JP6466735B2 - Filling equipment - Google Patents

Description

  The present invention relates to a filling apparatus for filling a liquid in a minute space formed on the surface of an object to be processed.

  In recent years, in a semiconductor manufacturing process, a technique for filling a conductor serving as an electrode or an insulator serving as an insulating layer inside a via or a through hole (microspace) provided on a semiconductor wafer (object to be processed) has been demanded. . As a method for filling a minute space with a conductor or an insulator, a method using a liquid conductor or insulator such as molten metal or liquid glass, a method using a liquid in which metal powder or insulating powder is dispersed, etc. For example, the present applicant has proposed a metal filling apparatus disclosed in Japanese Patent Laid-Open No. 2013-075330 as a technique for filling molten metal into a minute space on a semiconductor wafer.

  As shown in FIG. 13, the metal filling apparatus 100 includes a holding table 101 that holds the workpiece K, a cylindrical housing 102 that is disposed to face the holding table 101, and an internal space of the housing 102. The piston 103 and the like to be processed with respect to the processing surface of the processing object K held in the holding table 101 are hermetically sealed by the processing object K, the housing 102 and the piston 103 held on the holding table 101. Process chamber 104 is formed. Further, the metal filling apparatus 100 includes a molten metal supply mechanism 105 that supplies the molten metal M into the processing chamber 104, a decompression mechanism 106 that depressurizes the inside of the processing chamber 104, and a gas that supplies an inert gas into the processing chamber 104. A pressurizing mechanism 107, a recovery mechanism 108 for recovering excess molten metal, and the like are provided.

  According to this metal filling apparatus 100, first, the workpiece K is placed on the holding table 101. Next, the processing chamber 104 is formed by pressing the housing 102 against the object to be processed K and the holding table H to form a processing chamber 104, and the gas in the processing chamber 104 is exhausted by the decompression mechanism 106 to the processing chamber 104 and the object to be processed K The formed micro space is depressurized to a substantially vacuum state. Thereafter, the molten metal M is supplied to the processing chamber 104 by the molten metal supply mechanism 105 until reaching an amount that can cover the entire surface to be processed without being bounced by the surface to be processed K.

  Next, an inert gas for pressurization is supplied into the processing chamber 104, the molten metal M is pressurized by this gas pressure, and the molten metal M is filled into the minute space by so-called differential pressure filling. Thereafter, the piston 103 is moved toward the object to be processed, and the piston 103 is pressed against the surface to be processed of the object K to be processed. As a result, surplus metal between the piston 103 and the workpiece K is pushed out from the workpiece K into the gap between the inner peripheral surface of the housing 102 and the outer peripheral surface of the piston 103, and the post-processing workpiece The layer made of surplus metal formed on the object K is thin.

  Thereafter, an inert gas is supplied into the processing chamber 104, and excess molten metal in the processing chamber 104 is recovered in an appropriate recovery unit provided outside the processing chamber 104. Next, the molten metal M is cooled until the temperature of the molten metal M becomes equal to or lower than the melting point, and waits until the molten metal filled in the minute space of the workpiece K is cooled and hardened, and then the workpiece K is taken out from the processing chamber 104. Thus, it is possible to obtain an object to be processed in which a minute space is filled with metal.

JP 2013-075330 A

  By the way, in the metal filling apparatus 100, when the processing chamber 104 is formed with the workpiece K held on the holding table 101, the lower end surface of the housing 102 and the upper surface of the holding table 101 are in close contact with each other. .

  However, there is a concern that the airtightness of the gap between the lower end surface of the housing 102 and the upper surface of the holding base 101 is not sufficient in practical use. Problems can arise.

  That is, in the metal filling apparatus 100, the workpiece K is held on the holding table 101 by pressing the workpiece K against the holding table 101 with the housing 102. If the airtightness between the surface and the upper surface of the holding table 101 is not sufficient, external air is sucked from between the two and the pressure between the upper and lower surfaces of the workpiece K when the processing chamber 104 is reduced to a substantially vacuum state. Specifically, the pressure on the holding table side of the object to be processed K becomes larger than the pressure on the processing chamber side, and the object to be processed K is deformed into a convex shape toward the processing chamber 104 side. Cracks.

  In addition, when the pressure difference between the upper and lower surfaces of the workpiece K is large, the workpiece K is greatly deformed, and the surface of the workpiece K comes into contact with the lower surface of the piston 103, the melted in the processing chamber 104. When the metal M is supplied, the entire surface of the object to be processed K cannot be covered, resulting in a problem that defective filling occurs.

  The present invention has been made in view of the above circumstances, and prevents the object to be processed from being curved by avoiding that the pressure on the holding table side of the object to be processed becomes larger than the pressure on the processing chamber side. An object of the present invention is to provide a filling device that can be used.

