JP6245748B2 - Flexible electronic device manufacturing equipment - Google Patents

Description

  The present invention relates to a flexible electronic device manufacturing apparatus that manufactures an electronic device by laminating a plurality of functional layers on a flexible substrate by printing or coating.

  In recent years, a flexible electronic device in which a functional layer such as a wiring with a high-definition pattern is formed on a flexible substrate such as a film has attracted attention. Examples of the flexible electronic device include a thin film transistor (hereinafter referred to as a TFT in this specification). In the production of these flexible electronic devices, conventionally, a photolithography method capable of forming a wiring with a high-definition pattern has been employed. However, the method of manufacturing an electronic device by the photolithography method requires a laborious process such as creating a high-temperature / vacuum environment, which requires a large number of manufacturing steps and high manufacturing costs. Therefore, there is a need for a flexible electronic device manufacturing method that replaces the photolithography method.

  As an electronic device manufacturing method that replaces the photolithography method, for example, there is printed electronics (hereinafter referred to as PE in the present specification). The manufacture of flexible electronic devices using PE is to produce flexible electronic devices by forming high-definition pattern wiring on a flexible substrate by printing or coating methods. Compared with manufacturing, a time-consuming process is not required, and the number of manufacturing steps can be reduced and the manufacturing cost can be greatly reduced.

JP 2007-268715 A

  As a method for forming a thin film transistor employing this PE, for example, there is a technique described in Patent Document 1. The method of forming a thin film transistor described in Patent Document 1 is a method of accurately forming a conductive material on a specific portion of a substrate by using a high resolution reversal printing method when forming an electrode pattern of the conductive material on the substrate. It is.

  However, a TFT is formed by laminating a gate layer, an insulating layer, a source / drain layer, and a semiconductor on a base material. In manufacturing a TFT, the relative positions of the respective layers must be aligned and laminated with high definition. When the technique disclosed in Patent Document 1 is used to stack multiple layers on a base material, each time the base material is moved to each device for forming each layer, the precision of the base material for each device is Alignment must be done. This preparatory work related to precise alignment may increase the burden on the operator and increase the number of manufacturing steps and the manufacturing cost.

  The present invention has been made in view of the above problems, and it simplifies preparation work such as alignment at each step required when performing multi-layer stacking, and enables a flexible electronic device with a small number of manufacturing steps and high accuracy. The purpose is to manufacture.

A flexible electronic device manufacturing apparatus according to a first invention for solving the above problems includes a base material processing unit that prints or applies a functional layer to a flexible base material, and a base that supplies the base material to the base material processing unit. A flexible electronic device manufacturing apparatus including a material supply unit, wherein the substrate supply unit is mounted with a mounting unit, and the suction unit is configured to suck the substrate with the mounting unit. A position adjusting means for adjusting the position of the placing means; a substrate position detecting means for detecting the position of the substrate placed on the placing means; and supplying the substrate to the substrate processing section at a predetermined position. A control unit that controls the position adjustment unit based on a detection result of the substrate position detection unit, and a pressure drum that holds and rotates the substrate in the substrate processing unit, and the pressure An impression cylinder phase detection means for detecting the phase of the cylinder, A transporting means for transporting the substrate placed on the placing means to the impression cylinder of the substrate processing unit, the control means based on the detection result of the impression cylinder phase detection means, The conveyance means is controlled .

  A flexible electronic device manufacturing apparatus according to a second invention that solves the above problem is the flexible electronic device manufacturing apparatus according to the first invention, wherein the position adjusting means is configured to place the placing means in two different directions in a horizontal plane. The position is adjusted by movement and rotation.

A flexible electronic device manufacturing apparatus according to a third invention for solving the above-mentioned problems is the flexible electronic device manufacturing apparatus according to the first or second invention, wherein the transport means holds the end of the base material. It is a transfer cylinder provided with a claw device, and the above-mentioned placing means is a plate-like object which has a notch part in the position corresponding to the track of a claw in the above-mentioned claw device.

According to the flexible electronic device manufacturing apparatus according to the first aspect of the invention, the substrate supply unit is mounted on the mounting unit, the position adjusting unit that adjusts the position of the mounting unit, and the mounting unit. A base material position detecting means for detecting the position of the placed base material, and a control means for controlling the position adjusting means based on the detection result of the base material position detecting means. It can supply to a base-material process part. In addition, by controlling the position adjusting means based on the detection result of the base material position detecting means, it is possible to eliminate preparation work related to alignment that may cause an increase in the burden on the operator.
In addition, even a base material that has been subjected to a predetermined process in the previous step can be processed with high accuracy in the base material processing unit by performing alignment adjustment in the base material supply unit. Furthermore, even after the processing of the flexible electronic device manufacturing apparatus, since the reference for the processing performed on the base material is required, other processing can be performed by adjusting the alignment based on the reference in the other processing apparatus. Other processing by the apparatus can be performed with high accuracy.
Also, a base material that is provided with a pressure drum that holds and rotates the base material in the base material processing unit and a pressure drum phase detection unit that detects the phase of the pressure cylinder, and is placed on the mounting unit in the base material supply unit Is conveyed to the impression cylinder of the substrate processing unit, and the control unit controls the conveying unit based on the detection result of the impression cylinder phase detection unit, whereby the substrate is supplied from the substrate supply unit to the substrate processing unit. Can be precisely performed, and various high-precision processes can be performed on the substrate in the substrate processing unit.

  According to the flexible electronic device manufacturing apparatus according to the second aspect of the present invention, the position adjusting means adjusts the position of the mounting means by moving and rotating in two different directions in the horizontal plane, thereby enabling precise alignment adjustment. It can be carried out. Therefore, when setting the base material on the base material supply unit, that is, when placing the base material on the mounting means, it is not necessary to accurately place the base material at a predetermined position. It is only necessary to perform rough positioning with an abutment pin or the like installed on the surface. That is, since the preparatory work related to the alignment can be simplified, the burden on the operator can be reduced.

According to the flexible electronic device manufacturing apparatus according to the third aspect of the present invention, a simple structure can be obtained by using the transfer means provided with a gripping claw device that holds the end of the base material. In addition, since the mounting means is a plate-like object having a notch at a position corresponding to the path of the nail in the gripper device, interference between the mounting means and the gripper device of the transfer cylinder can be avoided with a simple structure. can do.

1 is a schematic diagram illustrating a flexible electronic device manufacturing apparatus according to a first embodiment. 3 is a flowchart illustrating steps performed in the flexible electronic device manufacturing apparatus according to the first embodiment. It is the elements on larger scale of the film substrate in which the some process was performed in the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is a schematic perspective view which shows the supply apparatus of the base material supply part in the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the base material supply part in the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the base material supply part in the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the base material supply part in the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. 1 is a block diagram illustrating a control system of a flexible electronic device manufacturing apparatus according to Embodiment 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG. It is explanatory drawing which shows operation | movement of the flexible electronic device manufacturing apparatus which concerns on Example 1. FIG.

  Embodiments of a flexible electronic device manufacturing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. Needless to say, the present invention is not limited to the following examples, and various modifications can be made without departing from the spirit of the present invention.

  A flexible electronic device manufacturing apparatus according to the present embodiment and a flexible electronic device manufactured using the apparatus will be described with reference to FIGS.

  The flexible electronic device manufacturing apparatus according to the present embodiment performs alignment adjustment with high accuracy on a base material, and performs a plurality of processes in manufacturing the electronic device.

  As shown in FIG. 1, the flexible electronic device manufacturing apparatus 1 has a base material supply unit 2 as a supply unit that supplies a film substrate 100 as a base material, and a film substrate 100 supplied by the base material supply unit 2. The base material processing unit 3 that performs a plurality of processes, which will be described later, and the base material discharge unit 4 as a discharge unit that discharges the film substrate 100 processed by the base material processing unit 3.

  As shown in FIG. 3, the film substrate 100 supplied by the base material supply unit 2 is subjected to various processes in a plurality of steps (S <b> 1 to S <b> 4 shown in FIG. 2) in the base material processing unit 3. The gate layer 110, the insulating layer 120, the source / drain layer 130, and the semiconductor 140, which are functional layers, are stacked on the film substrate 100 with high accuracy and discharged by the base material discharge unit 4 (see FIG. 1).

