JP6375988B2 - Heat-foamable laminate and foamed paper and heat insulating container using the same - Google Patents
Heat-foamable laminate and foamed paper and heat insulating container using the same Download PDFInfo
- Publication number
- JP6375988B2 JP6375988B2 JP2015031660A JP2015031660A JP6375988B2 JP 6375988 B2 JP6375988 B2 JP 6375988B2 JP 2015031660 A JP2015031660 A JP 2015031660A JP 2015031660 A JP2015031660 A JP 2015031660A JP 6375988 B2 JP6375988 B2 JP 6375988B2
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- Prior art keywords
- density polyethylene
- resin layer
- polyethylene resin
- jis
- weight
- Prior art date
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- 229920001684 low density polyethylene Polymers 0.000 claims description 88
- 239000004702 low-density polyethylene Substances 0.000 claims description 88
- 229920005989 resin Polymers 0.000 claims description 81
- 239000011347 resin Substances 0.000 claims description 81
- 238000000034 method Methods 0.000 claims description 78
- 239000000463 material Substances 0.000 claims description 48
- 239000011342 resin composition Substances 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 37
- 238000005187 foaming Methods 0.000 claims description 34
- 229920005992 thermoplastic resin Polymers 0.000 claims description 33
- 229920013716 polyethylene resin Polymers 0.000 claims description 19
- 238000012360 testing method Methods 0.000 claims description 18
- 229920004889 linear high-density polyethylene Polymers 0.000 claims description 13
- 239000000155 melt Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 229920001903 high density polyethylene Polymers 0.000 claims description 5
- 239000004700 high-density polyethylene Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 127
- 239000000123 paper Substances 0.000 description 59
- 238000001125 extrusion Methods 0.000 description 33
- 239000000758 substrate Substances 0.000 description 21
- 238000010030 laminating Methods 0.000 description 20
- 239000010408 film Substances 0.000 description 19
- -1 polyethylene Polymers 0.000 description 19
- 229920000573 polyethylene Polymers 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000000465 moulding Methods 0.000 description 17
- 239000004698 Polyethylene Substances 0.000 description 15
- 238000002156 mixing Methods 0.000 description 15
- 239000006260 foam Substances 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 210000004027 cell Anatomy 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 238000003475 lamination Methods 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 210000000497 foam cell Anatomy 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 230000003446 memory effect Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000002655 kraft paper Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000000976 ink Substances 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000004088 foaming agent Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012986 chain transfer agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 2
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 235000014347 soups Nutrition 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- MYOQALXKVOJACM-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)C MYOQALXKVOJACM-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- CWJHMZONBMHMEI-UHFFFAOYSA-N 1-tert-butylperoxy-3-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC(OOC(C)(C)C)=C1 CWJHMZONBMHMEI-UHFFFAOYSA-N 0.000 description 1
- SZVMZLJAAGWNPG-UHFFFAOYSA-N 1-tert-butylperoxyoctane Chemical compound CCCCCCCCOOC(C)(C)C SZVMZLJAAGWNPG-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 235000015429 Mirabilis expansa Nutrition 0.000 description 1
- 244000294411 Mirabilis expansa Species 0.000 description 1
- 229920003355 Novatec® Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000004708 Very-low-density polyethylene Substances 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- VZBZCLRLPBEOBO-UHFFFAOYSA-N carboxyoxy octan-3-yl carbonate Chemical compound CCCCCC(CC)OC(=O)OOC(O)=O VZBZCLRLPBEOBO-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- YMRYNEIBKUSWAJ-UHFFFAOYSA-N ditert-butyl benzene-1,3-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OOC(C)(C)C)=C1 YMRYNEIBKUSWAJ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000012171 hot beverage Nutrition 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- RLAWWYSOJDYHDC-BZSNNMDCSA-N lisinopril Chemical compound C([C@H](N[C@@H](CCCCN)C(=O)N1[C@@H](CCC1)C(O)=O)C(O)=O)CC1=CC=CC=C1 RLAWWYSOJDYHDC-BZSNNMDCSA-N 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 235000013536 miso Nutrition 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 235000013557 nattō Nutrition 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229920001866 very low density polyethylene Polymers 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Laminated Bodies (AREA)
Description
本発明は、カップの発泡成形時のホットスリップ性に優れ、更にラミネート成形時の加工性が良好な樹脂組成物を用いた、加熱発泡性積層体、並びにそれを用いた発泡加工紙及び断熱容器に関するものである。 The present invention relates to a heat-foamable laminate using a resin composition excellent in hot slip property at the time of foam molding of a cup and having good workability at the time of laminate molding, and foam-processed paper and a heat insulating container using the same. It is about.
従来、断熱性を有する容器としては、合成樹脂製の発泡体が多く使用されている。また、廃棄し易く印刷適性の良い容器として、紙を複数枚使用した断熱紙容器や、紙基材の両面をポリエチレン樹脂層で積層された材料を使用し、表面のポリエチレン樹脂層を発泡させ、断熱性を付与した紙容器がある。 Conventionally, as a container having heat insulation properties, a synthetic resin foam is often used. In addition, as a container that is easy to dispose of and has good printability, a heat-insulated paper container using multiple sheets of paper, or a material in which both sides of a paper base material are laminated with a polyethylene resin layer, foam the polyethylene resin layer on the surface, There is a paper container with heat insulation.
紙を基材とした技術としては、紙の少なくとも一面にポリエチレンを押出ラミネートし、他面には蒸気圧保持層を形成させ加熱により表面に不規則な凹凸模様を有する加工紙を製造する技術がある(例えば、特許文献1参照)。
また、胴部材の片側壁面に熱可塑性樹脂フィルムがラミネートまたはコーティングされ、加熱によりフィルムを発泡させて発泡断熱層を形成させる技術が提案されている(例えば、特許文献2参照)。
一方、非発泡層に水蒸気の透過を抑制するバリア層を設けることで、発泡層の発泡倍率を向上する方法が考案されており、発泡層の反対側にバリア層としてアルミニウム箔や延伸ポリエステルフィルムからなる層を設け、さらにその上にシーラント層を設けることにより、ヒートシールによるカップ成形が可能でありながら加熱発泡時に水蒸気の透過を防ぐ方法が開示されている(例えば、特許文献3、4参照。)。しかし、この方法においては、層構成がバリア層とシーラント層を設ける必要があるため、コストアップにつながるという問題があった。
As a technology based on paper, there is a technology in which polyethylene is extruded and laminated on at least one surface of the paper, a vapor pressure holding layer is formed on the other surface, and heated to produce a processed paper having an irregular concavo-convex pattern on the surface. Yes (see, for example, Patent Document 1).
In addition, a technique has been proposed in which a thermoplastic resin film is laminated or coated on one side wall surface of a body member, and a foamed heat insulation layer is formed by foaming the film by heating (see, for example, Patent Document 2).
On the other hand, a method of improving the expansion ratio of the foam layer by providing a barrier layer that suppresses the permeation of water vapor in the non-foam layer has been devised. From the aluminum foil or stretched polyester film as a barrier layer on the opposite side of the foam layer There is disclosed a method of preventing water vapor permeation at the time of heat foaming while providing a layer to be formed and further providing a sealant layer thereon, while allowing cup molding by heat sealing (see, for example, Patent Documents 3 and 4). ). However, this method has a problem that the layer structure needs to provide a barrier layer and a sealant layer, leading to an increase in cost.
更に、非発泡層に、発泡層よりも融点の高い、高密度ポリエチレン樹脂を用いて、双方の中間温度で加熱することにより積層体を発泡させる方法が開示されている(例えば、特許文献5〜7参照。)。しかし、いずれの特許文献においても、高密度ポリエチレンの詳細は記載されていない。発泡用積層体の作製は、安定した品質の製品を高効率で得るため、押出ラミネート成形法が広く用いられているが、高密度ポリエチレンは押出ラミネート加工時の加工性が不安定となるため、単体では押出ラミネート成形に用いることができず、高圧法低密度ポリエチレンを混合して用いられている。しかし、この方法で得られた積層体を発泡させ、断熱性を付与した紙容器を製造する工程において、非発泡層のホットスリップ性が劣り、カップ生産時の不良が発生し、生産効率の低下に繋がるという問題があった。 Furthermore, a method is disclosed in which a non-foamed layer is foamed by using a high-density polyethylene resin having a higher melting point than that of the foamed layer and heating at an intermediate temperature between the two (for example, Patent Documents 5 to 5). 7). However, none of the patent documents describes details of high-density polyethylene. For the production of foamed laminates, extrusion laminate molding methods are widely used to obtain stable quality products with high efficiency. However, high-density polyethylene has unstable processability during extrusion lamination, The simple substance cannot be used for extrusion lamination molding, and is used by mixing high pressure method low density polyethylene. However, in the process of producing a paper container with foamed laminates obtained by this method and imparting heat insulation properties, the hot-slip property of the non-foamed layer is inferior, causing defects during cup production, and reducing production efficiency There was a problem of being connected to.
本発明の目的は、上記問題点に鑑み、カップ生産時の発泡工程において、ホットスリップ性に優れ、尚且つラミネート成形時の加工性が良好な加熱発泡性積層体、それを用いた発泡加工紙及び断熱容器を提供することである。 In view of the above problems, an object of the present invention is a heat-foamable laminate having excellent hot-slip properties in a foaming process during cup production and good workability during laminate molding, and foamed paper using the same And providing an insulated container.
本発明者は、上記課題を解決すべく鋭意検討した結果、特定の樹脂組成物を非発泡層形成用に用いた積層体が、発泡工程において、ホットスリップ性に優れ、尚且つラミネート成形時の加工性が良好である事を見出し、本発明を完成させるに至った。 As a result of intensive studies to solve the above problems, the present inventor has a laminate using a specific resin composition for forming a non-foamed layer, has excellent hot-slip properties in the foaming step, and is also suitable for laminate molding. The present inventors have found that the workability is good and have completed the present invention.
すなわち、本発明の第1の発明によれば、 紙を主体とする基材の一方の面に発泡させるための低密度ポリエチレン樹脂層(I)を形成し、基材のもう一方の面に、基材から放出される蒸気等を保持する熱可塑性樹脂層(II)を形成した加熱発泡性積層体であって、該熱可塑性樹脂層(II)を形成する樹脂組成物(II)が、下記(a1)〜(a3)の特性を満足する線状高密度ポリエチレン(a)50重量%未満1重量%以上と、下記(A1)〜(A2)の特性を満足する高圧法低密度ポリエチレン樹脂(A)50重量%未満1重量%以上と、更に、下記(B1)〜(B2)の特性を満足する高圧法低密度ポリエチレン樹脂(B)15重量%〜35重量%とを混合した樹脂組成物であり、かつ、この混合物であるポリエチレン樹脂組成物(II)が下記(II−1)〜(II−2)の特性を満足することを特徴とする加熱発泡性積層体に関するものである。
(a1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜20g/10min
(a2)試験温度23℃JIS−K7112に準拠した密度が0.960g/cm3〜0.970g/cm3
(a3)数平均分子量に対する重量平均分子量の比で表される分子量分布(Mw/Mn)が2以上10以下
(A1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜10g/10min
(A2)試験温度23℃、JIS−K7112に準拠した密度が0.920g/cm3〜0.940g/cm3
(B1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜10g/10min
(B2)試験温度23℃、JIS−K7112に準拠した密度が0.920g/cm3未満
(II−1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1g/10min〜10g/10min
(II−2)試験温度23℃、JIS−K7112に準拠した密度が0.942g/cm3以下
That is, according to the first invention of the present invention, a low density polyethylene resin layer (I) for foaming is formed on one side of a base material mainly composed of paper, and the other side of the base material is A heat-foamable laminate in which a thermoplastic resin layer (II) that retains vapor or the like released from a substrate is formed, and the resin composition (II) that forms the thermoplastic resin layer (II) is: Linear high-density polyethylene satisfying the characteristics of (a1) to (a3) (a) Less than 50% by weight and 1% by weight or more, and high-pressure low-density polyethylene resin satisfying the following characteristics (A1) to (A2) ( A) A resin composition obtained by mixing less than 50% by weight and 1% by weight or more, and further, 15% by weight to 35% by weight of a high-pressure method low density polyethylene resin (B) satisfying the following characteristics (B1) to (B2): And a polyethylene resin composition which is a mixture thereof (II) relates to a heat-foamable laminate characterized by satisfying the following properties (II-1) to (II-2).
