JP6439315B2 - Roughened hardened body - Google Patents

Description

  The present invention relates to a roughened cured body. Furthermore, it is related with the laminated body, printed wiring board, and semiconductor device which used this roughening hardening body.

  As a manufacturing technique of a printed wiring board, a manufacturing method by a build-up method in which insulating layers and conductor layers (circuits) are alternately stacked is known. In the manufacturing method by the build-up method, the insulating layer is generally formed by curing a resin composition. Thereafter, the cured body of the resin composition is roughened to form a roughened cured body, and a conductor layer can be formed on the surface of the roughened cured body.

  In recent years, miniaturization of circuits has been promoted in the printed wiring board due to the trend of lightness, thinness, and smallness. Patent Document 1 discloses a technique for adjusting the surface roughness of a roughened and cured body using a special support in order to contribute to circuit miniaturization.

JP 2014-36051 A

  As an index representing the surface roughness of the roughened cured body, arithmetic average roughness (Ra), which is a parameter related to the height of the surface irregularities, is well known. In proceeding with the miniaturization of the circuit, it is necessary to reduce the surface roughness of the roughened cured body, and various efforts have been made to reduce the Ra on the surface of the roughened cured body.

  In the course of proceeding with the study of circuit miniaturization, the present inventors have found that when the surface roughness of the roughened cured body is somewhat low, the value of Ra does not necessarily correlate with the ability to form a fine circuit. It was. That is, it has been found that it is difficult to further refine the circuit by reducing Ra on the surface of the roughened cured body.

  This invention makes it a subject to provide the roughening hardening body which enables further refinement | miniaturization of a circuit.

  As a result of intensive studies on the above problems, the present inventors have found that the shape and spacing of the irregularities on the surface of the roughened cured body correlate with the ability to form a fine circuit. Based on such knowledge, the present inventors have found that further miniaturization of the circuit can be realized by introducing a specific uneven shape or a specific uneven space on the surface of the roughened cured body, thereby completing the present invention. It came to.

That is, the present invention includes the following contents.
[1] A roughened cured body obtained by roughening a cured body of a resin composition,
The arithmetic average roughness (Ra) of the surface of the roughened cured body is 500 nm or less,
When a roughened cured body with plating is formed by electroless plating on the surface of the roughened cured body, plating is performed in the cross section of the roughened cured body with plating in a direction perpendicular to the surface of the roughened cured body with plating. The length X of the plating region on the straight line L1 obtained by straightening the interface of the roughened hardened body by the least square method is parallel to the straight line L1 and 0 in the depth direction of the roughened hardened body from the straight line L1. A roughened cured body in which the length Y of the plating region on the straight line L2 that is 2 μm apart satisfies the condition of Y / X ≦ 1.
[2] When the length of the plating region on the straight line L3 that is parallel to the straight line L1 and is Z (μm) away from the straight line L1 in the depth direction of the roughened cured body is Y ′ / X The roughening hardening body as described in [1] whose minimum value of Z which satisfy | fills <= 0.05 is 3 or less.
[3] A roughened cured body obtained by roughening a cured body of the resin composition,
A roughened cured body having an average interval (Sm) of irregularities on the surface of the roughened cured body of 2000 nm or less.
[4] The roughened cured body according to any one of [1] to [3], wherein the surface of the roughened cured body has an arithmetic average roughness (Ra) of 200 nm or less.
[5] The cured product of the resin composition is
A first heat curing treatment for thermally cured at temperatures T ₁ of the resin composition,
Obtained by thermal curing treatment and a second heat curing treatment for thermally curing the first resin composition after heat curing treatment at a high temperature T ₂ than the temperature T _1, the [1] to [4] The roughening hardening body in any one.
[6] The roughened cured product according to [5], wherein the resin composition after the first thermosetting treatment has a minimum melt viscosity of 11000 poise to 300000 poise.
[7] The roughened cured body according to any one of [1] to [6], wherein the resin composition includes an inorganic filler having an average particle size of 0.01 μm to 0.3 μm.
[8] The roughened cured product according to any one of [1] to [7], wherein the resin composition includes one or more selected from the group consisting of a naphthol-based curing agent and an active ester-based curing agent.
[9] A laminate comprising the roughened cured body according to any one of [1] to [8] and a conductor layer formed on the surface of the roughened cured body.
[10] The laminate according to [9], wherein the conductor layer includes a circuit having a wiring pitch of 16 μm or less.
[11] A printed wiring board including an insulating layer formed of the roughened cured body according to any one of [1] to [8].
[12] A semiconductor device including the printed wiring board according to [11].

  ADVANTAGE OF THE INVENTION According to this invention, the roughening hardening body which enables further refinement | miniaturization of a circuit can be provided.

FIG. 1 is a schematic cross-sectional view of a roughened cured body with plating formed by electroless plating on a roughened cured body having a recess having a smaller opening diameter than the internal maximum diameter on the surface. FIG. 2 is a schematic cross-sectional view of a roughened cured body with plating formed by electroless plating on a roughened cured body having a recess having a larger opening diameter than the internal maximum diameter on the surface. FIG. 3 is a schematic cross-sectional view (1) showing a method for measuring the length of the plating region on the straight line L2. FIG. 4 is a schematic cross-sectional view (2) showing the method for measuring the length of the plating region on the straight line L2.

  Hereinafter, the present invention will be described in detail with reference to preferred embodiments thereof.

[Roughened hardened body]
The roughened cured body of the present invention is characterized by having fine concave portions on the surface whose opening diameter is equal to or larger than the internal maximum diameter. Here, the internal maximum diameter means the maximum diameter inside the recess.

  In the process of studying circuit miniaturization, when the surface roughness of the roughened cured body is somewhat low (for example, Ra is 500 nm or less), the inventors of the present invention have the value of Ra and the ability to form a fine circuit. And found not necessarily correlated. When the surface roughness of the roughened cured body was examined, when the surface roughness of the roughened cured body was somewhat low, a recess having an opening diameter smaller than the internal maximum diameter tends to be formed on the surface. I found. In such a roughened and cured body having a bowl-shaped concave portion that swells inside, the conductor in the concave portion is removed when the unnecessary portion (non-circuit forming portion) of the conductor layer is removed by etching during circuit formation. It is difficult to guess that when etching is performed under conditions that can sufficiently remove the conductor in the recess, the dissolution of the wiring pattern becomes noticeable and hinders the miniaturization of the circuit.

  On the other hand, the roughened cured body of the present invention has a somewhat low surface roughness (for example, Ra of 500 nm or less) and has a concave portion on the surface whose opening diameter is equal to or larger than the internal maximum diameter. . As a result, unnecessary portions of the conductor layer can be easily removed during circuit formation, and further miniaturization of the circuit can be achieved.

  In the present invention, the surface roughness of the roughened cured body (specifically, the shape of the concave portion) is the plating when the roughened cured body with plating is formed by electroless plating on the surface of the roughened cured body. The distribution of the plating region in the vicinity of the interface between the roughened and hardened body can be expressed as an index.

  Specifically, in the cross section of the roughened cured body with plating in the direction perpendicular to the surface of the roughened cured body with plating, on the straight line L1 obtained by linearizing the interface between the plating and the roughened cured body with the least square method The ratio between the length X of the plating region in the region and the length Y of the plating region on the straight line L2 that is parallel to the straight line L1 and is 0.2 μm away from the straight line L1 in the depth direction of the roughened cured body ( Y / X) can be obtained and the value of the ratio Y / X obtained can be used as an index.

  FIG. 1 is a schematic cross-sectional view of a roughened cured body with plating formed by electroless plating on a roughened cured body having a recess having a smaller opening diameter than the internal maximum diameter on the surface. The roughened cured body with plating shown in FIG. 1 is formed by roughening and curing body 1 having a recess having a smaller opening diameter than the internal maximum diameter on the surface, and electroless plating on the surface of the roughened cured body. Plating 20. The length X of the plating region on the straight line L1 obtained by linearizing the interface between the plating and the roughened cured body by the least square method is, for example, the description in FIG. 1 in which three concave portions are formed on the surface of the roughened hardened body. In the roughening cured body with plating, the lengths x1, x2 and x3 of the plating regions derived from the three concave portions can be added together. Actually, a large number of recesses are formed on the surface of the roughened cured body, and the length X is obtained by adding the lengths of the plating regions derived from these recesses. The same applies to the length Y of the plating region on the straight line L2. In the roughened cured body with plating described in FIG. 1, all the recesses have an opening diameter smaller than the internal maximum diameter, and the lengths x1, x2, and x3 of the plating region on the straight line L1 are: Each of the plating regions on the straight line L2 is shorter than the lengths y1, y2, and y3. Not only in this aspect, but when the ratio (Y / X) between the length X and the length Y obtained by the above procedure exceeds 1, it is equal to or larger than the internal maximum diameter. Even if a recess having an opening diameter is partially formed, it is still unsuitable in terms of the ability to form a fine circuit. When the ratio Y / X exceeds 1, a recess having an opening diameter smaller than the internal maximum diameter is formed at least in part, resulting in poor local microcircuit formation ability. is there.

  FIG. 2 is a schematic cross-sectional view of a roughened cured body with plating formed by electroless plating on a roughened cured body having a recess having a larger opening diameter than the internal maximum diameter on the surface. The roughened cured body with plating shown in FIG. 2 is formed by electroless plating on the surface of the roughened cured body 10 having a recess having a larger opening diameter than the internal maximum diameter on the surface, and the surface of the roughened cured body. Plating 20. The procedure for obtaining the length X of the plating region on the straight line L1 and the length Y of the plating region on the straight line L2 is the same as described above. In the roughened cured body with plating described in FIG. 2, all the recesses have an opening diameter larger than the internal maximum diameter, and the lengths x1, x2, and x3 of the plating region on the straight line L1 are: Each of the plating regions on the straight line L2 is longer than the lengths y1, y2, and y3. Such an embodiment is ideal for realizing excellent fine circuit forming ability, but the present inventors can obtain good fine circuit forming ability when the ratio Y / X is 1 or less. I have confirmed that.

  Therefore, in one embodiment, the present invention is a roughened cured body obtained by roughening a cured body of a resin composition, and the arithmetic average roughness (Ra) of the surface of the roughened cured body is 500 nm or less. In the cross section of the roughened cured body with plating in a direction perpendicular to the surface of the roughened cured body with plating, when the roughened cured body with plating is formed by electroless plating on the surface of the roughened cured body. The length X of the plating region on the straight line L1 obtained by linearizing the interface between the plating and the roughened hardened body by the least square method, and the depth of the roughened hardened body from the straight line L1 is parallel to the straight line L1. The present invention relates to a roughened cured body in which the length Y of the plating region on the straight line L2 that is 0.2 μm apart in the direction satisfies the condition of Y / X ≦ 1.

  From the viewpoint of achieving further circuit miniaturization, the ratio Y / X is 1 or less, preferably 0.98 or less, more preferably 0.96 or less, even more preferably 0.94 or less, and even more preferably 0. .92 or less, particularly preferably 0.9 or less, 0.88 or less, 0.86 or less, 0.84 or less, 0.82 or less, 0.8 or less, 0.78 or less, 0.76 or less, or 0. 74 or less. The lower limit of the ratio Y / X is not particularly limited and is preferably low, but can usually be 0.2 or more, 0.3 or more, or the like.

  The cross section of the roughened cured body with plating can be suitably observed using a FIB-SEM composite apparatus. An example of the FIB-SEM composite device is “SMI3050SE” manufactured by SII Nanotechnology. After cutting out the cross section of the roughened cured body with plating in a direction perpendicular to the surface of the roughened cured body with plating by FIB (focused ion beam), the cross section was observed with a scanning electron microscope (SEM) and plated. And a cross-sectional SEM image in the vicinity of the interface between the roughened and hardened body. The observation width and observation magnification by SEM are not particularly limited as long as the uneven shape on the surface of the roughened cured body can be properly grasped, and may be determined according to the specifications of the apparatus to be used.

  When the straight line L1 is obtained by linearizing the interface between the plating and the roughened cured body by the least square method, the interface between the plating and the roughened cured body is obtained with reference to the convex portion of the roughened cured body in the obtained cross-sectional SEM image. What is necessary is just to linearize by the least squares method. Thereby, the approximate straight line L1 can be provided in the opening surface of a recessed part. Hereinafter, a method of calculating the ratio Y / X will be described with the plating side in the cross-sectional SEM image as the upper side and the roughened cured body side as the lower side.

  The acquired cross-sectional SEM image is equally divided into sections of a predetermined width, and the position of the roughened and hardened body existing on the uppermost side in each section is adopted as a reference point. For example, a cross-sectional SEM image having an observation width W (μm) can be equally divided into n sections having a predetermined width W / n (μm), and n reference points can be obtained. W and n may be set as described in <Evaluation of unevenness on roughened cured body surface> described later. Although details will be described later, the roughened cured body is obtained by roughening a cured body of a resin composition containing an inorganic filler and a resin component. Therefore, “the position of the roughened cured body present on the uppermost side” refers to the position of the resin component when the resin component is present on the uppermost side, and the inorganic filler when the inorganic filler is present on the uppermost side. The position of the material. The obtained n reference points are subjected to coordinate transformation, and an approximate straight line based on the n reference points, that is, a straight line L1 is obtained by the least square method.

  The straight line L2 can be obtained by drawing a straight line parallel to the straight line L1 0.2 μm below the straight line L1.

  The procedure for obtaining the length X and Y of the plating area is as described above. By obtaining a sufficient number of cross-sectional SEM images, it is possible to obtain overall characteristics of the uneven shape on the surface of the roughened cured body. When a plurality of cross-sectional SEM images are acquired, the length X can be obtained by adding the lengths of the plating regions on the straight line L1 for all the cross-sectional SEM images. The same applies to the length Y and Y ′ described later.

  In the present invention, when an inorganic filler exists on the straight line L1, the inorganic filler region is handled as follows in calculating the length X. When at least a part of the inorganic filler is in contact with the resin component, the inorganic filler region is treated as a roughened cured body region. On the other hand, when the inorganic filler is not in contact with the resin component and is covered with electroless plating, the inorganic filler region is treated as a plating region. The same applies to the case where an inorganic filler is present on the straight line L2. For example, in the roughened cured body with plating whose schematic cross-sectional view is shown in FIG. 3, the inorganic filler 12 partially in contact with the resin component 11 exists on the straight line L2. In this case, the inorganic filler region is treated as a roughened cured body region, and the length of the inorganic filler region is not included in the length y of the plating region. On the other hand, in the roughened cured body with plating whose schematic cross-sectional view is shown in FIG. 4, the inorganic filler 12 that is not in contact with the resin component 11 and is covered with electroless plating is present on the straight line L2. In this case, the inorganic filler region is treated as a plating region, and the length of the inorganic filler region is included in the length y of the plating region. This is because when the inorganic filler is covered with electroless plating, it is highly likely to be removed together with the electroless plating when an unnecessary conductor layer is removed during circuit formation.

  From the viewpoint of achieving further miniaturization of the circuit, the depth of the recess formed on the surface of the roughened cured body is preferably not more than a predetermined value. In one embodiment, when Y ′ is the length of the plating region on the straight line L3 that is parallel to the straight line L1 and is Z (μm) away from the straight line L1 in the depth direction of the roughened cured body, Y ′ The minimum value of Z satisfying /X≦0.05 is preferably 3 or less, more preferably 2.8 or less, further preferably 2.6 or less, and 2.4 or less. It is even more preferable that it is 2.2 or less, 2 or less, 1.8 or less, 1.6 or less, 1.4 or less, 1.2 or less, or 1 or less. The lower limit of the minimum value of Z is not particularly limited, but can usually be more than 0.2, 0.3 or more, 0.4 or more, 0.6 or more, or the like.

  From the viewpoint of achieving further miniaturization of the circuit, the length of the plating region on the straight line L3 that is parallel to the straight line L1 and that is Z (μm) away from the straight line L1 in the depth direction of the roughened cured body is represented by Y ′. In this case, the minimum value of Z at which Y ′ becomes 0 is preferably 3 or less, more preferably 2.8 or less, further preferably 2.6 or less, and 2.4 or less. It is even more preferable that it is 2.2 or less, 2 or less, 1.8 or less, 1.6 or less, 1.4 or less, 1.2 or less, or 1 or less. The lower limit of the minimum value of Z is not particularly limited, but can usually be more than 0.2, 0.3 or more, 0.4 or more, 0.6 or more, or the like.

  As long as the ratio Y / X is 1 or less, the arithmetic average roughness (Ra) of the roughened cured body surface is preferably lower from the viewpoint of further miniaturization of the circuit. Ra of the surface of the roughened cured body is preferably 400 nm or less, more preferably 350 nm or less, still more preferably 300 nm or less, still more preferably 250 nm or less, particularly preferably 240 nm or less, 220 nm or less, 200 nm or less, 180 nm or less, 160 nm or less. Or 150 nm or less. The lower limit of Ra is not particularly limited, but can usually be 10 nm or more, 20 nm or more, 30 nm or more, and the like. The arithmetic average roughness (Ra) of the surface of the roughened cured body can be measured using a non-contact type surface roughness meter. As a non-contact type surface roughness meter, for example, “WYKO NT3300” manufactured by Becoins Instruments is cited.

  The present inventors have also found that the uneven shape on the surface of the roughened cured body (specifically, the shape of the concave portion) correlates well with the average interval (Sm) of the unevenness on the surface of the roughened cured body. Specifically, for a roughened cured body having a recess having a smaller opening diameter than the internal maximum diameter as shown in FIG. 1, the value of Sm is large, and the opening diameter is larger than the internal maximum diameter as shown in FIG. It has been found that the roughened cured body having a large concave portion on the surface has a small value of Sm. The inventors have confirmed that the roughened cured product having the ratio Y / X of 1 or less tends to have a value of Sm of 2000 nm or less.

  Therefore, in one embodiment, the present invention is a roughened cured body obtained by roughening a cured body of a resin composition, and the average interval (Sm) of the unevenness on the surface of the roughened cured body is 2000 nm or less. It relates to a roughened cured body.

  From the viewpoint of achieving further miniaturization of the circuit, the average interval (Sm) of the unevenness on the surface of the roughened cured body is 2000 nm or less, preferably 1950 nm or less, more preferably 1900 nm or less, still more preferably 1850 nm or less, and even more. It is preferably 1800 nm or less, particularly preferably 1750 nm or less, or 1700 nm or less. Although the minimum of this Sm is not specifically limited, Usually, it can be 500 nm or more, 700 nm or more, etc. The average interval (Sm) of the unevenness on the surface of the roughened cured body can be measured using a non-contact type surface roughness meter, similarly to Ra. The average interval (Sm) of the surface unevenness refers to the average interval between profile peaks of the surface unevenness profile. The profile peak means the highest peak between a point that crosses the average line of the uneven profile upward and a point that crosses downward. Sm is a standard parameter defined by ISO 4287 and JIS B 0601.

  Also in such embodiment, the suitable range of arithmetic mean roughness (Ra) of the roughening hardening body surface is as above-mentioned.

  The thickness of the roughened cured body of the present invention is preferably 3 μm or more, more preferably 5 μm or more, still more preferably 10 μm or more, 15 μm or more, or 20 μm or more from the viewpoint of obtaining good insulation. The thickness of the roughened cured body of the present invention is preferably 100 μm or less, more preferably 90 μm or less, still more preferably 80 μm or less, 70 μm or less, or 60 μm or less, from the viewpoint of thinning the printed wiring board.

  The roughened cured body of the present invention may have a multilayer structure composed of two or more layers. In the case of a roughened cured body having a multilayer structure, the overall thickness is preferably in the above range.

  Hereinafter, the resin composition used in order to form the roughening hardening body of this invention is demonstrated.

<Resin composition>
The resin composition used for forming the roughened cured body of the present invention has the above-mentioned roughened cured body obtained by roughening the cured body while the cured body has sufficient hardness and insulation. It does not specifically limit as long as desired uneven | corrugated shape and an uneven | corrugated space | interval are satisfy | filled. For example, as a resin composition, the resin composition containing a thermosetting resin and a hardening | curing agent is mentioned. As a thermosetting resin, the conventionally well-known thermosetting resin used when forming the insulating layer of a printed wiring board can be used, and an epoxy resin is especially preferable. Accordingly, in one embodiment, the resin composition includes an epoxy resin and a curing agent. The resin composition may further contain additives such as an inorganic filler, a thermoplastic resin, a curing accelerator, a flame retardant, and an organic filler as necessary. In the present invention, the “resin component” refers to a component other than the inorganic filler among the components constituting the resin composition.

-Epoxy resin-
Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolak type epoxy resin, Phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type Epoxy resin, linear aliphatic epoxy resin, epoxy resin having butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing ester Carboxymethyl resins, cyclohexanedimethanol type epoxy resins, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenyl ethane epoxy resin and the like. An epoxy resin may be used individually by 1 type, and may be used in combination of 2 or more type.

  The epoxy resin preferably contains an epoxy resin having two or more epoxy groups in one molecule. When the nonvolatile component of the epoxy resin is 100% by mass, at least 50% by mass is preferably an epoxy resin having two or more epoxy groups in one molecule. Among them, the resin composition is a solid epoxy resin (also referred to as “solid epoxy resin”) alone at a temperature of 20 ° C., or a solid epoxy resin and an epoxy resin that is liquid at a temperature of 20 ° C. And a liquid epoxy resin ”). The solid epoxy resin is preferably a solid epoxy resin having 3 or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having 3 or more epoxy groups in one molecule. The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule, and more preferably an aromatic liquid epoxy resin having two or more epoxy groups in one molecule. In the present invention, the aromatic epoxy resin means an epoxy resin having an aromatic ring in the molecule.

  The liquid epoxy resin has a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a naphthalene type epoxy resin, a glycidyl ester type epoxy resin, a phenol novolac type epoxy resin, an alicyclic epoxy resin having an ester skeleton, and a butadiene structure. Epoxy resins are preferable, and bisphenol A type epoxy resins, bisphenol F type epoxy resins, and naphthalene type epoxy resins are more preferable. Specific examples of the liquid epoxy resin include “HP4032”, “HP4032H”, “HP4032D”, “HP4032SS” (naphthalene type epoxy resin) manufactured by DIC Corporation, “jER828US”, “jER828EL” manufactured by Mitsubishi Chemical Corporation. (Bisphenol A type epoxy resin), "jER807" (bisphenol F type epoxy resin), "jER152" (phenol novolac type epoxy resin), "ZX1059" (bisphenol A type epoxy resin and bisphenol manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) F-type epoxy resin mixture), “EX-721” (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX Corporation, “Celoxide 2021P” (manufactured by Daicel Corporation) (alicyclic epoxy resin having an ester skeleton) ), "PB-3600" Epoxy resin) having an butadiene structure. These may be used alone or in combination of two or more.

  Solid epoxy resins include naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, Anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, tetraphenylethane type epoxy resin are preferable, naphthalene type tetrafunctional epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, And bisphenol AF type epoxy resin is more preferable. Specific examples of the solid epoxy resin include “HP-4700”, “HP-4710” (naphthalene type tetrafunctional epoxy resin), “N-690”, “N-695” (cresol novolak) manufactured by DIC Corporation. Type epoxy resin), “HP7200”, “HP7200H”, “HP7200HH” (dicyclopentadiene type epoxy resin), “EXA7311”, “EXA7311-G3”, “EXA7311-G4”, “EXA7311-G4S”, “HP6000” (Naphthylene ether type epoxy resin), “EPPN-502H” (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., “NC7000L” (naphthol novolak type epoxy resin), “NC3000H”, “NC3000”, “ NC3000L ”,“ NC3100 ”(Bifeni Type epoxy resin), “ESN475V” (naphthol type epoxy resin) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., “ESN485” (naphthol novolac type epoxy resin), “YX4000H”, “YL6121” (biphenyl) manufactured by Mitsubishi Chemical Corporation Type epoxy resin), “YX4000HK” (bixylenol type epoxy resin), “YX8800” (anthracene type epoxy resin), “PG-100”, “CG-500” manufactured by Osaka Gas Chemical Co., Ltd., Mitsubishi Chemical Corporation ) "YL7800" (fluorene type epoxy resin), Mitsubishi Chemical Corporation "jER1010" (solid bisphenol A type epoxy resin), "YL7760" (bisphenol AF type epoxy resin), "jER1031S" (tetraphenyl) Ethane type epoxy resin).

  When the liquid epoxy resin and the solid epoxy resin are used in combination as the epoxy resin, the quantitative ratio thereof (liquid epoxy resin: solid epoxy resin) is in the range of 1: 0.1 to 1: 8 in terms of mass ratio. preferable. By setting the amount ratio of the liquid epoxy resin and the solid epoxy resin within such a range, i) moderate tackiness is obtained when used in the form of an adhesive film described later, and ii) used in the form of an adhesive film. In this case, sufficient flexibility is obtained and handling properties are improved, and iii) a cured product having sufficient breaking strength can be obtained. The mass ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin: solid epoxy resin) is more preferably in the range of 1: 0.3 to 1: 7, and 1: 0.6 to 1: The range of 6 is more preferable, and the range of 1: 0.8 to 1: 5 is particularly preferable.

  The epoxy equivalent of the epoxy resin is preferably 50 to 5000, more preferably 50 to 3000, still more preferably 80 to 2000, and even more preferably 110 to 1000. The epoxy equivalent can be measured according to JIS K7236, and is the mass of a resin containing 1 equivalent of an epoxy group.

  The weight average molecular weight of an epoxy resin becomes like this. Preferably it is 100-5000, More preferably, it is 250-3000, More preferably, it is 400-1500. Here, the weight average molecular weight of the epoxy resin is a weight average molecular weight in terms of polystyrene measured by a gel permeation chromatography (GPC) method.

  The content of the epoxy resin in the resin composition is preferably 3% by mass to 40% by mass, more preferably 5% by mass to 35% by mass, and still more preferably 10% by mass to 30% by mass.

  In addition, in this invention, content of each component in a resin composition is a value when the non-volatile component in a resin composition is 100 mass% unless there is separate description.

-Curing agent-
The curing agent is not particularly limited as long as it has a function of curing the epoxy resin. For example, a phenolic curing agent, a naphthol curing agent, an active ester curing agent, a benzoxazine curing agent, a cyanate ester curing agent, and A carbodiimide type hardening | curing agent is mentioned. A hardening | curing agent may be used individually by 1 type, and may be used in combination of 2 or more type.

  As the phenol-based curing agent and the naphthol-based curing agent, a phenol-based curing agent having a novolak structure or a naphthol-based curing agent having a novolak structure is preferable from the viewpoint of heat resistance and water resistance. Further, from the viewpoint of adhesion strength (peel strength) with the conductor layer, a nitrogen-containing phenol-based curing agent or a nitrogen-containing naphthol-based curing agent is preferable, and a triazine skeleton-containing phenol-based curing agent or a triazine skeleton-containing naphthol-based curing agent is more preferable. . From the viewpoint of highly satisfying heat resistance, water resistance, and adhesion strength with the conductor layer, a triazine skeleton-containing phenol novolac-based curing agent and a triazine skeleton-containing naphthol novolak-based curing agent are preferable. Specific examples of the phenol-based curing agent and the naphthol-based curing agent include, for example, “MEH-7700”, “MEH-7810”, “MEH-7785” manufactured by Meiwa Kasei Co., Ltd., and Nippon Kayaku Co., Ltd. “NHN”, “CBN”, “GPH”, “SN-170”, “SN-180”, “SN-190”, “SN-475”, “SN-485” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. "SN-495", "SN-375", "SN-395", "LA-7052," "LA-7054," "LA-3018," "LA-1356," "TD2090" manufactured by DIC Corporation Or the like.

  From the viewpoint of obtaining a roughened cured product having excellent heat resistance, an active ester curing agent is also preferable. Although there is no restriction | limiting in particular as an active ester type hardening | curing agent, Generally ester groups with high reaction activity, such as phenol ester, thiophenol ester, N-hydroxyamine ester, ester of heterocyclic hydroxy compound, are in 1 molecule. A compound having two or more in the above is preferably used. The active ester curing agent is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m- Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, Benzenetriol, dicyclopentadiene type diphenol compound, phenol novolac and the like can be mentioned. Here, the “dicyclopentadiene type diphenol compound” refers to a diphenol compound obtained by condensing two molecules of phenol with one molecule of dicyclopentadiene.

  Specifically, an active ester compound containing a dicyclopentadiene-type diphenol structure, an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of a phenol novolac, and an active ester compound containing a benzoylated product of a phenol novolac are preferred, Of these, active ester compounds having a naphthalene structure and active ester compounds having a dicyclopentadiene type diphenol structure are more preferred. The “dicyclopentadiene type diphenol structure” represents a divalent structural unit composed of phenylene-dicyclopentalene-phenylene.

  As a commercial product of an active ester type curing agent, as an active ester compound containing a dicyclopentadiene type diphenol structure, “EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000-65T” (manufactured by DIC Corporation) ), “EXB9416-70BK” (manufactured by DIC Corporation) as an active ester compound containing a naphthalene structure, “DC808” (manufactured by Mitsubishi Chemical Corporation) as an active ester compound containing an acetylated product of phenol novolac, and benzoyl of phenol novolac Examples of the active ester compound containing a compound include “YLH1026” (manufactured by Mitsubishi Chemical Corporation).

  Specific examples of the benzoxazine-based curing agent include “HFB2006M” manufactured by Showa Polymer Co., Ltd., “Pd” and “Fa” manufactured by Shikoku Kasei Kogyo Co., Ltd.

  Examples of the cyanate ester curing agent include bisphenol A dicyanate, polyphenol cyanate (oligo (3-methylene-1,5-phenylene cyanate)), 4,4′-methylene bis (2,6-dimethylphenyl cyanate), 4, 4'-ethylidenediphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,1-bis (4-cyanatephenylmethane), bis (4-cyanate-3,5- Bifunctional cyanate resins such as dimethylphenyl) methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)) benzene, bis (4-cyanatephenyl) thioether, and bis (4-cyanatephenyl) ether; Phenol novolac and Polyfunctional cyanate resin derived from resol novolac, these cyanate resins and partially triazine of prepolymer. Specific examples of the cyanate ester curing agent include “PT30” and “PT60” (both phenol novolak polyfunctional cyanate ester resins) and “BA230” (part or all of bisphenol A dicyanate) manufactured by Lonza Japan Co., Ltd. And the like, and the like, and the like.

  Specific examples of the carbodiimide curing agent include “V-03” and “V-07” manufactured by Nisshinbo Chemical Co., Ltd.

  Among these, a naphthol type hardening | curing agent and an active ester type hardening | curing agent bring about the hardening body which shows high tolerance with respect to a roughening process, and bring about the roughening hardening body with low surface roughness. On the other hand, the naphthol-based curing agent and the active ester-based curing agent are a roughened cured body having a recess having a smaller opening diameter than the internal maximum diameter on the surface, that is, a roughened cured body in which the ratio Y / X exceeds 1. The present inventors have found that it is easy to end up with. Although it is possible to reduce the ratio Y / X somewhat by keeping the amount of naphthol-based curing agent and active ester-based curing agent low, the ratio Y / X is determined using only these amounts as parameters. There is a limit to the adjustment, and there is concern about an increase in Ra. Although details will be described later, in the present invention, the value of the ratio Y / X is desired by adjusting the curing condition of the resin composition and adjusting the phase separation size and the degree of cross-linking degree of the cured product. It has come to be able to be adjusted within the range. Naphthol-based curing agents and active ester-based curing agents exhibit inherently excellent curing properties, such as providing a roughened cured body with low surface roughness. Therefore, in one Embodiment which can enjoy the effect of this invention more, the resin composition contains 1 or more types selected from the group which consists of a naphthol type hardening | curing agent and an active ester type hardening | curing agent.

  The total content of the naphthol-based curing agent and the active ester-based curing agent in the curing agent is preferably 20% by mass or more, more preferably 30% by mass or more, and more preferably 30% by mass or more, when the nonvolatile component in the curing agent is 100% by mass. Preferably it is 40 mass% or more. The upper limit of the total content is preferably less than 80% by mass, more preferably 75% by mass or less, or 70% by mass or less.

  The amount ratio of the epoxy resin and the curing agent is preferably a ratio of [total number of epoxy groups of the epoxy resin]: [total number of reactive groups of the curing agent] in the range of 1: 0.2 to 1: 2. 1: 0.3-1: 1.5 are more preferable, and 1: 0.4-1: 1.2 are still more preferable. Here, the reactive group of the curing agent is an active hydroxyl group, an active ester group or the like, and varies depending on the type of the curing agent. Moreover, the total number of epoxy groups of the epoxy resin is a value obtained by dividing the value obtained by dividing the solid mass of each epoxy resin by the epoxy equivalent for all epoxy resins, and the total number of reactive groups of the curing agent is: The value obtained by dividing the solid mass of each curing agent by the reactive group equivalent is the total value for all curing agents.

-Inorganic filler-
The resin composition may include an inorganic filler. By including the inorganic filler, the coefficient of thermal expansion of the resulting roughened cured body can be kept low.

  The material of the inorganic filler is not particularly limited. For example, silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, water Aluminum oxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide , Zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate, and silica is particularly suitable. That. Examples of the silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. As silica, spherical silica is preferable. An inorganic filler may be used individually by 1 type, and may be used in combination of 2 or more type. Examples of commercially available spherical fused silica include “SO-C2” and “SO-C1” manufactured by Admatechs.

  The average particle size of the inorganic filler is preferably 3 μm or less, more preferably 2 μm or less, still more preferably 1 μm or less, and even more preferably 0, from the viewpoint of obtaining a roughened cured body having the above-described desired uneven shape and unevenness interval. 0.7 μm or less, particularly preferably 0.5 μm or less, 0.4 μm or less, or 0.3 μm or less. On the other hand, from the viewpoint of obtaining a resin varnish having an appropriate viscosity and good handleability when forming the resin varnish, the average particle size of the inorganic filler is preferably 0.01 μm or more, more preferably 0.03 μm or more. More preferably, it is 0.05 μm or more, 0.07 μm or more, or 0.1 μm or more. When using an inorganic filler with a small average particle size, the phase separation size of the resulting cured product can be kept small, which is advantageous in achieving a roughened cured product having the desired uneven shape and uneven spacing. The present inventors have confirmed. In a particularly preferred embodiment, the resin composition includes an inorganic filler having an average particle size of 0.01 μm to 0.3 μm. The average particle diameter of the inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be created on a volume basis by a laser diffraction particle size distribution measuring device, and the median diameter can be measured as the average particle diameter. As the measurement sample, an inorganic filler dispersed in water by ultrasonic waves can be preferably used. As the laser diffraction type particle size distribution measuring device, “LA-500”, “LA-750”, “LA-950”, etc. manufactured by Horiba, Ltd. can be used.

  Inorganic fillers are aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, organosilazane compounds, titanate coupling agents from the viewpoint of improving moisture resistance and dispersibility. It is preferable that it is processed with 1 or more types of surface treating agents. Examples of commercially available surface treatment agents include “KBM403” (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., and “KBM803” (3-mercaptopropyltrimethoxy manufactured by Shin-Etsu Chemical Co., Ltd.). Silane), Shin-Etsu Chemical "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical "SZ-31" (Hexamethyldisilazane) manufactured by Co., Ltd.

The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. The amount of carbon per unit surface area of the inorganic filler is a roughened cured body having the above desired concavo-convex shape and concavo-convex spacing while suppressing the phase separation size of the cured body obtained from the viewpoint of improving the dispersibility of the inorganic filler. from the viewpoint of obtaining, preferably 0.02 mg / ^{m 2} or more, 0.1 mg / ^{m 2} or more preferably, 0.2 mg / ^{m 2} or more is more preferable. On the other hand, from the viewpoint of preventing an excessive increase in melt viscosity at the melt viscosity or film form of the resin varnish is preferably 1 mg / ^{m 2} or less, more preferably 0.8 mg / ^{m 2} or less, 0.5 mg / ^{m 2} or less Is more preferable.

  The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with the surface treatment agent and ultrasonically cleaned at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid, the carbon amount per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, “EMIA-320V” manufactured by Horiba, Ltd. can be used.

  From the viewpoint of obtaining a roughened cured product having a low coefficient of thermal expansion, the content of the inorganic filler in the resin composition is preferably 40% by mass or more, more preferably 45% by mass or more, still more preferably 50% by mass or more, It is 55 mass% or more, 60 mass% or more, 65 mass% or more, or 70 mass% or more. The upper limit of the content of the inorganic filler in the resin composition is preferably 90% by mass or less, more preferably 85% by mass or less, and still more preferably 80% by mass or less, from the viewpoint of mechanical strength of the obtained roughened cured product. It is.

-Thermoplastic resin-
Examples of the thermoplastic resin include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, and polyether. Examples include ether ketone resins and polyester resins. A thermoplastic resin may be used individually by 1 type, or may be used in combination of 2 or more type.

  The weight average molecular weight in terms of polystyrene of the thermoplastic resin is preferably in the range of 8,000 to 70,000, more preferably in the range of 10,000 to 60,000, and still more preferably in the range of 20,000 to 60,000. The weight average molecular weight in terms of polystyrene of the thermoplastic resin is measured by a gel permeation chromatography (GPC) method. Specifically, the polystyrene-reduced weight average molecular weight of the thermoplastic resin is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P / K- manufactured by Showa Denko KK as a column. 804L / K-804L can be measured at a column temperature of 40 ° C. using chloroform or the like as a mobile phase, and can be calculated using a standard polystyrene calibration curve.

  Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene Examples thereof include phenoxy resins having a skeleton and one or more skeletons selected from the group consisting of a trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. A phenoxy resin may be used individually by 1 type, and may be used in combination of 2 or more type. Specific examples of the phenoxy resin include “1256” and “4250” (both bisphenol A skeleton-containing phenoxy resin), “YX8100” (bisphenol S skeleton-containing phenoxy resin), and “YX6954” (manufactured by Mitsubishi Chemical Corporation). In addition, “FX280” and “FX293” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., “YX7553”, “YL6794”, “YL7213” manufactured by Mitsubishi Chemical Corporation, “YL7290”, “YL7482” and the like can be mentioned.

  Examples of the polyvinyl acetal resin include a polyvinyl formal resin and a polyvinyl butyral resin, and a polyvinyl butyral resin is preferable. Specific examples of the polyvinyl acetal resin include, for example, “Electrical butyral 4000-2”, “Electrical butyral 5000-A”, “Electrical butyral 6000-C”, and “Electrical butyral 6000-EP” manufactured by Denki Kagaku Kogyo Co., Ltd. Sekisui Chemical Co., Ltd.'s S-REC BH series, BX series, KS series, BL series, BM series and the like.

  Specific examples of the polyimide resin include “Rika Coat SN20” and “Rika Coat PN20” manufactured by Shin Nippon Rika Co., Ltd. Specific examples of the polyimide resin include linear polyimide obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride (described in JP-A-2006-37083), a polysiloxane skeleton. Examples thereof include modified polyimides such as containing polyimide (described in JP-A No. 2002-12667 and JP-A No. 2000-319386).

  Specific examples of the polyamide-imide resin include “Bilomax HR11NN” and “Bilomax HR16NN” manufactured by Toyobo Co., Ltd. Specific examples of the polyamideimide resin also include modified polyamideimides such as polysiloxane skeleton-containing polyamideimides “KS9100” and “KS9300” manufactured by Hitachi Chemical Co., Ltd.

  Specific examples of the polyethersulfone resin include “PES5003P” manufactured by Sumitomo Chemical Co., Ltd.

  Specific examples of the polysulfone resin include polysulfone “P1700” and “P3500” manufactured by Solvay Advanced Polymers Co., Ltd.

  The content of the thermoplastic resin in the resin composition is preferably 0.1% by mass to 20% by mass, more preferably 0.5% by mass to 10% by mass, and further preferably 1% by mass to 5% by mass. .

-Curing accelerator-
The resin composition layer may contain a curing accelerator.

  Examples of the curing accelerator include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators. Of these, amine-based curing accelerators and imidazole-based curing accelerators are preferable. A hardening accelerator may be used individually by 1 type, and may be used in combination of 2 or more type. Although content of the hardening accelerator in a resin composition is not specifically limited, Preferably it is 0.005 mass%-1 mass%, More preferably, it is 0.01 mass%-0.5 mass%.

-Flame retardant-
Examples of the flame retardant include an organic phosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicone flame retardant, and a metal hydroxide. A flame retardant may be used individually by 1 type, or may be used in combination of 2 or more type. Although content of the flame retardant in a resin composition is not specifically limited, Preferably it is 0.5 mass%-10 mass%, More preferably, it is 1 mass%-9 mass%.

-Organic filler-
As the organic filler, any organic filler that can be used in the production of a printed wiring board may be used, and examples thereof include rubber particles, polyamide fine particles, and silicone particles, and rubber particles are preferable.

  The rubber particle is not particularly limited as long as it is a fine particle of a resin that has been subjected to a chemical crosslinking treatment on a resin exhibiting rubber elasticity and is insoluble and infusible in an organic solvent. For example, acrylonitrile butadiene rubber particles, butadiene rubber particles, Examples include acrylic rubber particles. Specific examples of the rubber particles include XER-91 (manufactured by Nippon Synthetic Rubber Co., Ltd.), Staphyloid AC3355, AC3816, AC3816N, AC3832, AC4030, AC3364, IM101 (above, manufactured by Aika Industry Co., Ltd.), paraloid. EXL2655, EXL2602 (above, Kureha Chemical Industry Co., Ltd.) and the like.

  The average particle diameter of the organic filler is preferably in the range of 0.005 μm to 1 μm, more preferably in the range of 0.2 μm to 0.6 μm. The average particle diameter of the organic filler can be measured using a dynamic light scattering method. For example, the organic filler is uniformly dispersed in an appropriate organic solvent by ultrasonic waves, etc., and the particle size distribution of the organic filler is measured by mass using a concentrated particle size analyzer (“FPAR-1000” manufactured by Otsuka Electronics Co., Ltd.). It can be measured by creating a standard and setting the median diameter as the average particle diameter. The content of the organic filler in the resin composition is preferably 1% by mass to 10% by mass, more preferably 2% by mass to 5% by mass.

  The resin composition may further contain other components as necessary. Examples of such other components include organic metal compounds such as organic copper compounds, organic zinc compounds, and organic cobalt compounds, and resins such as thickeners, antifoaming agents, leveling agents, adhesion promoters, and colorants. An additive etc. are mentioned.

  The roughening hardening body of this invention can be used as a roughening hardening body (roughening hardening body for insulating layers of a printed wiring board) for forming the insulating layer of a printed wiring board. Above all, in the production of printed wiring boards by the build-up method, it can be suitably used as a roughened and hardened body for forming insulating layers (roughened and hardened body for buildup insulating layers of printed wiring boards). It can be more suitably used as a roughened cured body for forming a conductor layer (a roughened cured body for a build-up insulating layer of a printed wiring board on which a conductive layer is formed by plating).

  When using the roughened cured body of the present invention on a printed wiring board, the resin composition used to form the roughened cured body of the present invention is a viewpoint that can be easily and efficiently laminated on the inner substrate, It is suitable to use in the form of an adhesive film including a layer made of the resin composition.

  In one embodiment, the adhesive film includes a support and a layer made of a resin composition bonded to the support (hereinafter also simply referred to as “resin composition layer”).

  In addition, in order to form the roughening hardening body of a multilayer structure, you may use the resin composition layer of a multilayer structure.

