JP6295515B2 - ELECTRONIC DEVICE, ELECTRONIC DEVICE, MOBILE BODY, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE - Google Patents

Description

  The present invention relates to an electronic device, an electronic apparatus and a moving body on which the electronic device is mounted, and a method for manufacturing the electronic device.

Conventionally, along with the downsizing and thinning of electronic equipment, electronic devices having vibrating devices such as crystal resonators are required to be further downsized and thinned, and power consumption is reduced to save energy. Is also required. In particular, in order to avoid the influence of the ambient temperature and to have high frequency stability, an electronic device such as an OCXO (crystal oscillator with a thermostatic bath) having a structure in which the heating element is heated and the ambient temperature of the crystal unit is kept constant is Since heat from the heating element is transmitted to the substrate and radiated to the outside of the OCXO, there is a problem that power consumption is large.
In order to solve such a problem, in Patent Document 1, a concave portion is provided in a substrate, a quartz crystal unit having a heating element fixed therein is disposed, and the substrate is floated from a substrate by a support member such as an adhesive or a lead terminal. A method of reducing power consumption by suppressing heat taken by a substrate by using a supporting structure is disclosed.

JP 2007-6270 A

  However, the above-mentioned OCXO is difficult to bond because the bonding wire that electrically connects the heating element provided on the surface of the crystal unit and the substrate is supported by the support member in a floating state. In addition, there is a problem that there is a possibility of disconnection due to insufficient strength.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

An electronic device according to an aspect of the present invention includes a support member having a first terminal, a second terminal, and a support portion connecting the first terminal and the second terminal, and a first member on an outer surface. A vibration device having three terminals, a heating element for heating the vibration device, a first bonding member that fixes the first terminal and the third terminal, and the first bonding member. A second joining member that secures the first terminal and the third terminal, and the first terminal overlaps the third terminal in plan view. 1 region and a second region extending from the first region to the outside of the region overlapping the third terminal, and the first bonding member is the first region of the third terminal. Between the region facing the first region and the first region, and the second joining member is And frequency, and secured between said vibrating device, said first terminal in a plan view, it <br/> part of the second region is provided on the outside of the vibrating device Features.
According to this embodiment, the first terminal of the support member and the third terminal provided on the vibration device are the first.
Since it is fixed by the joining member and the second joining member, there is an effect that the mechanical joining strength between the support member and the vibration device can be increased. Further, when the supporting member and the vibration device are fixed using the first bonding member having conductivity and the second bonding member having low thermal conductivity,
The support member and the vibration device can be electrically connected, and the heat from the heating element that heats the vibration device is not easily transmitted from the vibration device to the support member, so that the power consumed by the heating element is reduced and the power consumption is low. There is an effect that an electronic device can be obtained.
Further, according to this embodiment, the first member of the support member and the third terminal provided in the vibration device are fixed by the first bonding member having conductivity in the overlapping region, so that the support member and the vibration device are Can be electrically connected and the first bonding member having high thermal conductivity can be stored in the region overlapping the third terminal, so that the heat from the heating element for heating the vibration device is supported by the vibration device. There is an effect that transmission to the member can be minimized.
An electronic device according to another aspect of the present invention includes a first terminal, a second terminal, and a support member having a support portion that connects the first terminal and the second terminal; The first terminal and the third terminal in a first region where the first terminal and the third terminal overlap in plan view, The first terminal and the main surface of the vibration device around the third terminal are fixed by a first bonding member, and the first terminal and the main surface of the vibration device around the third terminal are in a plan view. The overlapping second region is fixed by a second bonding member , and the first terminal is partly provided on the outside of the vibration device in plan view. And
According to this embodiment, since the first terminal of the support member and the third terminal provided in the vibration device are fixed by the first bonding member and the second bonding member, the mechanical relationship between the support member and the vibration device is increased. There is an effect that it is possible to increase the bonding strength. Further, when the supporting member and the vibration device are fixed using the first bonding member having conductivity and the second bonding member having low thermal conductivity, the connection between the support member and the vibration device can be achieved, and Heat from the heating element that heats the vibration device becomes difficult to be transmitted from the vibration device to the support member, so that the power consumed by the heating element is reduced and an electronic device with low power consumption can be obtained.
Further, according to this embodiment, the first member of the support member and the third terminal provided in the vibration device are fixed by the first bonding member having conductivity in the overlapping region, so that the support member and the vibration device are Can be electrically connected and the first bonding member having high thermal conductivity can be stored in the region overlapping the third terminal, so that the heat from the heating element for heating the vibration device is supported by the vibration device. There is an effect that transmission to the member can be minimized.
An electronic device according to another aspect of the invention is characterized in that the first joining member has conductivity and the second joining member has non-conductivity.
According to this embodiment, the first terminal of the support member and the third terminal provided on the vibration device are fixed by an intermetallic bond (eutectic bond) such as solder or metal bump which is a conductive first joining member. Therefore, unlike the conductive adhesive containing the silver filler, the support member and the vibration device can be reliably electrically connected, and the first terminal fixed to the first bonding member and the first terminal Since the three terminals are further fixed by the non-conductive second bonding member, there is an effect that the mechanical bonding strength between the support member and the vibration device can be increased.
The manufacturing method of the electronic device which concerns on a certain form of this invention has the support member which has a support part which has connected between the 1st terminal, the 2nd terminal, and the said 1st terminal and the said 2nd terminal. A vibrating device having a third terminal on the outer surface, a heating element for heating the vibrating device, a first bonding member fixing the first terminal and the third terminal, and the first bonding In the method of manufacturing an electronic device, the first member fixed by a member and a second bonding member that fixes the third terminal are provided. A step of fixing the support member and the vibration device with the second bonding member after fixing the device with the first bonding member, wherein the first terminal is in plan view, and the second region is Including the configuration provided outside the vibrating device The second joint member is an adhesive, and the second joint member is applied to the second joint member from the second region provided outside the vibration device, and the first terminal is applied. And a step of heating and curing the second bonding member after the second bonding member is interposed between the vibration device and the vibration device.
According to this embodiment, the first terminal of the support member and the third terminal provided on the vibration device are connected to the first terminal.
After fixing with the joining member, by fixing the support member and the vibration device with the second joining member,
The electrical connection between the support member and the vibration device can be ensured by the conductive first bonding member, and the vibration device and the support member are fixed by the second non-conductive bonding member. Thus, there is an effect that it is possible to manufacture an electronic device that can further increase the bonding strength.
According to this embodiment, after the support member and the vibration device are electrically connected by the first bonding member having conductivity, the second bonding member having non-conductivity as an adhesive is placed outside the vibration device. By applying from the second region of the first terminal provided in the, by the capillary action of the adhesive,
Since the second bonding member that is an adhesive spreads around the first bonding member, the second connection member that is the adhesive is cured by subsequent heating, so that the electrical connection between the support member and the vibration device is achieved. There is an effect that an electronic device in which the bonding strength between the support member and the vibration device can be further increased while being held can be manufactured.
Application Example 1 An electronic device according to this application example includes a first terminal, a second terminal, and a support member having a support portion that connects the first terminal and the second terminal. A vibrating device having a third terminal on the outer surface, a heating element that heats the vibrating device, a first joining member that fixes the first terminal and the third terminal, and the first And a second bonding member that fixes the first terminal and the third terminal fixed by a bonding member.

