JP6255727B2 - Leaf spring frame member - Google Patents

Description

  The present invention relates to a leaf spring frame member for producing a leaf spring used in a camera module drive mechanism.

  Interaction between the current flowing in the coil and the magnetic field of the magnetic circuit composed of the yoke and magnet for the purpose of autofocusing and zooming in small electronic devices with cameras such as mobile phones, smartphones, tablet terminals, notebook PCs, etc. A camera module drive mechanism (voice coil motor (VCM)) that can displace the lens unit in the optical axis direction is known.

  A plate spring for supporting the holder holding the lens unit so as to be displaceable in the optical axis direction of the lens unit is used in such a camera module drive mechanism.

JP 2009-122360 A

  In recent years, with the progress of thinning of small electronic devices, camera modules mounted on portable devices have been made thinner and smaller, and camera modules smaller than conventional ones have begun to be used. For this reason, the leaf spring incorporated in the camera module is also required to be as thin as possible.

  On the other hand, with the increase in the number of pixels of the camera module, even in the auto focus type, the number of pixels of the CMOS sensor is from 3 to 5 million pixels, and more than 8 million pixels are manufactured. Along with such an increase in the number of pixels, a lens having a large aperture has been used in order to improve the performance of the incorporated lens. The spring strength required for the leaf spring differs depending on the weight of the camera lens. Specifically, when mounting a heavy lens, it is necessary to increase the thickness of the leaf spring in order to increase the spring strength of the leaf spring, and when mounting a light lens, the thickness of the leaf spring must be reduced. Required. Under such a background, in general, the leaf spring is manufactured by etching using a thin copper alloy high-strength material of about 20 μm to 100 μm.

  By the way, when manufacturing a camera module drive mechanism (VCM), automatic assembly without human intervention is generally used to improve assembly accuracy and quality, and a leaf spring is attached to the apparatus or supported after assembly. The work of removing the frame is automated.

  However, when a leaf spring is supplied to a device for assembling a camera module drive mechanism (VCM), the leaf spring is small and thin, so that deformation is likely to occur, and care must be taken in handling. Usually, the leaf spring (product portion) is set in the apparatus in a state where the leaf spring (product portion) is disposed on the support frame (plate spring frame member). Thereafter, a holder, a coil, and the like are assembled, and each leaf spring is separated from the support frame (bridge portion) when the VCM unit is completed. Usually, the leaf spring (product part) and the support frame (bridge part) are connected by a connecting part. However, if the connection strength of the connecting part is weakened, deformation often occurs. However, if the strength of the connecting portion is increased, it becomes difficult to separate the support frame (bridge portion) after the VCM unit is completed. For example, when separating the support frame (bridge portion), the VCM unit may not be separated from the support frame (bridge portion) unless the connection portion is repeatedly bent a plurality of times or the connection portion is not cut by a physical method. .

  The present invention has been made in consideration of such points, and can easily separate the outer frame portion and the support frame of each leaf spring product portion and make the cutting position constant. An object of the present invention is to provide a leaf spring frame member.

  The present invention relates to a leaf spring frame member for manufacturing a leaf spring used for a driving mechanism of a camera module, an outer frame portion, an inner frame portion disposed inside the outer frame portion, an inner frame portion and an outer frame portion. A plurality of leaf spring product portions each including a spring portion provided between the leaf spring product portions, and a support frame disposed around each leaf spring product portion and supporting the leaf spring product portion. The connecting portion and the support frame are connected by a connecting portion, and the connecting portion is provided with a breakable region that can be easily broken, and the breaking region includes a half-etched portion that is thinner than the other regions of the connecting portion. The depth of the plate spring frame member is characterized by being 55% or more of the thickness of the other region.

  The present invention is a leaf spring frame member in which a bank portion that is not half-etched is formed on both sides of the half-etched portion.

  The present invention is the leaf spring frame member characterized in that the width of the bank portion is more than 0 mm and not more than 0.12 mm.

  The present invention is the leaf spring frame member, wherein the half-etched portion extends over the entire width direction of the connecting portion.

  The present invention relates to a leaf spring frame member for manufacturing a leaf spring used for a driving mechanism of a camera module, an outer frame portion, an inner frame portion disposed inside the outer frame portion, an inner frame portion and an outer frame portion. A plurality of leaf spring product portions each including a spring portion provided between the leaf spring product portions, and a support frame disposed around each leaf spring product portion and supporting the leaf spring product portion. The part and the support frame are connected by a connecting part, and the connecting part is provided with a breakable region that can be easily broken, and the broken region includes a through hole.

