JP6418165B2 - Adhesive substrate, inkjet head, and substrate support method - Google Patents

Description

  The present invention relates to a bonding substrate bonded to another substrate, an inkjet head, and a substrate supporting method.

  2. Description of the Related Art Conventionally, an ink jet head is known in which a plurality of various substrates for forming a nozzle for discharging ink, a pressure chamber for containing ink, and the like are stacked with an adhesive interposed therebetween. Specifically, the nozzle substrate having the nozzle and one surface of the pressure chamber substrate having the pressure chamber are bonded via the first bonding substrate, and the other surface of the pressure chamber substrate, the ink flow path, and the actuator. And a wiring board having wirings electrically connected to each other are bonded via a second bonding substrate.

  The adhesive substrate is applied to substantially the entire area of one surface of the adhesive substrate in the process of manufacturing the inkjet head. Then, a concave portion for preventing the adhesive from adhering to a predetermined position on one surface of the adhesive substrate is formed in advance so that the adhesive substrate can be supported by the support member and operated from the one surface side where the adhesive is applied. Those are known (for example, see Patent Document 1).

JP 2001-30488 A

By the way, it is necessary to apply an adhesive to both the front and back surfaces of the bonding substrate. For this reason, in order to improve the ease of handling of the bonding substrate, it is desirable that the positions of the recesses are substantially equal on both the front and back surfaces of the bonding substrate. However, if the concave portions are formed at the same position on both the front and back surfaces of the bonding substrate, the thickness of the portion of the bonding substrate where the concave portions are formed becomes too thin or the concave portions communicate with each other (penetrate). . As a result, the strength of the bonding substrate may be excessively reduced, and the bonding substrate may be damaged.
In addition, although the method of apply | coating an adhesive partially with respect to the front and back both surfaces of the board | substrate for adhesion | attachment is also considered, it will become difficult to ensure high precision at low cost, and the application quantity of an adhesive agent becomes thick. .

  The present invention has been made in view of the above circumstances, and can provide a bonding substrate capable of suppressing a decrease in strength even when a recess for preventing adhesion of an adhesive is formed, and improving ease of handling, It is an object to provide an inkjet head and a substrate support method.

In order to solve the above problems, the bonding substrate of the invention according to claim 1 is:
Among the front and back surfaces, an adhesive substrate that is applied to substantially the entire area of at least one surface and is bonded to another substrate,
A plurality of recesses are provided on the front and back surfaces of the substrate body,
The recesses on the front and back surfaces of the substrate body do not overlap with the recesses on the other surface opposite to the one surface when viewed from either one of the front and back surfaces of the substrate body, and , Ri Na are arranged so as to overlap with the recess of the other surface when obtained by inverting the front and back of virtually the substrate body a reference line passing through the predetermined position of the substrate main body as the axis, the plurality of recesses, It is formed using any one of sandblasting and wet etching .

The invention described in claim 2 is the bonding substrate according to claim 1,
The substrate main body is bonded to a nozzle substrate having a nozzle and a pressure chamber substrate having a pressure chamber via an adhesive.

The invention according to claim 3 is the bonding substrate according to claim 1,
The substrate body is characterized by being bonded to a pressure chamber substrate having a pressure chamber and a wiring substrate having wiring electrically connected to an actuator for discharging droplets from a nozzle through an adhesive.

The invention according to claim 4 is the bonding substrate according to claim 3,
The substrate body includes an actuator accommodating portion that ejects droplets from a nozzle.

The invention according to claim 5 is the bonding substrate according to any one of claims 2 to 4,
The substrate body has a liquid flow path.

The invention according to claim 6 is the bonding substrate according to claim 4,
The plurality of concave portions and the accommodating portion are formed using any one of sandblasting and wet etching.

The invention according to claim 7 is the bonding substrate according to claim 5,
The plurality of recesses and the liquid flow path are formed using any one of sandblasting and wet etching.

The inkjet head of the invention according to claim 8 is
It has the board | substrate for adhesion as described in any one of Claims 1-7, It is characterized by the above-mentioned.

The substrate supporting method of the invention according to claim 9 is,
It is a board | substrate support method of the board | substrate for adhesion | attachment as described in any one of Claims 1-7,
A first support step of supporting the bonding substrate by engaging a plurality of support members with a plurality of recesses on the other surface opposite to the one surface that is the adhesive application surface of the substrate body of the bonding substrate;
A second support for supporting the bonding substrate by reversing the front and back of the bonding substrate having an adhesive applied to substantially the entire area of the one surface and then engaging a plurality of support members with the plurality of recesses on the one surface. Process,
It is characterized by including.
The substrate supporting method of the invention according to claim 10 is:
Among the front and back surfaces, a substrate supporting method for a bonding substrate in which an adhesive is applied to substantially the entire area of at least one surface and bonded to another substrate,
The bonding substrate is:
A plurality of recesses are provided on the front and back surfaces of the substrate body,
The recesses on the front and back surfaces of the substrate body do not overlap with the recesses on the other surface opposite to the one surface when viewed from either one of the front and back surfaces of the substrate body, and , When the front and back of the substrate body is virtually reversed with the reference line passing through a predetermined position of the substrate body as an axis, it is arranged so as to overlap the concave portion of the other surface,
The substrate support method is as follows:
A first supporting step of supporting the bonding substrate by engaging a plurality of support members with a plurality of recesses on the other surface opposite to the one surface which is the adhesive application surface of the substrate body of the bonding substrate;
A second support for supporting the bonding substrate by reversing the front and back of the bonding substrate having an adhesive applied to substantially the entire area of the one surface and then engaging a plurality of support members with the plurality of recesses on the one surface. Process,
It is characterized by including.
The invention according to claim 11 is the substrate support method according to claim 10,
The substrate main body is bonded to a nozzle substrate having a nozzle and a pressure chamber substrate having a pressure chamber via an adhesive.
The invention according to claim 12 is the substrate support method according to claim 10,
The substrate body is characterized by being bonded to a pressure chamber substrate having a pressure chamber and a wiring substrate having wiring electrically connected to an actuator for discharging droplets from a nozzle through an adhesive.
The invention according to claim 13 is the substrate support method according to claim 12,
The substrate body includes an actuator accommodating portion that ejects droplets from a nozzle.
Invention of Claim 14 in the board | substrate support method as described in any one of Claims 11-13,
The substrate body has a liquid flow path.

  According to the present invention, even if a concave portion for preventing adhesion of an adhesive is formed, strength reduction can be suppressed, and ease of handling can be improved.

It is a fragmentary sectional view showing a schematic structure of an ink jet head of one embodiment to which the present invention is applied. It is a top view which shows the board | substrate for 1st adhesion | attachment which comprises an inkjet head. It is a bottom view which shows the board | substrate for 1st adhesion | attachment which comprises an inkjet head. It is a figure which shows typically the support apparatus which supports the board | substrate for 1st adhesion | attachment. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: The figure which shows the 1st support process which supports the recessed part provided in the surface on the opposite side to the adhesive application surface of the board | substrate for 1st adhesion | attachment by a support member. It is. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is the figure which rotated the front and back by rotating the 1st board | substrate for adhesion | attachment 180 degree | times centering on the reference line. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is a figure which shows the 2nd support process which supports the recessed part provided in the application surface of the adhesive agent of the board | substrate for 1st adhesion | attachment with a support member. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is a figure at the time of joining the application | coating surface of the adhesive agent of a board | substrate for 1st adhesion | attachment, and one surface of a pressure chamber board | substrate. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is a figure at the time of joining the coating surface of the adhesive agent of a board | substrate for 1st adhesion | attachment, and one surface of a nozzle substrate. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is a figure at the time of joining a piezoelectric element to the upper surface of the diaphragm of a pressure chamber board | substrate. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is a figure at the time of joining the application surface of the adhesive agent of a board | substrate for 2nd adhesion | attachment, and one surface of a pressure chamber board | substrate. It is a figure for demonstrating the manufacturing method of an inkjet head, Comprising: It is a figure at the time of making the application | coating surface of the adhesive agent of a 2nd adhesion | attachment board | substrate, and one surface of a wiring board join. It is a top view which shows the modification of the board | substrate for 1st adhesion | attachment which comprises an inkjet head. It is a bottom view which shows the modification of the board | substrate for 1st adhesion | attachment which comprises an inkjet head.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a partial cross-sectional view showing a schematic configuration of an inkjet head 100 according to an embodiment to which the present invention is applied.
The inkjet head 100 is generally provided with a plurality of nozzles 1a, but FIG. 1 schematically shows only the components related to one nozzle 1a.

  As shown in FIG. 1, the inkjet head 100 includes a nozzle substrate 1, a first bonding substrate 2, a pressure chamber substrate 3, a second bonding substrate 4, a piezoelectric element 5, and a wiring substrate 6 stacked in this order. Configured.

The nozzle substrate 1 is located in the lowermost layer of the inkjet head 100. The nozzle substrate 1 is, for example, a silicon substrate. The nozzle substrate 1 is formed with a plurality of nozzles 1a (only one is shown in FIG. 1).
The nozzles 1a are arranged on the nozzle surface so as to have a substantially matrix shape, for example.

The first bonding substrate 2 is bonded to the nozzle substrate 1 having the nozzle 1a and the one surface (the lower surface in FIG. 1 and the like) having the pressure chamber 3c through the adhesive G (see FIG. 4A and the like). It is what is done.
That is, the first bonding substrate 2 is laminated and bonded to the upper surface of the nozzle substrate 1. The first bonding substrate 2 is, for example, a glass substrate. The first bonding substrate 2 is formed with a through hole 2a that communicates with the nozzle 1a of the nozzle substrate 1 and forms an ink flow path.
Further, the pressure chamber substrate 3 is laminated and bonded on the upper surface of the first bonding substrate 2.
The specific configuration of the first bonding substrate 2 will be described later.

The pressure chamber substrate 3 is composed of a pressure chamber layer 3a and a diaphragm 3b.
The pressure chamber layer 3a is laminated on the upper surface of the first bonding substrate 2 and bonded thereto. The pressure chamber layer 3a is made of a silicon substrate. In the pressure chamber layer 3a, a pressure chamber 3c that applies a discharge pressure to the ink discharged from the nozzle 1a is formed so as to penetrate the pressure chamber layer 3a.
The pressure chamber 3c is provided above the through hole 2a and the nozzle 1a, and communicates with the through hole 2a and the nozzle 1a.
The diaphragm 3b is laminated and bonded to the upper surface of the pressure chamber layer 3a so as to cover the opening of the pressure chamber 3c. That is, the diaphragm 3b constitutes the upper wall portion of the pressure chamber 3c. Moreover, for example, an oxide film is formed on the surface of the diaphragm 3b.
A second bonding substrate 4 is laminated and bonded on the upper surface of the vibration plate 3b.

The second bonding substrate 4 is electrically connected to the other surface (the upper surface in FIG. 1 and the like) of the pressure chamber substrate 3 having the pressure chamber 3c and the piezoelectric element 5 as an actuator for discharging ink from the nozzle 1a. It is bonded to the wiring board 6 having the lower wiring 6g via the adhesive G.
That is, the second bonding substrate 4 is laminated on the upper surface of the vibration plate 3b. The second bonding substrate 4 is made of, for example, a metal plate. A space 4 a for accommodating the piezoelectric element 5 is formed inside the second bonding substrate 4. The space 4a is formed above the pressure chamber 3c so as to penetrate the second bonding substrate 4.

  The piezoelectric element 5 is formed in substantially the same plan view shape as the pressure chamber 3c, and is provided at a position facing the pressure chamber 3c with the diaphragm 3b interposed therebetween. The piezoelectric element 5 is an actuator made of PZT (lead zirconium titanate) for deforming the diaphragm 3b. An electrode (not shown) provided on the lower surface of the piezoelectric element 5 is connected to the diaphragm 3b.

Further, the second bonding substrate 4 is formed with a through hole 4b communicating with the communication hole 3d of the pressure chamber substrate 3 independently of the space portion 4a.
A wiring substrate 6 is laminated and bonded on the upper surface of the second bonding substrate 4.
A specific configuration of the second bonding substrate 4 will be described later.

The wiring board 6 includes an interposer 6a that is a silicon substrate, for example. The lower surface of the interposer 6a is covered with, for example, two layers of silicon oxide insulating layers 6b and 6c, and the upper surface is similarly covered with an insulating layer 6d of silicon oxide. Of the two insulating layers 6b and 6c below the interposer 6a, the lower insulating layer 6c is laminated on the upper surface of the second bonding substrate 4 and bonded thereto.
The interposer 6a has a through hole 6e formed in the stacking direction, and a through electrode 6f is inserted into the through hole 6e. One end of a lower wiring 6g extending in the horizontal direction is connected to the lower end of the through electrode 6f. The other end of the lower wiring 6g is provided with a stud bump 6h exposed in the space 4a and connected to a solder 5a provided on an electrode (not shown) on the upper surface of the piezoelectric element 5. The lower wiring 6g is sandwiched and protected by two insulating layers 6b and 6c below the interposer 6a.
The interposer 6a is formed with an inlet 6i that communicates with the through hole 4b of the second bonding substrate 4 so as to penetrate the interposer 6a in the vertical direction.

Further, on the upper surface of the wiring board 6, an upper wiring 6j having one end connected to the upper end of the through electrode 6f and the other end connected to an electrical connector (not shown) via a relay board (not shown) or the like. It is arranged.
An adhesive layer 6k is formed so as to cover the upper wiring 6j on the upper surface of the wiring substrate 6 and the upper surface of the insulating layer 6d of the interposer 6a. The adhesive layer 6k is made of, for example, a photosensitive resin for bonding the inkjet head 100 to a holding plate (not shown). The adhesive layer 6k constitutes a protective layer that protects the upper wiring 6j. The adhesive layer 6k is formed with a through hole 61 that communicates with the inlet 6i.

  The communication hole 3d, the through holes 2a, 4b, 6l and the inlet 6i of the ink jet head 100 constitute an ink flow path, and ink in an ink chamber (not shown) is supplied to the nozzle 1a through the ink flow path.

Next, specific configurations of the first bonding substrate 2 and the second bonding substrate 4 will be described with reference to the drawings.
2A is a plan view showing the first bonding substrate 2, and FIG. 2B is a bottom view showing a state in which the first bonding substrate 2 is rotated 180 degrees around the reference line L as an axis. In addition, let the one surface represented by FIG. 2A in the 1st adhesion | attachment board | substrate 2 be the surface 201, and let the other surface represented by FIG.

As shown in FIGS. 2A and 2B, the first bonding substrate 2 is provided with a plurality of (for example, four) recesses 201a and 202a on the front and back surfaces of the substrate body 200. These recesses 201a and 202a are formed, for example, in portions that do not adhere the adhesive G even when the adhesive G is applied using a transfer roller (not shown) over substantially the entire front and back surfaces of the substrate body 200. belongs to.
Specifically, for example, the substrate body 200 is formed in a substantially rectangular shape, and recesses 201a and 202a each having a predetermined depth are formed near the four corners of the front and back surfaces.

  The recesses 201a and 202a on the front and back surfaces of the substrate body 200 are the other surface on the opposite side to the one surface when viewed from either one of the front and back surfaces of the substrate body 200 (for example, the front surface 201). The substrate main body 200 is virtually inverted with the reference line L as an axis that does not overlap the concave portion (for example, the concave portion 202a of the back surface 202) and passes through a predetermined position (for example, the center C) of the substrate main body 200. Is disposed so as to overlap with the concave portion on the other surface.

That is, the recesses 201a and 202a are arranged so as to be asymmetric with respect to the reference line L passing through a predetermined position on each surface of the substrate body 200.
Specifically, the surface 201 of the substrate body 200 is provided on both sides so as to sandwich a reference line L that passes through the center C of the substrate body 200 and is substantially parallel to two opposing sides (the left and right sides in FIG. 2A). Two recesses 201a are formed. In FIG. 2A, the two left recesses 201a and 201a have substantially the same distance D1 from the reference line L. Similarly, the two right recesses 201a and 201a have substantially the same distance D2 from the reference line L. Further, the distance D1 from the reference line L to each left concave portion 201a is different from the distance D2 from the reference line L to each right concave portion 201a. That is, the four recesses 201a of the surface 201 of the substrate body 200 are not arranged so as to be line symmetric with respect to the reference line L.
In addition, on the back surface 202 of the substrate main body 200, two on each side so as to sandwich a reference line L that passes through the center C of the substrate main body 200 and is substantially parallel to two opposing sides (the left and right sides in FIG. 2B). A recess 202a is formed. 2B, the distance D1 from the reference line L is substantially equal between the two left recesses 202a and 202a, and similarly, the distance D2 from the reference line L is approximately equal between the two recesses 202a and 202a on the right side. Further, the distance D1 from the reference line L to each left concave portion 202a is different from the distance D2 from the reference line L to each right concave portion 202a. That is, the four recesses 202a on the back surface 202 of the substrate body 200 are not arranged so as to be line symmetric with respect to the reference line L.

In addition, the recesses 201a and 202a have substantially the same relative arrangement with respect to the reference line L on the front and back of the substrate body 200.
Specifically, the distance D1 from the reference line L to the left concave portion 201a on the front surface 201 of the substrate body 200 and the distance D1 from the reference line L to the left concave portion 202a on the back surface 202 of the substrate main body 200 are approximately The distance D2 from the reference line L to the right concave portion 201a on the front surface 201 of the substrate body 200 and the distance D2 from the reference line L to the right concave portion 202a on the back surface 202 of the substrate main body 200 are equal to each other. It is almost equal.
2A, the distance from the upper side of the front surface 201 of the substrate body 200 to the upper two recesses 201a, and the distance from the upper side of the back surface 202 of the substrate body 200 to the upper two recesses 202a in FIG. 2B. Are substantially equal, the distance from the lower side of the front surface 201 of the substrate body 200 in FIG. 2A to the lower two recesses 201a, and the lower side of the back surface 202 of the substrate body 200 in FIG. 2B The distance from the lower two recesses 202a to each other is substantially equal.

Further, the recesses 201a and 202a on the front and back surfaces of the substrate body 200 are formed using, for example, sand blasting or wet etching.
Specifically, the first bonding substrate 2 is provided with a through hole 2a constituting an ink flow path (see FIG. 2A). The through hole 2a is formed by sandblasting or wet etching. In doing so, the recesses 201a and 202a are also formed. That is, when forming the through-hole 2 a, first, a recess having a depth of half or more of the thickness of the substrate body 200 is formed on one surface (for example, the front surface 201) of the front and back surfaces of the substrate body 200. At this time, four recesses 201a,..., A predetermined depth from the surface 201 of the substrate body 200 are also formed. Then, the front and back are penetrated by forming a recess having a depth of more than half the thickness of the substrate body 200 at a position corresponding to a recess on the other surface (for example, the back surface) different from the one surface of the substrate body 200. Hole 2a is formed. Further, four concave portions 202a,..., Which are scooped by a predetermined depth from the back surface 202 of the substrate body 200 are also formed.
In addition, since sandblasting and wet etching are known techniques, detailed description thereof is omitted, but can be arbitrarily changed in consideration of, for example, cost and accuracy.

When the substrate main body 200 is rotated 180 degrees around the reference line L, the first bonding substrate 2 configured in this way has four recesses 201a on any one surface (for example, the surface 201) before the rotation. The relative arrangement with respect to the reference line L is substantially equal to the relative arrangement with respect to the reference line L of the four concave portions 202a of the other surface (for example, the back surface 202) after rotation. That is, the four concave portions 201a,... On any one surface (for example, the front surface 201) before the rotation is the other surface (for example, when the front and back surfaces of the substrate body 200 are virtually reversed with the reference line L as an axis. , The back surface 202) overlaps with the recesses 202a.
Further, the arrangement of the recesses 201a and 202a on both the front and back surfaces of the first bonding substrate 2 is substantially the same as the arrangement of the four support members 301 of the support device 300 (see FIG. 3) used for manufacturing the inkjet head 100. ing. That is, when supporting the first bonding substrate 2 by engaging the support member 301 with the plurality of recesses 201a, ... (or the recesses 202a, ...) on one surface of the first bonding substrate 2, The relative arrangement of the recesses 201a and 202a with respect to the support member 301 is substantially equal on both the front and back surfaces of the first bonding substrate 2.

In addition, the structure of the recessed part (illustration omitted) of the board | substrate 4 for 2nd adhesion | attachment is substantially the same as that of the board | substrate 2 of the above-mentioned 1st adhesion | attachment, and detailed description is abbreviate | omitted.
The method of forming the recesses in the second bonding substrate 4 is substantially the same as that of the first bonding substrate 2 described above, and detailed description thereof is omitted, but the piezoelectric of the second bonding substrate 4 is omitted. When the space 4a for accommodating the element 5 and the through hole 4b are formed, a recess is also formed.

Next, a method for manufacturing the inkjet head 100 will be described with reference to FIGS.
FIG. 3 is a diagram schematically showing a support device 300 that supports the first bonding substrate 2. 4A to 4D and FIGS. 5A to 5D are views for explaining a method of manufacturing the inkjet head 100. FIG.

First, as shown in FIG. 4A, the other side opposite to the one surface (the upper surface in FIG. 4A) that is the application surface of the adhesive G of the substrate body 200 of the first bonding substrate 2 placed in a predetermined tray. The four support members 301 of the support device 300 are engaged with the four concave portions 202a of the surface (the lower surface in FIG. 4A) to support the first bonding substrate 2 (first support step). Subsequently, in a state where the first bonding substrate 2 is supported by the support member 301, for example, a transfer roller is used to adhere to substantially the entire area other than the four concave portions 201a on the one surface of the substrate body 200 and the through holes 2a. Agent G is applied.
Here, the adhesive G is applied to substantially the entire area other than the four recesses 201a on the first surface of the substrate body 200 of the first bonding substrate 2 and the through hole 2a, and then supported on the four recesses 202a on the other surface. The four support members 301 of the apparatus 300 may be engaged with each other to support the first bonding substrate 2.

Next, as shown in FIG. 4B, the other surface of the first bonding substrate 2 is sucked using a suction device (not shown), and the first bonding substrate 2 is rotated 180 degrees around the reference line L as an axis. To reverse the front and back. Thereby, the board | substrate 2 for 1st adhesion | attachment is arrange | positioned so that the one surface where the adhesive agent G was apply | coated may become a lower side.
Thereafter, four support members 301,... Of the support device 300 are respectively engaged with four recesses 201a,... On one surface (the lower surface in FIG. 4C) of the first adhesive substrate 2, thereby supporting the first adhesive substrate 2. (Second support step).
The support device 300 has one surface side of the first bonding substrate 2 provided that the arrangement of the four support members 301 is substantially equal to the arrangement of the recesses 201a and 202a on each surface of the first bonding substrate 2. What is supported from the other side and what is supported from the other side may be different or the same.

Next, as shown in FIG. 4D, the other surface of the first bonding substrate 2 is adsorbed, and one surface on which the adhesive G of the first bonding substrate 2 is applied and one surface of the pressure chamber substrate 3 (see FIG. 4D). The upper surface in 4D) is bonded via an adhesive G.
Thereafter, as shown in FIG. 5A, for example, using a transfer roller, after applying the adhesive G to substantially the entire area other than the four concave portions 202 a of the other surface of the first bonding substrate 2 and the through holes 2 a, Rotate 180 degrees. Then, the other surface of the first bonding substrate 2 to which the adhesive G is applied and the one surface (the upper surface in FIG. 5A) of the nozzle substrate 1 are bonded via the adhesive G. Subsequently, as shown in FIG. 5B, the piezoelectric element 5 is bonded to the upper surface of the vibration plate 3 b of the pressure chamber substrate 3.

Next, as shown in FIG. 5C, for example, after applying the adhesive G to substantially the entire area other than the four concave portions on the one surface of the second bonding substrate 4 and the space portions 4a and the through holes 4b using a transfer roller. , Rotate 180 degrees. Then, the one surface on which the adhesive G of the second bonding substrate 4 is applied and the other surface (the upper surface in FIG. 5C) of the pressure chamber substrate 3 are bonded via the adhesive G.
After that, as shown in FIG. 5D, the adhesive G is applied to substantially the entire area other than the four concave portions on the other surface of the second bonding substrate 4 and the space portions 4a and the through holes 4b, and then rotated 180 degrees. Then, the other surface of the second bonding substrate 4 on which the adhesive G is applied and the one surface (the upper surface in FIG. 5D) of the wiring substrate 6 are bonded via the adhesive G.
The method for handling the second bonding substrate 4 is substantially the same as that of the first bonding substrate 2 described above, and a detailed description thereof is omitted. In FIGS. 5A to 5D, illustration of the adhesive between the bonded substrates is omitted.

As described above, according to the inkjet head 100 of the present embodiment, a plurality of recesses 201a and 202a are provided on the front and back surfaces of the substrate body 200 of the first bonding substrate 2 (or the second bonding substrate). The recesses 201a and 202a on the front and back surfaces of the substrate body 200 are the other of the front and back surfaces of the substrate body 200 as viewed from one of the surfaces (for example, the front surface 201). The front and back surfaces of the substrate body 200 are virtually arranged around a reference line L passing through a predetermined position (for example, the center C) of the substrate body 200 without overlapping with a recess portion (for example, the recess portion 202a of the back surface 202). Since the first adhesive substrate 2 is arranged so as to overlap the concave portion of the other surface when reversed, even if a plurality of concave portions 201a and 202a are formed on the front and back surfaces of the first adhesive substrate 2, the first adhesive substrate 2 Recess 201 of , Prevents the thickness is thin becomes too or recess 201a of the portion 202a is formed, and what 202a is communicated, the intensity of the first bonding substrate 2 can be prevented from being excessively lowered.
Further, since the recesses 201a and 202a overlap with the recesses on the other surface when the front and back of the substrate body 200 are virtually reversed with the reference line L as an axis, the substrate body is utilized by using the recesses 201a and 202a. When the 200 is supported from the front and back surfaces, the structure of the support means can be made common. Specifically, a plurality of support members 301 are respectively engaged with a plurality of recesses 202a on the other surface opposite to one surface, which is an adhesive G coating surface of the substrate body 200 of the first bonding substrate 2. And supporting the first bonding substrate 2 and reversing the front and back of the first bonding substrate 2 coated with the adhesive G over substantially the entire area of the first surface. In the step of supporting the first bonding substrate 2 by engaging the support members 301,..., The arrangement of the plurality of support members 301,.
Therefore, even if the recesses 201a and 202a for preventing the adhesive G from adhering to the front and back surfaces of the first bonding substrate 2 are formed, the strength reduction can be suppressed and the ease of handling can be improved. .

  Further, the first bonding substrate 2 in which the substrate body 200 is bonded to the nozzle substrate 1 having the nozzle 1a and the pressure chamber substrate 3 having the pressure chamber 3c via the adhesive G, the pressure chamber substrate 3, and the ink By using the second bonding substrate 4 in which the substrate body is bonded via the adhesive G to the wiring substrate 6 having the lower wiring 6g electrically connected to the piezoelectric element 5 that discharges the nozzle 1a from the nozzle 1a. The strength reduction of the first bonding substrate 2 and the second bonding substrate 4 can be suppressed, the ease of handling can be improved, and the inkjet head 100 can be easily manufactured.

Further, when the through holes 2a constituting the ink flow path are formed in the first bonding substrate 2 by using sandblasting or wet etching, the concave portions 201a and 202a of the first bonding substrate 2 are also efficiently combined. Can be formed.
Further, when the space 4a and the through hole 4b for accommodating the piezoelectric element 5 are formed in the second bonding substrate 4 by using sandblasting or wet etching, the concave portion of the second bonding substrate 4 is also efficiently processed. It can be formed well.

The present invention is not limited to the above-described embodiment, and various improvements and design changes may be made without departing from the spirit of the present invention.
For example, the first bonding substrate 2 and the second bonding substrate 4 are illustrated as the bonding substrates, but this is an example and the present invention is not limited thereto, and the adhesive G is applied to almost the entire area of at least one surface. It can be arbitrarily changed as long as it is configured to be bonded to another substrate.

In the above embodiment, four recesses (recesses 201a and 202a) are provided on each of the front and back surfaces of the bonding substrate (for example, the first bonding substrate 2). The arrangement is an example and is not limited to this.
That is, for example, as shown in FIGS. 6A and 6B, one recess 201 a is formed on the front surface 201 of the substrate body 200, one on each side of the reference line L, and similarly, the reference line is formed on the back surface 202 of the substrate body 200. A configuration in which one recess 202a is formed on each side of L may be employed. Specifically, the arrangement of the recesses 201a and 202a of the substrate body 200 shown in FIGS. 6A and 6B is such that the upper and lower recesses of the four recesses 201a on the surface 201 of the substrate body 200 shown in FIG. 201a is omitted, and among the four recesses 202a on the back surface 202 of the substrate body 200 shown in FIG. 2B, the upper and lower recesses 202a are omitted.
In order to facilitate the support from the front and back surfaces of the substrate body 200, the number and arrangement of the recesses 201a and 202a on each surface can be arbitrarily changed as appropriate.

  In the above-described embodiment, the reference line L serving as a reference for the asymmetrical arrangement of the recesses 201a and 202a passes through the center C of the substrate body 200 and is substantially parallel to two opposing sides (the left and right sides in FIG. 2A). However, the present invention is not limited to this example, and the direction of the reference line L can be arbitrarily changed as appropriate. For example, the reference line L may be a line that passes through the center C of the substrate body 200 and is substantially parallel to two opposing sides (upper and lower sides in FIG. 2A). For example, the substrate body 200 is formed in a square shape. Then, one diagonal line may be used as the reference line L.

  Furthermore, it is needless to say that other specific detailed structures can be appropriately changed.

  In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  INDUSTRIAL APPLICABILITY The present invention can be used for a bonding substrate that is bonded to another substrate, an inkjet head, and a substrate supporting method.

DESCRIPTION OF SYMBOLS 100 Inkjet head 1 Nozzle substrate 1a Nozzle 2 First bonding substrate 200 Substrate body 201a, 202a Recess 3 Pressure chamber substrate 3c Pressure chamber 4 Second bonding substrate 5 Piezoelectric element 6 Wiring substrate 6g Lower wiring L Reference line

Claims (14)

Among the front and back surfaces, an adhesive substrate that is applied to substantially the entire area of at least one surface and is bonded to another substrate,
A plurality of recesses are provided on the front and back surfaces of the substrate body,
The recesses on the front and back surfaces of the substrate body do not overlap with the recesses on the other surface opposite to the one surface when viewed from either one of the front and back surfaces of the substrate body, and , Ri Na are arranged so as to overlap with the recess of the other surface when obtained by inverting the front and back of virtually the substrate body a reference line passing through the predetermined position of the substrate main body as an axis,
The bonding substrate , wherein the plurality of recesses are formed by using one of sandblasting and wet etching .   The bonding substrate according to claim 1, wherein the substrate body is bonded to a nozzle substrate having a nozzle and a pressure chamber substrate having a pressure chamber via an adhesive.   The substrate body is bonded to a pressure chamber substrate having a pressure chamber and a wiring substrate having wiring electrically connected to an actuator for discharging droplets from a nozzle through an adhesive. Item 2. The bonding substrate according to Item 1.   The bonding substrate according to claim 3, wherein the substrate body includes an actuator accommodating portion that discharges droplets from a nozzle.   The said substrate main body has a liquid flow path, The board | substrate for adhesion | attachment as described in any one of Claims 2-4 characterized by the above-mentioned.   The bonding substrate according to claim 4, wherein the plurality of concave portions and the accommodating portion are formed by using any one of sandblasting and wet etching.   The bonding substrate according to claim 5, wherein the plurality of recesses and the liquid channel are formed by using any one of sandblasting and wet etching.   An ink jet head comprising the bonding substrate according to claim 1. It is a board | substrate support method of the board | substrate for adhesion | attachment as described in any one of Claims 1-7,
A first supporting step of supporting the bonding substrate by engaging a plurality of support members with a plurality of recesses on the other surface opposite to the one surface which is the adhesive application surface of the substrate body of the bonding substrate;
A second support for supporting the bonding substrate by reversing the front and back of the bonding substrate having an adhesive applied to substantially the entire area of the one surface and then engaging a plurality of support members with the plurality of recesses on the one surface. Process,
A substrate supporting method characterized by comprising: Among the front and back surfaces, a substrate supporting method for a bonding substrate in which an adhesive is applied to substantially the entire area of at least one surface and bonded to another substrate,
The bonding substrate is:
A plurality of recesses are provided on the front and back surfaces of the substrate body,
The recesses on the front and back surfaces of the substrate body do not overlap with the recesses on the other surface opposite to the one surface when viewed from either one of the front and back surfaces of the substrate body, and , When the front and back of the substrate body is virtually reversed with the reference line passing through a predetermined position of the substrate body as an axis, it is arranged so as to overlap the concave portion of the other surface,
The substrate support method is as follows:
A first supporting step of supporting the bonding substrate by engaging a plurality of support members with a plurality of recesses on the other surface opposite to the one surface which is the adhesive application surface of the substrate body of the bonding substrate;
A second support for supporting the bonding substrate by reversing the front and back of the bonding substrate having an adhesive applied to substantially the entire area of the one surface and then engaging a plurality of support members with the plurality of recesses on the one surface. Process,
A substrate supporting method characterized by comprising: The substrate support method according to claim 10, wherein the substrate body is bonded to a nozzle substrate having a nozzle and a pressure chamber substrate having a pressure chamber via an adhesive. The substrate body is bonded to a pressure chamber substrate having a pressure chamber and a wiring substrate having wiring electrically connected to an actuator for discharging droplets from a nozzle through an adhesive. Item 11. The substrate supporting method according to Item 10. The substrate support method according to claim 12, wherein the substrate main body includes an actuator accommodating portion that discharges droplets from a nozzle. The substrate support method according to claim 11, wherein the substrate body includes a liquid channel.

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