JP6365365B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus that processes a through hole in a workpiece by using a laser.

  2. Description of the Related Art A laser processing apparatus that processes a nozzle hole in a nozzle body of a fuel injection valve using a laser is known. The laser processing apparatus includes a laser shielding member positioned between the nozzle hole and the inner wall of the nozzle body positioned in the laser irradiation direction in the nozzle body. The laser shielding member shields the inner wall of the nozzle body from the laser so as to prevent the laser passing through the nozzle hole from damaging the inner wall of the nozzle body. However, since this laser shielding member is damaged by the irradiated laser, it is necessary to replace it at a certain frequency. Thus, for example, Patent Document 1 describes a laser processing apparatus that includes an optical fiber as a laser shielding member and guides the irradiated laser to the outside of the nozzle body through the inside of the optical fiber.

European Patent No. 1661658

  However, in the laser processing apparatus described in Patent Document 1, if the output of the laser is large, the optical fiber is likely to be damaged. Therefore, it is necessary to reduce the output of the laser for processing the nozzle hole to such an extent that the optical fiber is not damaged. For this reason, the processing man-hour of a nozzle hole becomes comparatively long. Further, since a different device for absorbing the laser led out of the nozzle body is required, the size of the device may be increased.

  The present invention has been made in view of the above points, and an object of the present invention is to support a laser reflecting portion irradiated with a laser while maintaining the output of a laser passing through a through hole to be processed into a workpiece. It is providing the laser processing apparatus which can reduce the replacement frequency of a part.

The present invention is a laser processing apparatus that processes a through hole in a workpiece using a laser, and a laser irradiation unit that irradiates the workpiece with a laser that processes the through hole from one side of the workpiece; A laser reflecting portion provided on the opposite side of the workpiece to be irradiated with the laser, and a laser reflecting portion provided on the opposite side of the laser reflecting portion from the side on which the first reflecting surface and the second reflecting surface are formed. And a support part that supports the laser reflecting part so that the laser is irradiated.
The laser processing apparatus of the present invention is capable of reflecting the first reflecting surface whose angle formed with the irradiation direction of the laser that processes the through hole is larger than 0 degree and smaller than 90 degrees, and the laser reflected on the first reflecting surface. The laser reflecting portion has the second reflecting surface.

When a through hole is formed in a member to be processed using a laser, if the through hole penetrates, the laser penetrates through the through hole into a space on the opposite side to the side irradiated with the laser. In the laser processing apparatus of the present invention, the penetrating laser is irradiated to the laser reflecting portion provided on the side opposite to the side irradiated with the laser of the workpiece. The laser reflecting portion has a first reflecting surface whose angle formed with the laser irradiation direction is larger than 0 degree and smaller than 90 degrees, and a second reflecting surface capable of reflecting the laser reflected by the first reflecting surface. Yes. The laser that has penetrated into the space on the opposite side of the workpiece to be irradiated with the laser is first reflected on the first reflecting surface in the laser reflecting portion and then reflected on the second reflecting surface.
Thus, in the laser processing apparatus of the present invention, the laser is reflected at least twice at the laser reflecting portion. As a result, the intensity of the laser is attenuated by reflection from the first reflecting surface and the second reflecting surface, so that the laser reaches the support portion provided on the opposite side of the laser reflecting portion to which the laser is irradiated. However, the degree of damage to the support portion is reduced. Therefore, the laser processing apparatus of the present invention can reduce the replacement frequency of the support part without reducing the laser output.

  In addition, since the laser processing apparatus of the present invention can attenuate the intensity of the laser only by the laser reflecting portion, it is not necessary to provide a device that absorbs the laser unlike the laser processing apparatus described in Patent Document 1. Thereby, the physique of a laser processing apparatus can be maintained.

It is sectional drawing of a fuel injection valve provided with the nozzle body processed by the laser processing apparatus by 1st embodiment of this invention. FIG. 2 is an enlarged view of the vicinity of a nozzle body in FIG. 1. 1 is an overall schematic diagram of a laser processing apparatus according to a first embodiment of the present invention. It is a laser processing apparatus by 1st embodiment of this invention, Comprising: It is an enlarged view of the laser processing apparatus in the state in which the nozzle body was set. It is an enlarged view of the V section of FIG. It is an enlarged view of the VI section of FIG. It is an enlarged view of the VII part of FIG. It is a whole schematic diagram of the laser processing apparatus by 2nd embodiment of this invention. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 2nd embodiment of this invention is provided. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 3rd embodiment of this invention is provided. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 4th embodiment of this invention is provided. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 5th embodiment of this invention is provided. It is a whole schematic diagram of the laser processing apparatus by 6th embodiment of this invention. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 7th embodiment of this invention is provided. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 8th embodiment of this invention is provided. It is an enlarged view of the laser shielding member with which the laser processing apparatus by 9th embodiment of this invention is provided. It is a whole schematic diagram of the laser processing apparatus by 10th Embodiment of this invention. It is an enlarged view of the XVIII part of FIG.

Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. The third to fifth and eighth to tenth embodiments correspond to modes for carrying out the invention described in the claims.
(First embodiment)
The laser processing apparatus 1 according to the first embodiment is used for processing a nozzle body 93 as a “processed member” of the fuel injection valve 90 for diesel fuel shown in FIG.

First, the configuration of the fuel injection valve 90 processed by the laser processing apparatus will be described.
As shown in FIGS. 1 and 2, the fuel injection valve 90 includes a nozzle body 93 and a valve seat 94 as a “wall surface on the opposite side of the workpiece to be irradiated with laser” of the nozzle body 93. The needle 95 is provided so as to be able to be separated and contacted, and an electromagnetic drive unit 96 capable of driving the needle 95 in the axial direction.

  A sac chamber 97 is defined between the needle 95 in contact with the valve seat 94 and the nozzle body 93. The nozzle body 93 has an injection hole 98 as a “through hole” that communicates the outside of the nozzle body 93 and the sac chamber 97. The fuel introduced into the nozzle body 93 is supplied to the sac chamber 97 when the needle 95 moves away from the valve seat 94 and is injected to the outside through the nozzle hole 98. The nozzle hole 98 is processed by the laser processing apparatus 1.

  Next, the configuration of the laser processing apparatus 1 will be described with reference to FIGS. The laser processing apparatus 1 includes a laser irradiation unit 11, a work chuck 12, a laser shielding member 13, a work driving unit 14, a control unit 15, and the like. 3 and 5 to 7, the laser locus in the laser processing apparatus 1 is indicated by a two-dot chain line Lz <b> 0.

  The laser irradiation unit 11 includes a laser oscillator 111, a laser scanning unit 113, and the like. The laser irradiation unit 11 can process the nozzle hole 98 by irradiating the nozzle body 93 with a laser from the outer wall side.

  The laser oscillator 111 includes an optical resonator. The laser oscillator 111 is electrically connected to the control unit 15 (solid arrow L111 in FIG. 3). The laser oscillator 111 amplifies light based on the ON / OFF signal and the irradiation condition signal output from the control unit 15, and oscillates the laser. The laser oscillated by the laser oscillator 111 is guided to the laser scanning unit 113 via the plurality of mirrors 114.

  The laser scanning unit 113 is electrically connected to the control unit 15 (solid arrow L113 in FIG. 3). The laser scanning unit 113 scans the laser guided from the optical system 112 based on the scanning condition signal output from the control unit 15. The scanned laser beam is condensed by the condensing lens 115 and applied to the outer wall of the nozzle body 93.

  The work chuck 12 can hold the nozzle body 93. The work chuck 12 is fixed to a work driving unit 14 described later.

  The laser shielding member 13 is a substantially rod-shaped member. The laser shielding member 13 is made of, for example, ceramics. As shown in FIG. 3, the laser shielding member 13 is inserted into a nozzle body 93 supported by the work chuck 12.

The laser shielding member 13 includes a main body part 134 as a “supporting part”, a laser reflecting part 135, and the like. In the first embodiment, the main body part 134 and the laser reflecting part 135 are integrally formed.
The main body 134 is a central portion of the laser shielding member 13 provided on the central axis CA0 of the laser shielding member 13. The main body part 134 is formed in a substantially rod shape, and supports the laser reflection part 135 so that the laser reflection part 135 is irradiated with laser.
The laser reflecting portion 135 is provided on the radially outer side of the end portion of the main body portion 134 on the side inserted into the nozzle body 93. As shown in FIG. 4 which is a cross-sectional view passing through the central axis CA0 of the laser shielding member 13, the laser reflecting portion 135 is provided at a position where the laser passing through the nozzle hole 98 is irradiated.

As shown in FIG. 5 which is an enlarged view of the V portion in FIG. 4, the laser reflecting portion 135 has a plurality of bottomed holes 130 on the surface.
FIG. 6 is an enlarged view of a portion VI in FIG. 5, and shows a cross-sectional view through the central axis CA0 of one hole 130. Of the wall surfaces forming the hole 130, the wall surface 136 as the “first reflecting surface” is formed so as to form an angle larger than 0 degree and smaller than 90 degrees with respect to the incident direction of the laser Lz 0 passing through the nozzle hole 98. . In the first embodiment, the wall surface 136 is formed such that the angle formed by the wall surface 136 and the incident direction of the laser Lz0 (angle θ1 shown in FIG. 6) is 40 degrees or less. This is because when the angle between the incident direction of the laser and the reflecting surface is 40 degrees or less, the reflectance becomes larger than the absorptance, but the angle formed by the wall surface 136 and the incident direction of the laser Lz0 is here. It is not limited. As shown in FIG. 7, which is an enlarged view of the VII portion in FIG. 6, the wall surface 136 has a concave shape in which the surface shape is formed from a curved surface. In FIG. 7, the central axis of the laser to be irradiated is indicated by a two-dot chain line Lz0, and boundaries indicating the spread width of the laser are indicated by one-dot chain lines Lz1 and Lz2.
A wall surface 137 as a “second reflection surface” among the wall surfaces forming the hole 130 is provided at a position where the laser Lz0 reflected by the wall surface 136 can be reflected.

  The work drive unit 14 is electrically connected to the control unit 15 (solid arrow L114 in FIG. 3). The work driving unit 14 drives the nozzle body 93 to have a predetermined posture and a predetermined position based on the position signal output from the control unit 15.

  The control unit 15 is configured mainly with a microcomputer. The control unit 15 controls the laser irradiation by the laser irradiation unit 11 and the posture and position of the nozzle body 93 by the work driving unit 14. Specifically, the control unit 15 outputs the above-described irradiation condition signal or the like to the laser irradiation unit 11 so as to irradiate the nozzle body 93 with a laser capable of processing the nozzle hole 98. Further, the control unit 15 outputs a position signal to the work driving unit 14 so that the laser beam condensed by the condensing lens 115 is irradiated to the position where the nozzle hole 98 of the nozzle body 93 is processed.

  Next, the processing method of the nozzle hole 98 in the laser processing apparatus 1 according to the first embodiment will be described.

  First, the nozzle body 93 is fixed to the work chuck 12. Next, the laser shielding member 13 is inserted into the nozzle body 93.

Next, the work drive unit 14 is driven so that the laser beam focused on the condensing lens 115 is irradiated onto the outer wall of the nozzle body 93. After fixing the relative position of the nozzle body 93 with respect to the condensing lens 115, the nozzle body 93 is irradiated with laser to perform nozzle hole processing for forming the nozzle hole 98 having a predetermined diameter and a predetermined nozzle hole direction.
When the nozzle hole 98 penetrates, the laser enters the nozzle body 93 through the nozzle hole 98. The laser that enters the nozzle body 93 is first reflected by the wall surface 136 that forms the hole 130 of the laser reflector 135. As shown in FIG. 7, the laser Lz0 reflected on the wall surface 136 having a concave surface formed from a curved surface is expanded more broadly than the laser spreading width WL0 before being reflected (for example, the spreading width shown in FIG. 7). WL1) It faces the wall surface 137 and is reflected by the wall surface 137. Thereafter, the laser beam reflected from the wall surface 137 repeats reflection on the wall surface forming the hole 130 and attenuates in intensity.
In the laser processing apparatus 1 according to the first embodiment, the nozzle hole 98 is processed in the nozzle body 93 in this way.

  Conventionally, when a nozzle hole is machined in a nozzle body by a laser, the laser that machined the nozzle hole enters the nozzle body through the penetrating nozzle hole. Since the laser entering the nozzle body is irradiated to the inner wall of the nozzle body located in the laser irradiation direction, the inner wall of the nozzle body may be damaged. Therefore, a laser shielding member that shields the inner wall of the nozzle body is provided between the inner wall of the nozzle body and the nozzle hole so as to shield the inner wall of the nozzle body so that the laser after processing the nozzle hole does not reach the inner wall of the nozzle body. Although the laser shielding member can receive the laser to prevent damage to the inner wall of the nozzle body, the laser shielding member to which the laser is irradiated is gradually damaged, so the laser shielding member needs to be replaced at a certain frequency. There is. Although it is possible to reduce the laser output and delay the progress of damage, even in this case, it is inevitable to replace the laser shielding member at a certain frequency.

  (A) The laser processing apparatus 1 according to the first embodiment is provided with the laser shielding member 13 in the irradiation direction of the laser passing through the nozzle hole 98. The laser reflecting portion 135 included in the laser shielding member 13 has a wall surface 136 formed so as to form an angle larger than 0 degree and smaller than 90 degrees with respect to the laser irradiation direction. The laser that reaches the laser shielding member 13 is first reflected on the wall surface 136 and then reflected on the wall surface 137 facing the wall surface 136. As a result, the intensity of the laser that has reached the laser reflecting portion 135 is attenuated by repeating the reflection a plurality of times. Therefore, even if the laser reaches the main body portion 134 of the laser shielding member 13, the main body portion 134 is damaged. The degree is small. Therefore, the first embodiment prevents damage to the inner wall of the nozzle body 93 located in the laser irradiation direction while maintaining the output of the laser that processes the nozzle hole 98 and also prevents the laser shielding member 13 from being damaged by laser irradiation. Exchange frequency can be reduced.

(B) Further, as in the laser processing apparatus described in Patent Document 1 described above, it is necessary to absorb and extinguish the laser led to the outside even if the laser is led to the outside using an optical fiber or the like. A device for absorbing water is required separately.
On the other hand, in the laser processing apparatus 1, since the laser is reflected a plurality of times by the laser reflecting portion 135 provided on the surface of the main body portion 134, the intensity can be greatly attenuated on the surface of the laser shielding member 13. This eliminates the need for a separate device for absorbing the laser and maintains the physique of the device.

(C) In order to reduce the degree of damage to the laser shielding member irradiated with the laser, the laser shielding member may be formed of a high melting point material such as zirconia or diamond. However, even if the laser shielding member is formed from a high-melting point material, it is gradually damaged when irradiated with a laser. Therefore, when the damage proceeds to some extent, it is necessary to replace the laser shielding member. For this reason, the use of a laser shielding member made of a relatively expensive high melting point material increases the manufacturing cost of the fuel injection valve.
Since the laser shielding member 13 of the laser processing apparatus 1 can attenuate the intensity of the laser by multiple reflections on the wall surfaces 136 and 137, the degree of damage to the laser shielding member 13 can be reduced. Thereby, the laser shielding member 13 can be formed from a material cheaper than the high melting point material as described above. Therefore, the manufacturing cost of the fuel injection valve 90 can be reduced.

(D) Moreover, as shown in FIG. 7, the wall surface 136 is a concave shape whose surface shape is formed from a curved surface. Thereby, as shown in FIG. 7, the laser beam reflected by the wall surface 136 is widened, so that the intensity of the laser per unit area is reduced. Thereby, even if the laser reaches the main body 134, the degree of damage to the radially inner ends of the main body 134 and the laser reflecting portion 135 can be reduced. Therefore, the replacement frequency of the laser shielding member 13 due to damage of laser irradiation can be further reduced.
Also, even if the laser reflected by the laser reflecting portion 135 reaches the inner wall of the nozzle body 93, the intensity of the laser is small, so the degree of damage can be reduced.

  (E) Further, even when the laser Lz0 reflected from the wall surfaces 136 and 137 exits from the hole 130, the intensity of the laser Lz0 is attenuated by a plurality of reflections on the inner wall forming the hole 130. Thereby, even if the laser Lz0 reflected a plurality of times by the laser reflecting portion 135 is irradiated to the inner wall of the nozzle body 93, the degree of damage by the laser is small. Thereby, the degree of damage of the inner wall of the nozzle body 93 by the laser can be reduced.

(Second embodiment)
Next, a laser processing apparatus according to the second embodiment of the present invention will be described with reference to FIGS. The second embodiment is different from the first embodiment in that it includes a shielding member driving unit that drives the laser shielding member and the shape of the laser shielding member. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 1st embodiment, and description is abbreviate | omitted.

  A laser processing apparatus 2 as a “laser processing apparatus” according to the second embodiment is shown in FIG. The laser processing apparatus 2 includes a laser irradiation unit 11, a work chuck 12, a laser shielding member 13, a work driving unit 14, a “rotation driving unit”, a shielding member driving unit 16 as an “axial driving unit”, and a control unit 15. Etc. In FIG. 8, a laser locus in the laser processing apparatus 2 is indicated by a two-dot chain line Lz0.

  The shielding member driving unit 16 is electrically connected to the control unit 15 (solid arrow L116 in FIG. 8). The shielding member driving unit 16 is connected to the end of the laser shielding member 23 opposite to the end inserted into the nozzle body 93. The shielding member driving unit 16 can rotate the laser shielding member 23 around the central axis CA0 and move the laser shielding member 23 in the direction of the central axis CA0 (solid arrows R8 and S8 in FIG. 8).

A laser shielding member 23 provided in the laser processing apparatus 2 is shown in FIG. The laser shielding member 23 includes a main body portion 234 as a “support portion”, a laser reflection portion 235, and the like.
The main body 234 is a central portion of the laser shielding member 23 provided on the central axis CA0 of the laser shielding member 23. The main body portion 234 is formed in a substantially rod shape, and supports the laser reflection portion 235 so that the laser reflection portion 235 is irradiated with laser.
The laser reflecting portion 235 is provided on the radially outer side of the end portion of the main body portion 234 on the side inserted into the nozzle body 93. The laser reflecting portion 235 has a plurality of inverted conical bottomed holes 230 whose inner diameter decreases toward the inner radial direction on the surface. The holes 230 are provided in the outer wall on the radially outer side of the laser reflecting portion 235 so as to be aligned in the circumferential direction and the central axis CA0 direction. The hole 230 includes a wall surface 236 as a “first reflection surface” that is first reflected when the laser Lz0 enters the hole 230 and a wall surface 237 as a “second reflection surface” that is reflected by the laser Lz0 that reflects the wall surface 236. It is formed (see FIG. 9B). The wall surface 236 is formed so that the surface shape is a concave shape formed from a curved surface.

  In the second embodiment, when the nozzle hole 98 is processed, the shielding member driving unit 16 performs at least one of rotation or axial movement of the laser shielding member 23. The laser that enters the nozzle body 93 through the nozzle hole 98 reaches the rotating laser shielding member 23. At this time, since the laser shielding member 23 rotates or moves in the axial direction, the laser that has reached the laser shielding member 23 is reflected on the wall surfaces 236 and 237 of the plurality of holes 230. Thereby, it is possible to prevent a specific part of the laser reflection unit 235 from receiving the laser Lz0 in a concentrated manner, and to prevent the specific part from being damaged earlier than other parts. Therefore, the replacement frequency of the laser shielding member 23 can be further reduced.

(Third embodiment)
Next, the laser processing apparatus by 3rd embodiment of this invention is demonstrated based on FIG. The third embodiment differs from the second embodiment in the shape of the laser shielding member. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 2nd embodiment, and description is abbreviate | omitted.

A laser shielding member 33 provided in the laser processing apparatus according to the third embodiment is shown in FIG. The laser shielding member 33 includes a main body portion 334 as a “support portion”, a laser reflection portion 335, and the like.
The main body 334 is a central portion of the laser shielding member 33 provided on the central axis CA0 of the laser shielding member 33. The main body portion 334 is formed in a substantially rod shape, and supports the laser reflection portion 335 so that the laser reflection portion 335 is irradiated with laser.
The laser reflecting portion 335 is provided on the radially outer side of the end portion of the main body portion 334 on the side inserted into the nozzle body 93. The laser reflecting portion 335 has a groove 330 formed in the circumferential direction on the radially outer surface. The groove 330 is continuously formed in a thread groove shape from an end portion on the side inserted into the nozzle body 93 toward an end portion on the opposite side to the side inserted into the nozzle body 93. The groove 330 is a wall surface as a “first reflection surface” that first reflects when the laser enters the groove 330 and a wall surface as a “second reflection surface” that reflects the wall surface as the “first reflection surface”. Formed from.

  In the third embodiment, when the nozzle hole 98 is processed, at least one of the laser shielding member 33 is rotated or moved in the axial direction by the shielding member driving unit 16. Thereby, it is possible to prevent a specific portion of the laser reflection unit 335 from receiving the laser Lz0 in a concentrated manner, and to prevent the specific portion from being damaged earlier than other portions. Therefore, the replacement frequency of the laser shielding member 33 can be further reduced.

(Fourth embodiment)
Next, the laser processing apparatus by 4th embodiment of this invention is demonstrated based on FIG. The fourth embodiment differs from the second embodiment in the shape of the laser shielding member. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 2nd embodiment, and description is abbreviate | omitted.

A laser shielding member 43 provided in the laser processing apparatus according to the fourth embodiment is shown in FIG. The laser shielding member 43 includes a main body part 434 as a “supporting part”, a laser reflecting part 435, and the like.
The main body 434 is a central portion of the laser shielding member 43 provided on the central axis CA0 of the laser shielding member 43. The main body portion 434 is formed in a substantially rod shape and supports the laser reflection portion 435 so that the laser reflection portion 435 is irradiated with laser.
The laser reflecting portion 435 is provided on the radially outer side of the end portion of the main body portion 434 on the side inserted into the nozzle body 93. The laser reflecting portion 435 has a plurality of grooves 430 formed in the circumferential direction on the radially outer surface. The groove 430 is formed concentrically around the central axis CA0. The groove 430 is formed from a wall surface as a “first reflection surface” that reflects first when the laser enters the groove 430 and a wall surface as a “second reflection surface” that reflects the wall surface that reflects the wall surface as the “first reflection surface”. Is formed.

  In the fourth embodiment, when the nozzle hole 98 is processed, the shielding member driving unit 16 rotates or moves the laser shielding member 43 in the axial direction. Thereby, it is possible to prevent a specific portion of the laser reflection unit 435 from concentrating and receiving the laser Lz0, and to prevent the specific portion from being damaged earlier than other portions. Therefore, the replacement frequency of the laser shielding member 43 can be further reduced.

(Fifth embodiment)
Next, a laser processing apparatus according to the fifth embodiment of the present invention will be described with reference to FIG. The fifth embodiment is different from the second embodiment in the shape of the laser shielding member. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 2nd embodiment, and description is abbreviate | omitted.

A laser shielding member 53 provided in the laser processing apparatus according to the fifth embodiment is shown in FIG. The laser shielding member 53 includes a main body portion 534 as a “support portion”, a laser reflecting portion 535, and the like.
The main body portion 534 is a central portion of the laser shielding member 53 provided on the central axis CA0 of the laser shielding member 53. The main body portion 534 is formed in a substantially rod shape, and supports the laser reflection portion 535 so that the laser reflection portion 535 is irradiated with laser.
The laser reflecting portion 535 is provided on the radially outer side of the end portion of the main body portion 534 on the side inserted into the nozzle body 93. The laser reflecting portion 535 has a plurality of grooves 530 on the surface. The groove 530 is formed so as to be parallel to the central axis CA0 from the end portion on the side inserted into the nozzle body 93. The groove 530 has a wall surface as a “first reflection surface” that is first reflected when the laser enters the groove 530 and a wall surface as a “second reflection surface” that is reflected by the laser that reflects the wall surface as the “first reflection surface”. Formed from.

  In the fifth embodiment, when the nozzle hole 98 is processed, the shielding member driving unit 16 performs at least one of rotation or axial movement of the laser shielding member 53. Thereby, it is possible to prevent a specific portion of the laser reflection unit 535 from receiving the laser Lz0 in a concentrated manner, and to prevent the specific portion from being damaged earlier than other portions. Therefore, the replacement frequency of the laser shielding member 53 can be further reduced.

(Sixth embodiment)
Next, the laser processing apparatus by 6th embodiment of this invention is demonstrated based on FIG. The sixth embodiment is different from the second embodiment in the shape of the laser shielding member. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 2nd embodiment, and description is abbreviate | omitted.

A laser shielding member 63 provided in the laser processing apparatus according to the sixth embodiment is shown in FIG. The laser shielding member 63 includes a main body portion 634 as a “supporting portion”, a laser reflecting portion 635, and the like.
The main body 634 is a central portion of the laser shielding member 63 provided on the central axis CA0 of the laser shielding member 63. The main body 634 is formed in a substantially rod shape, and supports the laser reflecting portion 635 so that the laser reflecting portion 635 is irradiated with laser.

The laser reflecting portion 635 is provided on the radially outer side of the end portion of the main body portion 634 on the side inserted into the nozzle body 93. The laser reflecting portion 635 has a plurality of holes 630 on the surface.
The hole 630 is formed in a bag shape. Specifically, as shown in FIG. 13B, which is an enlarged cross-sectional view of the surface of the laser reflecting portion 635, the opening 631 of the hole 630 is formed such that the inner diameter D 631 is smaller than the inner diameter D 632 inside the hole 630. Has been.

  In the sixth embodiment, when the nozzle hole 98 is processed, the laser shielding member 63 is rotated by the shielding member driving unit 16. Thereby, it is possible to prevent a specific portion of the laser reflection unit 635 from receiving the laser Lz0 in a concentrated manner, and to prevent the specific portion from being damaged earlier than other portions. Therefore, the replacement frequency of the laser shielding member 63 can be further reduced.

  The laser that has entered the hole 630 is first reflected by the inner wall 636 as the “first reflecting surface” that forms the hole 630 and then the other inner wall 637 as the “second reflecting surface” that forms the hole 630. , 638 are reflected. In the sixth embodiment, the opening 631 of the hole 630 is formed so that the inner diameter D631 is smaller than the inner diameter D632 inside the hole 630, so that the laser that has entered the hole 60 is unlikely to go out, and the inner walls 636, 637. , 638 and repeat many reflections. Thereby, in the sixth embodiment, the laser irradiated to the laser reflecting portion 635 is reflected more than the laser entering the hole whose inner diameter of the opening is larger than the inner inner diameter, and the intensity is attenuated relatively large. . Therefore, the replacement frequency of the laser shielding member 63 can be further reduced.

(Seventh embodiment)
Next, the laser processing apparatus by 7th embodiment of this invention is demonstrated based on FIG. The seventh embodiment is different from the first embodiment in that the polarization state of the laser irradiated by the laser irradiation unit can be changed. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 1st embodiment, and description is abbreviate | omitted.

  A laser processing apparatus 3 as a “laser processing apparatus” according to the seventh embodiment includes a laser irradiation unit 11, a work chuck 12, a laser shielding member 13, a work driving unit 14, a control unit 15, and the like. In FIG. 14, the locus of the laser in the laser processing apparatus 3 is indicated by a two-dot chain line Lz0.

The laser irradiation unit 11 includes a laser oscillator 111, an optical system 112, a laser scanning unit 113, and the like.
The optical system 112 is provided on the optical path between the laser oscillator 111 and the laser scanning unit 113 as shown in FIG. The optical system 112 includes a polarizing plate and the like. The optical system 112 is electrically connected to the control unit 15 (solid arrow L112 in FIG. 14). The optical system 112 changes the polarization state of the laser oscillated by the laser oscillator 111 to a desired state based on the polarization switching signal output from the control unit 15. The laser beam that has passed through the optical system 112 is guided to the laser scanning unit 113.

  The control unit 15 stores the relationship between the intensity of the laser applied to the nozzle body 93 and the processing speed of the nozzle hole 98. When machining the nozzle hole 98, the control unit 15 calculates the time required for machining the nozzle hole 98 from the thickness of the portion where the nozzle hole 98 is formed and the intensity of the irradiated laser. When the time estimated to be necessary for the processing of the nozzle hole 98 has elapsed from the time when the processing of the nozzle hole 98 by the laser has started, the control unit 15 generates a polarization switching signal for making the S component of the laser larger than the P component. Output to the optical system 112. As a result, the polarization state of the laser penetrating into the nozzle body 93 through the nozzle hole 98 becomes a state in which the S component is larger than the P component.

  In general, depending on the incident angle, when the incident angle is large, it is known that the reflectance of the S component of the laser is larger than the reflectance of the P component. Therefore, in the seventh embodiment, it is estimated that the nozzle hole 98 has penetrated, and polarization is performed so that the S component of the laser becomes larger than the P component. As a result, the laser entering the nozzle body 93 through the nozzle hole 98 has a higher reflectance than the laser when the nozzle hole 98 is processed, so the laser energy absorbed by the laser shielding member 13 is compared. Become smaller. Therefore, the replacement frequency of the laser shielding member 13 can be further reduced.

(Eighth embodiment)
Next, a laser processing apparatus according to the eighth embodiment of the present invention will be described with reference to FIG. The eighth embodiment is different from the seventh embodiment in that an optical sensor is provided in the nozzle body. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 7th embodiment, and description is abbreviate | omitted. In FIG. 15, the laser trajectory is indicated by a two-dot chain line Lz0.

The laser processing apparatus according to the eighth embodiment includes an optical sensor 18 as “laser intensity detection means”. The optical sensor 18 is provided in a position where the reflected light of the laser does not strike in the nozzle body 93, for example, at the end of the laser shielding member 43 on the side inserted into the nozzle body 93. The optical sensor 18 is electrically connected to the control unit 15. The optical sensor 18 detects the laser intensity in the nozzle body 93 and outputs a signal based on the detected laser intensity to the control unit 15.
The control unit 15 outputs a polarization switching signal to the optical system 112 based on the signal output from the optical sensor 18. At this time, the polarization state of the laser penetrating into the nozzle body 93 through the nozzle hole 98 is polarized so that the S component is larger than the P component.

  The laser processing apparatus according to the eighth embodiment includes a contact member 131 that is inserted into the nozzle body 93 together with the laser shielding member 13. The contact member 131 is formed such that an end surface 133 on the side inserted into the nozzle body 93 can contact the valve seat 94. The laser shielding member 13 is inserted into a space 132 included in the contact member 131.

  When the nozzle hole 98 penetrates and the laser enters the nozzle body 93, the laser intensity in the nozzle body 93 increases. This change in laser intensity is detected by the optical sensor 18 and output to the control unit 15. The control unit 15 outputs a polarization switching signal for switching the polarization state of the laser to the optical system 112 based on the output of the optical sensor 18. Thereby, the energy of the laser which the laser shielding member 13 absorbs becomes comparatively small. Therefore, the replacement frequency of the laser shielding member 13 can be further reduced.

  Further, the contact member 131 provided in the laser processing apparatus according to the eighth embodiment is inserted into the nozzle body 93 so that the end surface 133 on the side inserted into the nozzle body 93 contacts the valve seat 94. Thereby, debris generated by the laser can be prevented from adhering to the valve seat 94.

(Ninth embodiment)
Next, a laser processing apparatus according to a ninth embodiment of the present invention will be described with reference to FIG. The ninth embodiment is different from the seventh embodiment in that a temperature sensor is provided. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 7th embodiment, and description is abbreviate | omitted.

The laser processing apparatus according to the ninth embodiment includes a temperature sensor 19 as “temperature detection means”. The temperature sensor 19 is provided inside the laser shielding member 13 as shown in FIG. The temperature sensor 19 can detect the temperature of the laser shielding member 13. The temperature sensor 19 is electrically connected to the control unit 15. The temperature sensor 19 detects the temperature of the laser shielding member 13 and outputs a signal based on the detected temperature to the control unit 15.
The control unit 15 outputs a polarization switching signal to the optical system 112 based on the signal output from the temperature sensor 19.

  When the laser entering the nozzle body 93 is irradiated onto the laser reflecting portion 135, the temperature of the laser shielding member 13 including the laser reflecting portion 135 rises due to the energy of the laser. In the ninth embodiment, a temperature change of the laser shielding member 13 is detected by the temperature sensor 19 and output to the control unit 15. The control unit 15 outputs a polarization switching signal for switching the polarization state of the laser to the optical system 112. Thereby, the energy of the laser which the laser shielding member 13 absorbs becomes comparatively small. Therefore, the replacement frequency of the laser shielding member 13 can be further reduced.

(Tenth embodiment)
Next, a laser machining apparatus according to the tenth embodiment of the present invention is described with reference to FIGS. The tenth embodiment is different from the first embodiment in the shape of the “member to be processed”. In addition, the same code | symbol is attached | subjected to the site | part substantially the same as 1st embodiment, and description is abbreviate | omitted.

  The laser processing apparatus 4 according to the tenth embodiment processes the through-hole 75 using a laser on the plate-shaped workpiece 70. The laser processing apparatus 4 includes a laser irradiation unit 11, a support base 72 as a “holding unit”, a laser shielding member 73, a drive unit 74, and a control unit 15. In FIGS. 17 and 18, the locus of the laser in the laser processing apparatus 4 is indicated by a two-dot chain line Lz0.

  The support base 72 is provided on the drive unit 74. The support base 72 can hold the workpiece 70.

The laser shielding member 73 is provided on the side opposite to the side irradiated with the laser of the workpiece 70 and between the workpiece 70 supported by the support base 72 and the drive unit 74. The laser shielding member 73 includes a main body portion 734 and a laser reflection portion 735 as “support portions”.
The main body 734 is located on the drive unit 74 side of the laser shielding member 73. The main body 734 supports the laser reflection unit 735 so that the laser reflection unit 735 is irradiated with laser.
As shown in FIG. 18, which is an enlarged view of the XVIII portion in FIG. 17, the surface of the laser reflecting portion 735 is formed in an uneven shape. The laser reflecting portion 735 includes a wall surface 736 as a “first reflecting surface” that first reflects the laser Lz0 that passes through the through hole 75 and a wall surface 737 as a “second reflecting surface” that reflects the wall surface 736. The wall surface 736 is formed such that the angle formed by the wall surface 736 and the incident direction of the laser Lz0 (angle θ2 shown in FIG. 18) is 40 degrees or less. Further, the wall surface 736 has a concave shape whose surface shape is formed from a curved surface.
The drive unit 74 is electrically connected to the control unit 15 (solid arrow L154 in FIG. 17). The drive unit 74 drives the workpiece 70 so as to be in a predetermined posture and a predetermined position based on the position signal output from the control unit 15.

  In the tenth embodiment, the laser Lz0 passing through the through hole 75 penetrates the workpiece 70 and enters between the workpiece 70 and the drive unit 74. The laser Lz0 penetrating toward the drive unit 74 side of the workpiece 70 is irradiated to the laser shielding member 73. The laser applied to the laser reflecting portion 735 included in the laser shielding member 73 is reflected by the wall surface 736 and the wall surface 737. This prevents the main body 734 of the laser shielding member 73 from being damaged by the laser. Therefore, the tenth embodiment has the effects (a) to (e) of the first embodiment.

(Other embodiments)
(1) In the first to ninth embodiments, the laser processing apparatus processes the nozzle hole in the nozzle body of the fuel injection valve for diesel fuel. However, the member for processing the “through hole” by the laser processing apparatus is not limited to this. You may process a nozzle hole in the nozzle body of the fuel injection valve for gasoline fuels. Further, as shown in the tenth embodiment, the present invention may be applied to processing of a member to be processed having a through hole.

  (2) In the above-described embodiment, the wall surface as the “first reflective surface” is formed so that the surface shape is a concave shape formed from a curved surface. However, the surface shape may be a convex shape formed from a curved surface or a flat surface. The wall surface as the “second reflecting surface” may also be formed so that the surface shape is a concave shape or a convex shape formed from a curved surface.

  (3) In the above-described embodiment, it is assumed that the laser reflecting portion is formed with a bottomed hole or groove having a first reflecting surface whose angle to the laser irradiation direction is 40 ° C. or less. However, the shape of the laser reflecting portion is not limited to this. It suffices to have a first reflecting surface whose angle to the laser irradiation direction is larger than 0 degree and smaller than 90 degrees and a second reflecting surface capable of reflecting the laser reflected by the first reflecting surface.

  (4) In the above-described embodiment, the laser processing apparatus includes the work driving unit that drives the nozzle body to have a predetermined posture and a predetermined position. However, the work drive unit may not be provided. The laser irradiation unit may move around the nozzle body.

  (5) In the above-described embodiment, the laser irradiation unit includes a laser oscillator, a laser scanning unit, and the like. However, the configuration of the laser irradiation unit is not limited to this.

  (6) In the above-described embodiment, the laser shielding member is formed from ceramics. However, the material forming the laser shielding member is not limited to this. Since the laser shielding member is likely to be heated to a high temperature by laser irradiation, a heat resistant material or a material having good thermal conductivity is desirable, but is not limited thereto.

  (7) In the second embodiment, the laser reflecting portion has an inverted conical hole. However, the shape of the hole is not limited to this.

  (8) In the second to sixth embodiments, the shielding member driving unit is capable of rotating the laser shielding member and driving in the axial direction. However, the function of the shielding member driving unit may be rotatable or drivable in at least one of the axial directions according to the shape of the laser shielding member.

  (9) In the seventh embodiment, the polarization time of the laser is changed by estimating the time that the nozzle hole penetrates. However, the time for changing the polarization state of the laser is not limited to this. The “through hole” may be processed using a laser having a polarization state in which the S component is larger than the P component.

  (10) In the eighth embodiment, the optical sensor is provided at the end of the laser shielding member on the side inserted into the nozzle body. However, the position where the optical sensor is provided is not limited to this. Any position where the change in the laser intensity in the nozzle body can be detected may be used.

  The present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from the spirit of the invention.

1, 2, 3, 4... Laser processing apparatus 11... Laser irradiation unit 12... Work chuck (holding unit)
134, 234, 334, 434, 534, 634, 734... Main body (supporting part)
135, 235, 335, 435, 535, 635, 735... Laser reflecting portion 136, 236, 636, 736 ... First reflecting surface 137, 237, 637, 638, 737 ... Second reflecting surface 70 ... Workpiece 75 ... Through hole 93 ... Nozzle body (workpiece)
98 ... Injection hole (through hole)

Claims (9)

A laser processing apparatus (2) for processing a through hole (98) in a workpiece (93) using a laser,
A laser irradiation section (11) for irradiating the workpiece with a laser for machining the through hole from one side of the workpiece;
A first reflecting surface (236) provided on the opposite side of the workpiece to be irradiated with the laser and having an angle with the laser irradiation direction for processing the through-hole greater than 0 degree and less than 90 degrees; And a laser reflecting portion (335, 435) having a second reflecting surface (237) capable of reflecting the laser reflected by the first reflecting surface;
Support portions (334, 434) for supporting the laser reflection portion so that the laser reflection portion is irradiated with laser;
A rotation drive unit (16) capable of rotating the laser reflection unit around a central axis of the support unit;
Equipped with a,
The laser reflecting portion is provided on the radially outer side of the support portion, is formed to extend in the circumferential direction on the radially outer surface, and is formed by at least the first reflecting surface and the second reflecting surface. (330, 430) The laser processing apparatus characterized by the above-mentioned. A laser processing apparatus (2) for processing a through hole (98) in a workpiece (93) using a laser,
A laser irradiation section (11) for irradiating the workpiece with a laser for machining the through hole from one side of the workpiece;
A first reflecting surface (236) provided on the opposite side of the workpiece to be irradiated with the laser and having an angle with the laser irradiation direction for processing the through-hole greater than 0 degree and less than 90 degrees; And a laser reflecting part (535) having a second reflecting surface (237) capable of reflecting the laser reflected by the first reflecting surface;
A support portion (534) for supporting the laser reflection portion so that the laser reflection portion is irradiated with laser;
An axial drive unit (16) capable of moving the laser reflecting unit in the direction of the central axis of the support unit;
With
The laser reflecting portion is formed on an outer surface in the radial direction so as to extend in the axial direction, and has a plurality of grooves (530) formed from at least the first reflecting surface and the second reflecting surface. Processing equipment. A laser processing apparatus (3, 4) for processing through holes (75, 98) in workpieces (70, 93) using a laser,
A laser irradiation section (11) for irradiating the workpiece with a laser for machining the through hole from one side of the workpiece;
A first reflecting surface (136, 736) is provided on the opposite side of the workpiece to be irradiated with the laser, and the angle formed with the laser irradiation direction for processing the through hole is larger than 0 degree and smaller than 90 degrees. ), And a laser reflecting portion (135, 735) having a second reflecting surface (137, 737) capable of reflecting the laser reflected by the first reflecting surface;
Support portions (134, 734) for supporting the laser reflection portion so that the laser reflection portion is irradiated with laser;
Equipped with a,
The laser irradiation unit has an optical system (112) capable of changing a ratio of an S component and a P component of a laser that processes the through hole, and the processing of the through hole is started from the time when the processing of the through hole is started. A laser processing apparatus characterized in that an S component of a laser for processing the through hole is made larger than a P component when a time estimated to be necessary for the elapse of time has elapsed . Laser intensity detecting means (18) capable of detecting the intensity of the laser beam between the workpiece and the laser reflecting portion;
The laser irradiation unit, according to claim 3, characterized in that to change the ratio between the laser intensity detecting means for processing said hole based on the intensity of the laser beam detected by the laser S component and P component Laser processing equipment. A laser processing apparatus (3) for processing a through hole (98) in a workpiece (93) using a laser,
A laser irradiation section (11) for irradiating the workpiece with a laser for machining the through hole from one side of the workpiece;
A first reflecting surface (136) that is provided on the opposite side of the workpiece to be irradiated with the laser and has an angle that is greater than 0 degree and less than 90 degrees with the direction of irradiation of the laser that processes the through hole; And a laser reflecting portion (135) having a second reflecting surface (137) capable of reflecting the laser reflected by the first reflecting surface;
Support portions (134, 734) for supporting the laser reflection portion so that the laser reflection portion is irradiated with laser;
Laser intensity detecting means (18) capable of detecting the intensity of laser light between the workpiece and the laser reflecting portion;
Equipped with a,
The laser irradiation unit has an optical system (112) capable of changing the ratio of the S component and the P component of the laser that processes the through hole, and is based on the intensity of the laser beam detected by the laser intensity detecting means. A laser processing apparatus , wherein a ratio of an S component and a P component of a laser for processing the through hole is changed . The temperature detecting means (19) capable of detecting the temperature inside the laser reflecting portion is further provided,
The said laser irradiation part changes the ratio of the S component of the laser which processes the said through-hole based on the temperature inside the said laser reflective part which the said temperature detection means detects, and a P component, It is characterized by the above-mentioned. The laser processing apparatus according to any one of 3 to 5 . A laser processing apparatus (3) for processing a through hole (98) in a workpiece (93) using a laser,
A laser irradiation section (11) for irradiating the workpiece with a laser for machining the through hole from one side of the workpiece;
A first reflecting surface (136) that is provided on the opposite side of the workpiece to be irradiated with the laser and has an angle that is greater than 0 degree and less than 90 degrees with the direction of irradiation of the laser that processes the through hole; And a laser reflecting portion (135) having a second reflecting surface (137) capable of reflecting the laser reflected by the first reflecting surface;
Support portions (134, 734) for supporting the laser reflection portion so that the laser reflection portion is irradiated with laser;
Temperature detecting means (19) capable of detecting the temperature inside the laser reflecting portion;
Equipped with a,
The laser irradiation unit includes an optical system (112) capable of changing a ratio of an S component and a P component of a laser that processes the through hole, and an internal temperature of the laser reflection unit detected by the temperature detection unit. The laser processing apparatus is characterized in that the ratio of the S component and the P component of the laser that processes the through hole is changed based on the above . Wherein the first at least one reflective surface and the second reflecting surface, the laser processing according to any one of claims 1 to 7, wherein the surface shape is concave or convex is formed from a curved surface apparatus. Wherein any one of claims 1, characterized by further comprising a contact member (131) capable of contacting the opposite side of the wall to the side on which the laser is irradiated in the workpiece (94) 8 The laser processing apparatus as described.

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