JP6322228B2 - Mold detection system and method - Google Patents

Description

  The present invention relates to a mold detection system and method, and more particularly to a mold detection system and method for detecting mold information and position information of a mold laid out in a bending machine.

  The table of the bending machine communicates with a registered mold in a mold storage device mounted on each machine. Only those that are registered by the person and placed in the mold storage device are assigned to the mold layout. That is, the mold arrangement is performed by the mold layout apparatus based on the information.

  The mold of this ATC (Auto Tool Changer) is stored in the mold storage device (mold stocker, etc.), but the storage status is managed by software such as mold type and length. The mold is automatically exchanged on the assumption that the information and the actual mold storage state match.

  See US Pat.

JP 2003-326316 A JP 2005-34872 A JP 2005-74446 A

  If the mold type and position information stored on the control unit (NC device, etc.) side is lost, the mold layout device cannot be automatically placed and stored, and it is necessary to store the mold manually. . Further, when the mold arrangement state is changed by a device other than the apparatus due to an alarm or the like, automatic arrangement and storage are impossible.

  In addition, when the software stops during replacement, or when a person stores the wrong type / position of the mold in the mold storage device (mold stocker), the management information in software and actual When the management information of the molds do not match, there is a problem that management becomes impossible and normal and safe operation becomes impossible.

  In addition, when the mold is placed by ATC (Auto Tool Changer) and then the mold outside the mold storage device (mold stocker) is manually added, the mold placed by the person There was a problem that there was a mistake in the position and mold type.

  Furthermore, when a machine with an ATC is used to manually place a mold, there is a problem that the position of the mold placed by the person and the mold type are wrong.

The present invention is for solving the above-mentioned problem, and the invention according to claim 1 is a mold layout apparatus for laying out a mold by control of a control unit, and bending by the mold by control of a control unit. In a mold detection system comprising a bending machine for processing,
The mold layout apparatus includes a detection unit that detects mold information of the mold and a position information acquisition unit that acquires position information of the mold, and the control unit includes the mold information and the position information. Based on the above, the mold is shared.

  In the invention according to claim 2, the control unit compares the mold information and position information of the molds that are automatically or manually laid out with CAM data, and the arrangement order of the molds according to the comparison result. Change or position correction is performed.

  The invention according to claim 3 is characterized in that the control unit performs automatic storage registration control by automatically assigning to the mold storage device based on the acquired information.

  According to a fourth aspect of the present invention, when the mold storage device is full, the control unit acquires selection information on whether or not to perform mold replacement by an operator who has confirmed the use frequency, and based on the selection information It is characterized by controlling.

  The invention according to claim 5 is characterized in that, in the case of an alarm stop during mold placement in automatic operation, the control unit performs an automatic recovery operation with reference to mold information and position information of the mold. .

The invention according to claim 6 is a mold detection method in which a mold layout device performs layout of a mold under control of a control unit, and a bending machine performs bending with the mold under control of a control unit.
The mold layout apparatus includes a detection unit that detects mold information of the mold and a position information acquisition unit that acquires position information of the mold, and the control unit includes the mold information and the position information. Based on the above, the mold is shared.

  According to the present invention, even if the control unit (NC device or the like) loses the mold information, it acquires the information and position again, thereby reconstructing the mold type and arrangement, and automatically arranging and storing the mold. Can be done. In addition, there is an effect that it is possible to manually place and store a mold that the machine does not have.

  Further, by acquiring the mold information registered in the ID and acquiring the mold position information on the table, the mold layout information can be reconfirmed by the control of the mold layout apparatus, and can be stored, rearranged, and the like.

  What can only be arranged and stored in the mold held in the mold storage device (mold stocker) can be arranged other than the held mold. By displaying the necessary mold information on the NC display, the mold can be arranged manually or at a predetermined position, so that it can be arranged in a product processable layout.

  Further, when the arrangement is shifted due to force majeure due to an alarm or the like, the re-recognition process is performed, so that the mold can be stored and arranged automatically.

  Since molds outside the mold storage device (mold stocker) can be taken in as ATC allocation targets, the number of mold allocation targets can be increased, and the operating rate of the machine can be improved. Dies with low usage frequency such as special molds can be shared by multiple machines.

