JP6260486B2 - Inspection device and inspection program - Google Patents

Description

  The present invention relates to an inspection apparatus and an inspection program for performing a chemical, medical, or biological inspection of an inspection object.

  Conventionally, an inspection apparatus for inspecting a specimen such as a biological substance or a chemical substance is known. For example, the sample liquid analyzer disclosed in Patent Document 1 includes a base, a microchip, a centrifugal force applying device, an optical measuring device, and a temperature adjusting device. The temperature adjusting device sends warm air into the base to increase the temperature inside the base. The centrifugal force applying device rotates the microchip with a rotation axis extending in parallel with the thickness direction of the microchip as a fulcrum, and applies a centrifugal force to the microchip. Whole blood in the microchip is centrifuged into a blood cell component and a plasma component, and the plasma component and the reagent are further mixed. The optical measurement device irradiates a plasma component mixed with a reagent with laser light and detects transmitted light as a measurement result. The measurement results are used to analyze plasma components.

  An inspection device is known in which centrifugal force is applied to a microchip by rotation about a rotation axis orthogonal to the thickness direction of the microchip (see, for example, Patent Document 2). In the case of this inspection apparatus, the area inside the base where the microchip moves by rotation may be larger in the direction of the rotation axis than the sample liquid analyzer described in Patent Document 1.

JP 2009-58409 A JP 2014-81247 A

  In an inspection apparatus in which a centrifugal force is applied to a microchip by rotation about a rotation axis orthogonal to the thickness direction of the microchip, the temperature inside the base is managed using the temperature adjustment mechanism described in Patent Document 1. Take the case where it is done as an example. In this case, since the area inside the base is relatively large in the direction of the rotation axis, when air heated by the temperature adjustment mechanism is sent into the base, a temperature distribution may occur in the direction of the rotation axis. For this reason, there exists a problem that the temperature of the rotation axis direction of the microchip inside a base may not be made uniform.

  The objective of this invention is providing the test | inspection apparatus and test | inspection program which can make uniform the temperature of the rotating shaft direction of a test | inspection chip.

An inspection apparatus according to a first aspect of the present invention rotates a holder that holds an inspection chip, a holder that rotates about the main axis, and a swing axis that extends in a direction intersecting the main axis. And a temperature that is arranged in a predetermined region including at least a rotation mechanism of the holder that rotates around the main shaft by the centrifugal mechanism, and a centrifugal mechanism that changes a direction of the centrifugal force with respect to the holder by rotation of the main shaft. An adjustment mechanism, a temperature sensor arranged in the predetermined area, an accepting means for accepting an instruction to start an inspection, and whether or not the temperature detected by the temperature sensor is within a first range allowed for a target temperature A first determination unit that determines whether or not the reception unit receives an instruction to start the inspection, and before the first determination unit determines that it is within the first range. Wherein the temperature of said temperature sensor detects that, in a range including the target temperature, a second determination means for determining whether or not the wider second range than the first range, by the second determination means And a control unit that heats or cools the temperature adjusting mechanism and rotates the main shaft at a first rotational speed when it is determined that the temperature is out of the second range.

  The inspection apparatus according to the first aspect causes the temperature adjustment mechanism to generate heat or cool and rotate the spindle before the temperature in the predetermined region falls within the first range after receiving an instruction to start the inspection. The temperature in the predetermined region changes according to the temperature adjustment mechanism generating heat or cooling. As the main shaft rotates, the air in the predetermined region is agitated and the temperature distribution in the predetermined region is suppressed. Therefore, the inspection apparatus can make the temperature in the main axis direction of the inspection chip uniform in a short time.

In addition , the inspection apparatus can reduce the time required for the temperature in the predetermined area to be within the second range to be equal to or less than the time required for the temperature in the predetermined area to be within the first range.

  In the first aspect, when the control unit determines that the second determination unit is out of the second range, the control unit causes the temperature adjustment mechanism to generate heat based on a parameter having a relatively large heat generation amount. When the second determination means determines that the temperature is within the second range, the temperature adjustment mechanism may generate heat based on a parameter having a relatively small heat generation amount. In this case, when the temperature in the predetermined area is outside the second range, the inspection apparatus can bring the temperature in the predetermined area within the second range in a short time by relatively increasing the amount of heat generation. it can.

  In the first aspect, the control means controls the spindle to rotate at the first rotational speed based on the difference between the temperature detected by the temperature sensor and the target temperature, and the parameter based on the difference It is also possible to execute at least one of the controls for rotating the main shaft by changing. The inspection device rotates the spindle at the first rotational speed based on the difference between the detected temperature and the target temperature, thereby efficiently converting the temperature in the predetermined region even when the difference between the detected temperature and the target temperature is large. Therefore, it can be within the second range. In addition, the inspection apparatus can efficiently set the temperature in the predetermined region within the second range by changing the parameter based on the difference between the detected temperature and the target temperature.

  In the first aspect, the control means controls the rotation of the main shaft at the first rotational speed proportional to the absolute value of the difference, and sets the parameter that the heat generation amount is relatively larger as the difference is larger. You may perform at least one of the control which changes and rotates the said main axis | shaft. In this case, the greater the difference, the greater the first rotational speed. As the first rotational speed increases, the air in the predetermined region is better agitated. In addition, the inspection device can increase the amount of heat generated as the difference increases. Therefore, the inspection apparatus can make the time until the temperature in the predetermined region falls within the second range constant regardless of the magnitude of the difference.

  In the first aspect, when the temperature detected by the temperature sensor is higher than the target temperature, the control means may rotate the spindle without causing the temperature adjustment mechanism to generate heat. In this case, the inside of the predetermined region can be cooled by rotating only the main shaft and stirring the air in the predetermined region without causing the temperature adjusting mechanism to generate heat.

  1st aspect WHEREIN: The detection means which detects whether the said test | inspection chip is mounted | worn with the said holder is provided, The said control means rotates the said spindle at the said 1st rotation speed based on the detection result by the said detection means. May be. The stability of the holder when the holder is rotated may be different depending on whether the inspection chip is attached to the holder or not. On the other hand, the inspection apparatus can change the first rotation speed depending on whether the inspection chip is attached to the holder or not. Therefore, the inspection apparatus can stably rotate the inspection chip or the holder at an appropriate number of rotations and appropriately agitate the predetermined area.

In a first aspect, the control means, wherein when it is determined not to be the first within range by the first determination means may rotate the main shaft at a second rotational speed lower than the first rotational speed. In this case, it is possible to suppress movement of the specimen and the reagent in the test chip due to centrifugal force.

  1st aspect WHEREIN: The said temperature sensor may be provided in the same height as the height of the measurement part vicinity in the said test | inspection chip with which the said holder was mounted | worn. In this case, the temperature sensor can appropriately detect the temperature of the measurement part of the inspection chip.

  In the first aspect, there may be provided a temperature changing means for lowering the target temperature and generating the temperature adjusting mechanism after the first determining means determines that the temperature is within the first range. In this case, it can suppress appropriately that the temperature in a predetermined area | region becomes larger than the target temperature before a change.

An inspection program according to a second aspect of the present invention rotates a holder that holds an inspection chip, a holder that rotates about the main axis, and a swing axis that extends in a direction intersecting the main axis. And a temperature that is arranged in a predetermined region including at least a rotation mechanism of the holder that rotates around the main shaft by the centrifugal mechanism, and a centrifugal mechanism that changes a direction of the centrifugal force with respect to the holder by rotation of the main shaft. An accepting step of accepting an instruction to start an inspection to a computer of an inspection apparatus including an adjustment mechanism and a temperature sensor arranged in the predetermined area, and a temperature detected by the temperature sensor is allowed for a target temperature . a first determining step of determining whether the first range being said accepting step accepts an instruction of said inspection start, One, prior to the first determination step determines that the first range, the temperature of the temperature sensor detects is a range including the target temperature, or within the first wide second range than A second determination step for determining whether or not and the second determination step determines that the temperature adjustment mechanism is out of the second range, the temperature adjustment mechanism generates heat or is cooled, and the spindle rotates at a first rotation speed. Control steps to be executed. According to the 2nd aspect, there can exist an effect similar to a 1st aspect.

2 is a perspective view showing a configuration of an inspection system 3. FIG. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1 and a perspective view of a test chip 2. FIG. 2 is an enlarged perspective view of the upper part of the inspection system 3 with the upper housing 11 removed, and a block diagram showing the electrical configuration of the inspection system 3. It is a flowchart of the 1st main process in 1st Embodiment. It is a figure which shows the parameter table 931 in 2nd Embodiment. It is a flowchart of the 2nd main process in 2nd Embodiment.

