JP6245025B2 - Mask for printing and printing method - Google Patents

Description

  The present invention relates to a mask for printing and the like, and relates to a mask used for printing a material to be printed such as cream solder or solder paste on a substrate with different thicknesses.

  An example of a printing mask is disclosed in Patent Document 1. In the printing mask described in Patent Document 1, first, a first metal mask is disposed on a printed wiring board. Next, the cream solder is printed on all lands on the printed wiring board by rolling using a printing squeegee through the opening of the first metal mask. Next, a second metal mask is bonded onto the first metal mask. Next, by rolling using a printing squeegee through the opening of the second metal mask, cream solder is additionally supplied to some lands on the printed wiring board. Thereby, cream solder can be printed on a printed wiring board by different thickness.

JP-A-5-309819

  However, in the technique described in Patent Document 1, after the first metal mask is placed on the printed wiring board and cream solder is printed, the second metal mask is bonded to the first metal mask and the cream solder is used. Again, additional supplies. For this reason, there has been a problem that the time required for the printing process is about twice as long as when the solder cream is printed once.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a printing mask or the like that can easily print a material to be printed with different thicknesses.

  A printing mask according to the present invention is a first mask plate disposed on a substrate having pads for mounting electronic components on the upper surface, with the lower surface facing the upper surface of the substrate and overlapping the substrate. And a second mask plate disposed on the first mask plate with the lower surface facing the upper surface of the first mask plate, and a position corresponding to the pad on the first mask plate When the first opening formed on the second mask plate and the second mask plate are arranged on the first mask plate, the first opening is included inside, and the end surface is the first. A squeegee for applying a printing material to the pad on the substrate via the first opening and the second opening. Nearly perpendicular to the predetermined squeegee movement direction In a predetermined sliding direction is along the upper surface of the first mask, and a drive unit for sliding the said second mask.

  In the printing method of the present invention, a first mask plate having a first opening is overlaid on a substrate having pads for mounting electronic components on the upper surface, and a lower surface faces the upper surface of the substrate. A first mask plate placement step for placing the first opening portion in correspondence with the position of the pad, and the first opening portion when the first opening portion is placed on the first mask plate. A second mask plate including a second opening having an inner surface and an end surface provided in the vicinity of the end surface of the first opening is arranged with the lower surface facing the upper surface of the first mask plate, A second mask plate placement step to be placed on the mask plate, and a squeegee is moved along the upper surface of the second mask plate, whereby the first opening and the second opening The material to be printed is applied onto the pad via A printing material application step, and a drive unit that is substantially perpendicular to a predetermined squeegee movement direction that is a direction in which the squeegee is moved to apply the printing material to the pad on the substrate. And a second mask plate sliding step for sliding the second mask plate along the upper surface of the first mask plate in the sliding direction.

  According to the printing mask and the like according to the present invention, it is possible to easily print the printing material with different thicknesses.

It is a figure which shows the state which attached the printing mask in the 1st Embodiment of this invention on the printed wiring board. FIG. 1A is a top view showing a state in which the printing mask according to the first embodiment of the present invention is attached to a printed wiring board. FIG. 1B is a cross-sectional view showing a state in which the printing mask according to the first embodiment of the present invention is attached to the printed wiring board, and is a cross-sectional view taken along the line AA in FIG. It is. It is a figure which shows the structure of a printed wiring board. FIG. 2A is a top view of the printed wiring board. FIG. 2B is a cross-sectional view of the printed wiring board, and is a cross-sectional view taken along the line BB in FIG. It is a figure which shows the structure of the 1st mask board of the printing mask in the 1st Embodiment of this invention. FIG. 3A is a top view showing the configuration of the first mask plate of the printing mask according to the first embodiment of the present invention. FIG. 3B is a cross-sectional view showing the configuration of the first mask plate of the printing mask according to the first embodiment of the present invention, and is a cross-sectional view taken along the line CC in FIG. is there. It is a figure which shows the structure of the 2nd mask board of the printing mask in the 1st Embodiment of this invention. FIG. 4A is a top view showing the configuration of the second mask plate of the printing mask according to the first embodiment of the present invention. FIG. 4B is a cross-sectional view showing the configuration of the second mask plate of the printing mask in the first embodiment of the present invention, and is a cross-sectional view taken along the line DD in FIG. is there. It is a figure which shows the printing flow in the 1st Embodiment of this invention. It is a figure for demonstrating the process of FIG.5 (b). FIG. 6A is a diagram showing the arrow P. FIG. FIG. 6B is a view showing a cross section taken along the section A1-A1 of FIG. It is a figure which shows roughly the residual state of the to-be-printed material in a specific 2nd opening part. FIG. 7A is a top view of the specific second opening after printing the printing material. FIG. 7B is a perspective view of the specific second opening after printing the printing material. It is a figure which shows the state which attached the printing mask in the 2nd Embodiment of this invention on the printed wiring board. FIG. 8A is a top view showing a state in which the printing mask according to the second embodiment of the present invention is attached to the printed wiring board. FIG. 8B is a cross-sectional view showing a state in which the print mask according to the second embodiment of the present invention is attached to the printed wiring board, and is a cross-sectional view taken along the line E-E in FIG. It is. It is a figure which shows the structure of the 2nd mask board of the mask for printing in the 3rd Embodiment of this invention. FIG. 9A is a top view of the second mask plate. FIG. 9B is a cross-sectional view of the second mask, which is a cross-sectional view taken along the line F-F in FIG. It is a figure which shows the state which attached the printing mask in the 4th Embodiment of this invention on the printed wiring board. FIG. 10A is a top view showing a state in which the printing mask according to the fourth embodiment of the present invention is attached to the printed wiring board. FIG. 10B is a cross-sectional view showing a state in which the print mask according to the fourth embodiment of the present invention is attached to the printed wiring board, and is a cross-sectional view taken along the line GG in FIG. It is. It is a figure for demonstrating the structure of a drive part, Comprising: It is an enlarged view of the H section of FIG.10 (b). It is a figure which shows the state which attached the printing mask in the 5th Embodiment of this invention on the printed wiring board. FIG. 12A is a top view showing a state in which the printing mask according to the fifth embodiment of the present invention is attached to the printed wiring board. FIG. 12B is a cross-sectional view showing a state in which the printing mask according to the fifth embodiment of the present invention is attached to the printed wiring board, and is a cross-sectional view taken along the line JJ in FIG. It is. It is a figure for demonstrating the structure of a positioning parameter | index. FIG. 13A is an enlarged top view of the positioning index. FIG.13 (b) is an enlarged view of the K section of FIG.12 (b). It is a figure for demonstrating the structure of a positioning parameter | index. FIG. 14A is a top view of the second positioning opening formed in the second mask plate. FIG. 14B is a top view of the first positioning opening formed in the first mask plate. FIG. 14C is a top view showing the configuration of the light detection sensor. It is a figure which shows the state which attached the printing mask in the 6th Embodiment of this invention on the printed wiring board. FIG. 15A is a top view showing a state in which the printing mask according to the sixth embodiment of the present invention is attached to the printed wiring board. FIG. 15B is a cross-sectional view showing a state in which the print mask according to the sixth embodiment of the present invention is attached to the printed wiring board, and is a cross-sectional view taken along the line L-L in FIG. It is. It is a figure for demonstrating the structure of a positioning parameter | index. 16 (a) and 16 (b) are cross-sectional views of the positioning index and include an enlarged view of the M part in FIG. 15 (b). It is a figure which shows the state which attached the printing mask in the 7th Embodiment of this invention on the printed wiring board. FIG. 17A is a top view showing a state in which the printing mask according to the seventh embodiment of the present invention is attached to the printed wiring board. FIG. 17B is a cross-sectional view showing a state in which the print mask according to the seventh embodiment of the present invention is attached to the printed wiring board, and is a cross-sectional view taken along the line NN in FIG. It is. It is a figure for demonstrating the structure of a positioning parameter | index. 18 (a) and 18 (b) are cross-sectional views of a positioning index and include an enlarged view of a P portion in FIG. 17 (b).

<First Embodiment>
A configuration of the printing mask 100 according to the first embodiment of the present invention will be described. FIG. 1 is a diagram showing a state in which the printing mask 100 is attached on the printed wiring board 200. FIG. 1A is a top view showing a state in which the printing mask 100 is attached on the printed wiring board 200. FIG. 1B is a cross-sectional view showing a state in which the print mask 100 is mounted on the printed wiring board 200, and is a cross-sectional view taken along the line AA in FIG.

  As shown in FIGS. 1A and 1B, the printing mask 100 includes a first mask plate 110, a second mask plate 120, and a drive unit 130. Of the printing mask 100, the first mask plate 110 and the second mask plate 120 are disposed on the printed wiring board 200.

  For convenience of explanation, first, the configuration of the printed wiring board 200 will be described, and then the configuration of the printing mask 100 will be described.

  FIG. 2 is a diagram illustrating a configuration of the printed wiring board 200. FIG. 2A is a top view of the printed wiring board 200. FIG. 2B is a cross-sectional view of the printed wiring board 200 and is a cross-sectional view taken along the line BB in FIG.

  As shown in FIGS. 2A and 2B, the printed wiring board 200 is formed in a plate shape. The printed wiring board 200 has a plurality of pads 201. The printed wiring board 200 corresponds to the board of the present invention.

  The plurality of pads 201 are formed on the upper surface of the printed wiring board 200 (the upper surface in FIG. 2B). The plurality of pads 201 are formed for mounting electronic components (not shown) on the upper surface of the printed wiring board 200. The base material of the printed wiring board 200 is formed by laminating a conductive layer (not shown) and an insulating layer (not shown). As a material of the plurality of pads 201 and the conductive layer, for example, a conductive metal material such as a copper alloy or a gold alloy is used.

  In FIG. 1A, FIG. 1B, FIG. 2A, and FIG. 2B, among the plurality of pads 201, a pad particularly related to the present invention is shown as a specific pad 201a. That is, the specific pad 201a corresponds to the pad of the present invention.

  The configuration of the printed wiring board 200 has been described above.

  Next, the configuration of the printing mask 100 will be described. The printing mask 100 includes a first mask plate 110, a second mask plate 120, and a drive unit 130. Here, after describing the configuration of the first mask plate 110, the configuration of the second mask plate 120 will be described, and finally the drive unit 130 will be described.

  FIG. 3 is a diagram illustrating a configuration of the first mask plate 110 of the printing mask 100. FIG. 3A is a top view showing the configuration of the first mask plate 110 of the printing mask 100. FIG. 3B is a cross-sectional view showing the configuration of the first mask plate 110 of the printing mask 100, and is a cross-sectional view taken along the line CC in FIG.

  As shown in FIGS. 3A and 3B, the first mask plate 110 is formed in a plate shape. Further, as shown in FIGS. 1A and 1B, the first mask plate 110 is formed on the upper surface (the upper surface in FIG. 1B) of the printed wiring board 200 and the lower surface (FIG. 1). (B) A surface on the lower side of the drawing is opposed to the printed wiring board 200 so as to overlap each other. The first mask plate 110 has a plurality of first openings 111. The first mask plate 110 is also called a first stencil. For example, a metal material such as stainless steel is used as the material of the first mask plate 110.

  As shown in FIG. 3A and FIG. 3B, the plurality of first openings 111 pass through the positions corresponding to the positions where the plurality of pads 201 are formed on the printed wiring board 200. Is formed.

  In FIG. 1A, FIG. 1B, FIG. 3A, and FIG. 3B, among the plurality of first openings 111, the first opening particularly related to the present invention is This is shown as the specific first opening 111a. That is, the specific first opening 111a corresponds to the first opening of the present invention. As shown in FIGS. 1A and 1A, the shape of the specific first opening 111a in a top view is substantially the same as that of the specific pad 201a. The specific first opening 111a is formed at a position corresponding to the position where the specific pad 201a is formed.

  FIG. 4 is a diagram illustrating the configuration of the second mask plate 120 of the printing mask 100. FIG. 4A is a top view showing the configuration of the second mask plate 120 of the printing mask 100. FIG. 4B is a cross-sectional view showing a configuration of the second mask plate 120 of the printing mask 100, and is a cross-sectional view taken along the line DD in FIG.

  As shown in FIGS. 4A and 4B, the second mask plate 120 is formed in a plate shape. Further, as shown in FIGS. 1A and 1B, the second mask plate 120 has a lower surface (a surface on the lower side in FIG. 1B) on the upper surface (first surface of the first mask plate 110). It is arranged on the first mask plate 110 so as to face the upper surface of FIG. The second mask plate 120 has a plurality of second openings 121. The second mask plate 120 is also called a second stencil. As the material of the second mask plate 120, for example, a metal material such as stainless steel is used.

  As shown in FIG. 1A and FIG. 4A, the plurality of second openings 121 are formed so as to surround a part of the first openings 111 of the first mask plate 110. Yes.

  In FIG. 1A, FIG. 1B, FIG. 4A, and FIG. 4B, among the plurality of second openings 121, the second opening particularly related to the present invention is This is shown as the specific second opening 121a. That is, the specific second opening 121a corresponds to the second opening of the present invention. As shown in FIG. 1A and FIG. 1B, when the second mask plate 120 is placed on the first mask plate 110, the specific second opening 121a is specified. The first opening 111a is included inside, and the end face is provided in the vicinity of the end face of the specific first opening 111a.

  As shown in FIG. 1A and FIG. 1B, the driving unit 130 moves the second mask 120 along the upper surface of the first mask 110 (the upper surface in FIG. 1B). And slide in a predetermined sliding direction (arrow α1, arrow α2). Here, FIG. 1A shows predetermined squeegee movement directions (arrow β1, arrow β2). This predetermined squeegee movement direction (arrow β1, arrow β2) is applied to the printing material (cream solder, solder paste, etc.) on the pad 201 on the printed wiring board 200 via the first opening 111 and the second opening 121. ) To move a squeegee (not shown). The predetermined sliding directions (arrow α1, arrow α2) are set substantially perpendicular to the predetermined squeegee moving directions (arrow β1, arrow β2). Note that the upper surface of the first mask 110 corresponds to the main surface of the first mask of the present invention.

  The configuration of the print mask 100 has been described above.

  Next, a method for printing a printing material on the pad 201 on the printed wiring board 200 using the printing mask 100 will be described. FIG. 5 is a diagram showing a printing flow in the first embodiment of the present invention.

  As shown in FIG. 5A, first, a printed wiring board 200, a first mask plate 110, and a second mask plate 120 are prepared. Then, the first mask plate 110 and the second mask plate 120 are disposed on the upper surface of the printed wiring board 200. Fig.5 (a) shows the arrangement | positioning relationship between each member same as FIG.1 (b).

  More specifically, first, the first mask plate 110 having the first opening 111 (including the specific first opening 111a), the pad 201 (including the specific pad 201) on the upper surface (FIG. 1 (b) the upper surface of the printed wiring board 200, and the lower surface (FIG. 1 (b) lower surface of the paper) is the upper surface of the printed wiring board 200 (upper surface of FIG. 1 (b)). ) And the first opening 111 is arranged in correspondence with the position of the pad 201. The step of disposing the first mask plate 110 on the printed wiring board 200 corresponds to the first mask plate disposing step of the present invention.

  Next, the second mask plate 120 having the second opening 121 (including the specific second opening 121a) is used, and the lower surface (the lower surface in FIG. 1B) is the first mask plate. It is placed on the first mask plate 110 so as to face the upper surface of 110 (the upper surface in FIG. 1B). The step of disposing the second mask plate 120 on the first mask plate 110 corresponds to the second mask plate disposing step of the present invention. When the second mask plate 120 is overlaid on the first mask plate 110, as shown in FIGS. 1A and 1B, the specific second opening 121a has the specific first opening 121a. One opening 111a is included inside, and an end surface is provided in the vicinity of the end surface of the specific first opening 111a.

  Further, the drive unit 130 is connected to the second mask plate 120 so that the second mask plate 120 can slide.

  Next, as shown in FIG. 5B, the first opening 111 (specific first opening 111a) is moved by moving a squeegee (not shown) along the upper surface of the second mask plate 120. And the second opening 121 (including the specific second opening 121a) and the pad 201 (including the specific pad 201a) of the printing material SP (solder paste, cream solder, etc.). Apply on top. At this time, the squeegee is moved in the predetermined squeegee moving direction (arrow β1, arrow β2) shown in FIG. As a result, the printing material SP is printed on the pad 201 (including the specific pad 201a). The process of FIG.5 (b) is corresponded to the printing material application | coating step of this invention.

  Here, FIG. 6 is a figure for demonstrating the process of FIG.5 (b). That is, FIG. 6 shows that the first opening 111 (including the specific first opening 111a) and the second opening 121 (the specific second opening 121a) are made using a squeegee (not shown). 2 is a diagram illustrating a state after the printing material SP is applied onto the pad 201 (including the specific pad 201a) on the printed wiring board 200. FIG. 6A is a diagram showing the arrow P. FIG. FIG. 6B is a view showing a cross section taken along the section A1-A1 of FIG.

  As shown in FIGS. 6A and 6B, the printing material SP is filled inside the first opening 111 (including the specific first opening 111a). Of the inner side of the second opening 121 (including the specific second opening 121a), along the inner wall of the opposite side extending in a direction substantially parallel to the squeegee movement direction (arrow β1, arrow β2). The printing material SP remains.

  FIG. 7 is a diagram schematically showing a remaining state of the printing material SP in the specific second opening 111a. FIG. 7A is a top view of the specific second opening 111a after the printing material is printed. FIG. 7B is a perspective view of the specific second opening 111a after the printing material is printed.

  As shown in FIGS. 7A and 7B, the inner side of the specific second opening 121a extends in a direction substantially parallel to the squeegee moving direction (arrow β1, arrow β2). The printing material SP remains along the inner wall of the opposite side. At this time, the printing material SP remaining inside the specific second opening 121a remains so that the volume decreases from the lower surface of the second mask plate 120 toward the upper surface.

  Next, as shown in FIG. 5C and FIG. 1A, the drive unit 130 moves along the upper surface (main surface) of the first mask plate 110 in a predetermined sliding direction (arrow α1). Then, the second mask plate 120 is slid. Note that the predetermined sliding direction is substantially perpendicular to the predetermined squeegee moving direction (arrow β1, arrow β2) as described above. As a result, as shown in FIG. 5C, the printing material remaining SP-a remaining inside the specific second opening 121a is filled in the specific first opening 111a. Separated from the SP.

  Next, as shown in FIG. 5D and FIG. 1A, the drive unit 130 causes the first mask plate 110 to move in a predetermined sliding direction (arrow α2 (the direction opposite to the arrow α1)). The second mask plate 120 is slid along the upper surface (main surface). Thereby, among the printing material SP shown in FIG. 5D, the printing material SP filled in the second opening 121 other than the specific second opening 121a, and the specific first The printing material SP filled in the first opening 111 other than the opening 111a is joined again. As a result, the printing material SP is printed on the pad 201 on the left side of FIG. 5D at a height corresponding to the thickness of the first mask plate 110 and the second mask plate 120 combined. .

  Further, as shown in FIG. 5 (d), even after the second mask plate 120 is slid by the drive unit 130 in the predetermined sliding direction (arrow α2), the specific second opening The printing material residue SP-a remaining inside the portion 121a remains separated from the SP filled in the specific first opening 111a. Therefore, the printing material SP is printed on the specific pad 201a at a height corresponding to the thickness of the first mask plate 110 without including the printing material residue SP-a.

  Further, on the pad 201 in the central portion of FIG. 5D, the printing material SP is only filled inside the first mask plate 110 at the stage of the processing of FIG. There is no print residue SP-a. Therefore, the printing material SP is printed on the pad 201 at the center of FIG. 5D at a height equivalent to the thickness of the first mask plate 110.

  Finally, as shown in FIG. 5E, the printing mask 100 is removed from the printed wiring board 200. This process corresponds to a printing mask removing step. Thereby, as shown in FIG. 5E, the printing material SP can be printed on the printed wiring board 200 with different thicknesses.

  The method for printing the printing material on the pad 201 on the printed wiring board 200 using the printing mask 100 has been described above.

  As described above, the printing mask 100 according to the first embodiment of the present invention includes the first mask plate 110, the second mask plate 120, the specific first opening 111a, and the specific second opening. Part 121a) and the drive part 130 are provided. The first mask plate 110 is placed on a printed wiring board 200 having a specific pad 201a for mounting an electronic component (not shown) on the upper surface, and the lower surface faces the upper surface of the printed wiring board 200. Arranged on top of each other. The second mask plate 120 is disposed so as to overlap the first mask plate 110 with the lower surface facing the upper surface of the first mask plate 110. The specific first opening 111a is formed in the first mask 110 at a position corresponding to the specific pad 201a. The specific second opening 121a includes the specific first opening 111a on the inner side when the second mask plate 120 is disposed on the first mask plate 110, and the end face is the specific first opening. Provided in the vicinity of the end surface of the opening 111a. The drive unit 130 moves along a top surface of the first mask 110 in a predetermined sliding direction (arrow α1, arrow α2) that is substantially perpendicular to a predetermined squeegee moving direction (arrow β1, arrow β2). The second mask 120 is slid. Here, the predetermined squeegee movement direction (arrow β1, arrow β2) applies the material to be printed to the specific pad 201a on the printed wiring board 200 through the specific first opening 111a and the specific second opening 121a. This is the direction in which the squeegee (not shown) is moved.

  When this printing mask 100 is used, by moving a squeegee (not shown) in a state where the first mask plate 110 and the second mask plate 120 are arranged on the upper surface of the printed wiring board 200, The printing material SP is applied onto the specific pad 201a through the specific first opening 111a and the specific second opening 121a. At this time, the printing material SP remains along the inner wall of the opposite side extending in a direction substantially parallel to the squeegee moving direction (arrow β1, arrow β2) inside the specific second opening 121a. .

  However, in the printing mask 100, as described above, the drive unit 130 causes the driving mask 130 to move in a predetermined sliding direction (arrow α1, arrow α2) that is substantially perpendicular to a predetermined squeegee movement direction (arrow β1, arrow β2). Then, the second mask 120 is slid along the upper surface of the first mask 110.

  By sliding the second mask 120, the SP to be left of the printing material remaining inside the specific second opening 121 a is filled in the specific first opening 111 a. And separated. Therefore, after the printing material SP is printed on the printed wiring board 200 and the printing mask 100 is removed from the printed wiring board 200, the printing material residue SP-a is removed. That is, according to the printing mask 100, the printing material can be easily printed at different thicknesses without supplying the printing material twice as in the technique described in Patent Document 1.

  The printing method according to the first embodiment of the present invention includes a first mask plate placement step, a second mask plate placement step, a printing material application step, and a second mask plate sliding step. Is included. In the first mask plate arrangement step, the first mask plate 110 having the specific first opening 111a is placed on the printed wiring board 200 having a specific pad 201a on the upper surface for mounting an electronic component (not shown). The bottom surface is opposed to the top surface of the printed wiring board 200. At the same time, the first mask plate 110 is arranged with the specific first opening 111a corresponding to the position of the specific pad 201a. In the second mask plate arrangement step, the second mask plate 120 having the specific second opening 121a is overlaid on the first mask plate 110 with the lower surface facing the upper surface of the first mask plate 110. And place it. The specific second opening portion 121a includes the specific first opening portion 111a on the inner side when disposed on the first mask plate 110, and has an end surface in the vicinity of the end surface of the specific first opening portion 111a. Provided. In the printing material application step, by moving a squeegee (not shown) along the upper surface of the second mask plate 120, printing is performed via the specific first opening 111a and the specific second opening 121a. The material SP is applied onto the specific pad 201a. In the second mask plate sliding step, the driving unit 130 moves the first mask plate in a predetermined sliding direction (arrow α1, arrow α2) that is substantially perpendicular to the predetermined squeegee moving direction (arrow β1, arrow β2). The second mask plate 120 is slid along the upper surface of the first mask plate 110. The predetermined squeegee moving directions (arrow β1, arrow β2) are directions in which a squeegee (not shown) is moved in order to apply the printing material SP to the specific pad 201 on the printed wiring board 200. This printing method also has the same effect as that of the printing mask 100 described above.

<Second Embodiment>
Next, the configuration of the printing mask 100A according to the second embodiment of the present invention will be described. FIG. 8 is a view showing a state in which the printing mask 100A is attached on the printed wiring board 200. FIG. FIG. 8A is a top view showing a state in which the print mask 100A is attached to the printed wiring board 200. FIG. FIG. 8B is a cross-sectional view showing a state in which the print mask 100A is attached to the printed wiring board 200, and is a cross-sectional view taken along the line E-E in FIG. In FIG. 8, constituent elements equivalent to those shown in FIGS. 1 to 7 are given the same reference numerals as those shown in FIGS. 1 to 7.

  As shown in FIGS. 8A and 8B, the printing mask 100A includes a first mask plate 110A, a second mask plate 120A, and a drive unit 130. Of the mask for printing 100 </ b> A, the first mask plate 110 and the second mask plate 120 </ b> A are arranged on the printed wiring board 200.

  Here, FIG. 1 (a), (b) and FIG. 8 (a), (b) are contrasted. In FIG. 8A and FIG. 8B, the first mask plate 110A and the second mask plate 120A have a first magnetic member 112 and a second magnetic member 122, respectively. In contrast, in FIG. 1A and FIG. 1B, the first mask plate 110 and the second mask plate 120 do not have a magnetic member. In this respect, they are different from each other.

  The first magnetic member 112 is attached to the upper surface of the first mask plate 110A (the upper surface of FIG. 8B). The first magnetic member 112 is brought into close contact with the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120A by attracting the second magnetic member 122 with a magnetic force.

  The second magnetic member 122 is attached to the lower surface of the second mask plate 120A (the lower surface in FIG. 8B). The second magnetic member 122 attracts the first magnetic member 112 by a magnetic force, thereby bringing the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120A into close contact with each other.

  In FIGS. 8A and 8B, the magnetic member is provided on both the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120B. On the other hand, the magnetic member may be provided on either the upper surface of the first mask plate or the lower surface of the second mask plate. Even in this case, the magnetic member brings the upper surface of the first mask plate 110A into close contact with the lower surface of the second mask plate 120B.

  As described above, the printing mask 100A according to the second embodiment of the present invention includes the magnetic members (for example, the first magnetic member 112 and the second magnetic member 122). The magnetic member is provided on one or both of the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120B. The magnetic member closely contacts the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120B. Thus, the first mask plate 110A and the second mask plate 120A are arranged on the printed wiring board 200, and the printing material is applied to the pads via the first opening 111 and the second opening 121. At this time, it is possible to prevent the printing material from flowing between the first mask plate 110A and the second mask plate 120A (between the plate thickness directions (the vertical direction in FIG. 8B)).

  Further, the magnetic member particularly has an outer peripheral portion of the first opening 111 (including the specific first opening 111a) and an outer peripheral portion of the second opening 121 (including the specific second opening 121a). It is good to be formed. Thus, the first mask plate 110A and the second mask plate 120A are arranged on the printed wiring board 200, and the printing material is applied to the pads via the first opening 111 and the second opening 121. At this time, it is possible to efficiently prevent the printing material from flowing between the first mask plate 110A and the second mask plate 120A (between the plate thickness directions (the vertical direction in FIG. 8B)).

  Further, in the printing method according to the second embodiment of the present invention, the magnetic member (for example, the first magnetic member 112, the second magnetic member 112) that closely contacts the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120B. The magnetic member 122) is provided on one or both of the upper surface of the first mask plate 110A and the lower surface of the second mask plate 120A. In the second mask plate placement step, the second mask plate 120A is placed on the first mask plate 110A so that the lower surface faces the upper surface of the first mask plate 110A, and the magnetic force of the magnetic member The upper surface of the first mask plate 110A and the lower surface of the second mask plate 120B are brought into close contact with each other. This printing method also provides the same effect as that of the printing mask 100A described above.

<Third Embodiment>
Next, the configuration of the printing mask in the third embodiment of the present invention will be described. FIG. 9 is a diagram showing the configuration of the second mask plate 120B of the printing mask according to the third embodiment of the present invention. FIG. 9A is a top view of the second mask plate 120B. FIG. 9B is a cross-sectional view of the second mask 120B, and is a cross-sectional view taken along the line FF in FIG. 9A. In FIG. 9, constituent elements equivalent to those shown in FIGS. 1 to 8 are given the same reference numerals as those shown in FIGS. 1 to 8.

  As shown in FIG. 9A and FIG. 9B, the second mask plate 120B includes a movable portion 123, a frame portion 124, and an elastic member 125.

  The movable portion 123 has all of the second openings 121 (including the specific second openings 121a). The movable portion 123 is disposed inside the frame portion 124. The movable portion 123 is connected to the frame portion 124 by an elastic member 125.

  The frame part 124 is disposed so as to surround the movable part 123. The frame part 124 is connected to the movable part 123 by an elastic member 125.

  The elastic member 125 connects between the movable portion 123 and the frame portion 124. The elastic member 125 is provided along the opposite side of the outer periphery of the movable portion 123 in the predetermined sliding direction (arrow α1, arrow α2) described above. The elastic member 125 urges the movable portion 123 of the second mask plate 120B along the sliding direction (arrow α1, arrow α2). As a result, the elastic member 125 biases the second opening 121 (including the specific second opening 121a) of the second mask plate 120B along the sliding direction (arrow α1, arrow α2). .

  As shown in FIG. 9A, predetermined gaps (d1, d2) are provided between the outer end surface of the movable portion 123 and the inner end surface of the frame portion 124.

  The gap d1 is set to such an extent that the outer end surface of the movable portion 123 and the inner end surface of the frame portion 124 abut.

  The gap d2 is set to such an extent that the elastic member 125 can be installed. Further, the gap d2 is such that the moving distance of the movable portion 123 is the width of the bottom surface of the above-described printing material residue SP-a (the sliding direction of the movable portion 123 of the second mask plate 120B (arrow α1, arrow α2)). The width is set to be larger than Thereby, the movement of the movable portion 123 separates the printing material residue SP-a from the printing material SP filled in the first opening 111 (including the specific first opening 111a). can do.

  Next, a method for printing a printing material on the pad 201 on the printed wiring board 200 using the printing mask according to the third embodiment of the present invention will be described.

  In the second mask plate sliding step corresponding to FIG. 5C, the elastic member 125 allows the second opening 121 (including the specific second opening 121a) of the second mask plate 120B to be predetermined. While urging along the sliding direction (arrow α1, arrow α2), the drive unit 130 causes the first mask plate 110 to move along the upper surface in the predetermined sliding direction (arrow α1, arrow α2). The movable part 123 of the second mask plate 120B is slid. Accordingly, the sliding of the specific second opening 121a of the second mask plate 120B is urged by the elastic member 125. As a result, the printing material residue SP-a remaining inside the specific second opening 121a is efficiently separated from the SP filled in the specific first opening 111a. Other operations conform to the above description using FIGS. 5 (a) to 5 (e).

  As described above, the printing mask in the third embodiment of the present invention has the elastic member 125. This elastic member 125 urges the specific second opening 121a of the second mask plate 120B along a predetermined sliding direction (arrow α1, arrow α2). Accordingly, the sliding of the specific second opening 121a of the second mask plate 120B is urged by the elastic member 125. As a result, the printing material residue SP-a remaining inside the specific second opening 121a is efficiently separated from the SP filled in the specific first opening 111a.

  In the printing method according to the third embodiment of the present invention, in the second mask plate sliding step, the elastic member 125 causes the specific second opening 121a of the second mask plate 120B to move in a predetermined sliding direction. While urging along (arrow α1, arrow α2), the drive unit 130 causes the second mask to move along the main surface of the first mask plate 110 in a predetermined sliding direction (arrow α1, arrow α2). The specific second opening 121a of the mask plate 120B is slid. This printing method also has the same effect as the effect of the printing mask in the third embodiment of the present invention.

<Fourth embodiment>
Next, the configuration of a printing mask 100C according to the fourth embodiment of the present invention will be described. FIG. 10 is a diagram illustrating a state in which the printing mask 100C is attached to the printed wiring board. FIG. 10A is a top view showing a state in which the printing mask 100C is mounted on the printed wiring board. FIG. 10B is a cross-sectional view showing a state in which the print mask 100C is attached to the printed wiring board, and is a cross-sectional view taken along the line GG in FIG. In FIG. 10, constituent elements equivalent to those shown in FIGS. 1 to 9 are given the same reference numerals as those shown in FIGS. 1 to 9.

  As shown in FIGS. 10A and 10B, the printing mask 100C includes a first mask plate 110, a second mask plate 120 and B, and a drive unit 130C.

  Here, FIG. 1 (a), (b) and FIG. 10 (a), (b) are contrasted. 10 (a) and 10 (b), a plurality of driving units 130C are provided on the first and second mask plates 110 and 120B, so that FIGS. 1 (a) and 1 (b). And different. 10 (a) and 10 (b), the second mask plate 120B is provided, and the second mask plate 120 is provided in FIGS. 1 (a) and 1 (b). ) Is different.

  As shown in FIG. 10A and FIG. 10B, each part of the plurality of driving units 130C has a predetermined sliding direction (arrows α1,...) Among the first and second mask plates 110 and 120B. It is provided on both ends of the arrow α2). The plurality of driving units 130C may be provided on both end sides in the predetermined squeegee movement direction (arrow β1, arrow β2) among the first and second mask plates 110, 120B. Further, the plurality of driving units 130C may be provided along the four sides of the first and second mask plates 110 and 120B.

  FIG. 11 is a diagram for explaining the configuration of the drive unit 130C, and is an enlarged view of a portion H in FIG. 10B.

  As shown in FIG. 11, a coil 131, a first magnet 132, a second magnet 133, and a ferromagnetic plate 134 are provided.

  As shown in FIG. 11, the coil 131 is provided on the upper surface of the second mask plate 120. The coil 131 is formed by winding a metal wire spirally or annularly.

  As shown in FIG. 11, the first magnet 132 and the second magnet 133 are provided alternately on the lower surface of the first mask plate 110. The first magnet 132 is an N-pole magnet, and the second magnet 133 is an S-pole magnet.

  The ferromagnetic plate 134 is provided on the lower surface of the first mask plate 110. The ferromagnetic plate 134 is, for example, a plate made of iron or the like having a high magnetic permeability.

In the above description, the coil 131 is provided on the upper surface of the second mask plate 120, and the first magnet 132 and the second magnet 133 are provided on the lower surface of the first mask plate 110. On the other hand, the coil 131 may be provided on the lower surface of the first mask plate 110, and the first magnet 132 and the second magnet 133 may be provided on the upper surface of the second mask plate 120.

  Next, a method for printing a printing material on the pad 201 on the printed wiring board 200 using the printing mask 100C according to the fourth embodiment of the present invention will be described.

  5C and 5D, the drive unit 130C operates as follows. That is, an electromagnetic force is generated between the coil 131 and the first and second magnets 132 and 133 by passing a current through the coil 131. In response to this, the first magnet 132 and the second magnet 133 repel each other. As a result, the second mask plate 120 </ b> B moves relative to the first mask plate 110. As a result, similar to the contents described with reference to FIG. 5C, the printing material residue SP-a remaining inside the specific second opening 121a is in the specific first opening 111a. Separated from the filled SP. Similarly to the content described with reference to FIG. 5D, among the printing materials SP, the printing material SP filled in the second opening 121 other than the specific second opening 121a. And the printing material SP filled in the first opening 111 other than the specific first opening 111a are joined again. As a result, the printing material SP is printed on the pad 201 on the left side of FIG. 5D at a height corresponding to the thickness of the first mask plate 110 and the second mask plate 120 combined. .

  Here, the movable portion 123 (second opening 121 (including the specific second opening 121a)) of the second mask plate B is moved in a predetermined squeegee movement direction (arrow β1, arrow β2) by the gap d1. ) Is restricted. On the other hand, the movable portion 123 (second opening 121 (including the specific second opening 121a)) of the second mask plate B is slid in a predetermined sliding direction (arrow α1, arrow α2) by the elastic member 125. ) To move.

As described above, in the printing mask 100C according to the fourth embodiment of the present invention, the driving unit 130C includes the coil 131 and the magnets (the first magnet 132 and the second magnet 133).
The coil 131 is provided on one of the first mask plate 110 and the second mask plate 120B. The magnets (the first magnet 132 and the second magnet 133) are provided on the other side of the first mask plate 110 or the second mask plate 120B so as to face the coil 131. Then, by passing an electric current through the coil 131, an electromagnetic force is generated between the coil 131 and the magnet (the first magnet 132 and the second magnet 133), and the second mask 120B is moved to a predetermined sliding state by the electromagnetic force. Slide along the upper surface of the first mask plate 110 in the moving direction (arrow α1, arrow α2). Thus, the second mask 120B can be slid along the upper surface of the first mask plate 110 in a predetermined sliding direction (arrow α1, arrow α2) with a simple configuration.

  In the printing method according to the fourth embodiment of the present invention, the drive unit 130C includes a coil 131 and magnets (a first magnet 132 and a second magnet 133). The coil 131 is provided on one of the first mask plate 110 and the second mask plate 120B. The magnets (the first magnet 132 and the second magnet 133) are provided on the other side of the first mask plate 110 or the second mask plate 120B so as to face the coil 131. Then, by passing an electric current through the coil 131, an electromagnetic force is generated between the coil 131 and the magnet (the first magnet 132 and the second magnet 133), and the second mask 120B is moved to a predetermined sliding state by the electromagnetic force. Slide along the upper surface of the first mask plate 110 in the moving direction (arrow α1, arrow α2). This printing method also has the same effect as that of the printing mask 100C.

<Fifth embodiment>
Next, the configuration of the printing mask 100D according to the fifth embodiment of the present invention will be described. FIG. 12 is a diagram showing a state in which the printing mask 100D is attached on the printed wiring board 200. FIG. FIG. 12A is a top view showing a state in which the printing mask 100D is attached on the printed wiring board 200. FIG. 12B is a cross-sectional view showing a state in which the print mask 100D is mounted on the printed wiring board 200, and is a cross-sectional view taken along the line JJ in FIG. In FIG. 12, constituent elements equivalent to those shown in FIGS. 1 to 11 are given the same reference numerals as those shown in FIGS. 1 to 11.

  As shown in FIGS. 12A and 12B, the printing mask 100D includes a first mask plate 110, a second mask plate 120, a drive unit 130, and a positioning index 140. ing.

  Here, FIG. 1 (a), (b) and FIG. 12 (a), (b) are compared. 12A and 12B differ from FIGS. 1A and 1B in that the printing mask 100D has a positioning index 140. FIG.

  As shown in FIG. 12A and FIG. 12B, each part of the positioning index 140 is provided at four corners of the first mask plate 110 and the second mask plate 120.

  FIG. 13 is a diagram for explaining the configuration of the positioning index 140. FIG. 13A is a top view of the positioning index 140. FIG.13 (b) is an enlarged view of the K section of FIG.12 (b).

  As shown in FIGS. 13A and 13B, the positioning index 140 includes a first positioning opening 141, a bridge part 142, a second positioning opening 143, and a light source part 144. And a light source cover 145 and a light detection sensor 146.

  FIG. 14 is a diagram for explaining the configuration of the positioning index. FIG. 14A is a top view of the second positioning opening 143 formed in the second mask plate. FIG. 14B is a top view of the first positioning opening 141 formed in the first mask plate. FIG. 14C is a top view showing the configuration of the light detection sensor 146.

  As shown in FIG. 13A, FIG. 13B, and FIG. 14B, the four first positioning openings 141 are provided at the four corners of the first mask plate 110. An assembly of the four first positioning openings 141 is formed in a substantially circular shape. A bridge portion 142 is provided between the four first positioning openings 141.

  As shown in FIG. 13A, FIG. 13B, and FIG. 14B, the bridge portion 142 is provided between the four first positioning openings 141. The intersecting portion of the bridge 142 is disposed at the center of the assembly of the four first positioning openings 141.

  As shown in FIG. 13A, FIG. 13B, and FIG. 14A, the second positioning openings 143 are provided at the four corners of the second mask plate 120. The second positioning opening 143 is provided in a circular shape so as to face the aggregate of the four first positioning openings 141. The center of the second positioning opening 143 is set so as to correspond to the position of the intersection of the bridge 142. That is, the center of the second positioning opening 143 is set so as to correspond to the position of the center of the assembly of the four first positioning openings 141. Further, the outer circumferential circle of the second positioning opening 143 is disposed inside the outer circumferential circle of the assembly of the four first positioning openings 141.

  As shown in FIG. 13A and FIG. 13B, the light source unit 144 is provided on the second mask plate 120 so as to face the second positioning opening 143. The light source unit 144 emits light toward the light detection sensor 146 through the first and second positioning openings 141 and 143.

  As shown in FIGS. 13A and 13B, the light source cover 145 is attached to the second mask plate 120 so as to cover the light source 144 and the second positioning opening 143. ing. The light source cover portion 145 suppresses leakage of light emitted from the light source portion 144.

  As shown in FIG. 13A, FIG. 13B, and FIG. 14C, each of the four light detection sensors 146 corresponds to the position of each of the four first positioning openings 141. And provided on the lower surface of the first mask plate 110. Each of the four light detection sensors 146 receives the light emitted by the light source unit 144 and detects a positional shift that occurs between the first positioning opening 141 and the second positioning opening 143.

  Next, an arrangement method using the positioning index 140 in the second mask plate arrangement step described with reference to FIG.

  First, the first mask plate 110 is disposed on the printed wiring board 200 in an overlapping manner.

  Next, the second mask plate 120 is disposed so as to overlap the first mask plate 110. At this time, the light emitted by the light source unit 144 enters the four light detection sensors 146 via the first and second positioning openings 141 and 143. Each of the four light detection sensors 146 detects the amount of incident light. The direction and amount of displacement of the first mask plate 110 and the second mask plate 120 can be recognized based on the difference in the amount of incident light detected by each of the four light detection sensors 146. Then, the positioning index 140 calculates a correction amount for correcting the displacement direction and the displacement amount of the first mask plate 110 and the second mask plate 120. Based on this correction amount, the position of the second mask plate 120 with respect to the first mask plate 110 is corrected. In this correction processing, the position of the second mask plate 120 with respect to the first mask plate 110 is corrected using the above-described driving units 130 and 130C.

  As described above, the printing mask 100D according to the fifth embodiment of the present invention includes the positioning index 140. The positioning index 140 is provided on one or both of the first mask plate 110 and the second mask plate 120 in order to use the second mask plate 120 on the first mask plate 110. ing. Thereby, the second mask plate 120 can be accurately arranged on the first mask plate 110.

  In the printing method according to the fifth embodiment of the present invention, the positioning index 140 for use when the second mask plate 120 is arranged on the first mask plate 110 is the first mask plate 110 and It is provided on either one or both of the second mask plates 120. In the second mask plate placement step, the positioning mask 140 is used to superimpose the second mask plate 120 on the first mask plate 110 with the lower surface facing the upper surface of the first mask plate 110, Deploy. This printing method also has the same effect as the printing mask 110D.

<Sixth Embodiment>
Next, the configuration of the printing mask 100E according to the sixth embodiment of the present invention will be described. FIG. 15 is a diagram illustrating a state in which the printing mask 100E is attached on the printed wiring board 200. FIG. FIG. 15A is a top view showing a state in which the printing mask 100E is attached on the printed wiring board 200. FIG. FIG. 15B is a cross-sectional view showing a state in which the print mask 100E is attached to the printed wiring board 200, and is a cross-sectional view taken along the line L-L in FIG. In FIG. 15, constituent elements equivalent to those shown in FIGS. 1 to 14 are given the same reference numerals as those shown in FIGS. 1 to 14.

  As shown in FIGS. 15A and 15B, the printing mask 100E includes a first mask plate 110, a second mask plate 120, a drive unit 130, and a positioning index 150. ing.

  Here, FIG. 1 (a), (b) is compared with FIG. 15 (a), (b). FIGS. 15A and 15B differ from FIGS. 1A and 1B in that the printing mask 100E has a positioning index 150. FIG.

  As shown in FIGS. 15A and 15B, the plurality of positioning indexes 150 are provided at the four corners of the first mask plate 110 and the second mask plate 120. In FIG. 15A and FIG. 15B, four positioning indexes 150 are shown. However, at least three positioning indexes 150 may be provided.

  FIG. 16 is a diagram for explaining the configuration of the positioning index 150. 16 (a) and 16 (b) are cross-sectional views of the positioning index 150 and include an enlarged view of the M part in FIG. 15 (b).

  As shown in FIGS. 16A and 16B, the positioning index 150 includes a first positioning opening 141A and a second positioning opening 143A.

  The first positioning opening 141 </ b> A is formed so as to penetrate the first mask plate 110.

  The second positioning opening 143A is formed so as to penetrate the second mask plate 120. The second positioning opening 143A is formed at a position corresponding to the position where the first positioning opening 141A is formed. The size of the second positioning opening 143A is substantially the same as the size of the first positioning opening 141A.

  Next, an arrangement method using the positioning index 150 in the second mask plate arrangement step described with reference to FIG.

  First, the first mask plate 110 is disposed on the printed wiring board 200 in an overlapping manner.

  Next, the second mask plate 120 is disposed so as to overlap the first mask plate 110. At this time, as shown in FIG. 16A and FIG. 16B, adjustment is performed using the pin PI so that the first mask plate 110 and the second mask plate 120 overlap each other at an accurate position. To do. Specifically, the positional relationship between the first mask plate 110 and the second mask plate 120 is corrected by inserting the pins PI into the first and second positioning openings 141A and 143B. Note that the amount of deviation generated between the first mask plate 110 and the second mask plate 120 is assumed to be less than about 500 μm. Assume that the inner diameters of the first positioning opening 141A and the second positioning opening 143A are about φ2 mm. In this case, the first positioning opening 141A and the second positioning opening are inserted into the first positioning opening 141A and the second positioning opening 143A by inserting a pin having a diameter of 1.8 mm. The second mask plate 120 moves in the direction in which 143A coincides. Thereby, the position of the second mask plate 120 with respect to the first mask plate 110 is corrected. The first positioning opening 141A and the second positioning opening 143A overlap each other. As a result, the first mask plate 110 and the second mask plate 120 overlap each other at an accurate position.

  As described above, the printing mask 100E according to the sixth embodiment of the present invention includes the positioning index 150. The positioning index 150 is provided on one or both of the first mask plate 110 and the second mask plate 120 in order to use the second mask plate 120 on the first mask plate 110. ing. Thereby, the second mask plate 120 can be accurately arranged on the first mask plate 110.

  Further, in the printing method according to the sixth embodiment of the present invention, the positioning index 150 for use in arranging the second mask plate 120 on the first mask plate 110 is the first mask plate 110 and It is provided on either one or both of the second mask plates 120. In the second mask plate arrangement step, the second mask plate 120 is overlapped on the first mask plate 110 with the lower surface facing the upper surface of the first mask plate 110 using the positioning index 150, Deploy. This printing method also has the same effect as the printing mask 110E.

<Seventh embodiment>
Next, the configuration of the printing mask 100F in the seventh embodiment of the present invention will be described. FIG. 17 is a diagram illustrating a state in which the printing mask 100F is attached to the printed wiring board 200. FIG. FIG. 17A is a top view showing a state in which the printing mask 100F is attached on the printed wiring board 200. FIG. FIG. 17B is a cross-sectional view showing a state in which the print mask 100F is attached to the printed wiring board 200, and is a cross-sectional view taken along the line NN in FIG. In FIG. 17, components equivalent to those shown in FIGS. 1 to 16 are denoted by the same symbols as those shown in FIGS. 1 to 16.

  As shown in FIGS. 17A and 17B, the printing mask 100F includes a first mask plate 110, a second mask plate 120, a drive unit 130, and a positioning index 160. ing.

  Here, FIG. 1 (a), (b) and FIG. 17 (a), (b) are compared. 17A and 17B are different from FIGS. 1A and 1B in that the printing mask 100F has a positioning index 160. FIG.

  As shown in FIGS. 17A and 17B, the plurality of positioning indexes 160 are provided at the four corners of the first mask plate 110 and the second mask plate 120. 17A and 17B show four positioning indexes 160. FIG. However, it is sufficient that at least three positioning indexes 160 are provided.

  FIG. 18 is a diagram for explaining the configuration of the positioning index 160. 18A and 18B are cross-sectional views of the positioning index 160 and include an enlarged view of a P portion in FIG. 17B.

  As shown in FIGS. 18A and 18B, the positioning index 160 includes a positioning mark 147 and a positioning opening 148.

  The positioning mark 147 is formed on the upper surface of the first mask plate 110 so as to be recessed in a circular shape.

  The positioning opening 148 is formed so as to penetrate the second mask plate 120. The positioning opening 148 is formed at a position corresponding to the position where the positioning mark 147 is formed. The size of the positioning opening 148 is set to be smaller than the size of the positioning mark 147. That is, when the positioning mark 147 and the positioning opening 148 are overlapped with each other centered, the positioning mark 147 is arranged inside the positioning opening 148.

  Next, an arrangement method using the positioning index 160 in the second mask plate arrangement step described with reference to FIG.

  First, the first mask plate 110 is disposed on the printed wiring board 200 in an overlapping manner.

  Next, the second mask plate 120 is disposed so as to overlap the first mask plate 110. At this time, as shown in FIG. 18A and FIG. 18B, adjustment is performed using the camera CA so that the first mask plate 110 and the second mask plate 120 overlap each other at an accurate position. To do. Specifically, the camera CA images the positioning mark 147 and the positioning opening 148. Then, the positional relationship between the first mask plate 110 and the second mask plate 120 is corrected so that the positioning mark 147 is disposed inside the positioning opening 148 in the captured image of the camera CA. . Thereby, the position of the second mask plate 120 with respect to the first mask plate 110 is corrected. As a result, the first mask plate 110 and the second mask plate 120 overlap each other at an accurate position.

  As described above, the printing mask 100F according to the seventh embodiment of the present invention includes the positioning index 160. The positioning index 160 is provided on one or both of the first mask plate 110 and the second mask plate 120 in order to use the second mask plate 120 on the first mask plate 110. ing. Thereby, the second mask plate 120 can be accurately arranged on the first mask plate 110.

  Further, in the printing method according to the seventh embodiment of the present invention, the positioning index 160 for use in arranging the second mask plate 120 on the first mask plate 110 is the first mask plate 110 and It is provided on either one or both of the second mask plates 120. In the second mask plate arrangement step, the second mask plate 120 is overlapped on the first mask plate 110 with the lower surface facing the upper surface of the first mask plate 110 using the positioning index 160, Deploy. This printing method also has the same effect as the printing mask 110F.

  The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.

100, 100A, 100C, 100D, 100E, 100F Printing mask 110, 110A First mask plate 111 First opening 111a Specific first opening 120, 120A, 120B Second mask plate 121 Second opening Part 121a Specific second opening 130, 130C Driving part 131 Coil 132 First magnet 133 Second magnet 134 Ferromagnetic plate 140 Positioning index 141, 141A First positioning opening 142 Bridge part 143, 143A Second Positioning opening 144 144 Light source 145 Light source cover 146 Light detection sensor 147 Positioning mark 148 Positioning opening 150 Positioning index 200 Printed wiring board 201 Pad 201a Specific pad

Claims (10)

A first mask plate disposed on the substrate having a pad for mounting an electronic component on the upper surface and a lower surface facing the upper surface of the substrate, and being stacked on the substrate;
A second mask plate disposed on the first mask plate with a lower surface facing the upper surface of the first mask plate;
A first opening formed in the first mask plate at a position corresponding to the pad;
When the second mask plate is placed on the first mask plate, the first opening is included inside, and an end surface is provided in the vicinity of the end surface of the first opening. Two openings,
In a direction substantially perpendicular to a predetermined squeegee movement direction, which is a direction in which a squeegee is moved to apply a printing material to the pad on the substrate through the first opening and the second opening. A printing mask comprising: a drive unit that slides the second mask along a top surface of the first mask in a predetermined sliding direction.   The printing mask according to claim 1, further comprising an elastic member that urges the second opening of the second mask plate along the predetermined sliding direction. The drive unit is
A coil provided on one of the first mask plate or the second mask plate;
A magnet provided on the other of the first mask plate and the second mask plate so as to face the coil,
By passing an electric current through the coil, an electromagnetic force is generated between the coil and the magnet, and the electromagnetic force causes the second mask to move on the main surface of the first mask plate in the predetermined sliding direction. The printing mask according to claim 1, which is slid along the mask.   A magnetic member that is provided on one or both of the upper surface of the first mask plate and the lower surface of the second mask plate and adheres the upper surface of the first mask plate and the lower surface of the second mask plate; The mask for printing of any one of Claims 1-3 provided.   In order to use the second mask plate on the first mask plate, a positioning index is provided on one or both of the first mask plate and the second mask plate. The mask for printing of any one of Claims 1-4. A first mask plate having a first opening is overlaid on a substrate having pads for mounting electronic components on the upper surface, the lower surface faces the upper surface of the substrate, and the first opening Corresponding to the position of the pad, a first mask plate arrangement step of arranging,
A second opening having a second opening that includes the first opening on the inside and has an end surface provided in the vicinity of the end surface of the first opening when arranged on the first mask plate; A second mask plate placement step of placing the mask plate, with the lower surface facing the upper surface of the first mask plate and overlapping the first mask plate;
A printing material application step of applying a printing material on the pad through the first opening and the second opening by moving a squeegee along the upper surface of the second mask plate. When,
In a predetermined sliding direction that is substantially perpendicular to a predetermined squeegee moving direction that is a direction in which the squeegee is moved to apply the printing material onto the pad on the substrate by the driving unit. A second mask plate sliding step of sliding the second mask plate along the upper surface of the one mask plate.   In the second mask plate sliding step, the driving portion is used to urge the second opening portion of the second mask plate along the predetermined sliding direction by an elastic member. The printing method according to claim 6, wherein the second mask plate is slid along a main surface of the first mask plate in a sliding direction. The drive unit is
A coil provided on one of the first mask plate or the second mask plate;
A magnet provided on the other of the first mask plate and the second mask plate so as to face the coil,
In the second mask plate sliding step, an electromagnetic force is generated between the coil and the magnet by passing an electric current through the coil, and the second mask is moved in the predetermined sliding direction by the electromagnetic force. The printing method according to claim 6, wherein the first mask plate is slid along the main surface of the first mask plate. A magnetic member that closely contacts the upper surface of the first mask plate and the lower surface of the second mask plate is provided on one or both of the upper surface of the first mask plate and the lower surface of the second mask plate. ,
In the second mask plate arranging step,
The second mask plate is arranged so as to overlap the first mask plate with the lower surface facing the upper surface of the first mask plate, and the upper surface of the first mask plate by the magnetic force of the magnetic member. The printing method according to claim 6, wherein the lower surface of the second mask plate is closely attached. A positioning index for use in arranging the second mask plate on the first mask plate is provided on either or both of the first mask plate and the second mask plate,
In the second mask plate arrangement step, the positioning mask is used to superimpose the second mask plate on the first mask plate with the lower surface facing the upper surface of the first mask plate, The printing method according to claim 6, wherein the printing method is arranged.