JP6372885B2 - Manufacturing method of wear-resistant plate - Google Patents

Description

  The present invention relates to a wear-resistant plate provided with wear resistance by a self-fluxing alloy coating layer formed on the surface of a metal substrate, and a method for producing the same.

A self-fluxing alloy coated steel plate (abrasion resistant plate) is known in which a self-fluxing alloy coating layer is formed on one surface of a metal substrate (steel plate) to improve the wear resistance (Patent Document 1).
In such a self-fluxing alloy-coated steel sheet, excellent wear resistance is imparted by the self-fluxing alloy coating layer.

JP-A-6-240307

  However, the self-fluxing alloy-coated steel sheet as described above has the following problems.

(1) Since the self-fluxing alloy coating layer is a hard film, it is highly susceptible to cracking.
And when a crack arises in a self-fluxing alloy coating layer and the surface of a base material is exposed, rust will generate | occur | produce from there and product life will be shortened.
Further, even if the cracks initially generated in the self-fluxing alloy coating layer are small, they grow on the entire surface of the self-fluxing alloy coating layer.

(2) The heat treatment at the time of forming the self-fluxing alloy coating layer generates a strain that cannot be ignored in terms of dimensions in the plate, which becomes a factor that significantly impedes application as a product.
If the thickness of the steel sheet is increased in order to reduce strain, the product weight increases and the practicality is impaired.

(3) The area of the self-fluxing alloy coating layer that can be formed is limited by the size of the processing furnace for performing the heat treatment, and a wear-resistant plate having a large area (for example, 5 m ² or more) cannot be manufactured.

The present invention has been made based on the above situation.
The object of the present invention is low cracking sensitivity, excellent crack resistance and impact resistance, no distortion that impairs the quality of the product, light weight, and can be reliably manufactured even for large areas. An object of the present invention is to provide a wear-resistant plate and a manufacturing method thereof.

In the method for producing a wear-resistant plate according to the present invention, a self-fluxing alloy coating layer is formed on the one side plane of the metal substrate having a plane on one side and the other side, and arranged in a plane with a gap between each other. A plurality of chip members,
Filling the gap to bind the plurality of tip members, forming one surface of a wear-resistant plate to be described later with the surface of the self-fluxing alloy coating layer exposed, and forming the other side plane of the plurality of tip members A method for producing a wear-resistant plate comprising a binder that covers and forms the other side of the wear-resistant plate described later ,
A step of arranging each of the plurality of chip members in a planar manner through a gap, with the self-fluxing alloy coating layer on the lower side in a mold,
The binder forming material is filled in the mold so as to fill the gap with a binder forming material (hereinafter referred to as “binder forming material”) and cover the other side surface of the plurality of chip members with the binder forming material. And the process of
By curing or melting and solidifying the input binder forming material, the surface of the self-fluxing alloy coating layer is exposed to bind the plurality of chip members to form one surface of the wear-resistant plate, Forming the other surface of the wear-resistant plate by covering the other flat surface of the plurality of chip members with the binder formed by curing or solidifying the binder forming material;
It is characterized by including .

  The wear-resistant plate having such a structure has a self-fluxing alloy surface having a relatively small area (the surface of the self-fluxing alloy coating layer) arranged to constitute one surface of the wear-resistant plate. , Because it is a composite material in which a plurality of chip members provided with a self-fluxing alloy coating layer are embedded in a binder, it is excellent in flexibility (flexibility), and the applied impact can be absorbed by the binder. Low sensitivity and excellent crack resistance and impact resistance.

  Further, a binder exists around the self-fluxing alloy coating layer formed on each of the plurality of chip members, and the plurality of self-fluxing alloy surfaces exposed on one surface of the wear-resistant plate are independent from each other. Even if a crack occurs in the self-fluxing alloy coating layer formed on the member, the crack stops at the self-fluxing alloy coating layer of the chip member, and on the self-fluxing alloy coating layer formed on the other chip member. Never reach.

Further, when manufacturing the wear-resistant plate having such a configuration, there is no distortion that occurs due to heat treatment when manufacturing a conventionally known self-fluxing alloy-coated steel sheet (forming a self-fluxing alloy coating layer). .
Moreover, according to the abrasion-resistant plate of such a structure, a significant weight reduction can be achieved as compared with a conventionally known self-fluxing alloy coated steel plate.
Further, according to the wear-resistant plate having such a configuration, the plate area can be adjusted by the number of chip members arranged, so that the plate area is not limited by the size of the processing furnace, Even plates can be reliably manufactured.