(A1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) is 0.1 to 20 g / 10 min.
(A2) Test temperature 23 ° C. Density in accordance with JIS-K7112 is 0.960 g / cm 3 to 0.970 g / cm 3
(A3) The molecular weight distribution (Mw / Mn) represented by the ratio of the weight average molecular weight to the number average molecular weight is 2 or more and 10 or less (A1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) 0.1-10g / 10min
(A2) The test temperature is 23 ° C., and the density according to JIS-K7112 is 0.920 g / cm 3 to 0.940 g / cm 3.
(B1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) is 0.1 to 10 g / 10 min.
(B2) Test temperature 23 ° C., density according to JIS-K7112 is less than 0.920 g / cm 3 (II-1) MFR measured according to JIS K7210 (190 ° C., 21.18 N load) is 0.1 g / 10min-10g / 10min
(II-2) The test temperature is 23 ° C. and the density based on JIS-K7112 is 0.942 g / cm 3 or less.
また、本発明の第2の発明によれば、請求項1記載の高圧法低密度ポリエチレン(A)と高圧法低密度ポリエチレン(B)の混合物からなる高圧法低密度ポリエチレン(b)のメルトマスフローレイト(MFR)が 0.1g/10min〜4.0g/10minである事を特徴とする第1の発明に記載された発泡性積層体用ポリエチレン樹脂組成物に関するものである。 According to the second invention of the present invention, the melt mass flow of the high pressure method low density polyethylene (b) comprising the mixture of the high pressure method low density polyethylene (A) and the high pressure method low density polyethylene (B) according to claim 1. The present invention relates to a polyethylene resin composition for a foamable laminate described in the first invention, characterized in that the rate (MFR) is 0.1 g / 10 min to 4.0 g / 10 min.
更に、本発明の第3の発明によれば、低密度ポリエチレン樹脂層(I)の厚さが20〜100μmであり、線状高密度ポリエチレン(a)と高圧法低密度ポリエチレン(b)で構成される樹脂組成物(II)の厚さが10〜100μmであることを特徴とする第1〜2の発明に記載の発泡性積層体に関するものである。 Furthermore, according to the third aspect of the present invention, the low density polyethylene resin layer (I) has a thickness of 20 to 100 μm, and is composed of linear high density polyethylene (a) and high pressure method low density polyethylene (b). The resin composition (II) having a thickness of 10 to 100 μm relates to the foamable laminate described in the first and second inventions.
また、本発明の第4の発明によれば、低密度ポリエチレン樹脂層(I)の融点Tm(I)と、樹脂層(II)の融点Tm(II)との融点差が、下記の式(1)を満足することを特徴とする第1〜3の発明のいずれか1つに記載の加熱発泡性積層体に関するものである。
Tm(II)−Tm(I)≧10 −−−−−式(1)
According to the fourth aspect of the present invention, the difference in melting point between the melting point Tm (I) of the low density polyethylene resin layer (I) and the melting point Tm (II) of the resin layer (II) is expressed by the following formula ( The present invention relates to a heat-foamable laminate according to any one of the first to third inventions characterized by satisfying 1).
Tm (II) −Tm (I) ≧ 10 −−−−− Formula (1)
更に本発明の第5の発明によれば、第1〜4のいずれか1つの発明に記載の加熱発泡性積層体を加熱して得られ、ポリエチレン樹脂層(I)を発泡して形成された発泡セルの高さが、370μm以上であることを特徴とする発泡加工紙に関するものである。 Furthermore, according to the 5th invention of this invention, it was obtained by heating the heat-foamable laminated body as described in any one of 1st-4th invention, and was formed by foaming the polyethylene resin layer (I). The present invention relates to foamed paper, wherein the height of the foamed cell is 370 μm or more.
また、本発明の第6の発明によれば、本発明の第1〜4の発明に係り、前記発泡性積層体を用いて容器を形成した後、該容器を加熱し、ポリエチレン樹脂層(I)を発泡させて得られた断熱容器に関するものである。 According to a sixth invention of the present invention, according to the first to fourth inventions of the present invention, after forming a container using the foamable laminate, the container is heated to obtain a polyethylene resin layer (I ) Is obtained by foaming.
本発明によれば、紙を主体とする基材の一方の面に発泡させるための高圧法低密度ポリエチレン樹脂層(I)を形成し、基材のもう一方に、基材から放出される蒸気等を保持する非発泡性の熱可塑性樹脂層(II)の製造用原料として、特定のMFRと密度を有する50重量%以下の線状高密度ポリエチレン(a)と、同じくMFRと密度が特定の範囲である高圧法低密度ポリエチレン(A)(B)を特定の比率で混合した(b)からなる樹脂組成物を用いることにより、ラミネート成形時の加工性が良好であり、更に発泡工程における、熱可塑性樹脂層(II)のホットスリップ性に優れ、尚且つ発泡倍率が高く、均一な発泡セルが形成された発泡層を有する加熱発泡性積層体を高速で生産性よく提供できる。 According to the present invention, a high-pressure low-density polyethylene resin layer (I) for foaming is formed on one surface of a base material mainly composed of paper, and vapor released from the base material is formed on the other side of the base material. As a raw material for producing a non-foaming thermoplastic resin layer (II) that holds the like, a linear high-density polyethylene (a) having a specific MFR and density of 50% by weight or less, and also having a specific MFR and density By using a resin composition consisting of (b) mixed with a specific ratio of high-pressure low-density polyethylene (A) (B) that is in the range, the processability at the time of laminate molding is good, and further in the foaming step, A heat-foamable laminate having a foamed layer in which the thermoplastic resin layer (II) is excellent in hot slip property and has a high foaming ratio and in which uniform foamed cells are formed can be provided at high speed and with high productivity.
以下に、本発明の、加熱により発泡させるための低密度ポリエチレン樹脂層(I)、基材から放出される蒸気等を保持する熱可塑性樹脂層(II)、及びそれを用いた発泡性積層体、発泡加工紙、並びに断熱容器・その製造方法について、項目毎に詳細に説明する。尚、本明細書中において、発泡性とは、加熱により発泡する性質を指す。発泡性がよいとは、主に高い発泡倍率を得ることができる状態を指し、紙基材からの蒸気等により積層体の厚さ方向に発泡セルが成長する際の発泡セルの高さが尺度になる。また、発泡セル高さの均一性(外観の良好性)も尺度に取り入れられる。 Below, the low density polyethylene resin layer (I) for foaming by heating of the present invention, the thermoplastic resin layer (II) for retaining vapor released from the substrate, and a foamable laminate using the same The foamed paper, the heat insulating container and the manufacturing method thereof will be described in detail for each item. In the present specification, foaming refers to the property of foaming by heating. Good foaming refers to a state where a high foaming ratio can be obtained mainly, and the height of the foamed cell when the foamed cell grows in the thickness direction of the laminate due to steam from the paper substrate is a measure. become. Also, the uniformity of foam cell height (good appearance) is taken into account.
1.高圧法低密度ポリエチレン樹脂層(I)
本発明の積層体の、加熱により発泡させるための低密度ポリエチレン樹脂層(I)としては、任意の低密度ポリエチレン樹脂、例えば高圧法低密度ポリエチレン樹脂、又は高圧法低密度ポリエチレン樹脂90重量%〜10重量%と線状低密度ポリエチレン樹脂10〜90重量%を適宜混合してなる樹脂組成物からなる樹脂層を用いることができる。特に好ましく用いられる高圧法低密度ポリエチレン樹脂は、例えばエチレンモノマーを原料として、高圧ラジカル重合法により次の条件で製造される。
(i)重合条件
本発明の高圧ラジカル重合法は、酸素、有機過酸化物などのラジカル開始剤の存在下において、超高圧下、塊状または溶液重合によって製造される。
重合温度は100〜300℃、好ましくは120〜280℃、より好ましくは150〜250℃の範囲とする。重合温度が100℃未満では、収率の低下や安定した製品を製造できないおそれがあり、300℃を超える場合には反応が安定せずに、分子量の大きい重合体を得ることが難しくなる。また、重合圧力は50〜400MPa、好ましくは70〜350MPa、より好ましくは100〜300MPaの条件下であり、重合圧力が50MPa未満では充分な分子量のものが得られず加工性や物性の低下が生じ、400MPaを超える場合には安定的な製造運転が行い難いものとなる。
1. High pressure low density polyethylene resin layer (I)
As the low density polyethylene resin layer (I) for foaming by heating of the laminate of the present invention, any low density polyethylene resin, for example, a high pressure method low density polyethylene resin, or a high pressure method low density polyethylene resin 90 wt% to A resin layer made of a resin composition obtained by appropriately mixing 10% by weight and 10 to 90% by weight of a linear low density polyethylene resin can be used. The high-pressure low-density polyethylene resin that is particularly preferably used is produced under the following conditions by, for example, high-pressure radical polymerization using ethylene monomer as a raw material.
(I) Polymerization conditions The high-pressure radical polymerization method of the present invention is produced by bulk or solution polymerization under ultrahigh pressure in the presence of a radical initiator such as oxygen or organic peroxide.
The polymerization temperature is 100 to 300 ° C, preferably 120 to 280 ° C, more preferably 150 to 250 ° C. If the polymerization temperature is less than 100 ° C., the yield may be lowered or a stable product may not be produced. If the polymerization temperature exceeds 300 ° C., the reaction is not stabilized and it is difficult to obtain a polymer having a large molecular weight. The polymerization pressure is 50 to 400 MPa, preferably 70 to 350 MPa, more preferably 100 to 300 MPa. If the polymerization pressure is less than 50 MPa, a product having a sufficient molecular weight cannot be obtained, resulting in deterioration of workability and physical properties. When the pressure exceeds 400 MPa, stable production operation is difficult to perform.
(ii)重合操作
製造に際しては、基本的には通常の高圧法低密度ポリエチレンの製造設備及び技術を利用することができる。反応器の形式としては攪拌翼付のオートクレーブ型、又はチューブラー型のものを使用することができ、必要に応じて複数個の反応器を直列又は並列に接続して多段重合をすることもできる。更に、オートクレーブ型反応器の場合には、反応器内部を複数ゾーンに仕切ることにより、温度分布を設けたり、より厳密な温度制御をすることも可能である。このような操作によって、メモリーエフェクト等を制御することが可能である。
(Ii) Polymerization operation In production, basically, production equipment and technology for ordinary high-pressure low-density polyethylene can be used. As the type of reactor, an autoclave type with a stirring blade or a tubular type can be used, and if necessary, a plurality of reactors can be connected in series or in parallel to perform multistage polymerization. . Furthermore, in the case of an autoclave type reactor, it is possible to provide temperature distribution or to perform more precise temperature control by dividing the inside of the reactor into a plurality of zones. By such an operation, it is possible to control a memory effect or the like.
