JP6369845B2 - Deposition equipment - Google Patents

Description

  The present invention relates to a film forming apparatus, and more particularly, to a roll to roll film forming apparatus that forms a film on a long substrate in a vacuum atmosphere or a reduced pressure atmosphere while conveying the long substrate by a roll to roll method. It relates to a technique suitable for use.

  A film-wrapping technique based on roll-to-roll, in which a substrate on which a film or foil is wound in a roll shape is rewound in a vacuum, continuously formed by a technique such as sputtering or vapor deposition, and further wound in a roll shape. Manufacturing processes such as barrier films for food packaging films, film capacitor electrodes, transparent conductive films for touch panels, display devices (liquid crystal, organic EL, electronic paper) using plastic films as substrates, lighting devices, polyimide and copper It is actively used in various situations such as applying a surface coating to a flexible substrate laminated with various types of solar cells based on metal foil or resin film, and long materials such as hot-rolled steel strips. .

  In such roll-to-roll film formation, when the roll is placed in the atmosphere and the processing chamber is in a reduced pressure state such as a vacuum, the film formation unit and the roll are A means for sealing the gap is necessary.

As an example of a structure for performing differential exhaust, which is an example of such a seal, while continuously feeding a long strip such as a cold strip or a hot rolled steel strip, vacuum deposition, ion plating When surface coating is performed by a so-called dry plating method such as sputtering, the degree of vacuum is successively increased while reaching the dry plating region by a plurality of space regions having different pressure differences (hereinafter referred to as differential pressure chambers). A differential pressure that induces the continuous passage of long materials while maintaining the pressure difference between the differential pressure chambers using the air-to-air system that is being lowered. Seals are known (Patent Documents 1 to 4).
In such a differential pressure seal, in order to maintain the sealed state, the exhaust is reduced in pressure by an exhaust means such as a pump.

  In addition, there has been a technical demand for performing processing for generating powder on a long substrate during film formation.

Japanese Patent Publication No. 06-72101 Japanese Patent No. 2614516 Japanese Unexamined Patent Publication No. 02-054767 Japanese Patent Laid-Open No. 01-172570

  However, conventionally, in a seal in an apparatus for forming a film under reduced pressure while transporting a long substrate, it is not assumed that powder is generated from the processing chamber. There was a problem that it was not provided assuming that powder was mixed.

The film forming apparatus of the present invention is a film forming apparatus for forming a film on a long substrate by a roll-to-roll method,
A deposition unit;
A first transport unit and a second transport unit respectively disposed at the front stage and the rear stage of the film forming unit;
A delivery unit disposed upstream of the first transport unit;
A winding unit disposed downstream of the second transport unit;
As the pressure when the film formation process is performed in the film formation unit, the internal pressure of the film formation unit is P1, the internal pressure of the transfer chamber adjacent to the film formation unit in the first transfer unit is P2, and the second When the internal pressure of the transfer chamber adjacent to the film forming unit in the transfer unit is defined as P3, the condition A; P1 <P2 and P1 <P3 with respect to these internal pressures
Pressure control means satisfying,
Have
The pressure control means is a flow rate variable valve,
The flow rate variable valve includes: a first exhaust line that communicates a transport chamber adjacent to the film forming unit and an exhaust unit in the first transport unit; a transport chamber adjacent to the film forming unit in the second transport unit; A second exhaust line communicating with the exhaust means, and
The conductance of the variable flow rate valve is controlled so that the gas flow from the transfer chamber adjacent to the film forming unit to the film forming unit flows in a viscous flow region .

The film forming apparatus of the present invention is a film forming apparatus for forming a film on a long substrate by a roll-to-roll method,
A deposition unit;
A first transport unit and a second transport unit respectively disposed at the front stage and the rear stage of the film forming unit;
A delivery unit disposed upstream of the first transport unit;
A winding unit disposed downstream of the second transport unit;
As the pressure when the film formation process is performed in the film formation unit, the internal pressure of the film formation unit is P1, the internal pressure of the transfer chamber adjacent to the film formation unit in the first transfer unit is P2, and the second When the internal pressure of the transfer chamber adjacent to the film forming unit in the transfer unit is defined as P3, the condition A; P1 <P2 and P1 <P3 with respect to these internal pressures
Pressure control means satisfying,
Have
The pressure control means is a gas supply means;
The gas supply means includes: a first exhaust line that communicates a transport chamber adjacent to the film forming unit and the exhaust means in the first transport unit; a transport chamber adjacent to the film forming unit in the second transport unit; Each can be connected to a second exhaust line communicating with the exhaust means,
The gas supply amount of the gas supply means is controlled so that the gas flow from the transfer chamber adjacent to the film formation unit to the film formation unit becomes a flow in a viscous flow region .

