JP6298343B2 - Wiring board manufacturing method - Google Patents

Description

The present invention may, for example, a method of manufacturing a wiring board having a double conductor for transmitting a high frequency signal.

  When transmitting a high-frequency signal, in order to prevent delay and malfunction due to interaction between adjacent wirings and noise, a cross section is rectangular between the ceramic layers in the insulating substrate formed by laminating a plurality of ceramic layers ( A quadrilateral metallized central line, a ceramic line surrounding the central line and having a cross section similar to the central line, and a double metallizing peripheral line surrounding the ceramic line and similar to the ceramic line in cross section. A wiring board formed by forming a line conductor having a structure has been proposed (for example, see Patent Document 1).

  However, when the high-frequency signal transmitted through the central line of the line conductor is transmitted to the pads formed on the front surface and the back surface of the insulating base, like the wiring board, the via conductor connecting the pads and the central line Are connected at right angles to the ends. If such a right-angled connection portion is provided in the transmission path, current concentrates on the right-angled connection portion, so that transmission loss of the high-frequency signal transmitted through the center line is increased. There was a problem that the property was impaired.

JP 2004-96056 A (pages 1 to 9, FIG. 1)

The present invention solves the problems described in the background art, and includes, for example, a central conductor that transmits a high-frequency signal, and an outer peripheral conductor that surrounds the periphery of the central conductor via an insulating portion inside a substrate body made of an insulating material. A wiring that can accurately transmit a high-frequency signal transmitted to the center conductor of the double conductor without causing transmission loss on a pad formed on the front surface or the back surface of the substrate body. to provide a method of manufacturing a board, it is an object.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problem, the present invention provides a double conductor comprising a central conductor and an outer peripheral conductor surrounding the central conductor with an insulating part interposed between the front surface and the back surface of the substrate body, or the front surface. It is conceived that at least a part is arranged in a continuous curved shape between the side surfaces.
That is, the method for manufacturing a wiring board according to the present invention (Claim 1) comprises a substrate body made of an insulating material, having a front surface and a back surface, and a side surface located between the front surface and the back surface, and a surface of the substrate body. And a double conductor comprising a central conductor and an outer peripheral conductor that surrounds the central conductor with an insulating portion disposed between the rear surface and the back surface or between the front surface and the side surface of the substrate body. In the wiring board, the double conductor has both end surfaces exposed on the front and back surfaces of the substrate body, or the front and side surfaces of the substrate body, and between the front and back surfaces of the substrate body or the substrate. A method of manufacturing a wiring board having a bent portion bent at least in part between a surface and a side surface of the main body, and the bent portion only includes a curved portion bent in a two-dimensional direction or a three-dimensional direction. Because
A central shaft portion, and an outer peripheral cylindrical portion surrounding the central shaft portion with a gap between the central shaft portion and the outer peripheral cylindrical portion. It consists only of curved parts curved in a dimensional direction or a three-dimensional direction, and connects the central shaft part and the outer peripheral cylinder part in the vicinity of both ends of the central axial part and the outer peripheral cylindrical part, and between them. A plurality of connecting portions defining a plurality of opening holes communicating between the gap and the outside, and a plurality of connecting portions formed in the outer peripheral cylindrical portion and communicating between the inner peripheral surface and the outer peripheral surface of the outer peripheral cylindrical portion. A step of preparing a three-dimensional model for forming a double conductor having a groove or a through hole, and the three-dimensional model is made of a powder, slurry, or liquid insulating material except at least both end faces of the model. By enclosing, the front and back surfaces, and the front and back surfaces And a side surface located on the steps of both end faces of the model are either exposed to the front and rear surfaces, forming a arsenide substrate body exposed to the surface and side,
The base substrate body is heated, and the insulating material constituting the base substrate body is baked or cured to obtain a base substrate body in which a cavity is provided, and from the inside of the base substrate body in the heating process. Removing the solid model, filling a conductive paste containing metal powder into the cavity formed in the trace of the solid model located inside the base substrate body, and the cavity A step of obtaining a base substrate body on which the double conductor including the curved portion is formed by heating and curing the conductive paste filled therein; and a front surface and a back surface of the base substrate body; And the side surfaces are polished to remove the cured product of the conductive paste filled in the traces from which the plurality of connecting portions located at least near both ends of the double conductor are removed, and form a substrate body. and a step, the, And wherein the door.