The present invention for solving the above problems is as follows.
A filling device for filling a liquid in a minute space formed in a treatment region inside the outer peripheral edge of the surface of the workpiece and formed to open to the surface,
A first body, and the first Ru treating body name from the second body disposed so as to face the surface of the object to be held to the body with the holding surface of the article to be treated is held Te, the processing object is held on the holding surface of the first body, in and a state where the first body and the second body are joined, in its interior, wherein a space in which the object to be processed is accommodated and held with the chamber is formed, a space adjacent to the holding chamber, the processing unit main body, wherein is housed in the holding chamber wherein a space in which the processing area the entire of the workpiece is exposed processing chamber is formed When,
A moving mechanism for moving at least one of the first main body and the second main body in a direction approaching and separating from the other;
A liquid supply mechanism for supplying a liquid into the processing chamber;
A first pressure reducing mechanism for reducing the pressure between the back surface of the object to be processed and the holding surface of the first main body;
A second decompression mechanism for decompressing the processing chamber,
In a state where the object to be processed is held on the holding surface, the first main body and the second main body are brought close to each other by the moving mechanism, and the first main body and the second main body are joined to each other. The two main bodies are configured such that a contact surface facing a peripheral area outside the processing area on the surface of the object to be processed is in contact with the peripheral area outside the processing area on the surface of the object to be processed. A filling device configured to define a chamber and the holding chamber;
Wherein the at least one of the first body and second body, set the first sealing mechanism on a surface to be joined with the other,
A second seal mechanism is provided on the holding surface of the first main body or the contact surface of the second main body, and the second seal mechanism allows the contact between the holding surface and the workpiece or the contact surface. And a filling device that seals between the object to be processed .

  According to the filling apparatus according to the present invention, first, an object to be processed having a minute space formed on the surface is placed on the holding surface of the first main body, and the first decompression mechanism and the first surface of the object to be processed are connected to the first surface. Depressurization with the holding surface of the main body is started.

  Next, the first main body and the second main body are brought close to each other by the moving mechanism, the first main body and the second main body are joined via the first seal mechanism, and the workpiece and the second main body are brought into contact with each other. Alternatively, the processing chamber and the holding chamber are defined by bringing the object to be processed and the second main body into contact with each other via the second seal mechanism. Thereafter, the gas in the processing chamber is exhausted and the processing chamber is depressurized by the second pressure reducing mechanism.

  Here, when the second seal mechanism is provided on the contact surface of the second body, the second seal mechanism makes contact between the peripheral area outside the treatment area on the surface of the workpiece and the second body. Since high airtightness is ensured between the contact surface and the inflow of air from the outside to the processing chamber is prevented, the processing chamber can be decompressed efficiently. In addition, since the first seal mechanism is provided between the first main body and the second main body, sufficient airtightness is ensured between the first main body and the second main body, and an external space is provided between the two. Therefore, it is possible to reduce the pressure between the back surface of the workpiece and the holding surface of the first main body to a predetermined pressure. Therefore, it becomes difficult for a pressure difference to occur between the side facing the processing chamber and the side facing the first body (between the front and back surfaces) of the workpiece, and the workpiece is prevented from being deformed.

  When the second seal mechanism is provided on the holding surface of the first body, the second seal mechanism provides sufficient airtightness between the back surface of the surface to be processed and the holding surface of the first body. Secured. Therefore, a difference in pressure between the front and back surfaces of the object to be processed is prevented, and sufficient airtightness is secured between the first main body and the second main body by the first sealing mechanism. Inflow of air into the processing chamber from the outside is prevented, and the processing chamber can be decompressed efficiently.

  Here, in the filling device, a space (hereinafter referred to as “gap space”) may be formed between the outer peripheral surface of the workpiece and the inner wall surface of the holding chamber, and the first body and the second body. And the gap space is at atmospheric pressure. Therefore, when pressure reduction in the processing chamber is started in this state, when the second seal mechanism is provided on the contact surface of the second body, air flows from the gap space to the back surface of the processing surface, When the pressure difference occurs between the front and back surfaces of the workpiece, the workpiece may be deformed, and when the second sealing mechanism is provided on the holding surface of the first body, the surface of the workpiece The air flows from the gap space into the processing chamber through the space outside the processing region and the contact surface of the second main body, and the time required to depressurize the processing chamber to a predetermined pressure increases. There is a fear.

  Therefore, the filling device preferably includes a third pressure reducing mechanism for reducing the pressure in the gap space. In this way, after the formation of the processing chamber, the gap space can be decompressed in advance by the third decompression mechanism before the decompression of the processing chamber is started. Thereby, even when the second seal mechanism is provided at the contact portion of the second main body, the degree of vacuum on the back side of the object to be processed can be sufficiently increased before the processing chamber is depressurized. Furthermore, since the volume of the gap space is small and the pressure can be quickly reduced to a predetermined pressure, the pressure reduction in the processing chamber can be started immediately after the formation of the processing chamber, and productivity can be improved. Further, even when the second seal mechanism is provided on the holding surface of the first main body, the time required for reducing the pressure in the processing chamber to a predetermined pressure can be shortened.

  The first seal mechanism and the second seal mechanism include an attachment member detachably attached to at least one of the first main body and the second main body, and a seal member fixed to the attachment member. It is preferable.

  In this way, by preparing in advance an attachment member to which the seal member is fixed, it is possible to easily replace the seal member simply by replacing the attachment member, and it is possible to improve maintainability. . Further, since the seal member is fixed to the mounting member, there is no problem that the seal member comes off every time the first main body and the second main body are separated from each other and must be attached again. The attachment member is structured to be attached to the first and second main bodies in an airtight manner.

  The term “liquid” as used in the present application refers to all kinds of liquid substances that are supplied on the surface to be processed and used for filling the micro space formed on the surface to be processed. For example, when an electrode is formed in the minute space, a paste containing molten metal or metal powder, or a solution in which metal powder is dispersed is exemplified, but the invention is not limited thereto.

  As described above, according to the filling apparatus of the present invention, it is possible to prevent a pressure difference from occurring between the side of the workpiece to be processed facing the processing chamber and the side facing the first main body. Since the object can be prevented from being bent, the yield can be improved, and the decompression of the processing chamber can be efficiently performed in a short time, so that the time required for the filling process can be reduced. Shortening can be achieved and liquid filling with higher productivity can be performed.

It is sectional drawing which showed schematic structure of the filling apparatus which concerns on one Embodiment of this invention. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is explanatory drawing which shows the operation | movement flow of the filling apparatus of the said embodiment. It is sectional drawing which showed schematic structure of the filling apparatus which concerns on other embodiment of this invention. It is sectional drawing which showed schematic structure of the filling apparatus which concerns on other embodiment of this invention. It is sectional drawing which showed schematic structure of the conventional metal filling apparatus.

  Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[Configuration of filling device]
The filling device 1 according to an embodiment of the present invention is formed in a processing region inside the outer peripheral edge portion of the surface to be processed in the plate-shaped object K, and is formed to open to the surface to be processed. This is an apparatus for filling a liquid in a minute space. In this example, a case where the molten metal M is filled in order to form an electrode in a minute space will be described as an example, but the liquid to be filled is not limited to this, and metal powder is dispersed. A liquid, a conductive paste, or the like can be used. Examples of the workpiece K include a silicon substrate, a glass substrate, a ceramic substrate, a resin substrate, a glass / silicon bonded substrate, and the like.

  As shown in FIG. 1, the filling device 1 includes a holding table H that is a first main body having a holding surface (upper surface) that holds an object to be processed K with the surface to be processed facing upward, A space is formed in the cylindrical housing C, the lower end surface of which is disposed to face the holding table H, and the surface to be processed of the workpiece K held on the holding table H so as to freely advance and retract. A provided piston P, an elevating mechanism 4 for moving the holding base H toward and away from the housing C, and a pressing mechanism 5 for moving the piston P back and forth are provided. In the present example, the housing C and the piston P constitute a second main body.

  The holding table H is provided with a first seal mechanism 6 on the outer peripheral portion on the upper surface side thereof. The first seal mechanism 6 includes an attachment member 6b detachably attached to the holding table H and the attachment member. It is comprised from the annular seal member 6a baked in the groove | channel formed in the upper surface of 6b. In the filling device 1 of this example, a seal member (not shown) for maintaining airtightness is interposed between the holding base H and the attachment member 6b, but the annular seal member 6a is attached. The member 6b may be baked on the upper corner of the inner peripheral side, and the space between the holding base H, the housing C, and the mounting member 6b may be simultaneously sealed by the annular seal member 6a.

  The internal space of the housing C has a large-diameter portion that becomes the holding chamber 3 on the lower end side, and has a stepped shape with a small-diameter portion that becomes a part of the processing chamber 2 on the upper end side. A contact surface C1 between the diameter portion and the small diameter portion includes a mounting member (not shown) detachably attached to the contact surface C1 and an annular seal member 7a baked on the mounting member. A two-seal mechanism 7 is provided. In the filling device 1 of the present example, a seal member (not shown) is appropriately interposed in order to ensure airtightness between the mounting member of the second seal mechanism 7 and the housing C. You may make it seal simultaneously between the to-be-processed object K, the housing C, and an attachment member (not shown) by the member 7a. The contact surface C1 may be formed at a position facing the peripheral area outside the processing area of the workpiece K held on the upper surface of the holding table H, but a large processing area is secured. In order to achieve this, it is preferable to form it at a position facing the edge of the surface to be processed in the workpiece K as much as possible.

  The piston P is inserted from the upper opening of the housing C, and is advanced and retracted in the axial direction by the pressing mechanism 3. Between the outer peripheral surface of the piston P and the inner peripheral surface of the housing C, , An O-ring 8 is interposed, and the O-ring 8 is sealed between the two. Further, a bellows seal 9 is provided between the flange portion of the piston P and the upper end surface of the housing C, and the airtightness between the piston P and the housing C is further enhanced by the bellows seal 9. It has been.

  The elevating mechanism 4 is a mechanism for elevating the holding base H up and down by a motor or the like. Then, the lifting mechanism 4 raises the holding table H toward the housing C, joins the upper surface of the holding table H and the lower end surface of the housing C via the first seal mechanism 6, and The peripheral area outside the processing area of the surface to be processed in the object to be processed K held on the upper surface is pressed against the annular seal member 7a of the second seal mechanism 7 to be brought into close contact therewith. Thus, an airtight processing chamber 2 is formed by the workpiece K, the housing C and the piston P held on the holding table H, and the entire processing area of the processing surface of the workpiece K is in the processing chamber 2. In addition to being exposed, the workpiece K is disposed in the holding chamber 3.

  The advance / retreat mechanism 5 is, for example, a hydraulic cylinder mechanism or the like that provides a driving force for moving the piston P back and forth, and can move the piston P forward and backward toward the workpiece K with a predetermined pressing force. .

  Further, the filling device 1 includes a first decompression mechanism 10 that decompresses between the lower surface of the workpiece K placed on the upper surface of the holding table H and the upper surface of the holding table H, and the inside of the processing chamber 2. The pressure in the gap space formed between the second decompression mechanism 11 for decompressing the inside of the processing chamber 2 and the outer peripheral surface of the workpiece K and the inner wall surface of the holding chamber 3 is decompressed. A third decompression mechanism 12, a molten metal supply mechanism 13 that supplies the molten metal M into the processing chamber 2, a first gas supply mechanism 14 that supplies an inert gas into the processing chamber 2, and the processing chamber 2 A molten metal recovery mechanism 15 that recovers the supplied molten metal M, a second gas supply mechanism 16 that supplies inert gas and dry air to the gap space, the elevating mechanism 4, the pressing mechanism 5, and the first pressure reducing mechanism 10. , Second decompression mechanism 11, third decompression mechanism 12, molten metal supply mechanism 13, gas feeder It has 14 and a control unit 17 for controlling the operation of the molten metal recovery mechanism 15.

  The first pressure reducing mechanism 10 is provided in the vacuum pump 10 a, a pipe 21 having one end connected to the vacuum pump 10 a and the other end penetrating the center of the front and back surfaces of the holding base H, and the pipe 21. The control valve 10b, and the vacuum pump 10a exhausts the air between the lower surface of the workpiece K placed on the holding table H and the upper surface of the holding table H, thereby holding the workpiece K in the holding table. This is a mechanism for vacuum adsorption to H.

  The second pressure reducing mechanism 11 includes a vacuum pump 11a, a pipe 22 having one end connected to the vacuum pump 11a and the other end penetrating the side wall on the upper end side of the housing C, and the vacuum pump 11a in the pipe 22 And a control valve 11b provided between the processing chamber 2 and the vacuum pump 11a exhausts the air in the processing chamber 2 to depressurize the processing chamber 2.

  The third decompression mechanism 12 is provided with a vacuum pump 12a and one end connected to the vacuum pump 12a and the other end penetrating the front and back surfaces outside the region of the holding table H where the workpiece K is held. And a control valve 12b provided in the pipe 23. The vacuum pump 12a exhausts the air in the gap space to depressurize the gap space.

  The operation of the three vacuum pumps 10a, 11a, 12a and the opening / closing of the three control valves 10b, 11b, 12b are controlled by the control device 17.

  The molten metal supply mechanism 13 includes a molten metal supply unit 13a, a pipe 24 having one end connected to the molten metal supply unit 13a and the other end penetrating the side wall on the lower end side of the housing C, and the pipe 24 And a control valve 13b provided between the molten metal supply unit 13a and the processing chamber 2, and a mechanism for supplying the molten metal M from the molten metal supply unit 13a into the processing chamber 2 with a predetermined supply pressure. Yes, the control valve 13b is controlled by the control device 17 to open and close.

  In the molten metal supply part 13a, the molten metal M used for metal filling is heated at a temperature higher than its melting point and stored in a liquid state. In this example, the molten metal M used for metal filling is lead-free solder having a melting point of about 200 ° C. However, the type of the molten metal M is not limited to solder, Depending on the function, any material such as Au, Ag, Cu, Pt, Pd, Ir, Al, Ni, Sn, In, Bi, Zn, and alloys thereof can be adopted.

  The gas supply mechanism 14 includes a gas supply unit 14a, a pipe 25a having one end connected to the gas supply unit 14a and the other end connected between the processing chamber 2 and the control valve 11b in the pipe 22. One end of the control valve 14b provided in the pipe 25a is connected between the gas supply unit 14a and the control valve 14b in the pipe 25a, and the other end is between the processing chamber 2 and the control valve 13b in the pipe 24. And a control valve 14c provided in the pipe 25b, and an inert gas from the gas supply unit 14a into the processing chamber 2 via the pipe 22, the pipe 24, the pipe 25a, and the pipe 25b. Is a mechanism for supplying The operation of the gas supply unit 14 a and the opening and closing of the two control valves 14 b and 14 c are controlled by the control device 17.

  The molten metal recovery mechanism 15 includes a molten metal recovery portion 15a, a pipe 26 having one end connected to the molten metal recovery portion 15a and the other end penetrating the side wall on the lower end side of the housing C, and the pipe 26 And a control valve 15b provided between the molten metal recovery section 15a and the processing chamber 2, and a mechanism for recovering the molten metal M in the processing chamber 2, wherein the control valve 15b is opened and closed by a control device. 17. In addition, as the molten metal collection | recovery part 15a, the structure which consists of a collection tank and the exhaust apparatus connected to this collection tank can be illustrated.

  The second gas supply mechanism 16 has a gas supply part 16a, one end connected to the gas supply part 16a, and the other end connected between the opening of the holding base H in the pipe 23 and the control valve 12b. 27 and a control valve 16b provided in the pipe 27, and a mechanism for supplying an inert gas or dry air to the gap space. The operation of the gas supply unit 16a and the opening / closing of the control valve 16b are controlled by the control device 17.

[Metal filling procedure]
Next, with reference to FIGS. 2-10, the metal filling procedure in the filling apparatus 1 of this example is demonstrated in detail.

  According to the filling apparatus 1 of the present example, the holding table H is first lowered by the lifting mechanism 4 to separate the upper surface of the holding table H from the lower end surface of the housing C, and then the workpiece K is processed. Place on the holding table H with the surface facing up. Next, the vacuum pump 10a is operated, the control valve 10b of the pipe 21 is opened, and gas exhaust between the upper surface of the holding table H and the lower surface of the workpiece K is started. The object K is vacuum-adsorbed (see FIG. 2).

  Next, the lifting mechanism 4 is operated to raise the holding table H toward the housing C, and the outer peripheral area of the processing surface of the processing target surface of the workpiece K held on the upper surface of the holding table H is set. The annular seal member 7a of the second seal mechanism 7 provided in the housing C is pressed and brought into close contact, and the annular seal member 6a of the first seal mechanism 6 is brought into close contact with the lower surface of the housing C. As a result, an airtight processing chamber 2 is formed in a state where the object to be processed K is pressed onto the holding table H by the housing C, and the object to be processed K is disposed in the holding chamber 3. An airtight holding chamber 3 is formed.

  Next, as shown in FIG. 3, the vacuum pump 12a of the third decompression mechanism 12 is operated, the control valve 12b is opened, the gas in the gap space is exhausted, and the gap space is decompressed to a substantially vacuum state. .

  Thereafter, the vacuum pump 11a of the second decompression mechanism 11 is operated, the control valve 11b is opened, the gas in the processing chamber 2 is exhausted, and the inside of the processing chamber 2 and the minute space formed in the workpiece K Is reduced to a substantially vacuum state (see FIG. 4).

  In the filling apparatus 1 of this example, since the first seal mechanism 6 is provided, the airtightness between the holding table H and the housing C is sufficiently ensured. When the pressure between the lower surface of K is reduced, air is prevented from being sucked from between the holding table H and the housing C, and the pressure can be reduced to a substantially vacuum state. When the pressure is reduced to a substantially vacuum state, no pressure difference is generated between the upper and lower surfaces of the workpiece K, and the workpiece K is prevented from being bent. The ease of bending depends particularly on the thickness of the workpiece K, and when performing the filling process on the workpiece K having a thickness that is likely to be curved, for example, a thickness of 2 mm or less, The effect of preventing the workpiece K from bending is particularly remarkable.

  Furthermore, since the airtightness between the housing C and the object to be processed K is improved by providing the second seal mechanism 7, the pressure in the processing chamber 2 can be efficiently reduced. In addition, before starting the decompression in the processing chamber 2, the gap space is decompressed in advance to a substantially vacuum state. Thereby, when pressure reduction in the processing chamber 2 is started, air leaks from the gap space between the upper surface of the holding table H and the lower surface of the workpiece K, and the degree of vacuum on the lower surface side of the workpiece K Therefore, the pressure reduction in the processing chamber 2 can be started quickly, and as a result, the time required to reduce the pressure in the processing chamber 2 to a predetermined pressure is shortened.

  Next, as shown in FIG. 5, in a state where the vacuum pumps 10a, 11a, and 12a continue to be depressurized, the control valve 13b is opened, and the liquid molten metal M heated to the melting point or higher is supplied from the molten metal supply unit 13a. Then, it is supplied into the processing chamber 2 until it reaches an amount that can cover the entire surface of the processing object K without being bounced on the surface of the processing object K. In addition, in the filling apparatus 1 of this example, the molten metal M is supplied in a state where the vacuum pump 11a continues to depressurize by providing the pipe 22 sufficiently above the liquid level of the supplied molten metal M. However, it is preferable to stop the supply of the molten metal M at an appropriate timing so that the molten metal M is not sucked into the vacuum pump 11a. In addition, for example, silicon (specific gravity: about 2.) is obtained by vacuum-adsorbing the workpiece K to the holding table H and pressing the housing C against the surface of the workpiece K via the second seal mechanism. Even if the solder (specific gravity: about 8) is supplied onto the workpiece K consisting of 5), the workpiece K does not float from the holding table H.

  In order to prevent the molten metal M from being cooled and hardened at this stage, the temperature in the processing chamber 2 is appropriately adjusted to a predetermined temperature by a heating mechanism.

  If a sufficient amount of molten metal M is supplied into the processing chamber 2, as shown in FIG. 6, the control valve 13b is closed to stop the supply of the molten metal M, and then the pressing mechanism 5 is operated to perform processing. The piston P in the chamber 2 is slowly brought closer to the workpiece K, and the tip of the piston P is submerged in the molten metal M supplied into the processing chamber 2. In this way, by avoiding the formation of a gas layer between the tip of the piston P and the molten metal M, the tip of the piston P is submerged in the molten metal M while the inside of the processing chamber 2 is in a substantially vacuum state. can do.

  Next, as shown in FIG. 7, the control valve 11b is closed while the tip of the piston P is kept submerged in the molten metal M, and the vacuum pump 11a is stopped to reduce the pressure in the processing chamber 2. While stopping, the control valve 14b is opened and the gas supply unit 14a is operated to supply pressurized nitrogen gas or the like from the gas supply unit 14a so that the inside of the processing chamber 2 has a predetermined pressure. As a result, the molten metal M is pressurized by a gas pressure such as nitrogen gas supplied into the processing chamber 2, and the molten metal M is more reliably filled into the minute space by so-called differential pressure filling.

  At the same time as the supply of the nitrogen gas for pressurization into the processing chamber 2, the control valve 12b is closed and the vacuum pump 12a is stopped to stop the pressure reduction of the gap space, while the control valve 16b is opened. The gas supply unit 16a is operated to supply pressurization nitrogen gas or the like from the gas supply unit 16a to the gap space, and the gap space is pressurized to a pressure substantially equal to that in the vacuum break or the processing chamber 2. Thus, the sealing performance of the annular seal member 7a can be supplemented by reducing the pressure difference between the processing chamber 2 and the gap space. It should be noted that there is no possibility that the workpiece K is deformed when the inside of the processing chamber 2 is pressurized.

  Thereafter, the pressing mechanism 5 is actuated to move the piston P toward the workpiece K and press the lower end surface of the piston P against the workpiece K surface (see FIG. 8). Thereby, the excess molten metal between the lower end surface of the piston P and the workpiece K is pushed out from the workpiece K into the gap between the inner peripheral surface of the housing C and the outer peripheral surface of the piston P. Therefore, the amount of residue formed on the processed surface of the processed object K after processing is reduced. In addition, although a residue means the layered unnecessary metal part which the excess molten metal which did not enter in micro space on the to-be-processed object K hardens | cures, it says that the said metal part is unnecessary in all cases. In some cases, it can be used as a wiring layer or a contact layer.

  Then, with the lower end surface of the piston P pressed against the surface to be processed K, the piston P is stationary for a predetermined time. In the filling device 1 of this example, as described above, the amount of the molten metal M corresponding to the amount of the piston P submerged in the liquid of the molten metal M is the outer peripheral surface of the piston P and the inner peripheral surface of the housing C. Therefore, the liquid level of the molten metal M rises, and as a result, the workpiece K is immersed in the molten metal M at a position deep from the liquid level of the molten metal M. Therefore, the lower end surface of the piston P and the workpiece K are in contact with each other, and due to the poor wettability between the molten metal M and the workpiece K and the lower end surface of the piston P, the molten metal on the surface of the workpiece K is processed. Even if the force with which M is repelled increases, it is difficult for the molten metal M to be in a state where the film is cut on the surface to be processed.

  Note that it is preferable to continue the gas pressurization by the first gas supply mechanism 14 while the lower end surface of the piston P is pressed against the surface to be processed of the workpiece K. By doing in this way, while filling force is maintained, the film | membrane breakage mentioned above can be prevented more effectively.

  Next, in a state where the lower end surface of the piston P is pressed against the surface to be processed K, the control valve 15b is opened, and the control valve 14c is opened to remove excess molten metal that cannot be filled in the minute space. It collect | recovers to the collection | recovery part 15a (refer FIG. 9). If the surplus molten metal is not recovered, the surplus molten metal M hardens between the piston P and the housing C after cooling, which will be described later, and the forward / backward movement of the piston P is hindered, or the workpiece K and the processing chamber 2 There arises a problem that the inner wall surface is fixed, and a large amount of metal remains in the processing chamber 2. However, if gas enters between the lower end surface of the piston P and the surface to be processed K, filling failure occurs. Therefore, the excess molten metal is not completely removed from the processing chamber 2, and the piston P It is preferable that the molten metal M is left in the gap between the outer peripheral surface of the lower end portion and the inner peripheral surface of the housing C. Note that the amount of the molten metal M remaining in the gap is preferably determined according to the wettability between the lower end surface of the workpiece K and the piston P and the molten metal M and the size of the gap.

