JP6330562B2 - Power supply - Google Patents

Description

  The present invention relates to a power supply device including a base plate to which an electronic component is fixed and a cover that covers the electronic component.

  As a power supply device such as a DC-DC converter, an apparatus including an electronic component such as a transformer or a diode and a wiring portion connected to the electronic component and forming a current path between the electronic component and an external device is known. (See Patent Document 1 below). The electronic component is fixed to a metal base plate, for example.

  When the power supply device is operated, radiation noise may be generated from the electronic component and transmitted to the external device. For this reason, in the power supply device, a metal cover is provided on the base plate, and electronic components are arranged inside the cover. Thereby, the radiation noise which generate | occur | produced from the electronic component is shielded with a cover, and the malfunction that radiation noise is transmitted to an external apparatus is suppressed.

  A part of the wiring part is drawn out from the inside of the cover. A portion of the wiring portion that is pulled out of the cover is used as a connection terminal for electrically connecting to the external device.

JP 2012-135175 A

  However, in the power supply device, since the radiation noise generated from the electronic components is linked to a portion of the wiring portion that exists inside the cover, a conduction noise current may be generated from this portion. Therefore, the generated conduction noise current may be transmitted to the external device. In order to solve this problem, a method of providing a filter circuit that removes the conduction noise current can be considered. However, if the amount of the conduction noise current generated is large, it cannot be completely removed by the filter circuit, and the conduction noise current is transmitted to an external device. There is a case.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power supply device that can further reduce the amount of conduction noise current transmitted to an external device.

One aspect of the present invention is a metal base plate connected to the ground;
A plurality of electronic components fixed to the base plate and electrically connected to each other;
A wiring layer disposed on the base plate in an insulated state with respect to the base plate, connected to the electronic component, and forming a current path between the electronic component and an external device;
A shielding layer that covers the wiring layer from the side opposite to the side on which the base plate is disposed and shields radiation noise generated from the electronic component;
A metal cover fixed to the base plate and containing a part of the wiring layer and the plurality of electronic components inside;
A plurality of connecting portions for electrically connecting the shielding layer and the base plate;
The shielding layer covers at least a portion of the wiring layer located inside the cover,
A first insulating layer is interposed between the wiring layer and the base plate, a second insulating layer is interposed between the shielding layer and the wiring layer, and the first insulating layer, the wiring layer, and the second The insulating layer and the shielding layer are stacked in the thickness direction of the base plate,
In the power supply device, a loop through which a current flows is formed by the plurality of connection portions, the shielding layer, and the base plate, and the wiring layer passes through the loop.

  In the power supply device, a portion of the wiring layer located inside the cover is covered with the shielding layer. For this reason, it is possible to suppress a problem that the radiation noise generated from the electronic component is linked to the above-described part and a conduction noise current is generated. Therefore, the amount of conduction noise current transmitted from the wiring layer to the external device can be reduced.

  In the power supply device, since the cover is provided, radiation noise generated from the electronic component can be shielded by the cover. Therefore, it is possible to suppress a problem that radiation noise is transmitted to an external device.

  In the power supply apparatus, since the loop is formed, the amount of radiation noise generated from the electronic component and leaking outside through the periphery of the wiring layer can be reduced. That is, even if an alternating magnetic field, which is a type of radiation noise, passes around the wiring layer, if a loop is formed as described above, an eddy current can be generated in the loop, The AC magnetic field can be canceled out by the magnetic field generated in. Therefore, it is possible to reduce the amount of AC magnetic field that leaks to the outside through the periphery of the wiring layer, that is, radiation noise.

  As described above, according to the present invention, it is possible to provide a power supply device that can further reduce the amount of conduction noise current transmitted to an external device.

FIG. 3 is a cross-sectional view of the power supply device according to the first embodiment, which is a cross-sectional view taken along the line II of FIG. II-II sectional drawing of FIG. III-III sectional drawing of FIG. 1 is a circuit diagram of a power supply device according to Embodiment 1. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. The figure following FIG. The figure following FIG. The figure following FIG. FIG. 11 is a cross-sectional view of the power supply device according to the second embodiment, which is a cross-sectional view taken along line IX-IX in FIG. XX sectional drawing of FIG. Sectional drawing of the power supply device in Example 3. FIG. Sectional drawing of the power supply device in Example 4. FIG. Sectional drawing of the power supply device in Example 5. FIG.

  The power supply device can be an in-vehicle power supply device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

Example 1
Examples of the power supply apparatus will be described with reference to FIGS. As shown in FIGS. 1 to 3, the power supply device 1 of this example includes a base plate 2, a plurality of electronic components 3, a wiring layer 4 a, a shielding layer 4 b, a cover 7, and a plurality of connection portions 8. .

  The base plate 2 is made of metal and connected to the ground. The plurality of electronic components 3 are fixed to the base plate 2 and electrically connected to each other. The wiring layer 4 a is disposed on the base plate 2 while being insulated from the base plate 2. The wiring layer 4a is connected to the electronic component 3 and forms a current path between the electronic component 3 and the external device. The shielding layer 4b covers the wiring layer 4a from the side opposite to the side on which the base plate 2 is disposed. The shielding layer 4 b shields radiation noise generated from the electronic component 3. The cover 7 is fixed to the base plate 2. Inside the cover 7, a part of the wiring layer 4a and a plurality of electronic components 3 are accommodated. Further, the connecting portion 8 electrically connects the shielding layer 4b and the base plate 2.

  A connection terminal 49 for connecting to an external device is formed in a part of the wiring layer 4a located outside the cover 7. The shielding layer 4b covers at least the portion 48 located inside the cover 7 in the wiring layer 4a.

A first insulating layer 5a is interposed between the wiring layer 4a and the base plate 2, and a second insulating layer 5b is interposed between the shielding layer 4b and the wiring layer 4a. The first insulating layer 5 a, the wiring layer 4 a, the second insulating layer 5 b, and the shielding layer 4 b are stacked in the thickness direction (Z direction) of the base plate 2 to constitute a stacked substrate 6.
As shown in FIG. 2, a loop L through which a current flows is formed by the plurality of connecting portions 8, the shielding layer 4 b, and the base plate 2. The wiring layer 4a penetrates through the loop L.

  The power supply device 1 of this example is a vehicle-mounted power supply device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

  As shown in FIG. 4, the power supply device 1 of this example is a DC-DC converter for charging the low voltage DC power supply 89 by reducing the voltage of the high voltage DC power supply 88. The power supply device 1 of this example includes an input capacitor 3a, a MOS module 3b, a transformer 3c, a diode module 3d, a choke coil 3e, and a smoothing capacitor 3f as electronic components 3. These electronic components 3 (3a to 3f) constitute the main circuit 18 of the power supply device 1. The power supply device 1 of this example further includes a filter coil 3 g and a filter capacitor 3 h as the electronic component 3. A filter circuit 19 is formed by these electronic components 3 (3g, 3h).

  A plurality of MOSFETs 30 are sealed in the MOS module 3b. By turning on and off the MOSFET 30, the DC voltage of the high-voltage DC power supply 88 is converted into an AC voltage, and this AC voltage is applied to the primary coil 31 of the transformer 3c. Then, the AC voltage output from the secondary coil 32 of the transformer 3c is rectified by the diode module 3d and smoothed using the choke coil 3e and the smoothing capacitor 3f. Further, the conduction noise current included in the smoothed output current is removed by the filter circuit 19. The low voltage DC power supply 89 is charged using the output current that has passed through the filter circuit 19.

  On the other hand, as shown in FIG. 3, the power supply device 1 of this example includes a plurality of bolts 81. The cover 7 is fixed using the bolt 81. The power supply device 1 of this example has three types of bolts 81, that is, a first bolt 81a, a second bolt 81b, and a third bolt 81c. The first bolt 81a is a bolt 81 whose main purpose is to form the loop L (see FIG. 2). The second bolt 81 b and the third bolt 81 c are bolts 81 whose main purpose is to fix the cover 7. The second bolt 81b is arranged outside the first bolt 81a in the width direction (Y direction) of the wiring layer 4a. The third bolt 81c is provided on the side opposite to the side on which the second bolt 81b is provided in the extending direction (X direction) of the wiring layer 4a.