<1. Schematic structure of inspection system 3>
DESCRIPTION OF EMBODIMENTS Embodiments embodying the present invention will be described with reference to the drawings. The schematic structure of the inspection system 3 will be described with reference to FIGS. The inspection system 3 of the present embodiment includes the inspection chip 2 shown in FIG. 2 that can store a sample and a reagent that are liquids, and the inspection apparatus 1 that performs inspection using the inspection chip 2. As shown in FIGS. 2 and 3, the inspection chip 2 is supported by a holder 61 of the inspection apparatus 1. When the inspection apparatus 1 rotates the holder 61 and the inspection chip 2 around the vertical axis A <b> 1 separated from the holder 61 and the inspection chip 2, centrifugal force acts on the holder 61 and the inspection chip 2. When the inspection apparatus 1 rotates the holder 61 and the inspection chip 2 about the horizontal axis A2, the centrifugal direction, which is the direction of the centrifugal force acting on the holder 61 and the inspection chip 2, is switched with respect to the inspection chip 2.

<2. Structure of the inspection apparatus 1>
The structure of the inspection apparatus 1 will be described with reference to FIGS. In the following description, the upper, lower, right, left, front side, and back side of FIG. 2 are respectively the upper, lower, front, rear, left, and right sides of the inspection apparatus 1. And In the present embodiment, the direction of the vertical axis A1 is the vertical direction of the inspection apparatus 1, and the direction of the horizontal axis A2 is the direction of the speed when the holder 61 and the inspection chip 2 are rotated about the vertical axis A1. . 3 shows a state in which the upper housing 11 and the pair of side housings 13 shown in FIG. 1 of the inspection apparatus 1 are removed. In the perspective view of FIG. 3, a measuring unit 7 described later is omitted.

  As shown in FIG. 1, the inspection apparatus 1 includes a housing 10. The housing 10 has a box-shaped frame structure. The housing 10 includes an upper housing 11, a lower housing 12, and a pair of side housings 13. A pair of side housing | casing 13 is a rectangular board | plate material long in an up-down direction. Each surface of the pair of side housings 13 faces in the left-right direction. The pair of side housings 13 are separated in the left-right direction. The lower housing 12 is a plate member spanned between the lower end of each of the pair of side housings 13, the lower side of the front end, and the lower side of the rear end. The upper housing 11 is a plate member spanned between the upper ends of the pair of side housings 13, the upper side of the front end, and the upper side of the rear end. A hole 11A is formed in the upper housing 11 between the front portion and the upper portion. The upper housing 11 rotatably supports one end of a lid member 11B that is a rectangular plate material. When the other end facing the one end of the lid member 11B approaches the upper housing 11 by rotation, the lid member 11B covers the hole 11A. An operation unit 94 including a power switch and a plurality of operation switches is provided on the right side of the upper portion of the upper housing 11.

  2 and 3, the inspection apparatus 1 includes a case 80, an upper plate 32, a turntable 33, a rubber heater 65, an angle changing mechanism 34, a holder 61, and a control device 90 shown in FIG. 1 is provided inside the housing 10 shown in FIG. The upper plate 32 is a rectangular plate material spanned between the front upper end and the rear upper end of the lower housing 12. The rubber heater 65 is a disk-shaped heater provided on the upper side of the upper plate 32. The turntable 33 is a disk provided rotatably on the upper plate 32 and the rubber heater 65. An inspection chip 2 to be described later is supported by a holder 61 disposed above the turntable 33.

  As shown in FIG. 2, the inspection chip 2 is mainly composed of a transparent synthetic resin plate 20. One surface of the plate material 20 is sealed with a sheet 291, and the other surface of the plate material 20 is sealed with a sheet 292. The sheets 291 and 292 are transparent synthetic resin thin plates. Between the plate member 20 and the sheet 291 and between the plate member 20 and the sheet 292, a liquid flow path (not shown) through which the liquid sealed in the inspection chip 2 can flow is formed. The sheets 291 and 292 seal the flow path forming surface of the plate material 20. The reagent and specimen injected into the test chip 2 are quantified or mixed in the process of flowing through the liquid flow path, and a mixed liquid is generated. The liquid mixture is stored in a measurement unit 293 formed in a part of the liquid channel. The inspection chip 2 is held by the holder 61 with the thickness direction extending in the front-rear direction and the left-right direction.

  The angle changing mechanism 34 is a drive mechanism provided on the turntable 33. The angle changing mechanism 34 rotates the inspection chip 2 by rotating the holder 61 around the horizontal axis A2. The case 80 is provided above the upper plate 32 and covers the turntable 33, the rubber heater 65, the angle changing mechanism 34, and the holder 61. 3 for performing optical measurement on the inspection chip 2 is provided on the upper side of the upper plate 32 and on the outside of the case 80. The control device 90 is a controller that controls various processes of the inspection device 1. As shown in FIG. 3, the control device 90 is disposed on the right side of the left side housing 13 shown in FIG. 1 and on the lower side of the upper plate 32. A drive mechanism for rotating the turntable 33 around the vertical axis A1 is provided below the upper plate 32 as follows.

  As shown in FIG. 2, a spindle motor 35 that supplies driving force for rotating the turntable 33, and a spindle 57 that extends upward from the inside of the lower casing 12, closer to the lower part of the central portion in the casing 10. Is installed. The main shaft motor 35 is a DC motor. The shaft 36 of the main shaft motor 35 protrudes upward and is connected to the main shaft 57. The main shaft 57 passes through the upper plate 32 and protrudes above the upper plate 32. The upper end portion of the main shaft 57 is connected to the center portion of the turntable 33. The main shaft 57 is rotatably supported by a support member 53 provided immediately below the upper plate 32 and a support member 54 provided below the support member 53. The inner ring of the ball bearing 54 </ b> A provided inside the support member 54 contacts the main shaft 57 and rotates according to the rotation of the main shaft 57. The support member 54 holds the outer ring of the ball bearing 54A at the front end. The rear end portion of the support member 54 is disposed on the right side of a stepping motor 51 described later. When the main shaft motor 35 rotates the shaft 36, the driving force is transmitted to the main shaft 57. At this time, the turntable 33 rotates around the main shaft 57 in conjunction with the rotation of the main shaft 57.

  The main shaft 57 is a cylindrical body having a hollow inside. The inner shaft 40 is a shaft that can move in the vertical direction inside the main shaft 57. As shown in FIG. 3, the inner shaft 40 has a quadrangular shape when viewed from above. The upper end portion of the inner shaft 40 extends through the main shaft 57 and above the turntable 33 and is connected to a pair of rack gears 43 described later.

  As shown in FIG. 2, the main shaft 57 is provided with a slit 57A extending in the vertical direction. A coupling portion (not shown) extending from the outside of the main shaft 57 to the inside through the slit 57A is provided on the inner ring of the ball bearing 54A. The inner end of the connecting portion is connected to the inner shaft 40.

  A stepping motor 51 for moving the inner shaft 40 up and down is fixed near the rear of the central portion of the housing 10. The shaft 58 of the stepping motor 51 protrudes rightward. A pinion gear (not shown) is fixed to the tip of the shaft 58. The pinion gear meshes with a rack gear (not shown) fixed to the support member 54. When the stepping motor 51 rotates the shaft 58, the support member 54 and the ball bearing 54A move up and down in conjunction with the rotation of the pinion gear. At this time, the connecting portion provided on the ball bearing 54A moves up and down along the slit 57A. The inner shaft 40 moves up and down in conjunction with the connecting portion.

  The detailed structure of the angle changing mechanism 34 will be described. The angle changing mechanism 34 includes a pair of rack gears 43. The pair of rack gears 43 are metal plate-like members. As shown in FIG. 3, the pair of rack gears 43 are fixed to the upper ends of the mutually facing surfaces of the inner shaft 40. One rack gear 43 extends from the inner shaft 40 in one direction when viewed from above, and the other rack gear 43 extends in the opposite direction to the one direction side. As shown in FIG. 2, a gear 431 is formed in the vertical direction at the end of the pair of rack gears 43 opposite to the inner shaft 40 side. The rack gear 43 moves up and down as the inner shaft 40 moves up and down.

  As shown in FIG. 3, support portions 47 are provided on the counterclockwise direction sides of the rack gears 43 as viewed from above. The support part 47 supports the holder 61 rotatably. More specifically, as shown in FIGS. 2 and 3, the support portion 47 includes two cylindrical portions 471, an extending portion 472, and a support shaft 473. The two cylindrical portions 471 are arranged side by side along the rack gear 43 and extend in the vertical direction. The extending portion 472 extends from the upper end of the cylindrical portion 471 in a direction away from the inner shaft 40 along the rack gear 43, and the distal end fixes the support shaft 473. The support shaft 473 extends in the clockwise direction when viewed from above, and the tip thereof is disposed inside the gear portion 76 formed in the holder 61. The gear portion 76 meshes with the gear 431 of the rack gear 43. As the rack gear 43 moves up and down, the gear portion 76 rotates around the support shaft 473, whereby the holder 61 rotates. Therefore, the inspection chip 2 held by the holder 61 rotates around the support shaft 473.

  In the present embodiment, as the spindle motor 35 rotates the turntable 33, the holder 61 and the inspection chip 2 rotate around the inner shaft 40 which is a vertical axis, and the holder 61 and the inspection chip 2 are centrifuged. Force acts. The rotation around the vertical axis A1 of the holder 61 and the inspection chip 2 is referred to as revolution. On the other hand, as the stepping motor 51 moves the inner shaft 40 up and down, the holder 61 and the inspection chip 2 rotate around the support shaft 473 that is a horizontal axis, and the centrifugal force acting on the holder 61 and the inspection chip 2. The centrifugal direction of the relative change. The rotation around the horizontal axis A2 of the holder 61 and the inspection chip 2 is referred to as rotation.

  When the support member 54 shown in FIG. 2 is raised to the uppermost end of the movable range, the rack gear 43 is also raised to the uppermost end of the movable range. At this time, the holder 61 and the inspection chip 2 are in a steady state where the rotation angle is 0 degree. In the state where the support member 54 shown in FIG. 2 is lowered to the lowermost end of the movable range, the rack gear 43 is also lowered to the lowermost end of the movable range. At this time, the holder 61 and the inspection chip 2 are rotated from the steady state by 90 degrees counterclockwise about the horizontal axis A2. That is, in this embodiment, the angular width in which the holder 61 and the inspection chip 2 can rotate is the rotation angle of 0 degree to 90 degrees.

  The detailed structure of the case 80 will be described. As shown in FIG. 3, the case 80 is a cylindrical member whose upper side is closed. The case 80 has a side surface portion 80A and an upper surface portion 80B. A hole 80C is formed from the front upper side of the side surface 80A to the front of the upper surface 80B. The case 80 is installed on the upper side of the upper plate 32. More specifically, the case 80 is provided outside the rotation range in which the holder 61 and the inspection chip 2 are rotated as seen from the main shaft 57 at the rotation center of the turntable 33. Case 80 covers the rotation range from above. Hereinafter, the area in the case 80 is referred to as a “predetermined area 81”.

  A hole 80 </ b> D is formed on the diagonally right rear side of the side surface 80 </ b> A of the case 80. A hole 80E is formed on the diagonally left rear side of the side surface 80A of the case 80. The measurement unit 7 that performs optical measurement on the inspection chip 2 includes a light source 71 that emits measurement light, and an optical sensor 72 that detects the measurement light emitted from the light source 71. The light source 71 is disposed on the right side of the hole 80D. The optical sensor 72 is disposed on the left side of the hole 80E.

  In the present embodiment, the position on the rear side of the main shaft 57 in the reciprocable range of the inspection chip 2 is a measurement position where the inspection chip 2 is irradiated with measurement light. When the inspection chip 2 is at the measurement position, the measurement light 70 connecting the light source 71 and the optical sensor 72 intersects the sheets 291 and 292 of the inspection chip 2 shown in FIG. A hole 61A is formed in the holder 61 at a position close to the measurement unit 293 in a state where the inspection chip 2 shown in FIG. The measurement light 70 emitted from the light source 71 passes through the measurement unit 293 of the inspection chip 2 at the measurement position, and further passes through the hole 61 </ b> A of the holder 61 and is detected by the optical sensor 72. As described above, optical measurement by the measurement unit 7 is performed.

  As shown in FIGS. 2 and 3, the lower rear side of the side surface portion 80 </ b> A of the case 80 protrudes in a box shape toward the rear. Hereinafter, the portion protruding in a box shape is referred to as a “projection 80F”. A temperature sensor 77 is provided above the inner surface of the protrusion 80F. The temperature sensor 77 has a thermistor 77A extending to the front side. The vertical position of the thermistor 77 </ b> A is equal to the vertical position of the hole 61 </ b> A of the holder 61. That is, the height of the thermistor 77 </ b> A is equal to the height of the measurement unit 293 of the inspection chip 2 supported by the holder 61. More specifically, the height of the thermistor 77A is equal to the height of the measuring portion 293 of the inspection chip 2 supported by the holder 61 at a rotation angle of 0 degree.

  The detailed structure of the rubber heater 65 will be described. As shown in FIG. 3, the rubber heater 65 is provided inside the portion of the upper plate 32 that contacts the lower end of the side surface portion 80 </ b> A of the case 80. That is, the rubber heater 65 is provided at the lower end in the predetermined area 81. The rubber heater 65 has a structure in which a heating wire is sandwiched between two rubber sheets. The rubber heater 65 generates heat when a current flows therethrough.

<3. Electrical configuration of control device 90>
The electrical configuration of the control device 90 will be described with reference to FIG. The control device 90 includes a CPU 91 that controls the main control of the inspection device 1, a RAM 92 that temporarily stores various data, a flash memory 93 that stores parameters, and a program ROM 95 that stores control programs. The CPU 91 is connected with an operation unit 94, a rubber heater 65, and a temperature sensor 77. As the control device 90, a personal computer connected to the inspection device 1 from the outside may be used, or a dedicated control device connected to the inspection device 1 from the outside may be used.

  Further, the revolution controller 97, the rotation controller 98, and the measurement unit 7 are connected to the CPU 91. The revolution controller 97 controls the revolution of the holder 61 and the inspection chip 2 by transmitting a control signal for rotating the spindle motor 35 to the spindle motor 35. The rotation controller 98 controls the rotation of the holder 61 and the inspection chip 2 by transmitting a control signal for rotating the stepping motor 51 to the stepping motor 51. The measurement unit 7 performs optical measurement of the inspection chip 2. Specifically, the measurement unit 7 performs light emission of the light source 71 and light detection of the optical sensor 72. The CPU 91 controls the revolution controller 97, the rotation controller 98, and the measuring unit 7.

<4-1. First Embodiment of Inspection Method (Parameter)>
In the first embodiment, the first target temperature, the second target temperature, the startup gain, the steady gain, the startup temperature range, the steady temperature range, and the spindle speed are stored in advance in the flash memory 93 as parameters. ing. The first target temperature and the second target temperature are the target values of the temperature in the predetermined area 81 shown in FIG. The second target temperature is equal to or lower than the first target temperature. The first target temperature is 34 degrees as an example. The second target temperature is 30 degrees as an example. The first target temperature is not limited to 34 degrees and may be another value. The second target temperature is not limited to 30 degrees and may be another value.

  The start-up gain is feedback controlled until the input operation for starting the quantification, mixing, and optical measurement of the liquid mixture in the test chip 2 is detected by the process of S11 described later. This is a proportional gain applied to (P control). Note that the CPU 91 adjusts the current passed through the rubber heater 65 by PWM control. Specifically, the CPU 91 adjusts the current by adjusting the duty ratio of the current passed through the rubber heater 65. The CPU 91 determines the duty ratio based on feedback control. Hereinafter, the above-described input operation is referred to as “inspection start operation”. The constant gain is a proportional gain applied to feedback control after an inspection start operation is detected by the process of S11 shown in FIG.

  When the duty ratio is determined based on feedback control, the current passed through the rubber heater 65 per unit time is greater when the startup gain is applied than when the steady-state gain is applied. large. That is, the amount of heat generated by the rubber heater 65 is greater when the startup gain is applied than when the steady-state gain is applied. Therefore, the time required for the temperature in the predetermined region 81 to converge to the first target temperature or the second target temperature by feedback control is greater when the startup gain is applied and when the steady-time gain is applied. Shorter than. On the other hand, the error between the temperature in the predetermined region 81 and the first target temperature or the second target temperature when the duty ratio is determined based on feedback control is more constant when the startup gain is applied. It becomes larger than the case where the constant gain is applied. That is, when the steady-state gain is applied, the temperature in the predetermined region 81 approaches the first target temperature or the second target temperature with higher accuracy than when the startup gain is applied.

  The start-up temperature range is a temperature range that is valid for the second target temperature until the inspection start operation is detected by the process of S11 described later. The temperature range at start-up is ± 3 degrees as an example. The constant temperature range is a temperature range that is valid for the first target temperature that is effective after an inspection start operation is detected by the process of S11 described later. The startup temperature range is equal to or higher than the steady-state temperature range. The constant temperature range is ± 1 degree as an example. The spindle rotation speed is the rotation speed of the spindle 57 per unit time. The spindle rotation speed is 300 rpm as an example. The starting temperature range is not limited to ± 3 degrees, but may be other values. The constant temperature range is not limited to ± 1 degree, and may be other values. The number of rotations of the main shaft is not limited to 300 rpm and may be other values.

<4-2. First Embodiment of Inspection Method (Process Flow)>
When the CPU 91 detects that the power switch of the operation unit 94 is turned on, the CPU 91 starts the first main process shown in FIG. 4 based on the control program stored in the program ROM 95. Whether or not the inspection chip 2 is mounted on the holder 61 when the first main process is started is undefined. The CPU 91 reads the first target temperature and the second target temperature stored in the flash memory 93 (S1). The CPU 91 reads the startup gain stored in the flash memory 93 (S2). The CPU 91 reads the startup temperature range stored in the flash memory 93 (S3).

  The CPU 91 starts the feedback control by applying the first target temperature read by the process of S1 and the start-up gain read by the process of S2. Thereby, heat generation of the rubber heater 65 is started, and temperature adjustment in the predetermined area 81 is started (S4). More details are as follows. The CPU 91 acquires the temperature detected by the temperature sensor 77. CPU91 sets the 1st target temperature read by the process of S1 as the target temperature in feedback control. The CPU 91 applies a startup gain to the temperature deviation between the acquired temperature and the first target temperature, and determines the duty ratio of the current to be passed through the rubber heater 65 based on feedback control. The CPU 91 causes the rubber heater 65 to generate heat by causing a current to flow through the rubber heater 65 at the determined duty ratio. For example, the CPU 91 applies a voltage according to the duty ratio to the semiconductor switch that controls the rubber heater 65. As a result, the current passed through the rubber heater 65 also follows the duty ratio. CPU91 acquires the temperature detected by temperature sensor 77 with a fixed period, and repeats processing. Thus, the CPU 91 adjusts the heat generation temperature of the rubber heater 65 and brings the temperature in the predetermined area 81 close to the first target temperature.

  The CPU 91 determines whether or not the temperature acquired from the temperature sensor 77 is within the startup temperature range with respect to the first target temperature (S5). Hereinafter, “determining whether the temperature is within the startup temperature range with respect to the first target temperature” is simply referred to as “determining whether the temperature is within the startup temperature range”. If the CPU 91 determines that the acquired temperature is within the startup temperature range (S5: YES), the process proceeds to S9. When the CPU 91 determines that the acquired temperature is outside the startup temperature range (S5: NO), the CPU 91 reads the spindle speed stored in the flash memory 93. The CPU 91 sets the read spindle rotational speed in the revolution controller 97 and starts the rotation of the spindle 57 (S6). The turntable 33 and the holder 61 start to rotate according to the spindle rotation speed. When the holder 61 is rotated, that is, the main shaft 57 is rotated, the air in the predetermined area 81 heated by the rubber heater 65 is agitated.

  The CPU 91 acquires the temperature detected by the temperature sensor 77. The CPU 91 determines whether or not the acquired temperature is within the startup temperature range (S7). If the CPU 91 determines that the acquired temperature is outside the startup temperature range (S7: NO), the process returns to S7. The CPU 91 continues the rotation of the main shaft 57 and continuously stirs the air in the predetermined area 81. When the CPU 91 determines that the acquired temperature is within the startup temperature range (S7: YES), the CPU 91 stops the rotation of the spindle motor 35 (S8). As a result, the turntable 33 and the holder 61 stop rotating. The CPU 91 reads the steady-state gain stored in the flash memory 93 (S9). The CPU 91 changes the proportional gain in the feedback control started by the process of S4 from the startup gain to the steady gain (S9). The CPU 91 reads the normal temperature range from the flash memory 93 (S10).

  In addition, after the process of S8 is complete | finished, for example, CPU91 cancels | releases the lock | rock of the cover member 11B, and makes the test | inspection chip 2 in the state in which the sample and the reagent were inject | poured into the holder 61 possible state. For example, after the process of S <b> 8 ends, the CPU 91 starts detecting an inspection start operation for the operation unit 94.

  The CPU 91 determines whether it is detected that an inspection start operation has been performed on the operation unit 94 (S11). If the CPU 91 determines not to detect that the inspection start operation has been performed (S11: NO), the process proceeds to S16. CPU91 acquires temperature detected by temperature sensor 77, when it is judged that it was detected that inspection start operation was performed to operation part 94 (S11: YES). The CPU 91 determines whether or not the acquired temperature is within a normal temperature range with respect to the first target temperature (S12). Hereinafter, “determining whether the first target temperature is within the steady-state temperature range” is simply referred to as “determining whether the first target temperature is within the steady-state temperature range”. When the CPU 91 determines that the acquired temperature is outside the normal temperature range (S12: NO), the CPU 91 returns the process to S12. When the CPU 91 determines that the acquired temperature is within the steady-state temperature range (S12: YES), the CPU 91 lowers the target temperature in the feedback control started by the process of S4 from the first target temperature to the second target temperature (S13). ).

  The CPU 91 starts an inspection process (S14). The outline of the inspection process is as follows. As shown in FIG. 3, the CPU 91 reads motor drive information stored in advance in the flash memory 93, sets the drive information of the spindle motor 35 in the revolution controller 97, and drives the stepping motor 51 in the rotation controller 98. Set. The CPU 91 controls the revolution controller 97 to start driving the spindle motor 35. As a result, the holder 61 and the inspection chip 2 revolve. Further, the CPU 91 controls the rotation controller 98 and drives the stepping motor 51. As a result, the holder 61 and the inspection chip 2 rotate. A centrifugal force in a direction corresponding to the rotation angle acts on the holder 61 and the inspection chip 2. The specimen and reagent in the test chip 2 move along the liquid flow path by the action of the centrifugal force. The specimen and the reagent are quantified and mixed in the process of moving in the liquid channel. The liquid mixture moves to the measurement unit 293 by the action of centrifugal force and is stored in the measurement unit 293.

  The CPU 91 controls the revolution controller 97 to rotate the inspection chip 2 to the angle of the measurement position. The CPU 91 controls the measurement unit 7 to cause the light source 71 to emit light. The measurement light 70 is applied to the measurement unit 293 of the inspection chip 2 through the hole 80D of the case 80. The measurement light 70 passes through the mixed liquid stored in the measurement unit 293 and the hole 61A of the holder 61, and is received by the optical sensor 72 through the hole 80E of the case 80. The CPU 91 performs optical measurement of the liquid mixture based on the amount of change of the measurement light 70 received by the optical sensor 72 and acquires measurement data. CPU91 calculates the measurement result of a liquid mixture based on the acquired measurement data. The measurement result is stored in the flash memory 93. In addition, the measuring method of a liquid mixture is not restricted to an optical measurement, Another method may be sufficient.

  As shown in FIG. 4, the CPU 91 ends the above-described inspection process (S15). The CPU 91 determines whether it is detected that the power switch of the operation unit 94 is turned off (S16). If the CPU 91 determines not to detect that the power switch has been turned off (S16: NO), the process returns to S9. When the CPU 91 determines that the power switch is turned off (S16: YES), the CPU 91 ends the feedback control started by the process of S4. Thereby, the CPU 91 ends the heat generation of the rubber heater 65 and ends the temperature adjustment in the predetermined area 81 (S17). The CPU 91 ends the first main process.

<5-1. Second Embodiment of Inspection Method (Parameter)>
In the second embodiment, the first target temperature, the second target temperature, the startup temperature range, the steady temperature range, the steady gain, and the parameter table 931 shown in FIG. The first target temperature, the second target temperature, the startup temperature range, the steady-state temperature range, and the steady-state gain are the same as those in the first embodiment described above, and a description thereof will be omitted.

  The parameter table 931 will be described with reference to FIG. In the parameter table 931, the starting rotation speed, the steady rotation speed, and the starting gain are associated with the temperature deviation. The rotational speed at start-up is the rotational speed per unit time of the main shaft 57 that is effective until the processing of S38 shown in FIG. The startup rotation speed includes a startup rotation speed when the inspection chip 2 is mounted on the holder 61 and a startup rotation speed when the inspection chip 2 is not mounted on the holder 61. Hereinafter, the rotation speed at the start-up in a state where the inspection chip 2 is mounted on the holder 61 is referred to as “chip rotation speed”. The rotation speed at the start-up when the inspection chip 2 is not attached to the holder 61 is referred to as “chip non-rotation speed”. The temperature deviation indicates a value obtained by subtracting the temperature in the predetermined region 81 detected by the temperature sensor 77 from the first target temperature. The constant rotational speed is the rotational speed per unit time of the main shaft 57 that is effective after the processing of S38 shown in FIG.

