JP6247481B2 - Manufacturing method of component-embedded substrate - Google Patents

Description

  The present invention relates to a method of manufacturing a component-embedded substrate in which an electronic component such as a chip resistor is built in a resin layer provided on a base substrate, and more particularly, a via hole formed after the resin layer is cured. The present invention relates to a technique for accurately aligning with an external electrode of an electronic component.

  2. Description of the Related Art Conventionally, as a method for manufacturing this type of component-embedded substrate, one having a process as shown in FIG. 6 is known (see, for example, Patent Document 1). Hereinafter, the prior art described in Patent Document 1 will be described with reference to FIG.

  First, as shown in FIG. 6A, after the electronic component 11 is bonded and fixed to a predetermined position on the base substrate 10 by using a clamp or a suction device, the amount of positional deviation of the electronic component 11 with respect to the design mounting position. Measure. At that time, a component mark (not shown) is provided on the surface of the electronic component 11. The component mark is inspected by an automatic visual inspection machine and compared with design data, thereby shifting the position of the mounted electronic component 11. The quantity is stored as data.

  Next, as shown in FIG. 6 (b), the insulating material 12 is stacked from the upper surface of the electronic component 11, and this is heated and pressurized by a laminating press, and then laser processing is performed as shown in FIG. 6 (c). Thus, a via hole 13 is formed at a predetermined position of the insulating material 12. In the step of forming the via hole 13, the data on the amount of displacement described above is used, and by taking this data into the laser processing conditions, the via hole 13 connected to the external electrode 11 a of the electronic component 11 is formed.

  Next, after performing electroless plating and electrolytic plating in order to deposit copper plating on the inside of the via hole 13 and the surface of the insulating material 12, the copper plated portion on the surface of the insulating material 12 is patterned to form a circuit. As shown in FIG. 6D, a component-embedded substrate having the connection via 14 and the conductor pattern 15 is manufactured.

JP 2007-207880 A

  By the way, in the prior art disclosed in Patent Document 1, when an insulating resin (for example, epoxy resin) having a large shrinkage rate at the time of curing is used as an insulating material, the base substrate is before and after the insulating resin is cured. Since the mounting position of the electronic component on the top will shift, even if you intend to form a via hole at the correct location after resin curing based on the position data stored before resin curing, the formed via hole and the external electrode of the electronic component There is a risk that the position will be shifted. In particular, in recent years, miniaturization of electronic components has been promoted, and the area of the external electrodes provided on the electronic components has been reduced accordingly. There was a problem that a bug occurred.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a method of manufacturing a component-embedded substrate capable of aligning a via hole and an external electrode of an electronic component with high accuracy. There is to do.

As a means for achieving the above object, a method of manufacturing a component-embedded substrate according to the present invention includes a step of mounting an electronic component having an external electrode and a pair of detection magnets on a base substrate, and the above-mentioned on the base substrate. Storing a positional relationship between the electronic component and the pair of detection magnets as a reference position, and forming an uncured resin layer on the base substrate so as to cover the electronic component and the pair of detection magnets; A step of curing the resin layer, a step of detecting a position of the pair of detection magnets as a variation position by bringing a magnetic body close to the surface of the cured resin layer, and the resin layer from the variation position and the reference position And calculating a correction position of the electronic component inside, and forming a via hole connected to the external electrode based on the calculation result.

In the component-embedded substrate manufactured by such a process, the positional relationship between the electronic component and the pair of detection magnets on the base substrate is stored in advance as a reference position before the resin layer is formed, and the cured resin layer If the fluctuation position of the internal detection magnet is detected by bringing a magnetic body close to the surface, the correction position of the cured electronic component is calculated from the relationship between the fluctuation position and the reference position that has already been stored, and the correction position Since the via hole is formed in the via hole, the via hole and the external electrode of the electronic component can be aligned with high precision even if the mounting position of the electronic component is shifted due to the shrinkage when the resin layer is cured.

