JP6472332B2 - Wafer generation method - Google Patents

Description

  The present invention relates to a method for producing a wafer in which a hexagonal single crystal ingot is sliced into wafers.

  Various devices such as IC and LSI are formed in a region partitioned by a plurality of scheduled division lines on a functional layer laminated on the surface of a wafer made of silicon or the like. Then, the wafer division line is processed by a processing device such as a cutting device or a laser processing device, the wafer is divided into individual device chips, and the divided device chips are applied to various electronic devices such as mobile phones and personal computers. Widely used.

  In addition, a power device or an optical device such as an LED or LD has a functional layer laminated on the surface of a wafer made of a hexagonal single crystal such as SiC or GaN, and a plurality of layers formed in a lattice shape on the laminated functional layer. It is divided and formed by a predetermined dividing line.

  The wafer on which the device is formed is generally produced by slicing an ingot with a wire saw, and the front and back surfaces of the sliced wafer are polished to a mirror finish (see, for example, Japanese Patent Application Laid-Open No. 2000-94221).

  In this wire saw, a single wire such as a piano wire having a diameter of about 100 to 300 μm is usually wound around a number of grooves provided on two to four spacing auxiliary rollers and arranged parallel to each other at a constant pitch. An ingot is sliced into a plurality of wafers by running the wire in a certain direction or in both directions.

  However, when the ingot is cut with a wire saw and the front and back surfaces are polished to produce a wafer, 70 to 80% of the ingot is discarded, which is uneconomical. In particular, hexagonal single crystal ingots such as SiC and GaN have high Mohs hardness, are difficult to cut with a wire saw, take a considerable amount of time, have poor productivity, and have a problem in efficiently producing a wafer. Yes.

  In order to solve these problems, a focusing point of a laser beam having a wavelength that is permeable to SiC is positioned inside the hexagonal single crystal ingot, and a modified layer and a crack are formed on the planned cutting surface. Japanese Unexamined Patent Application Publication No. 2013-49161 discloses a technique in which an external force is applied to cleave a wafer along a planned cutting surface on which a modified layer and a crack are formed to separate the wafer from the ingot.

  In the technique described in this publication, the condensing point of the pulse laser beam is set so that the first irradiation point of the pulse laser beam and the second irradiation point closest to the first irradiation point are in a predetermined position. Is irradiated spirally along the planned cutting surface, or is irradiated linearly to form a very high-density modified layer and cracks on the planned cutting surface of the ingot.

JP 2000-94221 A JP 2013-49161 A

  However, in the ingot cutting method described in Patent Document 2, the laser beam irradiation method is spiral or linear with respect to the ingot, and in the case of the linear shape, the direction in which the laser beam is scanned is not defined at all.

  In the ingot cutting method described in Patent Document 2, the pitch between the first irradiation point of the laser beam and the second irradiation point closest to the first irradiation point is set to 1 μm to 10 μm. . This pitch is a pitch at which cracks generated from the modified layer extend along the c-plane.

  Since the pitch when irradiating the laser beam is very small in this way, it is necessary to irradiate the laser beam at a very small pitch interval, regardless of whether the laser beam irradiation method is spiral or linear. There is a problem that productivity is not sufficiently improved.

  The present invention has been made in view of these points, and an object of the present invention is to provide a wafer generation method capable of efficiently generating a wafer from an ingot.

  According to the present invention, the first surface, the second surface opposite to the first surface, the c-axis extending from the first surface to the second surface, and the c-plane orthogonal to the c-axis A wafer generating method for generating a wafer from a hexagonal single crystal ingot having: a condensing point of a laser beam having a wavelength transparent to the hexagonal single crystal ingot is generated from the first surface It is positioned at a depth corresponding to the thickness of the wafer, and the laser beam is applied to the first surface by moving the focusing point and the hexagonal single crystal ingot relative to each other. A separation origin forming step for forming a separation starting point by forming a parallel modified layer and a crack extending from the modified layer, and a plate corresponding to the thickness of the wafer from the separation starting point after performing the separation starting point forming step The hexagonal crystal is peeled off from the hexagonal single crystal ingot. A separation step of forming a crystal wafer, wherein the c-axis is inclined by an off-angle with respect to the normal of the first surface, and the first surface and the c surface A modified layer forming step of forming a linear modified layer by relatively moving the condensing point of the laser beam in a direction orthogonal to the direction in which the off angle is formed, and the off angle is formed An index step for indexing a predetermined amount by relatively moving the condensing point in a direction, and the wafer peeling step includes an ultrasonic diaphragm through the bond material and the first hexagonal single crystal ingot There is provided a method for producing a wafer, characterized in that the wafer is adhered to a surface and ultrasonic waves are applied to the hexagonal single crystal ingot to peel the plate from the hexagonal single crystal ingot to produce a wafer.