(iii)ラジカル開始剤
ラジカル開始剤としては、ジクミルパーオキサイド、ベンゾイルパーオキサイド、ジ−
t−ブチルパーオキサイド、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘ
キサン、2,5−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキシン−3,2,5
−ジメチル−2,5−ジ(t−ブチルパーオキシ)ヘキサン、ラウロイルパーオキサイド
、t−ブチルパーオキシベンゾエート、1,1,3,3−テトラメチルブチルハイドロパ
ーオキサイド、ジイソプロピルベンゼンハイドロパーオキサイド、t−ブチルクミルパー
オキサイド、α,α´−ビス(t−ブチルパーオキシ−m−イソプロピル)ベンゼン、ジ
t−ブチルジパーオキシイソフタレート、n−ブチル−4,4−ビス(t−ブチルパーオ
キシ)バレレート、t−ブチルパーオキシベンゾエート、t−ブチルパーオキシアセテー
ト、シクロヘキサノンパーオキサイド、t−ブチルパーオキシラウレート、アセチルパー
オキサイド、i−ブチルパーオキサイド、オクタノイルパーオキサイド、t−ブチルパー
オキシピバレート、t−ブチルハイドロパーオキサイド、クメンハイドロパーオキサイド
、メチルエチルケトンパーオキサイド、ジイソプロピルパーオキシジカーボネート、ジ2
−エチルヘキシルパーオキシジカーボネート、1,1−ビスt−ブチルパーキシシクロヘ
キサン、2,2−ビスt−ブチルパーオキシオクタン、2,2−アゾビスイソブチロニト
リル等の有機過酸化物が挙げられる。これらの中でも、半減期1分を得るための分解温度が、160〜200℃のものが好ましい。
(Iii) Radical initiator As the radical initiator, dicumyl peroxide, benzoyl peroxide, di-
t-butyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3,2, 5
-Dimethyl-2,5-di (t-butylperoxy) hexane, lauroyl peroxide, t-butylperoxybenzoate, 1,1,3,3-tetramethylbutyl hydroperoxide, diisopropylbenzene hydroperoxide, t -Butylcumyl peroxide, α, α'-bis (t-butylperoxy-m-isopropyl) benzene, di-t-butyldiperoxyisophthalate, n-butyl-4,4-bis (t-butylperoxy ) Valerate, t-butyl peroxybenzoate, t-butyl peroxyacetate, cyclohexanone peroxide, t-butyl peroxylaurate, acetyl peroxide, i-butyl peroxide, octanoyl peroxide, t-butyl peroxide Valate, t-butyl Idro peroxide, cumene hydroperoxide, methyl ethyl ketone peroxide, diisopropyl peroxydicarbonate, di 2
-Organic peroxides such as ethylhexyl peroxydicarbonate, 1,1-bis t-butyl peroxycyclohexane, 2,2-bis t-butyl peroxyoctane, 2,2-azobisisobutyronitrile . Among these, a decomposition temperature for obtaining a half-life of 1 minute is preferably 160 to 200 ° C.
(iv)ラジカル発生剤の配合量
ラジカル発生剤の配合量は、特に限定されないが、ポリエチレン100重量部に対し、0.1〜5重量部、好ましくは0.3〜3重量部、より好ましくは0.5〜2重量部の範囲である。また必要ならば、連鎖移動剤等を用いて、分子量調節などを行ってもよい。
(Iv) Compounding amount of radical generator The compounding amount of the radical generator is not particularly limited, but is 0.1 to 5 parts by weight, preferably 0.3 to 3 parts by weight, more preferably 100 parts by weight of polyethylene. The range is 0.5 to 2 parts by weight. If necessary, the molecular weight may be adjusted using a chain transfer agent or the like.
(v)連鎖移動剤
連鎖移動剤としては、水素、プロピレン、ブテン−1、C1〜C20若しくはそれ以上の飽和脂肪族炭化水素又はハロゲン置換炭化水素、例えば、メタン、エタン、プロパン、ブタン、イソブタン、n−ヘキサン、n−ヘプタン、シクロパラフィン類、クロロホルム、四塩化炭素、C1〜C20若しくはそれ以上の飽和脂肪族アルコール、例えばメタノール、エタノール、プロパノール及びイソプロパノール、C1〜C20若しくはそれ以上の飽和脂肪族カルボニル化合物、例えばアセトン及びメチルエチルケトン、並びに芳香族化合物、例えばトルエン、ジエチルベンゼン及びキシレンのような化合物が挙げられる。
(V) Chain transfer agent As the chain transfer agent, hydrogen, propylene, butene-1, C1-C20 or more saturated aliphatic hydrocarbon or halogen-substituted hydrocarbon, for example, methane, ethane, propane, butane, isobutane, n-hexane, n-heptane, cycloparaffins, chloroform, carbon tetrachloride, C1-C20 or higher saturated aliphatic alcohols such as methanol, ethanol, propanol and isopropanol, C1-C20 or higher saturated aliphatic carbonyls Compounds such as acetone and methyl ethyl ketone, and aromatic compounds such as toluene, diethylbenzene and xylene are mentioned.
本発明の積層体において、高圧法低密度ポリエチレン樹脂層(I)に使用する低密度ポリエチレンのJIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜30g/10minの範囲であると、積層体の発泡性に優れるため好ましい。 In the laminate of the present invention, the MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) of the low density polyethylene used for the high pressure method low density polyethylene resin layer (I) is 0.1 to 30 g / 10 min. If it is in the range, it is preferable because the foamability of the laminate is excellent.
本発明の積層体において、高圧法低密度ポリエチレン樹脂層(I)に使用する低密度ポリエチレンの試験温度23℃、JIS−K7112に準拠した密度が、積層体を発泡する際に加える熱量を減少できるため、0.910〜0.940g/cm3の範囲であることが好ましい。 In the laminate of the present invention, the test temperature of the low density polyethylene used for the high pressure method low density polyethylene resin layer (I) is 23 ° C., and the density based on JIS-K7112 can reduce the amount of heat applied when foaming the laminate. Therefore, the range of 0.910 to 0.940 g / cm 3 is preferable.
本発明の積層体において、高圧法低密度ポリエチレン樹脂層(I)に使用する低密度ポリエチレンのメモリーエフェクト(ME)が1.5以上であると積層体の発泡性に優れるため好ましい。 In the laminate of the present invention, it is preferable that the memory effect (ME) of the low-density polyethylene used for the high-pressure method low-density polyethylene resin layer (I) is 1.5 or more because the foam has excellent foamability.
[メモリーエフェクト(ME)の測定]
ここで、メモリーエフェクト(ME)は、JIS K7210で使用されるメルトインデクサー(三鈴エリー(株)製半自動メルトテンション計)を使用し、測定条件をシリンダー温度240℃、定速押出量3g/分の条件にて、以下の条件で測定される。すなわち、装置に2.095mmφのMFR測定用ノズルをセットし、樹脂を炉へ充填する。ピストンを乗せ、0.09g/分の定速押出で5分間保持し、その後3g/分の定速押出とし6分30秒までエアー抜きを行う。6分30秒経過後、3g/分を維持したままストランドをカットし、オリフィス下端からのストランド長さが20mmとなった時点でのストランドの径を、オリフィス下端から15mmの位置でKEYENCE製レーザー寸法測定器(LS−3033)を用いて測定する。測定したストランドの直径をD、ダイスのオリフィス径をD0(2.095mm)として次式によりMEが求められる(ただし、実測値は少数点第2位を四捨五入する)。
ME=D/D0
[Measurement of memory effect (ME)]
Here, for the memory effect (ME), a melt indexer (semi-automatic melt tension meter manufactured by Misuzu Erie Co., Ltd.) used in JIS K7210 was used. The measurement conditions were a cylinder temperature of 240 ° C., a constant speed extrusion rate of 3 g / min. The measurement is performed under the following conditions. That is, a 2.095 mmφ MFR measurement nozzle is set in the apparatus, and the furnace is filled with resin. Place the piston, hold at 0.09 g / min constant speed extrusion for 5 minutes, then perform 3 g / min constant speed extrusion and release air until 6 minutes 30 seconds. After 6 minutes and 30 seconds, the strand was cut while maintaining 3 g / min. The diameter of the strand when the strand length from the lower end of the orifice became 20 mm was measured at 15 mm from the lower end of the orifice. Measure using a measuring instrument (LS-3033). The measured strand diameter is D and the orifice diameter of the die is D0 (2.095 mm), and the ME is obtained by the following formula (however, the measured value is rounded to the second decimal place).
ME = D / D0
本発明において、高圧法低密度ポリエチレン樹脂層(I)は、基材上に、前記高圧ラジカル法低密度ポリエチレン樹脂を用いて、ラミネート成形等で形成されて発泡性積層体として供給され、熱によって紙を主体とする基材から放出される少なくとも水蒸気等によって発泡される。したがって、発泡倍率が高く、均一な発泡セルを形成させるためには、該ポリエチレン樹脂組成物の融点が80〜120℃の範囲、好ましくは、90〜110℃程度の融点範囲内で選択することが望ましい。 In the present invention, the high-pressure method low-density polyethylene resin layer (I) is formed on the base material by using the high-pressure radical method low-density polyethylene resin by laminate molding or the like, and is supplied as a foamable laminate. It is foamed by at least water vapor or the like released from a paper-based substrate. Therefore, in order to form a uniform foam cell with a high expansion ratio, the melting point of the polyethylene resin composition may be selected within the range of 80 to 120 ° C, preferably within the melting point range of about 90 to 110 ° C. desirable.
本発明では、上記の積層体(I)層に使用する低密度ポリエチレンの特性を損ねない範囲で、フェノール系、リン系等の酸化防止剤、金属石鹸等の中和剤、アンチブロッキング剤、滑剤、分散剤、顔料、染料等の着色剤、防曇剤、帯電防止剤、紫外線吸収剤、光安定剤、造核剤などの添加剤を配合してもよい。また、上記の積層体(I)層に使用する低密度ポリエチレンの特性を損ねない範囲で、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸エチル共重合体等のラジカル重合法エチレン(共)重合体、密度0.86g/cm3〜0.91g/cm3未満の超低密度ポリエチレン、密度0.910g/cm3〜0.940g/cm3未満の直鎖状低密度ポリエチレン、密度0.940g/cm3以上の中・高密度ポリエチレン、ポリプロピレン等の他のポリオレフィン系樹脂等を配合しても構わない。 In the present invention, phenolic and phosphorous antioxidants, neutralizing agents such as metal soaps, antiblocking agents, and lubricants within a range that does not impair the properties of the low density polyethylene used in the laminate (I). Additives such as dispersants, colorants such as pigments and dyes, antifogging agents, antistatic agents, ultraviolet absorbers, light stabilizers, and nucleating agents may be blended. In addition, radical polymerization methods such as ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, etc., in the range not impairing the characteristics of the low density polyethylene used in the laminate (I) layer. coalescence, density 0.86g / cm 3 ~0.91g / cm 3 less than the very low density polyethylene, density 0.910g / cm 3 ~0.940g / cm 3 less than the linear low density polyethylene, density 0.940g Other polyolefin resins such as medium / high-density polyethylene and polypropylene / cm 3 or more may be blended.
2.樹脂層(II)用樹脂組成物
本発明の発泡性積層体の層(II)を構成する樹脂組成物は、紙を主体とする基材の一方の面に基材から放出される蒸気等を保持する熱可塑性樹脂層(II)を形成するポリエチレン樹脂組成物であって、下記(a1)〜(a3)の特性を満足する線状高密度ポリエチレン(a)50重量%未満1重量%以上と、該樹脂(a)以外の下記(A1)〜(A2)の特性を満足する高圧法低密度ポリエチレン樹脂(A)50重量%未満1重量%以上、更に、下記(B1)〜(B2)、の特性を満足する高圧法低密度ポリエチレン樹脂(B)15重量%〜35重量%とを混合して得られ、かつ、この混合物であるポリエチレン樹脂組成物(II)が下記(II−1)〜(II−2)の特性を満足することを特徴とする。
(a1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜20g/10min
(a2)試験温度23℃JIS−K7112に準拠した密度が0.960g/cm3〜0.970g/cm3
(a3)数平均分子量に対する重量平均分子量の比で表される分子量分布(Mw/Mn)が2以上10以下
(A1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜10g/10min
(A2)試験温度23℃、JIS−K7112に準拠した密度が0.920g/cm3〜0.940g/cm3
(B1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜10g/10min
(B2)試験温度23℃、JIS−K7112に準拠した密度が0.920g/cm3未満
(II−1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1g/10min〜10g/10min
(II−2)試験温度23℃、JIS−K7112に準拠した密度が0.942g/cm3以下
2. Resin composition for resin layer (II) The resin composition constituting the layer (II) of the foamable laminate of the present invention has a vapor or the like released from the substrate on one side of the substrate mainly composed of paper. A polyethylene resin composition for forming the thermoplastic resin layer (II) to be held, wherein the linear high density polyethylene (a) satisfying the following characteristics (a1) to (a3): less than 50% by weight and 1% by weight or more The high-pressure low-density polyethylene resin (A) satisfying the following characteristics (A1) to (A2) other than the resin (a) (A) less than 50% by weight, 1% by weight or more, and the following (B1) to (B2), The polyethylene resin composition (II), which is obtained by mixing 15% to 35% by weight of the high-pressure method low density polyethylene resin (B) satisfying the above characteristics, is the following (II-1) to The characteristic of (II-2) is satisfied.
(A1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) is 0.1 to 20 g / 10 min.
(A2) Test temperature 23 ° C. Density in accordance with JIS-K7112 is 0.960 g / cm 3 to 0.970 g / cm 3
(A3) The molecular weight distribution (Mw / Mn) represented by the ratio of the weight average molecular weight to the number average molecular weight is 2 or more and 10 or less (A1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) 0.1-10g / 10min
(A2) The test temperature is 23 ° C., and the density according to JIS-K7112 is 0.920 g / cm 3 to 0.940 g / cm 3.
(B1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) is 0.1 to 10 g / 10 min.
(B2) Test temperature 23 ° C., density according to JIS-K7112 is less than 0.920 g / cm 3 (II-1) MFR measured according to JIS K7210 (190 ° C., 21.18 N load) is 0.1 g / 10min-10g / 10min
(II-2) The test temperature is 23 ° C. and the density based on JIS-K7112 is 0.942 g / cm 3 or less.
本発明の熱可塑性樹脂層(II)に用いる線状高密度ポリエチレン(a)のJIS K7210に準拠(190℃、21.18N荷重)して測定した(a−1)MFRは0.1g/10min〜20g/10minの範囲が押出成形時の安定性上好ましい。 The linear high-density polyethylene (a) used for the thermoplastic resin layer (II) of the present invention was measured according to JIS K7210 (190 ° C., 21.18 N load) (a-1) MFR was 0.1 g / 10 min. A range of ˜20 g / 10 min is preferable in terms of stability during extrusion molding.
本発明では、熱可塑性樹脂層(II)に用いる線状高密度ポリエチレン(a)の(a−2)試験温度23℃、JIS−K7112に準拠した密度が、0.960g/cm3〜0.970g/cm3であることが好ましい。密度が0.960g/cm3以上であると、ホットスリップ性が向上し、加熱発泡時に水分が透過しにくく、発泡倍率が良好で耐熱性に優れた積層体が得られるため好ましい。 In the present invention, the linear high-density polyethylene (a) used for the thermoplastic resin layer (II) has a (a-2) test temperature of 23 ° C. and a density according to JIS-K7112 of 0.960 g / cm 3 to 0.00. It is preferably 970 g / cm 3 . A density of 0.960 g / cm 3 or more is preferred because hot slip properties are improved, moisture hardly permeates during foaming by heating, and a laminate having good expansion ratio and excellent heat resistance can be obtained.
また、本発明の樹脂組成物(II)に使用する線状高密度ポリエチレン(a)は、(a−3)ゲル・パーミエーション・クロマトグラフィー(GPC)装置で測定した、重量平均分子量(Mw)と数平均分子量(Mn)の比(Mw/Mn)が2〜10の範囲内であることが、成形品の強度と安定した押出成形性を両立させることが容易であることから好ましい。 The linear high-density polyethylene (a) used in the resin composition (II) of the present invention has a weight average molecular weight (Mw) measured by (a-3) gel permeation chromatography (GPC) apparatus. It is preferable that the ratio (Mw / Mn) of the number average molecular weight (Mn) is in the range of 2 to 10 because it is easy to achieve both the strength of the molded product and stable extrusion moldability.
本発明では、発泡性積層体用樹脂組成物(II)に用いる線状高密度ポリエチレン(a)はエチレンから導かれる繰り返し単位からなる、またはエチレンから導かれる繰り返し単位と炭素数3〜8のα−オレフィンから導かれる繰り返し単位からなるエチレン系重合体を含むものである。α − オレフィンとしては、直鎖または分岐鎖状の炭素数3 〜 2 0 のオレフィンが好ましく、例えば、プロピレン、1 − ブテン、1 − ペンテン、1 − ヘキセン、4 − メチル− 1 − ペンテン、1 − オクテン、1 − デセンを挙げることができる。またそれらを2種類以上組み合わせて使用しても良い。これら共重合体の中でも、エチレン・1 − ブテン共重合体、エチレン・1 − ヘキセン共重合体、エチレン・4 − メチル− 1 − ペンテン共重合体、エチレン・1 − オクテン共重合体が経済性の観点から好適である。
本発明に係る発泡性積層体用樹脂組成物(II)に用いる線状高密度ポリエチレン(a)は特に触媒、プロセス等に限定されるものではなく、成書『ポリエチレン技術読本』( 松浦一雄・三上尚孝編著、工業調査会刊行、2 0 0 1 年) のp . 1 2 3 〜 1 6 0 に記載されている方法により製造することが可能である。即ち、チーグラー系触媒、シングルサイト系触媒等や、スラリー法、溶液法、気相法の各重合様式にて、各種重合器、重合条件、触媒にて製造することが可能である。より具体的には、(II)層に使用する線状ポリエチレン(a)を製造するためには、好ましくは特公昭5 5 − 1 4 0 8 4 号公報などの特定のチーグラー系触媒あるいはシングルサイト系触媒を用いて重合温度、圧力等の重合条件、助触媒等をコントロールすることにより好適に製造可能である。
In the present invention, the linear high-density polyethylene (a) used for the resin composition (II) for the foamable laminate is composed of repeating units derived from ethylene, or repeating units derived from ethylene and α having 3 to 8 carbon atoms. -It contains an ethylene-based polymer composed of repeating units derived from olefins. The α-olefin is preferably a linear or branched olefin having 3 to 20 carbon atoms, such as propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1- Mention may be made of octene, 1-decene. Two or more of them may be used in combination. Among these copolymers, ethylene-1-butene copolymer, ethylene-1-hexene copolymer, ethylene-4-methyl-1-pentene copolymer, and ethylene-1-octene copolymer are economical. It is preferable from the viewpoint.
The linear high-density polyethylene (a) used for the resin composition (II) for the foamable laminate according to the present invention is not particularly limited to the catalyst, the process, etc., and the book “Polyethylene Technology Reader” (Kazuo Matsuura, By Mikami Naotaka, published by the Industrial Research Committee, 2001 It can be produced by the method described in 1 2 3 to 1 6 0. That is, it can be produced with various polymerization apparatuses, polymerization conditions, and catalysts in each polymerization mode of Ziegler catalyst, single site catalyst, etc., slurry method, solution method, and gas phase method. More specifically, in order to produce the linear polyethylene (a) used for the layer (II), a specific Ziegler-based catalyst or single site such as that described in Japanese Patent Publication No. 555-1440. It can be suitably produced by controlling polymerization conditions such as polymerization temperature and pressure, cocatalyst and the like using a system catalyst.
本発明の熱可塑性樹脂層(II)に用いる高圧法低密度ポリエチレン(b)は、少なくとも、下記の(A)及び(B)の2種類の高圧法低密度ポリエチレンを用いる。
すなわち、密度が0.920g/cm3〜0.940g/cm3 、メルトマスフローレイト(MFR)が0.1g/10min〜10g/10min 、層(II)を構成する樹脂組成物中の含有量が50重量%未満1重量%以上の低密度ポリエチレン(A) と、密度が0.920g/cm3 未満、好ましくは、密度0.918g/cm3 以下、好ましくは0.900g/cm3 以上、メルトマスフローレイトが0.1g/10min〜10g/10min 、層(II)を構成する樹脂組成物中の含有量が15重量%〜35重量%の低密度 ポリエチレン(B)からなることが好ましい。
低密度ポリエチレン(A)の密度が0.920g/cm3〜0.940g/cm3、メルトマスフローレイト(MFR)が0.1g/10min〜10g/10min であり、含有割合が層(II)を構成する樹脂組成物中50重量%未満1重量%以上であると、押出成形時の安定性が向上し、更にホットスリップ性も優れる事から、好ましい。又、低密度 ポリエチレン(B)が、密度 0.920g/cm3未満、メルトマスフローレイト 0.1g/10min〜10g/10min であり、添加割合が樹脂組成物中15重量%〜35重量%であれば、押出成形時の安定性が向上する事から、好ましい。
The high-pressure low-density polyethylene (b) used for the thermoplastic resin layer (II) of the present invention uses at least the following two types of high-pressure low-density polyethylene (A) and (B).
That is, the density in the resin composition constituting the layer (II) is 0.920 g / cm 3 to 0.940 g / cm 3 , the melt mass flow rate (MFR) is 0.1 g / 10 min to 10 g / 10 min. and 1 wt% to less than 50 wt% low density polyethylene (a), a density of less than 0.920 g / cm 3, preferably a density 0.918 g / cm 3 or less, preferably 0.900 g / cm 3 or more, the melt It is preferably made of low-density polyethylene (B) having a mass flow rate of 0.1 g / 10 min to 10 g / 10 min and a content in the resin composition constituting the layer (II) of 15 wt% to 35 wt%.
The density of the low density polyethylene (A) is 0.920 g / cm 3 to 0.940 g / cm 3 , the melt mass flow rate (MFR) is 0.1 g / 10 min to 10 g / 10 min, and the content ratio is the layer (II). When it is less than 50% by weight and 1% by weight or more in the resin composition to be constituted, stability during extrusion is improved, and hot slip property is also excellent, which is preferable. The low density polyethylene (B) has a density of less than 0.920 g / cm 3 , a melt mass flow rate of 0.1 g / 10 min to 10 g / 10 min, and an addition ratio of 15 wt% to 35 wt% in the resin composition. For example, the stability during extrusion molding is improved, which is preferable.
本発明では、線状高密度ポリエチレン(a)と (A)及び(B)の少なくとも2種類からなる高圧法低密度ポリエチレン(b)の混合物である発泡性積層体用樹脂組成物(II)の密度が 0.942g/cm3以下、メルトマスフローレイトが0.1g/10min〜10g/10minである事が好ましい。発泡性積層体用樹脂組成物(II)の密度が 0.942g/cm3以下 メルトマスフローレイトが0.1g/10min〜10g/10minであれば、押出成形時の安定性が向上し、更にホットスリップ性も優れる事から、好ましい。 In the present invention, the resin composition for expandable laminate (II), which is a mixture of linear high-density polyethylene (a) and high-pressure method low-density polyethylene (b) comprising at least two types of (A) and (B) It is preferable that the density is 0.942 g / cm 3 or less and the melt mass flow rate is 0.1 g / 10 min to 10 g / 10 min. When the density of the resin composition (II) for the foamable laminate is 0.942 g / cm 3 or less and the melt mass flow rate is 0.1 g / 10 min to 10 g / 10 min, stability during extrusion molding is improved, and hot Since slip property is also excellent, it is preferable.
本発明では、熱可塑性樹脂組成物(II)に用いる高圧法低密度ポリエチレン(b)は、メルトマスフローレイト(MFR)が 0.1g/10min〜4.0g/10minである事が好ましい。メルトマスフローレイト(MFR)が 0.1g/10min〜4.0g/10minであれば、押出成形時の安定性が向上し、更にホットスリップ性も優れる事から、好ましい。 In the present invention, the high pressure low density polyethylene (b) used for the thermoplastic resin composition (II) preferably has a melt mass flow rate (MFR) of 0.1 g / 10 min to 4.0 g / 10 min. A melt mass flow rate (MFR) of 0.1 g / 10 min to 4.0 g / 10 min is preferred because stability during extrusion is improved and hot slip properties are also excellent.
上記樹脂組成物(II)には、必要に応じて、上記熱可塑性樹脂の特性を損ねない範囲で、フェノール系、リン系等の酸化防止剤、金属石鹸等の中和剤、アンチブロッキング剤、滑剤、分散剤、顔料、染料等の着色剤、防曇剤、帯電防止剤、紫外線吸収剤、光安定剤、造核剤などの添加剤を配合してもよい。 In the resin composition (II), if necessary, a phenolic or phosphorus antioxidant, a neutralizer such as a metal soap, an antiblocking agent, and the like within a range not impairing the properties of the thermoplastic resin. Additives such as lubricants, dispersants, colorants such as pigments and dyes, antifogging agents, antistatic agents, ultraviolet absorbers, light stabilizers, and nucleating agents may be blended.
[熱可塑性樹脂組成物(II)の配合率]
線状高密度ポリエチレン(a)の配合割合は、50重量%未満1重量%以上であり、好ましくは45重量%以下である。線状ポリエチレン(a)の配合割合が、50重量%以上である場合は押出ラミネート成形時の加工性が悪化する等の不都合が生じるため、好ましくない。高圧法低密度ポリエチレン樹脂(A)の配合割合は、50重量%未満1重量%以上であり、好ましくは45重量%以下である。高圧法低密度ポリエチレン樹脂(A)の配合割合が、50重量%以上である場合は押出ラミネート成形時の加工性が悪化する等の不都合が生じるため、好ましくない。高圧法低密度ポリエチレン樹脂(B)の配合割合は、15重量%〜35重量%である。高圧法低密度ポリエチレン樹脂(B)の配合割合が15重量%未満の場合は押出ラミネート成形時の加工性が悪化する等の不都合が生じるため、好ましくない。高圧法低密度ポリエチレン樹脂(B)の配合割合が35重量%を超える場合は、ホットスリップ性が劣るため、好ましくない。
[Blend ratio of thermoplastic resin composition (II)]
The blending ratio of the linear high-density polyethylene (a) is less than 50% by weight and 1% by weight or more, preferably 45% by weight or less. When the blending ratio of the linear polyethylene (a) is 50% by weight or more, it is not preferable because problems such as deterioration of workability during extrusion lamination molding occur. The blending ratio of the high-pressure method low-density polyethylene resin (A) is less than 50% by weight and 1% by weight or more, preferably 45% by weight or less. When the blending ratio of the high-pressure method low-density polyethylene resin (A) is 50% by weight or more, it is not preferable because inconvenience such as deterioration of workability at the time of extrusion lamination molding occurs. The compounding ratio of the high-pressure method low-density polyethylene resin (B) is 15% by weight to 35% by weight. When the blending ratio of the high-pressure method low-density polyethylene resin (B) is less than 15% by weight, disadvantages such as deterioration in workability at the time of extrusion lamination molding occur, which is not preferable. When the blending ratio of the high-pressure method low-density polyethylene resin (B) exceeds 35% by weight, the hot slip property is inferior, which is not preferable.
3.発泡性積層体とその製造
本発明の発泡性積層体は、少なくとも、紙を主体とする基材の一方の面に、押出ラミネート法等により高圧法低密度ポリエチレン樹脂層(I)を形成した積層体であって、好ましくは上記基材のもう一方の面に、基材から放出される蒸気等を保持する熱可塑性樹脂層(II)を形成した積層体であって、基材から放出される少なくとも水蒸気等によって高圧法低密度ポリエチレン樹脂層(I)を発泡させうる積層体であるが、本発明の効果を損なわない範囲において該積層体の最外層、該層間等に他の層があってもよい。
3. Expandable laminate and production thereof The expandable laminate of the present invention is a laminate in which a high-pressure low-density polyethylene resin layer (I) is formed on at least one surface of a paper-based substrate by an extrusion lamination method or the like. A laminated body in which a thermoplastic resin layer (II) that holds vapor released from the base material is formed on the other surface of the base material, preferably released from the base material Although it is a laminate capable of foaming the high-pressure low-density polyethylene resin layer (I) with at least water vapor or the like, there are other layers in the outermost layer, the interlayer, etc. of the laminate as long as the effects of the present invention are not impaired. Also good.
高圧法低密度ポリエチレン樹脂層(I)の厚みは、特に限定されないが、発泡層厚みを高くすることができるという点で、通例では10〜100μm、特に20〜100μmの範囲で選択されることが好ましい。熱可塑性樹脂層(II)の厚みが、10μm未満では、基材から放出される蒸気等を十分に保持することができず、発泡層厚みを十分に高くすることができないおそれが生じる。また100μmを超える場合には、それ以上の効果の向上が期待されず、経済的デメリットが大きくなるおそれが生じる。 The thickness of the high-pressure method low-density polyethylene resin layer (I) is not particularly limited, but is usually selected in the range of 10 to 100 μm, particularly 20 to 100 μm in that the thickness of the foamed layer can be increased. preferable. If the thickness of the thermoplastic resin layer (II) is less than 10 μm, the vapor released from the base material cannot be sufficiently retained, and the foam layer thickness may not be sufficiently increased. On the other hand, when the thickness exceeds 100 μm, further improvement of the effect is not expected, and the economic disadvantage may increase.
4.紙を主体とする基材
本発明において紙を主体とする基材とは、(i)紙、あるいは、(ii)予め、加熱により揮発性ガスを発生する物質を紙にコーティングした基材、ラミネート成形過程で紙と高圧法低密度ポリエチレン樹脂層(I)間に加熱により揮発性ガスを発生する物質をコーティングしたもの、(iii)紙を主体とする基材中へ加熱により揮発性ガスを発生する物質を配合した基材のいずれかを意味するものである。本発明においては、主に紙に含まれる水分が加熱によって発生される水蒸気の作用によって基材表面の高圧法低密度ポリエチレン樹脂層(I)を発泡させるものであるが、加熱分解によって発生する揮発ガスによって基材表面の高圧法低密度ポリエチレン樹脂層(I)を発泡させることができるものであれば良く、特に限定されるものではない。上記、(i)紙としては、上質紙、クラフト紙、アート紙、再生紙、合成紙、樹脂とゼオライト、炭酸カルシウム等の無機物含有するシート等が挙げられる。該紙の坪量は100〜400g/m2、特に150〜350g/m2が好ましい。また、紙の含水率は4〜15%、好ましくは5〜13%、より好ましくは5〜12%程度のものが例示される。
また、(ii)紙に、熱により揮発性ガスを発生する物質をコーティングした基材としては、紙に溶剤系インキや水溶性のインキ、塗料、接着剤をコーティングした基材等が挙げられる。例えば特開2000−238225号公報等にみられるように、基材と高圧法低密度ポリエチレン樹脂層(I)間に発泡性物質を添加した接着剤層を設ければ、加熱によって発生する発泡性物質から発生する揮発性ガスによって、基材表面のポリエチレン樹脂層(I)の発泡を促進させることが可能である。
また、(iii)基材中に、加熱により揮発性ガスを発生する物質を配合した基材としては、基材中に揮発性ガスを発生する物質としての無機または有機の発泡剤、含水ポリマー、発泡剤内包のマイクロカプセル等が配合された基材であって、例えば特開2002−145239号公報等にみられるように、抄紙工程において熱発泡性の発泡剤を添加して抄紙した紙、あるいは紙に発泡剤を内包するマイクロカプセル、含水させた吸水性ポリマー等を配合した基材等などが挙げられる。さらに、紙を主体とする基材には、パルプ紙や合成紙等の紙にインクなどで絵や文字、模様などを印刷することもできる。
4). The base material mainly composed of paper In the present invention, the base material mainly composed of paper is (i) paper, or (ii) a base material in which paper is previously coated with a substance that generates volatile gas by heating, laminate In the molding process, a material that generates volatile gas by heating is coated between paper and high-pressure low-density polyethylene resin layer (I), (iii) volatile gas is generated by heating into a paper-based substrate It means one of the base materials blended with the substance to be treated. In the present invention, the moisture contained in the paper is used to foam the high-pressure low-density polyethylene resin layer (I) on the substrate surface by the action of water vapor generated by heating. It is not particularly limited as long as it can foam the high-pressure low-density polyethylene resin layer (I) on the surface of the base material with gas. Examples of the above (i) paper include high-quality paper, craft paper, art paper, recycled paper, synthetic paper, sheets containing inorganic substances such as resin and zeolite, and calcium carbonate. The basis weight of the paper is preferably 100 to 400 g / m 2 , particularly 150 to 350 g / m 2 . The water content of the paper is 4 to 15%, preferably 5 to 13%, more preferably about 5 to 12%.
Examples of the base material obtained by coating (ii) paper with a substance that generates volatile gas by heat include a base material obtained by coating paper with solvent-based ink, water-soluble ink, paint, or adhesive. For example, as shown in JP-A-2000-238225 and the like, if an adhesive layer to which a foamable substance is added is provided between the base material and the high-pressure method low-density polyethylene resin layer (I), the foamability generated by heating It is possible to promote foaming of the polyethylene resin layer (I) on the surface of the base material by the volatile gas generated from the substance.
Further, (iii) as a base material in which a substance that generates volatile gas by heating is mixed in the base material, an inorganic or organic foaming agent, a water-containing polymer as a substance that generates volatile gas in the base material, A base material in which microcapsules or the like encapsulating a foaming agent are blended, and a paper made by adding a thermal foaming foaming agent in a papermaking process, as seen in, for example, JP-A-2002-145239, or Examples thereof include microcapsules that encapsulate a foaming agent in paper, and substrates that contain water-absorbing polymers containing water. Furthermore, a picture, a character, a pattern, etc. can also be printed on paper, such as a pulp paper and a synthetic paper, with an ink etc. on the base material mainly made of paper.
本発明の発泡積層体においては、本発明の効果を損なわない範囲において、該層間、あるいはその内及び/又は外層等に他の層を設けてもよく、例えば、外側から、{ポリエチレンフィルム層/高圧法低密度ポリエチレン樹脂層(I)/基材/熱可塑性樹脂組成物層(II)}、{ポリエチレンフィルム層/バリア層/接着層/高圧法低密度ポリエチレン樹脂層(I)/基材/熱可塑性樹脂組成物層(II)}、高圧法低密度ポリエチレン樹脂層(I)/基材/樹脂組成物層(II)/バリア層/熱可塑性樹脂組成物層(II)}のように基材と高圧法低密度ポリエチレン樹脂層(I)または、さらに熱可塑性樹脂組成物層(II)を設けた積層体の内及び/又は外層、あるいは該層間に一層または複数層のフィルム層、装飾層、補強層、接着剤層、バリア層等を設けてもよい。
また、必要に応じて印刷等を施しても良い。印刷は、部分的または全面的に着色インキで印刷してもよい。また、必要に応じて発泡性インキを使用して、部分的または全面的に発泡部位を設けてもよい。印刷の位置、印刷面積の大小、印刷の方法、使用されるインキなどは、従来公知の技術を適宜選択して用いることができる。
In the foamed laminate of the present invention, other layers may be provided in the interlayer or the inner layer and / or the outer layer, etc. within a range not impairing the effects of the present invention. For example, {polyethylene film layer / High pressure method low density polyethylene resin layer (I) / base material / thermoplastic resin composition layer (II)}, {polyethylene film layer / barrier layer / adhesion layer / high pressure method low density polyethylene resin layer (I) / base material / Thermoplastic resin composition layer (II)}, high pressure method low density polyethylene resin layer (I) / base material / resin composition layer (II) / barrier layer / thermoplastic resin composition layer (II)} The inner layer and / or the outer layer of the laminate provided with the material and the high-pressure method low-density polyethylene resin layer (I) or the thermoplastic resin composition layer (II), or one or more film layers or decorative layers between the layers , Reinforcement layer, contact Adhesive layer may be provided a barrier layer or the like.
Moreover, you may print etc. as needed. The printing may be performed partially or entirely with colored ink. Moreover, you may provide a foaming site | part partially or entirely using a foamable ink as needed. For the printing position, the size of the printing area, the printing method, the ink used, etc., a conventionally known technique can be appropriately selected and used.
上記装飾層としては、印刷された紙、フィルム、不織布、織布等が挙げられる。
また補強層とは、基材に積層された高圧法低密度ポリエチレン樹脂層(I)が加熱によって発泡されるときに発泡層が破裂しないように、発泡性ポリエチレン樹脂層(I)の外層にポリエチレン樹脂フィルムなどを積層して発泡層の過度の発泡による破裂防止や、不ぞろいの発泡セルを均一に矯正する、あるいはフィルム、不織布等を積層して、機械的強度を持たせるなどの役割を果たすものである。樹脂としては、特に限定されるものではなく、ポリエチレン、ポリプロピレン等のポリオレフィン系樹脂、ポリアミド系樹脂、ポリエステル系樹脂等でよい。
また、接着剤層を形成する樹脂としては、エチレンと不飽和カルボン酸またはその誘導体との共重合体、ポリオレフィン樹脂に不飽和カルボン酸等をグラフトした変性ポリオレフィン樹脂、エチレン−酢酸ビニル共重合体等ホットメルト、通常の接着剤等が挙げられる。 またバリア層を形成する樹脂としては、ポリアミド系樹脂、ポリエステル系樹脂、エチレン−酢酸ビニル共重合体鹸化物(EVOH)、ポリ塩化ビニリデン系樹脂、ポリカーボネート系樹脂、延伸ポリプロピレン(OPP)、延伸ポリエステル(OPET)、延伸ポリアミド、アルミナ蒸着フィルム、シリカ蒸着フィルム等の無機酸化物の蒸着フィルム、アルミ蒸着等の金属蒸着フィルム、金属箔等が挙げられる。
Examples of the decorative layer include printed paper, film, nonwoven fabric, and woven fabric.
The reinforcing layer is a polyethylene layer formed on the outer layer of the foamable polyethylene resin layer (I) so that the foamed layer does not rupture when the high-pressure low-density polyethylene resin layer (I) laminated on the substrate is foamed by heating. Resin film is laminated to prevent the foam layer from bursting due to excessive foaming, uneven foam cells are uniformly corrected, or film, nonwoven fabric, etc. are laminated to give mechanical strength. It is. The resin is not particularly limited, and may be a polyolefin resin such as polyethylene or polypropylene, a polyamide resin, a polyester resin, or the like.
Examples of the resin forming the adhesive layer include a copolymer of ethylene and an unsaturated carboxylic acid or a derivative thereof, a modified polyolefin resin obtained by grafting an unsaturated carboxylic acid on a polyolefin resin, an ethylene-vinyl acetate copolymer, etc. A hot melt, a normal adhesive, etc. are mentioned. As the resin for forming the barrier layer, polyamide resin, polyester resin, ethylene-vinyl acetate copolymer saponified product (EVOH), polyvinylidene chloride resin, polycarbonate resin, stretched polypropylene (OPP), stretched polyester ( OPET), stretched polyamide, alumina vapor deposition film, inorganic oxide vapor deposition film such as silica vapor deposition film, metal vapor deposition film such as aluminum vapor deposition, and metal foil.
5.発泡性積層体の製造方法
本発明において、発泡性積層体を製造する方法としては、紙を主体とする基材の片面へ高圧法低密度ポリエチレン樹脂層(I)を積層し、あるいは他方の面に樹脂組成物層(II)をさらに積層できる方法であれば特に制約はないが、溶融樹脂をダイレクトに積層する押出ラミネート加工、事前にフィルムとしたものを積層するサンドラミネート加工、ドライラミネート加工する方法等が挙げられる。
5. Method for producing foamable laminate In the present invention, the foamable laminate is produced by laminating the high-pressure low-density polyethylene resin layer (I) on one side of a paper-based substrate, or the other side. There is no particular limitation as long as the method can further laminate the resin composition layer (II), but an extrusion laminating process for directly laminating a molten resin, a sand laminating process for laminating a film in advance, and a dry laminating process. Methods and the like.
押出ラミネート加工は、Tダイより押出した溶融樹脂膜を、基材上に連続的に被覆・圧着する方法で、被覆と接着を同時に行う成形加工法である。また、サンドラミネート加工は、紙と積層するフィルムの間に溶融した樹脂を流し込んで、この溶融した樹脂が接着剤のような働きをして接着・積層する方法であり、ドライラミネート加工は、紙と積層するフィルムを貼合する接着剤および/または接着剤の塗布ロール付近の雰囲気湿度を除湿するか、前記接着剤および/または接着剤の塗布ロールの温度を温熱するか、フィルムシートの貼合面を乾燥させる方法である。
サンドラミネート加工、ドライラミネート加工においては、本発明に用いる紙を主体とする基材の熱可塑性樹脂組成物層(II)が形成される側で、基材と熱可塑性樹脂組成物層(II)との間に、バリア性を向上させるため、上記アルミ箔、ポリエステル系フィルム、各種バリア性フィルム等を積層させることが容易である。
Extrusion laminating is a molding method in which a molten resin film extruded from a T-die is continuously coated and pressure-bonded on a substrate, and coating and adhesion are performed simultaneously. Sand laminating is a method in which a molten resin is poured between paper and a film to be laminated, and the molten resin acts as an adhesive to bond and laminate. Dehumidify the ambient humidity in the vicinity of the adhesive and / or adhesive application roll that bonds the film to be laminated with, or heat the temperature of the adhesive and / or adhesive application roll, or paste the film sheet This is a method of drying the surface.
In the sand laminating process and the dry laminating process, the base material and the thermoplastic resin composition layer (II) are formed on the side on which the thermoplastic resin composition layer (II) of the paper-based base material used in the present invention is mainly formed. In order to improve the barrier property, it is easy to laminate the aluminum foil, polyester film, various barrier films and the like.
6.発泡加工紙
本発明の発泡加工紙は、上記の発泡性積層体を加熱し、高圧法低密度ポリエチレン樹脂層(I)を発泡させて得られるものである。すなわち、上記発泡性積層体を発泡させる際に、高圧法低密度ポリエチレン樹脂層(I)と基材から放出される蒸気等を保持する熱可塑性樹脂組成物層(II)とが下記(式1)を満足させるように行うことが好ましい。
ここで、基材から放出される蒸気等を保持するとは、所定の加熱条件で基材から放出された蒸気等を高圧法低密度ポリエチレン樹脂層(I)側に拡散させ、高圧法低密度ポリエチレン樹脂層(I)を優先的に発泡させるよう、蒸気等をバリアすることを指す。この式(1)を満足させるように熱可塑性樹脂組成物層(II)に用いる樹脂組成物を選択すると、加熱による発泡処理条件を広くすることができるうえ、高圧法低密度ポリエチレン樹脂層(I)を優先的に発泡させることができるので好ましい。
Tm(II)−Tm(I)≧10 −−−−−式(1)
6). Foamed paper The foamed paper of the present invention is obtained by heating the foamable laminate and foaming the high-pressure low-density polyethylene resin layer (I). That is, when foaming the foamable laminate, the high-pressure method low-density polyethylene resin layer (I) and the thermoplastic resin composition layer (II) that retains vapor released from the substrate are represented by the following (formula 1 ) Is preferably satisfied.
Here, holding vapor etc. released from the base material means that the vapor etc. released from the base material under a predetermined heating condition is diffused to the high pressure method low density polyethylene resin layer (I) side, and the high pressure method low density polyethylene is used. This refers to barriering vapor or the like so that the resin layer (I) is preferentially foamed. When the resin composition used for the thermoplastic resin composition layer (II) is selected so as to satisfy the formula (1), the foaming treatment conditions by heating can be widened, and the high pressure method low density polyethylene resin layer (I ) Is preferred because it can be preferentially foamed.
Tm (II) −Tm (I) ≧ 10 −−−−− Formula (1)
発泡加工紙の発泡セルの高さは、370μm以上、好ましくは400μm以上とすることが望ましい。発泡セルの高さが370μm未満であると、十分な断熱性が得られない虞が生じる。
上記発泡加工紙は、下記のカップ等の断熱・保温材料としてはもちろんのこと、緩衝材料、遮音材料、発泡紙等としても用いられ、スリーブ材、紙皿、トレー、滑り止め材、果物の包装材、発泡紙等の農業用、産業用、生活用資材等として活用される。
The height of the foam cell of the foam-processed paper is 370 μm or more, preferably 400 μm or more. If the height of the foam cell is less than 370 μm, there is a possibility that sufficient heat insulation cannot be obtained.
The above-mentioned foamed paper is used as a heat insulating and heat insulating material for the following cups, as well as cushioning materials, sound insulation materials, foamed paper, etc., sleeve materials, paper plates, trays, anti-slip materials, fruit packaging Used as agricultural, industrial, and daily life materials such as wood and foamed paper.
発泡加工紙の製造にあたっては、下記の断熱容器の製造条件と同様であり、加熱方法としては特に制限はないが、熱風、マイクロ波、高周波、赤外線、遠赤外線等が挙げられる。加熱温度には特に制約はないが、紙を主体とする基材中の水分等を蒸発させ、発泡層樹脂が溶融する温度でなければならず、本発明においては100〜200℃、好ましくは100〜160℃、より好ましくは100〜140℃が好ましい。加熱時間は10秒間〜5分間が好ましい。加熱温度が100℃未満、加熱時間が10秒未満であると、十分な高さの発泡セルが得られない場合がある。加熱温度が200℃を超え、あるいは加熱時間が5分間を超えるような加熱過多の場合においては、発泡セルのへたりや均一性が損なわれる虞が生じる。 Production of foamed paper is the same as the production conditions for the heat insulating container described below, and the heating method is not particularly limited, and examples include hot air, microwave, high frequency, infrared, and far infrared. There is no particular limitation on the heating temperature, but it must be a temperature at which moisture in the substrate mainly composed of paper is evaporated and the foamed layer resin is melted. In the present invention, it is 100 to 200 ° C., preferably 100 -160 degreeC, More preferably, 100-140 degreeC is preferable. The heating time is preferably 10 seconds to 5 minutes. If the heating temperature is less than 100 ° C. and the heating time is less than 10 seconds, a sufficiently high foam cell may not be obtained. In the case of excessive heating such that the heating temperature exceeds 200 ° C. or the heating time exceeds 5 minutes, the sag and uniformity of the foamed cells may be impaired.
7.断熱容器
本発明の断熱容器は、上記発泡性積層体を用いて容器を形成した後、該容器を加熱し、ポリエチレン樹脂層(I)を発泡させて得られたものである。断熱容器でも、上記発泡加工紙と同様に、発泡セルの高さは、370μm以上、好ましくは400μm以上とすることが望ましい。発泡セルの高さが370μm未満であると、十分な断熱性が得られなくなる虞が生じる。
これにより得られた断熱容器は、トレー及びカップなどとして使用される。用途としては、ホット飲料容器、カップスープ容器、カップ味噌汁容器、カップ麺容器、納豆容器、弁当容器、コーヒーカップ容器等が例示される。
7). Thermal insulation container The thermal insulation container of the present invention is obtained by forming a container using the foamable laminate and then heating the container to foam the polyethylene resin layer (I). Even in the heat insulating container, like the foamed paper, the height of the foamed cell is preferably 370 μm or more, and preferably 400 μm or more. If the height of the foam cell is less than 370 μm, there is a possibility that sufficient heat insulation cannot be obtained.
The insulated container obtained by this is used as a tray, a cup, etc. Applications include hot beverage containers, cup soup containers, cup miso soup containers, cup noodle containers, natto containers, lunch boxes, coffee cup containers, and the like.
8.断熱容器の製造方法
上記断熱容器、特にカップの製造方法は、少なくとも、紙を主体とする基材の一方の面に、高圧法低密度ポリエチレン樹脂を用いて、加熱によって基材から放出される蒸気等によって発泡される厚さ20〜100μmのポリエチレン樹脂層(I)を形成し、基材の他面に、線状高密度ポリエチレン(a)と高圧法低密度ポリエチレン(b)で構成される樹脂組成物を用いて、基材から放出される蒸気等を保持する厚さ10〜100μmの熱可塑性樹脂層(II)が形成された発泡性積層体を形成し、ついで容器に成形後、加熱温度100〜200℃で加熱して、基材から放出される蒸気等によってポリエチレン樹脂層(I)を発泡させることを特徴とする。
断熱容器の製造方法においても上記発泡加工紙の製造方法と基本的には同様である。上記基材にラミネートするには、通例のラミネート方法が適用される。押出ラミネートにおいては、ダイス直下の樹脂温度200〜350℃、好ましくは260〜350℃、より好ましくは270〜350℃の範囲で行われる。また、成形速度は、10〜400m/分、好ましくは10〜350m/分位で行われ、必要に応じて、基材とポリエチレン樹脂との接着性を向上させるためにコロナ放電処理、オゾン処理、プラズマ処理、フレーム処理等
を行っても良い。また、必要に応じて、アンカーコート剤を塗布しても良い。
このようにして製造された発泡積層体を、ロール巻き原反もしくは連続的に繰り出して、該発泡積層体から胴部材用ブランクと底板部材用ブランクを打ち抜きし、常用のカップ成型機で胴部材と底板部材を接合させてカップ状等に成型した後、回分式あるいは転送するベルトコンベヤーに輸送されて熱風、マイクロ波、高周波、赤外線、遠赤外線等が具備する加熱炉、オーブントンネル等で加熱発泡されて断熱性容器が成形される。
特に連続的に製造するためには、好ましくは、加熱によって基材から放出される蒸気等によって発泡される高圧法低密度ポリエチレン樹脂層(I)と、基材から放出される蒸気等を保持する熱可塑性樹脂層(II)との融点差が、次の式(1)の関係を満足させるようにすることが望ましい。
Tm(II)−Tm(I)≧10 −−−−−式(1)
これにより、押出ラミネート等の高速成形性もよく、連続的に、発泡倍率が高く、均一な発泡セルを有する発泡層を形成することが可能になり、外観性が良く、印刷性、生産性が向上する。また、加熱時間は10秒間〜6分間が好ましい。加熱温度が100℃未満、加熱時間が10秒未満であると、十分な発泡セル高さが得られない場合がある。また、加熱温度が200℃を超え、または加熱時間が6分間を超える場合には、生成した発泡セルが加熱過多になって発泡セルにへたり等が生じ、製品のばらつきの原因となるおそれが生じる。 このように本発明の製造方法においては、基材から放出される蒸気等を保持する熱可塑性樹脂層(II)の製造用原料として、特定のMFRと密度を有する50重量%以下の線状ポリエチレンと、同じくMFRと密度が特定の範囲である高圧法低密度ポリエチレン(A)(B)を特定の比率で混合した樹脂組成物を用いることにより、ラミネート成形時の加工性が良好で、更に発泡工程における、熱可塑性樹脂層(II)のホットスリップ性に優れ、尚且つ発泡倍率が高く、均一な発泡セルが形成された発泡層を有する断熱性、外観の良好性等に優れた断熱性容器を容易に得ることができる。
8). Method for manufacturing a heat insulating container The above heat insulating container, particularly a method for manufacturing a cup, uses at least one surface of a base material mainly made of paper, a high-pressure low-density polyethylene resin, and a steam released from the base material by heating. A resin composed of a linear high-density polyethylene (a) and a high-pressure method low-density polyethylene (b) on the other surface of the base material formed with a polyethylene resin layer (I) having a thickness of 20 to 100 μm foamed by The composition is used to form a foamable laminate in which a thermoplastic resin layer (II) having a thickness of 10 to 100 μm that retains the vapor released from the substrate is formed, and then molded into a container, and then heated to a temperature. The polyethylene resin layer (I) is foamed by steam or the like released from the substrate by heating at 100 to 200 ° C.
The method for manufacturing a heat insulating container is basically the same as the method for manufacturing foamed paper. In order to laminate on the base material, a usual laminating method is applied. In the extrusion lamination, the resin temperature immediately below the die is 200 to 350 ° C, preferably 260 to 350 ° C, more preferably 270 to 350 ° C. The molding speed is 10 to 400 m / min, preferably about 10 to 350 m / min, and if necessary, in order to improve the adhesion between the base material and the polyethylene resin, corona discharge treatment, ozone treatment, Plasma treatment, flame treatment, or the like may be performed. Moreover, you may apply | coat an anchor coating agent as needed.
The foamed laminate produced in this way is rolled out or continuously drawn out, and a blank for a trunk member and a blank for a bottom plate member are punched out from the foamed laminate, and a barrel member is used with a conventional cup molding machine. After the bottom plate members are joined and molded into a cup shape, etc., they are transported to a batch or transfer belt conveyor and heated and foamed in a furnace, oven tunnel, etc. equipped with hot air, microwave, high frequency, infrared, far infrared, etc. A heat insulating container is formed.
In particular, for continuous production, it is preferable to hold a high-pressure low-density polyethylene resin layer (I) foamed by steam or the like released from the substrate by heating, and steam or the like released from the substrate. It is desirable that the difference in melting point with the thermoplastic resin layer (II) satisfies the relationship of the following formula (1).
Tm (II) −Tm (I) ≧ 10 −−−−− Formula (1)
As a result, high-speed moldability such as extrusion lamination is good, it is possible to continuously form a foam layer having a high foaming ratio and uniform foam cells, good appearance, good printability and productivity. improves. The heating time is preferably 10 seconds to 6 minutes. If the heating temperature is less than 100 ° C. and the heating time is less than 10 seconds, a sufficient foamed cell height may not be obtained. In addition, when the heating temperature exceeds 200 ° C. or the heating time exceeds 6 minutes, the generated foamed cell becomes excessively heated and may sag in the foamed cell, which may cause variation in products. Arise. Thus, in the production method of the present invention, as a raw material for producing the thermoplastic resin layer (II) that retains the vapor released from the base material, a linear polyethylene having a specific MFR and density of 50% by weight or less. Similarly, by using a resin composition in which MFR and high-pressure low-density polyethylene (A) (B) whose density is in a specific range are mixed in a specific ratio, workability at the time of laminate molding is good, and further foaming is performed. Insulating container excellent in hot-slip property of thermoplastic resin layer (II) in the process, and having a foaming layer having a high foaming ratio and a uniform foamed cell, excellent in heat insulation, good appearance, etc. Can be easily obtained.
以下、実施例を示して本発明を更に具体的に説明するが、本発明はこれらの実施例に限
定されるものではない。
なお、本実施例において用いるポリエチレン樹脂、その物性、得られた発泡性積層体等
の試験方法は、以下の通りである。
EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.
In addition, the test methods of the polyethylene resin used in the present Example, its physical properties, the obtained foamed laminate, and the like are as follows.
MFR
JIS K7210に準拠(190℃、21.18N荷重)して測定した。
MFR
Measured in accordance with JIS K7210 (190 ° C., 21.18 N load).
密度
ペレットを熱プレスして2mm厚のプレスシートを作成し、該シートを1000ml容量のビーカーに入れ蒸留水を満たし、時計皿で蓋をしてマントルヒーターで加熱した。蒸留水が沸騰してから60分間煮沸後、ビーカーを木製台の上に置き放冷した。この時60分煮沸後の沸騰蒸留水は500mlとし室温になるまでの時間は60分以下にならないように調整した。また、試験シートは、ビーカー及び水面に接しないように水中のほぼ中央部に浸漬した。シートを23℃、湿度50%の条件において16時間以上24時間以内でアニーリングを行った後、タテ×ヨコ2mmになるように打ち抜き、試験温度23℃でJIS−K7112に準拠して測定した。
The density pellet was hot-pressed to prepare a press sheet having a thickness of 2 mm. The sheet was placed in a beaker having a capacity of 1000 ml, filled with distilled water, covered with a watch glass, and heated with a mantle heater. After boiling boiling water for 60 minutes, the beaker was placed on a wooden table and allowed to cool. At this time, the boiling distilled water after boiling for 60 minutes was adjusted to 500 ml so that the time until reaching room temperature was not less than 60 minutes. Moreover, the test sheet was immersed in the substantially center part in water so that it might not contact a beaker and the water surface. The sheet was annealed at a temperature of 23 ° C. and a humidity of 50% within a period of 16 hours or more and within 24 hours, then punched out to a length of 2 mm and measured at a test temperature of 23 ° C. according to JIS-K7112.
(3)GPC
装置:Waters社製GPC(ALC/GPC 150C)
検出器:FOXBORO社製MIRAN 1A IR検出器(測定波長:3.42μm)
カラム:昭和電工社製AD806M/S(3本)
移動相溶媒:o−ジクロロベンゼン
測定温度:140℃
流速:1.0ml/分
注入量:0.2ml
試料の調製:試料は、ODCB(0.5mg/mLのBHTを含む)を用いて、1mg/mLの溶液を調製し、140℃で約1時間を要して溶解させる。
(3) GPC
Apparatus: Waters GPC (ALC / GPC 150C)
Detector: MIRAN 1A IR detector manufactured by FOXBORO (measurement wavelength: 3.42 μm)
Column: AD806M / S (3 pieces) manufactured by Showa Denko KK
Mobile phase solvent: o-dichlorobenzene Measurement temperature: 140 ° C.
Flow rate: 1.0 ml / min Injection volume: 0.2 ml
Sample preparation: Prepare a 1 mg / mL solution using ODCB (containing 0.5 mg / mL BHT) and dissolve at 140 ° C. for about 1 hour.
(4)ネックイン
モダンマシナリー製φ90mm押出ラミネーターを用い、ダイ幅560mm、エアギャップ110mmラミネート厚み30μm、ラミネート速度100m/min、及び、ラミネート厚み 15μラミネート速度 150m/minの条件で、ダイリップ樹脂温度を320℃とし、坪量50g/m2のクラフト紙に押出ラミネート成形を行った。上記条件で測定したネックインが40mm未満のものを○、40以上のものを×とした。
(4) Neck-in Modern machinery φ90mm extrusion laminator, die width 560mm, air gap 110mm laminate thickness 30μm, laminate speed 100m / min, laminate thickness 15μ laminate speed 150m / min, die lip resin temperature 320 The laminate was extrusion laminated to kraft paper having a basis weight of 50 g / m 2. The neck-in measured under the above conditions was less than 40 mm, and the one with 40 or more was rated as x.
(5)ドローダウン性
モダンマシナリー製φ90mm押出ラミネーターを用い、ダイ幅560mm、エアギャップ110mm、ダイリップ樹脂温度を320℃とし、押出機の回転数を12rpm 一定で、坪量50g/m2のクラフト紙に押出ラミネート成形した。上記加工条件で、溶融樹脂膜が破断しない、引取り最高速度が100m/min以上を○ 100m/min未満を×とした。
(5) Using drawdown modern machinery φ90mm extrusion laminator, die width 560mm, air gap 110mm, die lip resin temperature 320 ° C, extruder rotation speed constant 12rpm, basis weight 50g / m2 kraft paper Extruded laminate was formed. Under the above processing conditions, the melted resin film was not broken, and the maximum take-up speed was 100 m / min or more.
(6)ホットスリップ性
試験片は、坪量50g/m2のクラフト紙に厚み 30μで押出しラミネート成形したものを65mm ×長さ130mmに加工し、更に65mm×65mm幅の金属製ボード(重量200g)に正確に巻きつけたものを使用した。
テスター産業社製 引っ張り式スリップテスタ-上部に、昇温機付きステンレス板を配置し、
ステンレス板を実施例、比較例記載の測定温度まで昇温後、前述のボードを ステンレス板にセットし、10sec経過後に引っ張り速度150mm/minで 試験片を移動させた時の重量変化をロードセルでチャートに読み取り、得られた測定値を以下の数式で静摩擦係数、動摩擦係数とした。
静摩擦係数 : 金属製ボードが、移動を始めた時点の重量 /金属製ボード重量
動摩擦係数: 金属製ボードの70mm移動間の平均値/金属製ボード重量
上記条件で測定した110℃における静摩擦係数及び、動摩擦係数が0.90以下のものを○、0.91以上のものを×とした。更に、115℃における静摩擦係数及び、動摩擦係数が1.50以下のものを○、1.51以上のものを×とした。
(6) A hot-slip test piece is a 65 mm × 65 mm wide metal board (weight: 200 g), which is obtained by extruding and laminating 30 mm thick kraft paper with a basis weight of 50 g / m 2 to 65 mm × length 130 mm. The one that was accurately wound around was used.
Tensile type slip tester manufactured by Tester Sangyo Co., Ltd.
After raising the temperature of the stainless steel plate to the measurement temperature described in the examples and comparative examples, the above-mentioned board is set on the stainless steel plate, and the weight change when the test piece is moved at a pulling speed of 150 mm / min after 10 seconds has passed is charted with a load cell. The measured values obtained were read as static friction coefficient and dynamic friction coefficient by the following formulas.
Coefficient of static friction: Weight when metal board starts moving / Metal board weight dynamic friction coefficient: Average value during 70 mm movement of metal board / Metal board weight Coefficient of static friction at 110 ° C. measured under the above conditions, and A sample having a coefficient of dynamic friction of 0.90 or less was marked with ◯, and a coefficient of 0.91 or more was marked with ×. Furthermore, the thing with a static friction coefficient in 115 degreeC and the dynamic friction coefficient of 1.50 or less was made into (circle), and 1.51 or more was made into x.
(実施例1〜4)
表1に示す物性をそれぞれ有する線状ポリエチレン(a)と高圧法低密度ポリエチレン(A)(B)を、所定の重量比でドライブレンドした後、40mmφのスクリューとストランドダイを有する単軸押出機(ムサシノ機械社製-MK40)を用いて設定温度 190℃、20kg/Hでストランド状に押出し、ストランドカッターでペレットとした。このエチレン系重合体のペレットを用い、各種物性を評価した。又、得られたエチレン系重合体のペレットを、モダンマシナリー製φ90mm押出ラミネーターを用い、ダイ幅560mm、エアギャップ110mm、ラミネート厚み30μm、ラミネート速度100m/min、及び、ラミネート厚み 15μラミネート速度 150m/minの条件で、ダイリップ樹脂温度320℃とし、坪量50g/m2のクラフト紙に押出ラミネート成形を行い、ホットスリップ性及び、ネックイン、ドローダウン性の測定を実施した。
更に、このエチレン系重合体のペレットを、モダンマシナリー製φ90mm押出ラミネーターに供給し、320℃の温度でTダイより押出し、坪量 320g/m2の紙基材上の一方の面に40μの厚さになるように押出ラミネート成形を行い(II層)、この積層体の紙基材のもう一方の面(I層)にMFR 14g/10min 、密度 0.918g/cm3の高圧法低密度ポリエチレン(日本ポリエチレン(株)製商品名 ノバテックLC701)を 70μの厚みとなるよう押出しラミネート成形を行った。得られた積層体を10cm×10cmに切り出し、120℃に加熱したパーフェクトオーブン(PH−102型 エスペック製)中で360秒間静置し、高圧法低密度ポリエチレン層(I層)側を発泡させた後、取り出して空気中で室温まで冷却した。上記発泡させたセルサイズをデジタルマイクロスコープ(スカラ社製 HDM−2100)で、下部より灯影させて1.3cm×1.3cm四方の各発泡セル全ての面積を測定後、その平均を算出し、平均値が0.8以上のものを外観不良(×)、0.8未満のものを外観良好と評価した。
結果を表1に示す。
(Examples 1-4)
A single-screw extruder having a 40 mmφ screw and a strand die after dry blending linear polyethylene (a) and high-pressure method low-density polyethylene (A) (B) each having the physical properties shown in Table 1 at a predetermined weight ratio (Musashino Machinery Co., Ltd.-MK40) was used to extrude into strands at a set temperature of 190 ° C. and 20 kg / H, and pelletized with a strand cutter. Using this ethylene polymer pellet, various physical properties were evaluated. Moreover, the pellets of the obtained ethylene polymer were used, using a φ90 mm extrusion laminator manufactured by Modern Machinery, with a die width of 560 mm, an air gap of 110 mm, a laminate thickness of 30 μm, a laminate speed of 100 m / min, and a laminate thickness of 15 μlaminate speed of 150 m / min. Under the conditions, the die lip resin temperature was set to 320 ° C., extrusion lamination was performed on kraft paper having a basis weight of 50 g / m 2, and hot slip property, neck-in property, and draw down property were measured.
Further, this ethylene polymer pellet was supplied to a φ90 mm extrusion laminator manufactured by Modern Machinery, extruded from a T-die at a temperature of 320 ° C., and a thickness of 40 μm on one side on a paper substrate having a basis weight of 320 g / m 2. Extrusion laminate molding was performed (layer II), and the other side (layer I) of the paper substrate of this laminate was MFR 14 g / 10 min, density 0.918 g / cm 3 high pressure method low density polyethylene (Product name: Novatec LC701 manufactured by Nippon Polyethylene Co., Ltd.) was extruded and laminated to a thickness of 70 μm. The obtained laminate was cut into 10 cm × 10 cm and allowed to stand for 360 seconds in a perfect oven (PH-102 type Espec) heated to 120 ° C. to foam the high-pressure method low-density polyethylene layer (I layer) side. Then, it was taken out and cooled to room temperature in air. The foamed cell size was measured with a digital microscope (HDM-2100, manufactured by SCARA) from the bottom, and after measuring the area of all the foam cells of 1.3 cm × 1.3 cm square, the average was calculated. An average value of 0.8 or more was evaluated as poor appearance (x), and an average value of less than 0.8 was evaluated as good appearance.
The results are shown in Table 1.
(比較例1)
熱可塑性樹脂層(II)に用いる高圧法低密度ポリエチレン(b)のうち、(B)の低密度ポリエチレン 密度を0.918g/cm3 、配合割合を60重量%として、低密度ポリエチレン(A)を除き、線状ポリエチレン(a)と高圧法低密度ポリエチレン(b)の組成物MFRを、11.1g/10minとしたものを、モダンマシナリー製φ90mm押出ラミネーターに供給し、ダイ幅560mm、エアギャップ110mmラミネート厚み30μm、ラミネート速度100m/min、及び、ラミネート厚み 15μラミネート速度 150m/minの条件で、ダイリップ樹脂温度320℃とし、坪量50g/m2のクラフト紙に押出ラミネート成形を行い、ホットスリップ性及び、ネックイン、ドローダウン性の測定を実施した。
評価結果を表2に示す。
(Comparative Example 1)
Among the high-pressure method low-density polyethylene (b) used for the thermoplastic resin layer (II), the low-density polyethylene (A) has a low-density polyethylene density of 0.918 g / cm 3 and a blending ratio of 60% by weight. The composition MFR of linear polyethylene (a) and high-pressure low-density polyethylene (b), which is 11.1 g / 10 min, is supplied to a modern machinery φ90 mm extrusion laminator, die width 560 mm, air gap 110mm laminating thickness 30μm, laminating speed 100m / min, laminating thickness 15μ laminating speed 150m / min, die lip resin temperature 320 ° C, extrusion laminating to 50g / m 2 basis weight kraft paper, hot slip And neck-in and draw-down properties were measured.
The evaluation results are shown in Table 2.
(比較例2)
熱可塑性樹脂層(II)に用いる線状ポリエチレン(a)のMFRを 21g/10min、高圧法低密度ポリエチレン(b)のうち、(A)の低密度ポリエチレン配合割合を55重量%として、低密度ポリエチレン(B)を除いた組成物をモダンマシナリー製φ90mm押出ラミネーターに供給し、ダイ幅560mm、エアギャップ110mmラミネート厚み30μm、ラミネート速度100m/min、及び、ラミネート厚み 15μラミネート速度 150m/minの条件で、ダイリップ樹脂温度320℃とし、坪量50g/m2のクラフト紙に押出ラミネート成形を行い、ホットスリップ性及び、ネックイン、ドローダウン性の測定を実施した。
評価結果を表2に示す。
(Comparative Example 2)
The MFR of the linear polyethylene (a) used for the thermoplastic resin layer (II) is 21 g / 10 min, and the high-density low-density polyethylene (b) has a low-density polyethylene blending ratio of 55% by weight. The composition excluding polyethylene (B) was supplied to a φ90 mm extrusion laminator manufactured by Modern Machinery, under the conditions of a die width of 560 mm, an air gap of 110 mm, a laminate thickness of 30 μm, a laminate speed of 100 m / min, and a laminate thickness of 15 μm and a laminate speed of 150 m / min. Then, the die lip resin temperature was set to 320 ° C., and extrusion lamination was performed on a kraft paper having a basis weight of 50 g / m 2 to measure hot slip property, neck-in property, and draw down property.
The evaluation results are shown in Table 2.
(比較例3)
熱可塑性樹脂層(II)に用いる高圧法低密度ポリエチレン(b)のうち、(B)の低密度ポリエチレン 密度を0.918g/cm3 、配合割合を20重量%として、低密度ポリエチレン(A)を除き、線状ポリエチレン(a)の密度を0.966g/cm3とし、配合割合を80重量%とした組成物を、モダンマシナリー製φ90mm押出ラミネーターに供給し、ダイ幅560mm、エアギャップ110mmラミネート厚み30μm、ラミネート速度100m/min、及び、ラミネート厚み 15μラミネート速度 150m/minの条件で、ダイリップ樹脂温度320℃とし、坪量50g/m2のクラフト紙に押出ラミネート成形を行い、ホットスリップ性及び、ネックイン、ドローダウン性の測定を実施した。
評価結果を表2に示す。
(Comparative Example 3)
Of the high-pressure low-density polyethylene (b) used for the thermoplastic resin layer (II), the low-density polyethylene (A) has a low-density polyethylene density of 0.918 g / cm 3 and a blending ratio of 20% by weight. A composition in which the density of the linear polyethylene (a) is 0.966 g / cm 3 and the blending ratio is 80% by weight is supplied to a modern machinery φ90 mm extrusion laminator, and the die width is 560 mm and the air gap is 110 mm laminate. Under the conditions of a thickness of 30 μm, a laminating speed of 100 m / min, and a laminating thickness of 15 μlaminating speed of 150 m / min, the die lip resin temperature is set to 320 ° C., and extrusion laminating is performed on kraft paper having a basis weight of 50 g / m 2. Neck-in and draw-down properties were measured.
The evaluation results are shown in Table 2.
Claims (6)
(a1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜20g/10min
(a2)試験温度23℃JIS−K7112に準拠した密度が0.960g/cm3〜0.970g/cm3
(a3)数平均分子量に対する重量平均分子量の比で表される分子量分布(Mw/Mn)が2以上10以下
(A1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜10g/10min
(A2)試験温度23℃、JIS−K7112に準拠した密度が0.920g/cm3〜0.940g/cm3
(B1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1〜10g/10min
(B2)試験温度23℃、JIS−K7112に準拠した密度が0.920g/cm3未満
(II−1)JIS K7210に準拠(190℃、21.18N荷重)して測定したMFRが0.1g/10min〜10g/10min
(II−2)試験温度23℃、JIS−K7112に準拠した密度が0.942g/cm3以下 Thermoplastic that forms a low-density polyethylene resin layer (I) for foaming on one side of a paper-based base material, and holds vapor released from the base material on the other side of the base material A heat-foamable laminate having a resin layer (II), the resin composition (II) forming the thermoplastic resin layer (II) satisfying the following characteristics (a1) to (a3): High-density polyethylene resin (A) less than 50% by weight and 1% by weight or more, and high pressure method low density polyethylene resin (A) satisfying the following characteristics (A1) to (A2): A polyethylene resin composition (II) which is a resin composition in which 15% by weight to 35% by weight of a high-pressure method low density polyethylene resin (B) satisfying the characteristics of (B1) to (B2) is mixed. ) Are the features of (II-1) to (II-2) below. Heating the foamable laminate which satisfies the.
(A1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) is 0.1 to 20 g / 10 min.
(A2) Test temperature 23 ° C. Density in accordance with JIS-K7112 is 0.960 g / cm 3 to 0.970 g / cm 3
(A3) The molecular weight distribution (Mw / Mn) represented by the ratio of the weight average molecular weight to the number average molecular weight is 2 or more and 10 or less (A1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) 0.1-10g / 10min
(A2) The test temperature is 23 ° C., and the density according to JIS-K7112 is 0.920 g / cm 3 to 0.940 g / cm 3.
(B1) MFR measured in accordance with JIS K7210 (190 ° C., 21.18 N load) is 0.1 to 10 g / 10 min.
(B2) Test temperature 23 ° C., density according to JIS-K7112 is less than 0.920 g / cm 3 (II-1) MFR measured according to JIS K7210 (190 ° C., 21.18 N load) is 0.1 g / 10min-10g / 10min
(II-2) The test temperature is 23 ° C. and the density based on JIS-K7112 is 0.942 g / cm 3 or less.
Tm(II)−Tm(I)≧10 −−−−−式(1) The melting point difference between the melting point Tm (I) of the low density polyethylene resin layer (I) and the melting point Tm (II) of the thermoplastic resin layer (II) satisfies the following formula (1): The heat-foamable laminate according to any one of claims 1 to 3.
Tm (II) −Tm (I) ≧ 10 −−−−− Formula (1)
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