The film forming apparatus of the present invention is a film forming apparatus for forming a film on a long substrate by a roll-to-roll method,
A deposition unit;
A first transport unit and a second transport unit respectively disposed at the front stage and the rear stage of the film forming unit;
A delivery unit disposed upstream of the first transport unit;
A winding unit disposed downstream of the second transport unit;
As the pressure when the film formation process is performed in the film formation unit, the internal pressure of the film formation unit is P1, the internal pressure of the transfer chamber adjacent to the film formation unit in the first transfer unit is P2, and the second When the internal pressure of the transfer chamber adjacent to the film forming unit in the transfer unit is defined as P3, the condition A; P1 <P2 and P1 <P3 with respect to these internal pressures
Pressure control means satisfying,
Have
The pressure control means is a gas supply means;
The gas supply means is connectable to a transfer chamber adjacent to the film formation unit in the first transfer unit and to a transfer chamber adjacent to the film formation unit in the second transfer unit;
The gas supply amount of the gas supply means is controlled so that the gas flow from the transfer chamber adjacent to the film formation unit to the film formation unit becomes a flow in a viscous flow region .

In the present invention, the pressure control means controls the gas flow from the transfer chamber adjacent to the film forming unit to the film forming unit so that the gas flow becomes a flow in the viscous flow region, thereby adjoining the film forming unit. It is possible to prevent powder from entering the transfer chamber.

  According to the present invention, the delivery unit and the take-up unit are provided in the atmosphere, so that a long substrate is transported from atmospheric pressure to a reduced pressure during film formation, and the film formation unit under reduced pressure is sealed. It becomes possible to do.

  According to the present invention, even when film formation is performed on a long substrate, it is possible to prevent powder from entering the transport unit from the film formation unit.

1 is a schematic front view showing a first embodiment of a film forming apparatus according to the present invention. It is a schematic front view which shows 2nd Embodiment of the film-forming apparatus which concerns on this invention. It is a model front view which shows the film-forming unit in 3rd Embodiment of the film-forming apparatus which concerns on this invention. It is a schematic front view which shows the conveyance unit in 4th Embodiment of the film-forming apparatus which concerns on this invention. It is a schematic diagram which shows the pressure state of the conveyance unit in 4th Embodiment of the film-forming apparatus which concerns on this invention. It is a schematic front view which shows the film-forming unit in 5th Embodiment of the film-forming apparatus which concerns on this invention. It is a schematic front view which shows the conveyance unit in 6th Embodiment of the film-forming apparatus which concerns on this invention. It is a schematic side view which shows the conveyance unit in 7th Embodiment of the film-forming apparatus which concerns on this invention.

Hereinafter, a first embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic front view showing a film forming apparatus in the present embodiment. In the figure, reference numeral 1 denotes a film forming apparatus.

  Each embodiment shown below is described by way of example in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified. Further, the drawings used in the following description change or schematically show the dimensional ratios of the constituent elements for the sake of convenience in order to make the features of the present invention easier to understand, and are not necessarily the same as the actual ones. Absent.

  As shown in FIG. 1, the film forming apparatus 1 according to the present embodiment forms a film on a long substrate T by a roll-to-roll method. The first transport unit 20 disposed at the front stage, the second transport unit 30 disposed at the rear stage of the film forming unit 10, the delivery unit 41 disposed at the front stage of the first transport unit 20, and the second transport unit 30 A take-up unit 42 disposed in the subsequent stage and a pressure control means 50 for controlling the pressure when the film forming process is performed in the film forming unit 10 are provided.

The film forming unit 10 is a vacuum chamber, and as shown in FIG. 1, a film can be formed while a long substrate T moves inside the film forming unit 10. Processing is performed in a state where the powder is generated or the powder is flying.
Inside the film forming unit 10, a cathode plate 11 is provided at a position facing the moving substrate T. The cathode plate 11 is disposed so as to have a predetermined distance from the substrate T based on the film forming conditions.

  These cathode plates 11 are configured as a sputtering target or a plasma CVD cathode (film formation source). The selection, combination method, number used, arrangement, etc., of the sputtering target or the cathode for plasma CVD are appropriately set according to the type of material to be deposited, the deposition mode, and the like.

  In addition, although it has shown as a structure which forms into a film on both surfaces of the base material T in the figure, it is good also as single-sided film formation. Further, various vacuum film forming methods such as a vacuum deposition method, a sputtering method, and a plasma CVD method are applicable. A power supply unit (not shown) is connected to the cathode plate 11 via a power connection point 11a.

  An exhaust unit 13 is installed in the film forming unit 10 via an exhaust line 12. The exhaust unit 13 can use an oil diffusion pump, a turbo molecular pump, a rotary pump, or the like as a gas transfer type pump. Furthermore, a low-temperature condensing type low-temperature exhaust means such as a cryopanel or a cryocoil and a low-temperature exhaust means equipped with a cooler (not shown) for cooling a cooling medium circulating through the low-temperature condensing source are employed as a pump. You can also In this case, a fluorocarbon refrigerant, liquid nitrogen, or liquid helium can be used as the cooling medium. Further, the exhaust unit 13 can be arranged in a combination or a switchable structure with a combination of exhaust means such as a pump which is a large number of these types.

  The film forming unit 10 is provided with a gas introducing means 14 for introducing a predetermined process gas (rare gas or reactive gas) necessary for sputtering or plasma CVD into the film forming unit 10.