  Preferably, in the wafer peeling step, the bond material to be used is an ultraviolet curable resin whose adhesive strength is reduced by the irradiation of ultraviolet rays. The plate-like object is detached from the sonic vibration plate.

  According to the method for producing a wafer of the present invention, a laser beam condensing point is relatively moved in a direction perpendicular to a direction in which an off angle is formed between the first surface of the ingot and the c-plane. A shaped modified layer is formed inside the ingot, and after focusing in the direction in which the off-angle is formed, the focusing point of the laser beam is relatively moved in a direction perpendicular to the direction in which the off-angle is formed. The step of forming the linear modified layer is repeated, so that the modified layer is formed at a predetermined depth from the first surface, and cracks propagate along the c-plane on both sides of the modified layer. The one modified layer and the adjacent modified layer are connected by a crack, and the plate-like material corresponding to the thickness of the wafer is easily peeled from the hexagonal single crystal ingot from the separation starting point, and the hexagonal single crystal wafer is separated. Can be generated.

  Since the direction in which the laser beam moves is set to a direction orthogonal to the direction in which the off-angle is formed, the cracks that are formed by propagating along the c-plane from both sides of the modified layer extend very long. The amount can be increased, the productivity can be sufficiently improved, and the amount of ingot to be discarded can be sufficiently reduced, and can be suppressed to about 30%.

It is a perspective view of the laser processing apparatus suitable for implementing the production | generation method of the wafer of this invention. It is a block diagram of a laser beam generation unit. FIG. 3A is a perspective view of a hexagonal single crystal ingot, and FIG. 3B is a front view thereof. It is a perspective view explaining a separation starting point formation step. It is a top view of a hexagonal single crystal ingot. It is typical sectional drawing explaining the modified layer formation step. It is a schematic plan view explaining a modified layer formation step. FIG. 8A is a schematic plan view for explaining the index step, and FIG. 8B is a schematic plan view for explaining the index amount. It is a perspective view explaining a wafer peeling step. It is a perspective view explaining the wafer detachment | leave step from an ultrasonic diaphragm. 1 is a perspective view of a produced hexagonal single crystal wafer. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, there is shown a perspective view of a laser processing apparatus 2 suitable for carrying out the wafer production method of the present invention. The laser processing apparatus 2 includes a first slide block 6 mounted on a stationary base 4 so as to be movable in the X-axis direction.

  The first slide block 6 is moved in the machining feed direction, that is, the X-axis direction along the pair of guide rails 14 by the machining feed mechanism 12 including the ball screw 8 and the pulse motor 10.

  A second slide block 16 is mounted on the first slide block 6 so as to be movable in the Y-axis direction. That is, the second slide block 16 is moved along the pair of guide rails 24 by the index feed mechanism 22 including the ball screw 18 and the pulse motor 20 in the index feed direction, that is, the Y-axis direction.

  A support table 26 is mounted on the second slide block 16. The support table 26 can be moved in the X-axis direction and the Y-axis direction by the machining feed mechanism 12 and the index feed mechanism 22 and is rotated by a motor accommodated in the second slide block 16.

  A column 28 is erected on the stationary base 4, and a laser beam irradiation mechanism (laser beam irradiation means) 30 is attached to the column 28. The laser beam irradiation mechanism 30 includes a laser beam generation unit 34 shown in FIG. 2 housed in a casing 32, and a condenser (laser head) 36 attached to the tip of the casing 32. An imaging unit 38 having a microscope and a camera aligned with the condenser 36 and in the X-axis direction is attached to the tip of the casing 32.

  As shown in FIG. 2, the laser beam generation unit 34 includes a laser oscillator 40 that oscillates a YAG laser or a YVO4 laser, a repetition frequency setting unit 42, a pulse width adjustment unit 44, and a power adjustment unit 46. . Although not particularly shown, the laser oscillator 40 has a Brewster window, and the laser beam emitted from the laser oscillator 40 is a linearly polarized laser beam.