According to this, both end surfaces are exposed on the front and back surfaces of the substrate body, or the front and side surfaces of the substrate body, and between the front and back surfaces of the substrate body or between the front and side surfaces of the substrate body. And having a bent portion bent at least in a part in the axial direction, and the bent portion includes a double conductor composed only of a curved portion bent in a two-dimensional direction or a three-dimensional direction in the interior of the substrate body. It is possible to reliably manufacture the wiring board included in the above .

The insulating material constituting the substrate body is a ceramic or a resin, and the ceramic includes, for example, a high-temperature fired ceramic such as alumina and a low-temperature fired ceramic such as glass-ceramic. A curable and heat-resistant synthetic resin (for example, epoxy, polyester, polyimide resin, etc.) is included.
The double conductor is mainly made of a metal having excellent thermal conductivity, and the metal includes W, Mo, Ag, Cu, or an alloy containing any one of them as a main component.
Further, the double conductor is, for example, a so-called center conductor through which a high-frequency signal flows, and a so-called outer conductor that surrounds the periphery with an insulating portion made of an insulating material and prevents the influence of external noise and the like. Also used as a shield pattern.
Further, the two-dimensional direction is any two of an X (left / right) direction, a Y (front / rear) direction, and a Z (vertical) direction orthogonal to each other, and the three-dimensional direction is the X direction or the Y direction. , And all in the Z direction.
Further, the double conductor may be formed not only from the bent portion but also from the bent portion and a straight linear portion in a two-dimensional or three-dimensional direction.
In addition, in the inside of the substrate body, a wiring layer such as a ground (grounding layer) with a predetermined distance between the double conductor, and a via conductor for conducting the wiring layer to the outside, Pads connected to both ends of the via conductor are separately provided.

In addition, the three-dimensional model is formed exclusively for the three-dimensional double conductor including the gap. For example, using a three-dimensional (3D) printer, resin powder, wax, low melting point metal powder, Or it forms by laminating | stacking one of the powders of a low melting-point alloy, supplying in order toward the other end side from the one end side of this model .

In addition, it is desirable that the metal powder contained in the conductive paste has an average particle diameter of 1 μm or less from the viewpoint of easy filling into the cavity of the base substrate body .

Further, in the step of removing the model by heating the base substrate body, in the case where the insulating material is made of ceramic, the ceramic or the ceramic or the brazing material that has formed the model in the heating process is fired. Is performed by evaporating or sublimating the substrate to the outside of the base substrate body .

In addition, the step of removing the model from the base substrate body including a cavity obtained by heating the base substrate body forms the thermosetting resin when the insulating material is made of a thermosetting resin. This is performed by heating the thermosetting resin to a temperature equal to or higher than the curing temperature, and liquefying the wax, metal powder, or alloy powder that formed the model in the process and letting it flow out of the base substrate body .

Further, the present invention provides a method for removing the cured product of the conductive paste and forming the substrate body on the front and back surfaces, or the front and side surfaces of the substrate body where both end faces of the double conductor are exposed. Also included is a method of manufacturing a wiring board (Claim 2 ), further comprising a step of forming inner and outer double pads or inner and outer double side conductors individually connected to the end face of the central conductor and the end face of the outer peripheral conductor.
According to this, a high-frequency signal or the like can be transmitted to one end side of the central conductor of the double conductor via the inner pad or the inner side conductor, and the inner side different from the above from the other end side of the central conductor. The above-mentioned high-frequency signal can be transmitted to the outside via the inner pad or the inner side conductor, and the entire periphery can be electrically shielded by the outer conductor of the double conductor and the outer pad or the outer side conductor. A substrate can be reliably provided.

