JP6256242B2 - Table device, measuring device, semiconductor manufacturing device, flat panel display manufacturing device, and machine tool - Google Patents

Description

  The present invention relates to a table device, a measuring device, a semiconductor manufacturing device, a flat panel display manufacturing device, and a machine tool.

  In a technical field related to a measuring device, a semiconductor manufacturing device, a flat panel display manufacturing device, and a machine tool, a table device including a table that can move while supporting an object is used. The table device includes a plurality of members such as a guide member that guides the table and a base member that supports the guide member. If at least a part of the table device is thermally deformed, the positioning accuracy of the table may be insufficient.

  Patent Document 1 discloses a technique for maintaining straightness accuracy by setting the thermal expansion coefficient of the suction rail portion and the thermal expansion coefficient of the base to substantially the same value. Patent Document 2 discloses a technique for improving positioning accuracy by making the thermal expansion coefficient of the slider and the thermal expansion coefficient of the guide rail substantially the same.

JP 2000-136824 A JP 2002-158274 A

  It is effective to pay attention to the thermal expansion coefficient (linear expansion coefficient) of the member in order to suppress insufficient positioning accuracy due to thermal deformation of the member. Focusing on the linear expansion coefficient of the member, it is desired to devise a technique capable of obtaining higher positioning accuracy.

  An object of an aspect of the present invention is to provide a table device, a measuring device, a semiconductor manufacturing device, a flat panel display manufacturing device, and a machine tool that can suppress insufficient positioning accuracy.

  According to a first aspect of the present invention, there is provided a table having a first linear bearing and a second linear bearing, and a first guide member for guiding the first linear bearing of the table in a direction parallel to a first axis within a predetermined plane. A first support member that supports the first guide member, and is movable in a direction parallel to a second axis perpendicular to the first axis within the predetermined plane; and the second axis. A second movable member that includes a second guide member that guides the second linear bearing of the table in a parallel direction and a second support member that supports the second guide member, and is movable in a direction parallel to the first axis. A linear expansion coefficient of the first support member, a linear expansion coefficient of the first guide member B, a linear expansion coefficient of the second support member C, and a linear expansion coefficient of the second guide member. When the coefficient is D A> B, and, C <D, or, A <B, and, C> satisfies D, conditions, provides a table system.

  According to the first aspect of the present invention, the table can be smoothly moved in the direction parallel to the first axis with respect to the first support member by the first linear bearing and the first guide member. The table can be smoothly moved in a direction parallel to the second axis with respect to the second support member by the second linear bearing and the second guide member. Since the first linear bearing is guided in a state of being connected to the first guide member, when the first movable member moves in a direction parallel to the second axis, the table moves together with the first movable member and the second axis. Move in parallel direction. Since the second linear bearing is guided while being connected to the second guide member, when the second movable member moves in a direction parallel to the first axis, the table moves together with the first axis along with the second movable member. Move in parallel direction.

  In the first movable member, when the linear expansion coefficient A of the first support member is larger than the linear expansion coefficient B of the first guide member (when A> B), the first movable member rises when the temperature of the first movable member rises. The member is thermally deformed so that the central portion of the first movable member bends downward. In the second movable member, when the linear expansion coefficient C of the second support member is smaller than the linear expansion coefficient D of the second guide member (when C <D), when the temperature of the second movable member rises, the second movable member The member is thermally deformed so that the central portion of the second movable member bends upward. That is, when A> B and C <D, when the temperature of the first movable member and the temperature of the second movable member rise, the central portion of the first movable member is deformed to bend downward, 2 The center part of the movable member is deformed so as to bend upward. Further, in the case of A> B and C <D, when the temperature of the first movable member and the temperature of the second movable member are lowered, the central portion of the first movable member is deformed so as to bend upward, 2 The center part of the movable member is deformed so as to bend downward.

  That is, when A> B and C <D, when the temperature of the first movable member and the temperature of the second movable member change, one of the first movable member and the second movable member moves downward. The other movable member is deformed so as to bend upward.

  Similarly, in the case of A <B and C> D, when the temperature of the first movable member and the temperature of the second movable member change, one of the first movable member and the second movable member is moved. It is deformed so as to bend downward, and the other movable member is deformed so as to bend upward.

  Thus, the direction in which the first movable member bends is opposite to the direction in which the second movable member bends. For this reason, when one of the first movable member and the second movable member is thermally deformed (bending deformation), the thermal deformation of the one movable member is canceled by the thermal deformation of the other movable member. That is, even if each of the first movable member and the second movable member is thermally deformed due to a temperature change, the thermal deformation is offset.

  The table is connected to the first guide member of the first movable member via the first linear bearing, and is connected to the second guide member of the second movable member via the second linear bearing. Therefore, even if the first movable member and the second movable member are thermally deformed, the table is movably supported by each of the first guide member of the first movable member and the second guide member of the second movable member. The influence of thermal deformation of the first movable member and the second movable member is suppressed. Therefore, insufficient table positioning accuracy is suppressed.

  In the first aspect of the present invention, at least a part of the table is disposed above the first movable member, and the first movable member is disposed above the second movable member, Includes a plate-like table main body and a support member provided so as to protrude from the lower surface of the table main body and at least a part of which is disposed in the opening of the first movable member, and the first linear bearing is The second linear bearing may be disposed on a lower surface of the support member.

  Thereby, the table body is smoothly guided to the first guide member of the first movable member via the first linear bearing. The support member is smoothly guided to the second guide member of the second movable member via the second linear bearing. Therefore, each of the table, the first movable member, and the second movable member can move smoothly.

  In the first aspect of the present invention, in the movable range of the first movable member and the movable range of the second movable member, at least of the first guide member and the second guide member within a plane parallel to the predetermined surface. It may continue to overlap with some.

  Thereby, each of the first guide member and the second guide member can sufficiently guide the table.

  In the first aspect of the present invention, a third guide member for guiding the first movable member in a direction parallel to the second axis, and a second guide for guiding the second movable member in a direction parallel to the first axis. You may provide the base member which supports 4 guide members.