The method of manufacturing a wear plate of the present invention, the tip member, self-fluxing alloy coating layer Ri rectangular metal piece Der formed is self-fluxing alloy coating layer is flat rods of predetermined length formed It is preferable to include a step of cutting the chip member to produce the chip member .

Preferably , the method for manufacturing a wear-resistant plate of the present invention includes a step of cutting the die steel material on which the self- fluxing alloy coating layer is formed to a predetermined length to produce the tip member .

In the wear-resistant plate manufacturing method of the present invention, the tip member has a cross-sectional area between the one side plane and the other side plane that is smaller than the area of the one side plane and the other side plane (one side plane and It is preferable to have a constricted portion having a cross-sectional area parallel to the other side plane.

  According to the wear-resistant plate having such a configuration, the binder filled in the space around the constricted portion of the chip member increases the pull-out resistance of the chip member and reliably prevents the chip member from falling off the wear-resistant plate. can do.

The wear-resistant plate of the present invention has a low cracking sensitivity, is excellent in cracking resistance and impact resistance, has no distortion that impairs product quality, is lightweight, and can be manufactured even in a large area.
According to the production method of the present invention, it is possible to produce a lightweight wear-resistant plate having low cracking sensitivity, excellent crack resistance and impact resistance, and no distortion that impairs product quality.

The wear-resistant plate which concerns on 1st Embodiment of this invention is shown, (1) is a top view, (2) is AA sectional drawing of (1). The wear-resistant plate which concerns on 2nd Embodiment of this invention is shown, (1) is a top view, (2) is BB sectional drawing of (1). The wear-resistant plate which concerns on 3rd Embodiment of this invention is shown, (1) is a top view, (2) is CC sectional drawing of (1). The wear-resistant plate which concerns on 4th Embodiment of this invention is shown, (1) is a top view, (2) is D1-D1 sectional drawing of (1), (3) is D2-D2 sectional view of (1). FIG. The wear-resistant plate which concerns on 5th Embodiment of this invention is shown, (1) is a top view, (2) is E1-E1 sectional drawing of (1), (3) is E2-E2 sectional view of (1). FIG. The wear-resistant plate which concerns on 6th Embodiment of this invention is shown, (1) is a top view, (2) is FF sectional drawing of (1). It is explanatory drawing which shows typically the process of manufacturing the abrasion-resistant plate which concerns on 1st Embodiment of this invention.

<First Embodiment>
The wear-resistant plate 100 of this embodiment shown in FIG. 1 has one surface (one side) of a rectangular parallelepiped metal substrate 111 having a rectangular cross-section (cross-section AA in FIG. 1A shown in FIG. 1B). A self-fluxing alloy coating layer 112 is formed on the side plane), and a plurality of chip members 110 arranged in a plane via a gap G1 and a plurality of chip members 110 filled in the gap G1 are bonded. The surface 100A of the wear-resistant plate 100 is formed with the surface of the self-fluxing alloy coating layer 112 exposed, and the other surface (the other side plane) of the plurality of chip members 110 is covered to cover the other surface of the wear-resistant plate 100. And a binder 120 that forms the surface 100B.

The chip member 110 constituting the wear-resistant plate 100 of the present embodiment has a self-fluxing alloy coating layer 112 formed on one surface (one side plane) of the metal substrate 111, and the plurality of chip members 110 are in the binder 120. The self-fluxing alloy coating layer 112 is arranged in a plane with a gap G1 in a state where the surface of the self-fluxing alloy coating layer 112 is exposed.
The size of the metal base 111 constituting the chip member 110 is not particularly limited. For example, the width (W1) is 10 to 100 mm, the length (L1) is 10 to 100 mm, and the height (H1) is 5. ˜20 mm.

  The constituent metal material of the metal substrate 111 is not particularly limited, and examples thereof include metal materials such as low alloy steels such as carbon steel and CrMo steel, cast iron, and stainless steel.

A self-fluxing alloy coating layer 112 is formed on one surface of the metal substrate 111.
The self-fluxing alloy coating layer 112 forms a sprayed coating by spraying a self-fluxing alloy powder on one surface of the metal substrate 111 or one surface of a steel material (flat bar) for forming the metal substrate 111. Can be formed by remelting.