  The pulse laser beam adjusted to a predetermined power by the power adjusting means 46 of the laser beam generating unit 34 is reflected by the mirror 48 of the condenser 36 and is further fixed on the support table 26 by the condenser lens 50. A condensing point is positioned inside a certain hexagonal single crystal ingot 11 and irradiated.

  Referring to FIG. 3A, a perspective view of a hexagonal single crystal ingot 11 that is a processing object is shown. FIG. 3B is a front view of the hexagonal single crystal ingot 11 shown in FIG. The hexagonal single crystal ingot (hereinafter sometimes simply referred to as ingot) 11 is composed of a SiC single crystal ingot or a GaN single crystal ingot.

  The ingot 11 has a first surface (upper surface) 11a and a second surface (back surface) 11b opposite to the first surface 11a. The surface 11a of the ingot 11 is polished to a mirror surface to be a laser beam irradiation surface.

  The ingot 11 has a first orientation flat 13 and a second orientation flat 15 orthogonal to the first orientation flat 13. The length of the first orientation flat 13 is longer than the length of the second orientation flat 15.

  The ingot 11 has a c-axis 19 inclined at an off angle α in the direction of the second orientation flat 15 with respect to the perpendicular 17 of the surface 11 a and a c-plane 21 orthogonal to the c-axis 19. The c-plane 21 is inclined with respect to the surface 11 a of the ingot 11 by an off angle α. In general, in the hexagonal single crystal ingot 11, the direction orthogonal to the extension direction of the short second orientation flat 15 is the c-axis inclination direction.

  The c-plane 21 is set innumerably in the ingot 11 at the molecular level of the ingot 11. In the present embodiment, the off angle α is set to 4 °. However, the off angle α is not limited to 4 °. For example, the ingot 11 can be manufactured by freely setting in the range of 1 ° to 6 °.

  Referring again to FIG. 1, a column 52 is fixed to the left side of the stationary base 4, and an ultrasonic wave application mechanism 54 can move in the vertical direction through an opening 53 formed in the column 52. It is mounted on.

  In the wafer production method of the present embodiment, as shown in FIG. 4, the ingot 11 is fixed on the support table 26 with, for example, wax or an adhesive so that the second orientation flat 15 of the ingot 11 is aligned in the X-axis direction. To do.

  That is, as shown in FIG. 5, the direction Y1 in which the off-angle α is formed, in other words, perpendicular to the perpendicular 17 of the surface 11a of the ingot 11 and the direction where the intersection 19a with the surface 11a of the c-axis 19 exists. The ingot 11 is fixed to the support table 26 by aligning the direction, that is, the direction of arrow A with the X axis.

  Thereby, the laser beam is scanned along the direction A orthogonal to the direction in which the off angle α is formed. In other words, the A direction orthogonal to the direction Y1 in which the off angle α is formed is the processing feed direction of the support table 26.

  In the wafer generation method of the present invention, it is important that the scanning direction of the laser beam emitted from the condenser 36 is the arrow A direction orthogonal to the direction Y1 in which the off angle α of the ingot 11 is formed.

  That is, according to the method for producing a wafer of the present invention, the crack propagating from the modified layer formed inside the ingot 11 is set along the c-plane 21 by setting the scanning direction of the laser beam to the above-described direction. It is characterized in that it has been found to extend very long.

  In the wafer generation method of the present embodiment, first, a condensing point of a laser beam having a wavelength (for example, a wavelength of 1064 nm) having transparency to the hexagonal single crystal ingot 11 fixed to the support table 26 is set to the first. The surface 11a is positioned at a depth corresponding to the thickness of the wafer produced from the surface (surface) 11a, and the surface 11a is irradiated with a laser beam by relatively moving the focusing point and the hexagonal single crystal ingot 11 to the surface 11a. A separation starting point forming step is performed in which the parallel modified layer 23 and the crack 25 propagating from the modified layer 23 along the c-plane 21 are formed and used as a separation starting point.

  In this separation starting point formation step, the c-axis 19 is inclined by the off-angle α relative to the perpendicular 17 of the surface 11a, and the off-angle α is formed between the c-plane 21 and the surface 11a, that is, the direction of the arrow Y1 in FIG. The condensing point of the laser beam is relatively moved in a direction orthogonal to the direction A, that is, the A direction, and the modified layer 23 and the crack 25 propagating from the modified layer 23 along the c-plane 21 are formed in the ingot 11. As shown in FIGS. 7 and 8, the modified layer forming step includes an index step for indexing a predetermined amount by relatively moving the condensing point in the direction in which the off angle is formed, that is, in the Y-axis direction. Yes.