  Examples of the support include a film made of a plastic material, a metal foil, and release paper, and a film made of a plastic material is preferably used. Examples of plastic materials include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), and polyethers. Examples thereof include sulfide (PES), polyether ketone, and polyimide. Among these, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable. In a preferred embodiment, the support is a polyethylene terephthalate film.

  Commercially available products of the support include, for example, “Lumirror T6AM”, “Lumirror R56”, “Lumirror R80” (PET film) manufactured by Toray Industries, Inc., and “G2LA” (PET film) manufactured by Teijin DuPont Films Ltd. , “Teonex Q83” (PEN film) and the like.

  The support may be subjected to a mat treatment or a corona treatment on the surface to be joined to the resin composition layer. Further, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. Examples of the release agent used for the release layer of the support with the release layer include one or more release agents selected from the group consisting of alkyd resins, olefin resins, urethane resins, and silicone resins. . Examples of commercially available release agents include “SK-1”, “AL-5”, and “AL-7” manufactured by Lintec Corporation, which are alkyd resin release agents.

  Although the thickness of a support body is not specifically limited, The range of 5 micrometers-75 micrometers is preferable, and the range of 10 micrometers-60 micrometers is more preferable. In addition, when a support body is a support body with a release layer, it is preferable that the thickness of the whole support body with a release layer is the said range.

  The adhesive film is prepared, for example, by preparing a resin varnish in which a resin composition is dissolved in a solvent, and applying the resin varnish on a support using a die coater or the like and further drying to form a resin composition layer. Can be manufactured.

  Examples of the solvent include ketones such as acetone, methyl ethyl ketone (MEK) and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, cellosolve and butyl carbitol, etc. Examples thereof include carbitols, aromatic hydrocarbons such as toluene and xylene, amide solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone. A solvent may be used individually by 1 type and may be used in combination of 2 or more type.

  Drying may be performed by a known method such as heating or hot air blowing. The drying conditions are not particularly limited, but the drying is performed so that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% by mass to 60% by mass of the organic solvent, the resin composition is dried at 50 ° C. to 150 ° C. for 3 minutes to 10 minutes. A physical layer can be formed.

The minimum melt viscosity V ₀ of the resin composition layer is preferably from 300 poise to 12000 poise, from the viewpoint of suppressing resin seepage during the production of a printed wiring board and achieving good lamination (circuit embedding). Preferably, it is 500 poise to 10,000 poise, or 700 poise to 8000 poise. Therefore, in one embodiment, the roughened cured product of the present invention is obtained by roughening a cured product of the resin composition using a resin composition having a minimum melt viscosity of 300 poise to 12000 poise. The “minimum melt viscosity” of the resin composition layer refers to the lowest viscosity exhibited by the resin composition layer when the resin of the resin composition layer is melted. Specifically, when the resin composition layer is heated at a constant temperature increase rate to melt the resin, the initial stage of the melt viscosity decreases with increasing temperature, and then, when the temperature exceeds a certain temperature, the melt viscosity decreases with increasing temperature. To rise. “Minimum melt viscosity” refers to the melt viscosity at such a minimum point. The minimum melt viscosity of the resin composition layer can be measured by a dynamic viscoelastic method, and can be measured, for example, according to the method described in <Measurement of minimum melt viscosity> described later.

  In the adhesive film, a protective film according to the support can be further laminated on the surface of the resin composition layer that is not joined to the support (that is, the surface opposite to the support). Although the thickness of a protective film is not specifically limited, For example, they are 1 micrometer-40 micrometers. By laminating the protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches. The adhesive film can be stored in a roll. When an adhesive film has a protective film, it can be used by peeling off the protective film.

The roughened cured body of the present invention is obtained by roughening the cured body of the resin composition. For example, the roughened cured body of the present invention is produced by a method including the following steps (A) and (B).
(A) The process of thermosetting a resin composition and forming a hardening body (B) The process of roughening a hardening body and forming a roughening hardening body

As described above, the resin composition is preferably used in the form of an adhesive film including a layer made of the resin composition. Thus, in a preferred embodiment, step (A) comprises
(A1) providing a resin composition layer using an adhesive film including a support and a layer made of a resin composition bonded to the support; and (A2) thermosetting the resin composition layer. To obtain a cured product. In addition, the object (namely, inner layer board | substrate) which provides a resin composition layer in (A1) is mentioned later.

  The structure of the resin composition used in the step (A) is as described above. From the viewpoint of advantageously realizing the roughened cured body having the desired uneven shape and unevenness interval, it is preferable to use a resin composition containing an epoxy resin, a curing agent, and an inorganic filler (preferably silica). More preferably, a resin composition containing a resin, a curing agent, an inorganic filler (preferably silica), and a thermoplastic resin is used, and an epoxy resin, a curing agent, an inorganic filler (preferably silica), a thermoplastic resin, and More preferably, a resin composition containing a curing accelerator is used. The curing agent is selected from the group consisting of a naphthol-based curing agent and an active ester-based curing agent from the viewpoint of advantageously realizing a roughened cured body having a low surface roughness and the above-described desired uneven shape and unevenness interval. One or more selected from the group consisting of phenoxy resin and polyvinyl acetal resin as the thermoplastic resin, and from the group consisting of amine curing accelerator and imidazole curing accelerator as the curing accelerator It is preferable to use at least one selected from each.

The thermosetting of the resin composition in the step (A) is a process in which the resin composition is thermoset at a temperature T ₁ from the viewpoint of more easily realizing the roughened cured body having the desired uneven shape and uneven space. 1 thermosetting treatment and a second thermosetting treatment (hereinafter referred to as “step”) of thermosetting the resin composition after the first thermosetting treatment at a temperature T ₂ higher than the temperature T _1. It is also preferable to carry out by “thermosetting”. Thus, in one embodiment, the cured product of the resin composition, a first heat curing treatment for thermally curing the resin composition at temperatures T _1, from the temperature T ₁ of the resin composition after the first heat-curing treatment also obtained by thermosetting treatment and a second heat curing treatment for thermally cured at high temperatures T _2. In the embodiment using an adhesive film, the “resin composition” may be read as “resin composition layer”. The same applies to the following description.

When the resin composition is heat-cured by step thermosetting treatment, it is not limited to two-stage heating (T ₁ → T ₂ ), but may be three-stage (T ₁ → T ₂ → T ₃ ) or more multi-stage heating. Good.

From the viewpoint of advantageously realizing the roughened cured body having the desired uneven shape and unevenness interval, the first thermosetting treatment is preferably the lowest melt viscosity V ₁ of the resin composition after the first thermosetting treatment. Is preferably carried out in a range of 11,000 poise to 300,000 poise. The lower limit of the minimum melt viscosity V ₁ is more preferably 12000 poise or more, 13000 poise or more, or 14000 poise or more. The upper limit of the minimum melt viscosity V ₁ is more preferably 290000 poise or less, 280000 poise or less, 270000 poise or less, or 260000 poise or less. If the minimum melt viscosity V ₁ is executing the first heat curing treatment so that such range, it is possible to compatibility of each component constituting the resin composition is allowed to proceed thermally cured at a high state The excessive movement of each component constituting the resin composition can be suppressed during the thermosetting process at a higher temperature including the second thermosetting process. Thus, it is possible to allow the thermosetting to proceed in a state where the phase separation size and the degree of cross-linking degree are relatively small, which is advantageous in achieving the roughened cured body having the above desired uneven shape and uneven space. The inventors have confirmed.

In a preferred embodiment using an adhesive film, the support may be peeled between (A1) and (A2) or may be peeled after (A2). The support is preferably peeled after (A2) from the viewpoint of advantageously realizing the roughened cured body having the desired uneven shape and uneven interval. That is, it is preferable to thermoset the resin composition layer with the support attached. In such a case, the temperature T ₁ of the _first thermosetting treatment is preferably [support softening point −50] (° C.) or more, more preferably [support softening point −30] (° C.) or more, and further It is preferably [supporting softening point −10] (° C.) or more, or [support softening point] (° C.) or more. The upper limit of the temperature T ₁ is preferably [support softening point + 30] (° C.) or less, more preferably [support softening point + 25] (° C.) or less, or [support softening point + 20] (° C.). It is as follows. When these conditions are satisfied, it is possible to obtain a cured body having a smooth surface and a phase separation size in an appropriate range, which is advantageous in achieving the desired uneven shape and uneven space after the roughening treatment. The inventors have confirmed.

  The time for performing the first thermosetting treatment is not particularly limited as long as the effect of the present invention is exhibited, and may be determined according to the composition of the resin composition and the like. The time for performing the first thermosetting treatment may be, for example, 5 minutes to 180 minutes, 10 minutes to 150 minutes, or 15 minutes to 120 minutes.

Temperature _{T 2} of the second heat curing treatment is higher than the temperature _{T 1.} Temperature T ₂ is not particularly as long as the cured product having sufficient hardness is obtained limited, it may be determined according to the composition of the resin composition. The temperature T ₂ is preferably (T ₁ +10) ° C. or higher, more preferably (T ₁ +20) ° C. or higher, (T ₁ +30) ° C. or higher, (T ₁ +40) ° C. or higher, or (T ₁ +50) ° C. or higher. It is. The upper limit of the temperature T ₂ is preferably (T ₁ +150) ° C. or less, more preferably (T ₁ +140) ° C. or less, (T ₁ +130) ° C. or less, (T ₁ +120) ° C. or less, (T ₁ +110) ° C. Or (T ₁ +100) ° C. or less. The lower limit of temperature T ₂ is usually 150 ° C. or higher, 160 ° C. or higher, and the upper limit of temperature T ₂ is usually 240 ° C. or lower, 230 ° C. or lower, 220 ° C. or lower.

  The time for performing the second thermosetting treatment is not particularly limited as long as the effect of the present invention is exhibited, and may be determined according to the composition of the resin composition and the like. The time for performing the second thermosetting treatment may be, for example, 5 minutes to 120 minutes, 10 minutes to 90 minutes, or 15 minutes to 60 minutes.

From the viewpoint that can advantageously achieve a roughened cured material having the desired uneven shape and uneven intervals, after the second heat hardening process, to return the cured product from the temperature T ₂ to room temperature at a predetermined temperature lowering profile Is preferred. Preferably cured at a rate of temperature decrease of 10 ° C / min or less, more preferably 8 ° C / min or less, more preferably 6 ° C / min or less, 5 ° C / min or less, 4 ° C / min or less, or 3 ° C / min or less. it is preferable to return the body from temperature T ₂ to room temperature. The lower limit of the temperature lowering rate is not particularly limited, but can usually be 0.5 ° C./min or more, 1 ° C./min or more, and the like. When such a condition is satisfied, it is possible to obtain a cured body having a smooth surface and a phase separation size in an appropriate range, which is advantageous in achieving the desired uneven shape and uneven space after the roughening treatment. The inventors have confirmed.

  The pressure of the atmosphere at the time of thermosetting is not particularly limited, and may be performed under normal pressure, reduced pressure, or increased pressure.

  The procedure and conditions of the roughening treatment in the step (B) are not particularly limited, and known procedures and conditions that are usually used when forming the insulating layer of the printed wiring board can be adopted.

  For example, the cured body can be roughened by carrying out a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order. Although it does not specifically limit as a swelling liquid, An alkaline solution, surfactant solution, etc. are mentioned, An alkaline solution is preferable. The alkaline solution is preferably a sodium hydroxide solution or a potassium hydroxide solution. Examples of commercially available swelling liquids include “Swelling Dip Securigans P” and “Swelling Dip Securigans SBU” manufactured by Atotech Japan Co., Ltd. The swelling treatment with the swelling liquid can be performed, for example, by immersing the cured body in a swelling liquid at 30 to 90 ° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the cured body to an appropriate level, it is preferable to immerse the cured body in a swelling liquid at 40 to 80 ° C. for 5 to 15 minutes. Although it does not specifically limit as an oxidizing agent, For example, the alkaline permanganate solution which melt | dissolved potassium permanganate and sodium permanganate in the aqueous solution of sodium hydroxide is mentioned. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the cured product in an oxidizing agent solution heated to 60 ° C. to 80 ° C. for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as “Concentrate Compact CP” and “Dosing Solution Securigans P” manufactured by Atotech Japan Co., Ltd. The neutralizing solution is preferably an acidic aqueous solution. Examples of commercially available products include “Reduction Solution Securigant P” manufactured by Atotech Japan Co., Ltd. The treatment with the neutralizing solution can be performed by immersing the treated surface subjected to the roughening treatment with the oxidizing agent in the neutralizing solution at 30 to 80 ° C. for 5 to 30 minutes.

  The roughened and cured body of the present invention thus obtained has a low surface roughness and a concave portion on the surface whose opening diameter is equal to or larger than the internal maximum diameter. Thus, unnecessary portions of the conductor layer can be easily removed at the time of circuit formation, and further miniaturization of the circuit can be achieved in the production of the printed wiring board.

[Laminate]
The laminate of the present invention includes the roughened cured body of the present invention and a conductor layer formed on the surface of the roughened cured body.

  The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer is one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer. As the alloy layer, for example, an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper- A layer formed from a nickel alloy and a copper / titanium alloy). Among them, from the viewpoint of versatility of conductor layer formation, cost, ease of patterning, etc., single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or nickel / chromium alloy, copper / An alloy layer of nickel alloy or copper / titanium alloy is preferable, and a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of nickel / chromium alloy is more preferable, and a single layer of copper is preferable. A metal layer is more preferred.

  The conductor layer may have a single layer structure or a multilayer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multilayer structure, the layer in contact with the roughened cured body is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel / chromium alloy.

  Although the thickness of a conductor layer is based on the design of a desired printed wiring board, it is 3 micrometers-35 micrometers normally, Preferably it is 5 micrometers-30 micrometers.

  The conductor layer may be formed by plating. For example, the surface of the roughened cured body can be plated by a conventionally known technique such as a semi-additive method to form a conductor layer (circuit) having a desired wiring pattern. Hereinafter, an example in which a circuit is formed by a semi-additive method will be described.

  First, a plating seed layer is formed on the surface of the roughened cured body by electroless plating. Next, a mask pattern that exposes a part of the plating seed layer corresponding to a desired wiring pattern is formed on the formed plating seed layer. A conductor layer is formed by electrolytic plating on the exposed plating seed layer, and then the mask pattern is removed. Thereafter, an unnecessary plating seed layer can be removed by etching or the like to form a circuit having a desired wiring pattern.

  As described above, the roughened cured body of the present invention has a low surface roughness, and has a recess having an opening diameter equal to or larger than the internal maximum diameter on the surface. As a result, unnecessary portions of the conductor layer can be easily removed during circuit formation, and further miniaturization of the circuit can be achieved. For example, the ratio (L / S) of the circuit width (line; L) to the width (space; S) between circuits is 10 μm / 10 μm or less (that is, wiring pitch is 20 μm or less), and L / S = 9 μm / 9 μm or less (wiring) A circuit having a pitch of 18 μm or less can be formed with high yield. Furthermore, L / S = 8 μm / 8 μm or less (wiring pitch 16 μm or less), L / S = 7 μm / 7 μm or less (wiring pitch 14 μm or less), L / S = 6 μm / 6 μm or less (wiring pitch 12 μm or less), L / S Fine circuits with S = 5 μm / 5 μm or less (wiring pitch 10 μm or less) and L / S = 4 μm / 4 μm or less (wiring pitch 8 μm or less) can be formed with high yield. Therefore, in a preferred embodiment, the conductor layer includes a circuit having a wiring pitch of 16 μm or less.

[Printed wiring board]
The printed wiring board of the present invention includes an insulating layer formed of the roughened cured body of the present invention.

  In one Embodiment, the printed wiring board of this invention can be manufactured using said adhesive film. In such an embodiment, after the adhesive film is laminated on the inner layer substrate so that the resin composition layer is bonded to the inner layer substrate, the above-mentioned “step (A)” and “step (B)” are performed. The roughened cured body of the present invention can be formed on the inner layer substrate.

  The “inner layer substrate” is mainly a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, or a conductor layer patterned on one or both sides of the substrate. A circuit board on which (circuit) is formed. Further, when the printed wiring board is manufactured, an inner layer circuit board of an intermediate product in which an insulating layer and / or a conductor layer is further formed is also included in the “inner layer board” in the present invention.

  Lamination | stacking of an inner layer board | substrate and an adhesive film can be performed by heat-pressing an adhesive film to an inner layer board | substrate from the support body side, for example. Examples of the member that heat-presses the adhesive film to the inner layer substrate (hereinafter also referred to as “heat-pressing member”) include a heated metal plate (SUS end plate, etc.) or a metal roll (SUS roll). In addition, it is preferable not to press the thermocompression bonding member directly on the adhesive film but to press it through an elastic material such as heat resistant rubber so that the adhesive film sufficiently follows the surface irregularities of the inner layer substrate.

  Lamination of the inner layer substrate and the adhesive film may be performed by a vacuum laminating method. In the vacuum laminating method, the thermocompression bonding temperature is preferably in the range of 60 ° C to 160 ° C, more preferably 80 ° C to 140 ° C, and the thermocompression bonding pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0. The thermocompression bonding time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably performed under reduced pressure conditions with a pressure of 26.7 hPa or less.

  Lamination can be performed with a commercially available vacuum laminator. The commercially available vacuum laminator is as described above.

  After lamination, the laminated adhesive film may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression bonding member from the support side. The pressing conditions for the smoothing treatment can be the same conditions as the thermocompression bonding conditions for the laminate. The smoothing treatment can be performed with a commercially available laminator. In addition, you may perform lamination | stacking and a smoothing process continuously using said commercially available vacuum laminator.

  Next, a conductor layer is formed on the surface of the roughened cured body (insulating layer) formed on the inner layer substrate. The method for forming the conductor layer is as described above. When manufacturing a printed wiring board, a step of drilling an insulating layer may be further performed. These steps may be carried out according to various methods known to those skilled in the art used in the production of printed wiring boards.

[Semiconductor device]
A semiconductor device can be manufactured using the printed wiring board of the present invention. Examples of the semiconductor device include various semiconductor devices used for electrical products (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircrafts).

  The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) at a conduction point of the printed wiring board of the present invention. The “conduction location” is a “location where an electrical signal is transmitted on a printed wiring board”, and the location may be a surface or an embedded location. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.

  The semiconductor chip mounting method for manufacturing the semiconductor device of the present invention is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, and no bumps. Examples include a mounting method using a build-up layer (BBUL), a mounting method using an anisotropic conductive film (ACF), and a mounting method using a non-conductive film (NCF). Here, “a mounting method using a build-up layer without a bump (BBUL)” means “a mounting method in which a semiconductor chip is directly embedded in a recess of a printed wiring board and the semiconductor chip and wiring on the printed wiring board are connected”. It is.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example, this invention is not limited to these Examples. In the following description, “part” and “%” mean “part by mass” and “% by mass”, respectively, unless otherwise specified.

<Measurement and evaluation method>
First, the measurement / evaluation method in the physical property evaluation in this specification will be described.

[Preparation of measurement and evaluation substrate]
(1) Substrate treatment of a circuit board Both sides of a glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic Corporation “R1515A”) on which a circuit is formed Was etched by 1 μm with a microetching agent (“CZ8100” manufactured by MEC Co., Ltd.) to roughen the copper surface.

(2) Lamination | stacking of adhesive film The protective film was peeled from the adhesive film produced in the Example and the comparative example. Using the batch type vacuum pressure laminator (Nichigo Morton Co., Ltd. 2-stage build-up laminator “CVP700”), the resin composition layer is bonded to the circuit board using the exposed adhesive film of the resin composition layer. And laminated on both sides of the circuit board. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less and then pressing the film at 100 ° C. and a pressure of 0.74 MPa for 30 seconds. Subsequently, the laminated adhesive film was smoothed by hot pressing at 100 ° C. and a pressure of 0.5 MPa for 60 seconds under atmospheric pressure.

(3) Curing of resin composition layer After laminating the adhesive film, the resin composition layer was thermally cured to form cured bodies on both sides of the circuit board. At that time, for Examples 1, 2, 4 and Comparative Example 1, the resin composition layer was thermally cured with a PET film as a support attached. Regarding Example 3 and Comparative Example 2, the resin composition layer was thermally cured after peeling the PET film as the support.

The thermosetting of the resin composition layer includes a _first thermosetting treatment that is thermosetting at a temperature T ₁ and a second thermosetting treatment that is thermosetting at a temperature T ₂ higher than the temperature T _1. Performed by treatment. Specifically, the following condition 1 (Example 1), condition 2 (Example 2), condition 3 (Example 3 and Comparative Example 2), condition 4 (Example 4), or Condition 5 (Comparative Example 1) Carried out.
Condition 1: Heat-cured at 150 ° C. for 30 minutes (after being put into an oven at 150 ° C.) and then at 170 ° C. (after being transferred to an oven at 170 ° C.) for 30 minutes. Thereafter, the substrate was taken out in a room temperature atmosphere.
Condition 2: Heat-cured at 80 ° C. for 30 minutes (after being put into an 80 ° C. oven) and then at 175 ° C. (after being transferred to an oven at 175 ° C.) for 30 minutes. Thereafter, the substrate was taken out in a room temperature atmosphere.
Condition 3: Heat-cured at 100 ° C. for 30 minutes (after being put into an oven at 100 ° C.) and then at 175 ° C. (after being transferred to an oven at 175 ° C.) for 30 minutes. Thereafter, the substrate was taken out in a room temperature atmosphere.
Condition 4: Thermal curing was performed at 150 ° C. for 30 minutes (after being put in an oven at 150 ° C.) and then at 170 ° C. (after being transferred to an oven at 170 ° C.) for 30 minutes. Thereafter, the substrate was returned to room temperature (25 ° C.) with a temperature drop profile of 2.5 ° C./min.
Condition 5: Thermal curing was performed at 100 ° C. for 30 minutes (after being put into an oven at 100 ° C.) and then at 175 ° C. (after being transferred to an oven at 175 ° C.) for 30 minutes. Thereafter, the substrate was taken out in a room temperature atmosphere.

(4) Roughening treatment When the substrate was heat-cured with the support attached, the support was peeled off. The substrate with the cured body exposed was placed in a swelling solution (“Swelling Dip Securigant P” manufactured by Atotech Japan Co., Ltd., an aqueous solution containing diethylene glycol monobutyl ether and sodium hydroxide) at 60 ° C. for 5 minutes (Example 3 and comparison). Example 2) or 10 minutes (Examples 1, 2, 4 and Comparative Example 1), oxidizing agent (“Concentrate Compact CP” manufactured by Atotech Japan Co., Ltd.), KMnO ₄ : 60 g / L, NaOH: 40 g / L Aqueous solution) at 80 ° C. for 20 minutes, and finally immersed in a neutralizing solution (“Reduction Solution Securigant P” manufactured by Atotech Japan Co., Ltd., sulfuric acid aqueous solution) at 40 ° C. for 5 minutes and then dried at 80 ° C. for 30 minutes. Then, a roughened cured body was formed on both sides of the circuit board. The obtained substrate is referred to as “evaluation substrate A”.

(5) Formation of circuit A circuit was formed on the surface of the roughened cured body according to the semi-additive method.

(5-1) Electroless plating Electroless plating was performed on the surface of the roughened cured body. The electroless plating was performed by the following procedure using Atotech Japan Co., Ltd. pharmaceutical solution. A plating having a thickness of 1 μm was formed. The obtained substrate is referred to as “evaluation substrate B”. The evaluation board B is a board in which a roughened cured body with plating is formed on both surfaces of the circuit board.

1. Alkali cleaning (cleaning of roughened cured body surface and charge adjustment)
The surface of the roughened cured body was washed at 60 ° C. for 5 minutes using “Cleaning Cleaner Security 902”.
2. Soft etching (cleaning)
The substrate after alkali cleaning was treated at 30 ° C. for 1 minute using a sulfuric acid aqueous sodium peroxodisulfate solution.
3. Pre-dip (adjustment of the charge on the surface of the roughened cured body to give Pd)
The substrate was then treated with “Pre.Dip Neoganth B” for 1 minute at room temperature.
4). Activator (Applying Pd to the surface of the roughened cured body)
After pre-dip, the substrate was treated with “Activator Neoganth 834” at 35 ° C. for 5 minutes.
5. Reduction (reduction of Pd imparted to the roughened cured product)
Next, the substrate was treated at 30 ° C. for 5 minutes using a mixed solution of “Reducer Neoganth WA” and “Reducer Accelerator 810 mod.”.
6). Electroless copper plating (Cu deposition on roughened hardened body surface (Pd surface))
After the reduction, the substrate was treated at 35 ° C. for 20 minutes using a mixed solution of “Basic Solution Printganth MSK-DK”, “Copper solution Printganth MSK”, “Stabilizer Printganth MSK-DK”, and “Reducer Cu”. The obtained substrate was heat-treated at 150 ° C. for 30 minutes.

(5-2) Formation of wiring pattern After electroless plating, the substrate surface was treated with 5% aqueous sulfuric acid for 30 seconds. Next, a dry film for pattern formation (“Hottec RY-3600” manufactured by Hitachi Chemical Co., Ltd., thickness 19 μm) is used with a batch-type vacuum pressure laminator (“MVLP-500” manufactured by Meiki Seisakusho Co., Ltd.). And laminated on both sides of the substrate. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then applying pressure at 70 ° C. and a pressure of 0.1 MPa for 20 seconds.

  Thereafter, a glass mask (photomask) on which a wiring pattern (details are shown below) is formed is placed on a dry film, and light irradiation is performed by a projection exposure machine (“UX-2240” manufactured by USHIO INC.). did. Subsequently, a 30% 1% sodium carbonate aqueous solution was sprayed for 30 seconds at an injection pressure of 0.15 MPa. Then, it washed with water and the development (pattern formation) of the dry film was performed.

Glass mask wiring pattern:
A glass mask having 10 comb tooth patterns of i) to vii) below was used.
i) L / S = 4 μm / 4 μm, that is, a comb tooth pattern with a wiring pitch of 8 μm (wiring length: 15 mm, 16 lines)
ii) L / S = 5 μm / 5 μm, that is, a comb tooth pattern with a wiring pitch of 10 μm (wiring length 15 mm, 16 lines)
iii) L / S = 6 μm / 6 μm, that is, a comb tooth pattern with a wiring pitch of 12 μm (wiring length 15 mm, 16 lines)
iv) L / S = 7 μm / 7 μm, that is, a comb-teeth pattern with a wiring pitch of 14 μm (wiring length 15 mm, 16 lines)
v) L / S = 8 μm / 8 μm, that is, a comb tooth pattern with a wiring pitch of 16 μm (wiring length: 15 mm, 16 lines)
vi) L / S = 9 μm / 9 μm, that is, a comb tooth pattern with a wiring pitch of 18 μm (wiring length 15 mm, 16 lines)
vii) L / S = 10 μm / 10 μm, that is, a comb-tooth pattern with a wiring pitch of 20 μm (wiring length 15 mm, 16 lines)

  After development of the dry film, electrolytic copper plating was performed to form an electrolytic copper plating layer (conductor layer) having a thickness of 10 μm (the total thickness with the electroless copper plating layer was about 11 μm).

  Next, a 3% sodium hydroxide solution at 50 ° C. was sprayed at an injection pressure of 0.2 MPa, and the dry film was peeled off from both sides of the substrate. After annealing at 190 ° C. for 60 minutes, an unnecessary conductor layer (copper layer) is removed using a flash etching etchant (SAC process etchant manufactured by Ebara Densan Co., Ltd.). As a result, a circuit was formed. The obtained substrate is referred to as “evaluation substrate C”.

<Measurement of minimum melt viscosity>
About the resin composition layer of the adhesive film produced by the manufacture example, melt viscosity was measured using the dynamic viscoelasticity measuring apparatus ("Rhesol-G3000" by UBM). About 1 g of the sample resin composition, using a parallel plate with a diameter of 18 mm, the temperature was raised from a starting temperature of 60 ° C. to 200 ° C. at a heating rate of 5 ° C./minute, a measurement temperature interval of 2.5 ° C., a frequency of 1 Hz, The dynamic viscoelastic modulus was measured under a measurement condition of 1 deg strain, and the minimum melt viscosity (poise) was measured. Minimum melt viscosity V ₀ for the resin composition layer immediately after production (initial stage) and minimum melt viscosity V for the resin composition layer after the first thermosetting treatment in (3) of [Preparation of measurement / evaluation substrate] ₁ was requested.

<Measurement of arithmetic average roughness (Ra) and average interval of unevenness (Sm)>
For the evaluation substrate A, Ra and Sm values are obtained by numerical values obtained by using a non-contact type surface roughness meter (“WYKO NT3300” manufactured by Bee Coins Instruments Co., Ltd.) and a measurement range of 121 μm × 92 μm with a 50 × lens. Asked. The measured values were obtained by calculating the average value of 10 points selected at random. The Sm value was an average value of Sm (x) and Sm (y).

<Evaluation of uneven shape on roughened cured body surface>
About evaluation board | substrate B, cross-sectional observation was performed using FIB-SEM compound apparatus ("SMI3050SE" by SII nanotechnology Co., Ltd.). Specifically, a cross-section in the direction perpendicular to the surface of the evaluation substrate B is cut out by FIB (focused ion beam), and a cross-sectional SEM image in the vicinity of the interface between the plating and the roughened cured body (observation width 7.5 μm, observation magnification x36000). Acquired. For each sample, 10 randomly selected cross-sectional SEM images were acquired. Hereinafter, the evaluation procedure will be described with the plating side in the cross-sectional SEM image as the upper side and the roughened cured body side as the lower side.

-Straight lines L1 and L2-
The straight line L1 was obtained by linearizing the interface between the plating and the roughened cured body by the least square method with reference to the convex portion of the roughened cured body. Specifically, the obtained cross-sectional SEM image was divided into five equal sections of 1.5 μm in width, and the position of the roughened cured body existing on the uppermost side in each section was adopted as a reference point. The “position of the roughened cured body present on the uppermost side” refers to the position of the resin component when the resin component is present on the uppermost side, and the inorganic filler when the inorganic filler is present on the uppermost side. The position of the material. The obtained five reference points were subjected to coordinate transformation, and an approximate straight line based on these five reference points, that is, a straight line L1 was obtained by the least square method. A straight line parallel to the straight line L1 was drawn 0.2 μm below the straight line L1 to obtain a straight line L2. About the acquired cross-sectional SEM image of 10 places, the straight lines L1 and L2 were obtained.

-Length X and Y-
About the acquired cross-sectional SEM image of 10 places, the length of the plating area | region which exists on the straight line L1 was totaled, and length X was obtained. Similarly, the length of the plating area | region which exists on the straight line L2 was totaled about 10 acquired cross-sectional SEM images, and length Y was obtained. When the inorganic filler exists on the straight line L1, the inorganic filler region was handled as follows in calculating the length X. When at least a part of the inorganic filler was in contact with the resin component, the inorganic filler region was treated as a roughened cured body region. On the other hand, when the inorganic filler was not in contact with the resin component and was covered with electroless plating, the inorganic filler region was treated as a plating region. The case where an inorganic filler was present on the straight line L2 was handled in the same manner. Using the obtained X and Y, a Y / X ratio was determined. The obtained Y / X ratio is an index of the uneven shape on the surface of the roughened cured body. When the Y / X ratio is 1 or less, a concave portion whose opening diameter is equal to or larger than the internal maximum diameter is formed on the surface. When the Y / X ratio is greater than 1, it indicates that a recess having an opening diameter smaller than the internal maximum diameter is formed on the surface.

-Depth Z-
About the acquired 10 cross-sectional SEM images, the length of the plating region on the straight line L3 that is parallel to the straight line L1 and is Z (μm) away from the straight line L1 in the depth direction (downward) of the roughened cured body The minimum value of Z at which Y ′ becomes 0 was determined when the total of Y ′ was Y ′.

<Evaluation of microcircuit formation ability>
For the comb tooth patterns i) to vii) of the evaluation substrate C, the presence or absence of peeling of the circuit is confirmed with an optical microscope, and the presence or absence of an unnecessary electroless copper plating layer residue is measured for the insulation resistance of the comb tooth pattern. Confirmed by doing. And when there was no problem about nine or more among ten comb-tooth patterns, it determined with a pass. The fine circuit forming ability was evaluated based on the minimum L / S ratio and wiring pitch determined to be acceptable. In the evaluation, the smaller the minimum L / S ratio and wiring pitch determined to be acceptable, the better the fine circuit forming ability.

<Preparation Example 1> (Preparation of resin varnish 1)
Bisphenol type epoxy resin (“ZX1059” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., epoxy equivalent of about 169, 1: 1 mixture of bisphenol A type and bisphenol F type) 6 parts, bixylenol type epoxy resin (manufactured by Mitsubishi Chemical Corporation) "YX4000HK", epoxy equivalent of about 185) 10 parts, biphenyl type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 269) 5 parts, dicyclopentadiene type epoxy resin (DIC Corporation "HP-" 7200HH ", epoxy equivalent 280) 5 parts, and 12 parts of phenoxy resin (" YX7553BH30 "manufactured by Mitsubishi Chemical Corporation, 1: 1 solution of cyclohexanone: methyl ethyl ketone (MEK) having a solid content of 30% by mass) 30 parts of solvent naphtha The solution was heated and dissolved with stirring. After cooling to room temperature, 10 parts of a triazine skeleton-containing cresol novolac-based curing agent (hydroxyl equivalent 151, “LA-3018-50P” manufactured by DIC Corporation, 2-methoxypropanol solution with a solid content of 50%), Active ester curing agent (DIC Corporation "HPC8000-65T", active group equivalent of about 223, non-volatile component 65% by weight toluene solution) 10 parts, amine curing accelerator (4-dimethylaminopyridine (DMAP), 1.6 parts of MEK solution having a solid content of 5% by mass, 1 part of imidazole curing accelerator (1-benzyl-2-phenylimidazole (1B2PZ), MEK solution having a solid content of 5% by mass), flame retardant (Sanko Co., Ltd.) ) “HCA-HQ”, 10- (2,5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphaphenanthrene- 2 parts of 0-oxide, average particle diameter 2 μm), spherical silica surface-treated with an aminosilane coupling agent (“KBM573” manufactured by Shin-Etsu Chemical Co., Ltd.) (“SO-C2” manufactured by Admatechs Co., Ltd.), average After mixing 130 parts with a particle size of 0.5 μm and carbon amount per unit surface area of 0.38 mg / m ² ) and uniformly dispersing with a high-speed rotary mixer, the mixture is filtered with a cartridge filter (“SHP050” manufactured by ROKITECNO) Varnish 1 was prepared.

<Preparation Example 2> (Preparation of resin varnish 2)
10 parts of bisphenol AF type epoxy resin (Mitsubishi Chemical Corporation "YL7760", epoxy equivalent of about 238), 10 parts of bixylenol type epoxy resin (Mitsubishi Chemical Corporation "YX4000HK, epoxy equivalent of about 185), biphenyl type 10 parts of epoxy resin (Nippon Kayaku Co., Ltd. “NC3000L”, epoxy equivalent 269) and phenoxy resin (Mitsubishi Chemical Co., Ltd. “YX7553BH30”, solid content 30% by mass of cyclohexanone: methyl ethyl ketone (MEK) 1: 1 solution) 10 parts were dissolved in 25 parts of solvent naphtha with stirring. After cooling to room temperature, 5 parts of a triazine skeleton-containing phenol novolac curing agent (hydroxyl equivalent: 125, “LA-7054” manufactured by DIC Corporation, MEK solution with a solid content of 60%), active ester curing agent (DIC Corporation "HPC8000-65T", active group equivalent of about 223, non-volatile component 65% by weight toluene solution) 15 parts, amine curing accelerator (DMAP, 5% by weight solid content MEK solution) 2 parts, Spherical silica surface-treated with an aminosilane coupling agent (“KBM573” manufactured by Shin-Etsu Chemical Co., Ltd.) (“SO-C1” manufactured by Admatechs Co., Ltd.), average particle size of 0.25 μm, amount of carbon per unit surface area After mixing 100 parts of 0.36 mg / m ² ) and uniformly dispersing with a high-speed rotary mixer, a cartridge filter (“SHP made by ROKITECNO” 030 ") to prepare resin varnish 2.

<Preparation Example 3> (Preparation of resin varnish 3)
Bisphenol type epoxy resin (“ZX1059” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 1: 1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169), 4 parts of naphthalene type epoxy resin (“HP4032SS” manufactured by DIC Corporation) , Epoxy equivalent of 144) 5 parts, bixylenol type epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of about 185), biphenyl type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd.), epoxy While stirring 10 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, 1: 1 solution of cyclohexanone: methyl ethyl ketone (MEK) with a solid content of 30% by mass) in 15 parts of solvent naphtha It was dissolved by heating. After cooling to room temperature, 10 parts of a triazine skeleton-containing phenol novolac curing agent (hydroxyl equivalent 125, “LA-7054” manufactured by DIC Corporation, MEK solution with a solid content of 60%), naphthol curing agent ( “SN-485” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 10 parts of a MEK solution having a hydroxyl equivalent weight of 215 and a solid content of 60%, polyvinyl butyral resin (glass transition temperature of 105 ° C., “KS-1” manufactured by Sekisui Chemical Co., Ltd.) ) 10 parts of a 1: 1 mixed solution of ethanol and toluene with a solid content of 15%, 1 part of an amine curing accelerator (DMAP, MEK solution with a solid content of 5% by mass), a flame retardant (“HCA” manufactured by Sanko Co., Ltd.) -HQ ", 10- (2,5-dihydroxyphenyl) -10-hydro-9-oxa-10-phosphaphenanthrene-10-oxide, average particle size 2 [mu] m) 2 parts, amino Spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd.), surface treated with a run-based coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.), average particle size 0.5 μm, carbon amount per unit surface area 90 parts of 0.38 mg / m ² ) were mixed and dispersed uniformly with a high-speed rotary mixer, and then filtered with a cartridge filter (“SHP050” manufactured by ROKITECNO) to prepare a resin varnish 3.

<Preparation Example 4> (Preparation of resin varnish 4)
The naphthol type curing agent (Nippon Steel & Sumitomo Metal) was changed to 5 parts of the triazine skeleton-containing phenol novolac type curing agent (hydroxyl equivalent: 125, “LA-7054” manufactured by DIC Corporation, MEK solution having a solid content of 60%). Chemical SN Co., Ltd. “SN-485”, MEK solution having a hydroxyl equivalent weight of 215 with a solid content of 60% was changed to 20 parts, imidazole-based curing accelerator (1B2PZ, MEK solution with a solid content of 5 mass%) ) Resin varnish 4 was prepared in the same manner as Preparation Example 3 except that 1 part was added.

<Preparation Example 1> Preparation of Adhesive Film 1 As a support, a PET film (“Lumirror T6AM” manufactured by Toray Industries, Inc.), which was release-treated with an alkyd resin mold release agent (“AL-5” manufactured by Lintec Corporation), A thickness of 38 μm and a softening point of 130 ° C. were prepared. The resin varnish 1 was applied to the release surface of the support with a die coater, and dried at 80 ° C. to 110 ° C. (average 100 ° C.) for 3 minutes to form a resin composition layer. The thickness of the resin composition layer was 20 μm. Next, a polypropylene film (“Alphan MA-411” manufactured by Oji Specialty Paper Co., Ltd., thickness 15 μm) is used as a protective film on the surface of the resin composition layer not bonded to the support, and the rough surface of the protective film. Were laminated so as to be bonded to the resin composition layer, whereby an adhesive film 1 was obtained.

<Production Example 2> Production of adhesive film 2 Adhesive film 2 was produced in the same manner as Production Example 1 except that resin varnish 2 was used instead of resin varnish 1.

<Production Example 3> Production of Adhesive Film 3 Adhesive film 3 was produced in the same manner as Production Example 1 except that resin varnish 3 was used instead of resin varnish 1.

<Production Example 4> Production of Adhesive Film 4 Adhesive film 4 was produced in the same manner as Production Example 1 except that resin varnish 4 was used instead of resin varnish 1.

<Example 1>
Using the adhesive film 1, an evaluation substrate was prepared according to the above [Preparation of measurement / evaluation substrate], and each evaluation was performed.

<Example 2>
Using the adhesive film 2, an evaluation substrate was prepared according to the above [Preparation of measurement / evaluation substrate], and each evaluation was performed.

<Example 3>
Using the adhesive film 3, an evaluation substrate was prepared according to the above [Preparation of measurement / evaluation substrate], and each evaluation was performed.

<Example 4>
Using the adhesive film 1, an evaluation substrate was prepared according to the above [Preparation of measurement / evaluation substrate], and each evaluation was performed.

<Comparative Example 1>
Using the adhesive film 1, an evaluation substrate was prepared according to the above [Preparation of measurement / evaluation substrate], and each evaluation was performed.

<Comparative Example 2>
Using the adhesive film 4, an evaluation substrate was prepared according to the above [Preparation of measurement / evaluation substrate], and each evaluation was performed.

The evaluation results are shown in Table 2.

DESCRIPTION OF SYMBOLS 1 Roughening hardening body which has a recessed part whose opening diameter is smaller than an internal maximum diameter on the surface 10 Roughening hardening body which has a recessed part whose opening diameter is larger than an internal maximum diameter on the surface 11 Resin component 12 Inorganic filler 20 Plating L1 plating Straight line obtained by linearizing the interface of the roughened cured body by the least square method L2 A straight line parallel to the straight line L1 and 0.2 μm away from the straight line L1 in the depth direction of the roughened hardened body.

Claims (10)

A roughened cured body obtained by roughening a cured body of a resin composition,
The arithmetic average roughness (Ra) of the surface of the roughened cured body is 500 nm or less,
When a roughened cured body with plating is formed by electroless plating on the surface of the roughened cured body, plating is performed in the cross section of the roughened cured body with plating in a direction perpendicular to the surface of the roughened cured body with plating. The length X of the plating region on the straight line L1 obtained by straightening the interface of the roughened hardened body by the least square method is parallel to the straight line L1 and 0 in the depth direction of the roughened hardened body from the straight line L1. A roughened cured body in which the length Y of the plating region on the straight line L2 that is 2 μm apart satisfies the condition of Y / X ≦ 1.   When the length of the plating region on the straight line L3 parallel to the straight line L1 and separated from the straight line L1 by Z (μm) in the depth direction of the roughened cured body is Y ′, Y ′ / X ≦ 0. The roughening hardening body of Claim 1 whose minimum value of Z which satisfy | fills 05 is 3 or less.   The roughening hardening body of Claim 1 or 2 whose average space | interval (Sm) of the unevenness | corrugation of the surface of a roughening hardening body is 2000 nm or less.   The roughening hardening body of any one of Claims 1-3 whose arithmetic mean roughness (Ra) of the surface of a roughening hardening body is 200 nm or less. Resin composition contains an inorganic filler having an average particle size 0.01Myuemu～0.3Myuemu, roughened cured body according to any one of claims 1-4. The roughening hardening body of any one of Claims 1-5 in which the resin composition contains 1 or more types selected from the group which consists of a naphthol type hardening | curing agent and an active ester type hardening | curing agent. The laminated body containing the roughening hardening body of any one of Claims 1-6 , and the conductor layer formed in the surface of this roughening hardening body. The laminate according to claim 7 , wherein the conductor layer includes a circuit having a wiring pitch of 16 μm or less. The printed wiring board containing the insulating layer formed with the roughening hardening body of any one of Claims 1-6 . A semiconductor device comprising the printed wiring board according to claim 9 .

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