JP6334199B2 - Foreign device removing apparatus for piezoelectric device, its transport tray, and method for manufacturing piezoelectric device - Google Patents

Description

  The present invention relates to a foreign device removing apparatus for a piezoelectric device used in an electronic apparatus or the like, its transport tray, and a method for manufacturing a piezoelectric device.

  A surface-mount type piezoelectric device is manufactured by fixing a piezoelectric element, for example, a crystal element in a package, and then sealing the package with a plate-like or cap-like member.

  During this manufacturing process, if the package is sealed with foreign matter still attached to the piezoelectric element, the desired vibration characteristics cannot be obtained due to the foreign matter, or the vibration characteristics may change due to foreign matter falling off or reattaching. To do. For this reason, in the manufacture of a piezoelectric device, it is necessary to remove foreign matter before and after the frequency adjustment step or before sealing (for example, refer to the following cited references 1 and 2).

Of the cited documents 1 and 2, cited document 2 discloses a specific dust removing device that removes dust before sealing the package.
The dust removing apparatus described in the cited document 2 has a plurality of piezoelectric resonators (piezoelectric devices) arranged and held on a turntable, and piezoelectrically drives a piezoelectric device that faces the predetermined cleaning position by turning the turntable. In addition, an ion flow is sprayed on the piezoelectric device, and the separated dust is adsorbed by a dust collector provided downstream of the ion flow.

JP 2012-249063 A Japanese Patent Laid-Open No. 06-204774

  The dust collector requires a turntable and its driving device, an ion emission device, and a dust collector, and the configuration of the dust remover is complicated. In addition, since the piezoelectric devices that have come to the predetermined cleaning position are individually dusted while turning the turntable, workability is poor. In order to improve workability and increase productivity, it is necessary to add several more pairs of ion emission devices and dust removal devices at different locations on the turntable. In this case, the device configuration is further complicated.

Further, in the dust removing device, when the piezoelectric device is taken out from the device after dust removal or during the period from taking out to the next process, foreign matter (dust etc.) that has fallen due to gravity or the like is applied to the crystal piece (piezoelectric element). There is a risk of adhesion.
In order to convey to the next process, it is also possible to prevent the adhesion of foreign matter until the next device is moved to the next process by storing the piezoelectric device after dust removal in a jig or the like.
However, adhesion of foreign matter when the piezoelectric device is housed in the jig cannot be prevented, and labor and time for housing the piezoelectric device in the jig are required, and workability is further lowered, which causes a decrease in productivity.

An object of the present invention is to provide a foreign matter removing apparatus having a simple configuration and capable of efficiently removing foreign matters from a piezoelectric device.
Another object of the present invention is to provide a transport tray for a piezoelectric device that can also be used as a holding means for the foreign matter removing apparatus and prevents the adhesion of foreign matter by eliminating the need to transfer the piezoelectric device before transporting to the next process. is there.
Still another object of the present invention is to provide a method for manufacturing a piezoelectric device including a foreign matter removing step having a configuration capable of removing foreign matter from a piezoelectric device easily and efficiently.

  According to an embodiment of the present invention, there is provided a foreign matter removing apparatus for a piezoelectric device, wherein an unsealed piezoelectric device having a piezoelectric element fixed to a package faces a surface opposite to an element fixing side surface of the package to which the piezoelectric element is fixed. A plurality of external terminals provided on the surface facing upward and a holding member for holding the surface on the element fixing side of the package facing downward; and a holding member provided on the holding member, on the element fixing side of the package with respect to the piezoelectric device A foreign substance drop opening that opens below the surface, a voltage application unit that applies a voltage to a plurality of external terminals to vibrate the piezoelectric element, and the piezoelectric device held by the holding member is directed to the foreign substance drop opening And an evacuation unit that exhausts the foreign material from the foreign material drop port and removes the foreign material attached to the piezoelectric element.

  Preferably, the holding member has an intake port through which outside air can flow into a surface in contact with the surface of the package on the element fixing side.

Preferably, the holding member has a concave device receiving portion for positioning the piezoelectric device with respect to the package when the piezoelectric device is dropped with the surface on the element fixing side facing downward, and the concave device The receiving part penetrates the inner bottom part downward to form the foreign substance drop port, and supports the piezoelectric device with a frame-like inner bottom surface around the foreign substance drop hole.
More preferably, the foreign substance drop port of the holding member faces the surface of the package on which the element is fixed, and includes an exhaust hole portion communicating with the exhaust means, and a portion of the frame-shaped inner bottom surface from the exhaust hole portion. And an intake hole portion that secures an inflow path of outside air to the element fixing side by dividing the portion and extending to the outside of the piezoelectric device.

  Preferably, the holding member holds a plurality of the piezoelectric devices at the same time, and is detachable from the exhaust unit in a state where the plurality of piezoelectric devices are held, and at least a part of a transport tray of the piezoelectric devices is attached to the holding member. Configure.

  Preferably, the voltage applying means applies an AC voltage to the plurality of external terminals of the piezoelectric device, sweeps the frequency of the AC voltage, and can search for the frequency at which the largest vibration is obtained for each piezoelectric device. Has a frequency sweep function.

  The transport tray of the piezoelectric device according to one aspect of the present invention includes a plurality of unsealed piezoelectric devices each having a piezoelectric element fixed to a package, and an element fixing side surface of the package to which the piezoelectric element is fixed faces downward. A holding and conveying tray section for holding the sheet, and at least one foreign material drop opening provided on the holding and conveying tray section and opening below the surface of the package on the element fixing side of the package.

  A method for manufacturing a piezoelectric device according to one aspect of the present invention includes a step of fixing a piezoelectric element to a package, an unsealed piezoelectric device to which the piezoelectric element is fixed, and an element of the package to which the piezoelectric element is fixed. A step of holding the holding member so that a plurality of external terminals provided on a surface facing the opposite side of the fixed side face upward and a surface on the element fixing side of the package facing downward; and a plurality of the external terminals The piezoelectric element is vibrated by applying a voltage, and is held by the holder from a foreign substance drop opening provided on the holding member and opening below the surface of the package on the element fixing side of the package. In the direction from the piezoelectric device toward the foreign material drop port, exhausting and removing the foreign matter attached to the piezoelectric element, and after the foreign matter removal step, The surface of the element fixing side of the serial package including a sealing step of sealing with a sealing member.

According to said structure, the apparatus structure is simple and the foreign material removal apparatus of the structure which can perform foreign material removal efficiently from a piezoelectric device is provided.
In addition, there is provided a transport tray for a piezoelectric device that can also be used as a holding unit of the foreign matter removing apparatus and prevents the adhesion of foreign matter by eliminating the need to transfer the piezoelectric device before transporting to the next process.
Furthermore, a method for manufacturing a piezoelectric device is provided that includes a foreign matter removal step having a configuration capable of removing foreign matter from a piezoelectric device easily and efficiently.

FIG. 1A is a schematic configuration diagram (partially a cross-sectional view) of the foreign device removing apparatus for a piezoelectric device according to the first embodiment, and FIG. The schematic top view (B) seen from the means side. The top view (A) and back view (B) of the piezoelectric device which illustrate the outline internal structure which removed the package cover part. The back view of a 4-terminal piezoelectric device. Schematic configuration diagram (partially a cross-sectional view) (A) of the foreign device removing apparatus for a piezoelectric device according to the second embodiment, and voltage application showing a state where the piezoelectric device is held by a holding member of the foreign device removing apparatus The schematic top view (B) seen from the means side. The schematic top view seen from the voltage application means side which shows the state by which three holding members and three piezoelectric devices were hold | maintained at the conveyance tray of the foreign material removal apparatus of the piezoelectric device which concerns on 3rd Embodiment. FIG. 6 is a schematic cross-sectional view (A) along the line AA in FIG. 5 and a schematic cross-sectional view (B) along the line BB in FIG. 5.

Various embodiments and modifications of the present invention will be described with reference to the drawings, taking as an example the case where the piezoelectric element of the piezoelectric device is made of a crystal element. Therefore, in various embodiments and modifications of the present invention, a quartz crystal element will be described as an example of a piezoelectric element.
In the second and subsequent embodiments, the same or similar configurations as those already described may be described with the same reference numerals.

Hereinafter, description will be given in the following order.
1. 1st Embodiment: It is embodiment of the foreign material removal apparatus of a piezoelectric device containing the holding member in which the foreign material drop port is formed only by the through-hole below the crystal | crystallization element of a piezoelectric device. This embodiment includes an embodiment of a method for mounting a piezoelectric device including a foreign matter removing step using the holding member having the configuration.
2. Second Embodiment: Exhaust hole portion where a foreign substance drop port is only a through hole and communicates with the exhaust means below the crystal element of the piezoelectric device, and an intake hole extending from the exhaust hole portion to the outside of the piezoelectric device 1 is an embodiment of a foreign matter removing apparatus for a piezoelectric device including a holding member having a portion. This embodiment includes an embodiment of a method for mounting a piezoelectric device including a foreign matter removing step using the holding member having the configuration.
3. Third Embodiment: An embodiment of a transport tray capable of simultaneously holding a plurality of piezoelectric devices.
4). Modified example

<1. First Embodiment>
FIG. 1A is a schematic configuration diagram (partially a sectional view) of a foreign matter removing apparatus for a piezoelectric device according to a first embodiment of the present invention. FIG. 1B is a schematic top view seen from the voltage applying means side, showing a state in which the piezoelectric device is held by the holding member of the foreign matter removing apparatus. 2A and 2B are a top view and a back view of the piezoelectric device. Note that the top view of FIG. 2A illustrates an internal schematic configuration with the uppermost package lid 5 removed. FIG. 3 is a back view of a four-terminal piezoelectric device.
First, the structure of the piezoelectric device denoted by reference numeral 1 in FIG. 1 and the schematic manufacturing method from the piezoelectric element fixing step to the package sealing step will be described mainly with reference to FIG.

[Piezoelectric device structure and manufacturing method]
A piezoelectric device 1 shown in FIG. 2 is a two-terminal device, and has a package 2 and a crystal element 4 mounted inside a recess 2A of the package 2 as a main configuration. In the case of the four-terminal device shown in FIG. 3, an electronic component, specifically, a thermistor element as an example of a temperature-sensitive element that detects the environmental temperature of the crystal element 4, or an oscillation circuit function that oscillates the crystal element 4 2 may be provided in the recess 2A of the package, but the two-terminal device of FIG. 2 does not have a temperature sensitive element or an integrated circuit element.

  The package 2 can be mainly formed by laminating one or more insulating layers made of a ceramic material such as alumina ceramics and glass-ceramics and firing them.

  The package 2 has a recess 2 </ b> A for forming an internal space when the upper side is sealed with the package lid 5. As a preferred configuration for forming the recess 2A, the package 2 has a substrate portion and a frame portion, and when the frame portion is attached to the upper surface of the substrate portion, the frame portion is formed on the upper surface of the substrate portion. A configuration in which the surrounded recess 2A is formed can be employed. In this configuration, the substrate portion and the frame portion may be formed from the above-described ceramic material, or the substrate portion is formed from the above-described ceramic material, and the frame portion is made of a metal such as an Fe—Ni—Co alloy. You may form so that it may form a ring.

  The package lid 5 may be formed from a rectangular flat plate-shaped ceramic material, or may be formed from a rectangular flat plate-shaped Fe—Ni alloy or Fe—Ni—Co alloy. The package lid 5 functions as a sealing portion for hermetically sealing the recess 2A filled with nitrogen gas or the like in a state close to a vacuum.

As shown in FIG. 2A, connection pads 22A and 22B made of a metal material are disposed on the bottom surface of the recess 2A of the package 2 in order to bond the crystal element 4.
On the other hand, as shown in FIG. 2B, on the back surface of the package 2, for example, two external terminals 23A and 23B made of a metal material and electrically connected to each terminal of the crystal element 4 are arranged.
The connection between the connection pad 22A and the external terminal 23A is achieved by a wiring (or a wiring embedded in the ceramic material) formed on the inner bottom surface of the recess 2A and a via thereunder, although not particularly shown. Further, the connection between the connection pad 22B and the external terminal 23B is achieved by a via.

  The crystal element 4 includes a rectangular plate-shaped crystal element plate 41 and a pair of electrodes formed on both surfaces of the crystal element plate 41. As shown in FIG. 2A, each electrode covers a rectangular excitation electrode 42 widely disposed on the main surface of the crystal base plate 41 and one corner of the crystal base plate 41 so as to cover the crystal base plate 41. The connection electrode 43A is disposed on both surfaces, and the extraction electrode 44 connects the connection electrode 43A to the excitation electrode 42. These electrodes (42, 43A, 44) are formed from an integral conductive layer (for example, a metal film). In FIG. 2A, a connection electrode 43B of another electrode is shown at the corner on the other side of the short side of the quartz base plate 41. In this other electrode, the connection electrode 43B and the excitation electrode and the extraction electrode arranged on the other surface of the crystal base plate 41 (not shown) are formed from an integral conductive layer. When an external AC voltage is applied from the connection electrode 43 through the extraction electrode 44 to the quartz crystal element 4, the quartz crystal element 4 has one of the quartz base plates 41 sandwiched between the excitation electrodes 42 by the piezoelectric effect and the inverse piezoelectric effect. The part is adapted to cause excitation in a predetermined vibration mode and frequency.

Regarding the bonding between the crystal element 4 and the package 2, the conductive adhesive DS is used for bonding each of the connection electrode 43A and the connection pad 22A, and between the connection electrode 43B and the connection pad 22B. However, it is also possible to use solder for this joining.
As the conductive adhesive DS, for example, a conductive powder is contained as a conductive filler in a binder such as a silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W ), Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or any combination thereof is suitably used. be able to.

In the manufacture of the piezoelectric device 1, a package 2 made of a ceramic material, a crystal element 4, and a package lid 5 are formed.
In the formation of the crystal element 4, first, a quartz base plate 41 is obtained by cutting from an artificial crystalline lens at a predetermined cut angle and performing external processing. After that, for example, a metal film is deposited on both main surfaces of the quartz base plate 41 by sputtering or the like, or by printing or the like, a pair of excitation electrodes 42, connection electrodes 43A (43B), and extraction electrodes 44 are provided. The electrodes are integrally formed.

In the element fixing step, the crystal element 4 is bonded to the connection pads 22A and 22B formed on the bottom surface of the recess 2A of the package 2 with a conductive adhesive DS so as to have a cantilever structure.
Further, in the sealing step, the package lid 5 is placed on the package 2 so as to close the recess 2A, and the package lid 5 and the package 2 are firmly joined so as to be sealed by heating or the like. When the package lid 5 is made of the above alloy, for example, it is joined to the package 2 by seam welding or the like in a predetermined atmosphere.
In the manufacturing method of this embodiment, it has the foreign material removal process mentioned later for details between an element fixing process and a sealing process.

FIG. 3 is a rear view of the package 2 of the four-terminal piezoelectric device.
In this piezoelectric device, two external terminals 23 </ b> A and 23 </ b> B that can apply an AC voltage to the excitation electrode 42 of the crystal element 4 are arranged on one diagonal side on the back surface of the package 2. Two external terminals 23C and 23D are arranged on the other diagonal side. The two external terminals 23C and 23D may be ground terminals, or may be external terminals of the temperature sensing element when a temperature sensing element is provided in the piezoelectric device 1. When an integrated circuit element having an oscillation circuit function is provided in the piezoelectric device 1, an external terminal for outputting a voltage signal and an adjustment voltage for adjusting the voltage signal are input. It is good also as an external terminal for.

[Foreign substance removal device]
A foreign device removing apparatus 100 for a piezoelectric device shown in FIG. 1 is an apparatus used in a foreign matter removing step for removing foreign matter from the piezoelectric device 1 in the manufacturing process after the element fixing step and before the sealing step in the manufacturing method described above.
The foreign matter removing apparatus 100 roughly includes a holding member 7, an exhaust unit 8, and a voltage applying unit (for example, a network analyzer 9).

The holding member 7 is a surface on the element fixing side of the package 2 in which the crystal resonator 4 is fixed with the external terminals 23A and 23B facing upward (the recess 2A of the recess 2A). It is held so that the surface on the open side faces downward.
The material of the holding member 7 is not limited, and any material can be used as long as it has high rigidity among metal and resin materials. If the holding member itself may become a foreign matter generation source due to changes over time depending on the material, the surface of the holding member 7 may be coated to prevent the generation of foreign matter from itself.

The holding member 7 has a concave device receiving portion 71 that positions the package 2 of the piezoelectric device 1 with respect to the package 2 when the package 2 is dropped with the surface on the element fixing side of the package 2 facing downward.
The concave device receiving portion 71 is formed with a through hole penetrating the inner bottom portion downward. In the present embodiment, this through hole is referred to as a foreign substance drop port 72.

  The foreign substance drop opening 72 faces below the fixed crystal unit 4. The position and size of the foreign substance drop opening 72 are arranged so that the foreign substance is surely excreted downward from the inside of the package 2 when the foreign substance attached to the crystal unit 4 falls by its own weight or peels off due to vibration. However, it is desirable to be determined according to the position and size of the crystal unit 4. For example, it is desirable that the foreign substance drop opening 72 has a rectangular shape whose center approximately matches the center of the crystal element 4 and whose shape is one or more times larger than the main surface of the crystal element 4.

The inner bottom surface of the device receiving portion 71 located around the foreign substance drop opening 72 has a frame shape, and this inner bottom surface is hereinafter referred to as a frame-shaped inner bottom surface 71A.
The piezoelectric device 1 is mainly held by the frame-shaped inner bottom surface 71A. The package 2 of the piezoelectric device 1 has a rectangular frame-shaped front end surface around the recess 2A, and the rectangular frame-shaped front end surface abuts on the frame-shaped inner bottom surface 71A, so that the piezoelectric device 1 is held by the holding member. 7 is held.
In addition, the region surrounded by the inner peripheral wall of the device receiving portion 71 around the frame-shaped inner bottom surface 71A is formed to be slightly larger in size than the region surrounded by the side surface of the package 2, so that the piezoelectric device 1 does not shift laterally. It is positioned.

The exhaust means 8 may be a dedicated device for removing foreign matter such as a vacuum pump, or may be a dual-purpose device configured to connect a vacuum duct branched from a vacuum pump used in another manufacturing process of the piezoelectric device 1, for example. .
In any case, although not shown in detail in detail, the exhaust unit 8 includes an adsorbing portion that surrounds the opening surface of the foreign substance dropping port 72 on the bottom surface of the holding member 7 and adsorbs in a closed ring shape around the opening surface. And the exhaust means 8 makes the foreign matter removed from the package 2 again the package 2 by making the inside of the pipe or duct airtightly communicated with the foreign matter drop port 72 through the suction portion sufficiently low with a vacuum pump or the like. Eliminate promptly so as not to return.

  The voltage application means should just have the function to apply the alternating voltage which can vibrate the crystal element 4 at least. However, if the frequency range of the AC voltage that can be sufficiently oscillated for foreign object removal differs from device to device, and devices that cannot be sufficiently removed from foreign substances are produced at the same frequency, the frequency sweep function is used. As the voltage application means, it is desirable to use the network analyzer 9 as in this embodiment.

  The network analyzer 9 includes two probes Pa and Pb as voltage application terminals, and the two probes Pa and Pb are connected to two external terminals 23A and 23A provided on the back surface (upper surface in FIG. 1) of the package 2. 23B. The piezoelectric device 1 itself is light, but the piezoelectric device 1 is fixed to the holding member 7 with sufficient force by the pressing force at this time.

[Foreign substance removal process]
In the foreign matter removing process using the foreign matter removing apparatus 100 having such a configuration, the piezoelectric device 1 is held by the holding member 7 and the two probes Pa and Pb are pressed against the external terminals 23A and 23B to make electrical contact. Thereafter, the exhaust means 8 is operated. Then, an AC voltage is applied to the two probes Pa and Pb by the network analyzer 9 and the frequency of the AC voltage is swept within a predetermined range to obtain an optimum frequency at which the largest vibration is obtained. Search for each. It is desirable to limit the frequency sweep range in order to shorten the tact time. The frequency sweep range may be determined in advance based on, for example, a frequency range in which the oscillation frequencies of all the piezoelectric devices to be produced vary.
The crystal element 4 of the piezoelectric device 1 is vibrated for a predetermined time at the optimum frequency obtained by this search, and the foreign matter is peeled off. The foreign matter is forcibly discharged to the outside of the package by the exhaust means 8 through the foreign matter dropping port 72. At this time, due to the exhaust pressure of the exhaust means 8, the foreign matter adhering to the part in the package other than the crystal element 4 is also removed at the same time.

According to this embodiment, the following effects based on the above apparatus configuration and manufacturing method can be obtained.
The holding member 7 as a configuration peculiar to the foreign matter removing apparatus 100 according to the present embodiment includes a portion that holds the piezoelectric device 1 and a foreign matter dropping port 72 that opens below the piezoelectric element (crystal element 4) in the piezoelectric device. It's simple enough to be prepared. Further, the exhaust means 8 communicating with the foreign substance drop port 72 can be used for other manufacturing processes. For this reason, the whole structure of the foreign material removal apparatus 100 is very simple, maintenance is easy, and it is advantageous also in terms of cost.

  Moreover, since both the fall by the dead weight of a foreign material and the foreign material removal by the exhaust pressure of the exhaust means 8 are utilized, the foreign material removal efficiency is high. The deposits can be peeled off by the vibration of the piezoelectric element when an AC voltage is applied. Foreign matter adhering to a portion in the recess 2A of the package 2 other than the piezoelectric element can be forcibly discharged by the exhaust pressure of the exhaust means 8. Further, unlike the foreign substance peeling that blows the gas, the foreign substance does not rise due to the air current, and there is no possibility that the foreign substance will reattach to the piezoelectric element. Furthermore, since the surface to which the element of the package 2 after the foreign matter removal is fixed is facing downward, if it is moved to the next process as it is, the foreign matter is difficult to adhere during transportation. Note that even if a transport method is used in which the surface that fixes the element during transport is down, if the surface that fixes the element in the foreign matter removal process is facing upward, foreign matter will adhere when the device is turned upside down. There is a possibility, and in the manufacturing method of the present embodiment, such a work that may cause the adhesion of foreign matters can be made unnecessary.

<2. Second Embodiment>
FIG. 4A is a schematic configuration diagram (partially a cross-sectional view) of a foreign matter removing apparatus for a piezoelectric device according to a second embodiment of the present invention. FIG. 4B is a schematic top view seen from the voltage applying means side, showing a state in which the piezoelectric device is held by the holding member of the foreign matter removing apparatus.
The foreign matter removing apparatus 100A for a piezoelectric device shown in FIG. 4 is the same as that of the first embodiment shown in FIG. 1 in that it has a holding member, an exhaust means, and a network analyzer.
In the second embodiment, the shape of the holding member is different. Other configurations are the same as those already described, and thus the same reference numerals are given and description thereof is omitted.

In the holding member 7A according to the present embodiment, the shape of the foreign substance drop port 72A is different from the shape of the foreign substance drop port 72 in the first embodiment.
The foreign object drop port 72A has an exhaust hole 72B having the same position and size as the foreign object drop port 72 in the first embodiment, and four intake holes that communicate with the outside of the four sides from the exhaust hole 72B.

Here, the four intake holes are formed on a pair of intake holes 72C and 72C formed on the two short sides of the package receiver 71 and on two long sides of the package receiver 71. It consists of a pair of intake holes 72D and 72D. Four intake hole portions 72C, 72C, 72D, 72D (hereinafter may be referred to as intake hole portions 72C / D) are formed integrally with the exhaust hole portion 72B.
Here, the exhaust hole 72B is a through-hole penetrating the holding member 7A in the thickness direction (vertical direction), whereas the four intake holes 72C / D are package receiving from the upper side of the side wall of the exhaust hole 72B. It is a hole that extends outside the portion 71 and opens on the surface of the holding member 7A.
With this configuration, the four intake hole portions 72 </ b> C / D function as intake ports for air exhausted by the exhaust means 8.

  The width of each intake hole in FIG. 4B, that is, the length along each side of the package receiving portion 71 of each intake hole is relatively large on the long side and relatively small on the short side. Yes. However, it is not limited to such a width setting. Further, the position and the number of intake holes are arbitrary. However, since the direction of the airflow in which foreign matter is easily removed is considered to vary depending on the individual foreign matter, a configuration in which at least one intake hole is provided on each of the four sides as shown in the drawing is desirable. However, if the intake opening area is too large even though the exhaust pressure is weak, the necessary air flow velocity cannot be obtained in the vicinity of the element fixing surface. Therefore, the width and number of each intake hole can be arbitrarily optimized according to the magnitude of the exhaust pressure. The configuration shown in FIG. 4B is only a preferable arrangement of intake holes for the exhaust means 8 having a certain exhaust pressure, and is not necessarily an optimal arrangement of intake holes assuming different exhaust pressures. Be careful.

  In the first embodiment, the exhaust space (the duct, the foreign substance drop opening, and the inside of the package) by the exhaust means 8 is made as airtight as possible, thereby improving the foreign matter removal effect by exhaust. However, every time the piezoelectric device is replaced, it is necessary to return the exhaust space to the atmospheric pressure, and in the foreign matter removing process for the piezoelectric device after the replacement, it takes time to reduce the atmospheric pressure to a certain level. In addition, there is a concern that foreign matter remaining on the exhaust means side may rise during bending for returning the exhaust space to atmospheric pressure.

In contrast, in the second embodiment, since the exhaust space is not sealed, an air flow is intentionally formed, and foreign matter removal is promoted by the air flow. For this reason, when exchanging the piezoelectric device, the exhaust means 8 may be temporarily stopped, or the opening / closing mechanism provided in the middle of the pipe or duct may be temporarily closed. Further, in the foreign matter processing for the replaced piezoelectric device, if the exhaust means 8 is restarted or the opening / closing mechanism is opened again, a necessary air flow velocity can be obtained in a relatively short time. Therefore, the effect that the tact time required for processing for each piezoelectric device can be shortened compared to the first embodiment can be obtained. Further, since no bending is performed, the foreign matter remaining on the exhaust means side does not rise.
In addition, the effects described in the first embodiment are the same in the second embodiment.

<3. Third Embodiment>
FIG. 5 is a schematic top view seen from the voltage applying means side, showing a state in which three holding members and three piezoelectric devices are held on a transport tray of a foreign device for removing a piezoelectric device according to a third embodiment. It is. 6A is a schematic cross-sectional view taken along the line AA in FIG. 5, and FIG. 6B is a schematic cross-sectional view taken along the line BB in FIG.

  The third embodiment relates to a transport tray that transports a plurality of piezoelectric devices from a foreign matter removing process to the next sealing process. The configurations of the piezoelectric device 1 and the holding member 7A are the same as those in the second embodiment. However, the same holding member 7 as in the first embodiment may be used.

The transport tray 10 shown in FIGS. 5 and 6 has three holding members 7A placed in a row so as to be detachable in a concave member accommodating portion. The three holding members 7A do not slide down from the side unless the transport tray 10 is greatly inclined by the inner peripheral wall of the member accommodating portion.
Three through-holes 10A are formed in the fixed portion of the member accommodating portion with a size and a position suitable for the respective exhaust hole portions 72B of the three holding members. The through hole 10 </ b> A is provided as a foreign matter dropout opening of the transport tray 10.

The transport tray is detachably connected to the exhaust unit 8 similar to that of the first embodiment.
In the transport tray 10 having such a configuration, the foreign matter removing process can be batch-processed with respect to the three piezoelectric devices 1 while being connected to the exhaust unit 8. The conveyance itself may be manual or automatic. In the case of automation, foreign matter removal is performed in units of three piezoelectric devices 1, and the units are automatically conveyed to the next process.

  In addition to the effects described in the first and second embodiments, the transport tray 10 having such a configuration can easily process a plurality of piezoelectric devices. When this transport tray 10 is used, since the exhaust means 8 can be used in common, a plurality of piezoelectric devices can be processed continuously. In this case, the probe pair is brought into contact with each piezoelectric device by the network analyzer 9. Then, the probe pair to which the AC voltage is applied is switched, or if the optimum frequency is the same, the AC voltage can be applied simultaneously.

  For convenience of illustration, the number of devices that can be conveyed at one time is 3, but it may be 2 or 4 or more. Alternatively, the piezoelectric devices 1 may be arranged in a matrix on the transport tray, that is, vertically and horizontally in a plurality of columns.

<4. Modification>
The above 1st-3rd embodiment is not limited to the said description, For example, the various deformation | transformation illustrated below is possible.

In the third embodiment, the three holding members 7 </ b> A may be integrated and used as a part of the transport tray 10.
Alternatively, the three holding members 7A may be integrated with a thickness, size, and material that provide sufficient rigidity as a transport tray. In this case, the transport tray 10 shown in FIGS. 5 and 6 is unnecessary, and a plurality of integrated holding members themselves correspond to the transport tray of the present invention.

The foreign substance drop port 72 in the first embodiment may be configured such that there is no step present at a location indicated by reference numeral 71A in FIG. For example, the size of the foreign substance drop opening 72 may be made slightly larger than that shown in FIG. In the second embodiment, since there is an air flow, even if there is a step between the exhaust hole portion 72B and the intake hole portions 72C and 72D, it is difficult for the foreign matter to endure. It does not matter.
Further, the foreign substance drop port 72 in the first embodiment and the exhaust hole portion 72B in the second and third embodiments may be configured to have a wall surface that is inclined with a forward taper diagonally from the package 2 side without a step. In this case, the foreign matter slides down the inclined wall surface and is smoothly guided to the exhaust means 8 side.

  The present invention can be widely applied to piezoelectric devices having piezoelectric elements that vibrate using the piezoelectric effect. In addition to the piezoelectric device having a crystal element as described above, for example, a surface acoustic wave device, or a device having a piezoelectric element utilizing other physical phenomena such as an acceleration sensor, the foreign matter removing apparatus, the manufacturing method And the above transport tray can be used.

  In addition, the present invention may be implemented in various modes.

  DESCRIPTION OF SYMBOLS 1 ... Piezoelectric device, 2 ... Package, 2A ... Recessed part, 22A, 22B ... Connection pad, 4 ... Crystal element, 5 ... Package cover, 7, 7A ... Holding member, 8 ... Exhaust means, 9 ... Network analyzer (voltage) (Applying means), 10 ... transport tray, 22A, 22B ... connection pad, 23A, 23B, 23C, 23D ... external terminal, 41 ... quartz base plate, 42 ... excitation electrode, 43A, 43B ... connection electrode, 44 ... extraction electrode, 71 ... Device receiving portion, 71A ... Frame-shaped inner bottom surface, 72, 72A ... Foreign matter dropping port, 72B ... Exhaust hole portion, 72C, 72D ... Intake hole portion, 100 ... Foreign matter removing device, DS ... Conductive adhesive

Claims (10)

Piezoelectric device unsealed state of fixing the piezoelectric element in the package, prior Symbol piezoelectric element upward a plurality of external terminals provided on a surface facing away that the element fixing side surface of the package which is fixed, A holding member that is placed so that the surface of the package on which the element is fixed faces downward;
A foreign substance drop opening provided on the holding member and opening below the surface of the package on the element fixing side with respect to the piezoelectric device;
Voltage applying means for applying a voltage to the plurality of external terminals to vibrate the piezoelectric element;
The direction from the piezoelectric device is placed in the holding member in the foreign material chute, and an exhaust means for evacuating from the foreign object dropping port to remove foreign matter attached to the piezoelectric element,
Bei to give a,
The exhaust means has a suction portion that surrounds the foreign substance drop port on the lower surface of the holding member, and exhausts the suction portion.
Foreign device removal device for piezoelectric devices. A piezoelectric device in an unsealed state in which a piezoelectric element is fixed to a package, and a plurality of external terminals provided on a surface facing the element fixing side of the package to which the piezoelectric element is fixed are facing upward, A holding member that holds the surface of the package so that the element fixing side faces downward;
A foreign substance drop opening provided on the holding member and opening below the surface of the package on the element fixing side with respect to the piezoelectric device;
Voltage applying means for applying a voltage to the plurality of external terminals to vibrate the piezoelectric element;
An exhaust means for exhausting from the foreign material drop port in a direction from the piezoelectric device held by the holding member toward the foreign material drop port to remove the foreign material attached to the piezoelectric element;
With
The holding member has an intake port through which outside air can flow into a surface in contact with a surface on the element fixing side of the package.
Foreign matter removing apparatus of the pressure conductive device. The holding member has a concave device receiving portion that positions the piezoelectric device with respect to the package of the piezoelectric device when the piezoelectric device is dropped with the surface on the element fixing side facing downward.
The concave device receiving portion penetrates the inner bottom portion downward to form the foreign substance drop port, and supports the piezoelectric device on a frame-shaped inner bottom surface around the foreign substance drop port.
The foreign matter removing apparatus for a piezoelectric device according to claim 1. A piezoelectric device in an unsealed state in which a piezoelectric element is fixed to a package, and a plurality of external terminals provided on a surface facing the element fixing side of the package to which the piezoelectric element is fixed are facing upward, A holding member that holds the surface of the package so that the element fixing side faces downward;
A foreign substance drop opening provided on the holding member and opening below the surface of the package on the element fixing side with respect to the piezoelectric device;
Voltage applying means for applying a voltage to the plurality of external terminals to vibrate the piezoelectric element;
An exhaust means for exhausting from the foreign material drop port in a direction from the piezoelectric device held by the holding member toward the foreign material drop port to remove the foreign material attached to the piezoelectric element;
With
The holding member has a concave device receiving portion that positions the piezoelectric device with respect to the package of the piezoelectric device when the piezoelectric device is dropped with the surface on the element fixing side facing downward.
The concave device receiving portion penetrates the inner bottom portion downward to form the foreign substance drop port, and supports the piezoelectric device with a frame-shaped inner bottom surface around the foreign substance drop port,
The foreign object drop port of the holding member is
An exhaust hole portion facing the element fixing side of the package and communicating with the exhaust means;
A part of the frame-shaped inner bottom surface is divided from the exhaust hole part and extends to the outside of the piezoelectric device, thereby securing an inflow path of outside air to the element fixing side, and
That having a foreign matter removing apparatus of the pressure conductive device. The holding member is
Holding a plurality of the piezoelectric devices at the same time, detachable from the exhaust means in a state of holding the plurality of piezoelectric devices,
Constituting at least a part of a transport tray of the piezoelectric device;
The foreign matter removing apparatus for a piezoelectric device according to any one of claims 1 to 4. The voltage applying unit applies an AC voltage to the plurality of external terminals of the piezoelectric device, sweeps the frequency of the AC voltage, and searches for a frequency at which the largest vibration can be obtained for each piezoelectric device. Having
The foreign matter removing apparatus for a piezoelectric device according to any one of claims 1 to 5. A plurality of holding members for holding the pressure conductive device unsealed state where the piezoelectric element is fixed respectively, said as the surface of the element fixing side of the package which the piezoelectric element is fixed facing downward respectively in the package,
A tray body on which the plurality of holding members are detachably mounted;
Provided to the plurality of holding members, and the foreign matter chute you opening below the surface of the element fixing side of the package with respect to the piezoelectric device,
A plurality of through-holes provided in the tray main body and opened below the plurality of foreign substance drop openings;
A transport tray for piezoelectric devices. Fixing the piezoelectric element to the package;
A plurality of external terminals provided on a surface facing the opposite side of the surface of the package on which the piezoelectric element is fixed, the unsealed piezoelectric device to which the piezoelectric element is fixed are facing upward. A step of holding the holding member so that the surface of the element fixing side faces downward,
A voltage is applied to the plurality of external terminals to vibrate the piezoelectric element, and the holding is provided from a foreign material drop opening provided on the holding member and opening below the element fixing side surface of the package with respect to the piezoelectric device. A foreign matter removing step capable of removing the foreign matter attached to the piezoelectric element by exhausting in a direction from the piezoelectric device held by the part toward the foreign matter dropping port;
After the foreign matter removing step, a sealing step of sealing the surface on the element fixing side of the package with a sealing member;
Only including,
In the foreign matter removing step, a method for manufacturing a piezoelectric device that performs only exhaust among supply and exhaust . Fixing the piezoelectric element to the package;
A plurality of external terminals provided on a surface facing the opposite side of the surface of the package on which the piezoelectric element is fixed, the unsealed piezoelectric device to which the piezoelectric element is fixed are facing upward. A step of holding the holding member so that the surface of the element fixing side faces downward,
A voltage is applied to the plurality of external terminals to vibrate the piezoelectric element, and the holding is provided from a foreign material drop opening provided on the holding member and opening below the element fixing side surface of the package with respect to the piezoelectric device. A foreign matter removing step capable of removing the foreign matter attached to the piezoelectric element by exhausting in a direction from the piezoelectric device held by the part toward the foreign matter dropping port;
After the foreign matter removing step, a sealing step of sealing the surface on the element fixing side of the package with a sealing member;
Including
In the foreign matter removing step, the exhaust is performed in a state in which an intake port through which outside air can flow is secured on a surface in contact with a surface on the element fixing side of the package.
Method for producing a pressure electric devices. The holding member holding a plurality of piezoelectric devices is used as at least a part of a transport tray when transporting the plurality of piezoelectric devices from the foreign matter removing step to the sealing step.
A method for manufacturing a piezoelectric device according to claim 8 or 9.

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