Vertical cross-sectional view illustrating a wiring board of an embodiment that obtained Ri by the present invention. The top view of the said wiring board. (A) is a vertical sectional view of a three-dimensional model used in the manufacturing method for obtaining the wiring board according to the present invention , (B) is a plan view showing an upper end portion of the model, and (C) is a perspective view near the upper end portion. Schematic which shows 1 process in the manufacturing method of the said wiring board. Schematic which shows the process following the process of FIG. FIG. 6 is a schematic view showing a step that follows the step of FIG. 5. Schematic which shows the process following the process of FIG. Schematic which shows the process following the process of FIG. 7, and the principal part of the said wiring board. The vertical sectional view which shows the wiring board of a different form obtained by this invention . The vertical sectional view which shows the wiring board of the further different form obtained by this invention . The vertical sectional view which shows the wiring board of another different form obtained by this invention .

Hereinafter, modes for carrying out the present invention will be described.
Figure 1 is a vertical sectional view showing a wiring substrate 1a of a form that obtained Ri by the present invention, FIG. 2 is a plan view of a wiring substrate 1a.
As shown in FIGS. 1 and 2, the wiring board 1 a is made of ceramic (insulating material), and includes a front surface 3 and a back surface 4, and four side surfaces 5 positioned between the front surface 3 and the back surface 4. A substrate body 2 having a rectangular parallelepiped shape as a whole, a central conductor 11 formed continuously between the front surface 3 and the back surface 4 of the substrate main body 2 and positioned at the center of the cross section, and the periphery of the central conductor 11 A double conductor 10a made of an outer peripheral conductor 13 surrounded by an insulating portion 12 made of the same ceramic as described above.
In addition, the ceramic which comprises the said board | substrate main body 2 and the insulation part 12 consists of glass-ceramics, for example.

The double conductor 10a includes a central conductor 11 having a circular cross section, an insulating portion 12 and an outer peripheral conductor 13 having an inner shape and an outer shape similar to the central conductor 11, and an outer peripheral conductor 13. The insulating part 12 and the outer peripheral conductor 13 are concentric with each other. 1 and 2, the upper and lower portions along the axial direction of the double conductor 10a have a pair of upper and lower bent portions cp bent in a curved shape in the three-dimensional direction. Note that a straight line portion that is linear in the three-dimensional direction is located between the pair of bent portions cp.
As shown in FIG. 1 and FIG. 2, the upper and lower end surfaces of the double conductor 10a that are individually exposed on the front surface 3 and the back surface 4 of the center conductor 11 and the outer conductor 13 are respectively circular inside in a plan view. The pads 14 and 16 and the outer pads 15 and 17 having a ring shape in plan view are concentrically connected to each other and are individually connected.

In the substrate body 2, via conductors 6a and 6b penetrating between the front surface 3 and the back surface 4 are separately provided. The via conductors 6a and 6b are composed of a pair of upper and lower straight portions 7 perpendicular to the front surface 3 and the back surface 4 and an inclined portion 8 connecting between them. As indicated by broken lines in FIG. 1, a wiring layer (for example, a ground layer) 7g parallel to the front surface 3 and the back surface 4 of the substrate body 2 may be further connected to the via conductors 6a and 6b. . Disc-shaped surface pads 18 and back surface pads 19 are individually connected to the upper and lower surfaces of the via conductors 6a and 6b that are individually exposed on the front surface 3 and the back surface 4.
The inclined portion 8 may be provided with a wiring layer extending in the front-rear direction of FIG.
Further, the central conductor 11, the outer peripheral conductor 13, and the via conductors 6a and 6b are made of Ag or Cu, for example.

  According to the wiring board 1a as described above, the double conductors 10a having both end surfaces exposed on the front surface 3 and the back surface 4 of the substrate body 2 and continuously disposed between them are formed on the upper and lower portions. The bent portion cp has two bent portions cp, and the bent portion cp includes only a curved portion that is curved in a three-dimensional direction. As a result, a high frequency signal transmitted through the central conductor 11 of the double conductor 10a can be transmitted to the pads 14 and 16 formed on the front surface 3 and the back surface 4 of the substrate body 2 without causing transmission loss. Furthermore, since the double conductor 10a serves as both a conventional center line and a via conductor, there is no possibility of poor connection or disconnection between the center line and the via conductor.

