JP6270119B2 - Heat conduction plate - Google Patents

Description

  The present invention relates to a heat conductive plate for cooling a superconducting coil. In particular, the present invention relates to a heat conductive plate for cooling a superconducting coil using a thermosiphon indirect cooling method.

While the use of renewable energy is becoming increasingly important for the creation of a sustainable society, renewable energy sources that can be directly linked to the current power system and the amount of their use are limited because of the fluctuations in power generation. Limited. Therefore, there is a demand for a device that converts fluctuating renewable energy into a controlled electrical output, for example, a storage device that can store renewable energy once and output it when necessary. As this storage device, i) a superconducting power storage device (SMES) that is capable of rapid response and a large number of repeated storage / releases with respect to renewable energy having a severe power generation fluctuation of “min” or less. Is suitable. In addition, ii) “hydrogen” that can store large volumes of renewable energy with power generation fluctuations in units of “time” by decomposing water with an electrolysis device (EL) using surplus fluctuation components of power generation In addition to storing as (H ₂ ), when the amount of power generation is insufficient, it is suitable to output by a fuel cell power generation device (FC) using “hydrogen”.

It is expected that a hybrid storage system can be provided by integrating power generation fluctuation prediction technology of renewable energy in addition to the above SMES, EL, H ₂ and FC, and also a hydrogen station for a fuel cell vehicle having a liquefied hydrogen storage tank By integrating, it is expected to provide an advanced superconducting power converting system (ASPCS) with improved economy and reliability.

A superconducting coil is used in the superconducting power storage device (SMES).
The superconducting coil causes a quenching phenomenon that is fatal to the superconducting operation if the temperature rises and the normal conducting transition occurs. In addition, the application of superconducting coils to AC devices such as transformers and reactors induces eddy currents in the surrounding heat conducting plates due to the magnetic flux generated by the energizing current, causing AC loss and heat generation. Practical use has not progressed much. From such problems, development of a cooling mechanism for efficiently cooling and a heat conducting member used therefor is required.

For example, Patent Document 1 discloses a configuration in which a heat transfer member connected to a refrigerator is disposed so as to surround the outer periphery of a coil, and a slit is provided in a part of the heat transfer member.
Patent Document 2 discloses that in a pancake type superconducting coil, one end of a heat transfer material is inserted between all the superconducting coils and on both end outer surfaces of the laminated body so as to be in full contact with the coil end surfaces. The structure which connects the other end of a heat-transfer material with the cold head of a refrigerator is disclosed. Moreover, in order to suppress generation | occurrence | production of an eddy current, while providing the 1st slit cut radially from the outer peripheral end to the inner peripheral end, the 2nd slit cut radially from the inner peripheral end to the outer peripheral side is provided in the circumferential direction. The structure which provides in a space | interval is disclosed.

JP2010-272745A. JP2010-016026.

However, the heat transfer member of Patent Document 1 adopts a configuration that is arranged so as to surround the outer periphery of the coil, but the heat conduction plate that is arranged on the upper or lower surface of the superconducting coil having a substantially circular upper or lower surface. Is not disclosed. Therefore, the heat transfer member of Patent Document 1 cannot achieve a desired cooling efficiency.
Patent Document 2 discloses a heat conductive plate that is considered to have higher cooling efficiency than Patent Document 1. Specifically, Patent Document 2 discloses a heat conduction plate disposed on the upper surface or the lower surface of a superconducting coil having a substantially circular upper surface or lower surface, and first and second in order to suppress the generation of eddy currents. A structure in which two slits are provided is disclosed. However, since the first and second slits of Patent Document 2 are provided from the outer peripheral end to the inner peripheral end or from the inner peripheral end to the outer peripheral end with an interval in the circumferential direction, heat is transmitted in the circumferential direction. The cooling efficiency cannot be increased. Moreover, in patent document 2, it remains a problem to suppress generation | occurrence | production of an eddy current.

Therefore, an object of the present invention is to solve the above problems.
Specifically, an object of the present invention is a heat conduction plate disposed on the upper surface or the lower surface of a superconducting coil having a circular upper surface or lower surface, which increases cooling efficiency and suppresses the generation of eddy currents. It is providing the heat conductive board which has. In particular, it is to provide a heat conduction plate using a thermosiphon indirect cooling method.
Moreover, the objective of this invention is providing the superconducting magnet apparatus which has the said heat conductive board.
Furthermore, the objective of this invention is providing the superconducting magnet apparatus which has the said heat conductive board used for the superconducting power storage apparatus (SMES) in an advanced superconducting power conversion system (ASPCS).

The inventors have found the following invention.
<1> A heat conduction plate for cooling a superconducting coil,
The heat conducting plate includes a substantially disc-shaped heat conducting plate portion; and an outer periphery R _o (R _o : a distance from the center of the substantially disc-shaped circle to the outer circumferential end) of the substantially disc-shaped heat conducting plate portion. And preferably a plurality of heat transfer means extending radially outward,
a) The substantially disk-shaped heat conduction plate portion is disposed on the upper and / or lower surface of the superconducting coil, concentrically with the upper surface and / or the lower surface of the superconducting coil,
b) The substantially disk-shaped heat conductive plate portion has a circular notch from the center of the substantially disk-shaped heat conductive plate portion to the inner periphery R _i , and i) the diameter of the substantially disk-shaped heat conductive plate portion In the direction, the inner circumference R _i (R _i : the distance from the center of the substantially disc-shaped circle to the inner circumference end) to the outer circumference R _o (R _o : the center of the substantially disc-shaped circle) From the inner circumference R _i to the predetermined distance R ₁ in the radial direction of the substantially disc-shaped heat conducting plate portion; (A plurality of second slits extending to R _i <R ₁ <R _o ); and iii) a predetermined distance R ₂ (R ₁ <R ₂ ≦ R _o ) in the radial direction of the substantially disk-shaped heat conductive plate portion. A plurality of third slits extending from the outer periphery _Ro to the outer periphery Ro;
The heat conducting plate.

<2> In the above item <1>, R ₁ satisfies the following formula (A) (where R _x represents the distance from the center of the superconducting coil to the position where the magnetic field of the superconducting coil is zero). Good.

<3> A superconducting magnet device having the heat conducting plate described in <1> or <2>.
<4> In the above item <3>, the heat transfer means may be provided extending to a cold heat source.
<5> In the above item <4>, the superconducting magnet device is disposed between superconducting coils in which a plurality of superconducting coils are stacked, and first to nth (n represents an integer of 2 or more) heat conductive plates are stacked. The first heat transfer means of the first heat conduction plate and the mth heat conduction means of the mth heat conduction plate (m represents an integer of 2 or more and n or less) are seen from the top surface of the superconducting coil. Thus, they should be arranged so as not to overlap each other or with little overlap.

<6> In the above item <4> or <5>, the cold heat source may be liquefied hydrogen.
<7> In any one of the above items <4> to <6>, the cold heat source may employ a thermosiphon type, and the thermosiphon type pipe may be disposed on the upper part of the heat conduction plate.

According to the present invention, there is provided a heat conduction plate disposed on the upper surface or the lower surface of a superconducting coil having a circular upper surface or lower surface, the heat conduction plate having a structure for improving the cooling efficiency and suppressing the generation of eddy currents. can do. In particular, it is possible to provide a heat conduction plate using a thermosiphon indirect cooling method.
In addition, according to the present invention, a superconducting magnet device having the heat conducting plate can be provided.
Further, according to the present invention, it is possible to provide a superconducting magnet device having the above-described heat conductive plate, which is used for a superconducting power storage device (SMES) in an advanced superconducting power conversion system (ASPCS).

The upper surface schematic diagram of the substantially disk-shaped heat conductive board 1 which is 1 aspect of this invention is shown. It is a diagram illustrating a typical conductive plate comprising cooling end _{(T 0)} and the hot side of _{(T max).} It is a figure which shows the substantially disc shaped heat conductive part 102 which is a 1 aspect of this invention which has a 3rd slit. The enlarged schematic view of the outer periphery end vicinity of the substantially disc shaped heat conductive board part 2 which is one aspect | mode of this invention is shown. A graph (horizontal axis: distance from coil center (m); vertical axis: magnetic flux density (T)) used to determine the position at which the magnetic field of a double pancake superconducting coil becomes zero is shown. The schematic side view and upper surface schematic of the superconducting magnet apparatus 10 which has the heat conductive board which is one aspect | mode of this invention are shown.