  According to this application example, since the first terminal of the support member and the third terminal provided in the vibration device are fixed by the first bonding member and the second bonding member, the machine between the support member and the vibration device. There is an effect that the joint strength can be increased. Further, when the supporting member and the vibration device are fixed using the first bonding member having conductivity and the second bonding member having low thermal conductivity, the connection between the support member and the vibration device can be achieved, and Heat from the heating element that heats the vibration device becomes difficult to be transmitted from the vibration device to the support member, so that the power consumed by the heating element is reduced and an electronic device with low power consumption can be obtained.

  Application Example 2 In the electronic device according to the application example described above, the first bonding member has conductivity and the second bonding member has non-conductivity.

  According to this application example, the first terminal of the support member and the third terminal provided on the vibration device are in a metal-to-metal bond (eutectic bond) such as a solder or a metal bump that is a conductive first bonding member. Since it is fixed, unlike the conductive adhesive containing a silver filler, the support member and the vibration device can be reliably electrically connected, and the first terminal fixed by the first bonding member Since the third terminal is further fixed by the non-conductive second bonding member, there is an effect that the mechanical bonding strength between the support member and the vibration device can be increased.

  Application Example 3 In the electronic device according to the application example described above, the first terminal overlaps the third terminal with the third terminal and the third terminal overlaps with the third terminal in plan view. A second region extending to the outside of the region, and the first joining member is located between the region of the third terminal facing the first region and the first region. The second bonding member is fixed between the second region and the vibration device.

  According to this application example, since the first terminal of the support member and the third terminal provided in the vibration device are fixed by the first bonding member having conductivity, the support member and the vibration device Can be electrically connected and the first bonding member having high thermal conductivity can be stored in the region overlapping the third terminal, so that the heat from the heating element for heating the vibration device is supported by the vibration device. There is an effect that transmission to the member can be minimized. In addition, since the fixing area can be increased by fixing the periphery of the region overlapping the third terminal of the vibration device with the non-conductive second bonding member, the mechanical bonding strength between the support member and the vibration device can be further increased. There is an effect that it can be increased.

  Application Example 4 In the electronic device according to the application example, the first terminal includes a configuration in which the second region is provided outside the vibration device in a plan view. To do.

  According to this application example, the second region of the first terminal of the support member is provided outside the vibration device, so that the support member and the vibration device are fixed by the non-conductive second bonding member. Since the area can be further increased, there is an effect that the mechanical joint strength between the support member and the vibration device can be further increased.

  Application Example 5 In the electronic device according to the application example described above, the support member includes a portion where the width of the support portion is smaller than the width of the first terminal.

