JP6381512B2 - Wire saw deposit remover - Google Patents

Description

  The present invention relates to a wire saw deposit removing device, and more particularly to an apparatus for removing deposits adhering to a wire saw as a result of cutting an object to be cut such as concrete.

  As a device for cutting concrete or the like, a wire saw cutting device is known. A wire saw is made by attaching a large number of beads (diamond beads) with a diamond tip layer on the surface of the base metal to the outer circumference of the wire rope at regular intervals. The wire saw is wound around the workpiece. The object to be cut is cut by rotating at high speed. As for the wire rope used as a core material, the outer periphery is usually protected by a covering material such as rubber or resin, and a steel wire for reinforcement is wound in a coil shape.

  At the time of cutting the object to be cut, the diamond tip layer is pressed against the object to be cut by the tension applied to the wire saw, and the object to be cut is cut off as the wire saw runs and rotates at a high speed. At that time, since the object to be cut is cut (cut) by a large number of diamond tip layers, the work amount (cutting amount) per diamond tip layer is small, and the chips generated by cutting are very small powdery. It becomes. This cutting powder adheres to the surface of the diamond tip layer, the step portion between the diamond tip layer and the base metal, and the step portion between the base metal and the wire rope. Such adhesion of chips causes a reduction in the cutting function of the wire saw, a high temperature of heat generated when the wire saw is cut, and damage or cutting of the wire saw itself.

  In particular, when a wire saw heated to high temperature passes through a drive pulley and a number of driven pulleys provided for running rotation, the heat of the wire saw is transmitted to those pulleys, so the pulley is made of rubber. If it is, the rubber will melt and be easily worn, resulting in a decrease in durability.

  For this reason, conventionally, the wire saw is cooled by applying water. However, cooling with water requires a large amount of cooling water, and further, the water after cooling is mixed with chips to become turbid water, which requires water treatment. In addition, cooling with water can clean the chips adhering to the wire saw to some extent, but since water generates adhesive force on the chips, the adhesion is increased and it cannot be completely removed. Become. These unremoved deposits significantly reduce the cooling effect on the heated wire saw.

  Since cooling with water has the above-described problems, a cooling gas is also blown onto a wire saw (see, for example, Patent Documents 1 and 2). However, since this conventional method blows the cooling gas toward the wire saw from only one direction, it is impossible to remove the entire deposit adhering in an annular shape to the outer periphery of the wire saw, particularly the above-described stepped portion.

  In addition, since the wire saw is rapidly cooled at 0 ° C. to −40 ° C., locally cold portions and warm portions after cutting the workpiece are alternately generated, and the wire saw is kept in tension while being heated. Since stress acts repeatedly, it causes a fatigue strength and a decrease in the overall strength of a wire saw made of steel. These strength reductions shorten the life of the wire saw.

JP-A-8-276418 JP-A-2005-329506

The present invention has been made based on the technical background as described above, and achieves the following object.
The object of the present invention is to reliably remove the deposits attached by cutting the object to be cut, to suppress the temperature rise of the wire saw, and to extend the life thereof. Is to provide.

The present invention employs the following means in order to achieve the above object.
That is, the present invention is an apparatus that removes the adhering matter attached to an endless wire saw that is wound around an object to be cut and cut by rotating the object.
Provided in the traveling path of the wire saw, is an annular one that surrounds the outer periphery of the wire saw, and a header that is partially open in the circumferential direction ;
An air pipe that supplies compressed gas to the header;
A wire saw deposit removing apparatus comprising: a plurality of nozzles attached to the header at intervals in the circumferential direction, and sprayed with the compressed gas toward the traveling wire saw.

More specifically, the wire saw has a plurality of beads each having a cylindrical base metal and a chip layer provided on the surface thereof attached to the outer periphery of the wire rope at regular intervals. An annular step is formed on the
The nozzle may employ a configuration that is attached to the header such that the compressed gas is blown toward the stepped portion at a position a predetermined distance before each bead reaches the header.

The step portion includes a first step portion formed between the base metal and the chip layer, and a second step portion formed between the base metal and the wire rope, and the nozzle Can employ a configuration comprising two nozzle groups that spray compressed gas toward the first step portion and the second step portion.