  The tip rotation speed decreases as the temperature deviation approaches zero. That is, the chip rotation speed is proportional to the absolute value of the temperature deviation. The non-rotating speed of the chip is 600 rpm when the temperature deviation is 3 degrees or more and less than 6 degrees, and is 800 rpm when the temperature deviation is 6 degrees or more. The non-rotating speed of the chip is 800 rpm when the temperature deviation is -6 degrees or more and less than -3 degrees, and 1000 rpm when the temperature deviation is smaller than -6 degrees. When the corresponding temperature deviations are the same, the chip rotation speed is greater than the chip non-rotation speed.

  The constant rotation speed is 300 rpm when the temperature deviation is 0 degree or more and less than 3 degrees, and 500 rpm when the temperature deviation is 3 degrees or more. The constant rotation speed is 400 rpm when the temperature deviation is -3 degrees or more and less than 0 degrees, and 550 rpm when the temperature deviation is smaller than -3 degrees. For example, 550 rpm, which is the maximum value of the constant rotational speed, is smaller than, for example, 600 rpm, which is the minimum value of the rotational speed at startup. That is, the steady-state rotation speed is smaller than the startup rotation speed.

  Start-up gains K1 to K5 are associated with a temperature deviation of 0 degrees or more. The startup gains K1 to K5 have a magnitude relationship of K1> K2> K3> K4> K5. The startup gain increases as the temperature deviation increases in the positive direction. As the startup gain increases, the duty ratio of the current flowing through the rubber heater 65, which is determined based on the feedback control, becomes relatively large. Therefore, the amount of heat generated by the rubber heater 65 becomes relatively larger as the temperature deviation is larger. On the other hand, the larger the start-up gain, the greater the error between the temperature in the predetermined region 81 and the first target temperature or the second target temperature when feedback control is performed. That is, the temperature within the predetermined region 81 approaches the first target temperature or the second target temperature with accuracy as the temperature deviation is smaller. The steady-state gain is equal to or less than the startup gain K5. That is, any of the startup gains K1 to K5 is equal to or greater than the steady-state gain. Information indicating that no current flows through the rubber heater 65 is associated with the temperature deviation of less than 0 degrees instead of the startup gain, and the heater OFF is shown in FIG.

  The startup rotation speed is not associated with a temperature deviation of −3 degrees or more and less than 3 degrees. The reason is that since the temperature range at the time of startup is ± 3 degrees, the CPU 31 does not need to rotate the spindle 57 when the temperature deviation is not less than −3 degrees and less than 3 degrees. Each parameter in the parameter table 931 shown in FIG. 5 is an example, and other values may be used.

<5-2. Second Embodiment of Inspection Method (Process Flow)>
When the CPU 91 detects that the power switch of the operation unit 94 is turned on, the CPU 91 starts the second main process shown in FIG. 6 based on the control program stored in the program ROM 95. Whether or not the inspection chip 2 is mounted on the holder 61 when the second main process is started is undefined. The CPU 91 reads the first target temperature and the second target temperature stored in the flash memory 93 (S21).

  The CPU 91 acquires the temperature detected by the temperature sensor 77. The CPU 91 subtracts the acquired temperature from the first target temperature to calculate a temperature deviation. The CPU 91 reads a startup gain corresponding to the calculated temperature deviation in the parameter table 931 stored in the flash memory 93 (S22). As shown in FIG. 5, information indicating that no current is passed through the rubber heater 65 is associated with a temperature deviation of less than 0 degrees instead of the startup gain. Therefore, when the calculated temperature deviation is less than 0 degrees, the CPU 91 reads information indicating that no current is passed through the rubber heater 65 as a startup gain. The CPU 91 reads the startup temperature range stored in the flash memory 93 (S23).

  The CPU 91 starts feedback control based on the first target temperature read by the process of S21 and the startup gain read by the process of S22. Thereby, heat generation of the rubber heater 65 is started, and temperature adjustment in the predetermined area 81 is started (S24). Details of the feedback control are the same as those in the first embodiment described above, and a description thereof will be omitted. Note that when the CPU 91 reads information indicating that no current is allowed to flow through the rubber heater 65 as the startup gain, the CPU 91 does not execute the feedback control and does not cause the rubber heater 65 to generate heat. That is, when the temperature acquired from the temperature sensor 77 is higher than the first target temperature, the CPU 91 does not execute feedback control and does not cause the rubber heater 65 to generate heat.

  The CPU 91 determines whether or not the temperature acquired from the temperature sensor 77 is within the startup temperature range (S25). If the CPU 91 determines that the acquired temperature is within the startup temperature range (S25: YES), the process proceeds to S32. When the CPU 91 determines that the acquired temperature is outside the startup temperature range (S25: NO), the CPU 91 determines whether the test chip 2 is mounted on the holder 61 as follows (S26). As shown in FIG. 3, the CPU 91 controls the revolution controller 97 to rotate the inspection chip 2 to the angle of the measurement position. The CPU 91 controls the measurement unit 7 to emit measurement light 70 from the light source 71. The measuring light 70 is received by the optical sensor 72. The CPU 91 acquires the intensity of the measurement light 70 received by the optical sensor 72. The CPU 91 determines that the test chip 2 is not attached to the holder 61 when the intensity of the acquired measurement light 70 is greater than a predetermined threshold value. If the intensity of the acquired measurement light 70 is equal to or less than the predetermined threshold value, the holder It is determined that the inspection chip 2 is attached to 61.

  As shown in FIG. 6, the CPU 91 acquires the temperature detected by the temperature sensor 77. The CPU 91 subtracts the acquired temperature from the first target temperature to calculate a temperature deviation (S27). If the CPU 91 determines that the inspection chip 2 is attached to the holder 61 by the process of S26, the CPU 91 has a chip corresponding to the calculated temperature deviation among the rotation speeds of the chip in the parameter table 931 stored in the flash memory 93. The rotational speed is read as the rotational speed at startup (S28). If the CPU 91 determines that the inspection chip 2 is not attached to the holder 61 by the process of S26, the CPU 91 corresponding to the calculated temperature deviation out of the non-rotation speed of the chip in the parameter table 931 stored in the flash memory 93. The rotational speed is read as the rotational speed at startup (S28). The CPU 91 sets the read rotation speed at the start in the revolution controller 97 and starts the rotation of the main shaft 57 (S29). The turntable 33 and the holder 61 start to rotate according to the number of rotations at startup. When the holder 61 is rotated, that is, the main shaft 57 is rotated, the air in the predetermined area 81 heated by the rubber heater 65 is agitated.

  The CPU 91 acquires the temperature detected by the temperature sensor 77. The CPU 91 determines whether or not the acquired temperature is within the startup temperature range (S30). If the CPU 91 determines that the acquired temperature is outside the startup temperature range (S30: NO), the process returns to S27. The CPU 91 continues the rotation of the main shaft 57 and continuously stirs the air in the predetermined area 81 while changing the rotational speed at startup according to the temperature detected by the temperature sensor 77.

  When the CPU 91 determines that the acquired temperature is within the startup temperature range (S30: YES), the CPU 91 stops the rotation of the spindle motor 35 (S31). As a result, the turntable 33 and the holder 61 stop rotating. The CPU 91 reads the steady-state gain stored in the flash memory 93 (S32). The CPU 91 changes the proportional gain in the feedback control started by the process of S24 from the startup gain to the steady gain (S32). The CPU 91 reads the normal temperature range from the flash memory 93 (S33).

  In addition, after the process of S33 is completed, for example, the CPU 91 releases the lock of the lid member 11B so that the test chip 2 in a state where the sample and the reagent are injected can be attached to the holder 61. Further, for example, after the processing of S <b> 33 is completed, the CPU 91 starts detecting an inspection start operation for the operation unit 94.

  The CPU 91 determines whether it has been detected that an inspection start operation has been performed on the operation unit 94 (S34). If the CPU 91 determines not to detect that the inspection start operation has been performed (S34: NO), the process proceeds to S44. CPU91 acquires temperature detected by temperature sensor 77, when it is judged that it was detected that inspection start operation was performed to operation part 94 (S34: YES). The CPU 91 determines whether or not the acquired temperature is within the steady-state temperature range (S35). If the CPU 91 determines that the acquired temperature is within the steady-state temperature range (S35: YES), the process proceeds to S41.