  In the method of manufacturing a component-embedded substrate described above, the position of the detection magnet built in the resin layer may be detected using a magnetic material such as a magnetic fluid (magnetic colloid solution) or a small iron ball. It is preferable to use a permanent magnet as the body because the attractive force of the detection magnet increases. However, if a permanent magnet is used as the magnetic material, the magnetic material (for example, nickel) contained in the external electrode of the electronic component may be attracted and misdetected. The position of the detection magnet in the resin layer is detected as a fluctuating position by reversing the polarity of the permanent magnet at that position and causing the detection magnet to attract the rebound from the surface of the resin. Preferably, the position of the detection magnet can be detected more accurately.

As another means for achieving the above object, a method for manufacturing a component-embedded substrate according to the present invention includes mounting an electronic component having an external electrode and a pair of non- magnetized detection magnetic bodies on a base substrate. a step of, so as to cover a step of storing the positional relationship of the electronic component and the pair of sensing magnetic body in the base substrate as a reference position, said electronic component and said pair of sensing magnetic on the base substrate A step of forming an uncured resin layer, a step of curing the resin layer, a step of magnetizing the pair of unmagnetized detection magnetic bodies, and a magnetic material on the surface of the cured resin layer. A step of detecting the position of the pair of sensing magnetic bodies magnetized close to each other as a fluctuation position, a correction position of the electronic component in the resin layer is calculated from the fluctuation position and the reference position, and based on the calculation result Previous It is characterized in that it comprises a step of forming a via hole connected to an external electrode.

In the component-embedded substrate manufactured by such a process, the positional relationship between the electronic component on the base substrate and the pair of unmagnetized detection magnetic bodies is stored in advance as a reference position before the resin layer is formed. After magnetizing a pair of unmagnetized detection magnetic bodies after the resin layer is cured, if the magnetic body is brought close to the surface of the resin layer and the fluctuation position of the internal detection magnetic body is detected, this fluctuation position and the Since the correction position of the cured electronic component is calculated from the relationship with the stored reference position, and a via hole is formed at the correction position, mounting of the electronic component is accompanied by shrinkage when the resin layer is cured. Even if the position is shifted, the via hole and the external electrode of the electronic component can be aligned with high accuracy.

According to the method for manufacturing a component-embedded substrate according to the present invention, the mounting position of the electronic component and the pair of detection magnets (or detection magnetic bodies) on the base substrate is similarly displaced as the resin layer shrinks during curing. Based on the knowledge, the magnetic body is brought close to the surface of the cured resin layer to detect the fluctuation position of the internal detection magnet (or detection magnetic substance), and the fluctuation position and the resin layer are stored in advance before forming the resin layer. Since the corrected position of the electronic component after curing is newly calculated from the positional relationship with the electronic component and a via hole is formed at the position, the mounting position of the electronic component is changed as the resin layer shrinks during curing. Even if they are misaligned, the via hole and the external electrode of the electronic component can be aligned with high accuracy, and it is possible to prevent problems such as poor conduction and short circuit.

It is sectional drawing of the component built-in type board | substrate by this invention. It is a flowchart which shows the manufacturing process of the component built-in type board | substrate which concerns on the example of 1st Embodiment. It is explanatory drawing which shows the manufacturing process of the component built-in type board | substrate which concerns on the example of 1st Embodiment. It is a flowchart which shows the manufacturing process of the component built-in type board | substrate which concerns on the example of 2nd Embodiment. It is explanatory drawing which shows the manufacturing process of the component built-in type board | substrate which concerns on the example of 2nd Embodiment. It is explanatory drawing which shows the manufacturing process of the component built-in type board | substrate which concerns on a prior art example.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, a component-embedded substrate 1 according to the present invention is mounted on a base substrate 2 such as a double-sided substrate and the base substrate 2. The electronic component 3 and two detection magnets 4 (4A, 4B) mounted so as to sandwich the electronic component 3, and the resin layer 5 provided on the base substrate 2 so as to cover the electronic component 3 and the detection magnet 4 And a connection via 6 provided at a predetermined position of the resin layer 5 and a conductor pattern 7 provided on the surface of the resin layer 5.