Here, examples of the self-fluxing alloy to be used include known self-fluxing alloys capable of imparting wear resistance to the metal material (base material). As a preferable self-fluxing alloy, the ratio of B is 1 to 5. A Ni-based alloy having a mass percentage of 1 to 5 mass%, a Si percentage of 10 to 40 mass%, a Mo percentage of 0.0 to 4 mass%, and a C percentage of 1 mass% or less. be able to.
A conventionally well-known method can be employ | adopted as a thermal spraying method.
If necessary, surface treatment such as shot blasting may be performed on the surface of the base material on which the sprayed coating is formed.

The remelting temperature of the thermal spray coating is usually about 1000 to 1100 ° C.
A dense coating (self-fluxing alloy coating layer) is formed by remelting the sprayed coating, and its wear resistance is improved.

  In addition, when a self-fluxing alloy coating layer is formed on one surface of a steel material (flat bar) for forming the metal substrate 111, the steel material on which the self-fluxing alloy coating layer 112 is formed has a predetermined length (L1). The chip member 110 can be manufactured by cutting into pieces.

The thickness of the self-fluxing alloy coating layer 112 formed on one surface of the metal substrate 111 is preferably 0.5 to 5 mm, and more preferably 1 to 3 mm.
The self-fluxing alloy coating layer 112 may be in a state of a sprayed coating that has not been remelted.

As shown in FIG. 1 (1), the plurality of chip members 110 including the self-fluxing alloy coating layer 112 are arranged in a plane via gaps G 1 filled with a binder 120.
In FIG. 1A, the number of arrayed chip members 110 is 80 (10 rows × 8 columns). However, the number of arrayed members is of course not limited to this, and the number of arrayed members is appropriately determined according to the area of the wear-resistant plate. Can be changed.

The width of the gap G1 between the adjacent tip members 110 can be arbitrarily adjusted within a range in which good wear resistance or the like is maintained, but is usually 10 mm or less, preferably 0.1 to 0.5 mm. Is done.
If this gap is excessive, the wear resistance of the self-fluxing alloy coating layer cannot be sufficiently exhibited.

The binder 120 constituting the wear-resistant plate 100 of the present embodiment is filled in the gap G1 between the adjacent chip members 110 to bind the chip members 110 and expose the surface of the self-fluxing alloy coating layer 112. One surface 100A of the wear-resistant plate 100 is formed, and the other surface 100B of the wear-resistant plate 100 is formed by covering the other surface of the chip member 110.
Thereby, each of the plurality of chip members 110 is embedded in the binder 120 with the surface of the self-fluxing alloy coating layer 112 exposed.

From the viewpoint of imparting good crack resistance and impact resistance to the wear resistant plate 100 of the present embodiment, the binder 120 is required to have a certain flexibility.
Here, the tensile strength of the binder 120 measured in accordance with JIS K 7161 is preferably 10 to 100 MPa, and the elongation at break is preferably 30 to 1000%.

Moreover, it is preferable that the hardness (by the durometer hardness tester (D type)) of the binder 120 measured based on JIS K7215 is 10 or more, More preferably, it is 30-60.
When the hardness of the binder is excessive, the wear-resistant plate is inferior in crack resistance and impact resistance.
On the other hand, when the hardness of the binder is too small, the chip member may drop off or the shape as a plate cannot be maintained.

The binder 120 constituting the wear-resistant plate 100 can be formed by curing a curable binder forming material or by melting and solidifying a thermoplastic binder forming material.
Here, the curable binder forming material may be thermosetting or photocurable, and may be one-component curable or two-component curable.

  Examples of the curable binder forming material that can be suitably used to form the binder 120 include phenol resin, urea resin, melamine resin, allyl resin, furan resin, unsaturated polyester resin, epoxy resin, silicone resin, polyimide resin. And thermosetting resins such as polyurethane resins.

  Examples of the thermoplastic binder forming material that can be suitably used to form the binder 120 include polyethylene, polypropylene, polybutylene, polymethyl methacrylate, modified acrylic resin, polystyrene, AS resin, BS resin, ABS resin, Ethylene-vinyl acetate copolymer, VC, PVC, PVA, PVAC, polyvinylidene chloride, chlorinated vinyl chloride, propylene vinyl chloride copolymer, polyamide, polyamideimide, polyetherimide, saturated polyester resin, polycarbonate, polyacetal, ionomer Resin, polyether sulfone, polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polyarylate (PAR), polyether ether ketone (PEEK), liquid crystal plastic, police Phon, polyurethane, tetrafluoroethylene (PTFE), trifluoroethylene (PCTFE), polyvinylidene fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, fluorinated ethylene / perfluoroalkoxyethylene copolymer, tetrafluoride Examples thereof include an ethylene-ethylene copolymer, ethyl cellulose, cellulose acetate, cellulose propionate, and cellulose nitrate.

