Substrate 20 Glulam

Claims (2)

フローリング材を製造するにあたり、
コナラ又はクヌギの幹から直材を切り出す工程と、
直材から仕上げ幅及び仕上げ厚さよりも大きな粗板を製材する工程と、
粗板を35°C以上60°C以下の範囲内の温度で10%を超え20%以下の範囲内の含水率となるまで低温乾燥する工程と、
低温乾燥済みの粗板を仕上げ幅及び仕上げ厚さより大きな素板材に粗仕上げする工程と、
粗仕上げ済みの素板材を遮光防湿シートで覆って養生する工程と、
養生された素板材を35°C以上60°C以下の範囲内の温度で10%以下の含水率になるまで低温再乾燥する工程と、
低温再乾燥済みの素板材を仕上げ幅及び仕上げ厚みのフローリング材に仕上げる工程と、を備えたことを特徴とする板材の製造方法。
In producing flooring materials,
Cutting out a direct material from the trunk of konara or kunugi;
The process of sawing a rough plate larger than the finish width and finish thickness from the direct material,
A step of low-temperature drying the rough plate at a temperature in the range of 35 ° C. or more and 60 ° C. or less until the moisture content is in the range of more than 10% and 20% or less;
Rough finishing the low-temperature-dried rough board into a base material larger than the finishing width and finishing thickness;
Covering the rough-finished base material with a light-proof moisture-proof sheet and curing,
A step of re-drying the cured base material at a temperature in the range of 35 ° C. or more and 60 ° C. or less until a moisture content of 10% or less is obtained;
And a step of finishing the low-temperature re-dried base plate material into a flooring material having a finished width and a finished thickness.
集成材又は幅はぎ材を製造するにあたり、
コナラ又はクヌギの幹から直材を切り出す工程と、
直材から仕上げ幅及び仕上げ厚さよりも大きな粗板を製材する工程と、
粗板を35°C以上60°C以下の範囲内の温度で12%を超え20%以下の範囲内の含水率となるまで低温乾燥する工程と、
低温乾燥済みの粗板を仕上げ幅及び仕上げ厚さより大きな素板材に粗仕上げする工程と、
粗仕上げ済みの素板材を遮光防湿シートで覆って養生する工程と、
養生された素板材を35°C以上60°C以下の範囲内の温度で12%以下の含水率になるまで低温再乾燥する工程と、
低温再乾燥済みの素板材を仕上げ幅及び仕上げ厚みの集成材又は幅はぎ材に仕上げる工程と、
を備えたことを特徴とする板材の製造方法。
In manufacturing laminated or width strips,
Cutting out a direct material from the trunk of konara or kunugi;
The process of sawing a rough plate larger than the finish width and finish thickness from the direct material,
A step of low-temperature drying the rough plate at a temperature in the range of 35 ° C. or more and 60 ° C. or less until the moisture content is in the range of more than 12% and 20% or less;
Rough finishing the low-temperature-dried rough board into a base material larger than the finishing width and finishing thickness;
Covering the rough-finished base material with a light-proof moisture-proof sheet and curing,
A step of re-drying the cured base material at a low temperature until a moisture content of 12% or less at a temperature in the range of 35 ° C. or more and 60 ° C. or less;
Finishing the low-temperature re-dried base material into a finished width or finished thickness laminated or stripped material,
A method for producing a plate material, comprising:
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US4182048A (en) * 1978-02-21 1980-01-08 U.S. Natural Resources, Inc. Method of drying lumber
JPS58179602A (en) * 1982-04-14 1983-10-20 株式会社甲州屋 Warehouse for taking custody of wood
JP2516450Y2 (en) * 1993-04-05 1996-11-06 有限会社フジカンソー Wood dryer
JP2607564Y2 (en) * 1993-09-14 2001-11-12 段谷産業株式会社 Floorboard
JPH09318251A (en) * 1996-05-27 1997-12-12 Hakusan Seisakusho:Kk Lumber drier
JP2003170405A (en) * 2001-12-05 2003-06-17 Kitosugi Shuseizai Kako Kyodo Kumiai Method and apparatus for drying by steam heating of lumber
JP2009184228A (en) * 2008-02-06 2009-08-20 Try Wood:Kk Drying method for lumber
JP5288873B2 (en) * 2008-05-02 2013-09-11 独立行政法人森林総合研究所 Method for measuring moisture in wood
JP4199824B1 (en) * 2008-06-10 2008-12-24 株式会社コシイプレザービング Method for producing modified wood
CN101628440B (en) * 2009-08-07 2011-02-09 广东省宜华木业股份有限公司 Production method of weather-proof multilayer composite wood floor
JP4754027B1 (en) * 2010-05-27 2011-08-24 貫一 福井 Manufacturing method of cedar medium grain laminated lumber

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