JP6236486B2 - 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。 - Google Patents

位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。 Download PDF

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Publication number
JP6236486B2
JP6236486B2 JP2016043950A JP2016043950A JP6236486B2 JP 6236486 B2 JP6236486 B2 JP 6236486B2 JP 2016043950 A JP2016043950 A JP 2016043950A JP 2016043950 A JP2016043950 A JP 2016043950A JP 6236486 B2 JP6236486 B2 JP 6236486B2
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Japan
Prior art keywords
resin sealing
resin
mold
substrate
wedge
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JP2016043950A
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English (en)
Japanese (ja)
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JP2017162888A (ja
Inventor
田村　孝司
孝司 田村
祥人 奥西
祥人 奥西
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Towa Corp
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Towa Corp
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Publication date
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Priority to JP2016043950A priority Critical patent/JP6236486B2/ja
Priority to TW105140853A priority patent/TWI629730B/zh
Priority to KR1020160176337A priority patent/KR101992005B1/ko
Priority to CN201710022620.9A priority patent/CN107170694B/zh
Publication of JP2017162888A publication Critical patent/JP2017162888A/ja
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Publication of JP6236486B2 publication Critical patent/JP6236486B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2016043950A 2016-03-07 2016-03-07 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。 Active JP6236486B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016043950A JP6236486B2 (ja) 2016-03-07 2016-03-07 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。
TW105140853A TWI629730B (zh) 2016-03-07 2016-12-09 樹脂封裝裝置、樹脂封裝方法以及樹脂封裝產品的製造方法
KR1020160176337A KR101992005B1 (ko) 2016-03-07 2016-12-22 위치 조절 기구, 수지 밀봉 장치, 수지 밀봉 방법 및 수지 밀봉 제품의 제조 방법
CN201710022620.9A CN107170694B (zh) 2016-03-07 2017-01-12 树脂封装装置、树脂封装方法及树脂封装产品的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016043950A JP6236486B2 (ja) 2016-03-07 2016-03-07 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。

Publications (2)

Publication Number Publication Date
JP2017162888A JP2017162888A (ja) 2017-09-14
JP6236486B2 true JP6236486B2 (ja) 2017-11-22

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JP2016043950A Active JP6236486B2 (ja) 2016-03-07 2016-03-07 位置調節機構、樹脂封止装置、樹脂封止方法、及び樹脂封止製品の製造方法。

Country Status (4)

Country Link
JP (1) JP6236486B2 (ko)
KR (1) KR101992005B1 (ko)
CN (1) CN107170694B (ko)
TW (1) TWI629730B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6541746B2 (ja) * 2017-10-30 2019-07-10 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP6861609B2 (ja) * 2017-10-30 2021-04-21 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7092513B2 (ja) * 2018-02-09 2022-06-28 アピックヤマダ株式会社 圧縮成形金型用モールドベース
TWI787417B (zh) * 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 壓縮成形用模具及壓縮成形裝置
NL2021845B1 (en) * 2018-10-22 2020-05-13 Besi Netherlands Bv Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
US11518070B2 (en) 2019-03-27 2022-12-06 Pyxis Cf Pte. Ltd. Compression molding machine and method of compression molding
JP7084349B2 (ja) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7084348B2 (ja) * 2019-04-25 2022-06-14 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
CN112048715B (zh) * 2019-06-06 2022-09-16 北京北方华创微电子装备有限公司 调平机构、反应腔室及半导体加工设备
JP6704159B1 (ja) * 2019-12-02 2020-06-03 アサヒ・エンジニアリング株式会社 樹脂封止装置
KR102446919B1 (ko) * 2021-06-02 2022-09-23 한화솔루션 주식회사 언더커버 성형장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0713985B2 (ja) * 1988-02-05 1995-02-15 三菱電機株式会社 半導体装置の樹脂封止成形装置
KR100533067B1 (ko) * 1999-12-16 2005-12-02 다이-이치 세이코 가부시키가이샤 수지봉지용 금형장치
JP4467207B2 (ja) * 2001-05-14 2010-05-26 Ｔｏｗａ株式会社 樹脂封止方法及び基板クランプ機構
JP5004410B2 (ja) * 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP4503391B2 (ja) * 2004-08-06 2010-07-14 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2006319226A (ja) * 2005-05-16 2006-11-24 Matsushita Electric Ind Co Ltd 樹脂封止成形用金型装置および樹脂封止成形用金型装置の検査方法
CN101028735B (zh) * 2006-03-03 2010-09-29 鸿富锦精密工业（深圳）有限公司 模具结构
JP5352896B2 (ja) * 2008-01-19 2013-11-27 アピックヤマダ株式会社 トランスファ成形方法及びトランスファ成形装置
JP5560479B2 (ja) * 2009-07-01 2014-07-30 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置、並びに樹脂モールド方法
JP5824765B2 (ja) * 2011-01-11 2015-12-02 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置並びに供給ハンドラ
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP6062810B2 (ja) * 2013-06-14 2017-01-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置

Also Published As

Publication number Publication date
CN107170694A (zh) 2017-09-15
KR101992005B1 (ko) 2019-06-21
TWI629730B (zh) 2018-07-11
KR20170104365A (ko) 2017-09-15
CN107170694B (zh) 2021-07-20
JP2017162888A (ja) 2017-09-14
TW201732966A (zh) 2017-09-16

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