Moreover, the binder 120 may have rubber-like elasticity.
Specifically, natural rubber, isoprene rubber, butadiene rubber, styrene butadiene rubber, butyl rubber, nitrile rubber, ethylene propylene rubber, chloroprene rubber, acrylic rubber, chlorosulfonated polyethylene rubber, urethane rubber, silicone rubber, fluorine rubber, ethylene acetate Examples thereof include various rubbers such as vinyl rubber, epichlorohydrin rubber, polysulfide rubber, and thermoplastic elastomer.
The binder 120 may be a gel such as a silicone gel.

The wear-resistant plate 100 of this embodiment can be preferably manufactured as follows.
First, after surface treatment such as blasting is performed on one surface of a flat bar having a predetermined width (W1), a self-fluxing alloy powder is sprayed and remelted to form a self-fluxing alloy coating layer. A plurality of chip members 110 in which a self-fluxing alloy coating layer 112 is formed on one surface of a rectangular parallelepiped metal base 111 are produced by cutting the rectangular bar formed on one surface into a predetermined length (L1). To do.

  Next, each of the 80 chip members 110 obtained as described above is placed in the mold with the self-fluxing alloy coating layer 112 facing down (that is, the surface of the self-fluxing alloy coating layer 112 is the mold). (In contact with the bottom surface of the frame) and arranged in a plane via the gap G1.

  Next, as shown in FIG. 7A, for example, a powdery thermoplastic binder forming material 120 ′ is filled in the gap between the adjacent chip members 110, and the other surface side of the chip member 110 is sufficiently formed. It is put into a mold (lower mold) M1 so as to be covered.

Next, as shown in FIG. 7 (2), a plate-shaped upper mold M2 is placed on a mold (lower mold) M1, and a binder forming material 120 ′ charged into the mold M1 is pressed (shown). Heat in a pressurized environment.
Thereby, the binder forming material 120 ′ is melted and solidified to form the binder 120, and the wear-resistant plate 100 having a structure as shown in FIG. 1 can be obtained by taking it out from the mold M1.

The wear-resistant plate 100 of this embodiment has a single surface 100A in which a plurality of self-fluxing alloy surfaces (surfaces of the self-fluxing alloy coating layer 112) having a relatively small area are arranged in a plane.
In addition, the wear-resistant plate 100 is a composite material in which a plurality of chip members 110 each having a self-fluxing alloy coating layer 112 are embedded in a binder 120, which is much more than a conventionally known self-fluxing alloy-coated steel plate. Even if the impact is applied to the one surface 100A of the wear-resistant plate 100, the impact is absorbed and relaxed by the binder 120.
Therefore, the wear-resistant plate 100 of the present embodiment has low crack sensitivity and is excellent in crack resistance and impact resistance.

  Further, a binder 120 exists around the self-fluxing alloy coating layer 112 formed on each of the plurality of chip members 110, and a self-fluxing alloy surface (self-fluxing alloy coating layer) exposed on one surface 100 </ b> A of the wear-resistant plate 100. 122) is separated by the binder 120 and is independent of each other. Therefore, even if a crack occurs in the self-fluxing alloy coating layer 112 formed in a certain chip member 110, the crack is generated in the chip member 110. The self-fluxing alloy coating layer 112 does not extend to the self-fluxing alloy coating layer 112 formed on the other chip member 110 and grow.

Further, when the wear-resistant plate 100 of the present embodiment is manufactured, there is no distortion that is caused by heat treatment when manufacturing a conventionally known self-fluxing alloy-coated steel sheet (forming a self-fluxing alloy coating layer). .
In addition, according to the wear-resistant plate 100 of the present embodiment, a significant weight reduction can be achieved as compared with a conventionally known self-fluxing alloy coated steel plate.
Further, according to the wear-resistant plate 100 of the present embodiment, the plate area can be adjusted by the number of the chip members 110 arranged, so that the plate area is not limited by the size of the processing furnace, and has a large area. Even a wear-resistant plate (for example, 5 m ² or more) can be reliably manufactured.