The present application provides a heat conducting plate for cooling a superconducting coil. The present application also provides a superconducting magnet device having the heat conducting plate. Hereinafter, it demonstrates in order.
<Heat conduction plate>
The heat conducting plate of the present application is a substantially disc-shaped heat conducting plate portion; and an outer periphery R _o (R _o : a distance from the center of the substantially disc-shaped circle to the outer peripheral end) of the substantially disc-shaped heat conducting plate portion. A plurality of heat transfer means extending outward, preferably radially outward.

Moreover, the substantially disk-shaped heat conduction plate part is
a) It is arranged concentrically with the substantially circular upper and / or lower surface of the superconducting coil, above and / or below the superconducting coil so as to be in contact with the entire surface or almost the entire surface of the superconducting coil,
b) It has a circular notch from the center of the substantially disk-shaped heat conducting plate part to the inner periphery R _i (R _i : the distance from the center of the substantially disk-shaped circle to the inner peripheral end).

Furthermore, the substantially disk-shaped heat conductive plate portion has the following configurations i), ii), and iii).
That, i) in the radial direction of the symbolic discoid heat conductive plate, reaches to the outer R _o from the inner circumference R _i of the heat conducting plate, at least one of the first slit; and ii) the symbolic disc A plurality of second slits extending from the inner circumference R _i to a predetermined distance R ₁ (R _i <R ₁ <R _o ) in the radial direction of the plate-like heat conduction plate portion; and iii) the substantially disk-like heat conduction plate portion A plurality of third slits extending from the predetermined distance R ₂ (R ₁ <R ₂ ≦ R _o ) to the outer periphery R _{o in} the radial direction of
Regarding the iii), when it is R 2 ₌ R _o, is substantially disc-shaped heat conducting plate, which means that it does not have a third slit.

Hereinafter, the heat conductive plate of the present application will be described with reference to the drawings.
FIG. 1 shows a schematic top view of a heat conducting plate 1 according to an embodiment of the present invention.
A heat conductive plate 1 according to an embodiment of the present invention is a substantially disk-shaped heat conductive plate portion 2 made of a material having high heat conductivity, for example, aluminum, copper, copper alloy, etc., and having a thin disk shape; and extending radially outward from the outer peripheral R _o of the symbolic discoid heat conductive plate 2 has a plurality of strip-shaped heat transfer means 3a to 3h.
The plurality of heat transfer means 3a to 3h are extended to a cold heat source, which will be described later, and transfer the heat of the substantially disk-shaped heat conduction plate portion 2 to the cold heat source. In FIG. 1, although it has eight heat transfer means 3a-3h with respect to one substantially disk-shaped heat conductive board part 2, the number, arrangement | positioning location, etc. are the position of a heat source, a cooling effect, and restrictions on arrangement | positioning. , And the number of first slits 5 to be described later can be determined.

Substantially disk-shaped heat conductive plate 2 has a circular cutout b) from the center of the substantially disc-shaped heat conducting plate portion to the inner peripheral R _i, a ring-shaped or donut-shaped having a width W1 in the radial direction Form.
The inner circumference R _i is determined depending on the substantially circular shape of the superconducting coil in which the substantially disk-shaped thermoelectric plate portion 2 is disposed on the upper surface and / or the lower surface thereof. Moreover, the substantially disk-shaped heat conductive plate portion 2 is shaped so as to be in contact with the entire surface or almost the entire surface of the superconducting coil, and is preferably arranged in that way.

Substantially disk-shaped heat conductive plate 2, i) in the radial direction of the symbolic discoid heat conductive plate 2, a first slit reaching from the inner periphery R _i of the heat conducting plate 2 to the outer peripheral R _o 5 Have That is, the first slit 5 is provided so as to cut or cut the entire width W1 of the substantially disk-shaped heat conduction plate portion 2 in order to suppress the loop current in the circumferential direction.
The outer periphery _Ro depends on the shape of the superconducting coil, and may be the same as or slightly larger than the circular shape of the upper surface and / or the lower surface of the superconducting coil.
In FIG. 1, the substantially disk-shaped heat conduction plate portion 2 is illustrated as having only one first slit 5, but the number thereof depends on the loop current suppressing effect or the manufacturing convenience. Or two or more. The number of first slits is preferably one or two.
When two or more first slits are provided, the substantially disk-shaped heat conduction plate portion 2 is not integrally formed and does not maintain the “substantially disk shape”, but the substantially disk-like heat conduction plate portion is superconductive. Since a “substantially disk shape” is formed in a state of being arranged on the upper and / or lower surface of the substantially circular shape of the coil, the “substantially disk-like” heat conduction plate portion is defined in the present application.

The substantially disk-shaped heat conductive plate portion 2 is ii) a plurality of pieces extending from the inner circumference R _i to a predetermined distance R ₁ (R _i <R ₁ <R _o ) in the radial direction of the substantially disk-shaped heat conductive plate portion. It has the 2nd slit 6 (6a-6f). In FIG. 1, only the second slits corresponding to ¼ of the entire circumference are denoted by reference numerals 6 a to 6 f, but the second slit 6 is formed over the entire circumference.
The second slit is provided to suppress eddy currents induced in the heat conducting plate, and is provided to perform heat conduction in the radial direction from the inner periphery R _i to the predetermined distance R ₁ . Region AR1 from the inner peripheral R _i of the second slit 6 is formed to a predetermined distance R ₁ is an area for heat conduction (heat radiation) in the radial direction.

  The second slit 6 shown in FIG. 1 is cut substantially corresponding to the distance from the inner peripheral end of the superconducting coils 11a to 11h (see FIG. 4) to the periphery of the outer peripheral end, and in the circumferential direction. Are arranged with an angle θ. Thereby, the distance D1 between the 2nd slit 6 adjacent to each other is narrowed, and generation | occurrence | production of an eddy current can be suppressed effectively.

A distance w between two adjacent second slits (hereinafter simply abbreviated as “second slit width”) w will be described with reference to FIG.
Generally, eddy current loss P _e occurring conductive plate as shown in Figure 2 are calculated by the following equation (1). In the formula, it is defined as follows.
P _e : Eddy current loss (W) generated in a plate having a thickness a (m), a width w (m), and a length l (m);
f: Frequency of the varying magnetic field (Hz);
B _m : amplitude of the varying magnetic field (T);
ρ: Resistivity of conductive plate (Ω · m)

When the outer peripheral end of the heat conducting plate is a cooling end and has a constant temperature T ₀ , while the temperature near the inner peripheral end is T _max , the heat balance at the position x is expressed by the following equation. In the formula, k: thermal conductivity (W / m · K).

Here, the Wiedemann Frants law (ρk = L ₀ T) represented by the following formula (where L ₀ : Lorentz constant, 2.44 × 10 ⁻⁸ (WΩK ⁻² ) and T: absolute temperature (K)) Therefore, the above equation (2) is as follows.

x integrates with 0 → 1 and T integrates with T _max → T ₀ .

A width w for making the maximum temperature T _max equal to or less than an allowable value is obtained.

Therefore, when the cooling temperature T ₀ and the allowable temperature T _max are due to the fluctuation of the magnetic field with the frequency f and the amplitude B _m , the second slit width w may be equal to or smaller than the value represented by the expression (3).
For example, if the cooling end temperature is 20K and the allowable rise temperature of eddy current is 25K, the magnetic field amplitude is 2 Tesla, the frequency is 0.05 Hz, and the plate length l is 1 m, the second slit width w The allowable value is 0.018 m (about 20 mm). The outer peripheral edge portion, i.e., it is more preferable that also keep the tolerance comparable to or less of the width of the second slit width the width of a predetermined distance R ₁ to the outer R _o.

Region where the second slit is not provided (a region outside the region AR1), i.e., the area AR2 from a predetermined distance R ₁ to a predetermined distance R ₂ can perform heat conduction in the circumferential direction. Iii) When there is no third slit, that is, when the area AR2 is provided at the outer peripheral end, the heat transfer means 3a to 3h are connected to the area AR2, and are conducted in the circumferential direction by the area AR2. Heat can be conducted through the heat conducting means 3a to 3h. Therefore, the heat conducting plate 1 according to one aspect of the present invention shown in FIG. 1 is vortexed by AR1 heat transfer in the radial direction, AR2 heat transfer in the circumferential direction, and heat transfer by the heat transfer means 3a to 3h. The entire heat conducting plate can be efficiently cooled while suppressing the generation of current.

The area AR2 has a length in the radial direction (R ₂ −R ₁ ) (hereinafter, this value may be abbreviated as “2a ₂ (= L1 + L2)”. For L1 and L2, refer to FIG. 4 described later. It is possible to obtain an optimum value for the circumferential length ls.
Here, “area AR2” may be abbreviated as “slit coupling part” and “diameter length” may be abbreviated as “width”. That is, “the radial length of AR2” may be abbreviated as “width of slit connecting portion”. Further, “the length ls in the circumferential direction of AR2” may be abbreviated as “the length ls of the slit connecting portion”. Here, “the length ls in the circumferential direction of AR2”, that is, “the length ls of the slit connecting portion” is 2πR ₂ when the number of the first slits is “1”, When the number is “n” and the n first slits are equally arranged in the circumferential direction, it can be expressed as 2πR ₂ / n.
In order to obtain the optimum value, the temperature of the coil inner surface of the slit furthest away from the conduction plate cooling end needs to be equal to or lower than the allowable temperature of the superconducting magnet. Further, it can be obtained by analyzing the relationship between the heat flow term and the conduction term, the temperature of the coil inner surface of the heat conduction plate and the temperature of the cooling end, and the like.

It is preferably not more than a predetermined allowable value for suppressing an eddy current heat generation the width 2a ₂ of the slit width D1 and the slit connecting portions. However, regarding the width 2a ₂ of the slit connecting portion, in addition to the eddy current heat generation of the slit connecting portion itself, it is necessary to include heat inflow from each slit in the heat flow term. It is preferable to ensure the width. Specifically, 2a _2, i.e. _(R 2 -R ₁₎ is preferably in the range of about 10 to 20% of the _{R o.}

More specifically, the relationship between the temperature of the coil inner surface and the temperature of the cooling end is expressed by a relational expression in which (T _max ² −T ₀ ² ) is placed on the left side (see the following expression (4). Expression (4) ), R _x indicates the distance from the center of the superconducting coil to the position where the magnetic field of the superconducting coil becomes zero (details of derivation of equation (4) are omitted), and the first on the right side "Temperature difference due to eddy current loss from one slit plate, that is, the inner surface of the coil to the place where the magnetic field is 0", and "Terminal difference" Temperature difference due to eddy current loss generated at the slit plate connecting portion ", The “temperature difference due to heat flow due to eddy current loss flowing from each slit plate into the connecting portion” can be placed. Here, to derive an expression based on Wiedemann-Franz law, since the influence of the width 2a ₂ of the slit connecting portions, which fourth power in the second term, the third term comes takes minus 1 square of order, 2a ₂ It can be seen from the analysis result of the following formula (4) that there is an optimum range as described above.

Furthermore, the heat conducting plate of the present invention includes iii) a plurality of third plates extending from the predetermined distance R ₂ (R ₁ <R ₂ ≦ R _o ) to the outer circumference R _{o in} the radial direction of the substantially disc-shaped heat conducting plate portion. A slit.
However, the predetermined distance R ₂ may be the same as R _o, not the third slit is present. In short, the third slit has an arbitrary structure.
The case where the third slit is provided will be described with reference to FIG.
FIG. 3 shows a substantially disc-shaped heat conducting part 102 having a third slit.
The substantially disc-shaped heat conducting portion 102 has an area AR1 similar to the substantially disc-shaped heat conducting portion 2 shown in FIG. 1, and the area AR1 has a diameter from the inner circumference R _i to a predetermined distance R _1. A second slit 6 extending in the direction is formed, and heat can be conducted in the radial direction.

The area AR2 is provided outside the area AR1 in the radial direction as in FIG. The area AR2 has an annular shape formed between the predetermined distance R2 and the predetermined distance R1, and can conduct heat in the circumferential direction as described with reference to FIG.
Radially outside the area AR2, a predetermined distance _{R 2 (R 1 <R 2} ≦ R o) area AR3 having a plurality of third slits 107 extending to the outer peripheral _{R o (107a~107g)} from is provided. Similar to the second slit, the third slit can conduct heat in the radial direction and can suppress generation of eddy current. In FIG. 3, only the third slit corresponding to ¼ of the entire circumference is denoted by reference numerals 107 a to 107 f, but the third slit 107 is formed over the entire circumference.

As can be seen from AR1 and AR2 in FIG. 1 and AR1, AR2 and AR3 in FIG. 3, AR2 in FIG. 1 appears to have moved radially inward in FIG. That is, in the present application, it is defined as “iii) the third slit”, but “ii) the second slit extends to the outer peripheral end” and “the region AR2 having a heat transfer action in the circumferential direction is defined as the second slit. In other words, it is provided to cross.
In FIG. 3, the third slit 107 of AR3 is provided on the extension line of the second slit 6 of AR1, but the third slit may or may not be on the extension line of the second slit. Good.

Further, R ₁ preferably satisfies the following formula (A) (where R _x represents the distance from the center of the superconducting coil to the position where the magnetic field of the superconducting coil becomes zero).

The above formula (A) will be described with reference to FIG.
FIG. 4 shows an enlarged schematic view of the vicinity of the outer peripheral end of the substantially disk-shaped heat conductive plate portion 2.
A position R _x where the magnetic field of the superconducting coil becomes zero is arranged between a predetermined distance R ₁ that is the outer end of the second slit 6 and a distance R ₂ to the end of AR ₂ , that is, in the area AR _2. a, it is preferable provided with a predetermined distance R _1. In particular, when the predetermined distance R ₁ , the distance R ₂ to the end of AR ₂ , and the position R _{x at} which the magnetic field of the superconducting coil becomes zero satisfy the above formula (A), the region where the second slit 6 is not provided. , i.e. AR2 is generated at a distance L2 from the predetermined distance _{R 1} and electromotive force X that occurs in the distance L1 to the position _{R x} of zero magnetic field, up to a distance _{R 2} from the position _{R x} of the zero magnetic field to the end of AR2 The electromotive force (−X) is the opposite magnetic field, and since their values are the same, they cancel out. Therefore, the generation of eddy current can be completely or almost completely suppressed in the area AR2 where the second slit 6 is not provided, in other words, in the periphery of the outer peripheral end.

In the case where the third slit is not provided, the distance R ₂ to the end of AR2 is equal to the outer periphery _Ro (R ₂ = R _o ), and thus the above formula (A) is expressed by the above formula (A ′). Can be handled as
The dimension of (R ₂ -R ₁ ) (the length in the radial direction of the area AR2, the same as “width 2a ₂ of the slit connecting portion” and the above-described one) is in a range that exhibits thermal conductivity in the circumferential direction. Preferably having a relatively small size. In the embodiment of FIG. _2, the dimensions of the _(R 2 -R _1), as described above, is preferably in the range of about 10 to 20% of the _{R o.} In the case where the third slit is not provided, as described above, R ₂ = R _o , and therefore, the “dimension of (R ₂ −R ₁ )” is “the dimension of (R _o −R ₁ )”. It can be.

The distance R _x from the center of the superconducting coil to the position where the magnetic field of the superconducting coil becomes zero depends on the superconducting coil used, the cross-sectional shape (aspect ratio) of the coil, etc., but the position R _x depends on the Bio-Savart law. It can be obtained using.
FIG. 5 shows a disk shape formed by winding a MgB ₂ superconducting wire in the circumferential direction, specifically an inner radius (r1) of 0.05 m, an outer radius (r2) of 0.1 m, and a thickness (d) of 80. The graph used in order to obtain | require the position where the magnetic field of a .6mm double pancake type superconducting coil becomes zero is shown. The horizontal axis indicates the distance (m) from the coil center, and the vertical axis indicates the magnetic flux density (T).
According to FIG. 5, in the case of the superconducting coil used, it can be seen that there is a position where the magnetic field becomes zero in the vicinity of 0.095 m.

<Superconducting magnet device>
The present application provides a superconducting magnet device having the above-described heat conducting plate.
Specifically, it is a superconducting magnet device having one or more so-called pancake type or double pancake type superconducting coils, which are concentric with the upper surface and / or the lower surface of the pancake type or double pancake type superconducting coil. It is preferable to arrange the above-mentioned heat conductive plate. When a plurality of pancake-type or double pancake-type superconducting coils are stacked, it is preferable to arrange the above-described heat conductive plate between the superconducting coils to be stacked. Incidentally, MgB ₂ superconducting wire in a superconducting coil (critical temperature: 39K) and has been used, the material of the superconducting wire can be appropriately selected in view of the cold source.

In the superconducting magnet device, it is convenient to use liquefied helium (boiling point: 4K) and liquefied hydrogen (boiling point: 20K) as a cold heat source in terms of coil cooling, and it is economical to use liquefied hydrogen from a hydrogen station. It is even more convenient. In this case, it is preferable to adopt an indirect cooling method because hydrogen has a flammable property, and to adopt a thermosiphon method that naturally circulates itself when heat is applied.
The thermosiphon-type piping is preferably arranged on the top of the heat conducting plate.

An example of a superconducting magnet apparatus using a thermosiphon type cold heat source and using liquefied hydrogen as the cold heat source will be described below with reference to the drawings.
FIG. 6 shows a schematic diagram of an aspect 10 of the superconducting magnet device having the heat conducting plate of the present application. Specifically, FIG. 6A shows a side front view. Moreover, FIG.6 (b) shows the schematic of the one aspect | mode 10 of the superconducting magnet apparatus which removed the heat conduction means from Fig.6 (a), and employ | adopted the thermosiphon type indirect cooling system. Then, FIG. 6 (a ′) shows a top view of FIG. 6 (a).

One aspect 10 of the superconducting magnet device is formed by laminating eight double pancake superconducting coils 11a to 11h. Each double pancake superconducting coils 11a~11h is, MgB ₂ superconducting wire (critical temperature: 39K) with disc-shaped pancake coil formed by winding is superimposed is obtained by a two-layer, two The coils of the layers are connected at the innermost circumference.
The heat conducting plate 1 is disposed between the superconducting coils. For example, the first heat conducting plate 13a is disposed between the superconducting coils 11a and 11b, and the second heat conducting plate 13b is disposed between the superconducting coils 11b and 11c. , Etc., a heat conducting plate is arranged. Further, the heat conductive plate 1 is disposed so as to be in contact with the upper surface of the uppermost superconducting coil 11h and the lower surface of the lowermost superconducting coil 11a, respectively. The heat conducting plate 1 is configured to sandwich the superconducting coils 11a to 11h.
As described above, each heat conducting plate 1 has the above-described configuration, that is, the heat conducting means, the first slit, the second slit, the third slit, and the like.

The heat conducting means 3a to 3h included in each heat conducting plate 1 are bent upward near the outer peripheral end of the heat conducting plate 1, specifically at the position indicated by “CV” in FIG. The heat conducted by the heat conducting means is cooled by extending to the cold drum 15 arranged in the above and placing it so as to be in contact with the cold drum 15.
The cooling / heating drum 15 is formed of a material having good thermal conductivity, such as copper, and has a substantially cylindrical shape, and is disposed above the superconducting coils 11a to 11h. The thermosiphon line 16 that is a tubular portion is installed so as to have a contact portion 17 that comes into contact with the outer peripheral side surface of the cooling drum 15.

The thermosiphon line 16 has a substantially U shape when viewed from the side, and is installed by piping. One end of the thermosiphon line 16 is connected to the liquefied hydrogen tank 18, and liquefied hydrogen flows from the liquefied hydrogen tank 18 into the substantially U-shaped thermosiphon line 16. The cooling drum 15 is cooled at the contact portion 17. The liquefied hydrogen that has cooled the cold drum 15 is evaporated by the heat transmitted by the heat conducting means 3 a to 3 h, and the evaporated hydrogen flows upward and flows into the liquefied hydrogen tank 18. And liquefied hydrogen flows in into the contact part 17 again from the liquefied hydrogen tank 18, and liquefied hydrogen flows into a siphon type. As a result, the cooling drum 15 is continuously cooled, the heat conducting means 3a to 3h are indirectly cooled, and further, each heat conducting plate 1 and the superconducting coils 11a to 11h are cooled.
The double pancake superconducting coils 11 a to 11 h, the respective heat conducting plates 1, the cooling / heating drum 15, the thermosyphon line 16, and the liquefied hydrogen tank 18 are accommodated in a vacuum container 30.

Thus, the heat conducting means is provided on the heat conducting plate, extends to a cold heat source, and is cooled. As described above, the number and arrangement location of the heat conduction means of the present invention can be determined depending on the position of the cold heat source, the cooling effect, the arrangement limitation, and the like.
When the superconducting magnet device is formed by laminating a plurality of superconducting coils, and the first to nth (n represents an integer of 2 or more) heat conducting plates are disposed between the superconducting coils, the heat conducting means is preferably Is preferably arranged as follows. That is, the first heat transfer means of the first heat conduction plate and the mth heat conduction means of the mth heat conduction plate (m represents an integer of 2 or more and n or less) are viewed from the top surface of the superconducting coil. Thus, they should be arranged so as not to overlap each other or with little overlap. Thus, by providing the heat transfer means, the heat conduction plate and the superconducting coil can be efficiently cooled.

  As described above, the heat conduction plate of the present application and the superconducting magnet device having the heat conduction plate have been described with reference to the drawings. However, the heat conduction plate of the present invention and the superconducting magnet device having the heat conduction plate are limited to those illustrated. However, modifications and modifications of these illustrated ones are also included in the present invention.

The superconducting magnet device having the heat conducting plate of the present application, particularly the superconducting magnet device using liquefied hydrogen as a cold heat source, water electrolysis device (EL), large-capacity “hydrogen” storage device (H ₂ ), “hydrogen” By integrating with a fuel cell power generation apparatus (FC) to be used and a power generation fluctuation prediction technology of renewable energy, a hybrid storage system can be provided. Further, by integrating with a hydrogen station having a liquefied hydrogen storage tank or the like, an advanced superconducting power conversion system (ASPCS) with improved economy and reliability can be provided.

Claims (6)

A heat conduction plate for cooling the superconducting coil,
The heat conducting plate has a substantially disc-shaped heat conducting plate portion; and an outer periphery R _o (R _o : a distance from the center of the substantially disc-shaped circle to the outer peripheral end) of the substantially disc-shaped heat conducting plate. A plurality of heat transfer means for stretching;
The substantially disk-shaped heat conduction plate part is
a) It is arranged above and / or below the superconducting coil, concentrically with the substantially circular upper and / or lower surface of the superconducting coil,
b) having a circular notch from the center of the substantially disc-shaped heat conducting plate portion to the inner periphery R _i ; and i) in the radial direction of the substantially disc-shaped heat conducting plate portion, From inner circumference R _i (R _i : distance from the center of the substantially disc-shaped circle to the inner circumference end) to outer circumference R _o (R _o : distance from the center of the substantially disc-shaped circle to the outer circumference end) At least one first slit reaching;
ii) a plurality of second slits extending from the inner circumference R _i to a predetermined distance R ₁ (R _i <R ₁ <R _o ) in the radial direction of the substantially disc-shaped heat conducting plate portion; and iii) the substantially circle in the radial direction of the plate-like heat conductive plate, a plurality of third slits extending from a predetermined distance _{R 2 (R 1 <R 2} ≦ R o) to the peripheral _{R o;}
The heat conducting plate. 2. The heat conducting plate according to claim 1, wherein R ₁ satisfies the following formula (A) (wherein R _x represents a distance from the center of the superconducting coil to a position where the magnetic field of the superconducting coil becomes zero).

  A superconducting magnet device comprising the heat conducting plate according to claim 1.   4. The superconducting magnet device according to claim 3, wherein the heat transfer means is provided extending to a cold heat source.   The superconducting magnet device according to claim 4, wherein the cold heat source is liquefied hydrogen.   The superconducting magnet device according to claim 4 or 5, wherein the cold heat source employs a thermosiphon type, and the thermosiphon type pipe is disposed on an upper portion of the heat conducting plate.

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