Furthermore, since the cross section of the central conductor 11 is circular, current concentration due to the skin effect on the corners of the four corners can be reliably suppressed as in the metallized central line having a quadrangular cross section described in the background art. In addition, the distance between the wiring layer 7g, which is the ground layer, and the double conductor 10a is not constant, and the mutual distance is always wider than the closest part between the two, and the parasitic capacitance generated between the two is larger than that of the conventional form. Therefore, it is possible to improve the high frequency characteristics of the central conductor 11 of the double conductor 10a. Therefore, it is possible to reliably provide the wiring board 1a having excellent transmission characteristics such as high-frequency signals.
The cross-section of the central conductor 11 is elliptical or oval, and the inner shape and outer shape of the insulating portion 12 and the outer peripheral conductor 13 surrounding these are also oval or oval similar to the above. Also good.
The bent portion cp of the double conductor 10a may be a curved portion bent in a curved shape in any two two-dimensional directions among the X, Y, and Z directions.

Hereinafter, the method for manufacturing the wiring board 1a according to the present invention will be described by limiting it to the vicinity of the double conductor 10a.
As shown in the vertical cross-sectional view of FIG. 3A, a three-dimensional model 20 for forming the double conductor 10a was prepared in advance. As shown in FIG. 3 (A), the three-dimensional model 20 uses a three-dimensional printer (not shown) as a liquid raw material made of an acrylic resin powder and an adhesive having an average particle diameter of 1 to 50 μm. A central shaft portion 21 along the center line of the direction, and a cylindrical outer peripheral cylindrical portion 23 surrounding the central shaft portion 21 via a cylindrical gap 22, the central shaft portion 21, the gap 22, In addition, the upper and lower portions in the axial direction of the outer peripheral cylindrical portion 23 are formed by sequentially stacking along the vertical direction in the drawing so as to have a pair of upper and lower bent portions cp curved in a three-dimensional direction ( Step of preparing a three-dimensional model).

Further, as illustrated in the plan view of the upper end surface of FIG. 3B and the perspective view of the vicinity of the upper end portion of FIG. Four (a plurality of) connecting portions 25 are formed that connect the outer peripheral cylindrical portion 23 and define four (a plurality of) opening holes 26 that communicate between the gap 22 and the outside.
Further, as shown in FIG. 3 (C), a concave portion 27 without the central shaft portion 21 and the connecting portion 25 is located inside each end portion of the outer peripheral cylindrical portion 23. The outer peripheral cylindrical portion 23 is communicated via four (a plurality of) concave grooves 28 communicating between the inner peripheral surface near the upper end surface (end surface) 24 and the outer peripheral surface. The ceramic portion that is filled in the concave groove 28, the concave portion 27, and the opening hole 26 becomes a support portion for supporting the pipe-shaped ceramic portion that is filled in the gap 22 at both ends thereof.

Next, in the rectangular parallelepiped cavity disposed in a mold (not shown), the solid model 20 is constrained by contacting only the upper and lower end surfaces thereof with the ceiling surface and floor surface of the cavity. A glass-ceramic (insulating material) slurry was filled in by gel casting. In the cavity, two three-dimensional models (not shown) for forming the via conductors 6a and 6b were disposed together.
As a result, as shown in FIG. 4 (A), the glass-ceramic slurry is made of a dried raw ceramic body, and has a front surface 33, a back surface 34, and a side surface 35 located between these four sides, The base substrate body 30 was obtained in which the upper and lower end faces 24 of the three-dimensional model 20 were individually exposed on the front surface 33 and the back surface 34 (step of forming the base substrate body).
As illustrated in FIG. 4B in which the one-dot chain line portion B in FIG. 4A is enlarged, the pipe-shaped unfired ceramic portion 36 filled in the gap 22 is formed in the plurality of opening holes 26. Through the unfired ceramic part (45) filled in the recess 27, the unfired ceramic part 37 filled in the recess 27, and the unfired ceramic part 38 filled in the plurality of grooves 28. Connected to the unfired ceramic portion of the base substrate body 30 located around the substrate.

