JP6233872B2 - Ｌｅｄの製造方法 - Google Patents

Ｌｅｄの製造方法 Download PDF

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Publication number
JP6233872B2
JP6233872B2 JP2013050950A JP2013050950A JP6233872B2 JP 6233872 B2 JP6233872 B2 JP 6233872B2 JP 2013050950 A JP2013050950 A JP 2013050950A JP 2013050950 A JP2013050950 A JP 2013050950A JP 6233872 B2 JP6233872 B2 JP 6233872B2
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Prior art keywords
slurry
led
phosphor
binder
manufacturing
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JP2013050950A
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Japanese (ja)
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JP2014179384A5 (enExample
JP2014179384A (ja
Inventor
松永　正文
正文 松永
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Mtek Smart Corp
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Mtek Smart Corp
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Priority to JP2013050950A priority Critical patent/JP6233872B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires

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  • Led Device Packages (AREA)
JP2013050950A 2013-03-13 2013-03-13 Ｌｅｄの製造方法 Active JP6233872B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013050950A JP6233872B2 (ja) 2013-03-13 2013-03-13 Ｌｅｄの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013050950A JP6233872B2 (ja) 2013-03-13 2013-03-13 Ｌｅｄの製造方法

Publications (3)

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JP2014179384A JP2014179384A (ja) 2014-09-25
JP2014179384A5 JP2014179384A5 (enExample) 2016-05-12
JP6233872B2 true JP6233872B2 (ja) 2017-11-22

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JP2013050950A Active JP6233872B2 (ja) 2013-03-13 2013-03-13 Ｌｅｄの製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170026801A (ko) 2015-08-28 2017-03-09 삼성전자주식회사 반도체 발광소자 패키지 및 이를 이용한 광원모듈
JP6998114B2 (ja) * 2016-12-27 2022-02-04 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3434714B2 (ja) * 1998-10-20 2003-08-11 株式会社シチズン電子 表面実装型発光ダイオードの製造方法
DE10010638A1 (de) * 2000-03-03 2001-09-13 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement
JP2002335020A (ja) * 2001-05-10 2002-11-22 Nichia Chem Ind Ltd 発光装置
JP2006024615A (ja) * 2004-07-06 2006-01-26 Matsushita Electric Ind Co Ltd Ｌｅｄ照明光源およびその製造方法
US8058088B2 (en) * 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
TWI381556B (zh) * 2009-03-20 2013-01-01 億光電子工業股份有限公司 發光二極體封裝結構及其製作方法
TW201138976A (en) * 2010-01-08 2011-11-16 Mtek Smart Corp Coating method and device
WO2012090961A1 (ja) * 2010-12-28 2012-07-05 コニカミノルタオプト株式会社 発光装置、発光装置の製造方法、及び、塗布液
JP5617737B2 (ja) * 2011-03-31 2014-11-05 コニカミノルタ株式会社 発光装置の製造方法、発光装置及び蛍光体粒子分散液

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JP2014179384A (ja) 2014-09-25

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