  When the CPU 91 determines that the acquired temperature is outside the steady-state temperature range (S34: NO), the CPU 91 acquires the temperature detected by the temperature sensor 77. The CPU 91 subtracts the acquired temperature from the first target temperature to calculate a temperature deviation (S36). The CPU 91 reads the steady-state rotational speed corresponding to the calculated temperature deviation among the steady-state rotational speeds of the parameter table 931 stored in the flash memory 93 (S37). The CPU 91 sets the read normal rotation speed in the revolution controller 97, and starts the rotation of the main shaft 57 (S38). The turntable 33 and the holder 61 start to rotate according to the normal rotation speed. When the holder 61 is rotated, that is, the main shaft 57 is rotated, the air in the predetermined region 81 is agitated.

  The CPU 91 acquires the temperature detected by the temperature sensor 77. The CPU 91 determines whether or not the acquired temperature is within the normal temperature range (S39). When the CPU 91 determines that the acquired temperature is outside the normal temperature range (S39: NO), the CPU 91 returns the process to S36. The CPU 91 continues the rotation of the main shaft 57 while changing the steady-state rotation speed according to the temperature detected by the temperature sensor 77, and continuously stirs the air in the predetermined area 81.

  When the CPU 91 determines that the acquired temperature is within the normal temperature range (S39: YES), the CPU 91 stops the rotation of the spindle motor 35 (S40). The CPU 91 lowers the target temperature in the feedback control started by the process of S24 from the first target temperature to the second target temperature (S41).

  Since the processes of S42 and S43 are the same as the processes of S14 and S15 of the first embodiment, respectively, the description thereof is omitted. After the process of S43, the CPU 91 determines whether it is detected that the power switch of the operation unit 94 is turned off (S44). If the CPU 91 determines not to detect that the power switch has been turned off (S44: NO), it returns the process to S32. When the CPU 91 determines that the power switch is turned off (S44: YES), the CPU 91 ends the feedback control started by the process of S24. Thus, the CPU 91 ends the heat generation of the rubber heater 65 and ends the temperature adjustment in the predetermined area 81 (S45). The CPU 91 ends the second main process.

<6. Main actions and effects of this embodiment>
As described above, in the inspection apparatus 1, the inspection chip 2 is held by the holder 61 with the thickness direction of the inspection chip 2 extending in the front-rear direction and the left-right direction. The holder 61 revolves around the vertical axis A <b> 1 as the spindle motor 35 rotationally drives the turntable 33. Further, the holder 61 rotates about the horizontal axis A2 as the stepping motor 51 moves the inner shaft 40 up and down. The CPU 91 detects that the inspection start operation has been performed on the operation unit 94 (S11: YES, S34: YES), and then the temperature in the predetermined area 81 falls within the steady-state temperature range (S12: YES, Prior to S35: YES, heat generation of the rubber heater 65 is started (S4, S24), and the main shaft 57 is rotated (S6, S29). As the rubber heater 65 generates heat, the air in the predetermined area 81 is warmed. As the holder 61 revolves according to the rotation of the main shaft 57, the heated air in the predetermined area 81 is agitated.

  Note that the direction in which the thickness direction of the test chip 2 revolves in the front-rear direction and the left-right direction is higher in the vertical direction of the rotation range of the test chip 2 and the holder 61 than in the case where the test chip 2 revolves in the vertical direction. The size of is relatively large. For this reason, the size of the predetermined region 81 including the rotation region is also increased in the vertical direction, and a temperature distribution is easily generated in the predetermined region 81. On the other hand, the CPU 91 rotates the holder 61 while heating the rubber heater 65 before the inspection process (S14, S42) is started. For this reason, the CPU 91 can suppress the temperature distribution in the predetermined area 81 even when the predetermined area 81 is relatively large in the vertical direction. Therefore, the CPU 91 can make the temperature in the vertical direction of the inspection chip 2 mounted on the holder 61 uniform. In addition, by stirring the air in the predetermined region 81, the temperature around the measurement unit 293 of the inspection chip 2 disposed above the rubber heater 65 can be raised in a short time.

  After starting the heat generation of the rubber heater 65 (S4, S24), the CPU 91 determines whether or not the temperature in the predetermined area 81 is within the startup temperature range (S5, S25). When the CPU 91 determines that the temperature in the predetermined area 81 is outside the startup temperature range (S5: NO, S25: NO), the CPU 91 starts the rotation of the main shaft 57 (S6, S29). When the CPU 91 determines that the temperature in the predetermined area 81 is within the startup temperature range (S7: YES, S30: YES), the CPU 91 stops the rotation of the spindle 57 (S8, S31). Here, the startup temperature range is equal to or higher than the steady-state temperature range. For this reason, the CPU 91 can reduce the time required for the temperature in the predetermined area 81 to be within the temperature range at startup to be equal to or less than the time required for the temperature in the predetermined area 81 to be within the normal temperature range. It is possible to shorten the time until the operation can be accepted (S11, S34). The CPU 91 determines whether the temperature in the predetermined area 81 is within the steady-state temperature range after the temperature in the predetermined area 81 is within the startup temperature range (S12, S35, S39). Thus, the CPU 91 can appropriately set the temperature in the predetermined area 81 within the steady-state temperature range by controlling the temperature in the predetermined area 81 in a stepwise manner.

  The CPU 91 sets the proportional gain in the feedback control as the startup gain until the temperature in the predetermined area 81 falls within the startup range. When the CPU 91 determines that the temperature in the predetermined area 81 is within the startup range (S5: YES, S7: YES, S25: YES, S30: YES), the proportional gain in the feedback control is changed from the startup gain to the steady-state gain. (S9, S32). The amount of heat generated by the rubber heater 65 is greater when the startup gain is applied than when the steady-state gain is applied. For this reason, the CPU 91 can bring the temperature in the predetermined region 81 into the start-up range in a short time by causing the rubber heater 65 to generate heat according to a relatively large amount of heat generation. Further, the CPU 91 generates heat of the rubber heater 65 when the temperature in the predetermined area 81 is within the starting time range, and when the rubber heater 65 is further heated so that the temperature in the predetermined area 81 is within the normal time range. Make the amount relatively small. As a result, the CPU 91 can reduce the error between the temperature in the predetermined area 81 and the first target temperature, so that the rubber heater 65 can bring the temperature in the predetermined area 81 close to the first target temperature with high accuracy.

  Based on the temperature deviation between the temperature detected by the temperature sensor 77 and the first target temperature, the CPU 91 reads the rotational speed at startup with reference to the parameter table 931 (S28). The CPU 91 agitates the air in the predetermined area 81 by rotating the main shaft 57 at the read start-up rotation speed. Thus, the CPU 91 can adjust the degree of stirring according to the temperature deviation, so that the temperature in the predetermined area 81 can be efficiently within the startup range. Further, the CPU 91 applies the start-up gain specified with reference to the parameter table 931 based on the temperature deviation between the temperature detected by the temperature sensor 77 and the first target temperature to the feedback control. As a result, the CPU 91 can adjust the amount of heat generated by the rubber heater 65 in accordance with the temperature deviation, so that the temperature in the predetermined region 81 can be efficiently within the startup range.

  In the parameter table 931, the greater the absolute value of the temperature deviation, the greater the starting rotation speed. As the rotational speed at startup increases, the air in the predetermined region 81 is better agitated. Therefore, the CPU 91 can make the time until the temperature in the predetermined area 81 falls within the startup range constant regardless of the temperature deviation. Also, in the parameter table 931, the heat gain of the rubber heater 65 increases when applied to feedback control as the startup gain has a larger absolute value of temperature deviation. Therefore, the CPU 91 can make the time until the temperature in the predetermined area 81 falls within the startup range constant regardless of the temperature deviation.

  When the temperature deviation is less than −0 degrees, specifically, when the temperature in the predetermined area 81 is higher than the first target temperature, the CPU 91 rotates only the main shaft 57 without causing the rubber heater 65 to generate heat. The air in the region 81 is agitated. Thus, the CPU 91 can cool the inside of the predetermined area 81 when the temperature in the predetermined area 81 is too high.

  When the CPU 91 determines that the inspection chip 2 is attached to the holder 61, the CPU 91 reads the chip rotation speed in the parameter table 931 (S28). When the CPU 91 determines that the inspection chip 2 is not attached to the holder 61, the CPU 91 reads the chip non-rotation number in the parameter table 931 (S28). The chip rotation speed is larger than the chip non-rotation speed. In addition, when the holder 61 revolves in the state where the test | inspection chip 2 is not mounted | worn, the gravity center balance of rotation may worsen. In this case, compared with the case where the holder 61 revolves with the inspection chip 2 mounted, abnormal vibration may be induced or rotation may become unstable. On the other hand, the CPU 91 determines the rotation speed of the main shaft 57 when the inspection chip 2 is not attached to the holder 61 (the rotation speed of the chip), and the rotation of the main spindle 57 when the inspection chip 2 is attached to the holder 61. Less than the number (the number of rotations with the chip). Therefore, even when the inspection chip 2 is not attached to the holder 61, the CPU 91 can stably rotate the holder 61 at an appropriate number of rotations and appropriately agitate the inside of the predetermined area 81.

