JP2018164318A - Oscillator, electronic apparatus, and moving body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an oscillator having high frequency stability, an electronic apparatus in which the oscillator is mounted, and a moving body.SOLUTION: An oscillator 1 includes an integrated circuit 10 including a circuit for oscillation, a vibration piece 12, a circuit element 16, a heat-generating body 14, and a container 40. The integrated circuit 10, the vibration piece 12, and the heat-generating body 14 are disposed inside the container 40, and the circuit element 16 is disposed outside the container 40.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an oscillator, an electronic device, and a moving object.

  Conventionally, along with the downsizing and thinning of electronic equipment, oscillators having a vibrating device such as a crystal resonator have been required to be further downsized and thinned, and power consumption has also been reduced to save energy. It is requested. In particular, in order to avoid the influence of the ambient temperature and to have high frequency stability, the OCXO (quartz crystal oscillator with a thermostat) that heats the heating element and keeps the ambient temperature of the crystal unit constant is There is a problem in that heat is not transmitted uniformly over the entire substrate, and it becomes difficult to control the temperature of the oscillation components arranged around the crystal resonator, and high frequency stability cannot be obtained. In order to solve such a problem, in Patent Document 1, a crystal resonator element is disposed on an integrated circuit in which a heating element and an oscillation circuit are disposed on one semiconductor substrate, and disposed in a package together with other circuit elements. OCXO is disclosed.

JP 2010-213280 A

However, when the circuit element is built in the package in order to adjust the resonator element or the oscillation circuit or the like as in the above-described OCXO, for example, when a circuit element using a resin is used as the constituent member, the constituent member There is a possibility that the frequency characteristics of the resonator element may be fluctuated by the gas generated from the resin or the gas generated from the solder or conductive adhesive that is the connection member between the circuit element and the package.
In addition, since the heating element and the oscillation circuit are arranged on one semiconductor substrate, in order to heat the crystal resonator element to a required temperature, the temperature of the heating element exceeds the temperature at which the crystal resonator element is heated. However, since the heat from the heating element is easily transmitted to the oscillation circuit arranged on the same semiconductor substrate, the oscillation circuit is overheated and the performance of the oscillation circuit is deteriorated. There is a fear.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An oscillator according to this application example is an oscillator including an integrated circuit including an oscillation circuit, a resonator element, a circuit element, a heating element, and a container, and the integrated circuit and the vibration are disposed inside the container. A piece and the heating element are arranged, and the circuit element is arranged outside the container.

  According to this application example, the circuit element for adjusting the resonator element or the oscillation circuit is disposed outside the container in which the integrated circuit, the resonator element, and the heater element are disposed. Gas is no longer generated from the resin member that constitutes the circuit element, solder or conductive adhesive that is a connection member between the circuit element and the container, and even if gas is generated, the resonator element is stored in the container. Therefore, there is an effect that it is possible to obtain an oscillator having high frequency stability while maintaining the stable frequency characteristics of the resonator element without being affected by gas. In addition, since the integrated circuit including the oscillation circuit and the heating element are separated, the integrated circuit is not overheated when the resonator element is heated. Therefore, the resonator element can oscillate stably, and an oscillator having high frequency stability can be obtained.

  Application Example 2 In the oscillator according to the application example described above, the circuit element includes a crystal resonator.

  According to this application example, when a crystal resonator is used as a circuit element, the feedback circuit of the oscillation circuit has frequency selectivity, the negative resistance characteristic is narrowed, and the negative resistance of unnecessary spurious is reduced. Alternatively, since it can be a positive resistance, unnecessary spurious oscillation can be suppressed. Therefore, it is possible to suppress an unnecessary frequency and to oscillate only with main vibration, and to obtain an oscillator having high frequency stability.

  Application Example 3 In the oscillator according to the application example described above, the circuit element includes an inductance element.

  According to this application example, when an inductance element is used as a circuit element, an LC resonance circuit can be configured in combination with a capacitive element. By matching the frequency of this LC resonance circuit with the frequency of the main vibration, the feedback circuit of the oscillation circuit has frequency selectivity, the negative resistance characteristic is narrowed, and the negative resistance of unnecessary spurious is reduced. Alternatively, since it can be a positive resistance, unnecessary spurious oscillation can be suppressed. Therefore, it is possible to control an unnecessary frequency and oscillate only by the main vibration, thereby obtaining an oscillator having high frequency stability.

  Application Example 4 In the oscillator according to the application example described above, the resonator element is an SC cut crystal resonator element, and the circuit element controls an unnecessary frequency in a signal output from the oscillation circuit. It is characterized by that.

  According to this application example, an oscillator excellent in frequency stability can be configured by using an SC cut quartz crystal resonator element as the resonator element. Further, the secondary vibration mode called B mode, which is a factor that inhibits stable main vibration called C mode generated when the SC cut quartz crystal vibrating piece is oscillated, is controlled by a circuit element such as a crystal oscillator or an inductance element. Thus, there is an effect that an oscillator having high frequency stability can be obtained.

  Application Example 5 In the oscillator according to the application example described above, the circuit element is arranged in the container.

  According to this application example, since the heat of the heating element can be conducted to the circuit element by arranging the circuit element on the outer surface of the container in which the heating element is arranged, the characteristics of the circuit element are kept constant. The effect of external temperature changes can be reduced, and an oscillator having high frequency stability can be obtained.

  Application Example 6 In the oscillator according to the application example described above, the circuit element overlaps the heating element in a plan view.

  According to this application example, by arranging the circuit element on the outer surface of the container in which the heating element is arranged, in a region overlapping the heating element in a plan view, the distance from the heating element to the circuit element can be shortened, The heat of the heating element can be more conducted to the circuit element. Therefore, there is an effect that it is possible to further reduce the influence of an external temperature change and to obtain an oscillator having high frequency stability.

  Application Example 7 In the oscillator according to the application example described above, the integrated circuit and the heating element are separated from each other, and the resonator element is disposed on the heating element.

  According to this application example, since the integrated circuit and the heating element are spaced apart and disposed inside the container, the heat of the heating element that heats the resonator element is not directly transmitted to the integrated circuit. Therefore, characteristic deterioration of the oscillation circuit included in the integrated circuit due to excessive heating can be reduced. Further, since the vibration piece is disposed on the heating element, the heat of the heating element can be transmitted to the vibration piece without loss, and temperature control of the vibration piece can be further stabilized with low consumption.

  Application Example 8 An electronic apparatus according to this application example includes the oscillator described in the application example.

  According to this application example, there is an effect that an electronic device including an oscillator having high frequency stability can be obtained.

  Application Example 9 A moving object according to this application example includes the oscillator described in the application example.