Second Embodiment
The wear-resistant plate 200 of this embodiment shown in FIG. 2 is a metal substrate whose cross section (the BB cross section of FIG. 1A shown in FIG. 2B) is “H” shape or “I” shape. A self-fluxing alloy coating layer 212 is formed on one of the flange surfaces 211 (one side plane), and a plurality of chip members 210 arranged in a plane via the gap G2 and the gap G2 between the chip members 210. In addition, the space around the web of the metal substrate 211 is filled to bind the plurality of chip members 210, and the surface 200A of the wear resistant plate 200 is formed with the surface of the self-fluxing alloy coating layer 212 exposed. And a binder 220 which covers the other flange surface (the other side plane surface) of the plurality of chip members 210 and forms the other surface 200B of the wear-resistant plate 200.

The chip member 210 constituting the wear-resistant plate 200 of the present embodiment is formed by forming a self-fluxing alloy coating layer 212 on one of the flange surfaces (one side plane) of the metal substrate 211.
Here, the “flange” means the left and right vertical bars constituting the letter “H” when the cross section is “H” shape, and “I” when the cross section is “I” shape. The upper and lower horizontal bars that make up the characters "".
“Web” means a horizontal bar constituting the letter “H” when the cross section is “H” shape, and “I” when the cross section is “I” shape. The vertical bar that constitutes
Further, the “flange surface” refers to a flat surface on the outer side of the flange (the side opposite to the side where the web is located).

The size of the metal substrate 211 constituting the chip member 210 is not particularly limited, and the flange surface width (W2) is 10 to 100 mm, the flange surface length (L2) is 10 to 100 mm, and the height (H2). ) Is 5 to 100 mm.
As a constituent metal material of the metal substrate 211, the same metal material as that constituting the metal substrate 111 in the first embodiment can be exemplified.

  The self-fluxing alloy coating layer 212 formed on the metal substrate 211 is one of the flange surfaces of the metal substrate 211 or one of the flange surfaces of a steel material (H-shaped steel or I-shaped steel) for forming the metal substrate 211. In addition, the self-fluxing alloy coating layer 112 can be formed in the same manner as in the first embodiment.

  In addition, when the self-fluxing alloy coating layer is formed on one of the flange surfaces in the steel material (H-shaped steel or I-shaped steel) for forming the metal base material 211, the steel material in which the self-fluxing alloy coating layer 212 is formed. Is cut into a predetermined length (L2), whereby the chip member 210 can be manufactured.

As shown in FIG. 2 (1), in the wear-resistant plate 200 of this embodiment, 80 chip members 210 are arranged in a plane (10 rows × 8 columns) via a gap G2 filled with a binder 220. Has been. The number of the chip members 210 arranged is not limited to 80, and can be changed as appropriate according to the area of the wear-resistant plate.
Here, the width of the gap between the adjacent chip members 210 (gap G2 on one surface 200A of the wear-resistant plate 200) can be arbitrarily adjusted within a range in which good wear resistance and the like are maintained.

As with the binder 120 shown in the first embodiment, the binder 220 constituting the wear-resistant plate 200 of this embodiment cures a curable binder forming material or melts and solidifies a thermoplastic binder forming material. Can be formed.
In the wear-resistant plate 200 of the present embodiment, since the binder 220 is also filled in the space around the web of the metal base material 211 constituting the tip member 210, the tip from the binder 220 is caused by the so-called anchor effect. The pulling resistance of the member 210 can be increased.

<Third Embodiment>
The wear-resistant plate 300 of this embodiment shown in FIG. 3 is a flange in a metal substrate 311 whose cross section (the CC cross section of FIG. 1A shown in FIG. 3B) is a “U” shape. A self-fluxing alloy coating layer 312 is formed on one of the surfaces (one side plane), and a plurality of chip members 310 arranged in a plane via the gap G3, the gap G3 between the chip members 310, and the metal substrate The space inside the material 311 (the space surrounded by the two flanges and the web of the metal base material 311) was filled to bind the plurality of chip members 310, and the surface of the self-fluxing alloy coating layer 312 was exposed. A binder 320 that forms one surface 300A of the wear-resistant plate 300 in a state and covers the other flange surface (the other flat surface) of the plurality of chip members 310 to form the other surface 300B of the wear-resistant plate 300; It is provided.

The chip member 310 constituting the wear-resistant plate 300 of the present embodiment has a self-fluxing alloy coating layer 312 formed on one of the flange surfaces (one side plane) of the metal substrate 311.
Here, “flange” refers to the upper and lower horizontal bars that form the letter “ko”.
“Web” refers to a vertical bar that forms the character “ko”.
Further, the “flange surface” refers to a flat surface on the outer side of the flange (the side opposite to the side where the web is located).

