JP6453443B2 - Conductive film laminate - Google Patents

Description

  The present invention relates to a conductive film laminate in which protective films are attached to both surfaces of a conductive film.

In recent years, in various electronic devices such as portable information devices, touch panels that are used in combination with a display device such as a liquid crystal display device and perform an input operation to the electronic device by touching a screen have been widely used.
This touch panel is classified into a resistance film method, a capacitance method, an infrared method, an ultrasonic method, an electromagnetic inductive coupling method, and the like according to the operation principle. In particular, this touch panel has a high transmittance and a high durability. Capacitive touch panels are attracting attention.

  In a capacitive touch panel, a conductive film in which a conductive layer is formed in a predetermined pattern on a transparent insulating substrate is used. When a touch operation is performed, the touched position is determined from the change in the capacitance of the conductive film. Sense information.

For example, Patent Document 1 discloses that the smoothness of the transfer substrate surface is obtained by laminating the transparent substrate after sequentially laminating the transparent resin layer and the transparent resin substrate on the auxiliary electrode layer on the transfer substrate. A transparent conductive laminate in which a transparent conductive layer is formed on the side of the transferred surface composed of the auxiliary electrode layer and the transparent resin layer is disclosed.
Patent Document 2 discloses a conductive layer made of a conductor obtained by applying or printing a solution containing at least a polythiophene-based conductive agent and a silicon-containing compound having a mercapto group on at least one surface of an insulating layer, and then drying. A conductive sheet is disclosed.

  Moreover, as described in Patent Document 3, the produced conductive film is shipped as a laminate having a protective film attached to the surface for the purpose of protecting the conductive film, and is transported to the next destination. Finally, after the protective film is peeled off, it is used for applications such as mounting as a conductive film on a touch panel.

JP 2014-216175 A JP 2014-13708 A JP 2014-209440 A

  Electronic devices such as portable information devices are required to be thinner, and a touch panel is also required to be thinner. Accordingly, the conductive film is also required to be thinner.

  However, when the insulating substrate of the conductive film is thinned, the protective film is removed from the conductive film in a lamination process in which the conductive film is laminated with an LCD (liquid crystal display) module or a cover glass via an OCA (Optical Clear Adhesive) tape. It has been found that there is a problem that wrinkles and nicks are likely to occur during peeling and during transportation, resulting in poor handling.

  In addition, if the insulating substrate of the conductive film is thinned, when the protective film is peeled off from the conductive film, the protective film on the side opposite to the protective film on the side to be peeled off may be peeled off, causing wrinkles or nicks. It has been found that there is a problem that the yield decreases.

Furthermore, if the area of the insulating substrate of the conductive film increases, even if the conductive film is not thin, it is protected from the conductive film in the lamination process in which the conductive film is laminated with the LCD module or cover glass via the OCA tape. It has also been found that there is a problem that wrinkles and nicks are liable to occur when the film is peeled off and during conveyance, and handling properties are deteriorated.
Also, when the protective film is peeled from the conductive film having such a large area, the protective film on the side opposite to the protective film on the side to be peeled easily peels off, causing wrinkles and nicks, and reducing the yield. I also found that there was a problem of doing.

  In addition, when the peel strength of the protective film is too high, wrinkles and nicks may be caused, or a part of the adhesive may remain on the conductive film, resulting in a decrease in the optical properties of the conductive film. I found out.

  The present invention has been made to solve such a conventional problem, and can suppress the generation of wrinkles and nicks, has good handling properties, can suppress the decrease in yield, and can reduce the optical characteristics. It aims at providing the conductive film laminated body which can be suppressed.

As a result of intensive studies to achieve the above object, the present inventor has found that a conductive film having an insulating substrate having a thickness of less than 70 μm and a conductive portion formed on at least one surface of the insulating substrate, A first protective film that is detachably attached to the first surface side, and a second protective film that is detachably attached to the second surface side that is the surface opposite to the first surface of the conductive film. The thickness t1 of the first protective film is 75 μm or more, and the peeling force F1 at the time of 180 ° peeling of the first protective film to the conductive film is that of the second protective film. It has been found that the above problem can be solved by being larger than the peeling force F2 at the time of 180 ° peeling and 0.5 N / 25 mm or less.
That is, the present invention provides the following technical ideas (1) to (8).

(1) a conductive film having an insulating substrate having a thickness of less than 70 μm and a conductive layer formed on at least one surface of the insulating substrate;
A first protective film releasably attached to the first surface side of the conductive film;
A second protective film releasably attached to the second surface side that is the surface opposite to the first surface of the conductive film,
The thickness t1 of the first protective film is 75 μm or more,
The conductive film having a peeling force F1 at the time of 180 ° peeling of the first protective film with respect to the conductive film is larger than the peeling force F2 at the time of 180 ° peeling of the second protective film and is 0.5 N / 25 mm or less. Laminated body.
(2) The conductive film laminate according to (1), wherein the thickness t1 of the first protective film is thicker than the thickness t2 of the second protective film.
(3) The electrically conductive film laminated body as described in (1) or (2) whose haze value of a 1st protective film and a 2nd protective film is 15% or less.
(4) The conductive film laminate according to any one of (1) to (3), wherein the insulating substrate has a thickness of 50 μm or less.
(5) The conductive film laminate according to any one of (1) to (4), wherein the first protective film and the second protective film have an adhesive layer.
(6) The conductive film laminate according to any one of (1) to (5), wherein the insulating substrate is made of polyethylene terephthalate, a cycloolefin polymer, or a cycloolefin copolymer.
(7) The conductive film laminate according to any one of (1) to (6), wherein the conductive layer is formed on both surfaces of the insulating substrate.
(8) The conductive layer laminate according to any one of (1) to (7), wherein the conductive layer has a mesh structure formed of a plurality of fine metal wires.

Furthermore, as a result of intensive studies to achieve the above object, the present inventor has formed an insulating substrate having a thickness of 70 μm or more and a diagonal length of 20 inches or more on at least one surface of the insulating substrate. A conductive film having a conductive layer formed thereon, a third protective film releasably attached to the third surface side of the conductive film, and a surface opposite to the third surface of the conductive film. A third protective film having a thickness t3 of 75 μm or more, and 180 ° of the third protective film with respect to the conductive film. It has also been found that the above problem can be solved when the peeling force F3 at the time of peeling is larger than the peeling force F4 at the time of 180 ° peeling of the fourth protective film and 0.5 N / 25 mm or less.
That is, the present invention also provides the following technical ideas (9) to (17).

(9) a conductive film having an insulating substrate having a thickness of 70 μm or more and a diagonal length of 20 inches or more, and a conductive layer formed on at least one surface of the insulating substrate;
A third protective film releasably attached to the third surface side of the conductive film;
A fourth protective film releasably attached to the fourth surface side, which is the surface opposite to the third surface of the conductive film,
The thickness t3 of the third protective film is 75 μm or more,
The peeling force F3 at the time of 180 ° peeling of the third protective film with respect to the conductive film is larger than the peeling force F4 at the time of 180 ° peeling of the fourth protective film and 0.5 N / 25 mm or less. A conductive film laminate.
(10) The conductive film laminate according to (9), wherein the thickness t3 of the third protective film is thicker than the thickness t4 of the fourth protective film.
(11) The conductive film laminate according to (9) or (10), wherein the haze value of the third protective film and the fourth protective film is 15% or less.
(12) The conductive film laminate according to any one of (9) to (11), wherein the insulating substrate has a thickness of 90 μm or more.
(13) The conductive film laminate according to any one of (9) to (12), wherein the diagonal length of the insulating substrate is 25 inches or more.
(14) The conductive film laminate according to any one of (9) to (13), wherein the third protective film and the fourth protective film have an adhesive layer.
(15) The conductive film laminate according to any one of (9) to (14), wherein the insulating substrate is made of polyethylene terephthalate, a cycloolefin polymer, or a cycloolefin copolymer.
(16) The conductive film laminate according to any one of (9) to (15), wherein the conductive layer is formed on both surfaces of the insulating substrate.
(17) The conductive film laminate according to any one of (9) to (16), wherein the conductive layer has a mesh structure formed by a plurality of fine metal wires.

  According to the present invention, generation of wrinkles and nicks can be suppressed, handling properties are good, yield can be suppressed, and optical characteristics can be prevented from decreasing.

It is sectional drawing which shows typically an example of the electrically conductive film laminated body which concerns on Embodiment 1 of this invention. It is a top view which shows the conductive film of the conductive film laminated body of FIG. It is a fragmentary top view which expands and shows the detection electrode of a conductive film. It is a fragmentary sectional view which expands and shows a part of conductive film laminated body. It is sectional drawing which shows typically an example of the electrically conductive film laminated body which concerns on Embodiment 2. FIG.

Hereinafter, representative embodiments 1 and 2 of the present invention will be described, but the present invention is not limited to such embodiments.
In the present specification, a numerical range expressed using “to” means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.

Embodiment 1
Hereinafter, the conductive film laminate of Embodiment 1 of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.
In FIG. 1, an example of the electrically conductive film laminated body of Embodiment 1 of this invention is notionally shown with sectional drawing.
A conductive film laminate 50 shown in FIG. 1 includes a conductive film 10 in which a first detection electrode 12 is formed on one surface of an insulating substrate 11 and a second detection electrode 22 is formed on the other surface. It has the 1st protective film 51 stuck on one surface side of the film 10 so that peeling was possible, and the 2nd protective film 54 stuck on the other surface side of the conductive film 10 so that peeling was possible.

In the conductive film laminate of Embodiment 1, the thickness of the insulating substrate 11 of the conductive film 10 is less than 70 μm, the thickness t1 of the first protective film 51 is 75 μm or more, and the first protective film The peeling force F1 at the time of 180 ° peeling is larger than the peeling force F2 at the time of 180 ° peeling of the second protective film, and the peeling force F1 is 0.5 N / 25 mm or less.
With such a configuration, the conductive film laminate of Embodiment 1 can improve the ease of peeling of the protective film, and can suppress the occurrence of wrinkles and nicks on a thin insulating substrate, thereby reducing the yield. The handling property is good, and the remaining of the pressure-sensitive adhesive when the protective film is peeled can be suppressed to suppress the deterioration of the optical properties.
This point will be described in detail later.

<Conductive film>
FIG. 2 shows a plan view of the conductive film 10.
The conductive film 10 has a rectangular flexible transparent insulating substrate 11, and a sensing region S1 is defined at the center of the insulating substrate 11, and a peripheral region S2 is defined outside the sensing region S1.

The insulating substrate 11 is preferably an insulating substrate having transparency and a thickness of less than 70 μm.
The material of the insulating substrate 11 is not particularly limited, and various resin films can be used. For example, PET (polyethylene terephthalate), COP (cycloolefin polymer), COC (cycloolefin copolymer), polyethylene naphthalate Examples thereof include plastic films made of polymer materials such as (PEN), polyethylene, polypropylene, polystyrene, polyamide, polyvinyl chloride, polycarbonate, polyacrylonitrile, polyimide, polyacrylate, and polymethacrylate. Of these, PET, COP, and COC are preferable from the viewpoints of transparency and insulation.
The insulating substrate 11 may have a surface on which various films such as a protective film, an adhesive film, an antireflection layer, a light shielding layer, a planarization layer, a buffer layer, and a stress relaxation layer are formed.
In the first embodiment, the insulating substrate 11 is a film-like object such as a long film or a cut sheet-like film.

  Further, the thickness of the insulating substrate 11 is preferably 50 μm or less, more preferably 25 μm to 45 μm, from the viewpoints of thinning, transparency, flexibility, mechanical strength, and the like.

On the surface of the insulating substrate 11, a plurality of first detections are arranged in parallel in a second direction D2 extending along the first direction D1 and orthogonal to the first direction D1 in the sensing region S1. An electrode 12 is formed, and a plurality of first lead wires 13 corresponding to the plurality of first detection electrodes 12 are arranged adjacent to each other in the peripheral region S2, thereby forming the first wiring portion 14. At the same time, a plurality of first external connection terminals 15 corresponding to the plurality of first detection electrodes 12 are arranged on the edge of the insulating substrate 11.
A first connector portion 16 is formed at each end of each first detection electrode 12, and one end portion of the corresponding first lead-out wiring 13 is connected to one first connector portion 16. The other end of one lead wiring 13 is connected to the corresponding first external connection terminal 15.

Similarly, a plurality of second detection electrodes 22 extending along the second direction D2 and arranged in parallel in the first direction D1 are formed on the back surface of the insulating substrate 11 in the sensing region S1. In the peripheral region S2, a plurality of second lead wires 23 corresponding to the plurality of second detection electrodes 22 are arranged close to each other to form a second wiring portion 24, and the insulating substrate 11 A plurality of second external connection terminals 25 corresponding to the plurality of second detection electrodes 22 are arranged at the edge of the first and second detection electrodes 22.
A second connector portion 26 is formed at each end of each second detection electrode 22, and one end portion of the corresponding second lead-out wiring 23 is connected to one second connector portion 26, The other end of each of the two lead wires 23 is connected to the corresponding second external connection terminal 25.

The plurality of first lead wires 13 and the plurality of second lead wires 23 are each made of metal.
As shown in FIG. 3, the first detection electrodes 12 arranged on the surface of the insulating substrate 11 are preferably formed by a mesh pattern made of fine metal wires 12 a and arranged on the back surface of the insulating substrate 11. The second detection electrode 22 is also preferably formed by a mesh pattern made of fine metal wires 22a.

Thus, when the 1st detection electrode 12 and the 2nd detection electrode 22 have a mesh-shaped pattern formed with the metal fine wire, when irradiating illumination light from the back surface side of the insulated substrate 11, it is mesh-shaped. The illumination light is transmitted to the surface side of the insulating substrate 11 through the opening of the pattern and the transparent insulating substrate 11. That is, transparency can be secured as a conductive film, and it can be suitably used as a conductive film for a touch panel.
The detection electrode may be a metal oxide or the like, but a metal mesh is less likely to generate stress than a metal oxide, and local strain or the like occurs in the substrate when a thin substrate is used. It is difficult and preferable.

The line widths of the fine metal wires constituting the first detection electrode 12 and the second detection electrode 22 are not particularly limited, but are preferably 0.1 to 10,000 μm from the viewpoint of high integration of the fine metal wires. 1 to 300 μm is more preferable, 0.1 to 100 μm is more preferable, and 0.2 to 50 μm is particularly preferable.
The distance between the fine metal wires is not particularly limited, but is preferably from 0.1 to 1500 μm, more preferably from 0.1 to 1200 μm, further preferably from 0.1 to 1000 μm, from the viewpoint of high integration of the fine metal wires. ˜900 μm is particularly preferable.
The thickness of the fine metal wire is not particularly limited, but is preferably 0.001 to 100 μm, more preferably 0.01 to 30 μm, and still more preferably 0.01 to 20 μm from the viewpoint of high integration of the fine metal wires.
Further, the arrangement pattern of the fine metal wires is not particularly limited, and may be an arbitrary shape. For example, a linear shape, a curved shape, a rectangular shape, a circular shape, and the like can be given. Moreover, the some metal fine wire may be arrange | positioned in the desired pattern (for example, stripe shape).

  The plurality of first detection electrodes 12 and the plurality of first lead wires 13 arranged on the surface of the insulating substrate 11 can be formed simultaneously by the same process. Similarly, the plurality of second detection electrodes 22 and the plurality of second lead-out wirings 23 arranged on the back surface of the insulating substrate 11 can be simultaneously formed by the same process. In this case, the first detection electrode 12 and the first lead-out wiring 13 arranged on the surface of the same insulating substrate 11 are formed from the same material to the same thickness, and similarly on the back surface of the same insulating substrate 11. It is preferable that the second detection electrode 22 and the second lead wiring 23 to be disposed are formed of the same material and the same thickness.

The method for producing such a conductive film is not particularly limited, but a step of forming a silver halide emulsion layer (hereinafter also simply referred to as a photosensitive layer) containing silver halide and a binder on both surfaces of the insulating substrate 11 respectively. (1) The method which has the process (2) which develops after exposing a photosensitive layer is mentioned.
Below, each process is demonstrated.

[Step (1): Photosensitive layer forming step]
Step (1) is a step of forming a photosensitive layer containing silver halide and a binder on both surfaces of the insulating substrate 11.
The method for forming the photosensitive layer is not particularly limited, but from the viewpoint of productivity, the photosensitive layer forming composition containing silver halide and a binder is brought into contact with the insulating substrate 11 and photosensitive on both sides of the insulating substrate 11. A method of forming a conductive layer is preferred.
Below, after explaining in full detail the aspect of the composition for photosensitive layer formation used with the said method, the procedure of a process is explained in full detail.

The photosensitive layer forming composition contains a silver halide and a binder.
The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. As the silver halide, for example, silver halides mainly composed of silver chloride, silver bromide and silver iodide are preferably used, and silver halides mainly composed of silver bromide and silver chloride are preferably used.

The kind in particular of binder used is not restrict | limited, A well-known polymer can be used, for example, a water-soluble binder (water-soluble polymer) may be used. Specifically, for example, polysaccharides such as gelatin, carrageenan, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch, cellulose and derivatives thereof, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, polyacrylic acid , Polyalginic acid, polyhyaluronic acid, carboxycellulose, gum arabic, sodium alginate and the like. Moreover, the binder may be contained in the composition for photosensitive layer formation in the form of latex.
The volume ratio of the silver halide and the binder contained in the composition for forming the photosensitive layer is not particularly limited, and is appropriately set so as to be within a preferable volume ratio range of the metal and the binder in the fine metal wires 12a and 22a described above. Adjusted.

The composition for forming a photosensitive layer contains a solvent, if necessary.
Examples of the solvent used include water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, esters such as ethyl acetate, ethers, and the like. Etc.), ionic liquids, or mixed solvents thereof.

(Process procedure)
The method for bringing the composition for forming a photosensitive layer into contact with the insulating substrate 11 is not particularly limited, and a known method can be adopted. For example, the method of apply | coating the composition for photosensitive layer formation to the insulating substrate 11, the method of immersing the insulating substrate 11 in the composition for photosensitive layer formation, etc. are mentioned.
The content of the binder in the formed photosensitive layer is not particularly limited but is preferably ^{0.3~5.0g / m 2, 0.5~2.0g / m} 2 is more preferable.
Further, the content of silver halide in the photosensitive layer is not particularly limited, but is preferably 1.0 to 20.0 g / m ^{2 in} terms of silver from the viewpoint that the conductive properties of the fine metal wires 12a and 22a are more excellent. 0.0-15.0 g / m ² is more preferable.

  In addition, you may further provide the protective layer which consists of a binder on a photosensitive layer as needed. By providing the protective layer, scratches can be prevented and mechanical properties can be improved.

[Step (2): Exposure and development step]
In the step (2), the photosensitive layer obtained in the above step (1) is subjected to pattern exposure and then developed, whereby the first detection electrode 12, the first lead-out wiring 13, and the first external connection terminal. 15 and the first connector portion 16, the second detection electrode 22, the second lead-out wiring 23, the second external connection terminal 25, and the second connector portion 26.
First, the pattern exposure process will be described in detail below, and then the development process will be described in detail.

(Pattern exposure)
By subjecting the photosensitive layer to pattern exposure, the silver halide in the photosensitive layer in the exposed region forms a latent image. In the area where the latent image is formed, fine metal lines are formed by a development process described later. On the other hand, in an unexposed area that has not been exposed, the silver halide dissolves and flows out of the photosensitive layer during the fixing process described later, and a transparent film is obtained.
The light source used in the exposure is not particularly limited, and examples thereof include light such as visible light and ultraviolet light, and radiation such as X-rays.
The method for performing pattern exposure is not particularly limited. For example, surface exposure using a photomask may be performed, or scanning exposure using a laser beam may be performed. The shape of the pattern is not particularly limited, and is appropriately adjusted according to the pattern of fine metal wires to be formed.

(Development processing)
The development processing method is not particularly limited, and a known method can be employed. For example, a usual development processing technique used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.

  The development process can include a fixing process performed for the purpose of removing and stabilizing the silver salt in the unexposed part. For the fixing process, a technique of fixing process used for silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, and the like can be used.

In addition to the above steps, the following undercoat layer forming step, antihalation layer forming step, heat treatment, or binder removal treatment may be performed as necessary.
(Undercoat layer forming step)
For the reason of excellent adhesion between the insulating substrate 11 and the silver halide emulsion layer, a step of forming an undercoat layer containing the above-mentioned predetermined compound on the surface of the insulating substrate 11 is performed before the step (1). Is preferred.
(Anti-halation layer formation process)
From the viewpoint of thinning the thin metal wires 12a and 22a, it is preferable to carry out a step of forming antihalation layers on both surfaces of the insulating substrate 11 before the step (1).

[Step (3): Heating step]
Step (3) is performed as necessary, and is a step of performing heat treatment after the development processing. By carrying out this step, fusion occurs between the binders, and the hardness of the fine metal wires 12a and 22a is further increased. In particular, when polymer particles are dispersed as a binder in the composition for forming a photosensitive layer (when the binder is polymer particles in latex), by performing this step, fusion occurs between the polymer particles, Fine metal wires 12a and 22a having a desired hardness are formed.
The conditions for the heat treatment are appropriately selected depending on the binder used, but it is preferably 40 ° C. or higher from the viewpoint of the film forming temperature of the polymer particles, more preferably 50 ° C. or higher, and further 60 ° C. or higher. preferable. Further, from the viewpoint of suppressing curling of the substrate and the like, 150 ° C. or lower is preferable, and 100 ° C. or lower is more preferable.
In addition, since this heat treatment can be combined with a drying step usually performed after exposure and development processing, it is not necessary to increase a new step for film formation of polymer particles, and productivity, cost, etc. Excellent from a viewpoint.

[Step (4): Debinding process]
The binder removal treatment step is a step of treating the insulating substrate 11 having fine metal wires with a proteolytic enzyme that decomposes a water-soluble binder such as gelatin or an oxidizing agent such as oxo acid. By carrying out this step, a water-soluble binder such as gelatin is decomposed and removed from the photosensitive layer subjected to the exposure / development treatment, and ion migration between the fine metal wires is suppressed.
Below, the material used at this process is explained in full detail first, and the procedure of this process is explained in full detail after that.

(Proteolytic enzyme)
As a proteolytic enzyme (hereinafter also referred to as an enzyme), a known plant or animal enzyme capable of hydrolyzing a protein such as gelatin is used. Examples include pepsin, rennin, trypsin, chymotrypsin, cathepsin, papain, ficin, thrombin, renin, collagenase, bromelain, bacterial protease, and the like. Of these, trypsin, papain, ficin, and bacterial protease are particularly preferable. Among these, in particular, bacterial proteases (for example, biolase manufactured by Nagase Sangyo Co., Ltd.) are commercially available at low cost and can be easily obtained.

(Oxidant)
As the oxidizing agent, known oxidizing agents that can oxidatively decompose proteins such as gelatin are used. Examples thereof include halogen oxoacid salts such as hypochlorite, chlorite and chlorate. Among these, sodium hypochlorite is commercially available at a low price and can be easily obtained.

(Process procedure)
The procedure of the debinding process is not particularly limited as long as the insulating substrate 11 having fine metal wires can be brought into contact with the enzyme or the oxidizing agent. Examples of the contact method include a method of applying a treatment liquid on the insulating substrate 11 having a thin metal wire, a method of immersing the insulating substrate 11 having a thin metal wire in the treatment liquid, and the like.
The enzyme content in the treatment liquid is not particularly specified, and can be arbitrarily determined depending on the ability of the enzyme used and the required performance. Among them, the enzyme content is suitably about 0.05 to 20% by mass, more preferably 5 to 10% by mass with respect to the total amount of the processing solution, in terms of easy control of the degree of gelatin decomposition and removal. .

  In addition to the above enzyme, this treatment liquid can contain a pH buffer, an antibacterial compound, a wetting agent, a preservative, and the like as necessary.

In addition, you may further provide the process of wash | cleaning the insulating substrate 11 which has a metal fine wire with warm water after the process with a process liquid as needed. By providing this step, the gelatinolysis residue, the remainder of the proteolytic enzyme, the residual oxidizing agent, and the like can be removed, and ion migration is further suppressed.
The cleaning method is not particularly limited as long as the insulating substrate 11 having the fine metal wires can be brought into contact with the hot water. For example, a method of immersing the insulating substrate 11 having the fine metal wires in the hot water, or an insulating substrate having the fine metal wires 11 and the like.
The temperature of the hot water is appropriately selected according to the type of proteolytic enzyme used and the like, but is preferably 20 to 80 ° C and more preferably 40 to 60 ° C from the viewpoint of productivity.

  Moreover, you may implement a smoothing process with respect to the insulated substrate 11 which has the obtained metal fine wire after the said process as needed. The method of the smoothing process is not particularly limited, and for example, the smoothing process can be performed by a calendar roll including a pair of rolls.

In the above embodiment, the plurality of first detection electrodes 12 and the first wiring portion 14 are arranged on the surface of the insulating substrate 11 and the plurality of second detection electrodes 22 are arranged on the back surface of the insulating substrate 11. Although the 2nd wiring part 24 has been arranged, it is not restricted to this.
For example, a plurality of first detection electrodes 12 and a plurality of second detection electrodes 22 are arranged on one surface side of the insulating substrate 11 via an interlayer insulating film, and the first surface electrode on the same surface side of the insulating substrate 11. The wiring part 14 and the second wiring part 24 may be arranged.

  Or it can also be set as the structure of two board | substrates. That is, the plurality of first detection electrodes 12 and the first wiring portion 14 are arranged on the surface of the first insulating substrate, and the plurality of second detection electrodes 22 and the second wiring are arranged on the surface of the second insulating substrate. It is also possible to arrange the wiring portion 24 and use the first insulating substrate and the second insulating substrate so as to overlap each other.

  In the illustrated conductive film 10, the first detection electrode and the second detection electrode are formed by a mesh pattern made of a thin metal wire. However, the present invention is not limited to this, and at least one of the insulating substrates having a thickness of less than 70 μm is used. Any conductive film having a conductive layer formed on the surface may be used, and a conductive film having a solid conductive layer may be used.

Next, the first protective film 51 and the second protective film 54 will be described.
As shown in FIGS. 1 and 4, the first protective film 51 and the second protective film 54 are attached to both surfaces of the conductive film 10, respectively.

<First protective film>
The first protective film 51 is a member that is detachably attached to the first surface, which is one surface of the conductive film 10, and is a member for protecting the conductive film 10 during transportation. In the first embodiment, the thickness t1 of the first protective film 51 is 75 μm or more.
In the conductive film laminate 50 shown in FIG. 1, the first protective film 51 includes a first base material 52 and a first adhesive layer 53.

The 1st base material 52 can utilize the various well-known base materials used as a base material of the protective film of a conductive film.
Specifically, the first substrate 52 is made of polyethylene (PE), polyethylene naphthalate (PEN), polyamide (PA), polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyvinyl alcohol (PVA), polyacrylate. Nitrile (PAN), polyimide (PI), transparent polyimide, polymethyl methacrylate resin (PMMA), polycarbonate (PC), polyacrylate, polymethacrylate, polypropylene (PP), polystyrene (PS), ABS, cyclic olefin copolymer ( Various films such as COC), cycloolefin polymer (COP), and triacetyl cellulose (TAC) can be used.

The first pressure-sensitive adhesive layer 53 is a component having adhesiveness that becomes an adhesive layer when the conductive film 10 is laminated as the first protective film 51. In addition, since the first protective film 51 is detachably attached to the conductive film 10, the first adhesive layer 53 has slight adhesiveness to the conductive film 10.
Here, in the first embodiment, the peeling force F1 at the time of 180 ° peeling between the first protective film 51 and the conductive film 10 is 0.5 N / 25 mm or less, and the second force described later. It is larger than the peeling force F2 when the protective film 54 is peeled 180 °. Moreover, it is preferable that the peeling force F1 at the time of 180 degree peeling of the 1st protective film 51 is 0.001 N / 25mm or more.

Here, the peeling force at 180 ° peeling is a peeling force between the protective film and the conductive film, measured according to JISZ0237. First, a 70 × 25 mm protective film is pasted on a 140 × 25 mm conductive film with both ends having a width of 25 mm aligned while being pressed by a roller. Next, the conductive film not bonded to the protective film for 70 mm is folded back 180 ° and peeled off by 15 mm. One end of the protective film is fixed to the chuck of the tensile tester, and the conductive film is fixed to the other chuck. The tester is operated at 300 ± 0.2 mm / min, and the peeled-off force at 180 ° peeling is obtained by averaging the measured values of the peeled 50 mm-long adhesive strength.
In the following description, the peeling force at 180 ° peeling is also simply referred to as peeling force.

  If the 1st adhesion layer 53 can express the above-mentioned peeling power, there will be no restriction in particular in the material of the 1st adhesion layer 53, for example, acrylic adhesive, rubber adhesive, silicone adhesive, polyurethane adhesive, and the like A polyester-based pressure-sensitive adhesive or the like can be used. These pressure-sensitive adhesives may be emulsion type, solvent type, or solventless type.

  As the 1st protective film 51 which has such a base material and an adhesion layer, the various commercially available fine adhesion sheet utilized as a protection film can be used.

<Second protective film>
The second protective film 54 is a member that is peelably attached to the second surface side, which is the surface opposite to the first surface of the conductive film 10, and is a member for protecting the conductive film 10 during transportation. is there.
In the conductive film laminate 50 shown in FIG. 1, the second protective film 54 includes a second base material 55 and a second adhesive layer 56.

The 2nd base material 55 can utilize the various well-known base materials used as a base material of the protective film of a conductive film similar to the 1st base material 52. FIG.
The materials of the first base material 52 and the second base material 55 may be the same or different.

The second pressure-sensitive adhesive layer 56 is a component having adhesiveness that becomes an adhesive layer when the conductive film 10 is laminated as the second protective film 54. Moreover, the 2nd protective film 54 is stuck to the conductive film 10 so that peeling is possible.
Further, as described above, the peeling force F2 when the second protective film 54 is peeled by 180 ° is smaller than the peeling force F1 when the first protective film 51 is peeled by 180 °.

The material of the second adhesive layer 56 is not particularly limited as long as it can exhibit a peeling force that satisfies the above conditions, and the same material as that of the first adhesive layer 53 can be used.
Moreover, similarly to the 1st protective film 51, as such 2nd protective film 54, the various commercially available slightly adhesive sheet | seat utilized as a protective film can be used.

As mentioned above, for the purpose of protecting the conductive film, the conductive film is shipped as a laminate having a protective film attached to the surface thereof, and finally transported to the next destination, and finally the protective film. Then, the conductive film is mounted on the touch panel as a conductive film through a lamination process in which the conductive film is laminated with an LCD (liquid crystal display) module and a cover glass via an OCA (Optical Clear Adhesive) tape. At that time, after the first protective film is peeled off and attached to the LCD module, the other protective film is peeled off and attached to the cover glass.
Here, as described above, with the demand for further thinning of electronic devices such as portable information devices, there is a demand for thinning of conductive films used for touch panels.

However, if the conductive film is thinned, the conductive film is deformed when peeling the protective film from the conductive film in the laminating process or during transportation, and wrinkles and nicks are likely to occur, and handling properties are deteriorated. I found out there was a problem. In particular, when transporting after peeling off one of the protective films, the conductive film is easily deformed because the thin conductive film is supported only by the other protective film.
In addition, if the conductive film is made thin, when the protective film on one side is peeled off from the conductive film, the protective film on the side opposite to the protective film on the side to be peeled may be peeled off, causing wrinkles or nicks. , It turns out that there is a problem that the yield decreases. In addition, when the protective film is too peelable, when the protective film is peeled off, the conductive film is pulled and deformed, causing wrinkles and nicks, or part of the adhesive on the conductive film. It has been found that there is a problem that the optical properties of the conductive film deteriorate due to remaining.

  In contrast, in the conductive film laminate of Embodiment 1, the protective film is detachably attached to both surfaces of the conductive film having an insulating substrate thickness of less than 70 μm, and the peel strength of one protective film is the other. The protective film has a structure in which the protective film is larger than the peel force of the protective film and 0.5 N / 25 mm or less, and the protective film having the larger peel force has a thickness of 75 μm or more.

In Embodiment 1, when a thin conductive film having an insulating substrate thickness of less than 70 μm is used, the peeling force F1 at the time of 180 ° peeling of the first protective film is the same as that at the time of 180 ° peeling of the second protective film. By making it larger than the peeling force F2, when peeling the protective film in the lamination process, the protective film on the side to be peeled (second protective film) can be surely peeled, and the first on the opposite side. It is possible to prevent the protective film from being peeled off, and to suppress generation of wrinkles and nicks and a decrease in yield.
Moreover, since both the peeling force F1 of the first protective film and the peeling force F2 of the second protective film are 0.5 N / 25 mm or less, when peeling the first protective film or the second protective film, It can suppress that a conductive film is pulled and deform | transforms, and a wrinkle and a nick generate | occur | produce, Moreover, it can suppress that a part of adhesive remains on a conductive film, and can prevent that optical performance falls.
Further, by increasing the thickness t1 of the first protective film having the larger peeling force to 75 μm or more, the conductive film can be used even during transportation, in particular during transportation after the second protective film is peeled off. It is possible to prevent wrinkles and nicks from being deformed and to suppress deterioration in handling properties.

  Here, as the conductive film 10 (insulating substrate 11) is thinner, the above-described problem is more likely to occur. Therefore, the first embodiment of the present invention is more effective when the thickness of the insulating substrate 11 of the conductive film 10 is 50 μm or less. It can be suitably applied.

The thickness t1 of the first protective film 51 is preferably thicker than the thickness t2 of the second protective film 54.
If the thickness t2 of the second protective film 54 having the smaller peeling force, that is, the second protective film peeled first, is thicker than the thickness t1 of the first protective film 51, the second protective film 54 When the film 54 is peeled off, it may be difficult to peel off.
On the other hand, when the second protective film 54 is peeled off by making the thickness t2 of the second protective film 54 peeled first thinner than the thickness t1 of the first protective film. It is preferable at the point which becomes easy to do.

  Moreover, the peeling force F1 of the first protective film 51 can suppress adhesive residue and prevent the optical properties of the conductive film from being deteriorated, and prevents the first protective film from peeling when the second protective film is peeled off. From the viewpoint of being able to do so, 0.5 N / 25 mm or less is preferable, and 0.01 N / 25 mm to 0.25 N / 25 mm is more preferable.

The haze values of the first protective film 51 and the second protective film 54 are each preferably 15% or less, more preferably 10% or less, and particularly preferably 5% or less.
Thereby, from each of both surfaces of the conductive film laminate 50, the shape of the detection electrode and the wiring part formed on the insulating substrate 11 of the conductive film 10, the presence or absence of wiring chip, the presence or absence of nicks and wrinkles of the conductive film 10, etc. Can be inspected.

  In the example shown in FIG. 4, the first protective film 51 and the second protective film 54 have the first adhesive layer 53 and the second adhesive layer 56 between the metal thin wires 12 a and 22 a of the conductive film 10. Although it was set as the structure stuck to the conductive film 10 in the state which entered the area | region and contacted the surface of the metal fine wires 12a and 22a and the insulating substrate 11, it is not limited to this, In the area between the metal fine wires 12a and 22a The first adhesive layer 53 and the second adhesive layer 56 may have a region that is not in contact with the insulating substrate 11.

Embodiment 2
In the first embodiment, an insulating substrate having a thickness of less than 70 μm is used. However, in the following second embodiment, an insulating substrate having a diagonal length of 20 inches or more and a thickness of 70 μm or more is used.

In FIG. 5, an example of the electrically conductive film laminated body of Embodiment 2 is notionally shown with sectional drawing.
The conductive film laminate 50A shown in FIG. 5 includes a conductive film 10A in which a first detection electrode 12A is formed on one surface of an insulating substrate 11A and a second detection electrode 22A is formed on the other surface, It has the 3rd protective film 51A pasted on one side of film 10A so that exfoliation, and the 4th protective film 54A stuck on the other side of conductive film 10A so that peeling was possible.
The conductive film 10A according to Embodiment 2 and the first detection electrode 12A and the second detection electrode 22A formed on the conductive film 10A are formed on the conductive film 10 and the conductive film 10 according to Embodiment 1. The first detection electrode 12 and the second detection electrode 22 have the same configuration.

In the conductive film laminate of the second embodiment, the insulating substrate 11A of the conductive film 10A has a rectangular shape, a diagonal length of 20 inches (50.8 cm) or more, and a thickness of 70 μm or more. The thickness t3 of the protective film 51A is 75 μm or more, the peeling force F3 at the time of 180 ° peeling of the third protective film is larger than the peeling force F4 at the time of 180 ° peeling of the fourth protective film, and The peeling force F3 is 0.5 N / 25 mm or less. Such a conductive film laminate of Embodiment 2 is mounted on a touch panel having a diagonal length of 20 inches or more.
With such a configuration, the conductive film laminate of Embodiment 2 improves the ease of peeling of the protective film even when the diagonal length of the insulating substrate is 20 inches or more, and the insulating substrate is wrinkled or nicked. It is possible to suppress the reduction of the yield due to the occurrence of the above, the handling property is good, and the remaining of the adhesive when the protective film is peeled off can be suppressed to suppress the deterioration of the optical characteristics.
This point will be described in detail later.

<Conductive film>
A conductive film 10A according to Embodiment 2 shown in FIG. 5 is manufactured in the same manner as in Embodiment 1 using a rectangular insulating substrate having a diagonal length of 20 inches or more and a thickness of 70 μm or more. can do.
Note that the thickness of the insulating substrate 11A is preferably 90 μm or more, and more preferably 95 μm to 150 μm, from the viewpoints of thinning, transparency, flexibility, mechanical strength, and the like.

Next, the third protective film 51A and the fourth protective film 54A will be described.
As shown in FIG. 5, the 3rd protective film 51A and the 4th protective film 54A are each affixed on both surfaces of 10 A of electrically conductive films.

<Third protective film>
The third protective film 51A can have the same configuration as the first protective film 51 according to the first embodiment. The thickness t3 of the third protective film 51A is 75 μm or more.
Here, the peeling force F3 at the time of 180 ° peeling between the third protective film 51A and the conductive film 10A is 0.5 N / 25 mm or less, and the 180 ° peeling of the fourth protective film 54A described later is performed. It is larger than the peeling force F4 at the time. Moreover, it is preferable that the peeling force F3 at the time of 180 degree peeling of the 3rd protective film 51A is 0.001 N / 25mm or more.

<4th protective film>
The fourth protective film can have the same configuration as that of the second protective film 54 according to Embodiment 1. As described above, the peeling force F4 when the fourth protective film 54A is peeled by 180 ° is smaller than the peeling force F3 when the third protective film 51 is peeled by 180 °.

The conductive film laminate according to the first embodiment solves the problems of wrinkling of the conductive film, generation of nicks, and deterioration in handling properties in the lamination process that occurs by thinning the insulating substrate 11.
However, if the area of the insulating substrate is increased without reducing the thickness of the insulating substrate, the conductive film is deformed when peeling the protective film from the conductive film in the lamination process or during transportation. It has been found that there is a problem in that it tends to occur and handling becomes worse. In particular, when transporting after peeling off one protective film, the conductive film is easily deformed because the conductive film is supported only by the other protective film.
Also, even if the insulating substrate is not thinned, when the area of the insulating substrate is increased, when the protective film on one side is peeled off from the conductive film, the protective film on the side opposite to the protective film on the side to be peeled off It was found that there were problems such as wrinkles and nicks and a decrease in yield.

  In contrast, in the conductive film laminate of Embodiment 2, the protective film is detachably attached to both surfaces of a conductive film including an insulating substrate having a diagonal length of 20 inches or more and a thickness of 70 μm or more. The structure in which the peel strength of one protective film is greater than the peel strength of the other protective film and 0.5 N / 25 mm or less, and the thickness of the protective film having the larger peel strength is 75 μm or more. Have.

In the second embodiment, when a conductive film having a diagonal line length of 20 inches or more and a thickness of 70 μm or more is used, the peeling force F3 at the time of 180 ° peeling of the third protective film is the fourth. When the protective film is peeled off, the protective film on the side to be peeled off (fourth protective film) is surely peeled off when the protective film is peeled off in the laminating process. It is possible to prevent the third protective film on the opposite side from being peeled off, and to suppress generation of wrinkles and nicks and a decrease in yield.
Moreover, since the peeling force F3 of the third protective film and the peeling force F4 of the fourth protective film are both 0.5 N / 25 mm or less, when peeling the third protective film or the fourth protective film, It can suppress that a conductive film is pulled and deform | transforms, and a wrinkle and a nick generate | occur | produce, Moreover, it can suppress that a part of adhesive remains on a conductive film, and can prevent that optical performance falls.
Further, by increasing the thickness t3 of the first protective film having the larger peeling force to 75 μm or more, the conductive film can be used even during transportation, particularly during transportation after the fourth protective film is peeled off. It is possible to prevent wrinkles and nicks from being deformed and to suppress deterioration in handling properties.

  Here, as the area of the insulating substrate 11A is larger, the above-described problem is more likely to occur. Therefore, the second embodiment of the present invention is performed when the length of the diagonal line of the insulating substrate 11A is 25 inches (63.5 cm) or more. It can be applied more suitably.

The thickness t3 of the third protective film 51A is preferably thicker than the thickness t4 of the fourth protective film 54A.
When the thickness t4 of the fourth protective film 54A having the smaller peeling force, that is, the fourth protective film peeled first, is thicker than the thickness t3 of the third protective film 51A, the fourth protection film 54A is used. When the film 54A is peeled off, it may be difficult to peel off.
On the other hand, when the fourth protective film 54A is peeled off by making the thickness t4 of the fourth protective film 54A peeled first thinner than the thickness t3 of the third protective film 54 It is preferable at the point which becomes easy to do.

  Further, the peeling force F3 of the third protective film 51A can suppress the adhesive residue and prevent the optical properties of the conductive film from being deteriorated. The peeling of the third protective film 51A when peeling the fourth protective film 54A. 0.5N / 25mm or less is preferable from a viewpoint of preventing the above, and 0.01N / 25mm to 0.25N / 25mm is more preferable.

The haze values of the third protective film 51A and the fourth protective film 54A are each preferably 15% or less, more preferably 10% or less, and particularly preferably 5% or less.
Thereby, from each of both surfaces of the conductive film laminate 50A, the shape of the detection electrode and the wiring part formed on the insulating substrate 11A of the conductive film 10A, the presence or absence of wiring chip, the presence or absence of nicks and wrinkles of the conductive film 10A, etc. Can be inspected.

  Moreover, although the 1st protective film, the 2nd protective film, the 3rd protective film, and the 4th protective film set it as the structure which has an adhesion layer, it is not limited to this, It does not have an adhesion layer, Even if the base material which comprises a protective film itself uses the protective film which has adhesive force with respect to a conductive film as a 1st protective film, a 2nd protective film, a 3rd protective film, and a 4th protective film. Good.

  The conductive film laminate of the present invention has been described in detail above. However, the present invention is not limited to the above-described example, and various improvements and modifications may be made without departing from the gist of the present invention. Of course.

Hereinafter, the present invention will be described in more detail based on examples. Various values such as the thickness of the first protective film and the haze value of the first protective film were changed, and the A4 size of Examples 1 to 11 and Comparative Examples 1 to 4 (the length of the diagonal line was about 14.3 inches ( A conductive film laminate for 36.4 cm)) was produced.
The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be appropriately changed without departing from the spirit of the present invention, and the scope of the present invention is limited by the following examples. Should not be construed as a matter of course.

[Example 1]
(Preparation of silver halide emulsion)
To the following 1 liquid maintained at 38 ° C. and pH 4.5, an amount corresponding to 90% of each of the following 2 and 3 liquids was simultaneously added over 20 minutes while stirring to form 0.16 μm core particles. Subsequently, the following 4 and 5 solutions were added over 8 minutes, and the remaining 10% of the following 2 and 3 solutions were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete the grain formation.

1 liquid:
750 ml of water
9g gelatin
Sodium chloride 3g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
Two liquids:
300 ml of water
150 g silver nitrate
3 liquids:
300 ml of water
Sodium chloride 38g
Potassium bromide 32g
Potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution) 8 ml
Ammonium hexachlororhodate
(0.001% NaCl 20% aqueous solution) 10 ml
4 liquids:
100ml water
Silver nitrate 50g
5 liquids:
100ml water
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

  Then, it washed with water by the flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., and the pH was lowered using sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6 ± 0.2). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting step. The emulsion after washing and desalting was adjusted to pH 6.4 and pAg 7.5, and 3.9 g of gelatin, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate and 10 mg of chloroauric acid were added. Chemical sensitization was performed to obtain optimum sensitivity at 55 ° C., 100 mg of 1,3,3a, 7-tetraazaindene as a stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) as a preservative. added. The finally obtained emulsion contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide. It was a silver iodochlorobromide cubic grain emulsion having a coefficient of 9%.

(Preparation of photosensitive layer forming composition)
1,3,3a, 7-tetraazaindene 1.2 × 10 ⁻⁴ mol / mol Ag, hydroquinone 1.2 × 10 ⁻² mol / mol Ag, citric acid 3.0 × 10 ⁻⁴ mol / Mole Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g / mole Ag was added, and the coating solution pH was adjusted to 5.6 using citric acid, and the photosensitivity was obtained. A composition for forming a conductive layer was obtained.

(Photosensitive layer forming step)
After applying a corona discharge treatment to an insulating substrate having a thickness of 38 μm, a gelatin layer having a thickness of 0.1 μm as an undercoat layer on both surfaces of the insulating substrate, and an optical density of about 1.0 on the undercoat layer and a developer solution. An antihalation layer containing a dye that decolorizes with an alkali was provided. On the antihalation layer, the photosensitive layer forming composition was applied, a gelatin layer having a thickness of 0.15 μm was further provided, and an insulating substrate having a photosensitive layer formed on both sides was obtained. An insulating substrate having a photosensitive layer formed on both sides is referred to as a film A. The formed photosensitive layer had a silver amount of 6.0 g / m ² and a gelatin amount of 1.0 g / m ² .

(Exposure development process)
On both surfaces of the film A, the first detection electrode 12, the first lead-out wiring 13, the first external connection terminal 15, the pattern of the first connector portion 16, the second detection electrode 22, the second Exposure was performed using parallel light using a high-pressure mercury lamp as a light source through a photomask corresponding to the pattern of the two lead wires 23, the second external connection terminals 25, and the second connector portion 26. After the exposure, the film was developed with the following developer, and further developed with a fixer (trade name: N3X-R for CN16X, manufactured by Fuji Film). Furthermore, by rinsing with pure water and drying, an insulating substrate having a conductive member made of Ag wire and a gelatin layer formed on both surfaces was obtained. A gelatin layer was formed between Ag lines. The resulting film is referred to as film B.

(Developer composition)
The following compounds are contained in 1 liter (L) of the developer.
Hydroquinone 0.037mol / L
N-methylaminophenol 0.016 mol / L
Sodium metaborate 0.140 mol / L
Sodium hydroxide 0.360 mol / L
Sodium bromide 0.031 mol / L
Potassium metabisulfite 0.187 mol / L

(Heating process)
The film B was left to stand in a superheated steam bath at 120 ° C. for 130 seconds and subjected to heat treatment. The film after the heat treatment is referred to as film C. This film C is a conductive film.
Thus, the electroconductive film in which the detection electrode which has the mesh-shaped pattern part formed with the metal fine wire was formed was produced.

  Next, on the one surface (first surface) side of the produced conductive film, a first protection having a thickness t1 of 125 μm, a 180 ° peeling force F1 of 0.07 N / 25 mm, and a haze value of 0.8%. A film (TM30125 manufactured by Sanei Kaken Co., Ltd.) is placed on the other surface (second surface) side with a thickness t2 of 30 μm, a 180 ° peeling force F2 of 0.01 N / 25 mm and a haze value of 12.6%. Two protective films (KD23K manufactured by Sanei Kaken Co., Ltd.) were bonded together using a roller to produce a conductive film laminate according to Embodiment 1 of the present invention.

The 180 ° peel strength of the protective film was obtained by cutting a 14 × 2.5 cm test piece from the conductive film before sticking the protective film and sticking it on the adhesive surface of the 5 × 7 cm test piece of the protective film using a roller. In addition, the back side of the protective film was fixed to a peeling test apparatus (Shimadzu Corporation Autograph ADS-J) with a double-sided tape, and the measurement was performed by pulling the conductive film in the 180 ° direction at a speed of 300 mm / min.
Moreover, the haze value of the protective film was measured using a spectrophotometer (Konica Minolta CM-3600A) in a state where the separator laminated on the adhesive surface side was peeled off from the test piece of the protective film of 5 × 7 cm.

[Examples 2 to 8]
Except for changing the type of the first protective film and changing the thickness t1, 180 ° peeling force F1 and haze value of the first protective film as shown in Table 1, the same as in Example 1, A conductive film laminate was produced.

[Example 9]
By changing the types of the first protective film and the second protective film, the thickness t1, the 180 ° peeling force F1 and the haze value of the first protective film, and the thickness t2, 180 of the second protective film A conductive film laminate was produced in the same manner as in Example 1 except that the peel force F2 and the haze value were changed as shown in Table 1.
[Examples 10 and 11]
Except for changing the type of the first protective film and changing the thickness t1, 180 ° peeling force F1 and haze value of the first protective film as shown in Table 1, the same as in Example 1, A conductive film laminate was produced.

[Comparative Examples 1-4]
Except for changing the type of the first protective film and changing the thickness t1, 180 ° peeling force F1 and haze value of the first protective film as shown in Table 1, the same as in Example 1, A conductive film laminate was produced.

[Evaluation]
About the produced conductive film laminated body of the Example and the comparative example, the following peelability, optical characteristics, handling property, and visual observation aptitude were evaluated.

(Ease of peeling)
The first protective film side of the conductive film laminate was placed on the adsorption stage of a bonding machine (FRFU-R1 manufactured by FUK Co., Ltd.) and adsorbed at a specified pressure (100 kPa). Adhesive tape was applied to the corner of the surface of the second protective film, pulled in the 180 ° direction, and the second protective film was peeled off. In that case, the floating of the whole conductive film laminated body from the adsorption | suction stage, and the presence or absence of peeling in the interface of a conductive film and a 1st protective film were observed visually, and the following references | standards evaluated.
A: Floating from the adsorption stage and peeling of the first protective film did not occur at all.
B: Floating from the adsorption stage and / or peeling of the first protective film occurred slightly at a level without any actual harm.
C: Floating from the adsorption stage and / or peeling of the first protective film occurred at the actual harm level.

(optical properties)
After the conductive film laminate is left at 40 ° C. for 84 hours, the first protective film and the second protective film are peeled off, and the optical characteristics (L *, a *, b *) of the conductive film alone are measured. did. For the measurement, a spectrocolorimeter (Konica Minolta CM-3600A) was used. The measurement results were compared with the measurement results of the optical properties (L *, a *, b *) of the conductive film measured in advance, and evaluated according to the following criteria according to the amount of change.
A: Very small.
B: Small as long as there is no actual harm.
C: Changed within a certain range.

(Handling properties)
Cut the conductive film laminate into A4 size, peel off the second protective film, carry it by hand to the screen printer assuming the next process, and print the conductive film laminate peeled off the second protective film Installed in the machine. Next, assuming the pasting process, it was carried to the pasting machine by hand, and the conductive film laminate from which the second protective film was peeled was installed in the pasting machine. Thereafter, the conductive film was visually observed, and the presence or absence of wrinkles or nicks was evaluated according to the following criteria.
A: Wrinkles and nicks did not occur in this series of steps.
C: Wrinkles or nicks occurred.

(Applicability for visual observation)
A conductive film (400 mm × 500 mm) having a nick or wiring chip on the surface is selected, and a first protective film and a second protective film are bonded to both sides of the conductive film to produce a conductive film laminate. The conductive film laminate was visually observed from both sides and evaluated according to the following criteria.
A: Known nicks and wiring defects can be visually recognized.
B: Although not sufficient, it is visible.
C: Not visible.
The results are shown in Table 1.

  From Table 1, it turns out that Examples 1-11 of the conductive film laminated body of this invention have high peeling ease compared with Comparative Examples 1-3, and handling property is good. Therefore, generation of wrinkles and nicks and a decrease in yield can be suppressed. Moreover, since peeling force is appropriate compared with the comparative example 4, when peeling a protective film, it can suppress that an adhesive remains on a conductive film, and it turns out that an optical characteristic is favorable. Moreover, since the balance between peeling force and thickness is good, it can be seen that the handling property is excellent, and that wrinkles and nicks can be suppressed during handling.

Moreover, it turns out that it is preferable that the thickness of a 1st protective film is thicker than the thickness of a 2nd protective film from a viewpoint of peeling ease from the comparison with Example 8 and Example 9. FIG.
Moreover, from the comparison of Examples 2, 3, 6, 7, and 10, it can be seen that the 180 ° peeling force of the first protective film is more preferably 0.25 N / 25 mm or less from the viewpoint of optical characteristics.
Moreover, from the comparison of Examples 1 to 11 and Comparative Example 1, it is understood that the haze value of the protective film is preferably 15% or less from the viewpoint of visual observation suitability.
From the above results, when the insulating substrate is thinned, the effects of the present invention that the generation of wrinkles and nicks can be suppressed, the handling property is improved, the yield can be suppressed, and the optical characteristics can be suppressed from being decreased. ,it is obvious.

  Although the conductive film laminated body of said Examples 1-11 and Comparative Examples 1-4 was for A4 size, in the following Examples 12-14 and Comparative Examples 5 and 6, the thickness of a 3rd protective film The conductive film laminated body for cutting out so that the length of a diagonal line might be 29 inches by changing various values, such as a haze value of a 3rd protective film, was produced.

[Example 12]
The thickness of the insulating substrate is set to 100 μm, and a third protective film is provided on one side (first surface) side of the produced conductive film, and a fourth protective film is provided on the other side (second surface) side with a roller. A conductive film laminate was produced in the same manner as in Example 1 except that it was changed to be bonded.
[Examples 13 and 14]
A conductive film laminate was produced in the same manner as in Example 12 except that the thicknesses of the third protective film and the fourth protective film, 180 ° peeling force, and haze value were changed as shown in Table 2.
[Examples 15 and 16]
Except for changing the thickness of the insulating substrate to 38 μm and changing the thicknesses of the third protective film and the fourth protective film, the 180 ° peeling force and the haze value as shown in Table 2, the same manner as in Example 12 was performed. A conductive film laminate was produced.
[Comparative Examples 5 and 6]
A conductive film laminate was produced in the same manner as in Example 12 except that the thicknesses of the third protective film and the fourth protective film, 180 ° peeling force, and haze value were changed as shown in Table 2.
[Comparative Example 7]
Except for changing the thickness of the insulating substrate to 38 μm and changing the thicknesses of the third protective film and the fourth protective film, the 180 ° peeling force and the haze value as shown in Table 2, the same manner as in Example 12 was performed. A conductive film laminate was produced.

[Evaluation]
About the produced conductive film laminated body of the Example and the comparative example, the following peelability, optical characteristics, handling property, and visual observation aptitude were evaluated.

(Ease of peeling)
In the same manner as in Examples 1 to 11 and Comparative Examples 1 to 4, floating from the adsorption stage of the entire conductive film laminate, and the presence or absence of peeling at the interface between the conductive film and the first protective film were visually observed, evaluated.

(optical properties)
As in Examples 1 to 11 and Comparative Examples 1 to 4, the optical properties (L *, a *, b *) of the conductive film alone were measured and evaluated.

(Handling properties)
Except for cutting out the conductive film laminate so that the length of the diagonal line was 29 inches (73.7 cm), the conductive film was visually observed in the same manner as in Examples 1 to 11 and Comparative Examples 1 to 4, and wrinkles and The presence or absence of nicks was evaluated.

(Applicability for visual observation)
The conductive film laminated body was produced similarly to Examples 1-11 and Comparative Examples 1-4, and the conductive film laminated body was visually observed and evaluated from both surfaces.
The results are shown in Table 2.

  From Table 2, it turns out that Examples 12-16 of the electrically conductive film laminated body of this invention have high peeling ease compared with Comparative Examples 5-7, and handling property is good. Therefore, when the length of the diagonal line of the conductive film laminate is 29 inches, generation of wrinkles and nicks and a decrease in yield can be suppressed. Moreover, since the thickness of the 3rd protective film is 75 micrometers or more compared with Comparative Examples 5-7, since the balance of peeling force and thickness is good, the thickness of an insulated substrate is either 38 micrometers or 100 micrometers. Even if it exists, it turns out that it is excellent in handling property and can suppress that a wrinkle and a nick arise during handling.

Moreover, it turns out that the ease of peeling is high and handling property is good even if the thickness of the 3rd protective film is 75 micrometers or 125 micrometers from the contrast of Examples 12-16.
From the above results, when the area of the insulating substrate is increased, the generation of wrinkles and nicks can be suppressed, the handling property is improved, the yield can be suppressed, and the optical characteristics can be suppressed from decreasing. The effect is obvious.

DESCRIPTION OF SYMBOLS 10,10A Conductive film 11,11A Insulation board | substrate 12,12A 1st detection electrode 12a, 22a Metal fine wire 13 1st extraction | drawer wiring 14 1st wiring part 15 1st external connection terminal 16 1st connector part 22, 22A 2nd detection electrode 23 2nd extraction wiring 24 2nd wiring part 25 2nd external connection terminal 26 2nd connector part 50, 50A Conductive film laminated body 51 1st protective film 52, 52A 1st group Materials 53, 53A First adhesive layer 54 Second protective film 55, 55A Second base material 56, 56A Second adhesive layer 51A Third protective film 54A Fourth protective film S1 Sensing area S2 Peripheral area D1 First Direction D2 Second direction

Claims (17)

A conductive film having an insulating substrate having a thickness of less than 70 μm and a conductive layer formed on at least one surface of the insulating substrate;
A first protective film releasably attached to the first surface side of the conductive film;
A second protective film releasably attached to a second surface side that is the surface opposite to the first surface of the conductive film,
Each of the first protective film and the second protective film is peelable at the interface with the conductive film,
A thickness t1 of the first protective film is 75 μm or more;
The peeling force F1 at the time of 180 ° peeling of the first protective film with respect to the conductive film is larger than the peeling force F2 at the time of 180 ° peeling of the second protective film, and is 0.5 N / 25 mm or less. There is a conductive film laminate.   The conductive film laminate according to claim 1, wherein a thickness t1 of the first protective film is thicker than a thickness t2 of the second protective film.   The conductive film laminate according to claim 1, wherein the first protective film and the second protective film have a haze value of 15% or less.   The conductive film laminate according to claim 1, wherein the insulating substrate has a thickness of 50 μm or less.   The conductive film laminate according to any one of claims 1 to 4, wherein the first protective film and the second protective film have an adhesive layer.   The conductive film laminate according to any one of claims 1 to 5, wherein the insulating substrate is made of PET, COP, or COC.   The conductive film laminate according to claim 1, wherein the conductive layer is formed on both surfaces of the insulating substrate.   The conductive film laminate according to any one of claims 1 to 7, wherein the conductive layer has a mesh structure formed of a plurality of thin metal wires. A conductive film having an insulating substrate having a thickness of 70 μm or more and a diagonal length of 20 inches or more, and a conductive layer formed on at least one surface of the insulating substrate;
A third protective film removably attached to the third surface side of the conductive film;
A fourth protective film releasably attached to a fourth surface side that is a surface opposite to the third surface of the conductive film,
The third protective film and the fourth protective film are each peelable at the interface with the conductive film,
A thickness t3 of the third protective film is 75 μm or more;
The peeling force F3 at the time of 180 ° peeling of the third protective film with respect to the conductive film is larger than the peeling force F4 at the time of 180 ° peeling of the fourth protective film, and is 0.5 N / 25 mm or less. There is a conductive film laminate.   The conductive film laminate according to claim 9, wherein a thickness t3 of the third protective film is thicker than a thickness t4 of the fourth protective film.   The conductive film laminate according to claim 9 or 10, wherein the third protective film and the fourth protective film have a haze value of 15% or less.   The conductive film laminate according to claim 9, wherein the insulating substrate has a thickness of 90 μm or more.   The length of the diagonal of the said insulated substrate is 25 inches or more, The conductive film laminated body of any one of Claims 9-12.   The conductive film laminate according to any one of claims 9 to 13, wherein the third protective film and the fourth protective film have an adhesive layer.   The conductive film laminate according to claim 9, wherein the insulating substrate is made of PET, COP, or COC.   The conductive film laminate according to claim 9, wherein the conductive layer is formed on both surfaces of the insulating substrate.   The conductive film laminate according to any one of claims 9 to 16, wherein the conductive layer has a mesh structure formed of a plurality of fine metal wires.