It is the schematic which shows the outline of a bending machine. It is explanatory drawing explaining a die | dye side layout unit. It is explanatory drawing explaining a die | dye side layout unit. It is explanatory drawing explaining a die | dye side layout unit. It is explanatory drawing explaining a punch side layout unit. It is explanatory drawing explaining a punch side layout unit. It is explanatory drawing explaining a punch side layout unit. It is explanatory drawing explaining metallic mold position detection and metallic mold recognition. It is a flowchart which shows operation | movement of a metal mold | die layout. It is a flowchart which shows operation | movement of a metal mold | die layout. It is a flowchart which shows operation | movement of a metal mold | die layout. It is explanatory drawing explaining arrangement | positioning of a metal mold | die. It is explanatory drawing explaining the comparison with metal mold | position detection, metal mold | die recognition, and CAM. It is explanatory drawing explaining correction | amendment of a layout position. It is a flowchart which shows operation | movement of a metal mold | die layout. It is a flowchart which shows operation | movement of a metal mold | die layout.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  Please refer to FIG. An example of application of the die detection system KKS to a bending machine (for example, press brake) 1 will be described. That is, the mold detection system KKS includes the bending machine 1. Since the bending machine 1 is already well known, only the outline will be described.

  The bending machine 1 includes a lower table 2 and an upper table 3. A die holder 4 is provided above the lower table 2, and a die holder 5 is provided below the upper table 3. Further, a plurality of dies D (metal molds) are installed in the die holder 4, and a plurality of punches P (metal molds) are installed in the punch holder 5. On the other hand, a side frame 6 and a side frame 7 are provided on both the left and right sides of the bending machine 1 (both left and right sides with respect to the paper surface). The bending machine 1 configured as described above positions the workpiece W against the abutting portion T, and bending is performed by the cooperation of the punch P and the die D.

  The bending machine 1 of the mold detection system KKS includes a mold storage device 8 that stores and supplies the die D and the punch P. Then, the die D and the punch P stored in the mold storage device 8 based on the program are conveyed to a place specified by the mold layout device (die-side layout units 11 and 12, punch-side layout units 13 and 14). And laid out.

  The die-side layout units 11 and 12 and the punch-side layout units 13 and 14 are configured to be movable and positionable on the corresponding rail 9 and rail 10, respectively (for example, control by a servo motor). And it is comprised so that the present position can be specified from position information by functions, such as an encoder.

  An example of the mold moving means according to the present invention is described in “WO00 / 41824”.

  The bending machine 1 has a control unit 1A. The control unit 1A is composed of a computer, and is a central processing unit such as a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), a storage unit, and a display unit for displaying images and characters. 1B includes an input unit for inputting / outputting data.

  Then, the control unit 1A controls the die layout device (die side layout units 11, 12 and punch side layout units 13, 14) for laying out the die D and the punch P, and the bending machine 1 is controlled. .

  The control unit 1A compares the mold information and position information of the automatically or manually laid mold with the CAM data, and performs predetermined processing on the mold according to the comparison result.

  Here, the predetermined processing includes an operation of automatically changing the arrangement order of the die D or the punch P, and an operation of correcting the positions of the laid-out die D and the punch P.

  The control unit 1A automatically assigns the mold storage device 8 based on the acquired information and controls automatic storage registration. On the other hand, when the mold storage device 8 is full, the control unit 1A acquires a selection as to whether or not to replace the mold by an operator who has confirmed the use frequency, and controls based on the selection.

  Furthermore, in the case of an alarm stop during mold placement in automatic operation, the control unit 1A refers to the mold information and position information of the die D and punch P and performs an automatic recovery operation.

  Please refer to FIG. 2, FIG. 3 and FIG. FIG. 3 is a view including a cross section of FIG. 2 viewed from the direction of the arrow AR1. FIG. 4 is a view of FIG. 2 as viewed from the direction of the arrow AR1. The die-side layout unit 11 (the same applies to the die-side layout unit 12) is provided with a detection unit that detects mold information of the die D and a position information acquisition unit that acquires position information of the mold. The die D is shared based on the type information and the position information. Sharing includes associating mold information acquired from a mold and mold position information with the mold to make the mold to be automated similar to already registered molds.

  That is, the die side layout unit 11 (the same applies to the die side layout unit 12) is provided with an identification sensor 11A as a detection unit, and the identification information S1 (bar code, QR code (registered trademark), RF-ID, etc.) of the die D is received. read. The identification sensor 11A is a reader, a CCD camera, or the like. The position information acquisition unit includes a position detection sensor (for example, a reflective spot type photoelectric sensor) 11B and a servo motor (encoder) 11C. That is, the position detection sensor (reflective spot type photoelectric sensor) 11B detects the end face Da and the end face Db of the die D, and acquires the position when detected via the servo motor (encoder) 11C. Further, the width of the die D can be generated from the positions of the end surface Da and the end surface Db.

  Please refer to FIG. 5, FIG. 6 and FIG. FIG. 6 is a view including a cross section of FIG. 5 viewed from the direction of the arrow AR2. FIG. 7 is a view of FIG. 5 viewed from the direction of the arrow AR2. The punch-side layout unit 13 (same for the punch-side layout unit 14) is provided with a detection unit that detects mold information of the punch P and a position information acquisition unit that acquires position information of the mold. The punch P is shared based on the mold information and the position information. Sharing includes associating mold information acquired from a mold and mold position information with the mold to make the mold to be automated similar to already registered molds.

  That is, the punch-side layout unit 13 (the same applies to the punch-side layout unit 14) includes an identification sensor 13A as a detection unit. The identification sensor 13A is a device that reads the identifiers S2 and S3 (bar code, QR code (registered trademark), RF-ID, etc.) of the punch P, a CCD camera, or the like. The position information acquisition unit includes a position detection sensor (for example, a reflective spot type photoelectric sensor) 13B and a servo motor (encoder) 13C. That is, the position detection sensor (reflective spot type photoelectric sensor) 13B detects the end face Pa or the end face Pb of the punch P, and acquires the position at the time of detection via the servo motor (encoder) 13C. Further, the width of the punch P can be generated from the positions of the end face Pa and the end face Pb.

  Reference is made to FIG. The punch-side layout unit 13 (same for the punch-side layout unit 14) configured as described above can detect, for example, the laid-out punches P1, P2, P3, P4, P5, P6, and P7. (The symbol SP indicates a stock punch). While the punch-side layout unit 13 moves in the direction of the arrow AR3, the mold position is detected (when “ON”), and the mold information (mold number, mold length, front / back discrimination, etc.) is recognized. Note that the stock punch SP performs automatic collation with a stocker-mounted die by a reading operation as in the die layout area.

  Reference is made to FIG. The die-side layout unit 11 (the same applies to the die-side layout unit 12) detects, for example, laid-out dies D1, D2, D3, D4, D5, D6, and D7 (the symbol SD indicates a stocked die). It becomes possible. While the die-side layout unit 11 moves in the direction of the arrow AR4, the die position is detected (when “ON”), and the die information (die number, die length, etc.) is recognized. In addition, the stock die SD performs automatic collation with the stocker-mounted die by the reading operation as in the die layout area.

  The operation of the mold detection system KKS will be described with reference to FIGS. There are various application methods of the mold detection system KKS, and a suitable example is described below.

  FIG. 9 shows that the ID (type, length, etc.) and the arrangement position are automatically detected by the detection unit mounted on the mold layout device for the mold in which the ID information (code used for identification, etc.) is registered. This is a method of operating the mold rearrangement and storage.

  First, in step SA01, an undefined mold (die D or punch P) is placed on the lower table 4 or the upper table 5.

  In step SA02, the control unit 1A recognizes the die D or punch P in which ID information is registered.

  In step SA03, the mold information is read by the ID recognition sensor 13A mounted on the mold layout device (die-side layout units 11, 12 or punch-side layout units 13, 14) under the control of the control unit 1A.

  In step SA04, the control unit 1A confirms the mold type, length, position on the table, and the like from the sensor reading position and the mold ID information.

  In step SA05, control unit 1A determines whether or not to store die D or punch P. If it is determined that the die D or punch P is to be stored, the process proceeds to step SA06. If it is determined that the die D or punch P is not stored, the process proceeds to step SA07.

  In step SA07, controlled by the control unit 1A, the die-side layout units 11 and 12 or the punch-side layout units 13 and 14 place the die D or punch P at the product processing layout position and attach them.

  In step SA06, the control unit 1A determines whether or not the holding mold is used. If it is determined that the mold is a holding mold, the process proceeds to step SA08. If it is determined that the mold is not a holding mold, the process proceeds to step SA09.

  In step SA09, the die D or punch P is placed at a designated position on the lower table 4 or the upper table 5. In step SA08, the die D or punch P is stored in the mold storage device (mold stocker) 8.

  Please refer to FIG. This is a method for checking and correcting the misoperation of the mold type, length, and orientation (front and back) in manual and automatic combination layout operations. Accuracy can be improved by improving safety by checking for erroneous work due to human intervention and correcting the layout of the mold.

  First, in step SB01, the control unit 1A reads a product program. And it memorize | stores in a memory | storage device etc.

  In step SB02, the automatic mold layout starts under the control of the control unit 1A. That is, the die side layout units 11 and 12 or the punch side layout units 13 and 14 place the die D or punch P at the product processing layout position. In step SB03, the automatic mold layout is completed.

  In step SB04, the mold clamp is manually turned off. Thereby, the die D or the punch P can be inserted. In step SB05, the die D or the punch P is additionally arranged manually.

  In step SB06, the mold clamp is manually turned on. Thereby, the punch P or the die D is fixed.

  That is, as shown in FIG. 12A, punches PA1, PA2, PA3, PA4, and PA5 are automatically laid out by automatic mold layout, for example. Thereafter, as shown in FIG. 12B, the punches PA6, PA7, and PA8 are manually arranged.

  In step SB07, the controller 1A automatically starts the identification and position reading operation. In step SB08, the control unit 1A compares the mold identification and CAM data to determine whether or not they match. If it is determined that they do not match, the process proceeds to step SB09. If it is determined that they match, the process proceeds to step SB10.

  In step SB09, the control unit 1A determines the mold arrangement order and determines whether or not they match. If it is determined that they do not match, the process proceeds to step SB11. If it is determined that they match, the process proceeds to step SB12.

  In step SB11, the arrangement order automatic change operation is performed under the control of the control unit 1A. That is, the die side layout units 11 and 12 or the punch side layout units 13 and 14 change the product processing layout of the die D or punch P.

  In step SB12, the control unit 1A is warned by the control of the die number, the die length, and the front / back mismatch information.

  On the other hand, in step SB10, the control unit 1A compares the mold position data with the CAM data and determines whether or not it is within an allowable range. If it is determined that the value is outside the allowable range, the process proceeds to step SB13. If it is determined that the value is within the allowable range, the process proceeds to step SB14.

  Please refer to FIG. The punches PA1, PA2, PA3, PA4 and PA5 are automatically laid out. Thereafter, punches PA6, PA7 and PA8 are manually arranged. In this case, it is assumed that the punch PA6 and the CAM data are shifted by ΔX5, and the punches PA7 and PA8 are shifted by ΔX2.

  In step SB13, a layout position correction operation is performed.

Refer to FIG. For example, the punches PA7 and PA8 are made to coincide with the CAM data by moving in the arrow AR6 direction by ΔX2. (The punch PA6 is also corrected.)
In step SB14 and step SB15, bending is performed.

  Please refer to FIG. This is a method for checking and correcting the mis-work of mold type, length, and orientation (front and back) in manual layout operation. Accuracy can be improved by improving safety by checking for erroneous work due to human intervention and correcting the layout of the mold.

  First, in step SC01, the control unit 1A reads a product program. And it memorize | stores in a memory | storage device etc.

  In step SC02, the mold clamp is manually turned off. Thereby, the die D or the punch P can be inserted. In step SC03, the die D or the punch P is additionally arranged manually. In step SC04, the mold clamp is manually turned on. Thereby, the punch P or the die D is fixed.

  In step SC05, the controller 1A automatically starts the identification and position reading operation. In step SC06, the control unit 1A compares the mold identification and CAM data to determine whether or not they match. If it is determined that they do not match, the process proceeds to step SC07. If it is determined that they match, the process proceeds to step SC08.

  In step SC07, the control unit 1A determines the mold arrangement order and determines whether or not they match. If it is determined that they do not match, the process proceeds to step SC09. If it is determined that they match, the process proceeds to step SC10.

  In step SC09, the arrangement order automatic change operation is performed under the control of the control unit 1A. That is, the die side layout units 11 and 12 or the punch side layout units 13 and 14 change the product processing layout of the die D or punch P.

  In step SC10, the control unit 1A is warned to the operator of the die number, die length, and front / back mismatch information.

  On the other hand, in step SC08, the control unit 1A compares the mold position data with the CAM data and determines whether or not the allowable range is satisfied. If it is determined that it is outside the allowable range, the process proceeds to step SC11. If it is determined that the value is within the allowable range, the process proceeds to step SC12.

  In step SC11, a layout position correcting operation is performed. Compared with the CAM data, the position correction of the difference can be performed with the same contents as those described in FIGS. 13 and 14 described above.

  In step SC13 and step SC14, bending is performed.

  Refer to FIG. This is an example in which automatic storage registration is possible by automatically assigning to a mold storage device (mold stocker) 8 based on acquired information, and checking for erroneous work and improving safety due to human intervention. When the mold storage device (mold stocker) 8 is fully loaded, the operator makes a selection decision while checking the frequency of use.

  In step SD01, the mold clamp is manually turned off. Thereby, the die D or the punch P can be inserted. In step SD02, the die D or the punch P is additionally arranged manually. In step SD03, the mold clamp is manually turned on. Thereby, the punch P or the die D is fixed.

  In step SD04, the controller 1A automatically starts the identification and position reading operation. In step SD05, the control unit 1A reads the mold identification and mold position data and stores them in the storage device.

  In step SD06, the control unit 1A collates with the storage state of the mold storage device (mold stocker) 8, and determines whether there is a vacancy. If it is determined that there is no space, the process proceeds to step SD07. If it is determined that there is a vacancy, the process proceeds to step SD08.

  In step SD07, the operator confirms the mold usage frequency.

  In step SD09, the control unit 1A determines whether or not to replace the storage mold of the mold storage device (mold stocker) 8. If it is determined not to replace, the process proceeds to step SD10. If it is determined that the replacement is to be performed, the process proceeds to step SD11.

  In step SD10, the control unit 1A does not update the storage information of the mold storage device (mold stocker) 8.

  In step SD11, the control unit 1A controls the mold storage device (mold stocker) 8 to be replaced. In step SD12, the control unit 1A updates the storage information of the mold storage device (mold stocker) 8.

  On the other hand, in step SD08, the control unit 1A performs allocation to the mold storage device (mold stocker) 8. In step SD13, automatic storage in the mold storage device (mold stocker) 8 is performed. In step SD14, the storage information of the mold storage device (mold stocker) 8 is updated.

  Refer to FIG. This is an example in which an automatic recovery operation is possible when an alarm is stopped during mold placement in automatic operation. It is possible to check for errors due to human intervention and improve safety.

  First, in step SE01, the control unit 1A reads a product program. And it memorize | stores in a memory | storage device etc.

  In step SE02, the controller 1A automatically starts the identification and position reading operation. In step SE03, the control unit 1A notifies an alarm during the automatic mold layout operation.

  In step SE04, the controller 1A automatically starts the identification and position reading operation. In step SE05, control unit 1A stores the read mold identification and mold position data in the storage device.

  In step SE06, the storage stocker is attached.

  In step SE07, the control unit 1A performs reading collation of the mold mounted on the mold storage device (mold stocker). If it is determined not to collate, the process proceeds to step SE08. If it is determined to collate, the process proceeds to step SE09.

  In step SE08, the control unit 1A warns the mismatch content.

  In step SE09, automatic storage is performed in the mold storage device (mold stocker) 8. In step SE10, the storage information of the mold storage device (mold stocker) 8 is updated.

  The present invention is not limited to the embodiments of the invention described above, and can be implemented in other modes by making appropriate modifications.

DESCRIPTION OF SYMBOLS 1 Bending machine 1A Control part 1B Display part 2 Lower table 3 Upper table 4 Die holder 5 Punch holder 6 Side frame 7 Side frame 8 Mold storage device (mold stocker)
9 Rail 10 Rail 11 Die side layout unit 11A Detection unit 11B Detection unit 11C Position information acquisition unit 12 Die side layout unit 13 Punch side layout unit 13A Detection unit 13B Detection unit 13C Position information acquisition unit 14 Punch side layout unit KKS Mold detection System W Work P Punch D Die T Abutting part

Claims (5)

In a mold detection system comprising: a mold layout apparatus that performs layout of a mold by control of a control unit; and a bending machine that performs bending by the mold by control of a control unit;
The mold layout apparatus is capable of conveying a mold,
The mold layout apparatus is provided with a detection unit that detects mold information of the mold and a position information acquisition unit that acquires position information of the mold, and the control unit is the mold that is manually arranged As the mold already registered by associating the mold information and the position information with the mold, the mold to be automated, and
The control unit compares the mold information and position information of the molds automatically or manually laid out with CAM data, and changes the arrangement order of the molds or corrects the position according to the comparison result. A featured mold detection system. 2. The mold detection system according to claim 1, wherein the control unit performs automatic storage registration control by automatically assigning to the mold storage device based on the acquired information. When the mold storage device is full, the control unit acquires selection information as to whether or not to perform mold replacement by an operator who has confirmed the use frequency, and performs control based on the selection information. Item 3. A mold detection system according to Item 2 . When the automatic operation of the alarm stop of the mold arrangement, the control unit claim 1-3, characterized in that for automatic recovery operation with reference to the mold information and the position information of the mold 2. A mold detection system according to item 1. In the mold detection method in which the mold layout device performs the layout of the mold by the control of the control unit, and the bending machine performs the bending process by the mold by the control of the control unit.
The mold layout apparatus is capable of conveying a mold,
The mold layout apparatus is provided with a detection unit that detects mold information of the mold and a position information acquisition unit that acquires position information of the mold, and the control unit is the mold that is manually arranged As the mold already registered by associating the mold information and the position information with the mold, the mold to be automated, and
The control unit compares the mold information and position information of the molds automatically or manually laid out with CAM data, and changes the arrangement order of the molds or corrects the position according to the comparison result. A feature of the mold detection method.