  An electrode pad portion (not shown) is provided on the upper surface of the base substrate 2, and the bottom surface of the electronic component 3 is bonded and fixed to the electrode pad portion. The electronic component 3 is, for example, a chip resistor, and the electronic component 3 is provided with a pair of external electrodes 3a, a resistor (not shown), and the like. The detection magnet 4 is a rectangular parallelepiped permanent magnet, and the detection magnet 4 and the electronic component 3 are set to have substantially the same height. In order to distinguish between the two detection magnets 4, in the following description, reference numeral 4A is assigned to the left detection magnet and reference numeral 4B is assigned to the detection magnet on the right side of the figure. The resin layer 5 is a thermosetting resin made of an epoxy resin or the like, and the detection magnet 4 and the electronic component 3 on the base substrate 2 are built in the cured resin layer 5. The connection via 6 is a conductor made of copper plating or the like that connects the external electrode 3 a of the electronic component 3 and the conductor pattern 7 on the surface of the resin layer 5. As will be described later, the connection via 6 is formed in the resin layer 5. It is formed inside the via hole 5a.

  Next, a manufacturing method according to the first embodiment of the component-embedded substrate 1 configured as described above will be described with reference to FIGS.

  First, as shown in FIG. 3A, the electronic component 3 and the two detection magnets 4A and 4B are bonded and fixed at predetermined positions on the base substrate 2 using clamps or suction machines so as to sandwich the electronic component 3. (Part mounting process in FIG. 2). Next, the positions of the pair of external electrodes 3a and the two detection magnets 4A and 4B provided on the electronic component 3 are inspected using an automatic visual inspection machine or the like, and the positional relationship between them is stored as a reference position (FIG. 2 reference position storing step). Specifically, the mounting position of one detection magnet 4A is P1, the mounting position of the other detection magnet 4 is P2, the position of one external electrode 3a provided on the electronic component 3 is P3, and the position of the other external electrode 3a is If the position is P4, the distance between P1 and P2 (= X1), the distance between P1 and P3 (= X2), the distance between P2 and P4 (= X3), etc. are stored as the reference position.

  Next, as shown in FIG. 3B, a resin paste made of an epoxy resin is filled with a dispenser or the like so as to cover the electronic component 3 and the detection magnets 4A and 4B, and an uncured resin is formed on the base substrate 2. After forming the layer 5 (resin layer forming step in FIG. 2), the resin layer 5 is cured at a temperature of 150 ° C. to 180 ° C. (resin layer curing step in FIG. 2). Alternatively, after the prepreg (semi-cured resin sheet) is stacked on the base substrate 2 as the resin layer 5 (resin layer forming step in FIG. 2), the resin layer 5 is cured by pressing and heating (FIG. 2). Resin layer curing step). Since the resin layer 5 contracts due to the curing of the resin, the mounting position of the electronic component 3 and each detection magnet 4 built in the resin layer 5 is different from that before the resin layer 5 is formed, as shown in FIG. Position.

  Next, as shown in FIG. 3D, the position of the detection magnets 4 </ b> A and 4 </ b> B built in the resin layer 5 is obtained by bringing the magnetic body 8 close to the surface of the resin layer 5 and attracting it to the detection magnets 4 </ b> A and 4 </ b> B. Is detected as a fluctuating position (fluctuating position detecting step in FIG. 2). For example, a permanent magnet can be used as the magnetic body 8. In this case, the detection magnets 4A and 4B are arranged in advance so that the magnetic flux faces the upper and lower surfaces of the base substrate 2, and the permanent magnet 8 ( After confirming the approximate position of the detection magnets 4A and 4B with the polarity of the magnetic body) opposite to that of the detection magnets 4A and 4B, the polarity of the permanent magnet 8 is reversed at that position and attracted to the detection magnets 4A and 4B. By doing so, it is possible to accurately detect the fluctuation positions of the detection magnets 4A and 4B. Alternatively, it is also possible to use a magnetic fluid (magnetic colloid solution) called magnetic slime or the like as the magnetic body 8. When the magnetic body 8 that is not magnetized in this way is used, it is contained in the external electrode 3 a of the electronic component 3. It is possible to accurately detect the fluctuating positions of the detection magnets 4A and 4B without erroneously detecting the detected magnetic material (for example, nickel).