  As shown in FIGS. 6 and 7, when the modified layer 23 is formed linearly in the X-axis direction, cracks 25 are propagated along the c-plane 21 from both sides of the modified layer 23. In the wafer generation method of the present embodiment, an index amount setting step for measuring the width of the crack 25 formed by propagating from the linear modified layer 23 in the c-plane direction and setting the index amount of the condensing point is performed. Including.

  In the index amount setting step, as shown in FIG. 6, when the width of the crack 25 that propagates from the straight modified layer 23 in the c-plane direction and is formed on one side of the modified layer 23 is W1, the index is set. The predetermined power W2 is set to W1 or more and 2W1 or less.

  Here, the laser processing method of a preferred embodiment is set as follows.

Light source: Nd: YAG pulse laser Wavelength: 1064 nm
Repetition frequency: 80 kHz
Average output: 3.2W
Pulse width: 4 ns
Spot diameter: 10 μm
Numerical aperture (NA) of condenser lens: 0.45
Index amount: 400 μm

  Under the laser processing conditions described above, in FIG. 6, the width W1 of the crack 25 propagating from the modified layer 23 along the c-plane is set to about 250 μm, and the index amount W2 is set to 400 μm.

  However, the average output of the laser beam is not limited to 3.2 W, and with the processing method of this embodiment, good results were obtained by setting the average output to 2 W to 4.5 W. When the average output was 2 W, the width W1 of the crack 25 was approximately 100 μm, and when the average output was 4.5 W, the width W1 of the crack 25 was approximately 350 μm.

  When the average output is less than 2 W and greater than 4.5 W, the good modified layer 23 cannot be formed inside the ingot 11, so the average output of the irradiated laser beam is 2 W to 4.5 W Within the range, in the present embodiment, the laser beam with an average output of 3.2 W was irradiated to the ingot 11. In FIG. 6, the depth D1 from the surface 11a of the condensing point which forms the modified layer 23 was set to 500 μm.

  Referring to FIG. 8A, a schematic diagram illustrating the scanning direction of the laser beam is shown. The separation starting point forming step is performed in the forward path X1 and the return path X2, and the condensing point of the laser beam in which the modified layer 23 is formed on the hexagonal single crystal ingot 11 in the forward path X1 is indexed by a predetermined amount, and then the hexagonal path in the return path X2. The modified layer 23 is formed on the crystal single crystal ingot 11.

  In the separation starting point forming step, when the predetermined amount to be indexed of the condensing point of the laser beam is set to W or more and 2 W or less, the condensing point of the laser beam is positioned on the hexagonal single crystal ingot 11 and the first modification is performed. It is preferable that the index amount of the condensing point until the quality layer 23 is formed is set to W or less.

  For example, as shown in FIG. 8B, when the predetermined amount for indexing the focal point of the laser beam is 400 μm, the index amount is 200 μm until the first modified layer 23 is formed on the ingot 11. Execute laser beam scanning multiple times.

  If the first laser beam scan is idle, and it is found that the modified layer 23 is first formed in the ingot 11, the index amount is set to 400 μm and the modified layer is formed in the ingot 11. 23 is formed.

  When the formation of the plurality of modified layers 23 and the cracks 25 extending from the modified layers 23 along the c-plane 21 at the position of the depth D1 of the entire region of the ingot 11 is completed while feeding the index by a predetermined amount as described above. A wafer that forms a hexagonal single crystal wafer 27 by separating the plate-like material from the hexagonal single crystal ingot 11 by applying an external force and corresponding to the thickness of the wafer to be formed from the separation starting point consisting of the modified layer 25 and the crack 23. Perform a stripping step.

  This wafer peeling step is performed by, for example, an ultrasonic wave application mechanism 54 as shown in FIG. The ultrasonic wave application mechanism 54 includes an ultrasonic horn 56 that moves in the vertical direction by a moving mechanism built in the column 52, and an ultrasonic vibration plate 58 that is attached to the ultrasonic horn 56. The ultrasonic horn 56 applies a voltage to a built-in ultrasonic transducer to generate, for example, 20 kHz ultrasonic vibration.

  In the wafer peeling step, first, as shown in FIG. 9A, the ultraviolet curable resin 60 is dropped on the upper surface 11a of the hexagonal single crystal ingot 11 after the separation starting point forming step is completed, and the ultrasonic wave application mechanism 54 is lowered. Then, the ultrasonic vibration plate 58 is attached to the upper surface 11 a of the hexagonal single crystal ingot 11.

  After the ultrasonic vibration plate 58 is bonded to the upper surface 11a of the hexagonal single crystal ingot 11, as shown in FIG. 9B, ultrasonic waves are generated by the ultrasonic horn 56, and the ultrasonic waves are generated by the ultrasonic vibration plate. 58 to the hexagonal single crystal ingot 11.

  As a result, since the ultrasonic wave 62 is applied to the hexagonal single crystal ingot 11, the hexagonal single crystal wafer 27 as a plate is peeled from the hexagonal single crystal ingot 11. The ultrasonic vibration applied in the wafer peeling step is preferably an ultrasonic vibration of 10 kHz to 40 kHz, and more preferably an ultrasonic vibration of 15 kHz to 30 kHz.

  After the wafer 27 is peeled off from the hexagonal single crystal ingot 11, as shown in FIG. 10A, the hexagonal single crystal wafer 27 is irradiated with ultraviolet rays 65 by an ultraviolet lamp 64, as shown in FIG. 10B. Then, the hexagonal single crystal wafer 27 is detached from the ultrasonic vibration plate 58.

  After separating the hexagonal single crystal wafer 27 from the hexagonal single crystal ingot 11, it is preferable that the separation surface of the wafer 27 and the separation surface of the ingot 11 are polished and processed into a mirror surface.

2 Laser processing device 11 Hexagonal single crystal ingot 11a First surface (surface)
11b Second side (back side)
13 First Orientation Flat 15 Second Orientation Flat 17 First Surface Normal 19 c-axis 21 c-plane 23 Modified Layer 25 Crack 26 Support Table 30 Laser Beam Irradiation Unit 36 Condenser (Laser Head)
54 Ultrasonic wave application mechanism 56 Ultrasonic horn 58 Ultrasonic vibration plate

Claims (3)

A hexagonal crystal having a first surface, a second surface opposite to the first surface, a c-axis extending from the first surface to the second surface, and a c-plane orthogonal to the c-axis A method of producing a wafer for producing a wafer from a single crystal ingot,
The condensing point of a laser beam having a wavelength that is transmissive to the hexagonal single crystal ingot is positioned at a depth corresponding to the thickness of the wafer generated from the first surface, and the condensing point and the hexagonal single crystal The laser beam is irradiated to the first surface while relatively moving with the crystal ingot, and a separation layer is formed by forming a modified layer parallel to the first surface and a crack extending from the modified layer. A separation origin forming step to be formed;
After performing the separation starting point forming step, a wafer peeling step of peeling a plate-like material corresponding to the thickness of the wafer from the separation starting point from the hexagonal single crystal ingot to produce a hexagonal single crystal wafer, and
The separation starting point forming step includes a direction perpendicular to a direction in which the c-axis is inclined by an off-angle with respect to the normal of the first surface and an off-angle is formed between the first surface and the c-plane. A modified layer forming step for forming a linear modified layer by relatively moving the condensing point of the laser beam;
An index step of relatively moving the condensing point in a direction in which the off-angle is formed to index a predetermined amount,
In the wafer peeling step, an ultrasonic vibration plate is bonded to the first surface of the hexagonal single crystal ingot via a bond material, and ultrasonic waves are applied to the hexagonal single crystal ingot to remove the hexagonal single crystal ingot from the hexagonal single crystal ingot. A method for producing a wafer, comprising peeling off a plate-like material to produce a wafer.   In the wafer peeling step, the bond material to be used is an ultraviolet curable resin whose adhesive strength decreases when irradiated with ultraviolet rays, and after peeling the plate from the hexagonal single crystal ingot, the ultrasonic vibration plate is irradiated with ultraviolet rays. 2. The method for producing a wafer according to claim 1, wherein the plate-like object is detached from the wafer.   The method for producing a wafer according to claim 1 or 2, wherein the hexagonal single crystal ingot is selected from a SiC ingot or a GaN ingot.

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