Further, the header is accommodated in a shielding box having an opening for allowing the wire saw to pass before and after the traveling direction of the wire saw,
The shielding box may be provided with a suction pipe for sucking and discharging the removed deposits.

  According to this invention, since the deposit | attachment adhering by the cutting | disconnection of a to-be-cut | disconnected object can be removed reliably, the temperature rise of a wire saw can be suppressed and the lifetime can be extended.

It is a perspective view which shows embodiment of the deposit removal apparatus of the wire saw by this invention. It is a vertical direction sectional view of the embodiment. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is an enlarged view of the a part of FIG.

  Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view showing an embodiment of a wire saw deposit removing device according to the present invention, FIG. 2 is a vertical sectional view of the same embodiment, FIG. 3 is a sectional view taken along line AA in FIG. 4 is an enlarged view of part a in FIG.

  Although the wire saw 30 is a well-known thing, the structure is first demonstrated roughly. The wire saw 30 is made endless by attaching diamond beads 32 at regular intervals to the outer periphery of a wire rope 31 in which a large number of wires are twisted.

  The wire rope 31 is usually provided with a covering material (not shown) such as rubber or resin for protecting the wire rope 31 on the outer periphery between the diamond beads 32 and 32, and for reinforcing the covering material. A reinforcing steel wire 33 is wound in a coil shape.

  The diamond beads 32 include a cylindrical base metal 34 and a diamond tip layer 35 provided on the outer periphery thereof. The base metal 34 is attached to the wire rope 31 by being fitted and fixed to the wire rope 31. The wire saw 30 configured in this manner is wound around a driving pulley and a number of driven pulleys provided in a cutting device main body (not shown), rotates, and is wound around an object to be cut such as a concrete structure. Cut the cut.

  The diamond tip layer 35 is usually smaller in axial direction than the base metal 34, and therefore, the first step portion is provided between the base metal 34 and the diamond tip layer 35 by attaching the diamond beads 32 to the wire rope 31. 36, and a second stepped portion 37 is formed between the wire rope 31 and the base metal 34, respectively. Needless to say, these stepped portions 36 and 37 are annular.

  The direction indicated by the arrow B in FIG. 2 is the traveling direction of the wire saw 30, and the stepped portion is formed before and after the traveling direction of the wire saw 30 in the diamond beads 32, such as chips generated by cutting the workpiece. The deposits adhere to the step portions 36 and 37 on the front side of the wire saw 30 in the traveling direction.

  The deposit removing device 10 is installed in a traveling path in which the wire saw 30 cuts the object to be cut and returns to the cutting device main body. The removal device 10 includes a shielding box 11, a header 12 accommodated in the shielding box 11, an air supply pipe 13 that supplies compressed gas such as air to the header 12, and a number of nozzles 14 and 15 attached to the header 12. With.

  The shielding box 11 is provided with an opening 16 for allowing the wire saw 30 to pass before and after the traveling direction of the wire saw 30. An air supply pipe 13 that supplies compressed gas to the header 12 is supported by a shielding box 11, and an end portion thereof is connected to the header 12 in the shielding box 11. The other end of the air supply pipe 13 is connected to a compressed gas supply source (not shown). The shielding box 11 has a suction pipe 17 for sucking and discharging the removed deposit, and the suction pipe 17 is connected to a vacuum device (not shown).

  The header 12 has a shape surrounding the wire saw 30, which is an annular shape in this embodiment, and is connected to the air supply pipe 13 so as to traverse the traveling path of the wire saw 30 vertically. The header 12 is provided with an open portion 17 in a part in the circumferential direction so that the wire saw 30 can be easily put in the header 12.

  The wire saw 30 arranged so as to travel in the shielding box 11 through the front and rear openings 16, 16 is enclosed in the header 12, that is, surrounded by the header 12 through the open portion 17 that faces downward in the embodiment. To be arranged. Then, by applying tension to the wire saw 30, the wire saw 30 is positioned so that the axis thereof and the center of the header 12 substantially coincide.

  As shown in FIG. 4, the multiple nozzles 14, 15 spray the compressed gas toward the stepped portions 36, 37 at a position a predetermined distance L before each bead 32 of the wire saw 30 reaches the header 12. Inclined and attached to the header 12. Specifically, the nozzle 14 group is attached to the first step portion 36, and the nozzle 15 group is attached to the header 12 so as to blow compressed gas to the second step portion 37. These nozzles 14 and 15 are attached to the header 12 at intervals in the circumferential direction so as to be alternately arranged.