  Thereby, it is suppressed that the weight of a table and a 1st movable member acts on a 2nd movable member. The first movable member can be smoothly moved in the direction parallel to the second axis by the third guide member. The second movable member can be smoothly moved in a direction parallel to the first axis by the fourth guide member.

  In the first aspect of the present invention, the second guide member and the third guide member may be disposed at substantially the same position with respect to a direction parallel to the third axis orthogonal to the predetermined plane.

  Thereby, the table and the first movable member can smoothly move together in a direction parallel to the second axis.

  According to a second aspect of the present invention, there is provided a measurement apparatus comprising the table device according to the first aspect and a measurement unit that measures an object supported by the table.

  According to the second aspect of the present invention, the measuring apparatus can measure the object placed at the target position by the table, and therefore can accurately measure the object.

  A 3rd aspect of this invention provides a semiconductor manufacturing apparatus provided with the table apparatus of a 1st aspect, and the process part which processes the object supported by the said table.

  According to the third aspect of the present invention, the semiconductor manufacturing apparatus can process the object placed at the target position by the table, so that a defective product is suppressed from being manufactured from the object. The semiconductor manufacturing apparatus includes, for example, an exposure apparatus and is used in at least a part of the semiconductor device manufacturing process.

  A 4th aspect of this invention provides a flat panel display manufacturing apparatus provided with the table apparatus of a 1st aspect, and the process part which processes the object supported by the said table.

  According to the 4th aspect of this invention, since the flat panel display manufacturing apparatus can process the object arrange | positioned by the table at the target position, it is suppressed that a defective product is manufactured from the object. The flat panel display manufacturing apparatus includes, for example, an exposure apparatus and is used in at least a part of the flat panel display manufacturing process. The flat panel display includes at least one of a liquid crystal display, a plasma display, and an organic EL display.

  A 5th aspect of this invention provides a machine tool provided with the table apparatus of a 1st aspect, and the process part which processes the object supported by the said table.

  According to the fifth aspect of the present invention, the machine tool can process the object arranged at the target position by the table, so that the object can be precisely processed.

  According to the aspect of the present invention, insufficient positioning accuracy is suppressed.

FIG. 1 is a plan view showing an example of a table device according to the first embodiment. FIG. 2 is a front view illustrating an example of the table device according to the first embodiment. FIG. 3 is a perspective view showing a part of the table device according to the first embodiment. FIG. 4 is a cross-sectional view illustrating an example of a table according to the first embodiment. FIG. 5 is a diagram schematically illustrating an example of thermal deformation of the first movable member and thermal deformation of the second movable member according to the first embodiment. FIG. 6 is a diagram illustrating an example of a semiconductor manufacturing apparatus according to the second embodiment. FIG. 7 is a diagram illustrating an example of a measurement apparatus according to the third embodiment. FIG. 8 is a diagram illustrating an example of a machine tool according to the fourth embodiment.

  Hereinafter, embodiments according to the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of each embodiment described below can be combined as appropriate. Some components may not be used.

  In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the first axis in the predetermined plane is the X-axis direction, the direction parallel to the second axis orthogonal to the first axis in the predetermined plane is the Y-axis direction, and the direction parallel to the third axis orthogonal to the predetermined plane. Is the Z-axis direction. The rotation (tilt) directions around the X axis (first axis), Y axis (second axis), and Z axis (third axis) are the θX, θY, and θZ directions, respectively. The predetermined plane includes an XY plane. In the present embodiment, the predetermined plane and the horizontal plane are parallel. The Z-axis direction is the vertical direction. The X axis is orthogonal to the YZ plane. The Y axis is orthogonal to the XZ plane. The Z axis is orthogonal to the XY plane. The XY plane includes an X axis and a Y axis. The XZ plane includes an X axis and a Z axis. The YZ plane includes a Y axis and a Z axis.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a plan view showing an example of a table device 100 according to the present embodiment. FIG. 2 is a front view showing an example of the table device 100 according to the present embodiment. FIG. 3 is a perspective view showing a part of the table device 100 according to the present embodiment.

  1, 2, and 3, the table apparatus 100 includes a table 3 that can move in the X-axis direction and the Y-axis direction, and a first movable member 1 that can move in the Y-axis direction together with the table 3. A second movable member 2 that can move in the X-axis direction together with the table 3, and a base member 4 that supports the table 3, the first movable member 1, and the second movable member 2 so as to be movable. Yes. The first movable member 1 is movable in the Y-axis direction on the base member 4. The second movable member 2 is movable in the X axis direction on the base member 4. The table 3 is movable on the base member 4 in each of the X axis direction and the Y axis direction.

  The table 3 includes a table main body 30 having a support surface (upper surface) that supports an object, a support member 33 connected to the table main body 30, a first linear bearing 31, and a second linear bearing 32.

  The first movable member 1 includes a first guide member 11 that guides the first linear bearing 31 of the table 3 in the X-axis direction, a first support member 12 that supports the first guide member 11, and a third linear bearing 13. including.

  The second movable member 2 includes a second guide member 21 that guides the second linear bearing 32 of the table 3 in the Y-axis direction, a second support member 22 that supports the second guide member 21, and a fourth linear bearing 23. including.

  With respect to the Z-axis direction, the table 3, the first movable member 1, and the second movable member 2 are arranged at different positions. In the present embodiment, at least a part of the table 3 is disposed above the first movable member 1. In the present embodiment, the table main body 30 is disposed above the first movable member 1. At least a part of the support member 33 is disposed below the first movable member 1. The first movable member 1 is disposed above the second movable member 2.

  For example, the base member 4 is disposed on a support surface (floor surface or the like) of a facility (a factory or the like) where the table apparatus 100 is installed. The base member 4 supports a third guide member 41 that guides the first movable member 1 in the Y-axis direction and a fourth guide member 42 that guides the second movable member 2 in the X-axis direction. The third guide member 41 guides the third linear bearing 13 of the first movable member 1 in the Y-axis direction. The fourth guide member 42 guides the fourth linear bearing 23 of the second movable member 2 in the X-axis direction.

  The table body 30 is a plate-like member. The upper and lower surfaces of the table body 30 are substantially parallel to the XY plane. An opening 34 is provided at the center of the table body 30. The upper surface of the table body 30 is disposed around the upper end portion of the opening 34. The lower surface of the table body 30 is disposed around the lower end portion of the opening 34.

  The support member 33 is connected to the lower surface of the table body 30. In the present embodiment, the support member 33 is connected to each of the + X side region and the −X side region of the lower surface of the table body 30 with respect to the center of the table body 30 (opening 34). The support member 33 is disposed on both sides of the opening 34 with respect to the X-axis direction. The support member 33 is provided so as to protrude downward from the lower surface of the table body 30. The lower surface of the support member 33 is disposed below (−Z direction) than the lower surface of the table body 30.

  The first linear bearing 31 is disposed on the lower surface of the table body 30. At least a part of the first linear bearing 31 is fixed to the table body 30. The first linear bearing 31 is disposed in each of the + Y side region and the −Y side region of the lower surface of the table body 30 with respect to the center of the table body 30 (opening 34). The first linear bearing 31 is disposed on both sides of the opening 34 with respect to the Y-axis direction. In the present embodiment, two first linear bearings 31 are arranged in the X-axis direction in the + Y side region of the lower surface of the table body 30. Two first linear bearings 31 are arranged in the X-axis direction in the −Y side region of the lower surface of the table body 30.

  The second linear bearing 32 is disposed on the lower surface of the support member 33. At least a part of the second linear bearing 32 is fixed to the support member 33. The second linear bearing 32 is disposed below the first linear bearing 31. The second linear bearing 32 is disposed on both sides of the opening 34 with respect to the X-axis direction. Two second linear bearings 32 may be disposed in the Y-axis direction on the lower surface of the support member 33 disposed on the + X side of the opening 34. Two second linear bearings 32 may be disposed on the lower surface of the support member 33 disposed on the −X side of the opening 34. Note that one second linear bearing 32 may be disposed on the lower surface of the support member 33 disposed on the + X side of the opening 34. One second linear bearing 32 may be disposed on the lower surface of the support member 33 disposed on the −X side of the opening 34.

  The first support member 12 is a plate-like member. The upper surface and the lower surface of the first support member 12 are each substantially parallel to the XY plane. An opening 14 is provided at the center of the first support member 12. The upper surface of the first support member 12 is disposed around the upper end portion of the opening 14. The lower surface of the first support member 12 is disposed around the lower end portion of the opening 14.

  The first guide member 11 is disposed on the upper surface of the first support member 12. The first guide member 11 is fixed to the first support member 12. The first guide member 11 is long in the X-axis direction. In the present embodiment, the first guide member 11 is disposed in each of the + Y side region and the −Y side region of the upper surface of the first support member 12 with respect to the center of the first support member 12 (opening 14). . That is, in the present embodiment, two first guide members 11 are arranged in the Y-axis direction on the upper surface of the first support member 12.

  The third linear bearing 13 is disposed on the lower surface of the first support member 12. At least a part of the third linear bearing 13 is fixed to the first support member 12. The third linear bearing 13 is disposed in each of the + X side region and the −X side region of the lower surface of the first support member 12 with respect to the center of the first support member 12 (opening 14). With respect to the X-axis direction, the third linear bearings 13 are disposed on both sides of the opening 14. In the present embodiment, two third linear bearings 13 are arranged in the Y-axis direction in the + X side region of the lower surface of the first support member 12. Two third linear bearings 13 are arranged in the Y-axis direction in the −X side region of the lower surface of the first support member 12.

  The second support member 22 is a plate-like member. The upper surface and the lower surface of the second support member 22 are substantially parallel to the XY plane. An opening 24 is provided at the center of the second support member 22. The upper surface of the second support member 22 is disposed around the upper end portion of the opening 24. The lower surface of the second support member 22 is disposed around the lower end portion of the opening 24.

  The second guide member 21 is disposed on the upper surface of the second support member 22. The second guide member 21 is fixed to the second support member 22. The second guide member 21 is long in the Y-axis direction. In the present embodiment, the second guide member 21 is disposed in each of the + X side region and the −X side region of the upper surface of the second support member 22 with respect to the center of the second support member 22 (opening 24). . That is, in the present embodiment, two second guide members 21 are arranged in the X-axis direction on the upper surface of the second support member 22.

  The fourth linear bearing 23 is disposed on the lower surface of the second support member 22. At least a part of the fourth linear bearing 23 is fixed to the second support member 22. The fourth linear bearing 23 is disposed in each of the + Y side region and the −Y side region of the lower surface of the second support member 22 with respect to the center of the second support member 22 (opening 24). With respect to the Y-axis direction, the fourth linear bearings 23 are disposed on both sides of the opening 24. In the present embodiment, two fourth linear bearings 23 are arranged in the X-axis direction in the + Y side region of the lower surface of the second support member 22. Two fourth linear bearings 23 are arranged in the X-axis direction in the −Y side region of the lower surface of the second support member 22.

  The base member 4 includes a plate-shaped main body 40 and a support 43 that protrudes upward from the upper surface of the main body 40. The upper surface of the main body 40 is substantially parallel to the XY plane. The support portion 43 is disposed in each of the + X side region and the −X side region of the upper surface of the main body portion 40 with respect to the center of the main body portion 40. With respect to the X-axis direction, the support portions 43 are disposed on both sides of the center of the main body portion 40. The support portion 43 is disposed so as to protrude upward from the upper surface of the main body 40. The upper surface of the support portion 43 is disposed above (+ Z direction) the upper surface of the main body portion 40.

  The third guide member 41 is disposed on the upper surface of the support portion 43. The third guide member 41 is fixed to the support portion 43. The third guide member 41 is long in the Y-axis direction. The third guide member 41 is connected to each of the two support portions 43. That is, in the present embodiment, two third guide members 41 are arranged in the X-axis direction on the base member 4.

  The fourth guide member 42 is disposed on the upper surface of the main body 40. The fourth guide member 42 is fixed to the main body 40. The fourth guide member 42 is long in the X-axis direction. In the present embodiment, the fourth guide member 42 is connected to each of the + Y side region and the −Y side region of the upper surface of the main body 40 with respect to the center of the main body 40. That is, in the present embodiment, two fourth guide members 42 are arranged in the Y-axis direction on the base member 4.

  With respect to the Z-axis direction, the table body 30, the first movable member 1, and the second movable member 2 are arranged at different positions. Of the table main body 30, the first movable member 1 and the second movable member 2, the table main body 30 is disposed at the uppermost position (+ Z direction), and the first movable member 1 is disposed at the upper side next to the table main body 30. 2 The movable member 2 is disposed at the lowest position (−Z direction).

  The lower surface of the table body 30 is disposed above the upper surface of the first support member 12. The lower surface of the first support member 12 is disposed above the upper surface of the second support member 22. The lower surface of the second support member 22 is disposed above the upper surface of the main body portion 40 of the base member 4.

  The upper surface of the main body portion 40 is disposed below the upper surface of the support portion 43. In the present embodiment, the upper surface of the second support member 22 and the upper surface of the support portion 43 are disposed at substantially the same position (height) with respect to the Z-axis direction. In addition, regarding the Z-axis direction, the upper surface of the second support member 22 and the upper surface of the support portion 43 may be disposed at different positions.

  At least a part of the support member 33 is disposed in the opening 14 of the first support member 12. The upper surface of the support member 33 is disposed above the upper surface of the first support member 12. The lower surface of the support member 33 is disposed below the lower surface of the first support member 12.

  The first linear bearing 31 is disposed above the upper surface of the first support member 12. The first linear bearing 31 is guided in the X-axis direction by the first guide member 11 disposed on the upper surface of the first support member 12.

  The second linear bearing 32 is disposed below the lower surface of the first support member 12. The second linear bearing 32 is guided in the Y-axis direction by the second guide member 21 disposed on the upper surface of the second support member 22.

  The third linear bearing 13 is disposed below the first linear bearing 31. With respect to the Z-axis direction, the second linear bearing 32 and the third linear bearing 13 are disposed at substantially the same position (height). With respect to the Z-axis direction, the second guide member 21 that guides the second linear bearing 32 and the third guide member 41 that guides the third guide bearing 13 are disposed at substantially the same position (height). Note that the second linear bearing 32 and the third linear bearing 13 may be arranged at different positions with respect to the Z-axis direction. With respect to the Z-axis direction, the second guide member 21 and the third guide member 41 may be arranged at different positions. The third linear bearing 13 is guided in the Y-axis direction by a third guide member 41 disposed on the upper surface of the support portion 43.

  The fourth linear bearing 23 is disposed below the second linear bearing 32 and the third linear bearing 13. The fourth linear bearing 23 is guided in the X-axis direction by a fourth guide member 42 disposed on the upper surface of the main body 40.

  The table device 100 is at least partially connected to the first movable member 1, and is connected to the first drive device 5 that generates power for moving the first movable member 1, and at least partially connected to the second movable member 2. And a second driving device 6 that generates power for moving the second movable member 2.

  The first drive device 5 generates power for moving the first movable member 1 (first support member 12) in the Y-axis direction. The first drive device 5 includes a ball screw mechanism. The first drive device 5 includes a nut 51 fixed to the lower surface of the first support member 12, a ball screw 52 coupled to the nut 51, and a rotation motor 53 that rotates the ball screw 52. The position of the rotary motor 53 is fixed. The ball screw 52 is rotatably supported by the support portion 54. A coupling 55 is disposed between the ball screw 52 and the rotary motor 53. When the ball screw 52 is rotated by the operation of the rotary motor 53, the nut 51 moves in a direction parallel to the axis of the ball screw 52 (Y-axis direction). As a result, the first support member 12 moves in the Y-axis direction.

  The second drive device 6 generates power for moving the second movable member 2 (second support member 22) in the X-axis direction. The second drive device 6 includes a ball screw mechanism. The second drive device 6 includes a nut 61 fixed to the lower surface of the second support member 22, a ball screw 62 coupled to the nut 61, and a rotation motor 63 that rotates the ball screw 62. The position of the rotary motor 63 is fixed. The ball screw 62 is rotatably supported by the support portion 64. A coupling 65 is disposed between the ball screw 62 and the rotary motor 63. When the ball screw 62 is rotated by the operation of the rotary motor 63, the nut 61 moves in a direction parallel to the axis of the ball screw 62 (X-axis direction). As a result, the second support member 22 moves in the X-axis direction.

  At least a part of the table 3 is connected to the first movable member 1. In the present embodiment, the table 3 is connected to the first guide member 11 of the first movable member 1 via the first linear bearing 31. When the first movable member 1 is moved in the Y-axis direction by the operation of the first drive device 5, the table 3 is movable in the Y-axis direction together with the first movable member 1. Since the third linear bearing 13 of the first movable member 1 is guided by the third guide member 41 in the Y axis direction, the first movable member 1 can move smoothly in the Y axis direction. Since the second linear bearing 32 of the table 3 is guided by the second guide member 21, the table 3 can move smoothly in the Y-axis direction.

  At least a part of the table 3 is connected to the second movable member 2. In the present embodiment, the table 3 is connected to the second guide member 21 of the second movable member 2 via the second linear bearing 32. When the second movable member 2 is moved in the X-axis direction by the operation of the second driving device 6, the table 3 is movable in the X-axis direction together with the second movable member 2. Since the fourth linear bearing 23 of the second movable member 2 is guided by the fourth guide member 42 in the X-axis direction, the second movable member 2 can move smoothly in the X-axis direction. Since the first linear bearing 31 of the table 3 is guided by the first guide member 11, the table 3 can move smoothly in the X-axis direction.

  Thus, in the present embodiment, the table 3 moves in the Y-axis direction by the movement of the first movable member 1 and moves in the X-axis direction by the movement of the second movable member 2. The table 3 is a so-called XY table (two-axis table, two-dimensional table) that can move in each of the X-axis direction and the Y-axis direction.

  FIG. 4 is a cross-sectional view showing an example of the table 3 according to the present embodiment. As shown in FIG. 4, the table 3 includes a table main body 30, a support member 33 connected to the lower surface of the table main body 30, and a second linear bearing 32 connected to the lower surface of the support member 33.

  In the present embodiment, the support member 33 includes a first member 331 connected to the lower surface of the table body 30, a second member 332 disposed below the first member 331, a first member 331, and a second member 332. Tension member 333 disposed between the two. The tension member 333 includes a leaf spring. The tension member 333 is fixed to each of the first member 331 and the second member 332 by a bolt member. The second linear bearing 32 is provided on the lower surface of the second member 332.

  As shown in FIG. 4, in the present embodiment, the table main body 30 is connected to the second support member 22 via a tension member 333. Variations in load from the table 3 and the first movable member 1 are absorbed by the tension member 333. Further, the tension member 333 causes the table 3 and the first support member 12 and the second support member 22 to be separated from each other due to the difference in vertical straightness error between the table 3 and the first support member 12 and the second support member 22. The fluctuation of the load is suppressed, and the lack of positioning accuracy is suppressed.

  As shown in FIGS. 1, 2, and 3, the first movable member 1 is disposed above the second movable member 2. The table 3 is disposed above the first movable member 1 and the second movable member 2. The table 3 is connected to each of the first movable member 1 and the second movable member 2. That is, the table 3 is connected to the first guide member 11 of the first movable member 1 via the first linear bearing 31. The table 3 is connected to the second guide member 21 of the second movable member 2 via the second linear bearing 32.

  The first guide member 11 of the first movable member 1 is long in the X-axis direction. The second guide member 21 of the second movable member 2 is long in the Y-axis direction. Two first guide members 11 are arranged in the Y-axis direction. Two second guide members 21 are arranged in the X-axis direction. In the XY plane, the first guide member 11 and the second guide member 21 are orthogonal to each other. Even if each of the first movable member 1 and the second movable member 2 moves in the movable range of the first movable member 1 in the Y-axis direction and the movable range of the second movable member 2 in the X-axis direction, the first guide The member 11 and at least a part of the second guide member 21 continue to overlap (continue to intersect) in the XY plane.

  The movable range of the first movable member 1 in the Y-axis direction is defined based on at least one of the length of the third guide member 41 and the drive stroke of the first drive device 5. The movable range of the second movable member 2 in the X-axis direction is defined based on the length of the fourth guide member 42 and at least one of the second driving devices 6.

In this embodiment, the linear expansion coefficient of the first support member 12 of the first movable member 1 is A, the linear expansion coefficient of the first guide member 11 of the first movable member 1 is B, and the second support of the second movable member 2 is. When the linear expansion coefficient of the member 22 is C and the linear expansion coefficient of the second guide member 21 of the second movable member 2 is D,
A> B and C <D (1)
This condition is satisfied.

In addition,
A <B and C> D (2)
These conditions may be satisfied.

  In the present embodiment, the first support member 12, the first guide member 11, the second support member 22, and the second guide member are satisfied so that the condition of the formula (1) or the condition of the formula (2) is satisfied. 21 Each material is selected.

  In order to satisfy the condition of the formula (1), the first support member 12 is made of austenitic stainless steel (for example, SUS304), and the first guide member 11 is made of martensitic stainless steel (for example, SUS440C). The second support member 22 may be made of martensitic stainless steel (for example, SUS440C), and the second guide member 21 may be made of austenitic stainless steel (for example, SUS304).

  In order to satisfy the condition of the formula (2), the first support member 12 is made of alumina ceramic, the first guide member 11 is made of martensitic stainless steel (for example, SUS440C), and the second support member 22 is made. However, it may be made of austenitic stainless steel (for example, SUS304), and the second guide member 21 may be made of martensitic stainless steel (for example, SUS440C).

  In order to satisfy the condition of the formula (2), the first support member 12 is made of alumina ceramic, the first guide member 11 is made of austenitic stainless steel (for example, SUS304), and the second support member 22 is made of The second guide member 21 may be made of austenitic stainless steel (eg, SUS304).

  The linear expansion coefficient of alumina ceramic is said to be 7-8 ppm / degC. The linear expansion coefficient of martensitic stainless steel is said to be 10 to 13 ppm / degC. The linear expansion coefficient of austenitic stainless steel is said to be 16-18 ppm / degC. The linear expansion coefficient of the aluminum alloy is said to be 22 to 24 ppm / degC.

  The optimum value of the linear expansion coefficient varies depending on the cross-sectional shape of the first support member 12, the cross-sectional shape of the first guide member 11, the cross-sectional shape of the second support member 22, and the cross-sectional shape of the second guide member 21. Therefore, the cross-sectional shape of each member may be designed based on the selected material.

  Next, an example of the operation of the table device 100 according to the present embodiment will be described. At least one of the first driving device 5 and the second driving device 6 operates so that the table 3 is arranged at the target position in the XY plane. For example, the first movable member 1 moves in the Y-axis direction by the operation of the first driving device 5. When the first movable member 1 moves in the Y axis direction, the table 3 moves in the Y axis direction together with the first movable member 1. By the operation of the second drive device 6, the second movable member 2 moves in the X-axis direction. When the second movable member 2 moves in the X-axis direction, the table 3 moves in the X-axis direction together with the second movable member 2.

  When a temperature change occurs in the table apparatus 100, at least a part of the members of the table apparatus 100 may be thermally deformed.

  In the present embodiment, the linear expansion coefficient of the first support member 12 is A, the linear expansion coefficient of the first guide member 11 is B, the linear expansion coefficient of the second support member 22 is C, and the linear expansion of the second guide member 21. When the coefficient is D, the table device 100 is manufactured so as to satisfy the condition of the above-described expression (1) or (2).

  For example, when the condition of the expression (1) is satisfied, the linear expansion coefficient A of the first support member 12 is larger than the linear expansion coefficient B of the first guide member 11 (A> B). When the temperature of 1 rises, as shown in FIG. 5A, the first movable member 1 is thermally deformed so that the central portion of the first movable member 1 bends downward. Further, when the condition of the expression (1) is satisfied, the linear expansion coefficient C of the second support member 22 is smaller than the linear expansion coefficient D of the second guide member 21 (C <D), so that the second movable member When the temperature of 2 rises, as shown in FIG. 5B, the second movable member 2 is thermally deformed so that the central portion of the second movable member 2 bends upward. That is, when the condition of the expression (1) is satisfied, when the temperature of the first movable member 1 and the temperature of the second movable member 2 are increased, thermal deformation is performed so that the central portion of the first movable member 1 bends downward. And it heat-deforms so that the center part of the 2nd movable member 2 may bend upwards.

  FIG. 5 shows an example in which the temperature of the first movable member 1 and the temperature of the second movable member 2 are increased. When the condition of the formula (1) is satisfied, when the temperature of the first movable member 1 and the temperature of the second movable member 2 are lowered, the center portion of the first movable member 1 is thermally deformed so as to bend upward, The second movable member 2 is thermally deformed so that the center portion of the second movable member 2 bends downward.

  That is, when the condition of the expression (1) is satisfied, if the temperature of the first movable member 1 and the temperature of the second movable member 2 change, one of the first movable member 1 and the second movable member 2 is movable. The member is deformed so as to bend downward, and the other movable member is deformed so as to bend upward.

  Similarly, when the condition of the expression (2) is satisfied and the temperature of the first movable member 1 and the temperature of the second movable member 2 change, one of the first movable member 1 and the second movable member 2 is changed. The movable member is deformed so as to bend downward, and the other movable member is deformed so as to bend upward.

  Thus, when the condition of the formula (1) or the formula (2) is satisfied, when the first movable member 1 and the second movable member 2 are thermally deformed, the direction in which the first movable member 1 bends. The direction in which the second movable member 2 bends is opposite. Therefore, when one movable member of the first movable member 1 and the second movable member 2 is thermally deformed (bending deformation), the thermal deformation of the one movable member is offset by the thermal deformation of the other movable member. That is, even if each of the first movable member 1 and the second movable member 2 is thermally deformed due to a temperature change, the thermal deformation is offset.

  As described above, the first movable member 1 is disposed above the second movable member 2. The table 3 is disposed above the first movable member 1 and the second movable member 2. The table 3 is connected to each of the first movable member 1 and the second movable member 2. In the XY plane, the table 3, the first movable member 1, and the second movable member 2 are arranged so as to overlap each other. Even if each of the first movable member 1 and the second movable member 2 moves within the movable range of the first movable member 1 and the movable range of the second movable member 2, the first guide member 11 and the second guide member 11 are moved in the XY plane. The at least part of the two guide members 21 continues to overlap (continue to cross).

  Therefore, even if the first movable member 1 and the second movable member 2 are thermally deformed, they are connected to the first guide member 11 of the first movable member 1 and the second guide member 21 of the second movable member 2, respectively. The influence of the thermal deformation of the first movable member 1 and the second movable member 2 on the table 3 is suppressed. Therefore, insufficient positioning accuracy of the table 3 is suppressed.

  As described above, according to the present embodiment, even if the temperature change of the table apparatus 100 occurs, the first movable member 1 is satisfied by satisfying the condition of the expression (1) or (2). Thermal deformation and thermal deformation of the second movable member 2 are offset. Therefore, insufficient positioning accuracy of the table 3 that moves while being connected to the first movable member 1 and the second movable member 2 is suppressed.

  Further, according to the present embodiment, the table 3 (table body 30), the first movable member 1, and the second movable member 2 are arranged at different positions in the Z-axis direction. Thereby, it is suppressed that one movable member of the 1st movable member 1 and the 2nd movable member 2 contacts with the other movable member. Moreover, it is suppressed that the table main body 30 contacts the 1st movable member 1. FIG. Therefore, each of the table 3, the first movable member 1, and the second movable member 2 can move smoothly.

  In the present embodiment, the table 3 is provided with a plate-like table main body 30 and a support member provided so as to protrude from the lower surface of the table main body 30 and at least a part of which is disposed in the opening 14 of the first movable member 1. 33. The first linear bearing 31 is disposed on the lower surface of the table body 30, and the second linear bearing 32 is disposed on the lower surface of the support member 33. Thereby, the table main body 30 is smoothly guided in the X-axis direction by the first guide member 11 of the first movable member 1 via the first linear bearing 31. The support member 33 is smoothly guided in the Y-axis direction by the second guide member 21 of the second movable member 2 via the second linear bearing 32. Therefore, each of the table 3, the first movable member 1, and the second movable member 2 can move smoothly.

  In the present embodiment, in the movable range of the first movable member 1 and the movable range of the second movable member 2, at least a part of the first guide member 11 and the second guide member 21 overlap in the XY plane. to continue. Thereby, each of the first guide member 11 and the second guide member 21 can continue to sufficiently guide the table 3.

  In the present embodiment, the base member 4 supports the third guide member 41 that guides the first movable member 1 in the Y-axis direction and the fourth guide member 42 that guides the second movable member 2 in the X-axis direction. Is provided. Thereby, at least a part of the weight of the table 3 and the first movable member 1 acts on the base member 4. Therefore, the weight of the table 3 and the first movable member 1 is suppressed from acting on the second movable member 2. The first movable member 1 can be smoothly moved in the Y-axis direction by the third guide member 41. The second movable member 2 can be smoothly moved in the X-axis direction by the fourth guide member 42.

  In the present embodiment, the second guide member 21 and the third guide member 41 are disposed at substantially the same position in the Z-axis direction. Thereby, the table 3 and the 1st movable member 1 can be smoothly moved together regarding the Y-axis direction.

  In the present embodiment, as described with reference to FIG. 4, the table 3 includes the tension member 333 that functions as an error absorbing element. When the tension member 333 is provided, the second movable member 2 is required to be more positively deformed than the first movable member 1. In this case, the condition of equation (2) is obtained. For example, the first support member 12 is made of alumina ceramic, the first guide member 11 is made of martensitic stainless steel (for example, SUS440C), and the second support member 22 is made of an aluminum alloy (for example, A5052). The second guide member 21 may be made of martensitic stainless steel (for example, SUS440C).

Second Embodiment
A second embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 6 is a diagram illustrating an example of a semiconductor manufacturing apparatus 500 including the table apparatus 100 according to the present embodiment. The semiconductor manufacturing apparatus 500 includes a semiconductor device manufacturing apparatus capable of manufacturing a semiconductor device. The semiconductor manufacturing apparatus 500 is used in at least a part of a semiconductor device manufacturing process. The semiconductor manufacturing apparatus 500 includes a transfer apparatus 600 that can transfer an object S for manufacturing a semiconductor device. The transport apparatus 600 includes the table apparatus 100 according to the present embodiment.

  In FIG. 6, the table apparatus 100 is illustrated in a simplified manner. The object S is supported on the table 3.

  In the present embodiment, the object S is a substrate for manufacturing a semiconductor device. A semiconductor device is manufactured from the object S. The object S may include a semiconductor wafer or a glass plate. By forming a device pattern (wiring pattern) on the object S, a semiconductor device is manufactured.

  The semiconductor manufacturing apparatus 500 performs a process for forming a device pattern on the object S arranged at the processing position (target position) PJ1. The table apparatus 100 arranges the object S supported by the table 3 at the processing position PJ1. The transport device 600 includes a carry-in device 601 that can transport (carry in) the object S to the table 3 of the table device 100, and a carry-out device 602 that can transport (carry out) the object S from the table 3. The object S before processing is carried (carried in) to the table 3 by the carry-in device 601. The table apparatus 100 transports the object S supported by the table 3 to the processing position PJ1. The unloading device 602 transports (unloads) the processed object S from the table 3.

  The table apparatus 100 moves the table 3 and moves the object S supported by the table 3 to the processing position PJ1. The table apparatus 100 can arrange the object S supported by the table 3 at the processing position PJ1 with high positioning accuracy.

  For example, when the semiconductor manufacturing apparatus 500 includes an exposure apparatus that forms a device pattern on the object S via the projection optical system 501, the processing position PJ1 includes the image plane position (exposure position) of the projection optical system 501. The projection optical system 501 functions as a processing unit that performs exposure processing on the object S supported by the table 3. By arranging the object S at the processing position PJ1, the semiconductor manufacturing apparatus 500 can form a device pattern on the object S via the projection optical system 501.

  The semiconductor manufacturing apparatus 500 may include a film forming apparatus that forms a film on the object S. When the semiconductor manufacturing apparatus 500 includes a film forming apparatus, the processing position PJ1 includes a supply position (film forming position) to which a material for forming a film is supplied. The supply unit that supplies the material functions as a processing unit that performs the film forming process of the object S supported by the table 3. By arranging the object S at the processing position PJ1, a film for forming a device pattern is formed on the object S.

  After the object S is processed at the processing position PJ1, the processed object S is conveyed from the table 3 by the carry-out device 602. The object S transported (unloaded) by the unloading device 602 is transported to a processing device that performs a post-process.

  In the present embodiment, the table apparatus 100 can arrange the object S at the processing position PJ1. Therefore, it is suppressed that a defective product is manufactured. That is, since the table apparatus 100 suppresses the lack of positioning accuracy of the object S in the semiconductor manufacturing apparatus 500, the generation of defective products is suppressed.

  The flat panel display manufacturing apparatus may include the table device 100. The flat panel display manufacturing apparatus is used in at least a part of the manufacturing process of the flat panel display. The flat panel display includes at least one of a liquid crystal display, a plasma display, and an organic EL display.

  The flat panel display manufacturing apparatus may include the above-described exposure apparatus. A pattern for manufacturing a flat panel display may be formed on the object S including a glass plate via the projection optical system 501. The pattern for manufacturing the flat panel display includes at least one of a pixel pattern, a wiring pattern, and a color filter pattern. When the flat panel display manufacturing apparatus includes an exposure apparatus, the projection optical system 501 functions as a processing unit that processes the object S supported by the table 3. Note that the flat panel display manufacturing apparatus may include the above-described film forming apparatus.

  Since the semiconductor manufacturing apparatus 500 includes the table apparatus 100, the object S placed at the processing position PJ1 by the table 3 can be processed. Therefore, a defective product (semiconductor device) is prevented from being manufactured from the object S.

  Since the flat panel display manufacturing apparatus includes the table device 100, the flat panel display manufacturing apparatus can process the object S arranged at the processing position PJ1 by the table 3. Therefore, it is possible to suppress a defective product (flat panel display) from being produced from the object S.

<Third Embodiment>
A third embodiment will be described. FIG. 7 is a diagram illustrating an example of a measuring apparatus 700 including the table apparatus 100 according to the present embodiment. The measuring device 700 measures the object S2. The object S2 may include, for example, at least one of a semiconductor device manufactured by the above-described semiconductor manufacturing apparatus 500 and a flat panel display manufactured by the flat panel display manufacturing apparatus. The measuring device 700 includes a transport device 600B that can transport the object S2. The transport device 600B includes the table device 100 according to the present embodiment.

  In FIG. 7, the table device 100 is illustrated in a simplified manner. The object S2 is supported by the table 3.

  The measuring apparatus 700 measures the object S2 arranged at the measurement position (target position) PJ2. The table apparatus 100 arranges the object S2 supported by the table 3 at the measurement position PJ2. The transport device 600B includes a carry-in device 601B that can transport (carry in) the object S2 to the table 3 of the table device 100, and a carry-out device 602B that can transport (carry out) the object S2 from the table 3. The object S2 before measurement is transported (carried in) to the table 3 by the carry-in device 601B. The table apparatus 100 transports the object S2 supported by the table 3 to the measurement position PJ2. The measured object S2 is transported (unloaded) from the table 3 by the unloading device 602B.

  The table apparatus 100 moves the table 3 and moves the object S2 supported by the table 3 to the measurement position PJ2. The table apparatus 100 can arrange the object S2 supported by the table 3 at the measurement position PJ2 with high positioning accuracy.

  In the present embodiment, the measurement apparatus 700 optically measures the object S2 using detection light. The measuring apparatus 700 includes an irradiation device 701 capable of emitting detection light and a light receiving device 702 capable of receiving at least part of the detection light emitted from the irradiation device 701 and reflected by the object S2. In the present embodiment, the measurement position PJ2 includes a detection light irradiation position. The irradiation device 701 and the light receiving device 702 function as a measurement unit that measures the object S2 supported by the table 3. By disposing the object S2 at the measurement position PJ2, the state of the object S2 is optically measured.

  After the measurement of the object S2 is performed at the measurement position PJ2, the measured object S2 is transported from the table 3 by the carry-out device 602B.

  In the present embodiment, since the table device 100 can place the object S2 at the measurement position (target position) PJ2, it is possible to suppress the occurrence of measurement failure. That is, the measuring apparatus 700 can determine well whether or not the object S2 is defective. Thereby, for example, it is suppressed that defective object S2 is conveyed to a post process, or shipped. Moreover, since the measuring apparatus 700 can measure the object S2 arranged at the measurement position PJ2 by the table 3, the measurement of the object S2 can be performed precisely.

  Note that the three-dimensional measuring apparatus may include the table device 100 according to the present embodiment, or may include a transport device including the table device 100. Since the object to be measured is supported by the table 3, the three-dimensional measuring apparatus can measure the object placed at the target position, and therefore can accurately measure the object.

<Fourth embodiment>
A fourth embodiment will be described. FIG. 8 is a diagram illustrating an example of a machine tool 800 including the table device 100 according to the present embodiment. The machine tool 800 processes the object S3. The machine tool 800 includes a machining center and includes a table device 100 and a processing head 801. The processing head 801 functions as a processing unit that processes the object S3 supported by the table 3 of the table apparatus 100. The processing head 801 has a processing tool, and processes the object S3 supported by the table 3 of the table apparatus 100 with the processing tool. The processing head 801 is a mechanism for cutting the object S3. The machining head 801 moves the machining tool in the Z-axis direction orthogonal to the movement direction of the table 3.

  The machine tool 800 can relatively move the machining tool and the object S3 by moving the object S3 in the XY plane with the table apparatus 100 and moving the machining head 801 in the Z-axis direction.

  Since the machine tool 800 can machine the object S3 on the table 3 arranged at the machining position (target position), the object S3 can be precisely machined.

  In the present embodiment, the table 3 is moved in the XY plane (in the horizontal plane). In the present embodiment, the table 3 may be moved in a direction inclined with respect to the XY plane. The first movable member 1 and the second movable member 2 may be moved in a direction inclined with respect to the XY plane. That is, the XY plane may be parallel to the horizontal plane or may be inclined with respect to the horizontal plane.

DESCRIPTION OF SYMBOLS 1 1st movable member 2 2nd movable member 3 Table 4 Base member 5 1st drive device 6 2nd drive device 11 1st guide member 12 1st support member 13 3rd linear bearing 14 Opening 21 2nd guide member 22 2nd Support member 23 Fourth linear bearing 24 Opening 30 Table body 31 First linear bearing 32 Second linear bearing 33 Support member 34 Opening 40 Body portion 41 Third guide member 42 Fourth guide member 43 Support portion 51 Nut 52 Ball screw 53 Rotation Motor 54 Supporting part 55 Coupling 61 Nut 62 Ball screw 63 Rotating motor 64 Supporting part 65 Coupling 100 Table device 331 First member 332 Second member 333 Tension member 500 Semiconductor manufacturing device 501 Projection optical system 600 Conveying device 700 Measuring device 800 Machine Tools

Claims (9)

A table having a first linear bearing and a second linear bearing;
A first guide member that guides the first linear bearing of the table in a direction parallel to a first axis in a predetermined plane; and a first support member that supports the first guide member; A first movable member movable in a direction parallel to a second axis perpendicular to the first axis;
A second guide member that guides the second linear bearing of the table in a direction parallel to the second axis; and a second support member that supports the second guide member, and moves in a direction parallel to the first axis. A possible second movable member;
With
The linear expansion coefficient of the first support member is A, the linear expansion coefficient of the first guide member is B, the linear expansion coefficient of the second support member is C, and the linear expansion coefficient of the second guide member is D. When
A> B and C <D,
Or
A <B and C> D,
A table device that satisfies the above requirements. At least a part of the table is disposed above the first movable member,
The first movable member is disposed above the second movable member,
The table includes a plate-shaped table main body, and a support member provided so as to protrude from the lower surface of the table main body and at least a part of which is disposed in the opening of the first movable member,
The first linear bearing is disposed on a lower surface of the table body,
The table device according to claim 1, wherein the second linear bearing is disposed on a lower surface of the support member.   The first guide member and at least a part of the second guide member continue to overlap in a movable range of the first movable member and a movable range of the second movable member in a plane parallel to the predetermined surface. 2. The table device according to 2.   A base member that supports a third guide member that guides the first movable member in a direction parallel to the second axis, and a fourth guide member that guides the second movable member in a direction parallel to the first axis; The table apparatus as described in any one of Claims 1-3 provided with.   The table apparatus according to claim 4, wherein the second guide member and the third guide member are disposed at substantially the same position with respect to a direction parallel to a third axis orthogonal to the predetermined surface. The table device according to any one of claims 1 to 5,
A measurement unit for measuring an object supported by the table;
A measuring apparatus comprising: The table device according to any one of claims 1 to 5,
A processing unit for processing an object supported by the table;
A semiconductor manufacturing apparatus comprising: The table device according to any one of claims 1 to 5,
A processing unit for processing an object supported by the table;
A flat panel display manufacturing apparatus. The table device according to any one of claims 1 to 5,
A processing unit for processing an object supported by the table;
Machine tool equipped with.

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