  As described above, the multilayer substrate 6 is formed by laminating the first insulating layer 5a, the wiring layer 4a, the second insulating layer 5b, and the shielding layer 4b in the Z direction. The laminated substrate 6 of this example is a so-called thick copper substrate capable of flowing a large current through the wiring layer 4a.

  In this example, as shown in FIG. 2, intermediate ground layers 42 (42a, 42b) are formed at positions sandwiching the wiring layer 4a from the Y direction. These intermediate ground layers 42 are formed of a metal plate having the same thickness as the wiring layer 4a. The intermediate ground layer 42 and the shielding layer 4b are electrically connected to the base plate 2, that is, the ground, by the first bolt 81a and the second bolt 81b.

As shown in FIG. 1, the cover 7 is formed with a connector insertion hole 78 for inserting an input connector (not shown) and an opening 73. A part of the laminated substrate 6 protrudes from the opening 73 to the outside of the cover 7. Further, the cover 7 is formed with a protruding portion 71 protruding from the opening 73 in the X direction. The protrusion 71 and the laminated substrate 6 are superposed in the Z direction. And as shown in FIG. 2, the protrusion part 71 and the laminated substrate 6 are each fixed to the baseplate 2 using the volt | bolts 81a and 81b.
As described above, the bolts 81 a and 81 b have both a function of fixing the cover 7 and the laminated substrate 6 to the base plate 2 and a function of electrically connecting the shielding layer 4 b to the base plate 2.

  As shown in FIG. 2, a gap S is formed between the intermediate ground layer 42 and the wiring layer 4a. When the power supply device 1 is operated, an AC magnetic field, which is a kind of the radiation noise H, may be transmitted to the outside of the cover 7 through the gap S and the insulating layer 5 (5a, 5b). However, since the loop L is formed in this example, the eddy current I can flow through the loop L when an AC magnetic field passes. When the eddy current I flows, a magnetic field is generated around the eddy current I, thereby canceling the AC magnetic field. For this reason, a large AC magnetic field is prevented from leaking outside through the periphery of the wiring layer 4a.

  Moreover, as shown in FIG. 3, the notch part 61 is formed in the 2nd insulating layer 5b and the shielding layer 4b. The connection terminal 49 is exposed from the notch 61.

  The second insulating layer 5b and the shielding layer 4b have substantially the same shape when viewed from the Z direction. The shielding layer 4 b covers a part 48 of the wiring layer 4 a located inside the cover 7 and also covers a part of the part located outside the cover 7. Further, the shielding layer 4b covers all parts of the intermediate ground layer 48 (see FIG. 2) from the Z direction.

  Next, the manufacturing method of the power supply device 1 of this example is demonstrated. In order to manufacture the power supply device 1, as shown in FIG. 5, first, the first insulating layer 5a is prepared. As shown in FIG. 6, the wiring layer 4a and the intermediate ground layer 42 are disposed on the first insulating layer 5a. The first insulating layer 5a and the wiring layer 4a can be formed by, for example, pressing.

  Next, as shown in FIG. 7, the second insulating layer 5 b and the shielding layer 4 b are disposed on the wiring layer 4 a and the intermediate ground layer 42. The second insulating layer 5b and the shielding layer 4b are formed in the same shape. A notch 61 is formed in advance in the second insulating layer 5b and the shielding layer 4b.

  Thus, after laminating | stacking the 1st insulating layer 5a, the wiring layer 4a, the 2nd insulating layer 5b, and the shielding layer 4b, these layers are compressed to a Z direction and are mutually adhere | attached. Thereby, the laminated substrate 6 is formed.

  Next, as shown in FIG. 8, bolt insertion holes 89 are formed in the multilayer substrate 6, and the multilayer substrate 6 is disposed on the base plate 2. Moreover, the electronic component 3 (3a-3h) is fixed to the base plate 2, and the electronic component 3 and the wiring layer 4a are connected. Thereafter, the cover 7 (see FIG. 1) is attached, and the cover 7 and the laminated substrate 6 are fastened to the base plate 2 using the bolts 81. The power supply device 1 is manufactured by performing the above steps.

  The effect of this example will be described. As shown in FIG. 1, in this example, the part 48 located inside the cover 7 among the wiring layers 4a is covered with the shielding layer 4b. Therefore, the radiation noise H generated from the electronic component 3 is linked to the portion 48, and a problem that a conduction noise current is generated can be suppressed. Therefore, the amount of conduction noise current transmitted from the wiring layer 4a to the external device can be reduced.

  In this example, since the cover 7 is provided, the radiation noise H generated from the electronic component 3 can be shielded by the cover 7. Therefore, the malfunction that radiation noise H is transmitted to the external device can be suppressed.

  Further, in this example, as shown in FIG. 2, since the loop L is formed, the amount of radiation noise H generated from the electronic component 3 and leaking outside through the periphery of the wiring layer 4a can be reduced. it can. That is, even when an AC magnetic field, which is a type of radiation noise H, passes around the wiring layer 4a, if the loop L is formed as in this example, the eddy current I can be generated in the loop L. The AC magnetic field can be canceled out by the magnetic field generated around the eddy current I. Therefore, it is possible to reduce the amount of the alternating magnetic field leaking to the outside through the periphery of the wiring layer 4a, that is, the radiation noise H.

  As shown in FIGS. 1 and 2, in this example, the first insulating layer 5a, the wiring layer 4a, the second insulating layer 5b, and the shielding layer 4b are laminated. Therefore, the layers 5a, 4a, 5b, 4b can be brought into close contact with each other, and the shielding layer 4b can be disposed at a position close to the base plate 2. Therefore, the area of the loop L can be reduced. Therefore, it is easy to cancel the AC magnetic field.

  In this example, the first insulating layer 5 a, the wiring layer 4 a, the second insulating layer 5 b, and the shielding layer 4 b are laminated to form one laminated substrate 6. Therefore, these layers 5a, 4a, 5b, 4b can be made into one part, and the number of parts can be reduced. Therefore, the manufacturing cost of the power supply device 1 can be reduced.

  As described above, according to this example, it is possible to provide a power supply device that can further reduce the amount of conduction noise current transmitted to an external device.

  In the present example, the laminated substrate 6 is disposed on the output side of the power supply device 1, but the present invention is not limited to this. That is, the laminated substrate 6 may be disposed on the input side of the power supply device 1.

  Further, in this example, as shown in FIG. 4, the MOS module 3b incorporating a plurality of MOSFETs 30 is used, but the present invention is not limited to this. That is, a so-called discrete component in which each MOSFET 30 is individually incorporated may be used. The same applies to the diode module 3d.

(Example 2)
In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same components as in the first embodiment unless otherwise specified.

  In this example, the structure of the connecting portion 8 is changed. As shown in FIGS. 9 and 10, in this example, a metal plate connection layer 4 c electrically connected to the base plate 2 is provided between the first insulating layer 5 a and the base plate 2. A contact via 80 that penetrates the first insulating layer 5a and the second insulating layer 5b and connects the shielding layer 4b and the plate connection layer 4c is provided. Among the plurality of connection portions 8, some of the connection portions 8 are configured by the contact via 80. The shielding layer 4b, the contact via 80, and the base plate 2 form a loop L through which current flows.

  In this example, a bolt 81 (corresponding to the second bolt 81b of the first embodiment) is provided outside the contact via 80 in the Y direction. The cover 7 and the laminated substrate 6 are fixed to the base plate 2 by the bolts 81.

The effect of this example will be described. In this example, since the loop L is configured using the contact via 80, the number of bolts 81 can be reduced as compared with the first embodiment. Therefore, the work of fixing the laminated substrate 6 and the cover 7 to the base plate 2 can be easily performed when the power supply device 1 is manufactured.
In addition, the configuration and operational effects are the same as those of the first embodiment.

(Example 3)
In this example, as shown in FIG. 11, a metal shield plate 72 is provided in the cover 7, and the space in the cover 7 is divided into two. In this example, a plurality of electronic components 3 constituting the main circuit 18 (see FIG. 4) of the power supply device 1 are arranged in one of the two spaces S1 and S2 in the cover 7. Further, a plurality of electronic components 3 constituting the filter circuit 19 (see FIG. 4) are arranged in the other space S2. The shield plate 72 is connected to the shielding layer 4 b and the cover 7.

  In this example, the core 39 is provided so as to surround a part of the wiring layer 4a. A portion of the wiring layer 4a surrounded by the core 39 is a filter coil 3g. A filter capacitor 3h is connected to the wiring layer 4a.

The effect of this example will be described. In this example, since the metal shield plate 72 is disposed between the main circuit 18 and the filter circuit 19, the radiation noise H generated from the main circuit 18 can be shielded by the shield plate 72. Therefore, it is possible to suppress generation of a conduction noise current due to the radiation noise H interlinking with the filter coil 3g and the filter capacitor 3h. Accordingly, the amount of conduction noise current transmitted to the external device can be further reduced.
In addition, the configuration and operational effects are the same as those of the first embodiment.

Example 4
In this example, as shown in FIG. 12, the shield plate 72 and the shielding layer 4b are made into one component. In this example, the shield plate 72 is formed by bending a part of the shielding layer 4b in the Z direction.

If it does in this way, since it is not necessary to make the shield board 72 and the shielding layer 4b into separate parts, the number of parts can be reduced. Therefore, the manufacturing cost of the power supply device 1 can be reduced.
In addition, the configuration and operational effects are the same as those of the first embodiment.

(Example 5)
In this example, as shown in FIG. 13, an auxiliary filter circuit 191 is provided outside the cover 7. In this example, an auxiliary filter coil 37 and an auxiliary filter capacitor 38 are provided outside the cover 7. These auxiliary filter coil 37 and auxiliary filter capacitor 38 constitute an auxiliary filter circuit 191.

The effect of this example will be described. In this example, since the auxiliary filter circuit 191 is provided outside the cover 7, the radiated noise H can be shielded by the cover 7, and the radiated noise H is hardly transmitted to the auxiliary filter circuit 191. For this reason, it is possible to suppress a problem that the conduction noise current is generated due to the radiation noise H interlinking with the auxiliary filter coil 37 and the auxiliary filter capacitor 38. Further, since the power supply device 1 of this example includes the two filter circuits 19 and 191, the conduction noise current generated from the main circuit 18 can be effectively removed.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

DESCRIPTION OF SYMBOLS 1 Power supply device 2 Base plate 3 Electronic component 4a Wiring layer 4b Shielding layer 5a 1st insulating layer 5b 2nd insulating layer 7 Cover 8 Connection part L Loop

Claims (2)

A metal base plate (2) connected to the ground;
A plurality of electronic components (3) fixed to the base plate (2) and electrically connected to each other;
A wiring arranged on the base plate (2) in an insulated state with respect to the base plate (2), connected to the electronic component (3), and forming a current path between the electronic component (3) and an external device Layer (4a);
A shielding layer (4b) for covering the wiring layer (4a) from the side opposite to the side on which the base plate (2) is disposed, and shielding radiation noise generated from the electronic component (3);
A metal cover (7) fixed to the base plate (2) and accommodating a part of the wiring layer (4a) and the plurality of electronic components (3) inside;
A plurality of connecting portions (8) for electrically connecting the shielding layer (4b) and the base plate (2);
The shielding layer (4b) covers at least a portion (48) located inside the cover (7) of the wiring layer (4a),
A first insulating layer (5a) is interposed between the wiring layer (4a) and the base plate (2), and a second insulating layer (5b) is interposed between the shielding layer (4b) and the wiring layer (4a). The first insulating layer (5a), the wiring layer (4a), the second insulating layer (5b), and the shielding layer (4b) are laminated in the thickness direction of the base plate (2). And
The plurality of connecting portions (8), the shielding layer (4b), and the base plate (2) form a loop (L) through which a current flows, and the wiring layer (4 a ) is formed in the loop (L). A power supply device (1) characterized by being penetrated. A metal plate connection layer (4c) electrically connected to the base plate (2) is interposed between the first insulating layer (5a) and the base plate (2), and the plurality of connection portions (8) At least a part of the connection part (8) passes through the first insulating layer (5a) and the second insulating layer (5b) and connects the shielding layer (4b) and the plate connection layer (4c). The power supply device (1) according to claim 1, wherein the power supply device (1) is a contact via (80).

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