JP6263734B2 - スイッチ装置 - Google Patents
スイッチ装置 Download PDFInfo
- Publication number
- JP6263734B2 JP6263734B2 JP2013214494A JP2013214494A JP6263734B2 JP 6263734 B2 JP6263734 B2 JP 6263734B2 JP 2013214494 A JP2013214494 A JP 2013214494A JP 2013214494 A JP2013214494 A JP 2013214494A JP 6263734 B2 JP6263734 B2 JP 6263734B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- wiring board
- movable
- layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 10
- 238000003825 pressing Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 4
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003811 finger Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Images
Landscapes
- Tumbler Switches (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Push-Button Switches (AREA)
Description
図1は本発明の一実施の形態によるスイッチ装置の断面図、図2は同主要部の分解斜視図、図3は同配線基板の分解斜視図であり、同図において、1は紙フェノール樹脂やガラス入りエポキシ樹脂等の配線基板である。
1A 回路部
2 導電層
2A 固定接点
2B 配線パターン
2C 枠状導電層
3 絶縁層
4 表示層
4A 表示部
4B 枠状表示層
5 遮蔽部
6 抵抗
7 弾性基体
7A 可動部
7B 可動接点
7C ボス部
8 ケース
8A 開口部
8B 押えリブ
8C 締付部
9 ビス
10 カバー
10A ガイド孔
11 操作体
11A 軸部
11B 押圧部
12 押圧ピン
20 スイッチ装置
Claims (1)
- 固定接点が上面に形成された配線基板と、前記固定接点に対向した可動接点を下面に設けた可動部が一体に形成され、前記配線基板の上面を覆う弾性基体と、前記弾性基体の上方に揺動又は上下動可能に配設された操作体を備え、前記操作体の操作によって前記固定接点と前記可動接点の接離が行われるスイッチ装置であって、前記配線基板の上面に導電層と絶縁層と表示層の内、少なくとも前記導電層と前記絶縁層からなる回路部を形成し、前記配線基板の上面に枠状に連なる遮蔽部を形成して、前記遮蔽部が前記回路部を囲むと共に、前記遮蔽部を前記回路部の最大高さとなる部分と同じ層を積層させて、前記弾性基体の下面を前記遮蔽部に弾接させたスイッチ装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013214494A JP6263734B2 (ja) | 2013-10-15 | 2013-10-15 | スイッチ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013214494A JP6263734B2 (ja) | 2013-10-15 | 2013-10-15 | スイッチ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015079573A JP2015079573A (ja) | 2015-04-23 |
JP6263734B2 true JP6263734B2 (ja) | 2018-01-24 |
Family
ID=53010860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013214494A Active JP6263734B2 (ja) | 2013-10-15 | 2013-10-15 | スイッチ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6263734B2 (ja) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2510107Y2 (ja) * | 1988-08-18 | 1996-09-11 | オムロン株式会社 | プッシュスイッチ |
JP2012079656A (ja) * | 2010-10-06 | 2012-04-19 | Tokai Rika Co Ltd | 操作装置 |
-
2013
- 2013-10-15 JP JP2013214494A patent/JP6263734B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015079573A (ja) | 2015-04-23 |
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