  Then, after recovering the excess molten metal M, the control valve 14c and the control valve 15b are closed and cooled until the temperature of the molten metal M becomes equal to or lower than the melting point, until the molten metal M filled in the minute space is cooled and hardened. stand by. Thereafter, the control valve 14b is closed to stop the gas supply into the processing chamber 2, and the control valve 16b is closed to stop the gas supply to the gap space.

  Thereafter, as shown in FIG. 10, the pressing mechanism 5 is operated to raise the piston P, and the lifting mechanism 4 is lowered to open the processing chamber 2. Then, the control valve 10b is closed, the operation of the vacuum pump 10a is stopped, the workpiece K after the metal filling process is taken out, and replaced with a new workpiece K to be subjected to the metal filling process. The procedure shown in FIG. 10 is repeated, and the metal filling process is performed on the workpiece K.

  Here, in the filling device 1 of the present example, the annular seal member 6a of the first seal mechanism 6 is baked on the attachment member 6b, and similarly, the annular seal member 7a of the second seal mechanism 7 is also an attachment member (not shown). Unlike the case where the O-ring is simply attached, there is a problem that the annular seal members 6a and 7a are attached to the object to be processed K and the housing C, respectively, when the processing chamber 2 is opened. It does not occur. Therefore, when the processing chamber 2 is opened, it is not necessary to perform an O-ring mounting operation, and the metal filling process can be performed efficiently and continuously.

  Further, attachment members of the first seal mechanism 6 and the second seal mechanism 7 are detachably attached to the holding base H and the housing C, respectively. As a result, even if the annular seal members 6a and 7a are deteriorated and need to be replaced, it is possible to keep the annular seal members 6a and 7a by stocking another attachment member so that the annular seal members 6a and 7a are simply replaced. The seal member can be replaced with a new one, and maintainability is greatly improved as compared with the case where the annular seal member is directly baked on the holding base H or the housing C.

  As described above, according to the filling apparatus 1 of the present example, the first sealing mechanism 6 is provided between the holding base H and the housing C to improve the airtightness between the two. It is possible to prevent the air from flowing in between the housing and the housing C and to reduce the pressure between the workpiece K and the holding table H to a substantially vacuum state. It is possible to prevent the difference from occurring. Furthermore, before starting the decompression in the processing chamber 2, the space between the inner wall surface of the holding chamber 3 and the outer peripheral surface of the workpiece K, that is, the clearance space is decompressed in advance. Since the air does not leak between the upper surface of the holding table H and the lower surface of the workpiece K and the degree of vacuum on the lower surface side of the workpiece K is maintained, the pressure reduction in the processing chamber 2 can be started quickly. Can do.

  As mentioned above, although one Embodiment of this invention was described, the aspect which this invention can take is not limited to these at all.

  In the above example, the filling device is used for filling the molten metal into the minute space for the purpose of forming the electrode, but the liquid filling the minute space is not limited to this, and depending on the purpose It can be selected appropriately.

  In the above example, the third decompression mechanism 12 is provided to decompress the gap space. However, when the gap space is sufficiently small, the decompression of the processing chamber 2 is not significantly affected. The third decompression mechanism 12 is not necessarily provided. Further, instead of the vacuum pump 12a of the third pressure reducing mechanism 12, the vacuum pump 10a of the first pressure reducing mechanism 10 may be connected to the pipe 23 so as to reduce the number of parts.

  Moreover, although the filling apparatus 1 of the upper example was set as the structure which attaches a 1st seal mechanism to a holding stand, it is not restricted to this, You may make it attach a 1st seal mechanism to a housing. The filling device 30 configured as described above will be described below with reference to FIG. In addition, about the component same as the structure of the filling apparatus 1, the same code | symbol is attached | subjected and the detailed description is abbreviate | omitted.

  As shown in FIG. 11, the filling device 30 includes a holding base H, a housing C ′, an elevating mechanism 31, a first decompression mechanism 10, a second decompression mechanism 11, a third decompression mechanism 12, a molten metal supply mechanism 13, 1 gas supply mechanism 14 and control device 17.

  The housing C ′ is formed with a recessed portion having a stepped shape in cross section that is opened at the lower end surface, the recessed portion is formed on the lower end side, and is formed on the large diameter portion serving as the holding chamber 3, and on the upper end side, It has a small diameter portion that becomes the processing chamber 2. Further, the housing C 'is provided with a first seal mechanism 6 in a detachable manner on the outer peripheral portion on the lower end side thereof.

  A pipe 22 connecting the vacuum pump 11a of the second decompression mechanism 11 and the inside of the processing chamber 2 is provided so as to penetrate the upper surface of the housing C ′ and the bottom surface of the recess formed in the housing C ′. ing. The first gas supply mechanism 14 is connected to the pipe 22 by a pipe 25a '.

  In the filling apparatus 30, the workpiece K is placed on the holding table H, and the first pressure reducing mechanism 10 is operated to start depressurization between the upper surface of the holding table H and the lower surface of the workpiece K. After that, the processing chamber 2 is formed by lowering the housing C ′ by the lifting mechanism 31, and the workpiece K is disposed in the holding chamber 3.

  Next, after the decompression of the gap space is performed by the third decompression mechanism 12, the interior of the processing chamber 2 is decompressed to a substantially vacuum state by the second decompression mechanism 11. Thereafter, the molten metal M is supplied into the processing chamber 2 by the molten metal supply mechanism 13.

  Thereafter, the decompression of the processing chamber 2 by the second decompression mechanism 11 is stopped, the inert gas is supplied into the processing chamber 2 by the first gas supply mechanism 14, and the molten metal M is brought into the micro space by the differential pressure filling. Fill.

  Thus, also in the filling device 30, the airtightness between the holding base H and the housing C ′ is enhanced by providing the first seal mechanism 6, and thereby the inflow of air from the outside is effective. Therefore, the pressure between the upper surface of the holding table H and the lower surface of the workpiece K can be reduced to a substantially vacuum state, and the pressure difference between the upper and lower sides of the workpiece K can be eliminated. In addition, since the gap space is previously decompressed before the decompression of the processing chamber 2 is started, the interior of the processing chamber 2 can be decompressed to a substantially vacuum state efficiently in a short time.

  Further, in the filling devices 1 and 30, a holding chamber is formed by providing a recess at the lower end of the housing. However, like the filling device 40 shown in FIG. You may make it form.

  Further, in the filling devices 1, 30, and 40, the second seal mechanism is provided between the housing and the workpiece, but the second seal is provided between the upper surface of the holding table and the lower surface of the workpiece. A mechanism may be provided. In this case, since the second sealing mechanism ensures airtightness between the upper surface of the holding table and the lower surface of the object to be processed, it is possible to prevent a pressure difference between the upper and lower surfaces of the object to be processed. Although the molten metal may flow into the gap space, the second seal mechanism prevents the molten metal from flowing between the back surface of the workpiece and the upper surface of the holding table from the gap space. Further, since the first seal mechanism is provided between the housing and the holding base, it is possible to prevent the molten metal from flowing out of the gap space to the outside of the apparatus.

  In addition, in the filling devices 1, 30, and 40, the molten metal M supplied into the processing chamber 2 by the first gas supply mechanism 14 is pressurized, but the liquid that fills the minute space and the object to be processed When the wettability with an object is good and the liquid is easily filled in the minute space, it is not always necessary to pressurize the liquid supplied into the processing chamber 2.

DESCRIPTION OF SYMBOLS 1 Filling device 2 Processing chamber 3 Holding chamber 4 Lifting mechanism 5 Pushing mechanism 6 First seal mechanism 6a Annular seal member 6b Mounting member 7 Second seal mechanism 7a Annular seal member 10 First decompression mechanism 11 Second decompression mechanism 12 Third decompression mechanism Mechanism 13 Molten metal supply mechanism 14 First gas supply mechanism 15 Molten metal recovery mechanism 16 Second gas supply mechanism 17 Controller H Holding stand C Housing P Piston K Processed object

Claims (3)

A filling device for filling a liquid in a minute space formed in a treatment region inside the outer peripheral edge of the surface of the workpiece and formed to open to the surface,
A first body, and the first Ru treating body name from the second body disposed so as to face the surface of the object to be held to the body with the holding surface of the article to be treated is held Te, the processing object is held on the holding surface of the first body, in and a state where the first body and the second body are joined, in its interior, wherein a space in which the object to be processed is accommodated and held with the chamber is formed, a space adjacent to the holding chamber, the processing unit main body, wherein is housed in the holding chamber wherein a space in which the processing area the entire of the workpiece is exposed processing chamber is formed When,
A moving mechanism for moving at least one of the first main body and the second main body in a direction approaching and separating from the other;
A liquid supply mechanism for supplying a liquid into the processing chamber;
A first pressure reducing mechanism for reducing the pressure between the back surface of the object to be processed and the holding surface of the first main body;
A second decompression mechanism for decompressing the processing chamber,
In a state where the object to be processed is held on the holding surface, the first main body and the second main body are brought close to each other by the moving mechanism, and the first main body and the second main body are joined to each other. The two main bodies are configured such that a contact surface facing a peripheral area outside the processing area on the surface of the object to be processed is in contact with the peripheral area outside the processing area on the surface of the object to be processed. A filling device configured to define a chamber and the holding chamber;
Wherein the at least one of the first body and second body, set the first sealing mechanism on a surface to be joined with the other,
A second seal mechanism is provided on the holding surface of the first main body or the contact surface of the second main body, and the second seal mechanism allows the contact between the holding surface and the workpiece or the contact surface. A filling device in which a gap between the workpiece and the object to be processed is sealed . The holding chamber is configured so that a space is formed between the inner wall surface of the holding chamber and the outer peripheral surface of the object to be processed in a state where the object to be processed is accommodated inside and held on the holding surface. Has been
The filling device according to claim 1, further comprising a third decompression mechanism for decompressing the space. The first seal mechanism and the second seal mechanism are:
An attachment member detachably attached to at least one of the first body and the second body;
The filling device according to claim 1, comprising a sealing member fixed to the mounting member.

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