  After detecting that the inspection start operation has been performed (S34: YES), the CPU 91 determines that the temperature in the predetermined area 81 is out of the steady-state range (S35: NO), which is smaller than the rotation speed at startup. The main shaft 57 is rotated at a constant rotational speed (S38). As a result, the CPU 91 relatively reduces the centrifugal force acting on the inspection chip 2. Therefore, the CPU 91 can suppress the movement of the sample and reagent in the test chip 2 mounted on the holder 61 in the liquid flow path of the test chip 2 due to centrifugal force.

  In the inspection apparatus 1, it is preferable to directly attach the thermistor 77 </ b> A of the temperature sensor 77 to the inspection chip 2 and directly measure the temperature of the mixed liquid stored in the measurement unit 293. However, since the inspection chip 2 rotates during the inspection process, the thermistor 77A cannot be directly attached to the inspection chip 2. On the other hand, in the inspection apparatus 1, the height of the thermistor 77 </ b> A of the temperature sensor 77 is made equal to the height of the measurement unit 293 of the inspection chip 2 supported by the holder 61. In this case, even when a temperature distribution occurs in the height direction within the predetermined region 81, the temperature sensor 77 can detect the temperature of the liquid mixture stored in the measurement unit 293 of the test chip 2 with high accuracy.

  The inspection apparatus 1 can heat the inside of the predetermined area 81 with the rubber heater 65 but cannot cool the inside of the predetermined area 81. For this reason, it is preferable that the temperature in the predetermined area 81 is always lower than the first target temperature. On the other hand, after detecting that the inspection start operation has been performed (S11: YES, S34: YES), the CPU 91 determines that the temperature in the predetermined area 81 is within the steady-state range, The temperature to be reduced is lowered from the first target temperature to a second target temperature lower than the first target temperature (S13, S41). Thus, the CPU 91 can appropriately suppress the temperature of the predetermined area 81 from becoming higher than the first target temperature.

  The CPU 91 adjusts the temperature in the predetermined area 81 by P control. Thereby, when the temperature in the predetermined region 81 rises, the phenomenon of exceeding the first target temperature or the second target temperature, so-called overshoot, can be suppressed.

<7. Other>
The present invention is not limited to the above embodiment, and various modifications can be made. In the above embodiment, the rubber heater 65 is provided in the predetermined area 81 and on the upper side of the upper plate 32. On the other hand, the rubber heater 65 may be provided below the upper surface portion 80B of the case. The rubber heater 65 may be provided on both the upper side of the upper plate 32 and the lower side of the upper surface portion 80B of the case.

  In the above embodiment, the thermistor 77 </ b> A of the temperature sensor 77 is provided at a height equal to the height of the measurement unit 293 of the inspection chip 2 supported by the holder 61. The thermistor 77 </ b> A of the temperature sensor 77 may not be exactly equal to the height of the measurement unit 293 of the inspection chip 2 supported by the holder 61. The thermistor 77 </ b> A may be provided at a position higher than the height of the measurement unit 293, or may be provided at a position lower than the height of the measurement unit 293. Specifically, the thermistor 77 </ b> A may be provided within a range of ± 5 mm with respect to the height of the measurement unit 293. However, depending on the shape and material of the inspection chip 2, the length of the optical measurement time, etc., it may not be limited to ± 5 mm. Desirably, the thermistor 77A may be provided within a range of ± 1 ° C. with respect to the temperature at the height of the measuring unit 293. Said feedback control is not limited to P control, PI control or PID control may be sufficient.

  In the above embodiment, the CPU 91 determines the duty ratio of the current to be passed through the rubber heater 65 by feedback control, and adjusts the temperature of the rubber heater 65. The CPU 91 may determine another parameter by feedback control and adjust the temperature of the rubber heater 65. For example, the CPU 91 may adjust the current passed through the rubber heater 65 by PAM control. That is, the CPU 91 may adjust the temperature of the rubber heater 65 by switching the magnitude of the current and allowing it to flow through the rubber heater 65. The CPU 91 applies a start-up gain or a steady-state gain to the temperature deviation between the temperature acquired from the temperature sensor 77 and the first target temperature, and determines the magnitude of the current passed through the rubber heater 65 based on feedback control. May be.

  In the second embodiment, the CPU 91 refers to the parameter table 931 and changes the starting rotation speed and the starting gain in accordance with the temperature deviation. The CPU 91 may refer to the parameter table 931 and change either the starting rotation speed or the starting gain according to the temperature deviation. For example, when changing the rotational speed at startup according to the temperature deviation, the CPU 91 may set the startup gain to a constant value regardless of the temperature deviation. On the other hand, for example, when the startup gain is changed according to the temperature deviation, the CPU 91 may set the startup rotational speed to a constant value regardless of the temperature deviation.

  In the parameter table 931, the non-rotation speed of the chip is constant at 800 rpm when the temperature deviation is 6 degrees or more, and constant at 1000 rpm when the temperature deviation is less than −6 degrees. The tip non-rotational speed may be set to a larger value as the absolute value of the temperature deviation increases. That is, the tip non-rotation speed may be proportional to the absolute value of the temperature deviation, similar to the tip rotation speed. In the parameter table 931, the chip rotation speed is proportional to the temperature deviation. The chip rotation speed may be a constant value as in the case of the chip non-rotation speed when the temperature deviation is equal to or greater than a predetermined value or less than the predetermined value.

  In the above embodiment, a Peltier element may be provided instead of the rubber heater 65 provided in the predetermined region 81. The Peltier element may cool the inside of the predetermined area 81. Further, both the rubber heater 65 and the Peltier element may be provided in the predetermined region 81. The CPU 91 may perform heating or cooling in the predetermined area 81 by using the rubber heater 65 and the Peltier element. When the temperature in the predetermined area 81 is higher than the startup range, the CPU 91 may cool the predetermined area 81 with the Peltier element without causing the rubber heater 65 to generate heat, and stir the air in the predetermined area 81. Good. In this case, the CPU 91 does not have to lower the target temperature in the feedback control from the first target temperature to the second target temperature by the process of S13 or S41. Further, a known heater may be provided in place of the rubber heater 65. The well-known heater may have a heating line exposed.

  When the temperature detected by the temperature sensor 77 is determined to be outside the startup temperature range by the process of S30 of the second embodiment (S30: NO), the CPU 91 may return the process to S30. That is, the CPU 91 may continuously rotate the main shaft 57 at the starting rotation speed read in the process of S28 and continuously agitate the air in the predetermined area 81. If the temperature detected by the temperature sensor 77 is determined to be outside the normal temperature range by the process of S39 of the second embodiment (S39: NO), the CPU 91 may return the process to S39. That is, the CPU 91 may continuously rotate the main shaft 57 at the normal rotation speed read in the process of S37 and continuously agitate the air in the predetermined area 81.

  By the process of S26 of the second embodiment, the method for determining whether or not the inspection chip 2 is mounted on the holder 61 can be changed. For example, the holder 61 may be provided with a switch (not shown). The switch may be turned off when the inspection chip 2 is not attached to the holder 61 and may be turned on when the inspection chip 2 is attached to the holder 61. The CPU 91 may determine whether or not the inspection chip 2 is attached to the holder 61 by detecting ON / OFF of the switch. Further, for example, infrared light may be incident on the hole 80D of the case 80, and the infrared light output from the hole 80E may be detected by a sensor. The CPU 91 may determine whether or not the inspection chip 2 is attached to the holder 61 according to the intensity of infrared rays detected by the sensor.

  In the second embodiment, the CPU 91 may rotate the main shaft 57 at a common rotational speed corresponding to the temperature deviation regardless of whether or not the inspection chip 2 is attached to the holder 61. The constant rotation speed may be the same as the startup rotation speed or may be larger than the startup rotation speed.

  In the above, CPU91 determined duty ratio based on feedback control by the process of S4 in 1st Embodiment, or the process of S24 in 2nd Embodiment. The CPU 91 passes the current of the duty ratio according to the temperature deviation through the rubber heater 65 until the feedback control is terminated by the process of S17 in the first embodiment or the process of S45 in the second embodiment. The temperature in the predetermined area 81 was adjusted. On the other hand, the CPU 91 may determine the duty ratio by a method other than the feedback control. Specifically, it is as follows.

  For example, data in which a duty ratio is associated with each of a plurality of temperature deviations may be stored in the flash memory 93. As a specific example of the data, for example, the duty ratio “0%” may be associated with the temperature deviation “+0.25 degrees or more”. The duty ratio “10%” may be associated with the temperature deviation “± 0.25 degrees”. The duty ratio “20%” may be associated with the temperature deviation “−0.25 to −0.75 degrees”. The duty ratio “30%” may be associated with the temperature deviation “−0.75 to −1.25 degrees”. The duty ratio “40%” may be associated with the temperature deviation “−1.25 to −1.75 degrees”. The duty ratio “50%” may be associated with the temperature deviation “−1.75 to −2.25 degrees”. The duty ratio “60%” may be associated with the temperature deviation “−2.25 to −2.75 degrees”. The duty ratio “70%” may be associated with the temperature deviation “−2.75 to −3.25 degrees”. The duty ratio “80%” may be associated with the temperature deviation “−3.25 to −3.75 degrees”. The duty ratio “90%” may be associated with the temperature deviation “−3.75 to −4.25 degrees”. The duty ratio “100%” may be associated with the temperature deviation “−4.25 degrees or less”.

  When the CPU 91 determines that the temperature acquired from the temperature sensor 77 is out of the startup temperature range by the process of S7 in the first embodiment or the process of S30 in the second embodiment (S7: NO or S30: NO), a temperature deviation between the acquired temperature and the first target temperature may be calculated. The CPU 91 may specify a duty ratio corresponding to the calculated temperature deviation based on the above data. The CPU 91 may adjust the temperature in the predetermined area 81 by causing the current having the specified duty ratio to flow through the rubber heater 65.

  When the CPU 91 determines that the temperature acquired from the temperature sensor 77 is outside the steady-state temperature range by the process of S12 in the first embodiment (S12: NO), the CPU 91 calculates a temperature deviation between the acquired temperature and the first target temperature. May be. The CPU 91 may specify a duty ratio corresponding to the calculated temperature deviation based on the above data. The CPU 91 may adjust the temperature in the predetermined area 81 by causing the current having the specified duty ratio to flow through the rubber heater 65.

  After calculating the temperature deviation by the process of S36 in the second embodiment, the CPU 91 may specify the duty ratio corresponding to the calculated temperature deviation based on the above data. The CPU 91 may adjust the temperature in the predetermined area 81 by causing the current having the specified duty ratio to flow through the rubber heater 65.

  The CPU 91 may acquire the temperature from the temperature sensor 77 after starting the inspection process by the process of S14 in the first embodiment or the process of S42 in the second embodiment. The CPU 91 may calculate a temperature deviation between the acquired temperature and the first target temperature. The CPU 91 may specify a duty ratio corresponding to the calculated temperature deviation based on the above data. The CPU 91 may adjust the temperature in the predetermined area 81 by causing the current having the specified duty ratio to flow through the rubber heater 65.

  The spindle motor 35 and the stepping motor 51 are examples of the “centrifugal mechanism” of the present invention. The support shaft 473 is an example of the “swing shaft” in the present invention. The rubber heater 65 is an example of the “temperature adjusting mechanism” in the present invention. The CPU 91 that performs the processes of S11 and S34 is an example of the “accepting means” in the present invention. The CPU 91 that performs the processes of S12 and S35 is an example of the “first determination unit” in the present invention. The constant temperature range is an example of the “first range” in the present invention. The first target temperature and the second target temperature are examples of the “target temperature” in the present invention. The CPU 91 that performs the processes of S4, S6, S24, and S29 is an example of the “control unit” in the present invention. The rotational speed at startup is an example of the “first rotational speed” in the present invention. The CPU 91 that performs the processes of S5 and S25 is an example of the “second determination unit” in the present invention. The startup temperature range is an example of the “second range” in the present invention. The start-up gain or the steady-state gain is an example of the “parameter” in the present invention. The CPU 91 that performs the process of S26 is an example of the “detection means” in the present invention. The constant rotational speed is an example of the “second rotational speed” in the present invention. The CPU 91 that performs the processes of S13 and S41 is an example of the “temperature changing means” in the present invention. The processing of S11 and S34 is an example of the “acceptance step” in the present invention. The processing of S12 and S35 is an example of the “first determination step” in the present invention. The processing of S4, S6, S24, and S29 is an example of the “control step” in the present invention.

1: Inspection device 2: Inspection chip 3: Inspection system 7: Measuring unit 33: Turntable 34: Angle changing mechanism 35: Spindle motor 51: Stepping motor 57: Spindle 61: Holder 65: Rubber heater 70: Measuring light 71: Light source 72: Optical sensor 77: Temperature sensor 80: Case 81: Predetermined area 90: Control device 91: CPU
94: Operation unit 293: Measurement unit 473: Support shaft 931: Parameter table A1: Vertical axis A2: Horizontal axis

Claims (10)

A holder for holding an inspection chip;
Centrifugation that changes the direction of centrifugal force caused by rotation of the main shaft with respect to the holder by rotating the holder about the main shaft and rotating the holder about a swing shaft extending in a direction intersecting the main shaft. Mechanism,
A temperature adjusting mechanism disposed in a predetermined region including at least a rotation range of the holder that rotates around the main shaft by the centrifugal mechanism;
A temperature sensor disposed in the predetermined area;
A receiving means for receiving an instruction to start an inspection;
First determination means for determining whether or not a temperature detected by the temperature sensor is within a first range allowed for a target temperature;
The temperature detected by the temperature sensor before the reception unit receives the instruction to start the inspection and the first determination unit determines that the temperature is within the first range is a range including the target temperature, Second determination means for determining whether or not the second range is wider than the first range;
Control means for causing the temperature adjusting mechanism to generate heat or cool and rotate the spindle at a first rotational speed when the second determination means determines that the temperature is outside the second range. Inspection device to do. The control means includes
When the second determination means determines that the temperature is outside the second range, the temperature adjustment mechanism is caused to generate heat based on a parameter having a relatively large amount of heat generation,
2. The temperature adjustment mechanism according to claim 1 , wherein when the second determination unit determines that the temperature is within the second range, the temperature adjustment mechanism generates heat based on a parameter having a relatively small heat generation amount. Inspection device. The control means controls the spindle to rotate at the first rotational speed based on the difference between the temperature detected by the temperature sensor and the target temperature, and changes the parameter based on the difference, The inspection apparatus according to claim 2 , wherein at least one of control for rotating the main shaft is executed. The control means controls the spindle to rotate at the first rotational speed proportional to the absolute value of the difference, and changes the parameter so that the amount of heat generation is relatively larger as the difference is larger. The inspection apparatus according to claim 3 , wherein at least one of the control for rotating the motor is executed. Wherein if the temperature detected by the temperature sensor is higher than the target temperature, the without heating temperature adjusting mechanism, any one of claims 1 to 4, characterized in that rotating the spindle The inspection device described in 1. Detecting means for detecting whether or not the inspection chip is mounted on the holder;
Wherein, the inspection apparatus according to any one of claims 1-5, characterized in that rotating the main shaft at the first rotation speed based on a detection result of said detecting means. The control means of claims 1 to the case where it is determined not to be the first within range by the first determination means, characterized in that rotating the main shaft at a second rotational speed lower than the first rotational speed 6. The inspection apparatus according to any one of 6 . The temperature sensor, the inspection apparatus according to any one of claims 1 to 7, characterized in that provided at the same height as the height of the vicinity of the measurement portion in the test chip mounted in the holder. After it is determined that the first range by said first determination means, to any of claims 1 to 8, characterized in that it comprises a temperature changing means for heating said temperature adjusting mechanism is lowered the target temperature The inspection device described. By rotating the holder around the main axis and the holder holding the inspection chip, and rotating the holder around the swing axis extending in the direction intersecting the main axis, the centrifugal force due to the rotation of the main axis A centrifugal mechanism that changes a direction with respect to the holder; a temperature adjustment mechanism that is disposed in a predetermined region that includes at least a rotation range of the holder that rotates about the main axis by the centrifugal mechanism; and that is disposed in the predetermined region. In the computer of the inspection device equipped with a temperature sensor,
A reception step for receiving an instruction to start an inspection;
A first determination step of determining whether or not a temperature detected by the temperature sensor is within a first range allowed for a target temperature;
The reception step receives an instruction to start the inspection, and the temperature detected by the temperature sensor before the first determination step determines that it is within the first range, is a range including the target temperature, A second determination step of determining whether or not the second range is wider than the first range;
When it is determined by the second determination step that the temperature is outside the second range, the temperature adjustment mechanism generates or cools, and the control step of rotating the main shaft at a first rotational speed is executed. Inspection program.

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