  The compressed gas blowing angle, that is, the angle formed between the bus line passing through the blowing position of the base metal 34 and the compressed gas flow for the first stepped portion 36, and the bus line passing through the blowing position of the wire rope 31 for the second stepped portion 37 The angles formed by the compressed gas flow, and if these angles are small, the distance L becomes long and the energy of the compressed gas is attenuated. Therefore, the spray angle is preferably 20 degrees to 40 degrees.

  With the removing device 10 configured as described above, the wire saw 30 passes through the shielding box 11 before cutting (cutting) the workpiece and returning to the cutting device main body. In this shielding box 11, the compressed gas from the nozzles 14, 15 is blown onto the wire saw 30, and in particular, the header 12 is provided on the first step portion 36 and the second step portion 37 formed by the attachment of the diamond beads 32. Compressed gas is sprayed at a position that is a predetermined distance L before reaching.

  Since the compressed gas is blown from the nozzles 14 and 15 surrounding the wire saw 30 over almost the entire circumference of the annular first step portion 36 and the second step portion 37, such as chips adhering to the step portions 36 and 37. Deposits are reliably removed. Thereby, deposits, such as a chip, do not laminate and adhere to wire saw 30, and the temperature rise of wire saw 30 can be controlled. Therefore, cutting efficiency can be improved and the life of the wire saw can be extended.

  Moreover, since the periphery of the header 12 is shielded by the shielding box 11 and the removed deposit is discharged from the suction pipe 17, the deposit does not scatter in the vicinity of the cutting work site, and the work environment is kept good. Can do.

  The above embodiment is merely an example, and the present invention can take various aspects. In the said embodiment, although the wire saw 30 which can form the two annular level | step-difference steps parts 36 and 37 by attaching the diamond bead 32 to the wire rope 31, the base metal and the outer periphery of a wire rope are attached to a wire saw. Some of them are mounted so as to be flush with each other, and only one annular step portion is formed, and the removal device of the present invention can be applied even when this type of wire saw is used.

  Alternatively, a plurality of headers 12 and members associated therewith may be installed at intervals in the travel path of the wire saw 30, and compressed gas may be sprayed onto the wire saw 30 at a plurality of locations. Moreover, although the cyclic | annular thing which opened a part of circumferential direction was shown as the header 12, the cyclic | annular thing closed without partially opening a header may be sufficient.

10: Removal device 11: Shielding box 12: Header 13: Air supply pipe 14, 15: Nozzle 16: Opening 17: Suction pipe 30: Wire saw 31: Wire rope 32: Diamond beads 34: Base metal 35: Diamond tip layer 36: First step 37: Second step

Claims (4)

An apparatus for removing attached matter attached to an endless wire saw that is wound around an object to be cut and cut by rotating the object,
Provided in the traveling path of the wire saw, is an annular one that surrounds the outer periphery of the wire saw, and a header that is partially open in the circumferential direction ;
An air pipe that supplies compressed gas to the header;
A wire saw deposit removing device, comprising: a plurality of nozzles attached to the header at intervals in the circumferential direction and spraying the compressed gas toward the wire saw that is running. The wire saw has a plurality of beads each having a cylindrical base metal and a chip layer provided on the surface thereof attached to the outer periphery of the wire rope at regular intervals, and an annular stepped portion is provided for each bead. Formed,
2. The wire saw according to claim 1, wherein the nozzle is attached to the header so as to blow a compressed gas toward the stepped portion at a position a predetermined distance before each bead reaches the header. Deposit removal device. The step portion includes a first step portion formed between the base metal and the chip layer, and a second step portion formed between the base metal and the wire rope. 3. The wire saw deposit removing apparatus according to claim 2, comprising a group of two nozzles for blowing a compressed gas toward each of the first step portion and the second step portion. The header is accommodated in a shielding box having an opening for allowing the wire saw to pass before and after the traveling direction of the wire saw,
The wire saw deposit removing apparatus according to any one of claims 1 to 3, wherein the shielding box is provided with a suction pipe for sucking and discharging the removed deposit.

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