JP6468130B2 - 回路構成体および電気接続箱 - Google Patents

回路構成体および電気接続箱 Download PDF

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Publication number
JP6468130B2
JP6468130B2 JP2015168956A JP2015168956A JP6468130B2 JP 6468130 B2 JP6468130 B2 JP 6468130B2 JP 2015168956 A JP2015168956 A JP 2015168956A JP 2015168956 A JP2015168956 A JP 2015168956A JP 6468130 B2 JP6468130 B2 JP 6468130B2
Authority
JP
Japan
Prior art keywords
heat transfer
bus bars
insulating
electronic component
transfer member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015168956A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017046526A (ja
JP2017046526A5 (enExample
Inventor
健人 小林
健人 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2015168956A priority Critical patent/JP6468130B2/ja
Priority to PCT/JP2016/073564 priority patent/WO2017038419A1/ja
Priority to CN201680046685.0A priority patent/CN107851984B/zh
Priority to US15/754,323 priority patent/US10820406B2/en
Publication of JP2017046526A publication Critical patent/JP2017046526A/ja
Publication of JP2017046526A5 publication Critical patent/JP2017046526A5/ja
Application granted granted Critical
Publication of JP6468130B2 publication Critical patent/JP6468130B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/16—Distribution boxes; Connection or junction boxes structurally associated with support for line-connecting terminals within the box
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)
JP2015168956A 2015-08-28 2015-08-28 回路構成体および電気接続箱 Active JP6468130B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015168956A JP6468130B2 (ja) 2015-08-28 2015-08-28 回路構成体および電気接続箱
PCT/JP2016/073564 WO2017038419A1 (ja) 2015-08-28 2016-08-10 回路構成体および電気接続箱
CN201680046685.0A CN107851984B (zh) 2015-08-28 2016-08-10 电路结构体及电连接箱
US15/754,323 US10820406B2 (en) 2015-08-28 2016-08-10 Circuit structure and electrical junction box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015168956A JP6468130B2 (ja) 2015-08-28 2015-08-28 回路構成体および電気接続箱

Publications (3)

Publication Number Publication Date
JP2017046526A JP2017046526A (ja) 2017-03-02
JP2017046526A5 JP2017046526A5 (enExample) 2017-12-14
JP6468130B2 true JP6468130B2 (ja) 2019-02-13

Family

ID=58187537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015168956A Active JP6468130B2 (ja) 2015-08-28 2015-08-28 回路構成体および電気接続箱

Country Status (4)

Country Link
US (1) US10820406B2 (enExample)
JP (1) JP6468130B2 (enExample)
CN (1) CN107851984B (enExample)
WO (1) WO2017038419A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019197848A (ja) * 2018-05-11 2019-11-14 株式会社オートネットワーク技術研究所 回路構成体、及び電気接続箱
JP7151232B2 (ja) * 2018-07-18 2022-10-12 株式会社オートネットワーク技術研究所 回路基板
US11495908B2 (en) * 2019-04-01 2022-11-08 Aptiv Technologies Limited Electrical connector assembly with liquid cooling features
JP7182079B2 (ja) * 2019-04-25 2022-12-02 株式会社オートネットワーク技術研究所 回路構成体
US11539158B2 (en) 2019-09-09 2022-12-27 Aptiv Technologies Limited Electrical terminal seal and electrical connector containing same
US11778793B2 (en) * 2021-03-31 2023-10-03 Toyota Motor Engineering & Manufacturing North America, Inc. Systems including an integrated power module with vias and methods of forming the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004007180B4 (de) * 2003-02-14 2015-10-22 Autonetworks Technologies, Ltd. Verteilereinheit und elektrisches Verbindungsgehäuse hiermit
JP2005228799A (ja) * 2004-02-10 2005-08-25 Auto Network Gijutsu Kenkyusho:Kk 回路構成体及びその製造方法
JP4582717B2 (ja) * 2006-05-09 2010-11-17 株式会社オートネットワーク技術研究所 回路構成体
CN201018237Y (zh) * 2007-03-23 2008-02-06 朱志飞 一体化母排
CN202949688U (zh) * 2012-12-20 2013-05-22 安徽巨一自动化装备有限公司 一种插片式电机控制器水冷散热结构
JP6115464B2 (ja) * 2013-12-20 2017-04-19 株式会社オートネットワーク技術研究所 回路構成体

Also Published As

Publication number Publication date
US20190014654A1 (en) 2019-01-10
JP2017046526A (ja) 2017-03-02
CN107851984B (zh) 2019-12-10
WO2017038419A1 (ja) 2017-03-09
CN107851984A (zh) 2018-03-27
US10820406B2 (en) 2020-10-27

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