The size of the metal substrate 311 constituting the chip member 210 is not particularly limited, and the flange surface width (W3) is 10 to 100 mm, the flange surface length (L3) is 10 to 100 mm, and the height (H3). ) Is 5 to 100 mm.
Examples of the constituent metal material of the metal substrate 311 include the same metal materials as those constituting the metal substrate 111 in the first embodiment.

  The self-fluxing alloy coating layer 312 formed on the metal substrate 311 is formed on the first flange surface of the metal substrate 311 or one of the flange surfaces of a steel material (C-shaped steel) for forming the metal substrate 311. The self-fluxing alloy coating layer 112 can be formed in the same manner as in the embodiment.

  In addition, when the self-fluxing alloy coating layer is formed on one of the flange surfaces in the steel material (C-shaped steel) for forming the metal base material 311, the steel material on which the self-fluxing alloy coating layer 312 is formed has a predetermined length. The chip member 310 can be manufactured by cutting the length (L3).

As shown in FIG. 3A, in the wear-resistant plate 300 of the present embodiment, 80 chip members 310 are arranged in a plane (10 rows × 8 columns) through a gap G3 filled with a binder 320. Has been. Note that the number of the chip members 310 arranged is not limited to 80, and can be appropriately changed according to the area of the wear-resistant plate.
Here, the width of the gap between the adjacent tip members 310 (gap G3 on one surface 300A of the wear-resistant plate 300) can be arbitrarily adjusted within a range in which good wear resistance and the like are maintained.

As with the binder 120 shown in the first embodiment, the binder 320 constituting the wear-resistant plate 300 of this embodiment cures a curable binder forming material or melts and solidifies a thermoplastic binder forming material. Can be formed.
In the wear-resistant plate 300 of this embodiment, since the binder 320 is also filled in the space inside the metal base 311 constituting the tip member 310, the tip member 310 from the binder 320 is caused by a so-called anchor effect. The pull-out resistance can be increased.

<Fourth embodiment>
The wear-resistant plate 400 of this embodiment shown in FIG. 4 has a shape such that the D1-D1 cross section of FIG. (1) shown in FIG. A self-fluxing alloy coating layer 412 is formed on one surface (one side plane) of a prismatic metal base 411 having a rectangular D2-D2 cross section in FIG. The plurality of chip members 410 arranged in a plane via the gap G4 and the gap G4 between the chip members 410 are filled to bind the plurality of chip members 410, and the surface of the self-fluxing alloy coating layer 412 is attached. One surface 400A of the wear-resistant plate 400 is formed in an exposed state, and the other surface (the other side plane) of the plurality of chip members 410 is covered to form the other surface 400B of the wear-resistant plate 400. ing.

The chip member 410 constituting the wear-resistant plate 400 of the present embodiment is formed by forming a self-fluxing alloy coating layer 412 on one surface (one side plane) of the metal substrate 411.
The metal base material 411 constituting the chip member 410 is a prismatic base material having a bottom surface and a cross section (D1-D1 cross section) in a shape in which two identical trapezoidal upper bases are overlapped.

The size of the metal substrate 411 constituting the chip member 210 is not particularly limited, and the width (W4) of one surface and the other surface is 10 to 100 mm, the length (L4) of one surface and the other surface is 10 to 100 mm, The height (H4) is 5 to 100 mm.
Examples of the constituent metal material of the metal base 411 include the same metal materials as those constituting the metal base 111 in the first embodiment.

The self-fluxing alloy coating layer 412 formed on the metal base material 411 is formed on one surface of the metal base material 411 or a steel material for forming the metal base material 411 on the self-fluxing alloy coating layer 112 shown in the first embodiment. It can be formed in the same manner as the forming method.
In addition, when the self-fluxing alloy coating layer is formed on one surface of the steel material for forming the metal base material 411, the steel material on which the self-fluxing alloy coating layer 412 is formed is cut into a predetermined length (L4). Thus, the chip member 410 can be manufactured.

As shown in FIG. 4A, in the wear-resistant plate 400 of this embodiment, 80 chip members 410 are arranged in a plane (10 rows × 8 columns) through a gap G4 filled with a binder 420. Has been. The number of the chip members 410 arranged is not limited to 80, and can be changed as appropriate according to the area of the wear-resistant plate.
Here, the width of the gap between the adjacent tip members 410 (gap G4 on one surface 400A of the wear-resistant plate 400) can be arbitrarily adjusted within a range in which good wear resistance and the like are maintained.

The binder 420 constituting the wear-resistant plate 400 of the present embodiment cures the curable binder forming material or melts and solidifies the thermoplastic binder forming material in the same manner as the binder 120 shown in the first embodiment. Can be formed.
In the wear-resistant plate 400 of the present embodiment, the intermediate portion in the height direction of the metal base 411 constituting the tip member 410 is bound, and the binder 420 is also filled in the space around the constricted portion. Therefore, the pulling resistance of the chip member 410 from the binder 420 can be increased by the so-called anchor effect.

<Fifth Embodiment>
The wear-resistant plate 500 of this embodiment shown in FIG. 5 includes an E1-E1 cross section of FIG. 1A shown in FIG. 2B and E2-E2 of FIG. 1A shown in FIG. A self-fluxing alloy coating layer 512 is formed on one surface (one-side plane) of the metal base 511 whose cross-section is such that the upper bases of two identical trapezoids are overlapped with each other. In a state where the plurality of chip members 510 arranged in a plane via the gap G5 between the chip members 510 are filled to bind the plurality of chip members 510 and the surface of the self-fluxing alloy coating layer 512 is exposed. In addition to forming one surface 500A of the wear-resistant plate 500, a binder 520 that covers the other surface (the other side plane) of the plurality of chip members 510 to form the other surface 500B of the wear-resistant plate 500 is provided.

The chip member 510 constituting the wear resistant plate 500 of the present embodiment is formed by forming a self-fluxing alloy coating layer 512 on one surface (one side plane) of the metal substrate 511.
The metal base material 511 constituting the chip member 510 is a base material having a three-dimensional shape such that the upper surfaces of two identical square frustums are overlapped.

The size of the metal substrate 511 constituting the chip member 510 is not particularly limited, and the width (W5) of one surface and the other surface is 10 to 100 mm, the length (L5) of one surface and the other surface is 10 to 100 mm, The height (H5) is 5 to 100 mm.
Examples of the constituent metal material of the metal substrate 511 include the same metal materials as those constituting the metal substrate 111 in the first embodiment.

  The self-fluxing alloy coating layer 512 formed on the metal base material 511 can be formed on one surface of the metal base material 511 in the same manner as the method for forming the self-fluxing alloy coating layer 112 shown in the first embodiment.

As shown in FIG. 5 (1), in the wear-resistant plate 500 of this embodiment, 80 chip members 510 are arranged in a planar shape (10 rows × 8 columns) through a gap G5 filled with a binder 520. Has been. The number of chip members 510 arranged is not limited to 80, and can be changed as appropriate according to the area of the wear-resistant plate.
Here, the width of the gap between adjacent chip members 510 (gap G5 on one surface 500A of wear-resistant plate 500) can be arbitrarily adjusted within a range in which good wear resistance and the like are maintained.

The binder 520 constituting the wear-resistant plate 500 of the present embodiment cures the curable binder forming material or melts and solidifies the thermoplastic binder forming material in the same manner as the binder 120 shown in the first embodiment. Can be formed.
In the wear-resistant plate 500 of the present embodiment, the intermediate portion in the height direction of the metal base 511 constituting the tip member 510 is bundled, and the binder 520 is also filled in the space around the bundled portion. Therefore, the pulling resistance of the chip member 510 from the binder 520 can be increased by the so-called anchor effect.

<Sixth Embodiment>
The wear-resistant plate 600 of this embodiment shown in FIG. 6 has a metal base having a shape in which trapezoidal upper and lower bases having the same FF cross-section of FIG. (1) shown in FIG. A self-fluxing alloy coating layer 612 is formed on one surface (one side plane) of the material 611, and a plurality of chip members 610 arranged in a plane with a gap therebetween are filled in a gap between the chip members 610. A plurality of tip members 610 are bound to form one surface 600A of the wear-resistant plate 600 with the surface of the self-fluxing alloy coating layer 612 exposed, and the other surface (the other side plane) of the plurality of tip members 610 is formed. And a binder 620 that covers and forms the other surface 600B of the wear-resistant plate 600.

The chip member 610 constituting the wear-resistant plate 600 of this embodiment has a self-fluxing alloy coating layer 612 formed on one surface (one side plane) of the metal base 611.
The metal substrate 611 constituting the tip member 610 is a three-dimensional (substantially drum-shaped) substrate in which the upper surfaces of two identical truncated cones are overlapped.

The size of the metal base 611 constituting the chip member 610 is not particularly limited, and the diameter of the circle on one side (one side plane) and the other side (the other side plane) is 5 to 20 mm, and the height (H6) is. 5 to 20 mm.
Examples of the constituent metal material of the metal substrate 611 include the same metal materials as those constituting the metal substrate 111 in the first embodiment.

  The self-fluxing alloy coating layer 612 formed on the metal substrate 611 can be formed on one surface of the metal substrate 611 in the same manner as the method for forming the self-fluxing alloy coating layer 112 shown in the first embodiment.

As shown in FIG. 6A, in the wear-resistant plate 600 of this embodiment, 75 chip members 610 are arranged in a planar shape. The number of chip members 610 arranged is not limited to 75, and can be changed as appropriate according to the area of the wear-resistant plate.
Here, the width of the gap between the adjacent chip members 610 in the same row can be arbitrarily adjusted as long as good wear resistance and the like are maintained.

The binder 620 constituting the wear-resistant plate 600 of the present embodiment cures the curable binder forming material or melts and solidifies the thermoplastic binder forming material in the same manner as the binder 120 shown in the first embodiment. Can be formed.
In the wear-resistant plate 600 of this embodiment, the intermediate portion in the height direction of the metal base 611 constituting the tip member 610 is constricted, and the binder 620 is also provided in the space around the constricted portion (reduced diameter portion). Therefore, the pulling resistance of the chip member 610 from the binder 620 can be increased by a so-called anchor effect.

As mentioned above, although embodiment of this invention was described, this invention is not limited to these, A various change is possible.
For example, the metal base material constituting the chip member is not particularly limited as long as it is a base material having a flat surface (one side flat surface) exposed on one surface of the wear-resistant plate, and various shapes are used. Can do.

The wear-resistant plate of the present invention can be used in various fields such as industrial machinery, transportation equipment, machine tools, powder conveyance (equipment / piping), and waste treatment facilities.
Specific applications include quarry transportation equipment, stone collision part protection plates, metal scrap processing equipment transportation equipment, falling object collision floors, truck bed floors, powder transportation piping, insulation members, etc. can do.
The wear-resistant plate of the present invention can be applied (attached) to a curved surface by taking advantage of its flexibility (flexibility).

DESCRIPTION OF SYMBOLS 100 Wear-resistant plate 110 Tip member 111 Metal base material 112 Self-fluxing alloy coating layer 120 Binder 200 Wear-resistant plate 210 Chip member 211 Metal base material 212 Self-fluxing alloy coating layer 220 Binder 300 Wear-resistant plate 310 Chip member 311 Metal base material 312 Self-fluxing alloy coating layer 320 Binder 400 Wear-resistant plate 410 Chip member 411 Metal substrate 412 Self-fluxing alloy coating layer 420 Binder 500 Wear-resistant plate 510 Chip member 511 Metal substrate 512 Self-fluxing alloy coating layer 520 Binder 600 Wear-resistant plate 610 Chip member 611 Metal substrate 612 Self-fluxing alloy coating layer 620 Binder M1 Formwork (lower mold)
M2 plate-shaped upper mold

Claims (3)

A self-fluxing alloy coating layer is formed on the one side plane of the metal substrate having a plane on each of the one side and the other side, and a plurality of chip members arranged in a plane with a gap therebetween,
Filling the gap to bind the plurality of tip members, forming one surface of a wear-resistant plate to be described later with the surface of the self-fluxing alloy coating layer exposed, and forming the other side plane of the plurality of tip members A method for producing a wear-resistant plate comprising a binder that covers and forms the other side of the wear-resistant plate described later ,
A step of arranging each of the plurality of chip members in a planar manner through a gap, with the self-fluxing alloy coating layer on the lower side in a mold,
Filling the gap with a binder-forming material and charging the material into the mold so as to cover the other side surface of the plurality of chip members with the material; and
By curing or melting and solidifying the charged material, the surface of the self-fluxing alloy coating layer is exposed to bind the plurality of chip members to form one surface of the wear-resistant plate. Forming the other surface of the wear-resistant plate by covering the other side plane of the plurality of chip members with the binder formed by curing or solidifying
A method for producing a wear-resistant plate, comprising: The tip member, Ri rectangular metal piece der the self-fluxing alloy coating layer is formed,
The method for manufacturing a wear-resistant plate according to claim 1, further comprising a step of cutting the flat bar on which the self-fluxing alloy coating layer is formed into a predetermined length to produce the tip member. 2. The method for manufacturing a wear-resistant plate according to claim 1, further comprising a step of cutting the die steel material having the self-fluxing alloy coating layer into a predetermined length to produce the tip member.

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