JP6458566B2 - Particle counting apparatus and particle counting system using the same - Google Patents

Description

  The present invention relates to a particle counting device for detecting fine dust (particles) and a particle counting system using the same.

  For example, semiconductor manufacturing apparatuses such as an ion implantation apparatus and an organic EL film forming apparatus are known that when particles exist in a semiconductor manufacturing apparatus (vacuum processing chamber), the particles adhere to the wafer and the yield decreases. It has been. In particular, as the density and miniaturization of semiconductor devices progress in recent years, the reduction in manufacturing yield due to the particles becomes a serious problem.

Therefore, the semiconductor manufacturing apparatus is provided with a particle counting device that detects particles floating in the processing chamber in real time (see, for example, Patent Document 1). By this particle counting device was used to measure the particles existing in the processing chamber, optimizes and cleaning conditions of the manufacturing process based on the measurement value, thereby preventing a decrease in manufacturing yield.

Here, with reference to the schematic diagram of FIG. 1 showing an example of a particle counting system of the present invention, its configuration will be described. Also, FIG. 6 is a perspective view of a particle counting apparatus shown in FIG. 1, FIG. 7 is a cross-sectional view of FIG.
Particle counting system 1 includes a particle counting apparatus 10, the control unit 30, the personal computer 40, and control the serial cross cable 33 for connecting the control unit 30 and the personal computer 40, a particle counting device 10 A control cable 34 for connecting the unit 30 is provided.

Particle counting apparatus 10 includes, for example, a housing 20 of stainless steel, a semiconductor laser device 13 as a light emitting element (light emitting means), a photodiode 14a becomes a light receiving element (scattered light detection means), and 14b, an optical lens 15a , 15b, a beam stopper 19, and a preamplifier (component) 16 for driving the semiconductor laser element 13.

The housing 20 includes a cylindrical measuring head 21 having an axis in the horizontal direction, a cylindrical ICF 70 hermetic flange (pipe connecting portion) 22, and a cylindrical case portion 23.
The case portion 23 is formed with a connection port 23 a for connecting to the control cable 34. Thus, the particle counting apparatus 10 and the control unit 30, and can transmit and receive signals through the control cable 34.

  The ICF 70 hermetic flange 22 has a plurality of screw holes 22a penetrating in the horizontal direction. Thus, by passing the screw 42 through the screw hole 22a, the ICF 70 connection port 41a and the ICF 70 hermetic flange 22 formed in the semiconductor manufacturing apparatus 41 can be fixed.

Inside the measuring head 21, a beam stopper 19, photodiodes 14a and 14b, optical lenses 15a and 15b, and a semiconductor laser element 13 are arranged in this order.
As shown in FIG. 7, the semiconductor laser element 13 and the optical lenses 15a and 15b are arranged in the right end portion of the measurement head 21, and output laser light L having a predetermined wavelength to the left. The beam stopper 19 is disposed in the left end portion of the measuring head 21 and absorbs the laser beam L.

In addition, at a predetermined position on the wall surface in the vicinity of the central portion of the measurement head 21, a long-hole-shaped window portion 18a penetrating in the vertical direction and extending in the horizontal direction is formed, and the measurement head facing the window portion 18a in the vertical direction A long hole-like window portion 18b that penetrates in the vertical direction and is long in the horizontal direction is also formed at a predetermined position on the wall surface 21. That is, the structure is such that the particles enter the central portion (measurement target region) inside the measurement head 21 through the windows 18a and 18b.
As a result, the laser light L emitted from the semiconductor laser element 13 is condensed by the optical lenses 15 a and 15 b, passes through the central portion (measurement target region) inside the measurement head 21, and then enters the beam stopper 19. Absorbed. At this time, if the particles are present in the measurement target region, the laser light L and the particles collide, and the laser light L is scattered by the particles to generate scattered light.

  In addition, a rectangular photodiode 14a is disposed at a predetermined position on the wall surface in the vicinity of the central portion inside the measurement head 21 between the window 18a and the window 18b, and is opposed to the photodiode 14a in the front-rear direction. A rectangular photodiode 14b is also disposed at a predetermined position. Thereby, the scattered light generated by the particles entering the measurement target region (between the pair of photodiodes 14a and 14b) is received by the photodiodes 14a and 14b.

  The photodiodes 14a and 14b are configured to generate pulsed electrical signals (hereinafter referred to as “particle signals”) when irradiated with light. The particle signals are sequentially output to the control unit 30 via the control cable 34.