  According to this application example, there is an effect that a moving body including an oscillator having high frequency stability can be configured.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the oscillator which concerns on 1st Embodiment of this invention, (a) is a top view, (b) is AA sectional view taken on the line. It is a schematic block diagram of the container which comprises the oscillator which concerns on 1st Embodiment of this invention, (a) is a top view, (b) is a BB sectional drawing. The circuit diagram which shows the structure of the oscillator based on this invention. The schematic plan view which shows the modification of the oscillator which concerns on this invention. It is a schematic block diagram of the oscillator which concerns on 2nd Embodiment of this invention, (a) is a top view, (b) is CC sectional view taken on the line. It is a schematic block diagram of the oscillator which concerns on 3rd Embodiment of this invention, (a) is a top view, (b) is DD sectional view taken on the line. It is a schematic block diagram of the oscillator which concerns on 4th Embodiment of this invention, (a) is a top view, (b) is the EE sectional view taken on the line. It is a schematic block diagram of the oscillator which concerns on 5th Embodiment of this invention, (a) is a top view, (b) is FF sectional view taken on the line. BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows the electronic device provided with the oscillator which concerns on this invention, (a) is a perspective view which shows the structure of a mobile type (or notebook type) personal computer, (b) is the structure of a mobile telephone (PHS is also included). FIG. The perspective view which shows the structure of the digital camera as an electronic device provided with the oscillator which concerns on this invention. The perspective view which shows the structure of the motor vehicle as a moving body provided with the oscillator which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[Oscillator]
<First Embodiment>
As an example of the oscillator 1 according to the first embodiment of the present invention, an OCXO (quartz crystal oscillator with a thermostatic bath) having an SC-cut quartz crystal resonator element having excellent frequency stability will be described with reference to FIGS. 1 and 2. .
1A and 1B are schematic views showing the structure of an oscillator 1 according to the first embodiment of the present invention. FIG. 1A is a plan view, and FIG. 1B is an AA line shown in FIG. FIG. FIG. 2 is a schematic configuration diagram of the container 40 constituting the oscillator 1 according to the first embodiment of the present invention. FIG. 2 (a) is a plan view, and FIG. 2 (b) is a diagram B shown in FIG. 2 (a). It is sectional drawing of a -B line. In FIGS. 1A and 2A, the state in which the cover 64 and the lid member 44 are removed is illustrated for convenience of describing the internal configuration of the oscillator 1 and the container 40. In addition, for convenience of explanation, including the figures described later, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other. Further, for convenience of explanation, in the plan view when viewed from the Y-axis direction, the surface in the + Y-axis direction is described as the upper surface and the surface in the −Y-axis direction is described as the lower surface. The wiring patterns and electrode pads formed on the upper surface of the base substrate 62, the connection terminals formed on the outer surface of the container 40, and the wiring patterns and electrode pads formed inside the container 40 are not shown.

  As shown in FIGS. 1A and 1B, the oscillator 1 includes an integrated circuit 10 including an oscillation circuit, a heating element 14, and a container 40 in which a resonator element 12 that is an SC-cut crystal resonator element is housed, And the circuit element 16 disposed on the upper surface of the base substrate 62 outside the container 40. On the upper surface of the base substrate 62 of the oscillator 1, the container 40 is disposed separately from the base substrate 62 via a lead frame 66, and a plurality of circuit components 20, 22, 24 such as capacitors and resistors are disposed. Yes. Further, the container 40 and the circuit element 16 are covered with a cover 64 and stored in the container 60. Note that the inside of the container 60 is hermetically sealed in a reduced-pressure atmosphere such as a vacuum or an inert gas atmosphere such as nitrogen, argon, or helium.

  A circuit element 16 and circuit components 20, 22, and 24 for adjusting the oscillation circuit 12 included in the resonator element 12 or the integrated circuit 10 are disposed outside the container 40 in which the heating element 14 is accommodated. Therefore, the heat of the heating element 14 generates gas from the resin member constituting the circuit element 16, solder, conductive adhesive, or the like which is a connection member between the circuit element 16 or the circuit components 20, 22, 24 and the container 40. In addition, even if gas is generated, since the resonator element 12 is accommodated in the container 40, the stable frequency characteristic of the resonator element 12 is maintained without being affected by the gas, and high frequency stability is achieved. Can be obtained.

Inside the container 40, as shown in FIGS. 2A and 2B, there are a heating element 14 such as an integrated circuit 10, a power transistor, a resistance heating element, and the vibrating element 12 disposed on the upper surface of the heating element 14. It is stored. The inside of the container 40 is hermetically sealed in a reduced-pressure atmosphere such as a vacuum or an inert gas atmosphere such as nitrogen, argon, or helium.
The container 40 includes a package main body 42 and a lid member 44. As shown in FIG. 2B, the package body 42 is formed by stacking a first substrate 46, a second substrate 48, a third substrate 50, a fourth substrate 52, and a fifth substrate 54. ing. The second substrate 48, the third substrate 50, the fourth substrate 52, and the fifth substrate 54 are annular bodies from which the central portion is removed, and a seal ring or a low melting point is formed on the periphery of the upper surface of the fifth substrate 54. A sealing member 56 such as glass is formed.

  The second substrate 48 and the third substrate 50 form a recess (cavity) for housing the integrated circuit 10, and the fourth substrate 52 and the fifth substrate 54 form the heating element 14 and the vibrating piece 12. A recess (cavity) is formed to accommodate the.

The integrated circuit 10 is bonded to a predetermined position on the upper surface of the first substrate 46 by a bonding member 36, and the integrated circuit 10 is an electrode pad (not shown) disposed on the upper surface of the second substrate 48 by a bonding wire 30. And are electrically connected.
The heating element 14 is bonded to a predetermined position on the upper surface of the third substrate 50 by the bonding member 34, and the electrode pad 26 formed on the upper surface (active surface 15) of the heating element 14 is bonded to the fourth substrate by the bonding wire 30. It is electrically connected to an electrode pad (not shown) disposed on the upper surface of 52.
Accordingly, since the integrated circuit 10 and the heating element 14 are spaced apart from each other inside the container 40, it is difficult for the heat of the heating element 14 that heats the vibrating reed 12 to be directly transmitted to the integrated circuit 10. Therefore, it is possible to control the deterioration of the characteristics of the oscillation circuit included in the integrated circuit 10 due to overheating.

Since the external stress sensitivity is the smallest among the crystal resonator elements, the resonator element 12 which is an SC cut crystal resonator element excellent in frequency stability is disposed on the active surface 15 of the heating element 14. In addition, the SC cut quartz crystal vibrating piece (vibrating piece 12) includes an electrode pad 26 formed on the active surface 15 and an electrode pad (not shown) formed on the lower surface of the vibrating piece 12 made of metallic bumps or conductive material. It is joined to the heating element 14 through a joining member 32 such as an adhesive. Note that excitation electrodes (not shown) formed on the upper and lower surfaces of the vibrating piece 12 and electrode pads (not shown) formed on the lower surface of the vibrating piece 12 are electrically connected to each other. Note that the vibration piece 12 and the heating element 14 are only required to be connected so that the heat generated by the heating element 14 is transmitted to the vibration piece 12. For example, the vibration piece 12 and the heating element 14 are nonconductive. The resonator element 12 and the heating element 14 or the package body 42 may be electrically connected using a conductive member such as a bonding wire.
Therefore, since the vibration piece 12 is disposed on the heating element 14, the heat of the heating element 14 can be transmitted to the vibration piece 12 without loss, and the temperature control of the vibration piece 12 is further stabilized with low consumption. be able to.

  As a constituent material of the cover 64 and the lead frame 66 of the container 60, an iron-based alloy having a low thermal conductivity such as 42 alloy (iron-nickel alloy) is preferably subjected to nickel plating.

  The base substrate 62 of the container 60 is made of a material such as an insulating glass epoxy resin or ceramics. Further, the wiring provided on the base substrate 62 is a method of etching from a substrate having a copper foil applied to the entire surface, or a metal wiring material such as tungsten (W) or molybdenum (Mo) is screen printed on the substrate and fired. On top of that, nickel (Ni), gold (Au), or the like is plated.

  Furthermore, in the above-described embodiment, the description has been given using the rectangular SC-cut quartz crystal vibrating piece as the vibrating piece 12. However, the present invention is not limited to this, and a circular SC-cut quartz crystal vibrating piece or a rectangular or circular AT-cut quartz crystal is not limited thereto. A vibrating piece, a tuning fork type quartz vibrating piece, a surface acoustic wave resonance piece, other piezoelectric vibrators, or a MEMS (Micro Electro Mechanical Systems) resonance piece may be used. Note that when the AT-cut quartz crystal resonator element is used, the B-mode suppression circuit is not required, so that the oscillator 1 can be reduced in size.

[Oscillation circuit]
Next, the oscillation circuit of the oscillator 1 according to the present invention will be described with reference to FIG.
FIG. 3 is a circuit showing a configuration of the oscillator 1 according to the present invention.

  The SC-cut quartz crystal resonator element having excellent frequency stability has a thickness torsional vibration mode (B mode) and a thickness longitudinal vibration mode (in addition to the thickness shear vibration mode (C mode) of the main vibration). A mode) exists. Therefore, vibrations in the B mode and A mode other than the C mode cause various problems as spurious components (unnecessary vibration components) when the oscillator is configured. In particular, the frequency f2 of the B mode adjacent to the C mode, which is the main vibration, is only about 9 to 10% away from the frequency f1 of the C mode, and the resonance level of the B mode is equivalent to that of the C mode. For this reason, this causes a frequency jump in which the oscillation frequency changes from f1 to f2.

  Therefore, as shown in FIG. 3, the oscillation circuit of the oscillator 1 connects the collector of the transistor 70 to the power source Vc, and further connects one end of the resonator element 12 that is an SC-cut crystal resonator element to the base. The other end of the crystal vibrating piece (vibrating piece 12) is grounded via the variable capacitor 76. A series circuit of divided capacitors 72 and 74 is connected between the base and ground of the transistor 70, and a circuit that is a crystal unit between the middle point (dividing point) of the series circuit of the divided capacitors 72 and 74 and the emitter. The element 16 is inserted and connected. The resistors 78 and 80 are bleeder resistors, the resistor 82 is a feedback resistor (load resistor), and Vo is an output terminal of the oscillator 1. The crystal resonator (circuit element 16) uses, for example, an AT-cut crystal resonator element, and sets its series resonance frequency so as to substantially match the oscillation frequency due to the main vibration (C mode).

  By inserting a crystal resonator (circuit element 16) between the midpoint of the series circuit of the divided capacitors 72 and 74 and the emitter of the transistor 70, the feedback circuit is given frequency selectivity and the negative resistance characteristic is narrow. As a result, a sufficiently large negative resistance is obtained at the C-mode frequency f1 of the main vibration, and the negative resistance is small or presents a positive resistance at the B-mode frequency f2. As a result, oscillation is not possible at the B-mode frequency. . Therefore, it is possible to oscillate only in the C mode of the main vibration, and to obtain the oscillator 1 having high frequency stability.

  In the above-described embodiment, the crystal element is used as the circuit element 16. However, the circuit element 16 is not limited to this and may be an inductance element. When an inductance element is used as the circuit element 16, an LC resonance circuit can be configured in combination with a capacitive element. By matching the frequency of this LC resonance circuit with the frequency of the main vibration, the feedback circuit of the oscillation circuit has frequency selectivity, the negative resistance characteristic is narrowed, and the negative resistance of unnecessary spurious is reduced. Alternatively, since it can be a positive resistance, unnecessary spurious oscillation can be suppressed. Therefore, it is possible to control the unnecessary frequency and oscillate only by the main vibration, and to obtain the oscillator 1 having high frequency stability.

<Modification>
Next, a modification of the resonator element mounting of the oscillator 1 according to the first embodiment of the present invention will be described with reference to FIGS.
4A to 4C are schematic plan views showing modifications of the resonator element mounting of the oscillator 1 according to the first embodiment of the present invention. 4 (a) to 4 (c), the state in which the lid member 44 (see FIG. 2 (b)) is removed is illustrated for convenience of describing the internal configuration of the container 40.
Hereinafter, modifications of the resonator element mounting will be described focusing on differences from the first embodiment described above, and descriptions of similar matters will be omitted.

  In the modification shown in FIG. 4A, in the electrode pads 26 and 26a formed on the active surface 15a of the heating element 14a, the area of the electrode pad 26a arranged on the lower surface of the resonator element 12a is larger than the area of the electrode pad 26. large. Therefore, since the mounting area of the resonator element 12a can be increased, impact due to dropping or vibration can be reduced, and deterioration of vibration characteristics and the like can be prevented. Further, since the bonding area with the heating element 14a is large, the heat transfer is improved, and the oscillator 1 having low power consumption and high frequency stability can be obtained.

  In the modification shown in FIG. 4B, in the electrode pads 26 and 26b formed on the active surface 15b of the heating element 14b, the area of the electrode pad 26b disposed on the lower surface of the resonator element 12b is larger than the area of the electrode pad 26. Is also big. In addition, an electrode pad 28 is formed on the upper surface of the resonator element 12 b and is electrically connected to the electrode pad 26 formed on the active surface 15 b of the heating element 14 b by a bonding wire 30. Since the vibrating piece 12b can be fixed at one point, mounting distortion and thermal strain can be reduced and more stable vibration characteristics can be obtained as compared with the two-point fixing. In addition, since the electrode pad 28 is formed on the upper surface of the resonator element 12b, an electrode pattern forming step for wiring an excitation electrode (not shown) formed on the upper surface of the resonator element 12b on the lower surface of the resonator element 12b is required. Therefore, the cost of the resonator element 12b can be reduced.

  Similar to the modification shown in FIG. 4B, the modification shown in FIG. 4C has a structure in which one electrode pad 26c is formed on the active surface 15c of the heating element 14c, so that the same effect can be obtained. . Further, the electrode pad 28c is formed on the upper surface of the vibrating piece 12c, and is electrically connected to the electrode pad (not shown) formed on the upper surface of the fourth substrate 52 by the bonding wire 30. With the downsizing of the oscillator 1, it is possible to prevent a bonding failure due to a decrease in the distance between the electrode pad 28c and the electrode pad 26 formed on the active surface 15c of the heating element 14c.

Second Embodiment
Next, an oscillator 1a according to a second embodiment of the present invention will be described with reference to FIG.
FIG. 5 is a schematic configuration diagram of an oscillator 1a according to a second embodiment of the present invention. FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along the line CC in FIG. is there. In FIG. 5A, for convenience of explaining the internal configuration of the oscillator 1a, a state where the upper portion of the cover 64 is removed is shown.
Hereinafter, the second embodiment will be described with a focus on the differences from the first embodiment described above, and the description of the same matters will be omitted.

  As shown in FIGS. 5A and 5B, the oscillator 1a according to the second embodiment has the circuit element 16 disposed on the lower surface of the container 40 as compared with the oscillator 1 according to the first embodiment. Is different.

  With such a configuration, the heat of the heating element 14 can be transferred to the circuit element 16 by conduction through the package body 42, so that the temperature of the circuit element 16 is kept constant and the influence of external temperature changes is reduced. Therefore, the oscillator 1a having high frequency stability can be obtained.

<Third Embodiment>
Next, an oscillator 1b according to a third embodiment of the present invention will be described with reference to FIG.
6A and 6B are schematic configuration diagrams of an oscillator 1b according to a third embodiment of the present invention. FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along the line DD in FIG. is there. In FIG. 6A, for convenience of explaining the internal configuration of the oscillator 1b, a state in which the upper portion of the cover 64 is removed is illustrated.
Hereinafter, the third embodiment will be described with a focus on differences from the first embodiment described above, and descriptions of the same matters will be omitted.

  As shown in FIGS. 6A and 6B, the oscillator 1b according to the third embodiment generates heat in a plan view when the circuit element 16 is on the lower surface of the container 40 as compared with the oscillator 1 according to the first embodiment. The difference is that the body 14 is disposed so as to overlap the region where the body 14 is disposed.

  With such a configuration, the distance from the heating element 14 to the circuit element 16 in the package body 42 can be shortened, and the heat of the heating element 14 is more efficiently transmitted to the circuit element 16 by conduction through the package body 42. be able to. Therefore, the influence of external temperature changes can be further reduced, and the oscillator 1b having high frequency stability can be obtained.

<Fourth embodiment>
Next, an oscillator 1c according to a fourth embodiment of the present invention will be described with reference to FIG.
7A and 7B are schematic configuration diagrams of an oscillator 1c according to a fourth embodiment of the present invention. FIG. 7A is a plan view, and FIG. 7B is a cross-sectional view taken along line EE in FIG. is there. In FIG. 7A, for convenience of explaining the internal configuration of the oscillator 1c, a state in which the upper portion of the cover 64 is removed is illustrated.
Hereinafter, the fourth embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.

  As shown in FIGS. 7A and 7B, the oscillator 1c according to the fourth embodiment is compared with the oscillator 1 according to the first embodiment, and the third substrate 50 of the package body 42 constituting the container 40. A difference is that a spacer 38 is disposed on the upper surface of (see FIG. 2B), and a heating element 14 having the resonator element 12 bonded thereto is disposed on the upper surface of the spacer 38.

  With such a configuration, when the spacer 38 is made of a material having low thermal conductivity such as glass, the heat of the heating element 14 is conducted only to the vibrating piece 12 and the temperature of the vibrating piece 12 can be kept more stable. Further, if the spacer 38 is made of a material having high thermal conductivity such as copper (Cu), the heat of the heating element 14 can be conducted to the entire container 40, so that the integrated circuit 10 and the circuit element 16 are kept at a stable temperature. be able to. Therefore, an oscillator 1c having high frequency stability can be obtained.

<Fifth Embodiment>
Next, an oscillator 1d according to a fifth embodiment of the present invention will be described with reference to FIG.
8A and 8B are schematic configuration diagrams of an oscillator 1d according to the fifth embodiment of the present invention. FIG. 8A is a plan view, and FIG. 8B is a cross-sectional view taken along line FF in FIG. is there. In FIG. 8A, for convenience of explanation of the internal configuration of the oscillator 1d, a state where the upper portion of the cover 64 is removed is shown.
Hereinafter, the fifth embodiment will be described with a focus on differences from the first embodiment described above, and descriptions of similar matters will be omitted.

  As shown in FIGS. 8A and 8B, the oscillator 1d according to the fifth embodiment has a third substrate 50 of the package main body 42 constituting the container 40 as compared with the oscillator 1 according to the first embodiment. On the upper surface (see FIG. 2B), the spacer 38d is disposed at a position where the heating element 14 is disposed and a position opposed to each other in plan view.

  With such a configuration, when the resonator element 12 is joined to the upper surface of the heating element 14, the tip of the resonator element 12 (the end in the + X axis direction) is prevented from being tilted, and an impact caused by dropping or vibration is reduced. Since it can be relaxed, it is possible to obtain the oscillator 1d having excellent drop resistance and shock resistance.

[Electronics]
Next, electronic devices to which the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d according to an embodiment of the present invention are applied will be described with reference to FIGS. 9A, 9B, and 10. FIG.
FIG. 9 is a schematic diagram showing an electronic device including the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d according to an embodiment of the present invention. FIG. 9A is a mobile type (or notebook type). ) Is a perspective view showing the configuration of the personal computer 1100, and FIG. 9B is a perspective view showing the configuration of the mobile phone 1200 (including PHS).

  In FIG. 9A, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1000. The display unit 1106 has a hinge structure portion with respect to the main body portion 1104. It is supported so that rotation is possible. Such a personal computer 1100 incorporates an oscillator 1, an oscillator 1a, an oscillator 1b, an oscillator 1c, or an oscillator 1d having high frequency stability.

  In FIG. 9B, the mobile phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1000 is disposed between the operation buttons 1202 and the earpiece 1204. . Such a cellular phone 1200 incorporates an oscillator 1, an oscillator 1a, an oscillator 1b, an oscillator 1c, or an oscillator 1d having high frequency stability.

FIG. 10 is a perspective view showing a configuration of a digital camera 1300 as an electronic apparatus including the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d according to an embodiment of the present invention. Note that FIG. 10 simply shows connection with an external device.
The digital camera 1300 generates an imaging signal (image signal) by photoelectrically converting an optical image of a subject using an imaging element such as a CCD (Charge Coupled Device).
A display unit 1000 is provided on the back surface of a case (body) 1302 in the digital camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1000 displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.
When the photographer confirms the subject image displayed on the display unit 1000 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1330 is connected to the video signal output terminal 1312 and a personal computer 1340 is connected to the input / output terminal 1314 for data communication as necessary. Furthermore, the imaging signal stored in the memory 1308 is output to the television monitor 1330 or the personal computer 1340 by a predetermined operation. Such a digital camera 1300 incorporates an oscillator 1, an oscillator 1a, an oscillator 1b, an oscillator 1c, or an oscillator 1d having high frequency stability.

  As described above, by using the oscillator 1, the oscillator 1 a, the oscillator 1 b, the oscillator 1 c, or the oscillator 1 d having high frequency stability as the electronic device, a higher-performance electronic device can be provided.

  The oscillator 1 according to the embodiment of the present invention includes a personal computer 1100 (mobile personal computer) in FIG. 9A, a mobile phone 1200 in FIG. 9B, and a digital camera 1300 in FIG. , For example, an ink jet discharge device (for example, an ink jet printer), a laptop personal computer, a television, a video camera, a car navigation device, a pager, an electronic notebook (including a communication function), an electronic dictionary, a calculator, an electronic game device, a work Station, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measurements Equipment, instrumentation (e.g., vehicle, aircraft, ship instrumentation), Light simulator, mobile communication base station equipment, a router or a storage area network devices such as switches, may be applied a local area network equipment, the electronic equipment for network transmission equipment.

[Moving object]
Next, a moving body to which the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d according to an embodiment of the present invention is applied will be described with reference to FIG.
FIG. 11 is a perspective view showing a configuration of an automobile 1400 as a moving body including the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d according to the embodiment of the present invention.
The automobile 1400 is equipped with a gyro sensor including the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d according to the present invention. For example, as shown in the figure, an automobile 1400 as a moving body is equipped with an electronic control unit 1402 incorporating the gyro sensor for controlling the tire 1401. As another example, the oscillator 1 includes a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an air bag, and a tire pressure monitoring system (TPMS: Tire Pressure Monitoring System). It can be widely applied to electronic control units (ECUs) such as engine controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle attitude control systems.

  As described above, by using the oscillator 1, the oscillator 1a, the oscillator 1b, the oscillator 1c, or the oscillator 1d having high frequency stability as the moving body, a higher-performance moving body can be provided.

  The oscillators 1, 1 a, 1 b, 1 c, 1 d of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part Can be replaced with any structure having a similar function. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.

  DESCRIPTION OF SYMBOLS 1 ... Oscillator, 10 ... Integrated circuit, 12 ... Vibrating piece, 14 ... Heat generating body, 15 ... Active surface, 20, 22, 24 ... Circuit component, 26, 28 ... Electrode pad, 30 ... Bonding wire, 32, 34, 36 DESCRIPTION OF SYMBOLS Joining member 38 ... Spacer 40 ... Container 42 ... Package body 44 ... Lid member 46 ... First substrate 48 ... Second substrate 50 ... Third substrate 52 ... Fourth substrate 54 ... 5th substrate, 56 ... sealing member, 60 ... container, 62 ... base substrate, 64 ... case, 66 ... lead frame, 70 ... transistor, 72,74 ... divided capacity, 76 ... variable capacity, 78,80 , 82 ... Resistance, 1000 ... Display unit, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Main unit, 1106 ... Display unit, 1200 ... Mobile phone, 1202 ... Operation buttons, 12 4 ... Earpiece, 1206 ... Mouthpiece, 1300 ... Digital camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1312 ... Video signal output terminal, 1314 ... Input / output terminal, 1330 ... TV Monitor, 1340 ... personal computer, 1400 ... automobile, 1401 ... tire, 1402 ... electronic control unit.

Claims (9)

An oscillator including an integrated circuit including an oscillation circuit, a resonator element, a circuit element, a heating element, and a container,
Inside the container, the integrated circuit, the vibrating piece and the heating element are disposed,
An oscillator, wherein the circuit element is disposed outside the container.   The oscillator according to claim 1, wherein the circuit element includes a crystal resonator.   The oscillator according to claim 1, wherein the circuit element includes an inductance element. The resonator element is an SC cut crystal resonator element,
The oscillator according to any one of claims 1 to 3, wherein the circuit element is for suppressing an unnecessary frequency in a signal output from the oscillation circuit.   The oscillator according to claim 1, wherein the circuit element is disposed in the container.   The oscillator according to claim 5, wherein the circuit element overlaps the heating element in a plan view. The integrated circuit and the heating element are separated from each other,
The oscillator according to claim 1, wherein the resonator element is disposed on the heating element.   An electronic apparatus comprising the oscillator according to claim 1.   A moving body comprising the oscillator according to claim 1.

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