  Although not shown, the discharged film substrate 100 is set in an oven (not shown) separate from the flexible electronic device manufacturing apparatus 1, and each layer 110, 120, 130 stacked on the film substrate 100 is set in the oven. , 140 are fired or crosslinked to obtain a flexible electronic device.

  Examples of the film substrate 100 used in this embodiment include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), flexible glass, cellulose (with a thickness of about 20 to 300 μm ( A kind of paper).

  The substrate supply unit 2, the substrate processing unit 3, and the substrate discharge unit 4 in the flexible electronic device manufacturing apparatus 1 will be described in detail.

  First, the structure of the base material supply unit 2 will be described with reference to FIGS. 1 and 4 to 6.

  As shown in FIG. 1, the base material supply unit 2 includes a supply device 10 that supplies the film substrate 100 and a transport unit that delivers the film substrate 100 supplied by the supply device 10 to the base material processing unit 3. It is comprised by the transfer cylinder 20 of a double cylinder.

  The film substrate 100 is conveyed to a supply position (position shown in FIGS. 1 and 5B) by the supply device 10, and a gripper device 21 provided on the transfer cylinder 20 holds the leading end portion 100a on the upstream side in the conveyance direction of the film substrate 100. In addition to being held, it is transported by the rotation operation of the transfer cylinder 20 (see FIG. 5C) and supplied to the substrate processing unit 3. Here, the supply position is a position where the film substrate 100 is supplied from the supply apparatus 10 to the transfer cylinder 20, that is, a specified position where the gripper device 21 holds the film substrate 100.

  The transfer cylinder 20 is in contact with the impression cylinder 30 in the base material processing unit 3 to be described later, and is connected to the impression cylinder 30 via a gear mechanism (not shown). The transfer cylinder 20 is rotationally driven together with the impression cylinder 30, and the gripping claw device 21 of the transfer cylinder 20 is opened and closed by the transfer cylinder claw opening / closing cam drive device 221 (see FIG. 6), that is, the pressure is applied to the film substrate 100. Switching between the operation of transferring to the cylinder 30 and the operation of not transferring the film substrate 100 to the impression cylinder 30 without switching is performed.

  The conveying means in the present invention is not limited to the transfer cylinder 20 of the present embodiment. For example, the conveying means may be a single-drive transfer cylinder independent of the impression cylinder 30, a transfer cylinder of a single cylinder or a triple cylinder, or a swing device that does not use a transfer cylinder.

  As shown in FIG. 4, the supply device 10 includes a transport table 12 that can be moved on a transport table 11 (see FIGS. 5A to 5C) by a driving source (not shown), and a film substrate 100 that is installed on the transport table 12. It is comprised from the mounting board 13 as a mounting means to mount.

  The base material supply unit 2 attracts the film substrate 100 to the placement board 13 so that the placement position of the film substrate 100 on the placement board 13 does not shift even if the transport table 12 moves on the transport base 11. Adsorption means is provided. In the present embodiment, as a suction means, a plurality of suction holes (not shown) opened on the surface of the mounting board 13 that contacts the film substrate 100 are provided, and a pump 16 that communicates with the suction holes and applies a negative pressure (see FIG. 6). That is, the suction means in the present embodiment vacuum-sucks the film substrate 100 to the mounting board 13 using negative pressure.

  Thus, by providing the suction hole (not shown) and the pump 16, the film substrate 100 can be sucked to the mounting board 13 using the negative pressure generated by the pump 16. That is, the negative pressure generated by the pump 16 acts on the film substrate 100 on the mounting board 13 through an adsorption hole (not shown) communicating with the pump 16, and the film substrate 100 is connected to the mounting board 13. Therefore, even if the transport table 12 moves on the transport table 11, the mounting position of the film substrate 100 on the mounting board 13 does not shift. In addition, when the film substrate 100 is attracted to the placement board 13, the placement position of the film substrate 100 can be adjusted accurately and finely also in alignment adjustment described later.

  The mounting board 13 is a plate-like object on which the film substrate 100 can be mounted, and corresponds to the nail trajectory of the gripping claw device 21 (see FIG. 1) of the transfer cylinder 20 at the upstream end 13a in the conveying direction. A plurality of (four in the present embodiment) cutout portions 13b are provided at the positions where they are placed.

  By providing the notch 13b on the mounting board 13 in this way, the gripper device 21 of the transfer cylinder 20 and the supply apparatus 10 are mounted when the film substrate 100 is transferred from the supply apparatus 10 to the transfer cylinder 20. Interference with the board 13 can be avoided.

  The mounting board 13 on the transfer table 12 is provided with an actuator 14 as a position adjusting means. By actuating the actuator 14, the placement board 13 can be moved in the horizontal direction X and the vertical direction Y in the horizontal plane and rotated in the rotation direction θ on the transport table 12. That is, the placement position of the film substrate 100 with respect to the transport table 12 can be adjusted by adjusting the position of the placement board 13 in the left-right direction X, top-and-bottom direction Y, and rotation direction θ by the actuator 14.

  Further, an alignment camera 15 as a position detection unit for detecting the placement position of the film substrate 100 with respect to the transport table 12 is installed in the movement path of the transport table 12. Thus, by providing the actuator 14 and the alignment camera 15, precise alignment adjustment can be performed with respect to the mounting position of the film substrate 100 with respect to the transport table 12.

  Specifically, the conveyance table 12 on which the film substrate 100 is set is stopped at the alignment adjustment position where the alignment camera 15 is installed (see FIG. 5A), and an alignment mark 101 (in this embodiment) provided in advance on the film substrate 100. Is read by the alignment camera 15 to detect the mounting position of the film substrate 100 with respect to the transport table 12, and the actuator 14 is operated based on the detection result, thereby aligning the alignment mark 101, that is, the film substrate 100. It can be located at a predetermined position (reference position with respect to the transport table 12) (see FIG. 4).

  At this time, the pump 16 is operated to adsorb the film substrate 100 to the mounting board 13, so that the mounting position of the film substrate 100 is adjusted accurately and finely, that is, precise alignment adjustment of the film substrate 100 is performed. It can be performed.

  Thus, by performing precise alignment adjustment of the film substrate 100, the film substrate 100 can be supplied to the transfer cylinder 20 at a predetermined supply position, and can be conveyed to the base material processing unit 3 at a predetermined conveyance position. . Therefore, since the base material processing unit 3 can perform various processes on the film substrate 100 transported at a predetermined transport position every time, the high-precision various processes can be performed on the film substrate 100. .

  In addition, for example, the above-described alignment adjustment is performed in the flexible electronic device manufacturing apparatus 1 according to the present embodiment even for a base material that has been subjected to a predetermined process in the previous step, and various processes can be performed with high accuracy. In addition, after various processes in the flexible electronic device manufacturing apparatus 1, other processes by other processing apparatuses are performed by performing the same alignment adjustment in the other processing apparatuses with reference to the existing alignment marks 101. Can be applied with high accuracy.

  Further, as described above, since the supply apparatus 10 can precisely adjust the alignment of the film substrate 100, when the film substrate 100 is set in the supply apparatus 10, that is, on the mounting board 13 in the supply apparatus 10. When placing the substrate 100, it is not necessary to place the film substrate 100 accurately at a predetermined position, and only rough positioning is performed with an abutment pin (not shown) installed on the placement board 13. good.

  That is, the film substrate 100 is roughly positioned on the placement board 13 by hand placement, the film substrate 100 is attracted to the placement board 13, and the film substrate 100 on the placement board 13 is adjusted by the alignment adjustment described above. Accurate positioning can be performed (positioned at the reference position with respect to the transport table 12), so that when the film substrate 100 is set on the supply apparatus 10, the load on the operator is not increased, and the number of manufacturing steps is increased. There is no invitation.

  As an actuator 14 for driving the mounting board 13 in the supply device 10, that is, as a position adjusting means for the film substrate 100, the mounting board 13 can be moved and rotated in two different directions within the horizontal plane with respect to the transfer table 12. For example, various mechanisms such as a mechanism using a ball screw or a bearing by a driving source such as a motor, a mechanism using hydraulic pressure, air pressure, or the like can be adopted.

  In addition, the conveyance table 12 in a present Example performs the detection and adjustment of the base material set position (not shown) for mounting the film board | substrate 100 on the mounting board 13, and the mounting position of the film board | substrate 100. FIG. And a supply position (see FIG. 5B) for holding the film substrate 100 by the gripping claw device 21 of the transfer cylinder 20, and its moving mechanism and drive source Etc. are not particularly limited. In order to accurately move the transport table 12, that is, the film substrate 100 from the alignment adjustment position to the supply position, the transport table 12 is preferably linearly driven by a linear motor or the like (not shown).

  Of course, the above-mentioned base material set position, alignment adjustment position, and supply position are set to the same position, and without moving the transport table 12, the setting of the film substrate 100, the detection and adjustment of the mounting position of the film substrate 100, and the transfer Supply to the gripper device 21 of the trunk 20 may be performed.

  Next, the configuration of the substrate processing unit 3 will be described with reference to FIGS. 1 to 3.

  As shown in FIG. 1, the base material processing unit 3 is installed adjacent to the periphery of the impression cylinder 30, and a quadruple impression cylinder 30 that receives the film substrate 100 from the transfer cylinder 20 in the base material supply unit 2. It is comprised by the processing apparatuses 40, 50, 60, and 70 as a processing means. The film substrate 100 is supplied from the base material supply unit 2 to the base material processing unit 3 by being replaced by the gripping claw device 31 provided in the impression cylinder 30 from the gripping claw device 21 of the transfer cylinder 20.

  The impression cylinder 30 is rotationally driven so as to be able to rotate forward and backward by an impression cylinder driving device 230 (see FIG. 6) as impression cylinder driving means, and a holding claw device 31 of the impression cylinder 30 is a transfer cylinder side impression cylinder claw opening / closing cam driving device. The claw is opened and closed by 231a and the discharge part side impression cylinder claw opening / closing cam driving device 231b (see FIG. 6). The film substrate 100 is held by the gripping claw device 31 of the impression cylinder 30 with the leading end 100a in the conveyance direction upstream (the end on the upstream side in the conveyance direction when the impression cylinder 30 is driven to rotate forward). Therefore, the pressure drum 30 is provided with a close contact means so that the bottom side of the film substrate 100 not held by the gripper claw device 31 is not separated from the surface of the pressure drum 30 when the pressure drum 30 is driven in reverse rotation.

  In this embodiment, a contact sheet (not shown) made of a polymer material is attached to the surface of the impression cylinder 30 as the contact means. The film substrate 100 held on the impression cylinder 30 by the gripper device 31 is configured so that the substantially entire surface thereof is in close contact with the surface of the impression cylinder 30. In this way, by providing the pressure drum 30 with close contact means for bringing the film substrate 100 into close contact with the surface of the pressure drum 30, even when the pressure drum 30 is reversely driven by the operation of the pressure drum drive device 230, the gripper device. The bottom side of the film substrate 100 that is not held by 31 is not separated from the surface of the impression cylinder 30, and the film substrate 100 held by the gripper device 31 of the impression cylinder 30 can be stably conveyed and discharged.

  As an adhesion means provided in the impression cylinder 30 in the present invention, the film substrate 100 is adhered to the surface of the impression cylinder 30 by attaching a polymer material having adhesion such as porous porous or silicon as in this embodiment. For example, the bottom side of the film substrate 100 held by the impression cylinder 30 may be held by a holding claw device (not shown).

  The processing devices 40, 50, 60, and 70 are processing means for performing a plurality of processes for providing (stacking) a plurality of functional layers on the film substrate 100 held on the impression cylinder 30 by a printing method or a coating method. In this embodiment, a reversal printing apparatus 40 as a printing apparatus for printing a functional solution for forming a functional layer by a reversal printing method and a functional solution for forming a functional layer by a coating method are provided. Coating device 50 as a coating device for coating, inkjet printing device 60 as a printing device for printing a functional solution for forming a functional layer by an inkjet printing method, and a functional solution printed or applied to film substrate 100 Is a drying device (solidifying device) 70 for drying (solidifying) the material.

  Of course, the processing means in the present invention is not limited to the reverse printing apparatus 40, the coating apparatus 50, the inkjet printing apparatus 60, and the drying apparatus 70 of the present embodiment. The processing means prints or coats one of the plurality of functional layers constituting the flexible electronic device, and then applies the upper layer of the one functional layer to the film substrate 100 held on the impression cylinder 30. Any other functional layer may be used as long as it performs a plurality of processes in the manufacturing stage of the electronic device, such as providing another functional layer by printing or coating.

  As the processing means, for example, a gravure printing device that performs processing by a gravure printing method, an intaglio printing device that performs processing by an intaglio printing method, a relief printing device that performs processing by a letterpress printing method are installed adjacent to the periphery of the impression cylinder 30. In addition to the processing by the printing method, a coating device that performs processing by various coating methods may be installed adjacent to the periphery of the impression cylinder 30. Of course, the contents and number of processes performed by the processing means are not limited to those of the present embodiment.

  The reverse printing apparatus 40 is means for performing one of a plurality of processes on the film substrate 100, and forms the gate layer 110 and the source / drain layer 130 on the film substrate 100 by using the reverse printing method. The conductive solution (functional solution) for printing is printed in a predetermined pattern. As shown in FIG. 1, the reverse printing apparatus 40 includes a double cylinder rubber cylinder 41 in contact with the impression cylinder 30, a double cylinder reverse plate cylinder 42 in contact with the rubber cylinder 41, and the rubber cylinder 41. It consists of a slit die 43 adjacent to the conductive solution supply device (not shown).

  The rubber cylinder 41 is driven to rotate forward and backward independently of the impression cylinder 30 by a reversal printing unit rubber cylinder driving / detaching device 241 (see FIG. 6) as a rubber cylinder driving means and a rubber cylinder attaching / detaching means. It can be attached to and detached from the impression cylinder 30. The reversing plate cylinder 42 is rotationally driven independently of the impression cylinder 30 and the rubber cylinder 41 by a reversal printing section plate cylinder driving / detaching device 242 (see FIG. 6) as plate cylinder driving means and plate cylinder attaching / detaching means. At the same time, it can be attached to and detached from the rubber cylinder 41.

  In addition, the slit die 43 in the reverse printing apparatus 40 is operated by a reverse printing unit slit coater operating device 243 (see FIG. 6). When processing by the reverse printing method is performed, the slit die 43 is moved downward and the rubber cylinder 41 is moved. When the conductive solution is supplied from a conductive solution supply device (not shown) to the slit die 43 and the rubber cylinder 41 (see FIG. 7A), and the processing by the reverse printing method is not performed, the slit die 43 is placed. Is moved to a standby position away from the rubber cylinder 41, and the supply of the conductive solution to the slit die 43 and the rubber cylinder 41 from the conductive solution supply device (not shown) is stopped (see FIG. 7B).

  The conductive solution used in the reverse printing apparatus 40 can be used to form both the gate layer 110 and the source / drain layer 130. The reverse printing apparatus 40 forms the gate layer 110 by a reverse printing method. Printing for forming the source / drain layer 130 is performed. Although it does not specifically limit as a conductive solution, The functional solution which melt | dissolved the metal nanoparticle is mentioned. Examples of the metal nanoparticles include gold, silver, copper, nickel, platinum, palladium, and rhodium, and examples of the solvent include water and alcohol.

  Of course, as the processing means in the present invention, different conductive solutions are used for forming the gate layer 110 and the source / drain layer 130, and printing for forming the gate layer 110 and printing for forming the source / drain layer 130 are performed. You may make it perform using a respectively different apparatus.

  The conductive solution is supplied from a conductive solution supply device (not shown) to the slit die 43 and is supplied from below the slit die 43 to the rubber cylinder 41 that is rotationally driven. The conductive solution supplied to the peripheral surface of the rubber cylinder 41 is removed from the negative pattern (non-imaged portion) conductive solution by the printing plate 42a or 42b provided on the peripheral surface of the inversion plate cylinder 42 that contacts the rubber cylinder 41. Only the conductive solution of the positive pattern (image portion) is left on the peripheral surface of 41. The positive pattern conductive solution left on the peripheral surface of the rubber cylinder 41 is transferred to the film substrate 100 held on the peripheral surface of the impression cylinder 30.

  Two types of printing plates 42 a and 42 b formed in different patterns are attached to the reversal plate cylinder 42 of the reversal printing device 40 in this embodiment, and two types of pattern reversal printing can be performed by one reversal printing device 40. It is configured. The two types of printing plates 42a and 42b are a printing plate 42a for forming a gate layer and a printing plate 42b for forming a source / drain layer. Each of the printing plates 42a and 42b is formed in a pattern corresponding to each layer. Yes.

  Therefore, in the gate layer forming step, the conductive solution of the gate layer pattern is printed on the film substrate 100 by reversal printing using one printing plate 42a, and in the source / drain layer forming step, the other printing plate 42b is used. The conductive solution of the source / drain layer pattern is printed on the film substrate 100 by the reversal printing used.

  That is, the reverse printing apparatus 40 in the present embodiment can print a plurality of functional layers in different patterns (two layers in the present embodiment) on the film substrate 100 held on the impression cylinder 30. The gate electrode layer 110 has a function of both a gate layer forming device for forming the gate layer 110 and a source / drain layer forming device for forming the source / drain layer 130 by printing the conductive solution on the film substrate 100 in different patterns. ing. The printing operation of the reverse printing apparatus 40 in the gate layer forming step and the source / drain layer forming step will be described later.

  In this embodiment, since the printing for forming different layers is performed by the reversal printing apparatus 40, the reversal plate cylinder 42 is a double cylinder so that two types of printing plates 42a and 42b can be attached. The plate cylinder in the present invention is not limited to this. The plate cylinder in the present invention may be, for example, a plate cylinder having a triple cylinder or more to which two types of printing plates are attached, or a plate cylinder having a triple cylinder or more to which three or more types of printing plates are attached.

  The coating apparatus 50 is means for performing one of a plurality of processes on the film substrate 100, and an insulating solution (functional solution) for forming the insulating layer 120 on the film substrate 100 using a coating method. ) Is applied. As shown in FIG. 1, the coating apparatus 50 includes a rubber cylinder 51 in contact with the impression cylinder 30, a slit die 52 adjacent to the upper side of the rubber cylinder 51, and an insulating solution supply device (not shown).

  The rubber cylinder 51 is rotationally driven so that it can rotate forward and backward independently of the impression cylinder 30 by a rubber cylinder driving means and a coating part rubber cylinder driving / detaching device 251 (see FIG. 6) as rubber cylinder attaching / detaching means. At the same time, it can be attached to and detached from the impression cylinder 30.

  In addition, the slit die 52 in the coating apparatus 50 is operated by a coating unit slit coater operating device 252 (see FIG. 6). When processing by the coating method is performed, the slit die 52 is moved downward to approach the rubber cylinder 51. In addition to being positioned at the solution supply position, an insulating solution is supplied from an insulating solution supply device (not shown) to the slit die 52 and the rubber cylinder 51 (see FIG. 7E), and when the coating method is not applied, the slit die 52 is moved upward. Then, it is positioned at a standby position separated from the rubber cylinder 51, and the supply of the insulating solution to the slit die 52 and the rubber cylinder 51 from an insulating solution supply device (not shown) is stopped (see FIG. 7F).

  The insulating solution used in the coating apparatus 50 can be used to form the insulating layer 120, and printing for forming the insulating layer 120 is performed by a coating method using the coating apparatus 50. Although it does not specifically limit as an insulating solution, The functional solution which melt | dissolved the insulating material is mentioned, For example, there exists a functional solution etc. which melt | dissolved polyvinyl phenol in isopropyl alcohol.

  The insulating solution is supplied to the slit die 52 from an insulating solution supply device (not shown), and is supplied from below the slit die 52 to the rubber cylinder 51 that is rotationally driven. The insulating solution supplied to the peripheral surface of the rubber cylinder 51 is applied to the entire surface of the film substrate 100 held by the impression cylinder 30.

  The inkjet printing apparatus 60 is a means for performing one of a plurality of processes on the film substrate 100, and a semiconductor solution (functionality) for forming the semiconductor 140 on the film substrate 100 using the inkjet printing method. Solution). As shown in FIG. 1, the ink jet printing apparatus 60 includes a nozzle head 61 that is installed on the impression cylinder 30 so as to be close to and away from the impression cylinder 30 and a semiconductor solution supply device (not shown).

  When the inkjet printing apparatus 60 performs the process by the inkjet printing method using the inkjet actuator 260 (see FIG. 6), the nozzle head 61 is moved downward to be positioned at a printing position close to the impression cylinder 30 and is not shown. When the semiconductor solution is supplied from the semiconductor solution supply device to the nozzle head 61 and the film substrate 100 (see FIG. 7J), and the processing by the ink jet printing method is not performed, the nozzle head 61 is moved upward and the standby is separated from the impression cylinder 30. At the same time, the supply of the semiconductor solution from the semiconductor solution supply device (not shown) to the nozzle head 61 and the film substrate 100 is stopped (see FIG. 7A).

  The semiconductor solution used in the ink jet printing apparatus 60 can be used for forming a layer of the semiconductor 140, and printing for forming the semiconductor 140 is performed by an ink jet printing method using the ink jet printing apparatus 60. Although it does not specifically limit as a semiconductor solution, The functional solution which melt | dissolved the derivative is mentioned. Examples of the derivative include a polythiophene derivative, a polyacetylene derivative, a polythienylene vinylene derivative, a polyallylamine derivative, a polyacetylene derivative, an acene derivative, and an oligothiophene derivative. Examples of the solvent include water and alcohol.

  When processing by the ink jet printing method is performed, the semiconductor solution is supplied from a semiconductor solution supply device (not shown) to the nozzle head 61 and is ejected from the nozzle head 61 at the printing position to the film substrate 100. On the other hand, when the process by the inkjet printing method is not performed, the supply of the semiconductor solution from the semiconductor solution supply device (not shown) to the nozzle head 61 is stopped and the nozzle head 61 is retracted to the standby position.

  The drying device 70 is a means for performing one of a plurality of processes on the film substrate 100, and irradiates the film substrate 100 on which a predetermined printing or coating has been performed with an IR light to thereby obtain a functional solution. In this method, impurities such as a solvent and a dispersant are removed. Here, the functional solution is a solution having a function such as conductivity and insulation dissolved in a solvent. In the present embodiment, the conductive solution printed by the reversal printing device 40, the inkjet printing device 60, and the like. The insulating solution printed by the coating apparatus 50 is a semiconductor solution printed by the above.

  Of course, the solidification apparatus in the present invention is not limited to the drying apparatus 70 that irradiates the IR light of this embodiment. Examples of the solidification device include a drying device that dries a functional solution, an energy irradiation device that crosslinks an insulating solution that is a functional solution, and a baking device that conducts a conductive solution that is a functional solution. That is, the solidification of the functional solution by the solidification device includes drying by blowing hot air or the like on the functional solution applied or printed by a heater or the like, and irradiating with electron radiation (EB) or xenon (Xe) flash. When the conductive film is baked in a state where the film substrate 100 is held on the impression cylinder 30, and a UV curable insulating material and a UV curable organic semiconductor material are used as the insulating solution and the semiconductor solution, respectively, a UV lamp is used. For example, the insulating solution and the semiconductor solution may be cross-linked while the film substrate 100 is held by the impression cylinder 30 by irradiation.

  In the vicinity of the drying device 70, a pre-drying device presence / absence detection sensor 205 (see FIG. 6) is provided to detect the presence or absence of the film substrate 100 before the drying process (solidification step) by the drying device 70. It is said.

  Next, the structure of the base material discharge part 4 is demonstrated with reference to FIG. 1 and FIG.

  The base material discharge unit 4 includes a discharge device 80 that receives the film substrate 100 from the impression cylinder 30 in the base material processing unit 3 and a discharge table 90 on which the film substrate 100 discharged by the discharge device 80 is placed. .

  The discharge device 80 includes one sprocket 81 installed in the vicinity of the impression cylinder 30 in the base material processing unit 3, and the other sprocket 82 installed behind the impression cylinder 30 (on the left side in FIG. 1). The chain 83 is suspended from both the sprockets 81 and 82. The chain 83 is provided with a claw hook (not shown), and a claw device 84 is provided on the claw hook.

  The sprocket 81 in the discharge device 80 is provided in the vicinity of the impression cylinder 30 in the base material processing unit 3 and is connected to the impression cylinder 30 via a gear mechanism (not shown). The sprockets 81 and 82 and the chain 83 are rotationally driven together with the impression cylinder 30, and a holding claw device 84 provided on a claw rod (not shown) of the chain 83 is opened and closed by a discharge unit claw opening / closing cam driving device 284 (see FIG. 6). That is, switching is performed between an operation in which the nail receives the film substrate 100 from the impression cylinder 30 and an operation in which the nail does not receive the film substrate 100 from the impression cylinder 30.

  The discharging means in the present invention is not limited to the one provided with the discharging device 80 of the present embodiment. For example, the discharge means may be provided with a discharge device that employs a single-drive sprocket independent of the impression cylinder 30, and includes a mechanism via a transfer cylinder that is driven by single drive or gear connection with the impression cylinder 30. Also good.

  The film substrate 100 that has been subjected to a plurality of processes in the base material processing unit 3 is replaced by the gripping claw device 84 of the discharge device 80 from the gripping claw device 31 of the impression cylinder 30, and as the chain 83 of the discharge device 80 travels. Are transported. When the film substrate 100 held by being held by the gripper device 84 reaches the upper side of the discharge table 90 by running of the chain 83, the nail of the gripper device 84 is opened, and the film substrate 100 is released and placed on the discharge table 90. Placed.

  The operation control when performing a plurality of processes in the flexible electronic device manufacturing apparatus 1 will be described below.

  As shown in FIG. 6, the flexible electronic device manufacturing apparatus 1 includes a control device 200 as a control unit that controls operations when performing the above-described plurality of processes.

  Further, the pressure cylinder 30, the rubber cylinder 41 and the reverse printing cylinder 42 of the reverse printing apparatus 40, and the rubber cylinder 51 of the coating apparatus 50 are independently driven, so that the respective phases can be detected. The material processing device 3 includes a pressure drum phase detector 201 as pressure drum phase detection means for detecting the phase of the pressure drum 30 and a rubber drum phase detection means for detecting the phase of the rubber drum 41 of the reverse printing apparatus 40. Inversion printing unit rubber cylinder phase detector 202, inversion printing unit plate cylinder phase detector 203 as plate cylinder phase detecting means for detecting the phase of the inversion plate cylinder 42 of the inversion printing apparatus 40, and rubber cylinder 51 of the coating apparatus 50 And a coating part rubber cylinder phase detector 204 as a rubber cylinder phase detection means for detecting the phase of the cylinder (see FIGS. 1 and 6).

  As shown in FIG. 6, the control device 200 has the cylinders 30, 41, 42, 51 with phases of the impression cylinder phase detector 201, the reverse printing unit rubber cylinder phase detector 202, and the reverse printing unit plate cylinder phase detection. The presence / absence of the film substrate 100 before the drying step is input as a signal from the substrate presence / absence detection sensor 205 before the drying apparatus. Further, the operation information of the suction switch 206 by the operator and the information on the placement position of the film substrate 100 with respect to the transport table 12 detected by the alignment camera 15 in the base material supply unit 2 are input to the control device 200.

  On the other hand, the control device 200 includes a transfer cylinder claw opening / closing cam drive device 221, an impression cylinder drive device 230, a transfer cylinder side pressure drum claw opening / closing cam drive device 231a, a discharge side pressure drum claw opening / closing cam drive device 231b, and a reverse printing unit rubber cylinder. Driving / detaching device 241, reverse printing part plate cylinder driving / detaching device 242, reverse printing part slit coater operating device 243, coating unit rubber cylinder driving / detaching device 251, coating part slit coater operating device 252, inkjet operating device 260, drying Driving instructions for the device operating device 270 and the discharge portion claw opening / closing cam driving device 284 are output as signals. Further, the control device 200 outputs information for starting and ending adsorption of the film substrate 100 to the mounting board 13 to the pump 16, for adjusting the mounting position of the film substrate 100 with respect to the transport table 12. Information is output to the actuator 14.

  The operation of the flexible electronic device manufacturing apparatus 1 according to the present embodiment will be described with reference to FIGS.

First, the base material supply unit 2 prepares to supply the film substrate 100.
The film substrate 100 is set on the supply device 10 by hand placement or the like, that is, the film substrate 100 is placed on the placement board 13 in the supply device 10. At this time, the film substrate 100 is roughly positioned by an unillustrated butting pin or the like installed on the mounting board 13.

  The operator operates the suction switch 206 to start suction of the film substrate 100 to the placement board 13. When suction start information is input to the control device 200 from the suction switch 206, the control device 200 operates the pump 16 so that the film substrate 100 is sucked to the placement board 13 through a suction hole (not shown). Control. Specifically, the suction of the film substrate 100 to the placement board 13 is controlled by opening and closing a valve (not shown) provided inside or outside the pump 16.

  In other words, when suction is started, a valve (not shown) is closed so that negative pressure by the pump 16 acts on the film substrate 100 through a suction hole (not shown). By opening, the negative pressure by the pump 16 is prevented from acting on the film substrate 100 through a suction hole (not shown).

  The suction means in the present invention is not limited to one that starts the suction of the film substrate 100 to the placement board 13 by the operator operating the suction switch 206 as in the present embodiment. For example, by providing a detection sensor (not shown) that detects the film substrate 100 on the mounting board 13, the operator performs rough positioning of the film substrate 100 on the mounting board 13 by hand placement or the like. At this time, the suction may be automatically started.

  Further, the suction means in the present invention is not limited to the one that starts and ends the suction of the film substrate 100 to the mounting board 13 by opening and closing a valve (not shown) as in this embodiment. For example, the suction of the film substrate 100 to the mounting board 13 may be started and ended by turning on and off the pump 16.

  The supply device 10 on which the film substrate 100 is adsorbed to the mounting board 13 is moved by a driving device (not shown) and is positioned at an alignment adjustment position in the vicinity where the alignment camera 15 is installed (see FIG. 5A). Then, the control device 200 controls the actuator 14 based on the detection result of the alignment camera 15 so as to supply the film substrate 100 to the base material processing unit 3 at a predetermined position (see FIG. 6).

  At the alignment adjustment position, the alignment camera 101 reads an alignment mark 101 provided in advance on the film substrate 100, and detects the placement position of the film substrate 100 on the transport table 12 (see FIG. 4). Based on the detection result, the actuator 14 is operated to adjust the position by moving in two different directions X and Y and rotating in the rotational direction θ in the horizontal plane. That is, the alignment board 101, that is, the film substrate 100 is moved to a predetermined position (by moving the mounting board 13 in a horizontal plane in a horizontal direction X, in a vertical direction Y, and in a rotational direction θ). The reference position relative to the transport table 12 is set.

When the film substrate 100 is accurately positioned with respect to the transport table 12, the supply device 10 is further moved by a driving device (not shown) and is positioned at a supply position in the vicinity of the transfer cylinder 20 (see FIG. 5B).
With the above operation, the supply preparation of the film substrate 100 is completed.

Subsequently, the base material processing unit 3 performs a multi-layer printing of functional layers on the film substrate 100.
Before printing, the rubber cylinder 41 of the reversal printing device 40 is in a detached position away from the impression cylinder 30 by a reversal printing unit rubber cylinder driving / detaching device 241, and the plate cylinder 42 is a reversing printing unit plate cylinder driving / detaching device The rubber cylinder 51 of the coating apparatus 50 is in a detached position away from the impression cylinder 30 by the coating part rubber cylinder driving / detaching device 251 (see FIG. 7A).

  First, in the gate layer forming step of Step S1, a conductive solution for forming the gate layer 110 is printed, and the conductive solution is dried.

  When the control device 200 operates the reverse printing unit slit coater actuating device 243 and the reverse printing unit rubber cylinder driving / detaching device 241 (see FIG. 6), the slit die in the reverse printing device 40 by the conductive solution supply device (not shown). The conductive solution is supplied to 43, and the slit die 43 is moved downward so as to be close to the rubber cylinder 41, and the conductive solution is supplied to the circumferential surface of the rubber cylinder 41 that is rotationally driven (see FIG. 7A). When sufficient conductive solution is supplied to the peripheral surface of the rubber cylinder 41, supply of the conductive solution by a conductive solution supply device (not shown) is stopped, and the slit die 43 is moved away from the rubber cylinder 41 and moved to the standby position.

  Next, based on the detection results of the reversal printing unit rubber cylinder phase detector 202 and the reversal printing unit plate cylinder phase detector 203, the control device 200 performs the reversal printing unit rubber cylinder driving / detaching device 241 and the reversal printing unit plate cylinder. By actuating the driving / detaching device 242 (see FIG. 6), the plate cylinder 42 and the rubber cylinder 41 in the reverse printing apparatus 40 are adjusted to the phase of the transfer start position of one printing plate 42a, and the plate cylinder 42 is a rubber cylinder. The plate cylinder 42 and the rubber cylinder 41 are rotationally driven in a state where the printing cylinder 42 is brought into contact with the printing cylinder 41 and a printing pressure is applied (see FIG. 7B). The conductive solution supplied to the peripheral surface of the rubber cylinder 41 is removed by the convex portion of the printing plate 42a attached to the peripheral surface of the plate cylinder 42, leaving only the positive pattern conductive solution. (Positive patterning).

  When the positive patterning of the conductive solution on the peripheral surface of the rubber cylinder 41 is completed, the control device 200 operates the reverse printing part plate cylinder driving / detaching device 242 and, based on the detection result of the impression cylinder phase detector 201, By operating the impression cylinder driving device 230 and the transfer cylinder claw opening / closing cam driving device 221 (see FIG. 6), the plate cylinder 42 is separated from the rubber cylinder 41 and positioned at the standby position, and the substrate supply unit 2 The gripper device 21 of the transfer cylinder 20 in FIG. 5 holds the film substrate 100 on the mounting board 13 in the supply device 10 (see FIG. 5C), and the transfer cylinder 20 is rotated as the impression cylinder 30 is driven to rotate. The film substrate 100 is conveyed (see FIG. 7C).

  The controller 200 operates the impression cylinder driving device 230 and the transfer cylinder claw opening / closing cam driving device 221 based on the detection result of the impression cylinder phase detector 201 at substantially the same time, that is, the transfer in the base material supply unit 2. When the film substrate 100 on the mounting board 13 in the supply device 10 is added by the holding claw device 21 of the trunk 20, the suction of the film substrate 100 to the mounting board 13 is ended almost simultaneously.

  That is, a valve (not shown) provided inside or outside the pump 16 is opened so that negative pressure by the pump 16 does not act on the film substrate 100 through a suction hole (not shown). Therefore, the film substrate 100 is released from the suction to the mounting board 13 due to the negative pressure of the pump 16 and can be conveyed by the transfer cylinder 20.

  Based on the detection result of the impression cylinder phase detector 201, the control device 200 operates the impression cylinder driving device 230, the transfer cylinder side impression claw opening / closing cam driving device 231a, and the transfer cylinder claw opening / closing cam driving device 221 ( 6), the film substrate 100 carried by the gripping claw device 21 of the transfer cylinder 20 is transferred to the gripping claw device 31 of the impression cylinder 30 in the base material processing unit 3, and is rotated by the rotation of the impression cylinder 30. It is conveyed (see FIG. 7C).

The control device 200 operates the impression cylinder driving device 230 and the inverted printing unit rubber cylinder driving / detaching device 241 based on the detection results of the impression cylinder phase detector 201 and the inverted printing unit rubber cylinder phase detector 202 ( 6), the impression cylinder 30 and the rubber cylinder 41 in the reverse printing apparatus 40 are matched to the phase of the transfer start position, the rubber cylinder 41 is brought into contact with the impression cylinder 30, and the impression cylinder is applied with the printing pressure applied. 30 and the rubber cylinder 41 are rotationally driven (see FIG. 7D). Thus, the positive pattern conductive solution left on the peripheral surface of the rubber cylinder 41 is transferred to the film substrate 100 held on the peripheral surface of the impression cylinder 30.
With the above operation, printing of the conductive solution for forming the gate layer on the film substrate 100 is completed.

Next, the conductive solution printed on the film substrate 100 is dried.
The control device 200 operates the impression cylinder driving device 230 and the drying device operating device 270 based on the detection results of the impression cylinder phase detector 201 and the substrate presence / absence detection sensor 205 before the drying device (see FIG. 6). The film substrate 100 that has been printed by the reversal printing device 40 is conveyed to the vicinity of the drying device 70 while being held by the impression cylinder 30, and impurities of the conductive solution are blown away by the IR light of the drying device 70. At the time of drying, by rotating the impression cylinder 30 so as to repeat forward rotation and reverse rotation, the film substrate 100 can be uniformly irradiated with IR light, so that uneven drying can be prevented. Alternatively, the conductive solution may be dried by stopping the impression cylinder 30 for a certain period of time at the drying position where the IR light is irradiated.

  Further, by detecting the presence / absence of the film substrate 100 on the impression cylinder 30 by the substrate presence / absence detection sensor 205 before the drying apparatus, a conveyance failure of the film substrate 100 can be detected. In addition, when it is judged that the substrate substrate presence / absence detection sensor 205 before the drying apparatus does not have the film substrate 100, the flexible electronic device manufacturing apparatus 1 is stopped.

In the present embodiment, the conductive solution printed on the film substrate 100 is dried by irradiating the film substrate 100 held on the impression cylinder 30 with IR light. Without being limited thereto, the conductive solution printed on the film substrate 100 while being held by the impression cylinder 30 may be baked.
With the above operation, the gate layer forming step of Step S1 is completed.

  Next, in the insulating layer forming step of Step S2, an insulating solution for forming the insulating layer 120 is printed, and the insulating solution is dried.

  When the control unit 200 operates the coating unit slit coater operating device 252 and the coating unit rubber cylinder driving / detaching device 251 (see FIG. 6), the insulating die is supplied to the slit die 52 in the coating device 50 by an insulating solution supply device (not shown). While the solution is supplied, the slit die 52 moves downward so as to be close to the rubber cylinder 51, and the insulating solution is supplied to the peripheral surface of the rubber cylinder 51 (see FIG. 7E). When a sufficient insulating solution is supplied to the peripheral surface of the rubber cylinder 51, the supply of the insulating solution by an insulating solution supply device (not shown) is stopped, and the slit die 52 is separated from the rubber cylinder 51 and positioned at the standby position.

  In this embodiment, the operation efficiency in the multi-layer printing is improved by supplying the insulating solution to the slit die 52 and the rubber cylinder 51 in the coating apparatus 50 simultaneously with the drying of the conductive solution. Of course, the operation order in the present invention is not limited to this, and it is needless to say that each operation order can be changed without departing from the gist of the present invention.

The control device 200 operates the impression cylinder driving device 230 and the coating portion rubber cylinder driving / detaching device 251 based on the detection results of the impression cylinder phase detector 201 and the coating portion rubber cylinder phase detector 204 (FIG. 6). The pressure cylinder 30 and the rubber cylinder 51 in the coating apparatus 50 are adjusted to the phase of the transfer start position, the rubber cylinder 51 is brought into contact with the pressure cylinder 30, and the pressure cylinder 30 and the rubber are applied with a printing pressure applied thereto. The barrel 51 is driven to rotate (see FIG. 7F). As a result, the insulating solution supplied to the peripheral surface of the rubber cylinder 51 is transferred to the film substrate 100 held on the peripheral surface of the impression cylinder 30.
With the above operation, the printing of the insulating solution for forming the insulating layer on the film substrate 100 is completed.

Next, the insulating solution printed on the film substrate 100 is dried.
The control device 200 operates the impression cylinder driving device 230 and the drying device operating device 270 based on the detection results of the impression cylinder phase detector 201 and the substrate presence / absence detection sensor 205 before the drying device (see FIG. 6). The film substrate 100 printed by the coating apparatus 50 is conveyed to the vicinity of the drying apparatus 70 while being held by the impression cylinder 30, and impurities of the insulating solution are blown away by the IR light of the drying apparatus 70. At the time of drying, by rotating the impression cylinder 30 so as to repeat forward rotation and reverse rotation, the film substrate 100 can be uniformly irradiated with IR light, so that uneven drying can be prevented. Further, the insulating solution may be dried by stopping the impression cylinder 30 for a certain period of time at a drying position where the IR light is irradiated.

  Further, by detecting the presence / absence of the film substrate 100 on the impression cylinder 30 by the substrate presence / absence detection sensor 205 before the drying apparatus, a conveyance failure of the film substrate 100 can be detected. In addition, when it is judged that the substrate substrate presence / absence detection sensor 205 before the drying apparatus does not have the film substrate 100, the flexible electronic device manufacturing apparatus 1 is stopped.

In the present embodiment, the insulating solution printed on the film substrate 100 is dried by irradiating the film substrate 100 held on the impression cylinder 30 with IR light. Without limitation, the insulating solution printed on the film substrate 100 while being held by the impression cylinder 30 may be crosslinked.
With the above operation, the insulating layer forming step of Step S2 is completed.

  Next, in the source / drain layer forming step in step S3, a conductive solution for forming the source / drain layer 130 is printed.

  When the control device 200 operates the impression cylinder driving device 230 based on the detection result of the impression cylinder phase detector 201 (see FIG. 6), the insulating layer 120 is driven by forward rotation or reverse rotation of the impression cylinder 30. After the film formation is completed, the film substrate 100 is stopped at the preparation position for the source / drain layer formation step. When the film substrate 100 is moved by driving the impression cylinder 30 to rotate in the forward direction, the discharge device in the base material discharge section 4 from the impression cylinder 30 is operated by operating the discharge-unit-side impression cylinder claw opening / closing cam driving device 231b. Do not change to 80.

  When the control device 200 operates the reverse printing unit slit coater actuating device 243 and the reverse printing unit rubber cylinder driving / detaching device 241 (see FIG. 6), the slit die in the reverse printing device 40 by the conductive solution supply device (not shown). The conductive solution is supplied to 43, and the slit die 43 is moved downward so as to be close to the rubber cylinder 41, and the conductive solution is supplied to the circumferential surface of the rubber cylinder 41 that is driven to rotate (see FIG. 7G). When a sufficient conductive solution is supplied to the peripheral surface of the rubber cylinder 41, the supply of the conductive solution by a conductive solution supply device (not shown) is stopped, and the slit die 43 is moved away from the rubber cylinder 41 to the standby position.

  Next, based on the detection results of the reversal printing unit rubber cylinder phase detector 202 and the reversal printing unit plate cylinder phase detector 203, the control device 200 performs the reversal printing unit rubber cylinder driving / detaching device 241 and the reversal printing unit plate cylinder. By actuating the driving / detaching device 242 (see FIG. 6), the plate cylinder 42 and the rubber cylinder 41 in the reverse printing apparatus 40 are matched with the phase of the transfer start position of the other printing plate 42b, and the plate cylinder 42 is the rubber cylinder. The plate cylinder 42 and the rubber cylinder 41 are rotationally driven in a state in which the printing cylinder 42 is brought into contact with the printing cylinder 41 (see FIG. 7H). In the conductive solution supplied to the peripheral surface of the rubber cylinder 41, the negative pattern conductive solution is removed by the convex portions of the printing plate 42b attached to the peripheral surface of the plate cylinder 42, and only the positive pattern conductive solution is left. (Positive patterning).

When the positive patterning of the conductive solution on the peripheral surface of the rubber cylinder 41 is completed, the control device 200 operates the reverse printing part plate cylinder driving / detaching device 242, and the impression cylinder phase detector 201 and the reverse printing part rubber cylinder phase. Based on the detection result of the detector 202, the plate cylinder 42 is separated from the rubber cylinder 41 and waits by operating the impression cylinder driving device 230 and the reverse printing unit rubber cylinder driving / detaching device 241 (see FIG. 6). In the state where the pressure cylinder 30 and the rubber cylinder 41 in the reverse printing apparatus 40 are matched to the phase of the transfer start position, the rubber cylinder 41 is brought into contact with the pressure cylinder 30 and the printing pressure is applied. The impression cylinder 30 and the rubber cylinder 41 are rotationally driven (see FIG. 7I). Thus, the positive pattern conductive solution left on the peripheral surface of the rubber cylinder 41 is transferred to the film substrate 100 held on the peripheral surface of the impression cylinder 30.
With the above operation, printing of the conductive solution for forming the source / drain layer on the film substrate 100 is completed.

Next, the conductive solution printed on the film substrate 100 is dried.
The control device 200 operates the impression cylinder driving device 230 and the drying device operating device 270 based on the detection results of the impression cylinder phase detector 201 and the substrate presence / absence detection sensor 205 before the drying device (see FIG. 6). The film substrate 100 that has been printed by the reversal printing device 40 is conveyed to the vicinity of the drying device 70 while being held by the impression cylinder 30, and impurities of the conductive solution are blown away by the IR light of the drying device 70. At the time of drying, by rotating the impression cylinder 30 so as to repeat forward rotation and reverse rotation, the film substrate 100 can be uniformly irradiated with IR light, so that uneven drying can be prevented. Alternatively, the conductive solution may be dried by stopping the impression cylinder 30 for a certain period of time at the drying position where the IR light is irradiated.

  Further, by detecting the presence / absence of the film substrate 100 on the impression cylinder 30 by the substrate presence / absence detection sensor 205 before the drying apparatus, a conveyance failure of the film substrate 100 can be detected. In addition, when it is judged that the substrate substrate presence / absence detection sensor 205 before the drying apparatus does not have the film substrate 100, the flexible electronic device manufacturing apparatus 1 is stopped.

In the present embodiment, the conductive solution printed on the film substrate 100 is dried by irradiating the film substrate 100 held on the impression cylinder 30 with IR light. Without being limited thereto, the conductive solution printed on the film substrate 100 while being held by the impression cylinder 30 may be baked.
With the above operation, the source / drain layer forming step of step S3 is completed.

  Next, in the semiconductor formation step of step S4, a semiconductor solution for forming the semiconductor 140 is printed.

  The control device 200 operates the impression cylinder driving device 230 based on the detection result of the impression cylinder phase detector 201 (see FIG. 6), so that the source / drain is driven by forward rotation driving or reverse rotation driving of the impression cylinder 30. After the formation of the layer 130 is completed, the film substrate 100 is stopped at the preparation position for the semiconductor formation process. When the film substrate 100 is moved by driving the impression cylinder 30 in the reverse rotation, the discharge device in the base material discharge section 4 from the impression cylinder 30 is operated by operating the discharge section side impression cylinder claw opening / closing cam driving device 231b. Do not change to 80.

When the control device 200 operates the impression cylinder driving device 230 and the inkjet operation device 260 based on the detection result of the impression cylinder phase detector 201 (see FIG. 6), the nozzle head 61 in the inkjet printing device 60 is moved to the impression cylinder. The semiconductor solution is moved downward so as to be close to 30, and the semiconductor solution is supplied to the nozzle head 61 by a semiconductor solution supply device (not shown), and printing is performed on the film substrate 100 held on the peripheral surface of the impression cylinder 30 by the inkjet printing method (See FIG. 7J). When the film substrate 100 is printed by the ink jet printing method, the supply of the semiconductor solution to the nozzle head 61 by the semiconductor solution supply device (not shown) is stopped, and the nozzle head 61 is separated from the impression cylinder 30 to the standby position. Moved.
With the above operation, the printing of the semiconductor solution for forming the semiconductor 140 on the film substrate 100 is completed.

Next, the semiconductor solution printed on the film substrate 100 is dried.
The control device 200 operates the impression cylinder driving device 230 and the drying device operating device 270 based on the detection results of the impression cylinder phase detector 201 and the substrate presence / absence detection sensor 205 before the drying device (see FIG. 6). The film substrate 100 that has been printed by the inkjet printing apparatus 60 is conveyed to the vicinity of the drying apparatus 70 while being held by the impression cylinder 30, and impurities of the semiconductor solution are blown away by the IR light of the drying apparatus 70. At the time of drying, by rotating the impression cylinder 30 so as to repeat forward rotation and reverse rotation, the film substrate 100 can be uniformly irradiated with IR light, so that uneven drying can be prevented. Alternatively, the semiconductor solution may be dried by stopping the impression cylinder 30 for a certain period of time at the drying position where the IR light is irradiated.

  Further, by detecting the presence / absence of the film substrate 100 on the impression cylinder 30 by the substrate presence / absence detection sensor 205 before the drying apparatus, a conveyance failure of the film substrate 100 can be detected. In addition, when it is judged that the substrate substrate presence / absence detection sensor 205 before the drying apparatus does not have the film substrate 100, the flexible electronic device manufacturing apparatus 1 is stopped.

In the present embodiment, the semiconductor solution printed on the film substrate 100 is dried by irradiating the film substrate 100 held on the impression cylinder 30 with IR light. Without being limited thereto, the semiconductor solution printed on the film substrate 100 while being held by the impression cylinder 30 may be crosslinked.
With the above operation, the semiconductor formation process of step S4 is completed.

  As described above, the multi-layer printing of the functional layer on the film substrate 100 in the base material processing unit 3 is completed, and the gate layer 110, the insulating layer 120, the source / drain layer 130, and the semiconductor 140 are highly accurate as shown in FIG. The film substrate 100 laminated on the substrate can be obtained.

  Subsequently, the substrate discharge unit 4 discharges the film substrate 100.

  Based on the detection result of the impression cylinder phase detector 201, the control device 200 operates the impression cylinder driving device 230, the discharge portion side impression drum claw opening / closing cam driving device 231b, and the discharge portion claw opening / closing cam driving device 284 ( 6), the film substrate 100 carried by the gripping claw device 31 of the impression cylinder 30 is replaced by the gripping claw device 84 of the discharge device 80 in the base material discharge section 4, and the impression cylinder 30 is driven to rotate. Accordingly, the sprocket 81 is driven to rotate, whereby the chain 83 travels and the film substrate 100 is conveyed.

  When the film substrate 100 is conveyed to above the discharge table 90 by the discharge device 80, the film substrate 100 is released from the gripper device 84 and stacked on the discharge table 90, and the discharge of the film substrate 100 is completed.

  In the present embodiment, firing and crosslinking of the gate layer 110, the insulating layer 120, the source / drain layer 130, and the semiconductor 140 printed on the film substrate 100 are performed in an oven (not shown) separate from the flexible electronic device manufacturing apparatus 1. Thus, an electronic device in which the gate layer 110, the insulating layer 120, the source / drain layer 130, and the semiconductor 140, which are functional layers, are stacked on the film substrate 100 with high precision can be obtained.

  Of course, the flexible electronic device manufacturing apparatus according to the present invention is not limited to the one that is fired and crosslinked in a separate oven as in this embodiment, and the oven is installed in the base material processing unit 3 of the flexible electronic device manufacturing apparatus 1. In the flexible electronic device manufacturing apparatus 1, the functional layer may be fired and crosslinked.

  The gate layer 110, the insulating layer 120, the source / drain layer 130, and the semiconductor 140 are not limited to those printed at once. For example, after the gate layer 110 is printed, the film substrate 100 is discharged and separated. After performing other processing in the processing apparatus, the remaining insulating layer 120, source / drain layer 130, and semiconductor 140 may be printed again by returning to the flexible electronic device manufacturing apparatus 1.

  When processing a base material using a plurality of processing apparatuses including a flexible electronic device manufacturing apparatus according to the present invention, alignment adjustment of the film substrate 100 is performed in the flexible electronic device manufacturing apparatus 1 as in this embodiment. Accordingly, the film substrate 100 that has been processed in advance can be further processed with high accuracy without imposing a load on the operator.

DESCRIPTION OF SYMBOLS 1 Flexible electronic device manufacturing apparatus 2 Base material supply part (supply means)
3 Base material processing part 4 Base material discharge part (discharge means)
DESCRIPTION OF SYMBOLS 10 Supply apparatus 11 Conveyance stand 12 Conveyance table 13 Mounting board (mounting means)
13a Upstream end portion 13b in the transport direction of the mounting board Notch portion 14 in the mounting board Actuator (position adjusting means)
15 Alignment camera (position detection means)
16 Pump (adsorption means)
20 Crossing (conveying means)
21 Crossing nail device 30 for transfer cylinder Impression cylinder 31 Nail device 40 for impression cylinder Reverse printing device (processing means, printing device)
41 Rubber cylinder 42 Reversing plate cylinder 43 Slit die 50 Coating device (processing means, coating device)
51 Rubber cylinder 52 Slit die 60 Inkjet printing device (processing means, printing device)
61 Nozzle head 70 Drying device (processing means, solidification device)
80 Discharge device 81 Sprocket 82 Sprocket 83 Chain 84 Discharge device gripper device 90 Discharge base 100 Film substrate 101 Alignment mark 110 Gate layer 120 Insulating layer 130 Source / drain layer 140 Semiconductor 200 Controller 201 Impression cylinder phase detector (impression cylinder) Phase detection means)
202 Inverted printing section rubber cylinder phase detector (rubber cylinder phase detection means)
203 Inversion printing section plate cylinder phase detector (plate cylinder phase detection means)
204 Coating part rubber cylinder phase detector (rubber cylinder phase detection means)
205 Pre-drying device presence / absence detection sensor 206 Adsorption switch 221 Crossing claw opening / closing cam driving device 230 Pressure drum driving device (pressure drum driving means)
231a Transfer cylinder side impression cylinder claw opening / closing cam drive unit 231b Discharge unit side impression cylinder claw opening / closing cam drive apparatus 241 Reverse printing unit rubber cylinder driving / detaching device (rubber cylinder driving means and rubber cylinder attaching / detaching means)
242 Reverse printing section plate cylinder driving / detaching device (plate cylinder driving means and plate cylinder attaching / detaching means)
243 Reverse printing section slit coater actuator 251 Coating section rubber cylinder driving / detaching device (rubber cylinder driving means and rubber cylinder attaching / detaching means)
252 Coating unit slit coater actuator 260 Inkjet actuator 270 Dryer actuator 284 Discharge part claw opening / closing cam drive unit

Claims (3)

A flexible electronic device manufacturing apparatus comprising a base material processing unit that prints or applies a functional layer to a flexible base material, and a base material supply unit that supplies the base material to the base material processing unit,
In the base material supply unit,
A mounting means for mounting the substrate;
Adsorbing means for adsorbing the base material to the placing means,
Position adjusting means for adjusting the position of the placing means,
Base material position detecting means for detecting the position of the base material placed on the placing means,
Control means for controlling the position adjusting means based on the detection result of the base material position detecting means so as to supply the base material to the base material processing unit at a predetermined position ;
The base material processing unit includes a pressure drum that holds and rotates the base material, and a pressure drum phase detection unit that detects a phase of the pressure drum,
The substrate supply unit includes a conveying unit that conveys the substrate placed on the placing unit to the impression cylinder of the substrate processing unit,
The flexible electronic device manufacturing apparatus according to claim 1, wherein the control unit controls the transport unit based on a detection result of the impression cylinder phase detection unit . The flexible electronic device manufacturing apparatus according to claim 1, wherein the position adjusting unit adjusts the position of the placing unit by moving and rotating in two different directions within a horizontal plane. The transport means is a transfer cylinder provided with a gripper device that holds and holds an end of a base material;
The flexible electronic device manufacturing apparatus according to claim 1 or 2 , wherein the placing means is a plate-like object having a notch at a position corresponding to a track of the nail in the gripper nail device.

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