The first transport unit 20 is arranged upstream of the film forming unit 10 and transports the long substrate T sent from the sending unit 41 to the film forming unit 10 while maintaining a sealable state. .
The first transfer unit 20 is configured in multiple stages. As an example, as shown in FIG. 1, a transfer chamber 21A provided adjacent to the film forming unit 10, a transfer chamber 21B connected to the transfer chamber 21A, and a transfer A transfer chamber 21C connected to the chamber 21B and a transfer chamber 21D that is connected to the transfer chamber 21C and receives the elongated substrate T sent out from the sending-out unit 41 can be provided.

  As shown in FIG. 1, these transfer chambers 21A to 21D are provided with exhaust units 23A to 23D through exhaust lines 22A to 22D, respectively. In addition, a variable valve 51 is provided as a pressure control means 50 to be described later in the exhaust line 22A provided in the transfer chamber 21A adjacent to the film forming unit 10.

  These transfer chambers 21 </ b> A to 21 </ b> D are finally pressurized so that they can be sealed between the film forming unit 10 side that is a film forming atmosphere in a reduced pressure state and the delivery unit 41 side that is at atmospheric pressure. It is a differential exhaust seal with a pressure difference to create a gradient.

  The second transport unit 30 is disposed downstream of the film forming unit 10 and transports from the film forming unit 10 the long substrate T wound up by the winding unit 42 so as to be sealed. As shown in FIG. 1, the second transport unit 30 has substantially the same configuration as the first transport unit 20 except that the traveling direction of the base T is reversed, and thus the description of the corresponding configuration is omitted. . Here, in the 2nd conveyance unit 30, the code | symbol of the 20th generation in description of the 1st conveyance unit 20 shall be read as the 30th generation. A variable valve 52 is provided in the exhaust line 32A provided in the transfer chamber 31A adjacent to the film forming unit 10 as pressure control means 50 described later.

  These transfer chambers 31 </ b> A to 31 </ b> D have a pressure difference so that a pressure gradient is finally generated between the film forming unit 10 side which is a reduced pressure film forming atmosphere and the winding unit 42 side which is atmospheric pressure. It is a differential exhaust seal.

  The delivery unit 41 and the winding unit 42 are provided in the atmosphere as shown in FIG.

The pressure control means 50 sets the internal pressure of the film forming unit as P1 when the film forming process is performed in the film forming unit 10, and the transfer chamber 21A adjacent to the film forming unit 10 in the first transfer unit 20 is used. When the internal pressure is defined as P2 and the internal pressure of the transfer chamber 31A adjacent to the film forming unit 10 in the second transfer unit 30 is defined as P3, the condition A for these internal pressures; P1 <P2 and P1 <P3
It can be controlled to satisfy.

  In the present embodiment, by controlling the flow rate variable valve 51 provided in the exhaust line 22A connected to the transfer chamber 21A adjacent to the film forming unit 10, the film forming state in a reduced pressure state such as a vacuum is formed. With respect to the film unit 10, the inside of the transfer chamber 21A adjacent to the film formation unit 10 is set to be positive pressure.

  Specifically, the conductance of the variable flow valve 51 is set so that the gas flow from the transfer chamber 21A connected to the front stage of the film forming unit 10 to the film forming unit 10 becomes a flow in the viscous flow region instead of the molecular flow region. Control. As a result, the transfer chamber 21A has a positive pressure higher than the inside of the film forming unit 10, and the state in which the powder does not move from the film forming unit 10 to the adjacent transfer chamber 21A is maintained during the film forming process. It is possible to prevent entry into 23A. Furthermore, by making the inside of the transfer chamber 21A positive with respect to the film forming unit 10, the powder can be prevented from entering the transfer chamber 21B adjacent to the transfer chamber 21A and the transfer chambers 21C and 21D in the previous stage. it can.

  At the same time, in this embodiment, by controlling the variable valve 52 provided in the exhaust line 32A connected to the transfer chamber 31A adjacent to the film forming unit 10, the film forming state in a reduced pressure state such as a vacuum is set. The film forming unit 10 is set to have a positive pressure in the transfer chamber 31A adjacent to the film forming unit 10.

  Specifically, the conductance of the variable flow rate valve 52 is controlled so that the gas flow from the transfer chamber 31A to the film forming unit 10 becomes a flow in the viscous flow region instead of the molecular flow region. As a result, the transfer chamber 31A connected to the subsequent stage of the film forming unit 10 has a positive pressure rather than the inside of the film forming unit 10, and the powder does not move from the film forming unit 10 to the adjacent transfer chamber 31A. Can be prevented from entering the exhaust unit 33A. Further, the inside of the transfer chamber 31A can be set to a positive pressure with respect to the film forming unit 10, and powder can be prevented from entering the transfer chamber 31B adjacent to the transfer chamber 31A and the transfer chambers 31C and 31D in the subsequent stages.

  In the film forming apparatus 1 according to the present embodiment, the powder intrusion into the transfer chamber 21A and the transfer chamber 31A adjacent to the front and rear stages of the film forming unit 10 is thus prevented, and the exhaust units 23A and 33A It is possible to prevent the influence caused by the powder from occurring.

  In the film forming apparatus 1 according to the present embodiment, it is sufficient that the above-described pressure state is realized in a film forming state where powder is generated, and other states may be set in a state where no powder is generated. Is possible.

  In the present embodiment, the transport unit 21 and the transport unit 31 are both multi-stage configurations. However, the present invention is not limited to this configuration, and the transport unit 20 and the transport unit 30 may be configured as a single stage. Other configurations can also be adopted. In the case of the transport unit 20 and the transport unit 30 having only one stage, the transport units 20 and 30 are controlled by controlling the variable valves 51 and 52 provided in the exhaust lines 22 and 32 connected to the transport unit 20 and the transport unit 30. Is set to a positive pressure from the inside of the film forming unit 10.

Even when the transport unit 20 and the transport unit 30 have other stages, the exhaust lines 22 and 32 connected to the transport chambers 21 and 31 adjacent to the film forming unit 10 out of the transport unit 20 and the transport unit 30. By controlling the variable valves 51 and 52 provided in the transfer unit 20, the transfer units 20 and 30 are set to a positive pressure rather than the inside of the film forming unit 10.
Furthermore, the transfer chambers 21A and 31A adjacent to the film forming unit 10 can be set to a positive pressure more than the inside of the film forming unit 10, and the transfer chamber further away from the film forming unit 10 can be further set to a positive pressure. It is.

  Furthermore, as indicated by broken lines in FIG. 1, the exhaust units 23A and 33A can be provided with powder recovery means 24A and 34A for recovering the powder discharged from the exhaust units 23A and 33A.

Hereinafter, a second embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings.
FIG. 2 is a schematic front view showing the film forming apparatus in the present embodiment.
In the present embodiment, the only difference from the first embodiment shown in FIG. 1 is the portion related to the pressure control means 50, so the corresponding components are given the same reference numerals and the description thereof is omitted.

In the present embodiment, as the pressure control means 50, the transfer chamber 21A and the transfer chamber 31A are provided with a gas supply means 53 that can be connected so as to supply gas to the transfer chamber 21A, as shown in FIG. The gas supply means 54 is configured to be connectable so that gas can be supplied to the transfer chamber 31A.
The gas supply means 53 can be connected to the exhaust line 22A via a gas supply line 53a shown as a solid line arrow in the figure, and the gas supply means 54 exhausts via a gas supply line 54a shown as a solid line arrow in the figure. It can be connected to the line 32A.

  In the present embodiment, by controlling the gas supply means 53 provided in the exhaust line 22A provided in the transfer chamber 21A adjacent to the film forming unit 10, the film forming state in a reduced pressure state such as a vacuum is formed. The film unit 10 is set so that the inside of the transfer chamber 21 </ b> A adjacent to the film formation unit 10 has a positive pressure.

  Specifically, the gas supply amount in the gas supply means 53 is set so that the gas flow from the transfer chamber 21A to the film forming unit 10 is a flow in the viscous flow region instead of the molecular flow region. As a result, the transfer chamber 21A connected to the front stage of the film forming unit 10 has a higher positive pressure than the inside of the film forming unit 10, and a gas flow from the exhaust line 22A to the film forming unit 10 via the transfer chamber 21A is generated. Thus, the powder can be prevented from entering the exhaust unit 23A in a state where the powder does not move from the film forming unit 10 to the adjacent transfer chamber 21A. Further, the inside of the transfer chamber 21A can be set to a positive pressure with respect to the film forming unit 10, and powder can be prevented from entering the transfer chamber 21B adjacent to the transfer chamber 21A and the transfer chambers 21C and 21D in the previous stage.

  At the same time, by controlling the gas supply means 54 provided in the exhaust line 32A provided in the transfer chamber 31A adjacent to the film forming unit 10, the film forming unit 10 in a film forming state in a reduced pressure state such as a vacuum is obtained. On the other hand, the inside of the transfer chamber 31A adjacent to the film forming unit 10 is set to be positive pressure.

Specifically, the gas supply amount in the gas supply unit 54 is controlled so that the gas flow from the transfer chamber 31 </ b> A to the film forming unit 10 becomes a flow in the viscous flow region instead of the molecular flow region. As a result, the transfer chamber 31A connected to the rear stage of the film forming unit 10 has a negative pressure more than the inside of the film forming unit 10, and a gas flow from the exhaust line 32A to the film forming unit 10 via the transfer chamber 31A is generated. As a result, the powder can be prevented from entering the exhaust unit 33A in a state where the powder does not move from the film forming unit 10 to the adjacent transfer chamber 31A. Furthermore, the inside of the transfer chamber 31A can be set to a negative pressure with respect to the film forming unit 10, and powder can be prevented from entering the transfer chamber 31B adjacent to the transfer chamber 31A and the transfer chambers 31C and 31D at the subsequent stages.

  In addition, as the pressure control means 50, the flow variable valves 51 and 52 and the gas supply means 53 and 54 in the first embodiment can be provided side by side, and powder intrusion can be further prevented.

In the pressure control means 50 of the present embodiment, the gas supply means 53 can be connected to the exhaust line 22A via the gas supply line 53a shown as a solid arrow in FIG. It may be possible to connect to the transfer chamber 21A via the supply line 53b. Further, the gas supply means 54 can be connected to the exhaust line 32A via a gas supply line 54a shown as a solid arrow in FIG. 2, but the transfer chamber is connected via a gas supply line 54b shown as a broken arrow in the drawing. 31A may be connectable.

Hereinafter, a third embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings.
FIG. 3 is a schematic front view showing the film forming apparatus in the present embodiment.
In the present embodiment, the only difference from the first embodiment shown in FIG. 1 and the second embodiment shown in FIG. A description thereof will be omitted.

  As the film forming apparatus 1 of the present embodiment, while continuously feeding a long material (substrate) T such as a long thin strip, for example, a cold rolled steel or a hot rolled steel strip, vacuum deposition, ion plating, Surface coating may be performed by a so-called dry plating method such as sputtering, and in particular, a film forming unit 10 that performs film forming processing by spraying powder onto the surface or front and back surfaces of the substrate T may be provided.

  As shown in FIG. 3, the film forming unit 10 includes a plurality of rolls 15 a to 15 c and nozzles 16 a and 16 b that eject powder. As shown in FIG. 3, the film forming unit 10 performs the film forming process by spraying powder from the nozzles 16a and 16b onto the front and back surfaces of the substrate T. In the double-sided film formation, the nozzles 16a and 16b are arranged such that the nozzles 16a and 16b are sprayed on the lower surface of the base T at the position of the roll 15b, which is the previous stage, and the subsequent roll is applied to the upper surface of the base T. It arrange | positions so that it may spray by 15c.

  A powder supply means (not shown) is connected to the nozzles 16a and 16b, and the powder used for the film forming process is ejected. These nozzles 16a, 16b may have a plurality of predetermined number of jet outlets in the axial direction of the rolls 15b, 15c, or may be configured to jet powder over the entire width of the substrate T. The nozzle 16a ejects powder from the lower side of the roll 15b, and the nozzle 16b is arranged to eject powder from the upper side of the roll 15c.

  The distance between the rolls 15a and 15b is such that the length of the substrate T stretched between the rolls 15a and 15b is two to five times the roll radius, and the distance between the rolls 15b and 15c is the same. Set to

  As for the arrangement of the roll 15b and the roll 15c, the arc length with which the substrate T is in close contact with the surface of the roll 15b serving as a draft angle for forming the film on the roll 15b is in the range of 30 ° to 90 ° in terms of the roll center angle, or 45 The roll 15c is arranged so as to have the same turning angle.

  Further, the subsequent stage of the roll 15c is the final stage in the film forming unit 10 so that the roll is not provided up to the transfer chamber 31A so that the powder is not sandwiched between the base T and the roll. .

  As the film forming apparatus of the present embodiment, the lower side position of the roll 15b with respect to the base T wound around the roll 15b following the roll 15a while feeding the base T conveyed from the transfer chamber 21A by the rolls 15a to 15c. Then, the powder is ejected from the nozzle 16a, the one surface (lower side) of the substrate T is processed, and then the substrate T wound around the roll 15c downstream of the roll 15b is positioned above the roll 15b from the nozzle 16b. Powder is ejected and the other side (upper side) of the substrate T is processed. As the film forming unit 10, the substrate T is sent directly to the transfer chamber 31A at the subsequent stage of the roll 15c.

In the present embodiment, even when the amount of powder in the film forming unit 10 is extremely large as compared with the above-described embodiment, the transfer units 21 and 31 are set to have a positive pressure than the inside of the film forming unit 10, and the powder is transferred to the transfer unit. It is possible to prevent leakage to 21 and 31.
Moreover, it becomes possible to reduce that the powder on the base T is sandwiched between the rolls 15a to 15c and the base T.

Hereinafter, a fourth embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings.
FIG. 4 is a schematic front view showing the transport unit in the present embodiment.
In the present embodiment, the only difference from the third embodiment shown in FIG. 3 is the portion related to the transport unit 20 and the transport unit 30, and the corresponding components are denoted by the same reference numerals and description thereof is omitted. To do.

The film forming apparatus 1 of the present embodiment is a so-called vacuum deposition, ion plating, sputtering, or the like while a long material such as a long thin strip such as a cold rolled or hot rolled steel strip is continuously fed. The surface coating can be applied by a dry plating method.
The transport units 20 and 30 sequentially increase the degree of vacuum and then lower it while reaching the dry plating region (film formation unit) 10 by a plurality of space regions having a pressure difference (hereinafter referred to as differential pressure chambers). The air-to-air system is used, and it is a differential pressure seal that induces continuous passage of long materials while maintaining such a pressure difference between the differential pressure chambers. ing.

In the present embodiment, the transport unit 30 will be illustrated and described.
The transport unit 30 includes a single guide roll that guides the winding of the long thin ribbon at the boundary between the space regions having a pressure difference. The guide roll surrounds the outer periphery over almost a half circumference. A concave arc-shaped sealing surface that forms a very small gap only with respect to the outer peripheral surface of the guide roll except for the winding area of the ribbon, and the back surface of the elongated ribbon in the winding area of the elongated ribbon In addition, a sealing attachment having a second concave arc-shaped sealing surface that directly forms a very small gap with respect to both side edges is arranged.

This sealing attachment opens on the second concave arc-shaped sealing surface with a width that is slightly larger than the cross-sectional dimension of the long ribbon but narrower than the roll width of the guide roll, and is wound around the guide roll. It has an elongate passage that guides the ribbon to a spatial region with a pressure difference.
The single guide roll is composed of a hollow roll having a large number of small holes on the outer peripheral surface of the roll, and the inside of the hollow roll has a suction port facing the inner periphery of the hollow roll, and is long in the winding region. A cylindrical member that sucks and adheres the thin ribbon to the outer peripheral surface of the roll is provided.

The transport unit 30 of the present embodiment includes transport chambers 31A to 31E that maintain a multi-stage differential pressure state, and guide rollers 35A to 35F, sealing attachments 36A to 36F, and differential pressure chambers are provided in the transport chambers 31A to 31E, respectively. It has casings 37A-37E. Since all of the transfer chambers 31A to 31E have substantially the same structure so that pressure differences can be set in multiple stages, the transfer chamber 31A will be described.
In the transfer chamber 31A, a guide roll 35A is supported by bearings on the boundary corresponding to the entrance side of the substrate T of the transfer chamber 31A, that is, on the film forming unit 10 side. The long base T is wound around the outer periphery of the guide roll 35A so as to have a winding region 351 that is wound with a predetermined winding contact angle.

  The sealing attachment 36 </ b> A forms a very small gap δ <b> 1 facing the guide roll 35 </ b> A via the base T in the winding region 351, and the outer periphery of the guide roll 35 </ b> A at a position different from the winding region 351 of the base T. And has a concave arc-shaped seal region 361 that forms a very small gap δ2 with respect to the outer peripheral surfaces of the sealing attachment 36A and the guide roll 35A. Further, the sealing attachment 36A includes an elongated passage that guides the substrate T wound around the guide roll 35A in the winding region 351 to the space (film formation unit) 10 on the pressure reducing side having a pressure difference.

The pressure P3 in the transfer chamber 31A is set higher than the pressure P1 in the film forming unit 10, the pressure P3B in the next transfer chamber 31B is set higher than the pressure P3 in the transfer chamber 31A, and the next transfer chamber 31C. Is set higher than the pressure P3B of the transfer chamber 31B, the pressure P3D of the next transfer chamber 31D is set higher than the pressure P3C of the transfer chamber 31C, and the pressure P3E of the next transfer chamber 31E is The pressure P3D of the transfer chamber 31E is set to be lower than the atmospheric pressure P0 at which the subsequent winding unit 42 is located.
That is, P1 <P3 <P3B <P3C <P3D <P3E.

  Further, the guide rolls 35A to 35E are hollow rolls having a large number of small holes on the outer peripheral surface of the roll, and a fixed column member having a plurality of suction ports is incorporated inside the hollow roll, and the suction port of the column member is The suction port is connected to a vacuum pump in communication with a suction port provided on the fixed support shaft that holds the cylindrical member, and the base T is sucked and adhered to the outer surface of the roll 35A in the winding region 351 while the base T is being fed. It can also be set as a structure.

By adopting such a configuration, a sealing means capable of differential evacuation can be configured.
A specific setting example of the pressure state of the differential exhaust is shown in FIG.
In the figure, the pressure in the multistage transfer chambers 31A to 31E is shown.

In the present embodiment, the multi-stage transport unit is set so as to simply increase or decrease the pressure difference, but the pressure P3B of the transfer chamber 31B can be set lower than the pressure P3 of the transfer chamber 31A.
That is, P1 <P3, P3> P3B.

In this case, the pressure P3C of the next transfer chamber 31C is set higher than the pressure P3B of the transfer chamber 31B, and the pressure P3D of the next transfer chamber 31D is set higher than the pressure P3C of the transfer chamber 31C. The pressure P3E of the transfer chamber 31E at the stage is set to be higher than the pressure P3D of the transfer chamber 31D, and the pressure P3E of the transfer chamber 31E is set to be lower than the atmospheric pressure P0 at which the subsequent winding unit 42 is located. The
That is, P3B <P3C <P3D <P3E.

  Thus, if the internal pressure of the transfer chamber adjacent to the film forming unit 10 is set to a positive pressure, other pressure settings can be set arbitrarily.

Hereinafter, 5th Embodiment of the film-forming apparatus which concerns on this invention is described based on drawing.
FIG. 6 is a schematic front view showing the film forming apparatus in the present embodiment.
In the present embodiment, since only the part related to the film forming unit 10 is different from the third embodiment shown in FIG. 3, the corresponding components are denoted by the same reference numerals and the description thereof is omitted.

  As shown in FIG. 6, the film forming unit 10 of the present embodiment includes a powder recovery unit 17 provided at the bottom thereof. As shown in FIG. 6, the film forming unit 10 performs film forming processing by spraying powder from the nozzles 16a and 16b onto the front and back surfaces of the substrate T. At this time, a large amount of powder remains after the film forming processing. Is done.

The powder recovery means 17 has a funnel-shaped inclined bottom 17 a provided at the bottom of the film forming unit 10 and a powder tank 17 b for storing the recovered powder.
According to this configuration, of the powder discharged from the nozzles 16a and 16b, the portion not used for film formation of the substrate T falls and is collected by the funnel-shaped inclined bottom 17a and stored in the powder tank 17b. The Thereby, it is possible to reduce the powder staying in the vicinity of being connected to the transport units 21 and 31 on the upper side of the film forming unit 10.

Hereinafter, a sixth embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings.
FIG. 7 is a schematic front view showing the film forming apparatus in the present embodiment.
This embodiment differs from the first embodiment shown in FIG. 1, the second embodiment shown in FIG. 2, the third embodiment shown in FIG. 3, and the fifth embodiment shown in FIG. Since only the part relating to the body recovery means 14, 17, 24A, 34A is provided, the corresponding components are denoted by the same reference numerals and the description thereof is omitted. In the drawing, a part of the transport unit 20 and the transport unit 30 is omitted.

  As shown in FIG. 7, the powder recovery means 14, 17, 24A, and 34A of the present embodiment are configured to reuse the powder recovered from the film forming unit 10, the transfer chamber 21A, and the transfer chamber 31A. .

As shown in FIG. 7, the powder recovery means 17 of the present embodiment has a funnel-shaped inclined bottom 17a provided so as to be substantially half of the front side of the bottom of the film forming unit 10. Means 17A and switching powder recovery means 17B having a funnel-shaped inclined bottom 17a provided so as to be approximately half of the remaining rear stage side of the bottom of the film forming unit 10. Each of these switching powder recovery means 17A, 17B has a valve 17c between the bottom of the inclined bottom 17a and the powder tank 17b, and a valve 17d provided further below the powder tank 17b. It is connected to the powder regeneration means 17F through this valve 17d.
The powder regenerating unit 17F regenerates the collected powder and is connected to a powder supply unit (not shown).

  The powder recovery means of the present embodiment includes a switching powder recovery means 17A or a switching powder recovery means 17B, in which one of the valves 17c is opened and the valve 17d is closed, and the switching powder is closed. Of the body recovery means 17A or the switching powder recovery means 17B, the valve 17c of the other system is closed and the valve 17d is opened. Thereby, the powder stored in the powder tank 17b can be transferred to the powder regeneration means 17F in the switching powder recovery means of the system in which the valve 17d is opened.

  Moreover, the transfer of the recovered powder to the powder regeneration means 17F can be performed while continuing the powder recovery in the switching powder recovery means of the system in which the valve 17d is closed. It is possible to carry out powder recovery sequentially while maintaining the membrane.

  As shown in FIG. 7, the powder recovery means 14 of this embodiment is connected to the exhaust unit 13 via the exhaust line 12 and recovers powder from the exhaust of the film forming unit 10. Similarly to the powder recovery means 17, the powder recovery means 14 also includes a high performance dust collector (filter) 14 a, a powder recovery tank 14 b, a high performance dust collector (filter) 14 c, and a powder recovery tank 14 d. It is arranged so that it can be switched in series and connected to the powder regeneration means 17F. As a result, by switching the system, the recovered powder can be transferred to the powder regeneration unit 17F while the film forming unit 10 forms a film.

  As shown in FIG. 7, the powder recovery means 24A of this embodiment is connected to an exhaust unit 23A via an exhaust line 22A, and recovers powder from the exhaust in the transfer chamber 21A. Also in the powder recovery means 24A, like the powder recovery means 14 and 17, a high performance dust collector (filter) 24a, a powder recovery tank 24b, a high performance dust collector (filter) 24c, and a powder recovery tank 24d are used. Therefore, the recovered powder can be transferred to the powder regenerating unit 17F while forming the film in the film forming unit 10 by switching between the two systems. .

  As shown in FIG. 7, the powder recovery means 34A of this embodiment is connected to an exhaust unit 33A via an exhaust line 32A, and recovers powder from the exhaust in the transfer chamber 31A. In the powder recovery means 34A, as in the powder recovery means 14, 17, 24A, a high performance dust collector (filter) 34a, a powder recovery tank 34b, a high performance dust collector (filter) 34c, and a powder recovery tank 34d. As described above, by switching between the two systems so as to be connectable to the powder regenerating unit 17F, the recovered powder can be transferred to the powder regenerating unit 17F while forming a film in the film forming unit 10. It is.

  In this embodiment, since the discharged powder can be collected and regenerated while performing the film forming process, a process that requires a large amount of powder and a process that has low powder utilization efficiency during the film forming process. It is possible to efficiently regenerate the powder when performing the process.

Hereinafter, a seventh embodiment of a film forming apparatus according to the present invention will be described with reference to the drawings.
FIG. 8 is a schematic front view showing the film forming apparatus in the present embodiment.
In the present embodiment, the only difference from the sixth embodiment shown in FIG. 7 is the part relating to the powder recovery means 17C, 17D, and therefore the corresponding components are denoted by the same reference numerals and description thereof is omitted. To do.

  As shown in FIG. 8, the powder recovery means of the present embodiment has a funnel-shaped inclined bottom 17a on the right side provided so as to be substantially half of the bottom of the film forming unit 10 along the direction of travel of the substrate T. And a switching powder recovery means 17C having a funnel-shaped inclined bottom 17a provided so as to be approximately half of the remaining left side of the bottom of the film forming unit 10. Each of these switching powder recovery means 17C, 17D has a valve 17c between the bottom of the inclined bottom 17a and the powder tank 17b, and a valve 17d provided further below the powder tank 17b. It is connected to the powder regeneration means 17F through this valve 17d. The powder regeneration means 17F is connected to a powder supply means (not shown).

  In the present embodiment, the powder recovery means is arranged so that it can be switched between the two systems and connected to the powder regeneration means 17F in this way, thereby transferring the recovered powder to the powder regeneration means 17F. It can be executed while film formation is performed in the unit 10.

DESCRIPTION OF SYMBOLS 1 ... Film-forming apparatus 10 ... Film-forming unit 20 ... 1st conveyance unit 21A-21D ... Transfer chamber 22A ... 1st exhaust line 23A ... Exhaust means 30 ... 2nd transfer unit 31A-31D ... Transfer chamber 32A ... 2nd exhaust line 33A ... Exhaust means 50 ... Pressure control means 51, 52 ... Flow rate variable valves 53, 54 ... Gas supply means

Claims (5)

A film forming apparatus for forming a film on a long substrate by a roll-to-roll method,
A deposition unit;
A first transport unit and a second transport unit respectively disposed at the front stage and the rear stage of the film forming unit;
A delivery unit disposed upstream of the first transport unit;
A winding unit disposed downstream of the second transport unit;
As the pressure when the film formation process is performed in the film formation unit, the internal pressure of the film formation unit is P1, the internal pressure of the transfer chamber adjacent to the film formation unit in the first transfer unit is P2, and the second When the internal pressure of the transfer chamber adjacent to the film forming unit in the transfer unit is defined as P3, the condition A; P1 <P2 and P1 <P3 with respect to these internal pressures
Pressure control means satisfying,
Have
The pressure control means is a flow rate variable valve,
The flow rate variable valve includes: a first exhaust line that communicates a transport chamber adjacent to the film forming unit and an exhaust unit in the first transport unit; a transport chamber adjacent to the film forming unit in the second transport unit; A second exhaust line communicating with the exhaust means, and
The film forming apparatus , wherein the conductance of the variable flow rate valve is controlled so that the gas flow from the transfer chamber adjacent to the film forming unit to the film forming unit flows in a viscous flow region . A film forming apparatus for forming a film on a long substrate by a roll-to-roll method,
A deposition unit;
A first transport unit and a second transport unit respectively disposed at the front stage and the rear stage of the film forming unit;
A delivery unit disposed upstream of the first transport unit;
A winding unit disposed downstream of the second transport unit;
As the pressure when the film formation process is performed in the film formation unit, the internal pressure of the film formation unit is P1, the internal pressure of the transfer chamber adjacent to the film formation unit in the first transfer unit is P2, and the second When the internal pressure of the transfer chamber adjacent to the film forming unit in the transfer unit is defined as P3, the condition A; P1 <P2 and P1 <P3 with respect to these internal pressures
Pressure control means satisfying,
Have
The pressure control means is a gas supply means;
The gas supply means includes: a first exhaust line that communicates a transport chamber adjacent to the film forming unit and the exhaust means in the first transport unit; a transport chamber adjacent to the film forming unit in the second transport unit; Each can be connected to a second exhaust line communicating with the exhaust means,
The film forming apparatus , wherein the gas supply amount of the gas supply means is controlled so that the gas flow from the transfer chamber adjacent to the film forming unit to the film forming unit becomes a flow in a viscous flow region . A film forming apparatus for forming a film on a long substrate by a roll-to-roll method,
A deposition unit;
A first transport unit and a second transport unit respectively disposed at the front stage and the rear stage of the film forming unit;
A delivery unit disposed upstream of the first transport unit;
A winding unit disposed downstream of the second transport unit;
As the pressure when the film formation process is performed in the film formation unit, the internal pressure of the film formation unit is P1, the internal pressure of the transfer chamber adjacent to the film formation unit in the first transfer unit is P2, and the second When the internal pressure of the transfer chamber adjacent to the film forming unit in the transfer unit is defined as P3, the condition A; P1 <P2 and P1 <P3 with respect to these internal pressures
Pressure control means satisfying,
Have
The pressure control means is a gas supply means;
The gas supply means is connectable to a transfer chamber adjacent to the film formation unit in the first transfer unit and to a transfer chamber adjacent to the film formation unit in the second transfer unit;
The film forming apparatus , wherein the gas supply amount of the gas supply means is controlled so that the gas flow from the transfer chamber adjacent to the film forming unit to the film forming unit becomes a flow in a viscous flow region . Said pressure control means, the gas flow to the film forming unit from the conveying chamber adjacent to the deposition unit by controlling such that the flow of the viscous flow region, towards the conveying chamber adjacent from the deposition unit The film forming apparatus according to any one of claims 1 to 3, wherein a powder is prevented from entering. Film forming apparatus according to any one of claims 1 to 4 and the feeding unit and the take-up unit is characterized in that it is provided in the atmosphere.

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