  According to this application example, by providing a portion where the width of the support portion of the support member is smaller than the width of the first terminal, the heat of the heating element that heats the vibration device is reduced from being transmitted to the outside through the support member. There is an effect that can be. Further, there is an effect that it is possible to prevent the non-conductive second joining member for fixing the vibration device from flowing out from the first terminal to the second terminal side.

  Application Example 6 In the electronic device according to the application example described above, the third terminal has a circular shape in plan view.

  According to this application example, since the shape of the third terminal provided in the vibration device is circular, the conductive first joining member for electrical connection spreads uniformly on the third terminal, and vibration is generated. There is an effect that the device and the support member can be stably fixed.

  Application Example 7 In the electronic device according to the application example, the first bonding member is a solder or a metal bump.

  According to this application example, the first bonding member is an intermetallic bond (eutectic bond) such as a solder or a metal bump, and is not a conductive adhesive containing a silver filler. Therefore, unlike the conductive adhesive, there is an effect that electrical conduction can be ensured and the possibility of oscillation stoppage due to disconnection can be avoided. In addition, by making the first bonding member a solder or metal bump, the area for electrical connection can be made smaller, so that the heat of the heating element for heating the vibration device is transmitted to the outside through the support member. There is an effect that the power consumption of the electronic device can be reduced.

  Application Example 8 In the electronic device according to the application example described above, the electronic device further includes a substrate, the vibration device is disposed in a state of being separated from the substrate in a plan view, and the second terminal is the substrate. It is characterized by being fixed to.

  According to this application example, the vibration device can be supported in a state of floating from the substrate by arranging the vibration device in a state separated from the substrate and fixing the second terminal of the support member to the substrate. Heat from the heating element that heats the device is hardly transmitted to the substrate through the support member, and there is an effect that the power consumption of the electronic device can be reduced.

  Application Example 9 An electronic apparatus according to this application example includes the electronic device described in the application example.

  According to this application example, there is an effect that an electronic apparatus having an electronic device having excellent mechanical strength, stable characteristics, and low power consumption can be obtained.

  Application Example 10 A moving object according to this application example includes the electronic device described in the application example.

  According to this application example, there is an effect that it is possible to configure a moving body including an electronic device having excellent mechanical strength, stable characteristics, and low power consumption.

  Application Example 11 An electronic device manufacturing method according to this application example includes a first terminal, a second terminal, and a support portion that connects the first terminal and the second terminal. A support member, a vibration device having a third terminal on the outer surface, a heating element for heating the vibration device, a first joining member fixing the first terminal and the third terminal, In the method for manufacturing an electronic device, the support member includes: the first terminal fixed by the first bonding member; and the second bonding member fixed to the third terminal. After the vibration device is fixed by the first bonding member, the support member and the vibration device are fixed by the second bonding member.

  According to this application example, after fixing the first terminal of the support member and the third terminal provided on the vibration device with the first bonding member, the support member and the vibration device are fixed with the second bonding member. The electrical connection between the support member and the vibration device can be ensured by the conductive first joining member, and the vibration device and the support member are fixed by the non-conductive second joining member. Thus, there is an effect that it is possible to manufacture an electronic device that can further increase the bonding strength.

  Application Example 12 In the electronic device manufacturing method according to the application example, the first terminal includes a configuration in which the second region is provided outside the vibration device in a plan view. The second joining member is an adhesive, and the second joining member is applied to the second joining member from the second region provided outside the vibrating device, and the first terminal and the vibration are applied. And a step of heating and curing the second bonding member after the second bonding member is interposed between the device and the device.

  According to this application example, after the support member and the vibration device are electrically connected by the first bonding member having conductivity, the second bonding member having non-conductivity as an adhesive is disposed outside the vibration device. By applying from the second region of the first terminal provided on the second bonding member, the second bonding member as an adhesive spreads around the first bonding member due to the capillary phenomenon of the adhesive. By curing a certain second sex bonding member, it is possible to manufacture an electronic device that can further increase the bonding strength between the support member and the vibration device while maintaining the electrical connection between the support member and the vibration device. effective.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the electronic device which concerns on the 1st Embodiment of this invention, (a) is the schematic plan view which showed the inside, (b) is the sectional view on the AA line. It is a schematic plan view inside the electronic device which concerns on the 1st Embodiment of this invention, and is the A section enlarged view of Fig.1 (a). 1 is a schematic plan view of a lead frame used in an electronic device according to a first embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS The schematic plan view and sectional drawing explaining the manufacturing process of the electronic device which concerns on the 1st Embodiment of this invention. It is a schematic block diagram of the electronic device which concerns on the 2nd Embodiment of this invention, (a) is the schematic plan view which showed the inside, (b) is DD sectional view taken on the line. It is a schematic block diagram of the electronic device which concerns on the 3rd Embodiment of this invention, (a) is the schematic plan view which showed the inside, (b) is the EE sectional view taken on the line. It is a schematic block diagram of the electronic device which concerns on the 4th Embodiment of this invention, (a) is the schematic plan view which showed the inside, (b) is the FF sectional view taken on the line. The perspective view which shows the structure of the mobile type (or notebook type) personal computer as an electronic device provided with the electronic device which concerns on this invention. The perspective view which shows the structure of a mobile telephone (including PHS) as an electronic apparatus provided with the electronic device which concerns on this invention. The perspective view which shows the structure of the digital camera as an electronic device provided with the electronic device which concerns on this invention. The perspective view which shows the structure of the motor vehicle as a moving body provided with the electronic device which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<Electronic device>
(First embodiment)
FIG. 1 is a schematic configuration diagram of an electronic device according to a first embodiment of the present invention, FIG. 1 (a) is a schematic plan view showing the inside thereof, and FIG. 1 (b) is a diagram of FIG. 1 (a). It is AA sectional view. FIG. 2 is a schematic plan view of the inside of the electronic device according to the first embodiment of the present invention, and is an enlarged view of a portion A in FIG. In FIG. 1A, for convenience of explaining the internal configuration of the electronic device 1, a state in which the upper portion of the cover 12 is removed is illustrated.

  An electronic device 1 shown in FIG. 1 includes a substrate 10 for mounting electronic components, a cover 12, a vibrator 40 that is a vibration device, a heating element 42 that heats the vibration device, and a temperature-sensitive element 46 that measures the temperature of the vibration device. The lead frame terminals 30a to 30g, which are support members for supporting the vibration device, and the IC chip 48 are configured.

The vibrator 40 has a vibration element mounted inside a package such as ceramic. Further, the inside of the package of the vibrator 40 is hermetically sealed in a reduced pressure atmosphere or an inert gas atmosphere such as nitrogen.
On one main surface of the vibrator 40, there are a plurality of third terminals 20a to 20g, an electrode terminal 21 for fixing the terminal 44 of the heating element 42, an electrode terminal 22 for fixing the heating element 42, and a plurality of wirings 24a to 24e. Is formed.

  The first terminals 31a of the plurality of lead frame terminals 30a to 30g are fixed so that the plurality of third terminals 20a to 20g provided on one main surface of the vibrator 40 correspond to each other. As shown in FIG. 1B, the third terminals 20b and 20f are electrically connected to the first terminals 31a of the lead frame terminals 30b and 30f by a first bonding member 52 having conductivity such as solder or metal bumps. It is connected. Further, the third terminals 20b and 20f and the first terminals 31a of the lead frame terminals 30b and 30f are fixed around the respective first joining members 52 by non-conductive second joining members 56. The second joining member 56 is, for example, a resin-based adhesive having low thermal conductivity such as epoxy or silicon. In the present embodiment, the shape of the third terminals 20a to 20g is a rectangle, but the shape is not limited to a rectangle, and may be a circle. Since the shape of the third terminals 20a to 20g is circular, the conductive first joining member 52 for electrical connection spreads uniformly over the third terminals 20a to 20g, and the third terminal of the vibrator 40 There is an effect that 20a to 20g and lead frame terminals 30a to 30f can be stably fixed.

  As shown in FIG. 2, the third terminals 20 a to 20 g provided on one main surface of the vibrator 40 and the first terminals 31 a of the lead frame terminals 30 a to 30 g include a third terminal 20 c and a first terminal 31 a. Are fixed by the first conductive joining member 52 and electrically connected to each other in the first region 26 where the two overlap. Further, the second region 28 where one main surface of the vibrator 40 around the third terminal 20c and the first terminal 31a overlap is mechanically fixed by the non-conductive second bonding member 56. Note that the second region 28 may be a region extended to a region that does not overlap with one main surface of the vibrator 40 of the first terminal 31a. By applying and fixing the second bonding member 56 to a region that does not overlap one main surface of the vibrator 40 of the first terminal 31a, the second bonding member 56 wraps around and is fixed to the side surface portion of the vibrator 40. There is an effect that joint strength with lead frame terminals 30a-30g can be raised more.

  In the electronic device 1 of the present embodiment, the first terminals of the third terminals 20a to 20g and the lead frame terminals 30a to 30g of the vibrator 40 are formed by the conductive first bonding member 52 and the non-conductive second bonding member 56. Since the terminals 31a are fixed to each other, there is an effect that electrical connection can be achieved and fixation with high mechanical bonding strength can be achieved. Moreover, since the circumference | surroundings of the 1st joining member 52 of the 1st terminal 31a and the 3rd terminals 20a-20g are adhere | attached with the resin-type 2nd joining member 56, the 1st terminal 31a and the 3rd terminals 20a-20g When the first joining member 52 such as solder is used for fixing, the first joining member 52 such as solder is melted by heating by a reflow apparatus for mounting the electronic device 1 on a mounting substrate such as an electronic device. There is an effect that it is possible to prevent the occurrence of a short circuit due to flow out and contact with other terminals.

  In the vibrator 40, for example, a heating element 42 such as a power transistor or a heater is formed on an electrode terminal 22 provided on one main surface of the vibrator 40 by a bonding member 54 having high thermal conductivity such as solder. It is fixed. By fixing using the bonding member 54 having high thermal conductivity, the heat from the heating element 42 is efficiently transmitted to the vibrator 40, the power consumed by the heating element 42 is reduced, and the low power consumption electronic device 1. Is effective. The electrode terminal 22 is electrically connected to the ground terminal (not shown) of the electronic device 1 through the lead frame terminal 30d by the wiring 24c, thereby preventing the occurrence of electrical noise.

  Further, in the vibrator 40, the terminal 44 of the heating element 42 is bonded to the two electrode terminals 21 provided on one main surface of the vibrator 40, each having a conductive property such as solder or a metal bump. The members 50 are electrically connected. The two electrode terminals 21 are electrically connected to the IC chip 48 having a temperature control circuit via the lead frame terminals 30c and 30g by wirings 24d and 24e.

  Further, the vibrator 40 includes a temperature sensing element 46 such as a thermistor or a temperature sensor crystal vibrator on the wirings 24 a and 24 b provided on one main surface of the vibrator 40. Similarly to the terminal 44, the connection member 50 having electrical conductivity such as solder or metal bump is electrically connected. The temperature sensing element 46 is electrically connected to the IC chip 48 having a temperature control circuit via the lead frame terminals 30a and 30b by wirings 24a and 24b.

  The lead frame terminals 30a to 30g as support members have a first terminal 31a and a second terminal 31b at both ends thereof, and the width of the second terminal 31b is smaller than the width of the first terminal 31a. The first terminals 31 a of the lead frame terminals 30 a to 30 g are fixed to the third terminals 20 a to 20 g of the vibrator 40, respectively. The second terminals 31 b are conductive on the plurality of electrodes 32 provided on the substrate 10. Are fixed and electrically connected with each other.

  Further, as shown in FIG. 1B, the lead frame terminals 30a to 30g are bent toward the substrate 10 in the vicinity of the end of the first terminal 31a on the second terminal 31b side, and further, the second frame 31b is connected to the second terminal 31b. In the vicinity of the end on the one terminal 31a side, it is bent substantially in parallel with the substrate 10. Therefore, by fixing the second terminal 31 b to the plurality of electrodes 32 provided on the substrate 10, the vibrator 40 to which the heating element 42 and the temperature sensitive element 46 are fixed is supported in a floating state from the substrate 10. Therefore, the heat from the heating element 42 that heats the vibrator 40 is hardly transmitted to the substrate 10 through the lead frame terminals 30a to 30g that are support members, and the power consumption of the electronic device 1 can be reduced. effective.

  An IC chip 48 having an oscillation circuit for driving the vibrator 40 and a temperature control circuit for controlling the heating element 42 based on temperature information from the temperature sensing element 46 is mounted on the mounting terminal 36 provided on the substrate 10. It is fixed by the joining member 60. In addition, since the vibrator 40 is supported in a state of floating from the substrate 10, the IC chip 48 can be mounted in the space between the vibrator 40 and the substrate 10, so that the area of the substrate 10 can be reduced, The electronic device 1 can be downsized.

  On one main surface of the substrate 10, a plurality of electrodes 32 for fixing the lead frame terminals 30 a to 30 g and a plurality of mounting terminals 36 for fixing the IC chip 48 are provided. Are electrically connected by electrode wiring (not shown). The other surface of the substrate 10 is provided with a plurality of external terminals 34 for mounting on a mounting board such as an electronic device. The mounting terminals 36 for fixing the external terminals 34 and the IC chip 48 are electrodes. They are electrically connected by wiring (not shown) and through electrodes (not shown).

  The substrate 10 is made of a material such as an insulating ceramic or glass epoxy. In addition, each electrode, terminal provided on the substrate 10 or electrode wiring or through electrode for electrically connecting them is generally made of a metal wiring material such as tungsten (W) or molybdenum (Mo) on the substrate. It is formed by screen printing and baking, and a method of plating nickel (Ni), gold (Au) or the like thereon or a method of etching from a substrate having a copper foil applied to the entire surface.

  The cover 12 may be a ceramic material that is the same material as the substrate 10 other than a metal material such as Kovar. However, in the case of a metal material, it has a shielding effect and is advantageous in preventing electrical influence from the outside. The cover 12 is fixed by surrounding the end portion of the substrate 10 with solder, adhesive, or the like, and covers an electronic component including the vibrator 40 mounted on the substrate 10.

  The example of the structure of the electronic device according to the embodiment of the present invention has been described above. In FIG. 1B, the vibrator 40 to which the heating element 42 is fixed is turned upside down, and the lead frame terminals 30b and 30f The structure may be such that the third terminals 20b and 20f of the vibrator 40 are fixed to the surface of the one terminal 31a away from the substrate 10. With this structure, the heating element 42 and the IC chip 48 are close to each other, and the IC chip 48 has a temperature environment substantially equal to that of the vibrator 40. Therefore, there is an effect that frequency characteristics and the like can be further stabilized. .

  Further, in the structure in which the vibrator 40 is turned upside down and fixed, the second terminals 31b of the lead frame terminals 30b and 30f to which the vibrator 40 is fixed and the IC chip 48 are fixed to one main surface of the second substrate. However, a lead frame terminal provided on the other main surface of the second substrate may be fixed to the substrate 10. Since the heating element 42 and the IC chip 48 are close to each other by adopting a three-stage structure including the vibrator 40, the second substrate, and the substrate 10, the IC chip 48 has a temperature environment substantially equal to that of the vibrator 40, and Since the second substrate can be lifted from the substrate 10 by the lead frame terminal, the heat transmitted from the heating element 42 to the IC chip 48 becomes difficult to be transmitted to the substrate 10, and the frequency characteristics and the like are more stable and consumed. There is an effect that an electronic device with reduced power can be obtained.

<Manufacturing method>
An electronic device manufacturing method according to an embodiment of the present invention will be described.
FIG. 3 is a schematic plan view of a lead frame used in the electronic device according to the first embodiment of the present invention. 4 (1) to 4 (5) are schematic plan views for explaining the manufacturing process of the electronic device according to the first embodiment of the present invention, and FIGS. 4 (4) and 4 (b) are FIGS. ) (A) BB sectional drawing, FIG.4 (5) (b) is CC sectional view taken on the line of FIG.4 (5) (a).

  As shown in FIG. 3, the lead frame 70 used for manufacturing is provided with a plurality of lead frame terminals 30 connected to a frame portion 72 so that a large number of electronic devices 1 can be manufactured collectively. The frame portion 72 of the lead frame 70 is provided with a hole portion 74 necessary for automatically moving the inside of the reflow device for melting and curing the joining members 50 to 60. In addition, the lead frame is made by punching (pressing) or etching thin metal plates with excellent mechanical strength, electrical conductivity, thermal conductivity, and corrosion resistance, such as Cu alloy materials, iron alloy materials, etc. It is made.

  In the manufacturing method of the electronic device 1 according to the first embodiment of the present invention, as shown in FIGS. 4 (1) to (5), first, one main surface on which the third terminal 20 of the vibrator 40 is provided. The heat generating element 42 and the temperature sensing element 46 are fixed to each other with a conductive bonding member 50, and then a conductive first bonding member 52 is formed on the third terminal 20 (FIG. 4A).

  Next, a conductive first joining member 52 formed on the third terminal 20 of the vibrator 40, and a first terminal 31 a of the lead frame terminal 30 provided to be connected to the frame portion 72 of the lead frame 70. Are aligned so as to correspond to each other, and then melted and cured by a reflow apparatus or the like (FIG. 4 (2)).

  Thereafter, a non-conductive second bonding member 56 made of an adhesive such as epoxy resin or silicon resin is applied to the second region 28 of the first terminal 31a shown in FIG. Since the second bonding member 56 spreads around the already-cured first bonding member 52 due to the capillary phenomenon of the adhesive, the second bonding member 56 is cured by subsequent heating, so that the first terminal 31a and the third terminal 20 are cured. While maintaining the electrical connection, the bonding strength between the first terminal 31a and the third terminal 20 can be further increased (FIG. 4 (3)).

  Next, the frame portion 72 of the lead frame 70 and the lead frame terminal 30 are cut, the heating element 42 and the temperature sensing element 46 are fixed to the vibrator 40, and the vibrator having a plurality of lead frames 70 fixed thereto. 40 are individually separated (FIG. 4 (4)). Thereafter, as shown in FIGS. 4 (5) and 4 (b), the lead frame terminal 30 is once bent toward the vibrator 40 in the vicinity of the end of the first terminal 31a opposite to the side fixed to the third terminal 20. Further, the lead frame terminal 30 is bent so as to be substantially parallel to the main surface of the vibrator 40 in the vicinity of the end of the lead frame terminal 30 opposite to the first terminal 31a (FIG. 4 (5)).

  Thereafter, as shown in FIG. 1, the plurality of second terminals 31b of the lead frame terminals 30a to 30g are respectively aligned and fixed to the plurality of electrodes 32 provided on the substrate 10 on which the IC chip 48 is mounted. Later, the electronic device 1 is completed by fixing the cover 12. Since the lead frame terminals 30a to 30g bent twice are used, the vibrator 40 to which the heat generating element 42 and the temperature sensitive element 46 are fixed can be supported in a floating state from the substrate 10. The heat from the heating element 42 that heats the vibrator 40 becomes difficult to be transmitted to the substrate 10 through the lead frame terminals 30a to 30g, and the power consumption of the electronic device 1 can be reduced.

(Second Embodiment)
Next, an electronic device according to a second embodiment of the present invention will be described.
FIG. 5 is a schematic configuration diagram of an electronic device according to a second embodiment of the present invention, FIG. 5 (a) is a schematic plan view showing the inside thereof, and FIG. 5 (b) is a diagram of FIG. 5 (a). It is DD sectional view taken on the line. In FIG. 5A, for convenience of explaining the internal configuration of the electronic device 1a, a state in which the upper portion of the cover 12a is removed is illustrated.
Hereinafter, the second embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.

  As shown in FIG. 5, the electronic device 1 a according to the second embodiment has a first terminal of the lead frame terminal 130 a that is fixed to the terminal 44 a of the heating element 42 a as compared with the electronic device 1 according to the first embodiment. The length of 131a is longer toward the vibrator 40a. The difference is that the terminal 44a of the heating element 42a is fixed on the first terminal 131a by the conductive bonding member 50a and is electrically connected. ing.

  With such a configuration, since the heating element 42a and the temperature sensing element 46a can be mounted on the vibrator 40a after the vibrator 40a is mounted on the substrate 10a, the vibrator 40a and the lead frame terminal 130a are fixed to each other. In addition, there is an effect that it is possible to avoid the possibility that the heating element 42a and the temperature sensitive element 46a are broken or dropped by heating when the lead frame terminal 130a and the substrate 10a are fixed.

(Third embodiment)
Next, an electronic device according to a third embodiment of the present invention will be described.
6A and 6B are schematic configuration diagrams of an electronic device according to the third embodiment of the present invention. FIG. 6A is a schematic plan view showing the inside thereof, and FIG. 6B is a schematic diagram of FIG. It is EE sectional view taken on the line. In FIG. 6A, for convenience of explaining the internal configuration of the electronic device 1b, a state in which the upper portion of the cover 12b is removed is illustrated.
Hereinafter, the third embodiment will be described with a focus on differences from the first embodiment described above, and descriptions of similar matters will be omitted.

  As shown in FIG. 6, in the electronic device 1b according to the third embodiment, the length of the heating element 42b is longer in the direction of the terminal 44b than the electronic device 1 according to the first embodiment. The length of the first terminal 131b of the lead frame terminal 130b fixed to the terminal 44b of the body 42b is longer toward the terminal 44b. Further, the difference is that the terminal 44b of the heating element 42b is fixed on the first terminal 131b by the conductive bonding member 50b and electrically connected thereto.

  With such a configuration, since the heat generating element 42b having a large shape can be used, the temperature control of the vibrator 40b is facilitated, the vibrator 40b can be held at a more constant temperature, and the frequency stability is excellent. The electronic device 1b can be obtained.

(Fourth embodiment)
Next, an electronic device according to a fourth embodiment of the present invention will be described.
FIG. 7: is a schematic block diagram of the electronic device which concerns on the 4th Embodiment of this invention, FIG.7 (a) is the schematic plan view which showed the inside, FIG.7 (b) is FIG.7 (a). It is FF sectional view taken on the line. In FIG. 7A, for convenience of describing the internal configuration of the electronic device 1c, a state in which the upper portion of the cover 12c is removed is illustrated.
Hereinafter, the fourth embodiment will be described with a focus on differences from the first embodiment described above, and descriptions of similar matters will be omitted.

  As shown in FIG. 7, in the electronic device 1c according to the second embodiment, the length of the heating element 42c becomes longer in the direction of the terminal 44c than the electronic device 1 according to the first embodiment. The difference is that the terminal 44c of the body 42c is fixed and electrically connected by the electrode 32c provided on the substrate 10c and the conductive bonding member 50c.

  With such a configuration, since the heat generating element 42c having a large shape can be used, the temperature control of the vibrator 40c is facilitated, the vibrator 40c can be held at a more constant temperature, and the frequency stability is excellent. The electronic device 1c can be obtained.

<Electronic equipment>
Next, an electronic apparatus to which the electronic device 1 according to the present invention is applied will be described in detail with reference to FIGS.
FIG. 8 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including the electronic device according to the invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 100. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates the electronic device 1.

  FIG. 9 is a perspective view illustrating a configuration of a mobile phone (including PHS) as an electronic apparatus including the electronic device according to the invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and the display unit 100 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates the electronic device 1.

FIG. 10 is a perspective view illustrating a configuration of a digital camera as an electronic apparatus including the electronic device according to the invention. In this figure, the connection with an external device is also shown in a simplified manner. Here, an ordinary camera sensitizes a silver salt photographic film with a light image of a subject, whereas a digital camera 1300 captures a light image of a subject by photoelectrically converting it with an image sensor such as a CCD (Charge Coupled Device). A signal (image signal) is generated.
A display unit 100 is provided on the back surface of a case (body) 1302 in the digital camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 100 displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 100 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer (PC) 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital camera 1300 incorporates the electronic device 1.

  In addition to the personal computer 1100 in FIG. 8, the mobile phone 1200 in FIG. 9, and the digital camera 1300 in FIG. 10, the electronic apparatus including the electronic device 1 according to the present invention includes, for example, an ink jet discharge device (for example, an ink jet printer). ), Laptop personal computers, TVs, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, TV monitor for crime prevention, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments ( For example, vehicle, aircraft, ship instrumentation , It can be applied to a flight simulator.

<Moving object>
FIG. 11 is a perspective view schematically showing a mobile automobile 1500 including an electronic device according to an embodiment of the present invention. The automobile 1500 is equipped with the electronic device 1 according to the present invention. For example, as shown in FIG. 11, an automobile 1500 as a moving body has an electronic control unit 1510 that incorporates the electronic device 1 and controls tires and the like mounted on the vehicle body.
In addition, the electronic device 1 includes a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an antilock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), The present invention can be widely applied to an electronic control unit (ECU) 1510 such as an engine control, a battery monitor of a hybrid vehicle or an electric vehicle, and a vehicle body posture control system.

  As mentioned above, although embodiment of the electronic device of this invention, an electronic device, and a moving body was described based on drawing, this invention is not limited to the said embodiment, The structure of each part has the same function. It can be replaced with one having any structure. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment suitably.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 10 ... Board | substrate, 12 ... Cover, 20, 20a-20g ... 3rd terminal, 21 ... Electrode terminal, 22 ... Electrode terminal, 24a-24e ... Wiring, 26 ... 1st area | region, 28 ... 2nd area | region , 30, 30a to 30g ... lead frame terminal, 31a ... first terminal, 31b ... second terminal, 32 ... electrode, 34 ... external terminal, 36 ... mounting terminal, 40 ... vibrator, 42 ... heating element, 44 ... terminal , 46 ... temperature sensing element, 48 ... IC chip, 50 ... joining member, 52 ... first joining member, 54 ... joining member, 56 ... second joining member, 58 ... joining member, 60 ... joining member, 70 ... lead frame , 72 ... Frame part, 74 ... Hole part, 100 ... Display part, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Main body part, 1106 ... Display unit, 1200 ... Mobile phone, 1202 ... Operation buttons 1204 ... Earpiece, 1206 ... Mouthpiece, 1300 ... Digital camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1312 ... Video signal output terminal, 1314 ... Input / output terminal, 1430 ... TV Monitor, 1440 ... personal computer, 1500 ... automobile, 1510 ... electronic control unit.

Claims (10)

A support member having a first terminal, a second terminal, and a support part connecting between the first terminal and the second terminal;
A vibrating device having a third terminal;
A heating element for heating the vibrating device;
A first joining member fixing the first terminal and the third terminal;
A second bonding member that fixes the first terminal and the third terminal fixed by the first bonding member; and
The first terminal includes a first region overlapping the third terminal and a second region extending from the first region to the outside of the region overlapping the third terminal in plan view. And
The first bonding member is fixed between the first region and a region of the third terminal facing the first region,
The second joining member is fixed between the second region and the vibration device ,
The electronic device , wherein the first terminal has a part of the second region provided outside the vibrating device in a plan view . A support member having a first terminal, a second terminal, and a support part connecting between the first terminal and the second terminal;
A vibrating device having a third terminal;
A heating element for heating the vibrating device,
The first terminal and the third terminal are fixed by a first joining member in a first region where the first terminal and the third terminal overlap in plan view,
The main surface of the vibration device around the first terminal and the third terminal is in a second region where the first terminal and the main surface of the vibration device around the third terminal overlap in plan view. , it is secured by a second joint member,
The electronic device, wherein the first terminal has a part of the second region provided outside the vibrating device in a plan view. The first joining member has conductivity;
The electronic device according to claim 1, wherein the second bonding member has non-conductivity. Wherein the support member, the electronic device according to any one of claims 1 to 3 wherein the width of the support portion contains a smaller portion than the width of the first terminal, it is characterized. In plan view, an electronic device according to any one of claims 1 to 4 the shape of the third terminal is characterized in that it is a circular shape. Electronic device according to any one of claims 1 to 5, wherein the first joining member is a solder or metal bumps. Furthermore, a substrate is provided,
In plan view, the vibrating device is arranged in a state of being separated from the substrate,
Electronic device according to any one of claims 1 to 6, wherein the second terminal is secured to the substrate. An electronic apparatus characterized by comprising an electronic device according to any one of claims 1 to 7. Mobile, characterized in that it comprises an electronic device according to any one of claims 1 to 7. A support member having a first terminal, a second terminal, and a support part connecting between the first terminal and the second terminal;
A vibrating device having a third terminal;
A heating element for heating the vibrating device;
A first joining member fixing the first terminal and the third terminal;
In the method of manufacturing an electronic device, comprising: the second terminal member that fixes the first terminal and the third terminal fixed by the first joint member,
After fixing the vibration device to the support member by the first joining member,
Fixing the support member and the vibration device with the second joining member,
The first terminal is
In a plan view, the second region includes a configuration provided outside the vibrating device,
The second joining member is an adhesive;
Applying the second bonding member from the second region provided outside the vibrating device, the second bonding member,
After interposing the second joining member between the first terminal and the vibrating device,
The manufacturing method of the electronic device characterized by including the process of heating and hardening the said 2nd joining member.

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