  Here, if the position of one detection magnet 4A after resin curing is Q1, the position of the other detection magnet 4B is Q2, the position of one external electrode 3a is Q3, and the position of the other external electrode 3a is Q4, the magnetic Although the positions of Q1 and Q2 can be detected using the body 8, but the positions of Q3 and Q4 cannot be detected, the fluctuation positions of the detection magnets 4A and 4B detected this time and the above-mentioned stored before the resin layer 5 is formed. Based on the reference position data, the positions of Q3 and Q4 are calculated as correction positions of the electronic component 3 (correction position calculation step in FIG. 2). For example, if the distance between Q1 and Q2, which is the fluctuation position, is detected as Y1, the distance Y2 between Q1 and Q3 is Y2 = Y1 × X2 / X1 (from the relationship of X1: X2 = Y1: Y2), and Q2 Y3 is Y3 = Y1 × X3 / X1 (from the relationship of X1: X3 = Y1: Y3), and the positions Q3 and Q4 of the external electrodes 3a are obtained from these Y2 and Y3 as the correction positions. Can do.

  Next, by irradiating the correction position calculated in this way with a laser beam using a laser processing machine, a frustoconical via hole 5a is formed at a predetermined position of the resin layer 5 as shown in FIG. (Via hole forming step in FIG. 2). At that time, since the via hole 5a is formed at the correction position of the electronic component 3 which is displaced due to the shrinkage at the time of resin curing, the via hole 5a is formed with high positional accuracy with respect to the external electrode 3a of the electronic component 3. .

  Next, after performing electroless plating and electrolytic plating in order to attach copper plating to the inside of the via hole 5a and the surface of the insulating material 5, the copper plating portion on the surface of the insulating material 5 is patterned to form a circuit. The component built-in substrate 1 having the connection via 6 and the conductor pattern 7 as shown in FIG.

  As described above, in the method of manufacturing the component-embedded substrate 1 according to the first embodiment, the positional relationship between the electronic component 3 and the detection magnets 4A and 4B on the base substrate 2 is previously determined before the resin layer 5 is formed. If the variation position of the internal detection magnets 4A and 4B is detected by bringing the magnetic body 8 close to the surface of the cured resin layer 5 and stored, the variation position and the reference position already stored are stored. Since the correction position of the electronic component 3 after curing is calculated from the relationship and the via hole 5a is formed at the correction position, the mounting position of the electronic component 3 is shifted as the resin layer 5 contracts during curing. In addition, the via hole 5a and the external electrode 3a of the electronic component 3 can be aligned with high accuracy, and the occurrence of problems such as poor conduction and short circuit can be prevented.

  Next, a manufacturing method according to the second embodiment of the component-embedded substrate 1 will be described with reference to FIGS.

  In this second embodiment, first, as shown in FIG. 5A, the electronic component 3 and two detection magnetic bodies 9 (9A) are sandwiched between the electronic component 3 at a predetermined position on the base substrate 2. 9B) is bonded and fixed using a clamp or a suction machine (component mounting step in FIG. 4). The detection magnetic body 9 is made of an unmagnetized magnetic material that is not magnetized, and its external shape is the same as that of the detection magnet 4 of the first embodiment. In the following description, in order to distinguish the two detection magnetic bodies 9, the detection magnetic body on the left side in the figure is denoted by reference numeral 9A, and the detection magnetic body on the right side in the figure is denoted by reference numeral 9B.

  Next, the positions of the pair of external electrodes 3a and the two detection magnetic bodies 9A and 9B provided on the electronic component 3 are inspected using an automatic appearance inspection machine or the like, and the positional relationship between them is stored as a reference position ( Reference position storing step in FIG. 4). Specifically, the mounting position of one detection magnetic body 9A is P1, the mounting position of the other detection magnetic body 9B is P2, the position of one external electrode 3a provided on the electronic component 3 is P3, and the other external electrode If the position of 3a is P4, the distance between P1 and P2 (= X1), the distance between P1 and P3 (= X2), the distance between P2 and P4 (= X3), etc. are stored as reference positions. .

  Next, as shown in FIG. 5B, a resin paste made of an epoxy resin is filled with a dispenser or the like so as to cover the electronic component 3 and the detection magnetic bodies 9A and 9B, and the base substrate 2 is uncured. After forming the resin layer 5 (resin layer forming step in FIG. 4), the resin layer 5 is cured at a temperature of 150 ° C. to 180 ° C. (resin layer curing step in FIG. 4). Alternatively, after a prepreg (semi-cured resin sheet) is stacked on the base substrate 2 as the resin layer 5 (resin layer forming step in FIG. 4), the resin layer 5 is cured by pressing and heating (FIG. 4). Resin layer curing step). Since the resin layer 5 contracts due to the curing of the resin, as shown in FIG. 5C, the mounting position of the electronic component 3 incorporated in the resin layer 5 and the two detection magnetic bodies 9A and 9B is the formation of the resin layer 5. Misalignment with respect to the front.

  Next, after magnetizing the non-magnetized detection magnetic bodies 9A and 9B (magnetic body magnetization step in FIG. 4), the magnetic body 8 is brought close to the surface of the resin layer 5 as shown in FIG. Then, the position of the detection magnetic bodies 9A and 9B incorporated in the resin layer 5 is detected as a fluctuation position by being adsorbed to the detection magnetic bodies 9A and 9B (fluctuation position detection process in FIG. 4). Although it is possible to use a permanent magnet as the magnetic body 8, in view of erroneous detection with a magnetic material (for example, nickel) contained in the external electrode 3a of the electronic component 3, an unmagnetized magnetic fluid (magnetic) A colloidal solution is preferably used as the magnetic body 8. Further, since the magnetic force of the detection magnetic bodies 9A and 9B magnetized in the magnetic body magnetization step is small compared to the permanent magnet used as the detection magnet 4 of the first embodiment, the reaction can be achieved even with a small magnetic force. It is preferable to use a magnetic fluid (magnetic colloid solution) as the magnetic body 8.

  Here, when the position of one detection magnetic body 9A after curing of the resin is Q1, the position of the other detection magnetic body 9B is Q2, the position of one external electrode 3a is Q3, and the position of the other external electrode 3a is Q4. The positions of Q1 and Q2 can be detected using the magnetic body 8, but the positions of Q3 and Q4 cannot be detected. Therefore, the fluctuation positions of the detected magnetic bodies 9A and 9B detected this time are stored before forming the resin layer 5. Based on the data of the reference position, the positions of Q3 and Q4 are calculated as the correction positions of the electronic component 3 (correction position calculation step in FIG. 4). For example, if the distance between Q1 and Q2, which is the fluctuation position, is detected as Y1, the distance Y2 between Q1 and Q3 is Y2 = Y1 × X2 / X1 (from the relationship of X1: X2 = Y1: Y2), and Q2 Y3 is Y3 = Y1 × X3 / X1 (from the relationship of X1: X3 = Y1: Y3), and the positions Q3 and Q4 of the external electrodes 3a are obtained from these Y2 and Y3 as the correction positions. Can do.

  Next, the correction position calculated in this manner is irradiated with a laser beam using a laser processing machine, whereby a frustoconical via hole 5a is formed at a predetermined position of the resin layer 5 as shown in FIG. (Via hole forming step in FIG. 4). At that time, since the via hole 5a is formed at the correction position of the electronic component 3 which is displaced due to the shrinkage at the time of resin curing, the via hole 5a is formed with high positional accuracy with respect to the external electrode 3a of the electronic component 3. .

  Next, after performing electroless plating and electrolytic plating in order to attach copper plating to the inside of the via hole 5a and the surface of the insulating material 5, the copper plating portion on the surface of the insulating material 5 is patterned to form a circuit. The component built-in substrate 1 having the connection via 6 and the conductor pattern 7 as shown in FIG. Since the magnetic forces of the detected magnetic bodies 9A and 9B after magnetization are sufficiently smaller than those of the permanent magnets, even if the detected magnetic bodies 9A and 9B are magnetized (magnetized), they are completed as the component-embedded substrate 1. Although there is no particular problem, if a step of demagnetizing (demagnetizing) the detection magnetic bodies 9A and 9B after the fluctuation position detection step of FIG. 4 is added, the electronic component 3 is magnetically applied from the detection magnetic bodies 9A and 9B in the product state. It is more preferable because it is not affected at all.

  As described above, in the method of manufacturing the component-embedded substrate 1 according to the second embodiment, the electronic component 3 on the base substrate 2 and the non-magnetized detection magnetic bodies 9A and 9B are formed before the resin layer 5 is formed. Is stored in advance as a reference position, and after magnetizing the detection magnetic bodies 9A and 9B in an unmagnetized state after the resin layer 5 is cured, the magnetic body 8 is brought close to the surface of the resin layer 5 and the inside If the fluctuation positions of the detection magnetic bodies 9A and 9B are detected, the correction position of the cured electronic component 3 is calculated from the relation between the fluctuation position and the reference position that has already been stored, and the via hole 5a is provided at the correction position. Since it is formed, the via hole 5a and the external electrode 3a of the electronic component 3 can be aligned with high accuracy even if the mounting position of the electronic component 3 is shifted due to the shrinkage when the resin layer 5 is cured. , Continuity failure and short circuit failure It is possible to prevent the occurrence of the condition.

  In the second embodiment, since the detection magnetic bodies 9A and 9B in the non-magnetized state are magnetized after the resin layer 5 is cured to detect the fluctuating position, the electronic component 3 on the base substrate 2 is detected. Even when the mounting positions of the detection magnetic bodies 9A and 9B approach each other, the magnetic force of the detection magnetic bodies 9A and 9B hardly affects the operation of the electronic component 3, and the electronic component 3 on the base substrate 2 and the detection magnetic The degree of freedom of component layout of the bodies 9A and 9B can be increased.

  In the first and second embodiments, the chip resistor is exemplified as the electronic component incorporated in the resin layer. However, other electronic components having external electrodes such as a chip capacitor and an IC chip are used. Is also possible.

DESCRIPTION OF SYMBOLS 1 Component built-in type board | substrate 2 Base board | substrate 3 Electronic component 3a External electrode 4, 4A, 4B Detection magnet 5 Resin layer 5a Via hole 6 Connection via 7 Conductor pattern 8 Magnetic body 9, 9A, 9B Detection magnetic body

Claims (3)

Mounting an electronic component having an external electrode and a pair of detection magnets on a base substrate;
Storing a positional relationship between the electronic component and the pair of detection magnets on the base substrate as a reference position;
Forming an uncured resin layer on the base substrate so as to cover the electronic component and the pair of detection magnets;
Curing the resin layer;
A step of detecting a position of the pair of detection magnets as a variable position by bringing a magnetic body close to the surface of the cured resin layer;
Calculating a correction position of the electronic component in the resin layer from the fluctuation position and the reference position, and forming a via hole connected to the external electrode based on the calculation result;
A method for manufacturing a component-embedded substrate, comprising:   2. The magnetic material according to claim 1, wherein the magnetic body is a permanent magnet, and the permanent magnet is brought close to the surface of the cured resin layer to repel the detection magnet, and then the magnetic pole of the permanent magnet is reversed at the position. Then, the position of the detection magnet in the resin layer is detected as the variation position by causing the detection magnet to be attracted to the component built-in substrate manufacturing method. Mounting an electronic component having an external electrode and a pair of unmagnetized detection magnetic bodies on a base substrate;
Storing a positional relationship between the electronic component and the pair of detection magnetic bodies on the base substrate as a reference position;
Forming an uncured resin layer on the base substrate so as to cover the electronic component and the pair of detection magnetic bodies;
Curing the resin layer;
Magnetizing the pair of sensing magnetic bodies in an unmagnetized state;
Detecting the position of the pair of detection magnetic bodies magnetized by bringing the magnetic body close to the surface of the resin layer after curing as a variable position;
Calculating a correction position of the electronic component in the resin layer from the fluctuation position and the reference position, and forming a via hole connected to the external electrode based on the calculation result;
A method for manufacturing a component-embedded substrate, comprising: