JP6328063B2 - 処理済像を使用するレチクル検査時の選択的感度のための細線の検出 - Google Patents

処理済像を使用するレチクル検査時の選択的感度のための細線の検出 Download PDF

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Publication number
JP6328063B2
JP6328063B2 JP2014561139A JP2014561139A JP6328063B2 JP 6328063 B2 JP6328063 B2 JP 6328063B2 JP 2014561139 A JP2014561139 A JP 2014561139A JP 2014561139 A JP2014561139 A JP 2014561139A JP 6328063 B2 JP6328063 B2 JP 6328063B2
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Japan
Prior art keywords
image
mask
printable
feature
test images
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Japanese (ja)
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JP2015513703A (ja
JP2015513703A5 (enExample
Inventor
ジュヨンユイ ワン
ジュヨンユイ ワン
ルイ−ファン シ
ルイ−ファン シ
リー−フーア イン
リー−フーア イン
ビーン リー
ビーン リー
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KLA Corp
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KLA Corp
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Publication of JP2015513703A5 publication Critical patent/JP2015513703A5/ja
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/13—Edge detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/174—Segmentation; Edge detection involving the use of two or more images
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20036—Morphological image processing
    • G06T2207/20044—Skeletonization; Medial axis transform
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20112—Image segmentation details
    • G06T2207/20161—Level set
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20221—Image fusion; Image merging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2014561139A 2012-03-08 2013-03-08 処理済像を使用するレチクル検査時の選択的感度のための細線の検出 Active JP6328063B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201261608268P 2012-03-08 2012-03-08
US61/608,268 2012-03-08
US201261609359P 2012-03-11 2012-03-11
US61/609,359 2012-03-11
US201261609903P 2012-03-12 2012-03-12
US61/609,903 2012-03-12
US13/473,299 2012-05-16
US13/473,299 US8855400B2 (en) 2012-03-08 2012-05-16 Detection of thin lines for selective sensitivity during reticle inspection using processed images
PCT/US2013/029790 WO2013134605A1 (en) 2012-03-08 2013-03-08 Detection of thin lines for selective sensitivity during reticle inspection using processed images

Publications (3)

Publication Number Publication Date
JP2015513703A JP2015513703A (ja) 2015-05-14
JP2015513703A5 JP2015513703A5 (enExample) 2016-04-28
JP6328063B2 true JP6328063B2 (ja) 2018-05-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014561139A Active JP6328063B2 (ja) 2012-03-08 2013-03-08 処理済像を使用するレチクル検査時の選択的感度のための細線の検出

Country Status (7)

Country Link
US (2) US8855400B2 (enExample)
EP (1) EP2823354B1 (enExample)
JP (1) JP6328063B2 (enExample)
KR (1) KR102090846B1 (enExample)
CN (1) CN104272184B (enExample)
TW (1) TWI602013B (enExample)
WO (1) WO2013134605A1 (enExample)

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US10401305B2 (en) 2012-02-15 2019-09-03 Kla-Tencor Corporation Time-varying intensity map generation for reticles
US8855400B2 (en) 2012-03-08 2014-10-07 Kla-Tencor Corporation Detection of thin lines for selective sensitivity during reticle inspection using processed images
US9430824B2 (en) 2013-05-14 2016-08-30 Kla-Tencor Corporation Machine learning method and apparatus for inspecting reticles
US9612541B2 (en) 2013-08-20 2017-04-04 Kla-Tencor Corporation Qualifying patterns for microlithography
US9183656B2 (en) 2014-03-11 2015-11-10 Fei Company Blend modes for mineralogy images
US9778205B2 (en) 2014-03-25 2017-10-03 Kla-Tencor Corporation Delta die and delta database inspection
US9478019B2 (en) 2014-05-06 2016-10-25 Kla-Tencor Corp. Reticle inspection using near-field recovery
US9747518B2 (en) 2014-05-06 2017-08-29 Kla-Tencor Corporation Automatic calibration sample selection for die-to-database photomask inspection
US10140698B2 (en) * 2015-08-10 2018-11-27 Kla-Tencor Corporation Polygon-based geometry classification for semiconductor mask inspection
US10395361B2 (en) 2015-08-10 2019-08-27 Kla-Tencor Corporation Apparatus and methods for inspecting reticles
US10186026B2 (en) * 2015-11-17 2019-01-22 Kla-Tencor Corp. Single image detection
US10394984B2 (en) * 2015-11-25 2019-08-27 International Business Machines Corporation Tool to provide integrated circuit masks with accurate dimensional compensation of patterns
CN105404900B (zh) * 2015-12-22 2017-12-19 广州视源电子科技股份有限公司 一种并排二极管的定位方法及装置
CN105631458B (zh) * 2015-12-22 2018-05-22 广州视源电子科技股份有限公司 一种电子元件样本标注方法及装置
US10192302B2 (en) 2016-05-25 2019-01-29 Kla-Tencor Corporation Combined patch and design-based defect detection
CN107633524B (zh) * 2016-07-18 2020-09-29 中国科学院微电子研究所 一种版图边界提取方法及装置
US11580398B2 (en) * 2016-10-14 2023-02-14 KLA-Tenor Corp. Diagnostic systems and methods for deep learning models configured for semiconductor applications
US10430987B1 (en) * 2017-06-09 2019-10-01 Snap Inc. Annotating an image with a texture fill
CN108037142B (zh) * 2017-12-04 2021-01-19 江苏维普光电科技有限公司 基于图像灰度值的掩膜版光学缺陷检测方法
CN108595422B (zh) * 2018-04-13 2022-05-10 卓望信息技术（北京）有限公司 一种过滤不良彩信的方法
JP6808684B2 (ja) 2018-06-14 2021-01-06 キヤノン株式会社 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法
US11263741B2 (en) * 2020-01-24 2022-03-01 Applied Materials Israel Ltd. System and methods of generating comparable regions of a lithographic mask
JP7527822B2 (ja) * 2020-03-27 2024-08-05 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
CN112967302B (zh) * 2021-02-26 2024-04-05 岭澳核电有限公司 核电厂水下安保入侵目标的监测方法
US11727556B2 (en) * 2021-09-29 2023-08-15 KLA Corp. Defect detection for multi-die masks

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SU884179A1 (ru) 1980-03-18 1981-11-23 Предприятие П/Я М-5339 Устройство дл контрол фотошаблонов
IL131282A (en) * 1999-08-05 2009-02-11 Orbotech Ltd Apparatus and methods for inspection of objects
IL131283A (en) * 1999-08-05 2008-07-08 Orbotech Ltd Facility and methods for checking objects
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
US7124394B1 (en) 2003-04-06 2006-10-17 Luminescent Technologies, Inc. Method for time-evolving rectilinear contours representing photo masks
TW200513812A (en) * 2003-09-05 2005-04-16 Schott Ag Attenuating phase shift mask blank and photomask
US8103086B2 (en) * 2007-01-11 2012-01-24 Kla-Tencor Corporation Reticle defect inspection with model-based thin line approaches
US7873204B2 (en) 2007-01-11 2011-01-18 Kla-Tencor Corporation Method for detecting lithographically significant defects on reticles
US8335369B2 (en) * 2007-02-28 2012-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Mask defect analysis
US8090189B1 (en) 2007-03-05 2012-01-03 Kla-Tencor Corporation Detection of thin line for selective sensitivity during reticle inspection
NL2006556A (en) * 2010-05-13 2011-11-15 Asml Holding Nv Optical system, inspection system and manufacturing method.
US8855400B2 (en) 2012-03-08 2014-10-07 Kla-Tencor Corporation Detection of thin lines for selective sensitivity during reticle inspection using processed images

Also Published As

Publication number Publication date
JP2015513703A (ja) 2015-05-14
EP2823354A4 (en) 2016-01-13
US20140369593A1 (en) 2014-12-18
CN104272184B (zh) 2019-08-09
TWI602013B (zh) 2017-10-11
CN104272184A (zh) 2015-01-07
US9092847B2 (en) 2015-07-28
US20130236083A1 (en) 2013-09-12
KR20140141645A (ko) 2014-12-10
EP2823354B1 (en) 2017-02-22
EP2823354A1 (en) 2015-01-14
WO2013134605A1 (en) 2013-09-12
KR102090846B1 (ko) 2020-04-14
WO2013134605A9 (en) 2013-12-12
TW201341947A (zh) 2013-10-16
US8855400B2 (en) 2014-10-07

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