  The present invention is the leaf spring frame member characterized in that the outer edge of the fracture region is located inside the outer edge of the leaf spring product portion.

  The present invention is the leaf spring frame member characterized in that notches are respectively formed in portions located on both sides of the connecting portion in the outer frame portion.

  This invention is a leaf | plate spring frame member characterized by the width | variety of the connection part with a leaf | plate spring product part being 0.20 mm or more and 0.40 mm or less among connection parts.

  In the present invention, each leaf spring product portion is a leaf spring product portion for a lower spring, the outer frame portion includes a pair of outer frame members spaced apart from each other, and the inner frame portion is a pair of inner frames spaced apart from each other. It is a leaf | plate spring frame member characterized by including a member.

  According to the present invention, the connecting portion is provided with a breakable region that can be easily broken, and the broken region includes a half-etched portion that is thinner than the other regions of the connecting portion, and the depth of the half-etched portion is It is 55% or more of the thickness of other regions. Thus, the outer frame portion and the support frame of each leaf spring product portion can be easily separated and the cutting position can be made constant.

FIG. 1 is an exploded perspective view showing a drive mechanism of a camera module. FIG. 2 is a schematic side view showing the camera module. FIG. 3 is a plan view showing an upper leaf spring incorporated in the drive mechanism of the camera module. FIG. 4 is a plan view showing a lower leaf spring incorporated in the drive mechanism of the camera module. FIG. 5 is a plan view showing a leaf spring frame member according to an embodiment of the present invention. Fig.6 (a) is an enlarged plan view which shows the connection part of a connection part and a leaf | plate spring product part, FIG.6 (b) is the VI-VI sectional view taken on the line of Fig.6 (a). FIG. 7 is an enlarged plan view showing a fracture area after the fracture. FIG. 8A is an enlarged plan view showing a modified example of the fracture region, and FIG. 8B is a cross-sectional view taken along the line VIII-VIII in FIG. FIG. 9A is an enlarged plan view showing another modification of the fracture region, and FIG. 9B is a cross-sectional view taken along the line IX-IX in FIG. Fig.10 (a) is an enlarged plan view which shows the other modification of a fracture | rupture area | region, FIG.10 (b) is XX sectional drawing of Fig.10 (a).

  Embodiments of the present invention will be described below with reference to the drawings.

(Configuration of camera module drive mechanism)
As shown in FIGS. 1 and 2, the camera module drive mechanism 1 includes a housing 2A composed of a cover 2 and a base 13, a lens unit 26A composed of a plurality of lenses 26 constituting an optical system, and a housing 2A. A holder 9 that is accommodated in the lens unit 26A and is movable in the optical axis direction of the lens unit 26A, a coil 8 provided on the outer periphery of the holder 9, and a coil 8 provided on the base 13 of the housing 2A. A yoke 6 and a magnet piece 7 for providing a magnetic field are provided.

  Among these, the holder 9 that stores the lens unit 26A includes an inner holder 9A that stores the lens unit 26A, and an outer holder 9B that is provided outside the inner holder 9A and has the coil 8 provided on the outer periphery. An outer screw 19A is formed on the outer periphery of the inner holder 9A, an inner screw 19B is formed on the inner periphery of the outer holder 9B, and the outer screw 19A of the inner holder 9A is engaged with the inner screw 19B of the outer holder 9B. Thus, the inner holder 9A can be screwed into the outer holder 9B.

  An upper leaf spring 5 is interposed between the cover 2 of the housing 2A and the upper portion of the holder 9, and a lower leaf spring 11 is interposed between the base 13 of the housing 2A and the lower portion of the holder 9.

  Then, when an electric current is passed through the coil 8 via the lower leaf spring 11, an upward force acts on the holder 9, and the lens unit 26A moves upward as a whole against the forces of the upper leaf spring 5 and the lower leaf spring 11. Can be lifted (see FIG. 2).

  Also, by adjusting the amount of current to be input, the force that moves the holder 9 upward is changed, and the balance between the force of the upper leaf spring 5 and the lower leaf spring 11 allows the holder 9 to move up and down. Position adjustment can be performed.

  As shown in FIG. 2, the housing 2 </ b> A is fixed above the base body 20 via an intermediate support 21, an infrared cut glass 24 is supported on the intermediate support 21, and an image sensor 25 is provided on the base 20. Is arranged.

  Thus, the camera module 1A includes the camera module drive mechanism 1 having the housing 2A, the infrared cut glass 24, the intermediate support 21 that supports the infrared cut glass 24, and the base body 20 on which the imaging element 25 is disposed. It is configured.

  In the above configuration, as shown in FIG. 3, the upper leaf spring 5 includes an outer frame portion 5a on the housing 2A side, an inner frame portion 5b on the holder 9 side, an outer frame portion 5a, and an inner frame portion 5b. And a spring portion 5c having a spring property provided between them. As shown in FIG. 4, the lower leaf spring 11 is provided between the outer frame portion 11a on the housing 2A side, the inner frame portion 11b on the holder 9 side, and between the outer frame portion 11a and the inner frame portion 11b. And a spring portion 11c having a spring property.

  Next, each component of the camera module drive mechanism 1 will be further described.

  As described above, in the space in the housing 2A composed of the cover 2 and the base 13, the holder composed of the inner holder 9A that holds the lens unit 26A and the outer holder 9B that is provided outside the inner holder 9A. 9 is accommodated so as to be displaceable in the optical axis direction of the lens unit 26A.

  The inner frame portion 5b of the upper leaf spring 5 and the inner frame portion 11b of the lower leaf spring 11 are attached to the upper and lower cylindrical edges of the outer holder 9B of the holder 9, respectively. The frame portion 5a (see FIG. 3) is attached to the upper surface of the yoke 6 fixed to the base 13 of the housing 2A, and the outer frame portion 11a (see FIG. 4) of the lower leaf spring 11 is attached to the base 13 of the housing 2A. Installed.

  A plurality of magnet pieces 7 are bonded to the yoke 6 to constitute a magnetic circuit of the drive mechanism 1 of the camera module. A coil 8 is disposed in the magnetic field formed by this magnetic circuit. The coil 8 is wound around the outer periphery of the outer holder 9B of the holder 9, and by supplying a current to the coil 8, the holder 9 can be displaced in the optical axis direction of the lens unit 26A. In FIG. 2, a member indicated by reference numeral 12 is a conductor (flexible printed circuit board or the like) for supplying a current from an external power source to the coil 8, and a member indicated by reference numeral 4 is attached to the upper surface of the upper leaf spring 5. It is an adjustment plate.

  Such a camera module 1A is incorporated into an electronic device terminal such as a small electronic device with a camera such as a mobile phone, a smartphone, a tablet terminal, or a notebook PC. In the present embodiment, such an electronic device terminal is also provided.

(Configuration of leaf spring)
Next, the upper leaf spring 5 and the lower leaf spring 11 will be further described with reference to FIGS.

  The upper leaf spring 5 and the lower leaf spring 11 are each made of a metal leaf spring material such as a copper alloy.

  As shown in FIG. 3, the upper leaf spring 5 includes a rectangular outer frame portion 5a, a ring-shaped inner frame portion 5b disposed on the holder 9 side and inside the outer frame portion 5a, an outer frame portion 5a, A spring portion 5c is provided between the inner frame portion 5b and has a spring property that expands and contracts the outer frame portion 5a and the inner frame portion 5b in the normal direction of the upper leaf spring 5.

  Positioning holes 17 for attaching the upper leaf springs 5 to the upper surface of the yoke 6 fixed to the base 13 of the housing 2A are provided in three of the four corners of the outer frame portion 5a. The positioning hole 17 is engaged with a positioning protrusion (not shown) provided on the upper surface side of the yoke 6 to accurately position the upper leaf spring 5 on the upper surface side of the yoke 6.

  Further, the outer frame portion 5a is provided with an adhesive portion 30A for attaching the upper leaf spring 5 to the housing 2A. The adhesive portions 30A are provided at the four corners of the outer frame portion 5a and in the vicinity of the connecting portion between the outer frame portion 5a and each spring portion 5c. A plurality (four) of the bonding portions 30A are provided at predetermined intervals in the circumferential direction of the outer frame portion 5a.

  On the other hand, the inner frame portion 5 b is provided with an adhesive portion 30 </ b> B for attaching the upper leaf spring 5 to the holder 9. The adhesive portions 30B are provided at the four corners of the inner frame portion 5b and in the vicinity of the connecting portion between the inner frame portion 5b and each spring portion 5c. A plurality (four) of the bonding portions 30B are provided at predetermined intervals in the circumferential direction of the inner frame portion 5b.

  Each spring portion 5c has a meandering shape in which thin lines are folded back several times, but is not limited to this, as long as it has a spring property such as an arc shape or an S shape. The shape does not matter.

  Next, the lower leaf spring 11 will be described with reference to FIG. In the lower leaf spring 11 shown in FIG. 4, the same parts as those of the upper leaf spring 5 shown in FIG.

  As shown in FIG. 4, the lower leaf spring 11 includes a rectangular outer frame portion 11a, a ring-shaped inner frame portion 11b arranged on the outer holder 9B side of the holder 9 and inside the outer frame portion 11a, A spring portion 11c is provided between the frame portion 11a and the inner frame portion 11b, and has a spring property that expands and contracts the outer frame portion 11a and the inner frame portion 11b in the normal direction of the lower leaf spring 11. .

  Among these, the outer frame portion 11a is provided with an adhesive portion 30A for attaching the lower leaf spring 11 to the base 13 of the housing 2A. The adhesive portions 30A are provided at the four corners of the outer frame portion 11a and in the vicinity of the connecting portion between the outer frame portion 11a and the spring portion 11c. A plurality (four) of the bonding portions 30A are provided at predetermined intervals in the circumferential direction of the outer frame portion 11a.

  On the other hand, the inner frame portion 11 b is provided with an adhesive portion 30 </ b> B for attaching the lower leaf spring 11 to the holder 9. The adhesive portion 30B is provided in the vicinity of the connecting portion with the spring portion 11c in the inner frame portion 11b. A plurality (four) of the bonding portions 30B are provided at predetermined intervals in the circumferential direction of the inner frame portion 11b.

  Each spring portion 11c has a meandering shape in which thin lines are folded back several times, but is not limited to this, as long as it has a spring property such as an arc shape or an S shape. The shape does not matter.

  In addition, a pair of connection terminals 11 e and 11 e connected to an external power source are provided on the outer frame portion 11 a of the lower leaf spring 11. The connection terminals 11e, 11e and the external flexible printed circuit board 12 (FIG. 2) are soldered, for example, so that the connection terminals 11e, 11e and the external power supply are electrically connected.

  Further, the inner frame portion 11b is provided with a pair of electrical connection terminals 11d and 11d connected to the coil 8 side. The connection terminals 11d and 11d and the coil 8 (FIG. 2) are soldered, for example, so that the connection terminals 11d and 11d and the coil 8 are electrically connected. In this way, a current can flow from the external power source to the coil 8 side via the lower leaf spring 11.

Further, as shown in FIG. 4, the outer frame portion 11a is composed of a pair of outer frame members 11a ₁ and 11a ₂ that are separated from each other, so that the connection terminals 11e and 11e are not short-circuited. The inner frame portion 11b is composed of a pair of inner frame members 11b ₁ and 11b ₂ that are spaced apart from each other, so that the connection terminals 11d and 11d are not short-circuited.

  3 and 4, the four spring portions 5 c and 11 c have a shape that is line symmetric with respect to the central axis of the leaf springs 5 and 11 that extend vertically or horizontally in FIGS. 3 and 4. . However, the present invention is not limited to this, and the four spring portions 5c and 11c may have a shape having a rotational symmetry of 90 °.

  Next, materials for the upper leaf spring 5 and the lower leaf spring 11 will be described. The upper leaf spring 5 and the lower leaf spring 11 are both produced by etching a metal plate made of a metal such as a copper alloy.

  In this case, the thickness of the upper leaf spring 5 and the lower leaf spring 11 can be set to 20 μm to 100 μm, for example.

(Configuration of leaf spring frame member)
Next, the leaf spring frame member used for manufacturing the leaf spring described above will be described with reference to FIGS. 5 and 6A and 6B. In the following description, the leaf spring frame member 50 used for manufacturing the lower leaf spring 11 will be described as an example. 5 and 6A and 6B, the same components as those in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 5, the leaf spring frame member 50 is manufactured by etching a metal plate made of a metal such as a copper alloy, and includes a large number (a plurality) of leaf spring product portions 11A and leaf spring products. And a support frame 51 that supports the portion 11A.

  Each leaf spring product portion 11A corresponds to the lower leaf spring 11 described above, and includes an outer frame portion 11a, an inner frame portion 11b disposed inside the outer frame portion 11a, an inner frame portion 11b, and an outer frame portion 11a. And a spring portion 11c provided between the frame portion 11a and the frame portion 11a. In addition, since the structure of these outer frame part 11a, the inner frame part 11b, and the spring part 11c was already demonstrated, detailed description is abbreviate | omitted here.

  The support frame 51 is arranged around each leaf spring product portion 11A so as to surround each leaf spring product portion 11A. In FIG. 5, the support frame 51 is disposed along two parallel sides of the substantially rectangular outer frame portion 11a. However, the present invention is not limited to this, and the support frame 51 may be provided in a lattice shape around the four sides of the substantially rectangular outer frame portion 11a.

  Furthermore, the outer frame portion 11 a and the support frame 51 of each leaf spring product portion 11 </ b> A are connected by a connecting portion 52. The connecting portion 52 is cut off from each leaf spring product portion 11A (lower leaf spring 11) during or after the drive mechanism 1 of the camera module is assembled. In the present embodiment, each leaf spring product portion 11A is connected to the support frame 51 by four connecting portions 52, but the number of connecting portions 52 connected to each leaf spring product portion 11A is the same. It is not restricted to, For example, it is good also as 2-8.

  Next, the configuration of the connecting portion between the connecting portion 52 and the leaf spring product portion 11A will be further described with reference to FIGS.

As shown in FIGS. 6A and 6B, the connecting portion 52 is connected to the outer frame portion 11a of the leaf spring product portion 11A. The connecting portion 52 has an elongated shape and extends perpendicular to one side of the outer frame portion 11a. Moreover, the connection part with the outer frame part 11a of the leaf | plate spring product part 11A among the connection parts 52 may have a shape which tapers toward the outer frame part 11a side (refer FIG. 5). In addition, it is preferable that width w ₁ of a connection part with the outer frame part 11a of 11 A of leaf | plate spring products parts among connection parts 52 shall be 0.20 mm or more and 0.40 mm or less.

  Further, the connecting portion 52 is provided with a fracture region 53 that can be easily broken as compared with other portions of the connecting portion 52. The fracture region 53 may be provided only in the connecting portion 52, or may be provided across both the connecting portion 52 and the outer frame portion 11a.

In this case, the fracture region 53 includes a half-etched portion 54. This half-etched portion 54 is half-etched from one surface side to the other surface side, and is thinner than other portions of the connecting portion 52 (see FIG. 6B). The half-etched portion 54 is formed together when the leaf spring frame member 50 is manufactured by etching a metal plate made of a metal such as a copper alloy. The planar shape of the half-etched portion 54 is not limited to a substantially rectangular shape (see FIG. 6A), and may be a substantially circular shape, a substantially elliptical shape, or the like. The width w ₂ of the half-etched portion 54 is preferably 0.04 mm or more and 0.40 mm or less. Further, as shown in FIGS. 10A and 10B, a plurality of (for example, two) half-etched portions 54 may be formed along the width direction of the connecting portion 52, for example. In this case, the width w ₂ of the half-etched portion 54 refers to the total width of the plurality of half-etched portions 54. Note that half-etching means that a metal plate, which is a material to be etched, is etched halfway in the thickness direction.

  Thus, since the fracture | rupture area | region 53 contains the half etching part 54, this part becomes the weakest part with respect to stress, such as bending and a tension | pulling. As a result, when the outer frame portion 11a and the support frame 51 are separated, the outer frame portion 11a and the support frame 51 can be reliably cut at the break region 53, and the break position between the outer frame portion 11a and the support frame 51 is set between the leaf spring product portions 11A. Can be made uniform.

In FIG. 6B, the depth d ₁ of the half-etched portion 54 is 55% or more of the thickness t ₁ of the other region of the connecting portion 52. Here, the thickness t ₁ is equal to the thickness of the metal plate itself constituting the leaf spring frame member 50, and specifically may be 20 μm or more and 100 μm or less. In this case, the depth d ₁ of the half-etched portion 54 may be, for example, 11 μm or more and less than 100 μm. Thus, by setting the depth d ₁ of the half-etched portion 54 to 55% or more of the thickness t ₁ of the other region of the connecting portion 52, the outer frame portion 11a of the leaf spring product portion 11A and the support frame 51 are connected. When separating, the connecting portion 52 can be easily separated from the outer frame portion 11a.

Further, bank portions 55 are provided on both sides of the half-etched portion 54 (referring to both sides in the width direction of the connecting portion 52). The bank portion 55 is not half-etched, and therefore has the same thickness t ₁ as the connecting portion 52. By providing the pair of bank portions 55 in this way, it is possible to prevent the strength around the fractured region 53 from being lowered more than necessary, and to prevent the connecting portion 52 from being separated from the outer frame portion 11a when not intended. be able to. Moreover, by providing a pair of bank parts 55, it can suppress that the connection part 52 twists with respect to the outer frame part 11a, and can prevent that a deformation | transformation arises in the connection part 52. FIG.

The width w ₃ of the bank portion 55 is preferably greater than 0 mm and not greater than 0.12 mm. When the thickness of the connecting portion 52 exceeds 50 μm, the strength around the fracture region 53 does not decrease more than necessary even if the bank portion 55 is not provided. Therefore, the lower limit value of the width _{w 3} of the bank portion 55 is defined as 0mm greater. On the other hand, if the plate thickness of the connecting portion 52 is 30-50 microns, the width _{w 3} of the bank portion 55 is not a certain degree, it is difficult to hold the leaf spring product portion 11A. In this case, by setting the width w ₃ of the bank portion 55 and below 0.12 mm, may become difficult to separate the leaf spring products section 11A, variation can be prevented or occurring on the cut surface.

  As shown in FIG. 6A, the outer edge 53a of the fracture region 53 (the outer edge of the half-etched portion 54) is located on the inner side (the inner frame portion 11b side) than the outer edge 11h of the leaf spring product portion 11A. Thereby, when the outer frame portion 11a and the support frame 51 are separated, the burr generated from the half-etched portion 54 or the bank portion 55 protrudes from the outer edge 11h of the leaf spring product portion 11A toward the outside (the support frame 51 side). Can be prevented.

  Furthermore, the notch part 11g is formed in the part located in the both sides of the connection part 52 among the outer frame parts 11a, respectively. The cutout portions 11g are recessed toward the inner side (the inner frame portion 11b side) of the outer frame portion 11a. Thereby, when the connection part 52 is cut off from the outer frame part 11a, it is possible to more reliably prevent a problem that the burr protrudes outward (from the support frame 51 side) from the outer edge 11h of the leaf spring product part 11A.

The leaf spring frame member 50 may be manufactured from either the upper leaf spring 5 or the lower leaf spring 11. However, since the lower leaf spring 11 includes a pair of outer frame members 11a ₁ and 11a ₂ spaced apart from each other and a pair of inner frame members 11b ₁ and 11b ₂ spaced apart from each other, the outer frame member 11a ₁ (inner frame member 11b ₁ ) and the outer frame member 11a ₂ (inner frame member 11b ₂ ) are more preferably used such a leaf spring frame member 50 so that they are not separated from each other.

(Operation of this embodiment)
Next, the operation of the present embodiment having such a configuration will be described. Specifically, the operation when the camera module drive mechanism 1 is manufactured will be described.

  First, a plurality of bases 13 having the same configuration are prepared, and these are arranged at a predetermined interval. Next, the leaf spring frame member 50 is disposed on the plurality of bases 13 arranged in this manner. Subsequently, each leaf spring product portion 11 </ b> A of the leaf spring frame member 50 is fixed to the corresponding base 13. At this time, an adhesive is applied to each of the bonding portions 30 </ b> A provided on the outer frame portion 11 a of each leaf spring product portion 11 </ b> A, and the outer frame portion 11 a is bonded and fixed to the base 13.

  Next, the outer holder 9 </ b> B around which the coil 8 is wound is fixed to each leaf spring product portion 11 </ b> A of the leaf spring frame member 50. At this time, an adhesive is applied to each of the bonding portions 30B provided on the inner frame portion 11b of each leaf spring product portion 11A, and the inner frame portion 11b is bonded and fixed to the outer holder 9B.

  Subsequently, the magnet piece 7 and the yoke 6 are attached to each base 13. Further, a plurality of upper leaf springs 5 are prepared, and the outer frame portion 5a of each upper leaf spring 5 is attached to the upper surface of the yoke 6, and the outer frame portion 5a of each upper leaf spring 5 is attached to the outer holder 9B. Next, the adjustment plate 4 is attached to the upper surface of each upper leaf spring 5, and the cover 2 is attached to each base 13 and the adjustment plate 4.

  Next, the lens unit 26 </ b> A is mounted in the housing 2 </ b> A composed of the cover 2 and the base 13. At this time, the inner holder 9A is screwed into the outer holder 9B while the outer screw 19A of the inner holder 9A housing the lens unit 26A is engaged with the inner screw 19B of the outer holder 9B fixed to the housing 2A in advance. In this way, a plurality of drive mechanisms 1 for the camera module are integrally manufactured.

  Thereafter, the driving mechanism 1 of each camera module is separated by separating the support frame 51 of the leaf spring frame member 50 from each leaf spring product portion 11A by a cutting device. Moreover, the lower leaf | plate spring 11 is obtained from each leaf | plate spring product part 11A, respectively.

  At this time, the rupture region 53 is broken at the half-etched portion 54, whereby the connecting portion 52 is separated from the outer frame portion 11a of the leaf spring product portion 11A. When the fracture region 53 is fractured, a part of the fracture region 53 becomes a burr 53b and remains on the leaf spring product part 11A (lower leaf spring 11) side (see FIG. 7).

  On the other hand, in the present embodiment, a breakable region 53 that can be easily broken is provided in the connecting portion 52 as described above. For this reason, when the support frame 51 is separated from each leaf spring product portion 11A, the breaking position of the connecting portion 52 can be stabilized.

  Moreover, the fracture | rupture area | region 53 contains the half etching part 54 thinner than the other area | region of the connection part 52, and the depth of the half etching part 54 is 55% or more of the thickness of the said other area | region. Thereby, in the process of separating the support frame 51 from each leaf spring product portion 11A, the connecting portion 52 can be easily separated from the outer frame portion 11a of the leaf spring product portion 11A, and work efficiency can be improved. . Moreover, when separating the connection part 52 from the outer frame part 11a, it is not necessary to bend the connection part 52 repeatedly, for example, or to cut the connection part 52 by a physical method. Therefore, the connecting portion 52 can be easily separated from the outer frame portion 11a without causing deformation or the like in the connecting portion 52.

  Further, as described above, the outer edge 53a of the fracture region 53 is located on the inner side of the outer edge 11h of the leaf spring product portion 11A. For this reason, it is possible to reliably prevent the burr 53b from protruding outward from the outer edge 11h of the leaf spring product portion 11A, regardless of where the fracture occurs in the fracture region 53 (see FIG. 7). Accordingly, it is possible to prevent the burr 53b from protruding from the outer surface of the camera module drive mechanism 1, and to improve the quality of the camera module drive mechanism 1.

  On the other hand, as a comparative example, when the burr 53b protrudes outward from the outer edge 11h of the leaf spring product portion 11A, when the camera module 1A is covered with a shield cover (not shown), the shield cover may be caught by the burr 53b and not covered well. There is. Even when the camera module 1A is incorporated into a type of device without a shield cover, when the camera module 1A is arranged in a very narrow space such as a smartphone or a mobile phone, the burr 53b may be connected to a substrate or a housing. There is a risk that the camera module 1A cannot be assembled accurately due to contact with the body, parts, or the like. Further, when the burr 53b comes into contact with a substrate, a casing, a component, or the like, there is a possibility of causing a failure. In the present embodiment, as described above, the burr 53b prevents the problem that the burr 53b protrudes from the outer surface of the drive mechanism 1 of the camera module, so that such various problems can be prevented.

(Operation of camera module drive mechanism)
Next, the operation of the camera module drive mechanism will be described with reference to FIG.

  First, a current is passed through the coil 8 through the lower leaf spring 11. As a result, an interaction occurs between the current and the magnetic field of the magnet piece 7, and an upward force acts on the holder 9. (See FIG. 2).

  Further, by adjusting the amount of current flowing through the coil 8, the force that moves the holder 9 upward is changed, and the balance between the force of the upper leaf spring 5 and the lower leaf spring 11 is made, so that the holder 9 moves up and down. And its position can be adjusted.

  In this case, an adhesive portion 30A is provided in the vicinity of the connecting portion with the spring portions 5c and 11c of the outer frame portions 5a and 11a of the upper plate spring 5 and the lower plate spring 11, and the spring portions 5c and 11b of the inner frame portions 5b and 11b. An adhesive portion 30B is provided in the vicinity of the connecting portion with 11c.

  Thus, by firmly fixing both ends of the spring portions 5c and 11c of the upper leaf spring 5 and the lower leaf spring 11 to each of the yoke 6, the base 13 and the holder 9 fixed to the base 13 of the housing 2A, The spring constant of the spring parts 5c and 11c can be stabilized.

  Thus, a camera module drive mechanism having stable spring characteristics can be obtained.

As described above, according to the present embodiment, the fracture region 53 includes the half-etched portion 54 that is thinner than the thickness t ₁ of the other region (metal plate itself) of the connecting portion 52, and the depth d of the half-etched portion 54. ₁ has a more than 55% of the thickness _{t 1} of the other areas. Thus, the outer frame portion 11a of the leaf spring product portion 11A and the support frame 51 can be easily separated, and the cutting position between the connecting portion 52 and the outer frame portion 11a can be made constant.

(Modification)
In the embodiment described above, the fracture region 53 includes the half-etched portion 54, and the bank portions 55 are provided on both sides of the half-etched portion 54. However, the present invention is not limited to this.

For example, as shown in FIGS. 8A and 8B, the fracture region 53 may include a through hole 61 that penetrates in the thickness direction of the connecting portion 52. In this case, bank portions 55 are respectively provided on both sides of the through hole 61. The bank portion 55 has the same thickness t ₁ as the connecting portion 52. With such a configuration, in the step of separating the support frame 51 from each leaf spring product portion 11A, the connecting portion 52 can be easily separated from the outer frame portion 11a of the leaf spring product portion 11A, and the work efficiency can be improved. Can be planned.

  Further, the outer edge 53a (the outer edge of the through hole 61) of the fracture region 53 is located on the inner side (the inner frame part 11b side) than the outer edge 11h of the leaf spring product part 11A. Thereby, when the outer frame portion 11a and the support frame 51 are separated, it is possible to prevent the burr generated from the bank portion 55 from protruding from the outer edge 11h of the leaf spring product portion 11A to the outside (the support frame 51 side). it can. Moreover, since the location where a burr | flash generate | occur | produces can be limited only to the bank part 55, the quantity of the burr | flash produced when the connection part 52 is cut off from the outer frame part 11a can be reduced.

Alternatively, as shown in FIGS. 9A and 9B, the half-etched portion 54 may extend over the entire width direction of the connecting portion 52. Further, the depth d ₁ of the half-etched portion 54 is 55% or more of the thickness t ₁ of the other region of the connecting portion 52. With such a configuration, in the step of separating the support frame 51 from each leaf spring product portion 11A, the connecting portion 52 can be easily separated from the outer frame portion 11a of the leaf spring product portion 11A, and the work efficiency can be improved. Can be planned.

  Further, the outer edge 53a (the outer edge of the half-etched portion 54) of the fracture region 53 is located on the inner side (the inner frame portion 11b side) than the outer edge 11h of the leaf spring product portion 11A. Thereby, when the outer frame portion 11a and the support frame 51 are separated, the burr generated from the half-etched portion 54 is prevented from protruding from the outer edge 11h of the leaf spring product portion 11A to the outside (support frame 51 side). Can do. Further, since the half-etched portion 54 extends over the entire width direction of the connecting portion 52, the cross-sectional area of the connecting portion 52 decreases, so that the amount of burrs generated when the connecting portion 52 is separated from the outer frame portion 11a is reduced. Can be reduced.

  8 and 9, the same parts as those in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

DESCRIPTION OF SYMBOLS 1 Camera module drive mechanism 1A Camera module 2 Cover 2A Housing | casing 4 Adjustment board 5 Upper leaf | plate spring 5a Outer frame part 5b Inner frame part 5c Spring part 6 Yoke 7 Magnet piece 8 Coil 9 Holder 11 Lower leaf | plate spring 11a Outer frame part 11b Inner frame portion 11c Spring portion 11d Connection terminal 11e Connection terminal 12 Flexible printed circuit board 13 Base 17 Positioning hole 20 Base body 21 Intermediate support body 24 Infrared cut glass 25 Imaging element 26 Lens 26A Lens unit 30A, 30B Bonding portion 50 Plate spring frame member 51 Support frame 52 Connecting portion 53 Breaking region 54 Half-etching portion 55 Bank portion 61 Through hole

Claims (6)

In the leaf spring frame member for leaf spring production used for the drive mechanism of the camera module,
A plurality of leaf spring product parts each including an outer frame part, an inner frame part arranged inside the outer frame part, and a spring part provided between the inner frame part and the outer frame part;
A support frame disposed around each leaf spring product portion and supporting the leaf spring product portion;
Each leaf spring product part and the support frame are connected by a connecting part,
The connecting portion is provided with a breakable region that can be easily broken,
The fracture region includes a half-etched portion that is thinner than other regions of the connecting portion,
The depth of the half-etched portion is 55% or more of the thickness of the other region,
A bank portion that is not half-etched is formed on both sides in the cutting direction of the half-etched portion, and the cross section along the cutting direction of the connecting portion in the fracture region is a U-shape. Leaf spring frame member.   The leaf spring frame member according to claim 1, wherein the width of the bank portion is more than 0 mm and not more than 0.12 mm.   3. The leaf spring frame member according to claim 1, wherein an outer edge of the fracture region is located inside an outer edge of the leaf spring product portion.   The leaf spring frame member according to any one of claims 1 to 3, wherein a notch portion is formed in each portion of the outer frame portion located on both sides of the connecting portion.   The leaf spring frame member according to any one of claims 1 to 4, wherein a width of a connection portion between the connection portion and the leaf spring product portion is 0.20 mm or more and 0.40 mm or less.   Each leaf spring product part is a leaf spring product part for a lower spring, the outer frame part includes a pair of outer frame members spaced apart from each other, and the inner frame part includes a pair of inner frame members spaced apart from each other. The leaf spring frame member according to any one of claims 1 to 5, wherein: