JP6221748B2 - Manufacturing method of optical communication module - Google Patents

Description

  The present invention relates to a method for manufacturing an optical communication module on which an optical component that is required to be mounted with high accuracy is mounted.

  A wavelength division multiplexing optical transmission module (hereinafter simply referred to as an optical transmission module), which is one of optical communication modules, converts signal light emitted from a plurality of light emitting elements (LDs) into an optical lens, a wavelength selection filter, and a reflection. The optical component is wavelength-multiplexed using an optical component such as a mirror for transmission, and these optical components are mounted on a substrate together with a plurality of LDs.

  Conventionally, a method of transporting the above optical components to a predetermined position on the mounting board by tweezers or the like has been taken. However, as the density of optical parts increases and the size of the optical transmission module decreases, tweezers are mounted on the mounting board. It has become difficult to secure an area to put. Therefore, a method has been proposed in which an optical component is sucked and sucked using a holder called a suction collet (also referred to as a suction collet or a vacuum collet) and transported to a predetermined position on the mounting substrate (see, for example, Patent Document 1). ). The suction collet is provided with a suction surface that comes into contact with the surface of the optical component and a suction port that opens to the suction surface. The optical component surface is sucked through the suction port to place the optical component at a predetermined position on the mounting substrate. To be transported.

  In Patent Document 2, a lens that is one of optical components is fixed to a metal lens holder having a protrusion, the lens holder is gripped and transported, and a lens holder holder is mounted. The technique of fixing to a board | substrate is described. YAG welding is used for fixing the lens holder and the lens holder holder and for fixing the lens holder holder and the substrate.

JP 2010-232370 A JP 2001-059925 A

  In particular, an assembly process (method) in which an optical component such as a lens is transported to a predetermined position on a substrate by using a suction collet generally employed in a semiconductor process, and is fixed to the predetermined position after optical alignment. This is a general method as disclosed in Patent Document 1 above. Moreover, in the said patent document 2, fixation to the board | substrate of an optical component is implemented by YAG welding. That is, when YAG welding is performed, it is necessary to secure a welding allowance for the optical component, and thus the optical component has a certain size.

However, in recent optical communication modules such as optical transceivers, components mounted on the optical communication module have been downsized in response to a strong demand for a reduction in package size. In particular, in optical parts such as lenses and mirrors, there are parts whose size is about 1 mm ³ or less. When fixing such an optical component on a substrate, YAG welding cannot be performed because it is extremely difficult to secure a welding allowance for the optical component. For this reason, resin fixation is required instead of YAG welding.

  In addition, as the component size is reduced, it has become difficult to hold an optical component by a conventional suction collet. Specifically, as the component size is reduced, the size of the suction port must be reduced, but a suction collet with a small suction port size cannot secure a sufficient suction force (gripping force of optical components). . That is, in order to fix the optical component on the substrate, a resin (such as an ultraviolet curable adhesive) is used as described above, but these resins generally have high viscosity. For this reason, when the optical component is gripped and aligned with the suction collet, the optical component must be slid against this viscosity, and the suction force of the suction collet cannot withstand this viscosity, There is a problem that it cannot be gripped.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a method for manufacturing an optical communication module that can be surely arranged on a substrate even with a small optical component.

  The present invention provides an optical communication having a plurality of light emitting elements or light receiving elements mounted on a substrate and a plurality of optical components fixed at positions corresponding to the plurality of light emitting elements or light receiving elements on the substrate. A method of manufacturing a module, wherein a pin member comprising a pedestal portion and a shaft portion standing on the pedestal portion is a surface opposite to the substrate-side surface of the optical component with the pedestal portion on the lower side. A pin member fixing step for fixing to the substrate, an alignment step for optically aligning the optical component on the substrate in a state where the shaft portion of the pin member is gripped, and between the optical component and the substrate. An optical component fixing step of fixing the optical component to the substrate by curing the applied resin.

  According to the above invention, the pin member can be fixed to the surface opposite to the substrate-side surface of the optical component, and the pin member can be gripped and transported onto the substrate for optical alignment. Even optical components can be reliably arranged on the substrate.

It is the figure which showed typically an example of the internal structure of the optical communication module with which the manufacturing method by this invention is applied. 1 is an overall view of an alignment device. It is a 6-axis adjusting mechanism, an enlarged view of the vicinity of the arm portion, and a partially enlarged view when the arm portion is viewed from above. It is a figure which shows the state after fixing a pin member to an optical component. It is a figure which shows a mode that the optical component to which the pin member was fixed is moved to a board | substrate. It is a figure which shows a mode that resin fixing an optical component to a board | substrate.

  Hereinafter, a specific example of a method for manufacturing an optical communication module according to an embodiment of the present invention will be described with reference to the drawings. In addition, this invention is not limited to these illustrations, is shown by the claim, and intends that all the changes within the meaning and range equivalent to the claim are included.

  FIG. 1 is a diagram schematically showing an example of the internal structure of an optical communication module to which the manufacturing method according to the present invention is applied. Hereinafter, as an example of the optical communication module, an optical transmission module including a plurality of light emitting elements (LD) will be described as an example. However, the present invention is an optical reception module including a plurality of light receiving elements (PD). However, it goes without saying that the same applies. In the figure, 1 is an optical transmission module, 1a to 1d are LDs (Laser Diodes), 2a to 2d are collimating lenses, 3 is a mirror, 4a and 4b are WSFs (Wavelength Selective Filters), 5 is An isolator, 6 is a λ / 2 wave plate, 7 is a polarization beam combiner, 8 is an optical coupling unit, 101 is a condenser lens, 102 is an mPD (monitor Photo Diode), 103 is a BS (Beam Splitter), Reference numeral 104 denotes a substrate.

  A plurality (four in this example) of LDs 1a to 1d are juxtaposed, and are individually driven by modulation signals. Each LD emits light of different wavelengths toward the front of the optical transmission module 1. The forward direction here refers to the side on which the optical coupling portion 8 for optical coupling with an external optical fiber is mounted. Individual light is once condensed by the condensing lens 101 and then converted into collimated light by the collimating lenses 2a to 2d. By condensing once, the design likelihood of the optical system after the collimating lenses 2a to 2d can be improved.

  In addition, between the two lenses (the condensing lens 101 and the collimating lenses 2a to 2d), mPDs 102 for monitoring a part of each emitted light via the BS 103 are mounted on the BS 103 corresponding to the number of LDs 1a to 1d. Is done. The BS 103 bends the optical axis of each part of the signal light traveling in parallel with the main surface of the substrate 104 by 90 °, and causes the mPD 102 to receive light with the optical axis directed upward.

  Half of the output light from the collimating lenses 2a to 2d is reflected by the mirror 3, and the reflected light and the remaining half of the light are combined by the WSFs 4a and 4b. Specifically, when the optical transmission module 1 includes four LDs 1a to 1d, the light having the wavelength λ4 is reflected by the mirror 3, and the reflected light and the light having the wavelength λ2 are combined by the WSF 4b. It becomes light of λ2 + wavelength λ4. On the other hand, the light of wavelength λ3 is similarly reflected by the mirror 3, and the reflected light and the light of wavelength λ1 are combined by the WSF 4a to become light of wavelength λ1 + wavelength λ3. The combined light emitted from the WSFs 4 a and 4 b is input to the isolator 5.

  In the isolator 5, light in the reverse direction from the front to the rear of the optical transmission module 1 is incident on the LDs 1 a to 1 d again to prevent the optical noise from increasing, and thus proceeds in the reverse direction. While blocking light, at the exit end of the isolator 5, only one of the combined light (for example, λ2 + λ4) is rotated by 90 ° (π / 2) on its polarization plane by the λ / 2 wavelength plate 6. That is, the combined light (λ1 + λ3) and the other combined light (λ2 + λ4) are lights whose polarization directions differ by 90 °. These two combined lights are combined by the polarization combiner 7 and output as one light including four lights having wavelengths λ1 to λ4.

The above optical components (the condensing lens 101, the collimating lenses 2a to 2d, the WSF 4a to 4b, the isolator 5, the λ / 2 wavelength plate 6, and the polarization multiplexer 7) are all mounted on the substrate 104. 104 is temperature-controlled by a Peltier cooler (TEC). In assembling the optical transmission module 1, a process of fixing the plurality of optical components on the substrate 104 after optical alignment is required. These optical components are extremely small components of about 1 mm ³ as described above, and are extremely difficult to hold by the suction collet.

  Here, in the method for manufacturing an optical communication module according to the present invention, an alignment device capable of six-axis adjustment is used. Hereinafter, an example of a schematic configuration of the alignment apparatus will be described with reference to FIGS. FIG. 2 is an overall view of the alignment device. 3A is an enlarged view of the six-axis adjusting mechanism and the vicinity of the arm portion, and FIG. 3B is a partially enlarged view of the arm portion of FIG. 3A viewed from above. In the figure, 10 is an alignment device, 11 is a drive control unit, 12 is a 6-axis adjustment mechanism, 13 is an arm unit, and 14 is an alignment stage. The alignment apparatus 10 includes a 6-axis adjustment mechanism 12 in the XYZ direction and the θφψ direction (roll, pitch, yaw). Since the 6-axis adjustment method itself is a known technique, the description here will be given. Omitted.

  As shown in FIG. 3B, the arm portion 13 is composed of a pair of arms (and an arm tip portion) and has a function of gripping a pin member described later. Since the tip portion of the conventional general arm portion does not follow the shape of the pin member, when the pair of arms are brought into contact with the pin member, the pin member is point-contacted at approximately two points in the arm horizontal direction (arm vertical). In the direction, line contact will occur, and the pin member will be insufficiently gripped. On the other hand, the tip portion of the arm portion 13 of this embodiment has a concave surface whose inner surface is along the outer diameter of the pin member, and makes the pin member come into surface contact in the horizontal and vertical directions of the arm portion 13. be able to. For this reason, it becomes possible to hold | grip a pin member strongly compared with a general arm shape.

  Further, when viewed from above or below, the arm portion 13 is formed such that one arm is linear and the other arm is bent toward one arm. That is, the pair of arms are formed asymmetrically. When the pin member is gripped by the arm portion 13, first, the pin member is brought into contact with the linear arm, and the bending arm is gripped so as to sandwich the pin member. Thereby, since the pressing force from the bending arm can be received on the linear arm side, the pin member can be firmly held.

  The alignment stage 14 is provided with a recess (not shown) for placing an optical component such as a lens and a substrate on which the optical component is fixed with resin at a predetermined location. The recess has substantially the same shape as the optical component and the substrate, and the depth is about 0.5 mm. That is, the alignment stage 14 can appropriately change the size and shape of the recess for each optical component to be fixed with resin.

(First embodiment)
4-6 is a figure for demonstrating an example of the manufacturing method of the optical transmission module by this invention. In the figure, 15 is a pin member, 16 is an optical component, 17 and 19 are resins such as an ultraviolet curable adhesive, and 18 is a substrate. In the present embodiment, the optical component 16 and the pin member 15 are fixed using a resin 17 at a predetermined location (such as the alignment stage 14) other than the substrate 18.

  FIG. 4 is a view showing a state after the pin member 15 is fixed to the optical component 16. In this example, the optical component 16 and the substrate 18 are assumed to be placed at predetermined positions on the alignment stage 14. First, the pin member 15 composed of the pedestal portion 15b and the shaft portion 15a erected on the pedestal portion 15b, the surface of the optical component 16 on the substrate 18 side (the lower surface 16a in FIG. 4) with the pedestal portion 15b on the lower side. Is fixed to the opposite surface (upper surface 16b in FIG. 4) (S1: pin member fixing step). In this example, the pedestal portion 15b is shown as a disk-shaped member having a diameter larger than the diameter of the columnar shaft portion 15a. However, the shapes of the shaft portion 15a and the pedestal portion 15b are limited to this. It is not a thing. When optical components are mounted with high accuracy, it is generally necessary to provide a high-precision stage or motor in the driving portion of the alignment stage, and therefore the alignment equipment tends to be large. On the other hand, by adopting the apparatus configuration as in this example, for example, it contributes to downsizing of the mounting stage and the like.

  The pin member 15 is made of, for example, resin, and as described above, includes a pedestal portion 15b at the lower portion, and the shaft portion 15a is integrally formed with the pedestal portion 15b. The pedestal portion 15b is, for example, a disk-shaped member having a diameter of 0.6 mm and a height of 0.2 mm. The shaft portion 15a is, for example, a cylindrical member having a diameter of 0.3 mm × height (0.3 to 1.0) mm. The optical component 16 is, for example, a lens having a width (perpendicular to the optical axis) 1.0 mm × thickness (parallel to the optical axis) 0.6 mm × height (perpendicular to the optical axis) 1.0 mm.

  In the pin member fixing step (S 1), first, the optical component 16 is placed on the alignment stage 14. The place where the optical component 16 is placed may be other than the alignment stage 14. At this stage, it is assumed that the optical component 16 and the pin member 15 are not bonded, and the pin member 15 is also placed at a predetermined location on the alignment stage 14. Next, the shaft portion 15a of the pin member 15 is gripped by the tip of the arm portion 13 of the alignment device and moved to substantially the center of the optical component 16, and is lifted from several μm to several tens of μm from the upper surface 16b of the optical component 16. Hold on. Then, a very small amount of resin 17 such as an ultraviolet curable adhesive is applied to the gap between the pedestal 15b of the pin member 15 and the upper surface 16b of the optical component 16 with a needle (a component capable of adjusting the ejection amount of a syringe, syringe, etc.). Then, the resin is fixed by irradiating ultraviolet rays as it is.

  In this manner, the pin member 15 is held in a state where it floats from the upper surface 16b of the optical component 16 by several μm to several tens of μm, the resin 17 is soaked into the gap between the two, and ultraviolet rays are irradiated while being held. As a result, as shown in FIG. 4, an optical component 16 having a shaft portion 15a erected at a substantially central portion is produced. In the present embodiment, the pin member 15 and the optical component 16 are fixed at a predetermined location (here, the alignment stage 14) other than the substrate 18.

  In the above, when fixing the pin member to the upper surface of the optical component such as a lens, a resin such as an ultraviolet curable adhesive is used, but the resin fixing is not necessarily limited. For example, it is possible to provide a metallized surface on the outer periphery of the optical component and fix the metal pin member by YAG welding or solder welding, but it is necessary to provide a metallized surface on the outer periphery of the optical component. Resin fixation is preferable. In addition, since welding is employed, it is necessary to secure a welding allowance for the optical component, and it is more desirable to fix the resin from the viewpoint of miniaturization of the optical component.

  According to this embodiment, if there is an optical component having a pin member resin-fixed on the upper surface and an alignment device having an arm part that can completely grip the pin member, the optical component is mounted on a predetermined substrate with high accuracy. be able to. For this reason, as an optical component to be used, it is not limited to a lens, A reflection mirror, an optical filter, etc. may be sufficient. Further, the pin member is not limited to a cylindrical shape, and may be a polygonal shape. Further, the alignment device may be an alignment facility having a mechanism capable of adjusting the position with respect to the six axes in the XYZ direction and the θφψ direction, and is not limited to this embodiment.

  FIG. 5 is a diagram illustrating a state in which the optical component 16 to which the pin member 15 is fixed is moved to the substrate 18, and FIG. 5A is a diagram illustrating a portion including the arm portion 13 and the alignment stage 14. FIG. 5B is a view of the distal end portion of the arm portion 13 in FIG. FIG. 6 is a diagram showing how the optical component 16 is fixed to the substrate 18 with resin.

  As shown in FIGS. 5A and 5B, the shaft portion 15a of the pin member 15 is moved to a predetermined position of the substrate 18 while being gripped by the arm portion 13, and as shown in FIG. The optical alignment of the optical component 16 is performed on the position (S2: alignment step), and the resin 19 such as an ultraviolet curable adhesive applied between the optical component 16 and the substrate 18 is cured, whereby the optical component 16 is optically aligned. The component 16 is fixed to the substrate 18 (S3: optical component fixing step). Here, the predetermined position of the substrate 18 is an approximate position (coarse position) when the optical component 16 is mounted on the substrate 18, for example, an optical component mounting position on the substrate 18 fixed to the alignment stage 14. It is conceivable that the initial value of the relative position with respect to the alignment stage 14 is set in advance for the six axes of the six-axis adjusting mechanism 12. Alternatively, the approximate position may be determined by providing an alignment mark (cross, L-shaped, U-shaped, etc.) in advance on the optical component mounting position on the substrate 18.

  Hereinafter, a specific mounting method of the optical component 16 (FIG. 4) to which the pin member 15 is fixed will be described. First, the optical component 16 with the pin member 15 attached to the upper surface is placed at a predetermined location on the alignment stage 14. As described above, a recess having substantially the same size as the outer shape of the optical component 16 is formed at the place where the optical component 16 is placed on the alignment stage 14. Next, the substrate 18 on which the optical component 16 is fixed with resin is placed on the alignment stage 14. In the place where the substrate 18 is placed on the alignment stage 14, a recess having substantially the same size as the substrate 18 is formed in the same manner as the optical component 16 described above.

  Next, the alignment device 10 to which the arm portion 13 is attached is driven and controlled to adjust the position (alignment) of the optical component 16 to which the pin member 15 is fixed. Specifically, the arm unit 13 is moved to the optical component 16 placed on the alignment stage 14, and after opening a pair of arms constituting the arm unit 13 in a square shape, the Z-axis direction (height Direction) to lower the pair of arm tips to a position where the entire pin can be grasped.

  Then, the arm portion 13 is operated so that the shaft of the pin member 15 contacts the inner surface of one arm (linear arm), and then the shaft of the pin member 15 is sandwiched between the inner surfaces of the other arm (bending arm). To work. Thereby, the axis | shaft of the pin member 15 can be reliably hold | gripped with a pair of arm. Thereafter, as shown in FIG. 5A, the optical component 16 having the pin member 15 held by the arm portion 13 is moved to a predetermined position (coarse position) of the substrate 18 on the alignment stage 14.

  In the above description, as described with reference to FIG. 3B, the pair of arms constituting the arm portion 13 is asymmetric. That is, when the arm portion 13 is viewed from above or below, one arm is substantially linear, while the other arm is bent so that the tip end of this arm comes into contact with both arms. The interval is narrowed. In this step, first, the pin member 15 comes into contact with the linear arm, and then the bending arm operates so as to sandwich the pin member 15.

  Here, the outer diameter of the shaft portion 15a of the pin member 15 and the inner diameter of the tip portion of the arm portion 13 are preferably in the following relationship. That is, as shown in FIG. 5B, a gap d is always formed between the arms while the shaft portion 15b of the pin member 15 is gripped. By doing in this way, even if the diameter of the arm inner surface is slightly different from the outer diameter of the pin, the pin can be securely gripped.

  The optical component 16 moved to a predetermined position (coarse position) on the substrate 18 is precisely aligned with the arm member 13 holding the pin member 15. For example, when the optical component 16 is a collimating lens, the collimating lens is irradiated with light from the outside using a light source (mainly a laser light source) and monitored with an infrared camera while being monitored with an infrared camera installed outside. The shape of the collimated light is confirmed, and the optimum position of the collimating lens (optical component 16) on the substrate 18 is determined. Alternatively, it may be optically coupled to an externally provided single mode optical fiber (SMF), and the angle adjustment may be performed using an alignment device so that the light of this SMF becomes the maximum value.

  Finally, as shown in FIG. 6, the resin 19 such as an ultraviolet curable adhesive applied between the optical component 16 and the substrate 18 is irradiated with ultraviolet rays (UV), and the optical component 16 is applied to the substrate 18. Fix the resin. For example, the resin 19 is applied between the optical component 16 and the substrate 18 before the optical component 16 is aligned at a predetermined position (coarse position) on the substrate 18. At this time, since the optical component 16 is securely held by the arm portion 13 via the pin member 15, the optical component 16 can be aligned (moved) against the viscosity of the resin 19.

(Second Embodiment)
In the first embodiment described above, in the pin member fixing step (S1), the optical component 16 and the pin member 15 are fixed using the resin 17 at a predetermined place (such as the alignment stage 14) other than the substrate 18. Although implemented, this embodiment is different in that the optical component 16 and the pin member 15 are fixed using a resin 17 at a predetermined position (coarse position) of the substrate 18.

  That is, a predetermined pair of substrates 18 fixed on the alignment stage 14 are gripped by a pair of arms constituting the arm portion 13 so that both sides of the optical component 16 are not damaged and do not damage the optical surface of the optical component 16. Move to position (coarse position). At this stage, the pin member 15 is not fixed to the optical component 16. The predetermined position (coarse position) of the substrate 18 is, for example, the initial value of the relative position between the optical component mounting position on the substrate 18 fixed to the alignment stage 14 and the alignment stage 14 as described above. Are set in advance for the six axes of the six-axis adjusting mechanism 12.

  In the above, the optical component 16 is roughly aligned by the predetermined position (coarse position) of the substrate 18. At this time, since the resin is not applied between the optical component 16 and the substrate 18, there is no problem that the optical component 16 loses the viscosity of the resin and its position shifts. That is, the optical component 16 is simply moved in space. When the rough position of the optical component 16 is determined, the optical component 16 is gently placed on the substrate 18. Then, the arm portion 13 is once separated from the optical component 16. In a state where the arm portion 13 is separated, a very small amount of resin 17 such as an ultraviolet curable adhesive is applied to the upper surface 16b of the optical component 16 with a needle.

  Next, one of the pin members 15 placed at a predetermined position on the alignment stage 14 is gripped by the arm portion 13 released from the grip of the optical component 16, and the arm portion 13 gripping the pin member 15 is optically operated. Move to above the part 16. Then, the pedestal 15 b of the pin member 15 is gently placed on the upper surface 16 b of the optical component 16 as it is. The resin 17 has already been applied to the upper surface 16b of the optical component 16, and in this state, ultraviolet rays are irradiated to bond the optical component 16 and the pin member 15 together.

  During this time, the optical component 16 is not changed in any way with respect to the five axes XYθφψ other than the Z axis, and only the Z axis moves up and down. However, although the relative positional relationship between the pin member 15 and the optical component 16 may be shifted due to the surface tension of the resin 17, such a slight shift in the relative positional relationship can be corrected in the following alignment process. So there is no problem.

  Next, while holding the pin member 15 with the arm portion 13, the optical component 16 is separated from the substrate 18, and a resin 19 is applied between the two. Thereafter, the optical component 16 is precisely aligned with a predetermined position (coarse position) of the substrate 18 as an initial position. At this stage, since the optical component 16 is securely held by the arm portion 13 via the pin member 15, the alignment (movement) is not hindered due to the viscosity of the resin 19. Moreover, since the pin contact surface of the arm member 13 has a shape along the outer shape of the pin, the pin member 15 can be reliably gripped.

DESCRIPTION OF SYMBOLS 1 ... Optical transmission module, 1a-1d ... LD (light emitting element), 2a-2d ... Collimating lens, 3 ... Mirror, 4a, 4b ... WSF (wavelength selection filter), 5 ... Isolator, 6 ... λ / 2 wavelength plate, DESCRIPTION OF SYMBOLS 7 ... Polarization combiner, 8 ... Optical coupling part, 10 ... Alignment apparatus, 11 ... Drive control part, 12 ... 6-axis adjustment mechanism, 13 ... Arm part, 14 ... Alignment stage, 15 ... Pin member, 15a ... Shaft portion, 15b ... base portion, 16 ... optical component, 16a ... lower surface, 16b ... upper surface, 17, 19 ... resin, 18 ... substrate, 101 ... condensing lens, 102 ... mPD (monitor light receiving element), 103 ... BS ( Beam splitter), 104... Substrate.

Claims (6)

Method for manufacturing optical communication module, comprising: a plurality of light emitting elements or light receiving elements mounted on a substrate; and a plurality of optical components fixed at positions corresponding to each of the plurality of light emitting elements or light receiving elements on the substrate Because
A pin member fixing step of fixing a pin member composed of a pedestal portion and a shaft portion standing on the pedestal portion to a surface opposite to the surface on the substrate side of the optical component with the pedestal portion facing down; ,
An alignment step of optically aligning the optical component on the substrate in a state where the shaft portion of the pin member is gripped,
A method of manufacturing an optical communication module, comprising: an optical component fixing step of fixing the optical component to the substrate by curing a resin applied between the optical component and the substrate. In the pin member fixing step, the optical component and the pin member are fixed using a resin at a predetermined place other than the substrate,
2. The optical communication according to claim 1, wherein in the alignment step, the optical component is optically aligned at the predetermined position by moving the substrate to a predetermined position while holding the shaft portion of the pin member. Module manufacturing method. In the pin member fixing step, the optical component and the pin member are fixed using a resin on a predetermined position of the substrate,
2. The method of manufacturing an optical communication module according to claim 1, wherein the alignment step performs optical alignment of the optical component at a predetermined position of the substrate in a state where the shaft portion of the pin member is held.   The method of manufacturing an optical communication module according to claim 1, wherein the alignment step performs optical alignment of the optical component with respect to predetermined six axes.   The light according to any one of claims 1 to 4, wherein in the alignment step, the shaft portion of the pin member is gripped by a pair of arms having a concave inner surface along the outer diameter of the shaft portion. A method for manufacturing a communication module.   6. The optical communication module according to claim 5, wherein when viewed from above or below, the pair of arms has one arm formed in a straight line and the other arm bent toward the one arm. Production method.

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