Further, the base substrate body 30 was heated to a predetermined temperature range, and the ceramic parts constituting the base substrate body 30 were fired. In this heating process, the acrylic resin powder, adhesive, and the like constituting the three-dimensional model 20 were sequentially evaporated from the upper end surface of the three-dimensional model 20 to the outside.
As a result, as shown in FIG. 5A, the solid model 20 is made of glass-ceramic, has a front surface 33, a back surface 34, and a side surface 35 positioned between these four sides, and the three-dimensional model 20 is removed by evaporation. As a result, a base substrate body 31 having a cavity 40 similar to the three-dimensional model 20 formed therein was obtained (step of removing the three-dimensional model).

The hollow portion 40 includes a central cavity portion 41 and an outer peripheral cavity portion 43 that are located at the trace where the central shaft portion 21 and the outer peripheral cylindrical portion 23 are removed, and the central shaft portion is located above and below in the axial direction. 21 and the outer peripheral cylinder part 23 had the same bending part cp. Note that reference numeral 44 in FIG. 5A denotes openings at both ends of the outer peripheral cavity 43.
Furthermore, as illustrated in FIG. 5B in which the one-dot chain line portion B in FIG. 5A is enlarged, the pipe-shaped ceramic portion 36 that is fired after being filled in the gap 22 has a plurality of openings. Via the fired ceramic part 45 filled in the hole 26, the fired ceramic part 37 filled in the recess 27, and the fired ceramic part 38 filled in each of the plurality of concave grooves 28 By being connected to the ceramic portion of the surrounding base substrate body 31, it was supported by the ceramic portion.

Next, a conductive paste containing Ag powder or Cu powder (metal powder) was filled into the cavity 40 from the surface 33 side (step of filling the conductive paste).
As a result, as shown in FIG. 6, the base substrate body 32 in which the uncured double conductor 10 a including the central conductor 11, the gap 12, and the outer peripheral conductor 13 made of the conductive paste is formed in the cavity 40. In addition, a plurality of connection pieces 29 are formed on the trace of the connection portion 25 in the vicinity of both ends of the double conductor 10a.
Further, the base substrate body 32 in which the uncured double conductor 10a is provided was heated to a predetermined temperature range to cure (cure) the double conductor 10a. As a result, the base substrate main body 32 in which the cured double conductor 10a was provided was obtained (step of obtaining the base substrate main body on which the double conductor was formed).

Next, the front surface 33 and the back surface 34 of the base substrate body 32 were polished to a required thickness. As a result, as shown in FIG. 7, the plurality of connection pieces (cured products) that have the front surface 3, the back surface 4, and the side surface 5 and are located near both end portions of the double conductor 10 a after curing. 29. The substrate body 2 from which the ceramic portions 37, 38, 45 were removed was obtained (step of removing the cured product and forming the substrate body).
Then, a Ti alloy is sputtered on both end surfaces of the central conductor 11 and the outer peripheral conductor 13 of the double conductor 10a exposed on the front surface 3 and the back surface 4 of the substrate body 2 to form a pair of concentric circles and rings. The base metal layer was formed, Cu was sputtered on the surface of each base metal layer, and the surface metal layer was laminated to form a pad body, and Ni plating and Au plating were sequentially applied to the surface.
The front and back pads 18 and 19 connected to both end faces of the via conductors 6a and 6b were also formed by the same method as described above.

As a result, as shown in FIG. 8, the wiring board 1a has inner pads 14 and 16 formed on both end faces of the central conductor 11 and outer pads 15 and 17 formed on both end faces of the outer conductor 13. Could get.
The pads 14 to 17 may be formed by screen-printing a conductive paste in a predetermined shape and then performing these curing processes.
According to the manufacturing method of the wiring board 1a as described above, both end surfaces are exposed on the front surface 3 and the back surface 4 of the substrate body 2, and at least the axial direction is provided between the front surface 3 and the back surface 4 of the substrate body 2. The wiring board 1a having the bent portion cp bent in part and having the double conductor 10a including only the curved portion bent in a curved shape in the three-dimensional direction is reliably manufactured. I was able to.

FIG. 9 is a vertical sectional view showing a wiring board 1b of a different form obtained by the present invention .
As shown in FIG. 9, the wiring substrate 1b includes a substrate body 2, via conductors 6a and 6b, and a double conductor 10b continuously disposed between the front surface 3 and the back surface 4 of the substrate body 2. It has. The double conductor 10b has a central conductor 11, an insulating portion 12, and an outer peripheral conductor 13 similar to those described above in cross section, and an upper side and a lower side in the axial direction between the front surface 3 and the rear surface 4 of the substrate body 2. As shown in FIG. 9, the two bent portions cp are connected in opposite directions (line symmetry).

FIG. 10 is a vertical sectional view showing a wiring board 1c of still another embodiment obtained by the present invention .
As shown in FIG. 10, the wiring board 1c has a double conductor disposed continuously between the board body 2, the via conductor 6a, the surface 3 of the board body 2, and the right side surface 5 in the drawing. 10c. The double conductor 10c has a bent portion cp that hangs down in a substantially J-shaped curve from the vicinity of the center of the surface 3 of the substrate body 2 and one end surface exposed on the side surface 5 of the substrate body 2 and from the side surface to the substrate. A bent portion cp that gently bends upward toward the center side of the main body 2 is connected while continuously bending. Side conductors 16 and 17 having the same shape as the inner pad 16 and the outer pad 17 are formed for each end face of the central conductor 11 and the outer conductor 13 exposed on the side face 5 of the substrate body 2.

FIG. 11 is a vertical cross-sectional view showing yet another form of the wiring board 1d obtained by the present invention .
As shown in FIG. 11, the wiring substrate 1d includes a substrate body 2, via conductors 6a and 6b, and a double conductor 10d that is continuous and partially branched between the front surface 3 and the back surface 4 of the substrate body 2. And. The double conductor 10d has an approximately y-shape as a whole when viewed from the side, both ends are exposed on the surface 3 of the substrate body 2, and the upper side is formed of a pair of left and right that is generally U-shaped when viewed from the side. The portion cp and the lower bent portion cp branched substantially downward from the vicinity of the bottom of the bent portion cp are continuously connected. The central conductor 11, the insulating portion 12, and the outer conductor 13 of the double conductor 10d are branched portions 11y, 12y by continuous curved portions near the bottom of the pair of bent portions cp located on the upper side that is substantially U-shaped. , 13y toward the lower bent portion cp, each of which is divided into two.
The same effects as those of the wiring board 1a can be obtained by the wiring boards 1b to 1d as described above.
The wiring boards 1b to 1d are also manufactured by the same method as the wiring board 1a.

The present invention is not limited to the embodiments described above.
For example, the insulating material constituting the substrate body may be a low-temperature fired ceramic other than glass-ceramic or a high-temperature fired ceramic such as alumina. In the latter case, W or Mo or the like is applied to an element made of a conductor such as a central conductor or an outer peripheral conductor of the double conductor. Further, a thermosetting and heat resistant synthetic resin (for example, an epoxy resin) may be applied to the insulating material.
The substrate body has a cavity having an opening at the center of the surface thereof, and one end surface or both end surfaces of the double conductor are exposed on the bottom surface of the cavity, and the inner and outer double pads are exposed on these end surfaces. May be formed.
Further, the double conductors 10a to 10d may have a configuration in which a plurality of sets of the same type or different types are provided in a single substrate body.
The cross section of the central conductor 11 of the double conductors 10a to 10d is elliptical or oval, and the inner shape and outer shape of the insulating portion 12 and the outer conductor surrounding the central conductor 11 are similar to the elliptical or oval shape. It is also good.

Further, the double conductor may have three or more end surfaces, and one or more end surfaces may be exposed on each of the front surface 3, the back surface 4, and the side surface 5 of the substrate body 2.
Further, the double conductor may have at least one bent portion in the axial direction .
Furthermore, the center conductor 11 of the double conductor may be used for signal transmission other than the transmission of a high-frequency signal.
Further, in the three-dimensional model 20 for forming the double conductor, a plurality of communicating between the inner peripheral surface and the outer peripheral surface of the outer peripheral cylindrical portion 23 are provided in the vicinity of both ends in place of the plurality of grooves 28. A through hole may be formed.
Furthermore, in the step of forming the base substrate body 30, a powder pressing method of pressing ceramic powder or the like in a predetermined mold may be used.
In addition, the three-dimensional model 20 may be formed of brazing or a low melting point metal. For example, after being embedded in the base substrate body 30 made of ceramic slurry, when the base substrate body 30 is fired, The wax or low melting point metal that has become liquid may be removed by flowing down from the lower end surface of the cavity 40.

According to the present invention, a double conductor composed of a central conductor for transmitting a high-frequency signal and an outer peripheral conductor for shielding that surrounds the periphery of the central conductor via an insulating portion is disposed inside the substrate body made of an insulating material. was set, the high-frequency signals transmitted by the center conductor of the double conductor securely method to manufacture a wiring board can be accurately transmitted without causing the transmission loss such as pad formed such as surface and back surface of the substrate body Can be provided.

1a to 1d .... wiring board 2 ........... main body 3,33 ........ front surface 4,34 .... back surface 5.35 ........ side surface 10a.about.10d .. double conductor 11 ……………… Center conductor 12 ……………… Insulation part 13 ……………… Outer peripheral conductor 14 to 17 ……… Pad / side conductor 20 ……………… Solid model
21 ……………… Center shaft 22 ……………… Gap 23 ……………… Outer cylindrical part 25 ……………… Connecting part 28 ……………… Groove 29 ………… ... Cured material of conductive paste 30 to 32 ... ... Substrate body cp ... ... ... Bending part

Claims (2)

A substrate body made of an insulating material and having a front surface and a back surface and a side surface located between the front surface and the back surface, between the front surface and the back surface of the substrate body, or between the front surface and the side surface of the substrate body And a double conductor composed of a central conductor and an outer peripheral conductor surrounding the central conductor with an insulating part interposed therebetween, wherein the double conductor is a surface and a back surface of the substrate body or the substrate. Both end surfaces are exposed on the front and side surfaces of the main body, and have a bent portion bent at least partially between the front and back surfaces of the substrate main body or between the front and side surfaces of the substrate main body, The bent portion is a method of manufacturing a wiring board consisting only of a curved portion bent in a two-dimensional direction or a three-dimensional direction,
A central shaft portion, and an outer peripheral cylindrical portion surrounding the central shaft portion with a gap between the central shaft portion and the outer peripheral cylindrical portion. It consists only of curved parts curved in a dimensional direction or a three-dimensional direction, and connects the central shaft part and the outer peripheral cylinder part in the vicinity of both ends of the central axial part and the outer peripheral cylindrical part, and between them. A plurality of connecting portions defining a plurality of opening holes communicating between the gap and the outside, and a plurality of connecting portions formed in the outer peripheral cylindrical portion and communicating between the inner peripheral surface and the outer peripheral surface of the outer peripheral cylindrical portion. Preparing a three-dimensional model for forming a double conductor having a groove or a through hole;
By enclosing the above three-dimensional model with a powdery, slurry-like or liquid insulating material except at least both end faces of the model, a front surface and a back surface, and a side surface positioned between the front surface and the back surface Having both ends of the model exposed on the front and back, or forming a base substrate body exposed on the front and side;
The base substrate body is heated, and the insulating material constituting the base substrate body is baked or cured to obtain a base substrate body in which a cavity is provided, and from the inside of the base substrate body in the heating process. Removing the three-dimensional model;
A step of filling a conductive paste containing a metal powder into the cavity formed in a mark located inside the base substrate body and the solid model is removed;
A step of obtaining a base substrate body on which the double conductor including the curved portion is formed by heating and curing the conductive paste filled in the cavity;
The conductive paste filled in the trace from which the plurality of connecting portions located at both ends of the double conductor are removed by polishing the front and back surfaces or the front and side surfaces of the base substrate body. Removing the cured product and forming a substrate body.
A method for manufacturing a wiring board. After the step of removing the cured product of the conductive paste and forming the substrate body, the end surface and the outer periphery of the center conductor on the front and back surfaces, or the front and side surfaces of the substrate body where both end surfaces of the double conductor are exposed Forming a double pad inside or outside, or a double side conductor inside and outside that is individually connected to the end face of the conductor;
The method for manufacturing a wiring board according to claim 1 .

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