The control unit 30 shapes the particle signal (measured value), counts the particles (processing result), calculates the particle size (processing result) of the particles, and sends them to the personal computer 40 to the serial cross cable 33. via comprises a signal processing unit for outputting a (not shown), a control unit for controlling the operation of the particle counting apparatus 10 via the control cable 34 and a (not shown).

  The personal computer 40 includes an input unit (not shown) composed of operation buttons, a keyboard and the like, a display unit 40a composed of a monitor and the like, and displays processing results and measurement values from the signal processing unit on the display unit 40a. A control unit (not shown) that outputs the measurement conditions (sampling frequency, threshold voltage, measurement time, etc.) set by using the serial cross cable 33 to the control unit 30, and a storage unit (not shown). Z)). Thereby, for example, the display unit 40a displays the particle information (for example, the number of particles that have passed during a certain period of time, the particle size, the passing speed, and the like) in real time. When the measurement is finished, a series of measurement results (number of passing particles at each time point during measurement, total number of particles passed during measurement, distribution of particle size and passing speed, etc.) are stored in the storage unit as a measurement file. Is done.

JP-A-6-26823

However, when the semiconductor manufacturing apparatus 41 connecting port 41a is for ICF70 are provided, can be arranged a particle counting apparatus 10 to the semiconductor manufacturing apparatus 41, the semiconductor manufacturing apparatus 41 to ICF70 connection opening 41a and if no, if you can not insert the measuring head 21 in ICF70 connecting port 41a has a problem that it is impossible to use a particle counting apparatus 10.
Moreover, even if it is possible to arrange the particle counting apparatus 10 to the semiconductor manufacturing apparatus 41, when the Oboshiki place a particle generation source is positioned at the center portion of the semiconductor manufacturing apparatus 41, measured in the vicinity of the particle source There was a problem that the head 21 could not be arranged.
The present invention has as its object to provide a particle counting apparatus which is capable of or connect to the desired connection port or a desired position.

In order to solve the above problems, the particle counter of the present invention includes a window for introducing particles into a measurement target region, a light irradiation means for emitting light to the measurement target region, and a measurement target region. A measurement head having a scattered light detection means for detecting scattered light by the introduced particles and generating a detection signal; a pipe connection portion provided at a rear portion of the measurement head; and connected to a predetermined pipe connection port; Connected to the case part having a part for controlling the light irradiation means and the scattered light detection means provided at the rear part of the pipe connection part, and a control unit for creating particle information based on the detection signal A particle counting device comprising a control cable for
A mount having an attachment part connectable to the case part and an installation part for installation other than the predetermined pipe connection port, and a connection capable of being connected to the specific pipe connection port at one end and electrically connected to the control cable. A pipe connection portion provided with a port and a flanged cable in which a control unit connection portion for connecting to the control unit is formed at the other end .

Here, the “predetermined pipe connection port” is a pipe connection port provided in a semiconductor manufacturing apparatus or the like, for example, “ICF70” of an ICF flange, “KF40” of a KF flange, or the like.
The “specific pipe connection port” is a pipe connection port provided in a semiconductor manufacturing apparatus or the like, and may be the same as or different from the predetermined pipe connection port. For example, “KF40” of KF flange or ICF flange “ICF70” or the like.

According to the particle counting device of the present invention, a predetermined connection port to the semiconductor manufacturing device is provided, if the particle generation source is present in the vicinity predetermined connection port, firstly, analyst, pipe connection portion And a predetermined piping connection port, the measuring head is arranged in the semiconductor manufacturing apparatus. Next, the analyst connects the case unit and the control unit with a cable and transmits the particle information to the control unit. On the other hand, when a particle generation source exists in the central part of the semiconductor manufacturing apparatus, first, the analyst connects the case part and the mounting part of the gantry and connects the mounting part of the gantry to the central part in the semiconductor manufacturing apparatus. The measurement head is placed in the semiconductor manufacturing apparatus. Next, the analyst connects the case unit and the control unit with a cable and transmits the particle information to the control unit.

As described above, the particle counting apparatus of the present invention can be located in the central portion of the semiconductor manufacturing device in the vicinity of a predetermined piping connections.

Further , according to the particle counting device of the present invention, when the semiconductor manufacturing apparatus is provided with the specific piping connection port, first, the analyst connects the case portion and the mounting portion of the mounting base, and installs the mounting base. The measurement head is placed in the semiconductor manufacturing apparatus with the part placed on the central part in the semiconductor manufacturing apparatus.

Next , the analyst connects the cable pipe connection portion and the specific pipe connection port, and connects the cable control unit connection portion and the control unit. Next, the analyst connects the pipe connection portion of the cable and the case portion with the cable, and transmits the particle information to the control unit.
As described above, according to the particle counting device of the present invention, either the KF flange or the ICF flange can be used.

Further, the particle counting apparatus of the present invention, the installation portion is a horizontal plate, the mounting portion, the perpendicular vertical plate to the horizontal plate, the casing portion so as to be screwed to the mounting portion It may be.

The particle counting system of the present invention includes a particle counter apparatus as described above, may be provided with a control unit for creating particle information based on the detection signal.

Schematic structural view showing an example of a particle counting system of the present invention. Schematic diagram showing another embodiment of a particle counting system of FIG. Schematic diagram showing another example of a particle counting system of the present invention. The perspective view which shows a mount frame. The figure which shows the structure of a cable with a flange. Perspective view of a particle counting apparatus shown in FIG. Sectional view of a particle counting apparatus shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below, and includes various modes without departing from the spirit of the present invention.

Figure 1-3 is a schematic block diagram showing an example of a particle counting system of the present invention. FIG. 4 is a perspective view of a gantry installed in the semiconductor manufacturing apparatus. FIG. 5 is a diagram showing the configuration of the flanged cable used in the present invention. FIG. 5A shows a cable with a predetermined flange, and FIG. 5B shows a cable with a specific flange. Note that, in, for the same as the above-described particle counting system and particles counting device 1 is hereinafter omitted by giving the same reference numerals.
Particle counting system 1 includes a particle counting apparatus 10, the control unit 30, the personal computer 40, and control the serial cross cable 33 for connecting the control unit 30 and the personal computer 40, a particle counting device 10 A control cable 34 for connecting the unit 30, a mount 50, a cable 35 with a predetermined flange for connecting the ICF 70 connection port 41 a and the control unit 30, a KF 40 connection port 43 a and the control unit 30. And a cable 36 with a specific flange for connection.

The gantry 50 has an L shape having, for example, a stainless steel horizontal plate (installation portion) 52 and a stainless steel vertical plate (attachment portion) 51 erected on the right end of the horizontal plate 52.
The vertical plate 51 has a plurality of screw holes 51a penetrating in the horizontal direction. Thereby, the left side surface of the case portion 23 and the right side surface of the vertical plate 51 can be fixed by passing the screw 53 through the screw hole 51a in a state where the window portion 18a and the window portion 18b are aligned in the vertical direction. It is possible. The horizontal plate 52 can be placed at an arbitrary position in the semiconductor manufacturing apparatuses 41 and 43.

  An ICF 70 hermetic flange (pipe connection part) 35a is formed at one end of the cable 35 with the predetermined flange, and a control unit connectable to the connection port of the control unit 30 at the other end of the cable 35 with the predetermined flange. A connecting portion 35d is formed. The ICF 70 hermetic flange 35 a has a plurality of screw holes 35 b penetrating in the horizontal direction and a connection port 35 c that can be connected to the control cable 34. Thereby, by passing the screw 42 through the screw hole 35b, it is possible to fix the ICF70 connection port 41a and the ICF70 hermetic flange 35a formed in the semiconductor manufacturing apparatus 41 as shown in FIG.

  A KF40 hermetic flange (pipe connection part) 36a is formed at one end of the cable 36 with specific flange, and a control unit connectable to the connection port of the control unit 30 at the other end of the cable 36 with specific flange. A connecting portion 36d is formed. The KF 40 hermetic flange 36 a has a plurality of screw holes 36 b penetrating in the horizontal direction and a connection port 36 c that can be connected to the control cable 34. Thereby, by passing the screw 44 through the screw hole 36b, it is possible to fix the KF40 connection port 43a and the KF40 hermetic flange 36a formed in the semiconductor manufacturing apparatus 43 as shown in FIG. .

Here, a method using a particle counting system of the present invention.
(1) When a semiconductor manufacturing apparatus is provided with a connection port for ICF70 and a particle generation source exists in the vicinity of the connection port (see FIG. 1)
First, the analyst connects the ICF 70 hermetic flange 22 and the ICF 70 connection port 41 a using the screw 42, and arranges the measuring head 21 in the semiconductor manufacturing apparatus 41. Next, the analyst connects the connection port 23 a of the case unit 23 and the connection port of the control unit 30 with the control cable 34. Finally, the analyst connects the connection port of the control unit 30 and the connection port of the personal computer 40 with the serial cross cable 33 and transmits the particle information to the personal computer 40.

(2) When the ICF 70 connection port is provided in the semiconductor manufacturing apparatus and the particle generation source is present in the center of the semiconductor manufacturing apparatus (see FIG. 2).
First, the analyst fixes the left side surface of the case portion 23 and the right side surface of the vertical plate 51 of the gantry 50 and places the horizontal plate 52 of the gantry 50 on the central portion in the semiconductor manufacturing apparatus 41 to measure the measurement head. 21 is arranged in the semiconductor manufacturing apparatus 41. Next, the analyst connects the ICF 70 hermetic flange 35 a of the cable 35 with a predetermined flange and the connection port 41 a for ICF 70 using the screw 42. Next, the analyst connects the connection port 23 a of the case portion 23 and the connection port 35 c of the ICF 70 hermetic flange 35 a with the control cable 34. Finally, the analyst connects the connection port of the control unit 30 and the connection port of the personal computer 40 with the serial cross cable 33 and transmits the particle information to the personal computer 40.

(3) When a semiconductor manufacturing apparatus is provided with a connection port for KF40 (see FIG. 3)
First, the analyst fixes the left side surface of the case portion 23 and the right side surface of the vertical plate 51 of the gantry 50 and places the horizontal plate 52 of the gantry 50 on the central portion in the semiconductor manufacturing apparatus 41 to measure the measurement head. 21 is arranged in the semiconductor manufacturing apparatus 43. Next, the analyst connects the KF 40 hermetic flange 36 a of the cable 36 with the specific flange and the KF 40 connection port 43 a using the screw 44. Next, the analyst connects the connection port 23 a of the case portion 23 and the connection port 36 c of the KF 40 hermetic flange 36 a with the control cable 34. Finally, the analyst connects the connection port of the control unit 30 and the connection port of the personal computer 40 with the serial cross cable 33 and transmits the particle information to the personal computer 40.

As described above, according to the particle counting system of the present invention, the arrangement and the desired pipe connecting port 41a to the desired position of the particle counting apparatus 10, it is possible to connect to 43a.

<Other embodiments>
(1) In the above-described particle counting system, pedestal 50 is set to L-shaped, there are no particular limitations on the shape, it may have a T-shape.

(2) In the above-described particle counting apparatus 10, the beam stopper 19 in the left end of the measuring head 21 showing the arrangement configurations, instead of this, the reflecting member that reflects light other than the measurement target region located It may be configured as described.

  The present invention can be used in a particle counting device for detecting particles.

1: Particle counting system 10: the particle counting apparatus 13: a semiconductor laser element (the light irradiation means)
14a, 14b: Photodiode (scattered light detection means)
16: Preamplifier (component)
18a, 18b: Window part 21: Measuring head 22: ICF70 hermetic flange (piping connection part)
23: Case part 30: Control unit 34: Control cable 41a: Connection port for ICF70 (predetermined piping connection port)
50: Mount 51: Vertical plate (mounting part)
52: Horizontal plate (installation part)

Claims (3)

A window for introducing particles into the measurement target area, a light irradiating means for emitting light to the measurement target area, and a scatter for detecting scattered light from the particles introduced into the measurement target area and generating a detection signal A measuring head having a light detecting means;
A pipe connection portion provided at a rear portion of the measurement head, and connected to a predetermined pipe connection port;
A case portion provided at a rear portion of the pipe connection portion, and having a part for controlling the light irradiation means and the scattered light detection means;
A particle counting device comprising a control unit for creating particle information based on the detection signal and a control cable for connecting the case part,
A mount having an attachment portion connectable to the case portion, and an installation portion for installing other than the predetermined pipe connection port;
With a flange that is connected to a specific pipe connection port at one end and provided with a connection port that can be electrically connected to the control cable, and has a control unit connection portion that is connected to the control unit at the other end Cable and
A particle counting device comprising: The installation part is a horizontal plate,
The mounting portion is a vertical plate perpendicular to the horizontal plate;
The particle counter according to claim 1, wherein the case part is screwed to the attachment part. The particle counter according to any one of claims 1 to 2 ,
A particle counting system comprising: a control unit that creates particle information based on the detection signal.

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